WO2016058539A1 - Led封装用基板、立体led封装、具有该立体led封装的灯泡及其制作方法 - Google Patents

Led封装用基板、立体led封装、具有该立体led封装的灯泡及其制作方法 Download PDF

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Publication number
WO2016058539A1
WO2016058539A1 PCT/CN2015/091970 CN2015091970W WO2016058539A1 WO 2016058539 A1 WO2016058539 A1 WO 2016058539A1 CN 2015091970 W CN2015091970 W CN 2015091970W WO 2016058539 A1 WO2016058539 A1 WO 2016058539A1
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WIPO (PCT)
Prior art keywords
substrate
bulb
light
led package
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/091970
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English (en)
French (fr)
Inventor
杨志强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SIM LIGHTING DESIGN Co Ltd
Original Assignee
SIM LIGHTING DESIGN Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201420596769.XU external-priority patent/CN204424304U/zh
Priority claimed from CN201420596768.5U external-priority patent/CN204176377U/zh
Priority claimed from CN201420597293.1U external-priority patent/CN204257694U/zh
Priority claimed from CN201420615380.5U external-priority patent/CN204268119U/zh
Priority claimed from CN201420616660.8U external-priority patent/CN204240103U/zh
Priority claimed from CN201510023423.XA external-priority patent/CN104595872A/zh
Priority claimed from CN201510023784.4A external-priority patent/CN104613346A/zh
Priority to EP15851506.4A priority Critical patent/EP3208523B1/en
Priority to CA2964421A priority patent/CA2964421C/en
Priority to PL15851506T priority patent/PL3208523T3/pl
Priority to JP2017539489A priority patent/JP2017532793A/ja
Application filed by SIM LIGHTING DESIGN Co Ltd filed Critical SIM LIGHTING DESIGN Co Ltd
Priority to ES15851506T priority patent/ES2835831T3/es
Priority to US15/518,983 priority patent/US10563824B2/en
Priority to AU2015333293A priority patent/AU2015333293B2/en
Publication of WO2016058539A1 publication Critical patent/WO2016058539A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a substrate for LED packaging, a three-dimensional LED package having the substrate, and a three-dimensional LED package bulb having the three-dimensional LED package.
  • the invention also relates to the above stereoscopic LED package and a method of fabricating the stereo LED package bulb.
  • LED light bulbs are typically incandescent light bulbs that have low illumination and are not energy efficient. Fluorescent light bulbs appear after incandescent light bulbs. Although they are energy-saving and illuminating, they are not environmentally friendly due to the large amount of phosphors used. Therefore, LED light sources that are both environmentally friendly and energy-saving have emerged and many LED bulbs have been produced.
  • the existing LED bulbs are very complicated in structure and manufacturing method.
  • the LED bulb and the manufacturing method disclosed in the Chinese patent CN101509616A include a lamp cap, a driving circuit component, a light source bracket, an LED light source, and a glass bulb housing. The tail of the glass bulb housing is fixedly connected with the lamp cap, and the LED light source is fixed on the light source bracket.
  • the tail of the glass bulb is sealed and fixed at the tail of the light source bracket and surrounds the LED light source and the light source bracket in the inner cavity of the bulb.
  • the driving circuit component is located in the lamp cap and is electrically connected to the lamp head and the LED light source through the wires.
  • LED packaging technology is more important when applying LED light sources.
  • LED packaging methods including a LED package, a chip on board LED package, a surface mount device LED package, and a system (System In Package) LED package, etc., and different package substrates are used depending on the LED package method.
  • the chip on board (Chip On Board) LED package is a popular LED packaging method.
  • the substrate for chip on board LED packaging is a substrate made of a circuit board or a single material, such as metal, PVC, plexiglass, plastic, etc., and the shape is mostly a flat rectangle. , flat round or flat strips, etc.
  • the LED chips are disposed on the substrate for the conventional chip-on-board LED package and the fluorescent glue is sealed,
  • the emitted light is flat. Due to the incomplete design of the overall structure, it is easy to appear uneven illumination around the illuminator.
  • the substrate is a light-transmitting material, although it can emit light at 360 degrees, the heat dissipation problem is generally encountered due to the generally poor heat dissipation coefficient of the transparent material; when the substrate is an opaque material, such as metal, even in the case of heat dissipation, it may be disregarded.
  • the LED chip there is a problem that there is no light on one side of the LED chip, and thus it is impossible to emit 360 degrees in all directions.
  • the current board-on-chip (Chip On Board) LED package substrate and the bulb have a uniform illumination angle, and cannot be illuminated at multiple angles and levels, and are also susceptible to heat dissipation problems, which affects luminous efficiency.
  • the present invention provides a substrate for a chip-on-board LED package with uniform illumination, a large illumination angle, a multi-level illumination, and a good heat dissipation effect, and a stereo LED package having the package substrate, A three-dimensional LED packaged bulb; the present invention also provides the above-described three-dimensional LED package and a method of manufacturing the same with the same.
  • a substrate for LED package wherein the substrate has a spiral shape as a whole, and at least one end of the substrate is provided with an electrode lead wire, and the electrode lead wire is connected to the device through a connecting member and/or a connecting material. Said substrate.
  • the spiral lines of the substrate are spaced apart from each other, the edges of the substrate being at least partially smooth curves, and/or at least partially broken lines formed by a plurality of straight ends.
  • the spiral shape of the substrate comprises at least 1/2 turn.
  • the material of the substrate is one of metal, plexiglass, PVC, plastic, sapphire, ceramic or silica gel, or a plurality of the above materials are made by splicing and/or nesting.
  • the edge of the substrate is provided with a plurality of notches, and/or the surface of the substrate is a reflective or scattering surface.
  • the substrate comprises an intermediate portion made of different materials and an edge portion which is in close contact with both sides of the intermediate portion; or the substrate is formed by splicing of a plurality of segments of different materials; or the substrate comprises a substrate body and at least one and a substrate The body is nested or spliced with a dot or strip formed of a material different from the substrate material.
  • the substrate is directly made of a PCB board, which includes a circuit layer; or the substrate is formed with one or at least two mutually independent circuit layers, and the circuit layer passes the ultrasonic gold Wire soldering or eutectic soldering on the substrate.
  • a solder joint of the LED chip is disposed on the circuit layer.
  • the substrate is a single single spiral structure integrally formed; or a group of single spiral structures integrally formed, comprising at least two single spiral structures; or a group of at least two single spiral structures a single spiral structure, wherein the splicing portion is provided with at least one connecting member for connection; or the substrate is an integrally formed double helix structure; or a double helix structure formed by splicing at least two ends, wherein at least one connection is provided at the splicing portion Connection member used.
  • the electrode lead wire is located on the surface of the substrate when the substrate is connected to the substrate, and a heat conducting insulating layer is disposed therebetween.
  • the edge of the substrate is provided with a fastener connecting the external heat dissipating component or the lead wire.
  • the substrate may be a circular spiral line, or may be an elliptical spiral line, or may be a polygonal, polygonal line such as a square, a pentagon or a hexagon.
  • the other end substrate serves as another electrode lead line.
  • the substrate as a whole may have a planar spiral line shape or a three-dimensional spiral line shape.
  • the substrate is a conical spiral; or an isosceles; or a single spiral structure that is firstly enlarged and then reduced in size along the axial direction; or is enlarged first in the radial direction along the axial direction.
  • a reduced double helix structure is preferably, a conical spiral; or an isosceles; or a single spiral structure that is firstly enlarged and then reduced in size along the axial direction; or is enlarged first in the radial direction along the axial direction.
  • the substrate may be a smoothly rising polygonal line shape, a stepped polygonal line shape, or a combination of the two.
  • the present invention further provides a three-dimensional LED package comprising the above-mentioned substrate of the present invention, wherein the substrate is provided with a plurality of LED chips connected in series and/or in parallel, wherein the plurality of LEDs The chip is taken out through the electrode lead wires at both ends of the substrate, or is taken out through the electrode lead wires at one end of the substrate and the other end of the substrate as the other electrode lead wires.
  • the spiral structure of the substrate is a conical spiral; or an isosceles spiral; or a single spiral structure which is firstly enlarged and then reduced in size along the axial direction; or is radially dimensioned along the axial direction.
  • the double helix structure that is enlarged and then reduced.
  • the LED chips are connected between each other and the LED chips and the electrode lead wires are electrically connected.
  • the substrate is made of a PCB board, the PCB board comprises a circuit layer; or the substrate is made with one or at least two mutually independent circuit layers, and the circuit layer is soldered by ultrasonic gold wire or The eutectic solder is soldered on the substrate, and the solder joints of the LED chips are provided on the circuit layer. At least one of the positive electrode and the negative electrode of the LED chip is electrically connected to the circuit layer through the solder joint, and the series, parallel or series-parallel connection of the LED chips is realized by the connection arrangement of the circuit layers.
  • the LED chips may be uniformly equidistantly distributed on the substrate, or may be unequal distance distribution, and may be disposed on one side of the substrate, or may be disposed on both sides of the substrate.
  • the surface of the LED chip and the substrate is coated with a dielectric layer having a protective or luminescent function, and the dielectric layer is a combination of one or more of a silica gel, an epoxy resin, and an LED luminescent powder.
  • the LED chip is a horizontal chip, a vertical chip, a flip chip or a white light chip.
  • the colors of the LED chips may all be the same, partially identical or each different.
  • the present invention provides a method for fabricating a three-dimensional LED package, comprising: preparing a substrate according to the present invention, such that the substrate as a whole has a planar spiral shape, and is disposed on the surface of the substrate.
  • the LED chips connected in series and/or in parallel are stretched in the opposite direction in the axial direction at both the ends of the substrate to form a three-dimensional spiral LED package.
  • the method for fabricating the three-dimensional LED package further comprises the step of coating at least one dielectric layer having a protective or luminescent function on the surface of the substrate and the LED chip before the stretching.
  • the LED chips are connected between each other and the LED chips and the electrode lead wires are electrically connected.
  • the surface of the electrical connection line is also coated with at least one dielectric layer having a protective or luminescent function.
  • the substrate is directly made of a PCB board, and the PCB board comprises a circuit layer; or, the substrate is formed with one or at least two mutually independent circuit layers, and the circuit layer is soldered by ultrasonic gold wire Or eutectic soldering on the substrate, the solder layer of the LED chip is provided on the circuit layer. At least one of the positive electrode and the negative electrode of the LED chip is electrically connected to the circuit layer through the solder joint, and the series, parallel or series-parallel connection of the LED chips is realized by the connection arrangement of the circuit layers.
  • the present invention further provides a light bulb having the above-mentioned three-dimensional LED package of the present invention, comprising: a light-transmitting bulb, wherein the light-transmitting bulb is provided with a lead wire, the lead wire Connected to at least one of the three-dimensional LED packages, at least one of the three-dimensional LED package electrode lead wires is connected to the lead wire, the light bulb further has a driver and an electrical connector, the lead wire is connected to the driver, the driver and The electrical connectors are connected.
  • the light-transmitting bulb is provided with a core column having the lead wire and the stem exhaust pipe, and the light-transmitting bulb and the core pillar are closely connected to form a sealed space inside the light-transmitting bulb.
  • a connection structure may be disposed between the light-transmitting bulb and the electrical connector, and the material thereof may be plastic, metal, ceramic, bamboo or rubber.
  • a heat dissipating wire may be disposed in the light transmissive bulb, and the heat dissipating wire is connected between the stem and the stereo LED package.
  • the light-transmitting bulb may be filled with a gas that protects the filament and facilitates heat dissipation of the filament.
  • the bulb having the above-mentioned three-dimensional LED package of the present invention comprises: a heat dissipating support member connected thereto is disposed in the light transmissive bulb, and the heat dissipating support member is connected to the electrical connector.
  • the heat dissipating support member may also be connected to the electrical connector through a connecting structural member, and the material of the connecting structural member may be plastic, metal, ceramic, bamboo or rubber.
  • the three-dimensional LED package may be in contact with the heat dissipation support, and the three-dimensional LED package is supported by the lead wires.
  • the heat dissipation support is a material having a high thermal conductivity and non-conductivity.
  • the material having a high thermal conductivity and non-conductivity is capable of forming a thermoelectric separation.
  • the heat dissipation support may be composed of more than one component.
  • the light transmissive bulb is A type, G type, R type, PAR type, T type or candle type; the electrical connection The device is E40, E27, E26, E14 or GU.
  • the present invention also provides a method for manufacturing a stereo LED packaged bulb, comprising the following steps:
  • the above steps 1) and 2) can be performed arbitrarily before or after, or simultaneously.
  • the core post is further provided with a heat dissipation line, and in the above step 3), the step of connecting the heat dissipation line to the stereo LED package is further included.
  • the present invention provides a method for fabricating a three-dimensional LED packaged bulb, which comprises the following steps:
  • the above steps 1) and 2) can be performed arbitrarily before or after, or simultaneously.
  • the heat dissipation support is a material having a high thermal conductivity and non-conductivity.
  • the material of the connecting structural element is made of plastic, metal, ceramic, bamboo or rubber.
  • the three-dimensional LED package is not in contact with the heat dissipation support, and the lead wire supports the three-dimensional LED package.
  • the heat dissipation support is composed of more than one component.
  • the invention has the advantages that the substrate for LED package, the three-dimensional LED package, the bulb with the three-dimensional LED package and the manufacturing method thereof can realize the all-round, three-dimensional,
  • the multi-layer illumination, the invention is also easy to dissipate heat, has a large illumination angle, has high luminous flux, and has simple structure, convenient processing and low cost.
  • FIG. 1 is a schematic view of a substrate for LED package according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view of a substrate for LED package according to a second embodiment of the present invention.
  • FIG 3 is a schematic view of a substrate for LED package according to a third embodiment of the present invention.
  • FIG. 4 is a schematic view of a substrate for LED package according to a fourth embodiment of the present invention.
  • Fig. 5 is a schematic view showing a substrate for LED package according to a fifth embodiment of the present invention.
  • Fig. 6 is a schematic view showing a substrate for LED package according to a sixth embodiment of the present invention.
  • Fig. 7 is a schematic view showing a substrate for LED package according to a seventh embodiment of the present invention.
  • Fig. 8 is a schematic view showing a substrate for LED package according to an eighth embodiment of the present invention.
  • Fig. 9 is a schematic view showing a substrate for LED package according to a ninth embodiment of the present invention.
  • Fig. 10 is a schematic view showing a substrate for LED package according to a tenth embodiment of the present invention.
  • Fig. 11 is a schematic view showing a substrate having a three-dimensional spiral line shape formed by stretching at both ends of the present invention.
  • Figure 12 is a schematic illustration of a three-dimensional LED package having a substrate in accordance with a first embodiment of the present invention.
  • FIG. 13 is a cross-sectional view of the three-dimensional LED package of FIG.
  • FIG. 14 is a schematic illustration of an embodiment of a light bulb with a stereo LED package.
  • 15 is a schematic illustration of another embodiment of a light bulb with a stereo LED package.
  • 16 is a schematic illustration of yet another embodiment of a light bulb having a stereo LED package.
  • 17a-17d are schematic illustrations of several embodiments of a bulb having a stereo LED package.
  • FIG. 18 is a schematic illustration of yet another embodiment of a light bulb with a stereo LED package.
  • 19 is a schematic illustration of yet another embodiment of a light bulb having a stereo LED package.
  • the material of the substrate 1 of the present invention may be one of metal, plexiglass, PVC, plastic, sapphire, ceramic or silica gel, or a plurality of materials of the above materials may be formed by splicing or nesting.
  • the LED package substrate includes a substrate 1 having electrode lead wires 2 at both ends thereof, and the electrode lead wires 2 are fixedly connected to both ends of the substrate through the connecting member 3 and/or the connecting material.
  • the connecting material can be glue, ceramic glue, Low melting glass, silver paste or plastic.
  • the electrode lead wire 2 can be connected to the substrate 1 through the connecting member 3.
  • one end of the substrate 1 is provided with the electrode lead-out line 2, and the other end is not provided with the electrode lead-out line, and the entire substrate is connected as another electrode lead-out line to the lead-out line 31 as will be described later. This is more conducive to the heat dissipation of the LED chip on the substrate, while making it easier and reducing the production cost.
  • the LED package substrate has a continuous spiral line shape as a whole.
  • the substrate can be formed into a three-dimensional state of a three-dimensional spiral line shape as shown in FIG. 11 from a plane state in a plane spiral shape by stretching in the opposite direction to the axial direction at both ends of the substrate.
  • the "spiral” hereinafter referred to generally includes a spiral in a planar state and a solid state unless otherwise specified.
  • the spiral lines of the substrate 1 are spaced apart from each other, so that the light emitted from the LED chip disposed on the substrate 1 is not absorbed or reflected by the substrate but is directly emitted.
  • the shape of the substrate of the present invention may be a circular spiral line, and may be an elliptical spiral line, or may be a spiral line of other geometric shapes such as a square, a pentagon, a hexagonal polygon, or the like, and may be a regular geometric shape. It can also be an irregular geometry to match the design of different stereo LED packages.
  • the spiral line-shaped substrate 1 includes at least 1/2 spiral turns.
  • the surface of the substrate 1 can be processed into a reflective surface or a scattering surface, so that the light is not easily absorbed by the substrate when it is irradiated on the substrate 1. This can reduce the light absorption of the substrate backlight while reflecting the light, thereby increasing the luminous flux and improving the illumination. Uniformity.
  • thermally conductive insulating layer When the electrode lead wire 2 is connected to the substrate 1, a thermally conductive insulating layer is disposed therebetween.
  • the thermally conductive insulating layer can efficiently transfer heat from the substrate to the electrode lead wires 2 without causing a short circuit when a conductive material is used as the substrate.
  • the edge 4 of the substrate 1 of the embodiment of Fig. 1 is a smooth curve
  • the edge 4 of the substrate 1 of the embodiment of Fig. 2 is a fold line formed by a plurality of straight lines connecting end to end.
  • the structure shown in FIGS. 1 and 2 can be matched with the design of different stereo LED packages to enhance the illumination effect of different stereo LED packages.
  • the edge of the substrate may also be provided with a plurality of notches 5.
  • the substrate is an opaque material, light may be transmitted through the gap of the edge of the substrate to the side of the substrate where the LED chip is not disposed, that is, enhanced.
  • the gap 5 can be U-shaped as shown, or can be V-shaped or other geometric shapes (not shown).
  • the edge of the substrate 1 can also be a smooth curve combined with a fold line.
  • the edge 4 of the substrate may also be provided with a fastener protruding from the edge 4, and the fastener may be used for connecting a heat dissipation wire or a lead wire or the like.
  • the substrate is a set of single spiral structures in which at least two single spirals are spliced, and the two spiral structures are connected by a connecting member 3; It is also possible to form a single set of single helix structures (not shown).
  • the LED package substrates of the fifth and sixth embodiments of the present invention are respectively a set of double helix structures (shown in FIG. 5 ) formed integrally; or A set of double helix structures, the two spiral structures are connected by a connecting member 3 (as shown in FIG. 6).
  • the double-helical LED package substrate can further enhance the stereoscopic LED package to achieve a more uniform illumination angle, achieve multi-angle, multi-level illumination, and enhance the illumination effect.
  • the substrate may have a smoothly rising line shape, and of course, the substrate 1 may be in a smoothly rising line shape or a combination of both.
  • the edge of the spiral line-shaped substrate 1 is a fold line of a stepped structure, and the substrate 1 is a spiral staircase-like structure viewed from the side, that is, a fold line bent into a stepped structure, and the structure can be directly performed.
  • the substrate comprises an intermediate portion 6 made of a different material and an edge portion 7 which is in close contact with both sides of the intermediate portion.
  • the intermediate portion 6 may be one of metal, plexiglass, PVC, plastic, sapphire, ceramic, and silica gel
  • the edge portion 7 may be another of metal, plexiglass, PVC, plastic, sapphire, ceramic, and silica gel.
  • the intermediate portion 6 is made of a metal material
  • the edge portion 7 is a transparent silicone material.
  • the LED chip can be mounted on the substrate 1 by a common packaging method so that light of the LED chip can penetrate the substrate 1 through the edge portion 7. The back makes the light more even.
  • the LED chip may be mounted on the intermediate portion 6 as needed, or may be mounted at or near the edge portion 7.
  • the substrate can also be segmented and spliced of different materials to make the substrate form more diverse, for example, one piece is a metal material, the other part is a plexiglass material, and then the segment is a ceramic material, etc.
  • the combination not only makes the shape of the substrate more diverse, but also facilitates heat dissipation, packaging and fabrication of the substrate.
  • the intensity of each segment can be designed according to the difference of material distribution and density, so as to achieve the requirement, thereby achieving uniform distribution of the entire lamp and illuminating the illumination. Evenly distributed.
  • the substrate 1 includes a body and a set of dot portions 8 which are nested and spliced with the substrate body and different from the substrate body material.
  • the dot portions 8 can also be used. Strip replacement.
  • the dot portion 8 is circular, and may have other geometric shapes such as an ellipse, a triangle, a rectangle, a pentagon, and a hexagon.
  • the belt portion may be a long strip shape or a quadrangular shape having a slightly larger area.
  • the substrate body material is any one of metal, plexiglass, PVC, plastic, sapphire, ceramic, and silica gel
  • the dot or strip material is the other of the above materials.
  • the material of the substrate body is metal
  • the material of the dot portion is a transparent silica gel material, which helps to transmit light from above the substrate to the lower side of the substrate through the dot portion, thereby making the illumination more uniform.
  • the LED chip can be mounted on the dot portion 8 or the strip portion by an ordinary die bonding process as needed, or at other positions on the substrate.
  • a substrate for LED package according to a tenth embodiment of the present invention is provided with one or at least two mutually independent circuit layers 9 which are subjected to ultrasonic gold wire bonding or eutectic soldering.
  • an LED chip solder joint is provided on the circuit layer 9.
  • the circuit layer 9 can also be disposed on the substrate by other means.
  • the substrate may also be directly made of a PCB board, which includes a circuit layer.
  • the spiral line-shaped substrate 1 has a length of 5 mm to 1000 mm and a width of 0.1mm-50mm, thickness 0.01mm-10mm, such a size makes the substrate easy to put into the bulb.
  • FIG. 12 and 13 are respectively a schematic view of a three-dimensional LED package having a substrate according to a first embodiment of the present invention and a cross-sectional view of the three-dimensional LED package.
  • a plurality of LED chips 11 connected in series and/or in parallel are disposed on the substrate 1.
  • the LED chips 11 and the chip 11 and the electrode lead wires 2 are connected by a chip electrical connection line 13.
  • These LED chips 11 are fixed on the substrate 1 by a non-conductive paste (for example, silica gel, modified resin or epoxy resin), or a conductive paste (for example, silver paste or copper paste).
  • the surface of the substrate 1 and the LED chip 11 is coated with a dielectric layer 12 having a protective or luminescent function, as shown in FIG.
  • the dielectric layer 12 is a combination of one or more of a silica gel, an epoxy resin, and an LED luminescent powder.
  • the dielectric layer 12 may be disposed only on the upper surface of the substrate having the LED chip 11 and the chip electrical connection line 13; the upper surface having the LED chip 3 and the chip electrical connection line 13 and the two sides may be wrapped without wrapping the bottom surface; It can wrap all surfaces of the entire substrate. For example, when the substrate edge 4 needs to be provided with a protruding fastener, the dielectric layer 12 does not need to wrap the fastener.
  • FIGS. 12 and 13 illustrate the case of forming a three-dimensional LED package using the substrate of the first embodiment of the present invention, but other forms of substrate shown or described herein may also be used to form a three-dimensional LED package.
  • the substrate for LED package of the tenth embodiment of the present invention shown in FIG. 10 since the substrate 1 of the spiral line shape may have a plurality of circuit layers by ultrasonic gold wire bonding or eutectic soldering, or the substrate may be directly
  • the PCB board is formed (the circuit board includes a circuit layer and the circuit layer is provided with solder joints), so the LED chip 11 can be connected to the circuit layer through the solder joint, and the structure greatly increases the types of LED chips that can be used.
  • the LED chip can be a horizontal chip, a vertical chip, a flip chip, and a white light chip.
  • the positive electrode of the chip is connected to the circuit layer through the solder joint, and the negative electrode of the chip is connected to the circuit layer through the chip electrical connection line 13; if the flip chip is used, the positive and negative electrodes pass between the chips The solder joint is connected to the circuit layer.
  • a white light chip it is not necessary to provide a dielectric layer having a protective and/or light-emitting function on the surface of the LED chip and the chip electrical connection line and the substrate, since the white light chip itself already has a dielectric layer for protection and/or light-emitting functions.
  • the illuminating colors of the LED chips 11 may be the same, partially the same, or each different. For example, all of them may be blue light, ultraviolet light or other monochromatic light, or different light colors to obtain mixed light of different colors, and different numbers of LED chips of various light colors may be used to obtain a high color rendering index.
  • White light may be blue light, ultraviolet light or other monochromatic light, or different light colors to obtain mixed light of different colors, and different numbers of LED chips of various light colors may be used to obtain a high color rendering index.
  • the LED chips may be uniformly equidistantly distributed on the substrate, or may be unequal distance distribution.
  • the setting position may be one side of the substrate or both sides of the substrate.
  • the substrate of the present invention has a three-dimensional spiral structure whose axis is an up-and-down direction, the pitch of the LED chip in the upper half of the substrate is small, that is, the LED chips are densely distributed, and the pitch of the lower half is large, that is, sparsely distributed.
  • the LED chip can be disposed on both sides of the substrate 1. In this case, the illumination of the light can be further improved. surface.
  • the LED package shown in FIGS. 12 and 13 may be a three-dimensional spiral shape, that is, a three-dimensional LED package, which may be a double spiral shape or a single spiral shape, and its shape is determined by the shape of the substrate 1 described above.
  • the three-dimensional LED package of the present invention can be fabricated by preparing any of the substrates shown in FIGS. 1-6, 8-10 of the present invention as described above, and providing a plurality of series and/or parallel connections on the surface of the substrate.
  • the LED chip 11 stretches the ends of the substrate in the opposite direction in the substrate axis direction to form a three-dimensional spiral LED package.
  • the method for fabricating the three-dimensional LED package further includes the step of coating at least one dielectric layer 12 having a protective or luminescent function on the surface of the substrate 1 and the LED chip 11 before the stretching.
  • an electrical connection line can be used between the LED chips 11 and between the LED chip and the electrode lead-out line.
  • the surface of the electrical connection line may also be coated with at least one dielectric layer having a protective or luminescent function.
  • the circuit layer 9 is provided on the substrate and the solder joint is provided on the circuit layer 9, at least one of the positive electrode and the negative electrode of the substrate LED chip 11 is electrically connected to the circuit layer 9 through the solder joint, and is connected through the circuit layer.
  • the cloth realizes series, parallel or series-parallel connection of the LED chips 11.
  • the three-dimensional LED package may be a conical spiral; or an isosceles spiral; or a single spiral structure that is firstly enlarged and then reduced in size along the axial direction; or is enlarged first in the radial direction along the axial direction.
  • a reduced double helix structure may be used.
  • the bulb includes a light transmissive bulb 20 having a stem with a lead wire 31 and a stem exhaust pipe 32 disposed therein. 30.
  • the lead wire 31 is for connecting and fixing the at least one spiral shaped stereo LED package 10.
  • the electrode lead wires on the substrate of the three-dimensional LED package 10 are connected to the electrical connector 90 via the lead wires 31, the driver 80 and the driver electrical lead wires 81 for connecting the external power source to illuminate the LED chip, and the light-transmitting bulb
  • the gas is connected to the stem 30, and is filled with a gas that protects the three-dimensional LED package and facilitates heat dissipation of the three-dimensional LED package in the sealed space formed by the light-transmitting bulb 20.
  • the gas may be a helium gas or a hydroquinone mixture.
  • the light-transmissive bulb 20 is made of a transparent, opalescent, frosted, or colored bulb, and may also be a bulb partially having a reflective layer or partially having a small prism and a small lens.
  • the shape of the light-transmissive bulb 20 is A, G, R, PAR, T, candle or other existing lamp bubble shell shapes.
  • the electrical connector 90 is one of the existing electrical connectors such as E40, E27, E26, E14, GU, and the like.
  • the heat-dissipating wire 21 is also disposed in the light-transmitting bulb 20, and the heat-dissipating wire 21 is connected between the core post 30 and the three-dimensional LED package 10 for conducting heat of the three-dimensional LED package to the stem 30 and then to the outside.
  • the stereo LED package in the bulb can be a conical spiral, as shown in Figure 14, which can be connected for bidirectional AC operation or unidirectional DC operation.
  • the driver 80 can be composed of a step-down current limiting circuit and a rectifying and filtering circuit in parallel with a capacitor and a resistor.
  • the driver 80 has a simple circuit, low cost, no electrolytic capacitor, no triode, no transformer, no high frequency radiation, and can also be a switching power supply and a constant current device.
  • the bulb having the stereo LED package can be fabricated by the following method, and the manufacturing method includes the following steps:
  • the aeration is a gas that fills the light-transmitting bulb 20 with a protective filament and facilitates heat dissipation of the filament.
  • the heat dissipation line 21 is further disposed on the stem 30, and the step 3) further includes the step of connecting the heat dissipation line 21 to the three-dimensional LED package 10.
  • the substrate 1 of the stereo LED package in the bulb is an isosceles, and is disposed laterally.
  • a connecting structure 40 is also disposed between the light-transmitting bulb 20 and the electrical connector 90, and is made of plastic, metal, ceramic, bamboo or rubber.
  • the connecting structure 40 can enlarge the neck diameter of the bulb, and can enter a larger size filament or a light strip, and the connecting structure 40 can increase the volume in the bulb to facilitate heat dissipation of the filament.
  • the bulb in contrast to the above-described bulb, has two helical, three-dimensional LED packages 10 forming a double helix.
  • the spatial positions of the double helices may be opposite, opposite, adjacent or interlaced, and the number of turns of the two spiral structures of the double helix may be the same or different.
  • FIGS. 17a-17b the three-dimensional LED packaged bulbs of different spiral structures are shown in FIG. 17a as a spiral structure which gradually increases in size from the bottom to the top in the axial direction, and FIG. 17b shows the axial direction from the bottom to the bottom.
  • the double spiral structure in which the radial dimension gradually increases from small to small, and FIG.
  • FIG. 17c is a single spiral structure in which the radial dimension first increases and then decreases in the axial direction from the bottom to the top, and FIG. 17d shows the radial dimension from the bottom to the top in the axial direction.
  • the light bulb comprises a light-transmissive bulb, and the light-transmissive bulb is provided with a heat-dissipating support 50, a lead wire 31 and at least one spiral-shaped three-dimensional LED package 10, wherein one lead wire 31 is disposed in the heat dissipation support 50, the at least Both ends of one spiral-shaped three-dimensional LED package 10 are fixedly connected to one lead wire and the other lead wire 31 in the heat dissipation support member 50, respectively.
  • the light-transmissive bulb and the heat-dissipating support 50 may be configured to be connected to the electrical connector 90 via the connecting structural member 60, or may be configured to be directly connected to the electrical connector 90 (not shown).
  • the lead wire 31 is connected to the driver 80, and the driver 80 is disposed within the connection structure member 60 and the electrical connector 90.
  • the connecting structural element 60 is plastic, metal, ceramic, bamboo or rubber.
  • the heat dissipation support 50 is a material having high thermal conductivity but not being electrically conductive (the high thermal conductivity is not conductive) The material is capable of forming a thermoelectric separation) such that heat can be transferred from the spiral shaped LED package 10 to the connecting structure element 60.
  • the heat dissipation support 50 may be integrally formed, but may be composed of more than one component for convenience of manufacture, and the materials of the components may be the same, partially the same, or different.
  • FIG. 19 another embodiment of a bulb having a three-dimensional LED package 10 of the present invention is shown.
  • This embodiment is similar to the bulb of FIG. 18 except that the three-dimensional LED package 10 is only fixedly connected to the two lead wires 31 and is not in contact with the heat sink support 50. Therefore, the two lead wires 31 function to support the three-dimensional LED package 10, and at the same time have heat transfer and conductive functions.
  • the lead wires transfer heat from the stereo LED package to the heat sink support 50 and the connection structure component 60.
  • the structure is only that the light-transmitting bulb is assembled with the lead wire and the electrical connector, and the heat-dissipating support member and the two lead wires 31 can achieve good heat dissipation effect, so Carry out the lamp sealing process and evacuation and inflation procedures.
  • the above-described bulb having a three-dimensional LED package as shown in FIGS. 18 and 19 can be produced by the following method, and the manufacturing method includes the following steps:
  • the driver 80 is placed in the electrical connector 90, and the light-transmitting bulb 20 and the heat-dissipating support 50 are connected and fixed to the electrical connector 90 through the connecting structural member 60.
  • the heat dissipation support 50 is a material with high thermal conductivity and non-conductivity.
  • the material having a high thermal conductivity and non-conductivity can form a thermoelectric separation, such as a plastic aluminum or the like.
  • the connecting structural member 60 is made of plastic, metal, ceramic, bamboo or rubber.
  • the three-dimensional LED package can be fixedly connected to the heat dissipation support member 50, and the three-dimensional LED package is supported by the heat dissipation support member 50.
  • the three-dimensional LED package and the heat dissipation support member 50 can be contactless, and can be extracted only by Line 31 supports the three-dimensional LED package.
  • the heat dissipation support 50 may be integrally formed or may be composed of one or more components.
  • the omnidirectional, three-dimensional, multi-level illumination of the bulb can be realized, the heat dissipation is easy, the illumination angle is large, the amount of light is uniform, and the structure is simple to manufacture, the processing is convenient, and the cost is low.

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Abstract

提供LED封装用基板、具有该基板的立体LED封装、具有该立体LED封装的灯泡以及其制作方法。基板呈螺旋线条形，基板的至少一端设有电极引出线（31），电极引出线（31）通过连接构件和/或连接材料连接至基板，基板的螺旋线条相互之间具有间隔，基板的边缘至少部分地为光滑的曲线和/或若干直线首尾相接形成的折线。立体LED封装以及具有该立体LED封装的灯泡（20），包括该基板，基板上设有多个串联和/或并联的LED芯片，多个LED芯片通过基板两端的电极引出线（31）引出，或者通过基板一端的电极引出线（31）和基板的另一端作为另一电极引出线（31）引出。可以实现灯泡的全方位、立体、多层次发光，还易于散热，并且其结构制作简单、成本低。

Description

LED封装用基板、立体LED封装、具有该立体LED封装的灯泡及其制作方法 技术领域
本发明涉及一种LED封装用基板，具有该基板的立体LED封装，具有该立体LED封装的立体LED封装灯泡。本发明还涉及上述立体LED封装以及立体LED封装灯泡的制作方法。
背景技术
传统的灯泡一般为白炽灯灯泡，其照度较低并且不节能。在白炽灯泡后出现了荧光灯灯泡，虽然其节能、照度较高，但是由于大量使用荧光粉导致不够环保。因此，目前出现了既环保又节能的LED光源而产生了不少LED灯泡。但是现有的LED灯泡其结构与制作方法都非常复杂。如中国专利CN101509616A所公开的LED灯泡及制作方法，包括灯头、驱动电路组件、光源支架、LED光源、玻璃灯泡壳体，玻璃灯泡壳体的尾部与灯头固定连接，LED光源固定在光源支架上，玻璃灯泡壳体尾部熔封固定在光源支架的尾部并将LED光源及光源支架包围在灯泡内腔中，驱动电路组件位于灯头内并通过导线分别与灯头、LED光源电连接。该结构虽然较为简单、便于制造，但是该LED灯泡中的LED光源支撑在光源支架上，LED光源具有单面发光的局限性，因此这样的LED灯泡无法实现全方位、立体的发光效果，而如果需要使得LED灯泡具有全方位立体的发光效果，通常需要设置多个朝向不同方向的LED光源。因此不仅提高成本，而且不易于安装。特别是在灯泡这样封闭的环境内设置较多LED光源的情况下，会使得LED的散热问题更加严重。
此外，应用LED光源时，LED封装技术则比较重要。现有技术中，有不同的LED封装方法，包括引脚(Lamp)LED封装，板上芯片直装式(Chip On Board)LED封装，贴片式(Surface Mount Device)LED封装，系统(System In Package)LED封装等，而根据不同的LED封装方法，会使用不同的封装基板。
其中，板上芯片直装式(Chip On Board)LED封装是比较流行的一种LED封装方法。在一般情况下，板上芯片直装式(Chip On Board)LED封装用的基板是由电路板或单一材料制成的基板，如金属、PVC、有机玻璃、塑料等，而形状大多是平面矩形，平面圆形或平面条状等。
然而，现有的板上芯片直装式LED封装用基板上设置LED芯片并且封上荧光胶后， 发出的为平面光。由于整体结构设计得不周全，亦容易在发光体四周出现发光不均匀的现象。另外，当基板是透光材料时，虽然可以360度发光，但由于透明材料散热系数普遍较差而通常会遇到散热问题；基板是不透光材料时，例如金属，即使在散热问题可不考虑的情况下，也会有在没有设置LED芯片的一面没有光因而不能360度全方位发光的问题。
总而言之，现有的板上芯片直装式(Chip On Board)LED封装用基板以及灯泡的发光角度不够均匀，无法多角度、多层次发光，而且也容易遇上散热问题，影响发光效率。
发明内容
为了解决上述技术问题，本发明提供一种发光均匀、发光角度大、多层次发光并且散热效果较好的板上芯片直装式LED封装用基板，以及具有该封装基板的立体LED封装、具有该立体LED封装的灯泡；本发明还分别提供上述立体LED封装以及具有该立体LED封装的灯泡的制作方法。
根据本发明，提供了一种LED封装用基板，所述基板整体呈螺旋线条形，所述基板的至少一端设有电极引出线，所述电极引出线通过连接构件和/或连接材料连接至所述基板。所述基板的螺旋线条相互之间具有间隔，所述基板的边缘至少部分地为光滑的曲线、和/或至少部分地为若干直线首尾相接形成的折线。
为了保证发光的角度，所述基板的螺旋线条形包括至少1/2个圈。
优选地，所述基板的材料为金属、有机玻璃、PVC、塑料、蓝宝石、陶瓷或硅胶中的一种，或是上述材料中的多种通过拼接和/或嵌套方式制成。
为了使光照更加均匀，所述基板的边缘设有多个缺口，和/或所述基板表面为反光面或散射面。
优选地，所述基板包括不同材料制成的中间部和紧贴中间部两侧的边缘部；或者所述基板由不同材料的多段拼接而成；或者所述基板包括基板本体以及至少一个与基板本体相嵌套、拼接的与基板材料不同材料制成的点状部或带状部。
为了便于制作连接，所述基板直接由PCB板制成，该PCB板上包含有电路层；或者，所述基板上制作有一个或至少两个相互独立的电路层，所述电路层通过超声波金丝焊接或共晶焊接在基板上。所述电路层上设有LED芯片的焊点。
优选地，所述基板为整体成型的单个单螺旋结构；或为整体成型的一组单螺旋结构，其中含有至少两个单螺旋结构；或是由至少两个单螺旋结构拼接而成的一组单螺旋结构，其中拼接处设有至少一个连接用的连接构件；或是所述基板为整体成型的双螺旋结构；或由至少两端拼接形成的双螺旋结构，其中拼接处设有至少一个连接用的连接构件。
优选地，所述电极引出线与基板连接时位于所述基板的表面上，两者之间设有一导热绝缘层。
为了便于连接散热部件或者引线，所述基板的边缘设有连接外界散热部件或者引线的扣件。
优选地，所述基板可为圆形螺旋线条，也可以为椭圆形螺旋线条，也可以为方形、五边形、六边形等多边形折线螺旋线条。
为了更加便于散热，所述基板的一端具有电极引出线时，另一端基板作为另一电极引出线。
所述基板整体可以呈平面螺旋线条形，也可以呈立体螺旋线条形。
优选地，所述基板为锥形螺旋体；或者为等圆螺旋体；或者为沿着轴线方向径向尺寸先变大后又缩小的单个螺旋结构；或者为沿着轴线方向径向尺寸先变大后又缩小的双螺旋结构。
而且，所述基板可以为平滑上升的折线状、或者台阶状的折线状，或两者的结合。
此外，为了解决上述技术问题，本发明还提供了一种立体LED封装，包括本发明上述的基板，所述基板上设有多个串联和/或并联的LED芯片，其中，所述多个LED芯片通过基板两端的电极引出线引出，或者通过基板一端的电极引出线和基板的另一端作为另一电极引出线引出。
优选地，所述基板的螺旋结构呈锥形螺旋体；或者呈等圆螺旋体；或者呈沿着轴线方向径向尺寸先变大后又缩小的单个螺旋结构；或者呈沿着轴线方向径向尺寸先变大后又缩小的双螺旋结构。
优选地，所述LED芯片之间，以及LED芯片与电极引出线之间用电连接线连接。
优选地，所述基板由PCB板制成，该PCB板上包含有电路层；或者，所述基板上制作有一个或至少两个相互独立的电路层，所述电路层通过超声波金丝焊接或共晶焊接在基板上，电路层上设有LED芯片的焊点。LED芯片的正极与负极中的至少一个通过焊点与电路层电连接，并通过电路层的连接排布实现LED芯片的串联、并联或串并联连接。
为了使发光更加全方位，所述LED芯片在基板上可以是均匀等距分布，也可以是不等距离分布，可以设置在基板的单面，也可以是基板的双面都设置。
所述LED芯片和基板的表面涂覆有一层具有保护或发光功能的介质层，该介质层为硅胶、环氧树脂胶和LED发光粉胶中的一种或几种的组合。
优选地，所述LED芯片为水平芯片、垂直芯片、倒装芯片或白光芯片。
优选地，所述LED芯片的颜色可以都相同、部分相同或每个都不同。
此外，为了解决上述技术问题，本发明提供了一种立体LED封装的制作方法，包括：制备本发明所述的基板，使所述基板整体呈平面螺旋线条形，在所述基板的表面设置多个以串联和/或并联形式连接的LED芯片，在所述基板的首尾两端沿轴向以反方向拉伸从而形成立体螺旋形LED封装。
优选地，该立体LED封装的制作方法还包括：在所述拉伸前在基板和LED芯片的表面涂覆至少一层具有保护或发光功能的介质层的步骤。
优选地，所述LED芯片之间，以及LED芯片与电极引出线之间用电连接线连接。
优选地，所述电连接线的表面也涂覆至少一层具有保护或发光功能的介质层。
优选地，所述基板直接由PCB板制成，该PCB板上包含有电路层；或者，所述基板上制作有一个或至少两个相互独立的电路层，所述电路层通过超声波金丝焊接或共晶焊接在基板上，电路层上设有LED芯片的焊点。LED芯片的正极与负极中的至少一个通过焊点与电路层电连接，并通过电路层的连接排布实现LED芯片的串联、并联或串并联。
此外，为了解决上述技术问题，本发明还提供了一种具有本发明上述立体LED封装的灯泡，其中，包括：透光泡壳，所述透光泡壳内设有引出线，所述引出线上连接有至少一个所述立体LED封装，至少一个所述立体LED封装的电极引出线与引出线连接，所述灯泡还具有驱动器和电连接器，所述引出线与驱动器连接，所述驱动器和电连接器相连。
优选地，所述透光泡壳内设具有所述引出线和芯柱排气管的芯柱，所述透光泡壳和芯柱密接，在透光泡壳内部形成密封空间。
所述透光泡壳和电连接器之间可以设有连接结构，其材质可以为塑料、金属、陶瓷、竹木或橡胶。
所述透光泡壳内还可以设有散热线，所述散热线连接在芯柱和立体LED封装之间。
所述透光泡壳内可以填充有保护灯丝并利于灯丝散热的气体。
另外优选地，具有本发明上述立体LED封装的灯泡包括：所述透光泡壳内设有与其连接的散热支撑件，所述散热支撑件与电连接器相连。
散热支撑件也可以通过连接结构元件与电连接器相连，所述连接结构元件的材料可以采用塑胶、金属、陶瓷、竹木或橡胶。
所述立体LED封装可以与散热支撑件不接触，而由引出线支撑所述立体LED封装。
所述散热支撑件为高导热系数不导电的材料。该高导热系数不导电的材料能够形成热电分离。
所述散热支撑件可以由一个以上部件组成。
优选地，所述透光泡壳为A型、G型、R型、PAR型、T型或烛型；所述电连接 器为E40、E27、E26、E14或GU。
此外，为了解决上述技术问题，本发明还提供了一种立体LED封装的灯泡的制作方法，包括以下步骤：
1)制作本发明上述的立体LED封装；
2)制作带两条引出线和芯柱排气管的芯柱；
3)将所述立体LED封装的电极引出线与芯柱的引出线连接；
4)将连接的立体LED封装与芯柱放入透光泡壳内，并将透光泡壳与芯柱相连接的位置用火进行熔烧使两部分相互融合形成一体；
5)将固定好的透光泡壳通过芯柱排气管进行抽真空和并向透光泡壳内充入保护灯丝并利于灯丝散热的气体，然后用火熔断所述芯柱排气管以形成完整密封的灯壳；
6)通过驱动器电引出线将驱动器与电连接器连接，将芯柱的引出线与驱动器连接，将驱动器放入电连接器内，并将灯壳与电连接器固定。
优选地，上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
优选地，所述芯柱上还设有散热线，在上述步骤3)中还包括将所述散热线与立体LED封装相连的步骤。
此外，为了解决上述技术问题，本发明提供了又一种立体LED封装的灯泡的制作方法，其特征在于，包括以下步骤：
1)制备本发明上述的立体LED封装；
2)准备带两条引出线的散热支撑件；
3)将所述立体LED封装的电极引出线与所述引出线连接；
4)将立体LED封装与散热支撑件放入透光泡壳内，并将透光泡壳与所述散热支撑件相固定；
5)通过驱动器电引出线将驱动器与电连接器连接，将散热支撑件的引出线与驱动器连接；
6)将驱动器放入电连接器内，并将电连接器直接或通过连接结构元件与散热支撑件连接固定。
优选地，上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
优选地，所述散热支撑件为高导热系数不导电的材料。
优选地，所述连接结构元件的材料采用塑胶、金属、陶瓷、竹木或橡胶。
优选地，所述立体LED封装与散热支撑件不接触，引出线支撑所述立体LED封装。
优选地，所述散热支撑件由一个以上部件组成。
与现有技术相比，本发明的优点在于，通过本发明所述的LED封装用基板、立体LED封装、具有该立体LED封装的灯泡及其制作方法，可以实现灯泡的全方位、立体、 多层次发光，本发明还易于散热、发光角度大、具有高光通量，并且其结构制作简单、加工便利，成本低。
附图说明
图1为本发明第一实施例的LED封装用基板的示意图。
图2为本发明第二实施例的LED封装用基板的示意图。
图3为本发明第三实施例的LED封装用基板的示意图。
图4为本发明第四实施例的LED封装用基板的示意图。
图5为本发明第五实施例的LED封装用基板的示意图。
图6为本发明第六实施例的LED封装用基板的示意图。
图7为本发明第七实施例的LED封装用基板的示意图。
图8为本发明第八实施例的LED封装用基板的示意图。
图9为本发明第九实施例的LED封装用基板的示意图。
图10为本发明第十实施例的LED封装用基板的示意图。
图11为本发明的两端拉伸后形成的呈立体螺旋线条形的基板的示意图。
图12为具有本发明第一实施例的基板的立体LED封装的示意图。
图13为图12中的立体LED封装的剖视图。
图14为具有立体LED封装的灯泡的实施例的示意图。
图15为具有立体LED封装的灯泡的另一实施例的示意图。
图16为具有立体LED封装的灯泡的又一实施例的示意图。
图17a-17d为具有立体LED封装的灯泡的几个实施例的示意图。
图18为具有立体LED封装的灯泡的又一实施例的示意图。
图19为具有立体LED封装的灯泡的又一实施例的示意图。
具体实施方式
以下结合附图的实施例对本发明作进一步的详细描述。
图1-10示出了本发明多个实施例的LED封装用基板。本发明的基板1的材料可以采用金属、有机玻璃、PVC、塑料、蓝宝石、陶瓷或硅胶中的一种，或是上述材料中的多种材料通过拼接或嵌套方式制成。
如图1-3所示，图中分别示出本发明的LED封装用基板的第一、第二和第三实施例。该LED封装用基板包括基板1，基板1的两端设有电极引出线2，电极引出线2通过连接构件3和/或连接材料与基板的两端相固定连接。该连接材料可以是胶水、陶瓷胶、 低熔点玻璃、银浆或塑料。如图1-3所示，该电极引出线2可以通过连接构件3连接至基板1。但也可以是(未示出)该基板1的一端设有电极引出线2，另一端不设有电极引出线，而是整个基板作为另一个电极引出线与如后述的引出线31连接，这样更加利于基板上的LED芯片的散热，同时制作更容易且能降低生产成本。
如图1-3所示，所述LED封装用基板整体呈连续的螺旋线条形。所述基板能够通过在所述基板的首尾两端沿轴线方向反方向拉伸而从呈平面螺旋线条形的平面状态成为如图11所示的呈立体螺旋线条形的立体状态。以下，为了描述方便，若无特别说明，以下所称的“螺旋”一般均包括平面状态和立体状态下的螺旋。
如图1-3所示，为了制造方便，基板1的螺旋线条相互之间具有一定的间隔，从而让设置在基板1上的LED芯片所发出的光不会被基板吸收或反射而是直接射出。本发明的基板的形状可以为圆形螺旋线条，可以为椭圆形螺旋线条，也可以为方形、五边形、六边形各种多边形等其他几何形状的螺旋形线条，可以是规则的几何形状，也可以是不规则的几何形状，以配合不同的立体LED封装的设计。该螺旋线条形基板1包括至少1/2个螺旋圈。
所述基板1的表面可以加工成反光面或散射面，使光线照射在基板1上时不容易被基板吸收，从而可以减少基板背光的吸光同时将光线反射出去，这样可以增加光通量，提高发光的均匀性。
所述电极引出线2与基板1连接时，两者之间设有一导热绝缘层。导热绝缘层既能够有效地将热从基板传到电极引出线2，又不会在使用导电材料作为基板时引起短路。
图1中实施例的基板1的边缘4为光滑的曲线，图2中实施例的基板1的边缘4为若干直线首尾相接形成的折线。如图1和图2所示的结构能够配合不同的立体LED封装的设计，增强不同的立体LED封装的发光效果。如图3中的实施例所示，基板的边缘也可以设有若干缺口5，当基板为不透光材料时，光可以通过基板边缘的缺口传至基板的未设置LED芯片的一面，即增强了立体LED封装的发光效果。该缺口5可以为如图所示的U形，也可以是V形或其他几何形状(未示出)。该基板1的边缘也可以为光滑的曲线与折线相结合。并且，该基板的边缘4也可以设置有突出于边缘4的扣件，该扣件可以用于连接散热线或者引出线等。
图4为本发明的第四实施例的LED封装用基板，该基板为至少两个单螺旋拼接而成的一组单螺旋结构，所述两个螺旋结构通过连接构件3连接；另外，该基板也可以为整体成型的一组单螺旋结构(未示出)。
如图5和图6所示，分别为本发明的第五和第六实施例的LED封装用基板，该基板为整体成型的一组双螺旋结构(如图5所示)；或为拼接而成的一组双螺旋结构，两个螺旋结构之间通过连接构件3连接(如图6所示)。使用本发明第五和第六实施例的 双螺旋结构的LED封装用基板，可以使立体LED封装进一步具有更均匀的发光角度，实现多角度、多层次发光，增强发光效果。
根据本发明的第七实施例的LED封装用基板，基板可以为平滑上升的折线状，当然该基板1也可以为平滑上升的线状或者两者结合。例如图7所示，该螺旋线条形基板1的边缘为台阶状结构的折线，该基板1从侧面看为螺旋形楼梯状结构，即折弯冲压成台阶状结构的折线，该结构可以直接进行立体LED封装，而且整体美观，外形时尚，深使用者喜爱。
如图8所示，该基板包括不同材料制成的中间部6和紧贴中间部两侧的边缘部7。例如，中间部6可以是金属、有机玻璃、PVC、塑料、蓝宝石、陶瓷和硅胶中的一种，边缘部7可以是金属、有机玻璃、PVC、塑料、蓝宝石、陶瓷和硅胶中的另一种。优选地，中间部6为金属材料，边缘部7为透明的硅胶材料，LED芯片可以通过普通的封装方式安装于基板1上从而使得LED芯片的光可以透过该边缘部7透到基板1的背面，使光照更加均匀。而且，根据需要，LED芯片可以安装在中间部6上，也可以安装在边缘部7或靠近边缘部7的位置上。同样地，基板也可以是不同材质的几段分段拼接，使基板形式更加多样，例如，一段为金属材料，另一段为有机玻璃材料，再接着的分段是陶瓷材料等，这样的各种组合不但使得基板的外形更加多样，而且利于基板的散热、封装以及制作，而且，可以根据材料分布疏密的不同来设计各段光强，以实现要求，从而达成整灯灯光分布均匀，更利于光照度的均匀分布。
如图9所示，根据本发明第九实施例，基板1包括本体以及一组与基板本体相嵌套、拼接的、不同于基板本体材料的点状部8，该点状部8也可以用带状部替代。该点状部8为圆形，也可以是椭圆形、三角形、矩形、五边形、六边形等其他几何形状。如果是带状部，带状部可以是长条形、或面积稍大的四边形等。更确切地说，基板本体材料为金属、有机玻璃、PVC、塑料、蓝宝石、陶瓷和硅胶中的任一种，点状部或带状部材料为上述材料中的另一种。例如，基板本体材料为金属，点状部的材料则为透明的硅胶材料，有助于将光通过点状部从基板的上方传递到基板的下方，从而使光照更加均衡。根据需要，LED芯片可以通过普通固晶工艺安装在点状部8或带状部上，也可以基板的其他位置上。
如图10所示，为本发明的第十实施例的LED封装用基板，该基板上设置有一个或至少两个相互独立的电路层9，电路层9通过超声波金丝焊接或共晶焊接在基板1上，电路层9上设有LED芯片焊点。本领域技术人员应该知道，也可以通过其他方式将电路层9设置在基板上。
所述基板也可以直接由PCB板制成，PCB板上包含电路层。
根据本发明，上述螺旋线条形的基板1的长度为5mm-1000mm，宽度为 0.1mm-50mm，厚度为0.01mm-10mm，这样的尺寸使得基板容易放入灯泡内。本领域技术人员应该知道，根据不同的应用场景也可以采取其他尺寸范围的基板，这些都属于本发明的保护范围。
图12、13分别是具有本发明第一实施例的基板的立体LED封装的示意图以及立体LED封装的剖视图。如图所示，该基板1上设有多个串联和/或并联的LED芯片11，这些LED芯片11之间、以及芯片11与电极引出线2之间由芯片电连接线13连接。这些LED芯片11通过不导电胶(例如硅胶、改性树脂或环氧树脂等)、或导电胶(例如银胶或铜胶等)固定在基板1上。基板1和LED芯片11表面涂覆有一层具有保护或发光功能的介质层12，如图13所示。该介质层12为硅胶、环氧树脂胶和LED发光粉胶中的一种或几种的组合。介质层12可以只设置在基板具有LED芯片11和芯片电连接线13的上表面上；也可以包裹该具有LED芯片3和芯片电连接线13的上表面以及两个侧面但不包裹底面；也可以包裹整个基板的所有表面。例如当基板边缘4需要设置突出的扣件时，介质层12则不需要包裹该扣件。
图12以及13示出了采用本发明第一实施例的基板形成立体LED封装的情况，但也可以使用本发明示出的或阐述的其他形式的基板来形成立体LED封装。
而且，在图10所示的本发明的第十实施例的LED封装用基板中，由于螺旋线条形的基板1可以通过超声波金丝焊接或共晶焊接有若干电路层，或者基板也可以直接由PCB板制成(PCB板上包含电路层而电路层上设有焊点)，因此LED芯片11可以通过该焊点与电路层连接，这种结构大大增加了可使用的LED芯片的种类，该LED芯片可以是水平芯片、垂直芯片、倒装芯片及白光芯片等。更详细地，如果用垂直芯片，则芯片的正极通过焊点与电路层连接、芯片的负极通过芯片电连接线13与电路层连接；如果用倒装芯片，则芯片之间正负极都通过焊点与电路层连接。如果用白光芯片，则不需要在LED芯片以及芯片电连接线和基板的表面设置具有保护及/或发光功能的介质层，因为白光芯片本身已经具有保护和/或发光功能的介质层。
在图12以及13所示的实施例的LED封装中，该LED芯片11的发光颜色可以都相同、部分相同或者每个都不相同。例如可都为蓝光、紫外光或者其他单色光，也可以是不同发光颜色的，以得到不同色的混合光，可选用不同数量的多种发光色的LED芯片还可得到高显色指数的白光。
根据本发明，所述LED芯片在基板上可以是均匀等距分布，也可以是不等距离的分布。其设置位置可以是在基板的单面，或者基板双面都设置。例如，当本发明的基板呈轴线为上下方向的立体螺旋结构时，该LED芯片在基板的上半部分的间距较小，即LED芯片密集分布，下半部分的间距较大，即稀疏分布。这样的设置可以增强灯丝的中心光强。基板1的双面可以都设置LED芯片，在此情况下，可以使光线的照射更加全 面。而且，图12以及13所示的LED封装可以为立体螺旋形，即立体LED封装，可以是双螺旋形，也可以是单螺旋形，其形状由上述基板1的形状决定。
本发明的立体LED封装可通过以下方法制作：准备本发明如前所述的图1-6、8-10所示的任一基板，在所述基板的表面设置多个串联和/或并联的LED芯片11，在基板轴线方向上以反方向拉伸所述基板的首尾两端从而形成立体螺旋形LED封装。
其中，所述立体LED封装的制作方法还包括：在所述拉伸前，在基板1和LED芯片11的表面涂覆至少一层具有保护或发光功能的介质层12的步骤。
其中，可以用电连接线在所述LED芯片11之间，以及LED芯片与电极引出线之间连接。此时，所述电连接线的表面也可以涂覆至少一层具有保护或发光功能的介质层。
或者，在基板上设有电路层9且电路层9上设有焊点时，基板LED芯片11的正极与负极中的至少一个通过焊点与电路层9电连接，并通过电路层的连接排布实现LED芯片11的串联、并联或串并联。
所述立体LED封装可以为锥形螺旋体；或者为等圆螺旋体；或者为沿着轴线方向径向尺寸先变大后又缩小的单个螺旋结构；或者为沿着轴线方向径向尺寸先变大后又缩小的双螺旋结构。
如图14所示，为具有立体LED封装的灯泡的示意图，该灯泡包括一透光泡壳20，该透光泡壳20内设置有带有引出线31和芯柱排气管32的芯柱30，引出线31用于连接固定上述至少一个螺旋形的立体LED封装10。根据本发明，立体LED封装10的基板上的电极引出线经引出线31、驱动器80以及驱动器电引出线81与电连接器90相连，以用于连接外界电源点亮LED芯片，透光泡壳20和芯柱30相连接，在透光泡壳20形成的密封空间内，填充有保护立体LED封装并利于立体LED封装散热的气体，该气体可以是氦气或氢氦混合气。所述透光泡壳20材质为透明、乳白、磨砂、或有色的泡壳，也可以为部分有反射层的，或部分有小棱镜、小透镜的泡壳。所述透光泡壳20的形状为A型、G型、R型、PAR型、T型、烛型或其他现有灯泡泡壳的形状。所述电连接器90为E40、E27、E26、E14、GU等现有的电连接器中的一种。该透光泡壳20内还可设有散热线21，该散热线21连接于芯柱30与立体LED封装10之间，用于将立体LED封装的热传导至芯柱30进而传导至外界。
该灯泡中的立体LED封装可为锥形螺旋体，如图14所示，其可连接成双向AC工作或单向DC工作。所述立体LED封装连接成单向DC工作时，可用外DC电源或交流电源工作；在用外交流电源时，所述驱动器80可由一电容和电阻并联的降压限流电路和整流滤波电路构成，驱动器80电路简单、成本低、无电解电容器，无三极管、无变压器、无高频辐射，也可以是开关电源和恒流装置。
该具有立体LED封装的灯泡可通过以下方法制作，所述制作方法包括以下步骤：
1)根据如前所述的方法制作如前所述的立体LED封装；
2)制作带两条引出线31和芯柱排气管32的芯柱30；
3)将所述立体LED封装的电极引出线2与芯柱30的引出线31连接；
4)将连接的立体LED封装与芯柱30放入透光泡壳20内，并将透光泡壳20与芯柱30相连接的位置用火进行熔烧使两部分相互融合形成一体；
5)将固定好的透光泡壳20通过芯柱排气管32进行抽真空和充气，然后用火熔断所述芯柱排气管32以形成完整密封的灯壳；
6)通过驱动器电引出线81将驱动器80与电连接器90连接，将芯柱30的引出线31与驱动器80连接，将驱动器80放入电连接器90内，并将灯壳与电连接器90固定。
上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
其中，所述充气为向透光泡壳20内充入保护灯丝并利于灯丝散热的气体。
其中，所述芯柱30上还设有散热线21，在上述步骤3)中还包括将所述散热线21与立体LED封装10相连的步骤。
如图15所示，根据本发明的另一个实施例，与上述灯泡不同的是，该灯泡中的立体LED封装的基板1为等圆螺旋体，并且横向设置。并且该透光泡壳20与电连接器90之间还设有连接结构40，其材质为塑料、金属、陶瓷、竹木或橡胶。设置该连接结构40可以使灯泡的脖径扩大，可以使更大尺寸的灯丝或灯条进入，而且设置该连接结构40能够增大泡壳内的容积，有利于灯丝散热。
如图16所示，根据本发明的又一个实施例，与上述灯泡不同的是，该灯泡中具有两个螺旋状的立体LED封装10，形成双螺旋体。该双螺旋体的空间位置可以为相对、相背、相贴或者相互交错，而且双螺旋体的两个螺旋结构的圈数可以一样也可以不一样。如图17a-17b中所示为不同的螺旋结构的立体LED封装的灯泡，图17a为沿轴向从下往上径向尺寸从小逐渐变大的螺旋结构，图17b为沿轴向从下往上径向尺寸从小逐渐变大的双螺旋结构，图17c为沿轴向从下往上径向尺寸先变大后又缩小的单个螺旋结构，图17d为沿轴向从下往上径向尺寸先变大后又缩小的双螺旋结构。
如图18所示，为本发明另一种具有立体LED封装10的灯泡的实施例。该灯泡包括透光泡壳，该透光泡壳内设有散热支撑件50，引出线31和至少一个螺旋形立体LED封装10，其中一根引出线31设于散热支撑件50内，所述至少一个螺旋形立体LED封装10的两端分别与散热支撑件50内的一根引出线和另一根引出线31固定连接。该透光泡壳以及散热支撑件50可以构成为通过连接结构元件60与电连接器90相连，也可以构成为直接与电连接器90连接(未图示)。引出线31与驱动器80相连，而驱动器80设置在连接结构元件60和电连接器90内。连接结构元件60为塑胶、金属、陶瓷、竹木或橡胶。散热支撑件50为具有高导热系数、但不导电的材料(该高导热系数不导电 的材料能够形成热电分离)，这样可以将热由螺旋形立体LED封装10传递到连接结构元件60。所述散热支撑件50可由整体成型，但为了制作方便也可以由一个以上部件组成，各部件的材料可以相同、部分相同或者各不相同。
如图19所示，为本发明的又一种具有立体LED封装10的灯泡的实施例。此实施例与图18中的灯泡大都相似，其不同之处在于，该立体LED封装10只与两条引出线31固定连接，而与散热支撑件50不接触。因此，两条引出线31起到了支撑立体LED封装10的作用，并且同时具有传热和导电功能。该引出线将热由立体LED封装传至散热支撑件50和连接结构元件60。
根据图18、19中所述的灯泡，其结构仅仅是透光泡壳与引出线和电连接器等相互组装，由于散热支撑件以及两条引出线31可以实现良好的散热效果，所以可不用进行灯泡的密封程序以及抽真空、充气程序。
上述如图18、19所示的具有立体LED封装的灯泡可通过以下方法制作，所述制作方法包括以下步骤：
1)根据如前所述的方法制作如前所述的立体LED封装；
2)制作带两条引出线31的散热支撑件50；
3)将所述立体LED封装的电极引出线2与所述散热支撑件50的所述引出线31连接；
4)将连接的立体LED封装与散热支撑件50放入透光泡壳20内，并将透光泡壳20与所述散热支撑件50相固定；
5)通过驱动器电引出线81将驱动器80与电连接器90连接，将散热支撑件50的引出线31与驱动器80连接；
6)将驱动器80放入电连接器90内，并将透光泡壳20以及散热支撑件50通过连接结构元件60与电连接器90连接固定。
上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
其中，所述散热支撑件50为高导热系数不导电的材料。该高导热系数不导电的材料能够形成热电分离，如塑包铝等等。
所述连接结构元件60的材料采用塑胶、金属、陶瓷、竹木或橡胶。
其中，使所述立体LED封装可以与所述散热支撑件50相固定连接，通过散热支撑件50支撑立体LED封装；或者，所述立体LED封装与散热支撑件50可以不接触，可以仅由引出线31支撑所述立体LED封装。
所述散热支撑件50可以整体成型，也可以由一个以上部件组成。
根据本发明，可以实现灯泡的全方位、立体、多层次发光，还易于散热、发光角度大、光量均匀，并且其结构制作简单、加工便利，成本低。

Claims (26)

  1. 一种LED封装用基板，其特征在于，所述基板(1)整体呈螺旋线条形，所述基板(1)的至少一端设有电极引出线(2)，所述电极引出线(2)通过连接构件(3)和/或连接材料连接至所述基板(1)，
    所述基板的螺旋线条相互之间具有间隔，所述基板(1)的边缘(4)至少部分地为光滑的曲线和/或若干直线首尾相接形成的折线。
  2. 根据权利要求1所述的基板，其特征在于，所述基板(1)的边缘设有多个缺口(5)，和/或所述基板(1)表面为反光面或散射面。
  3. 根据权利要求1或2所述的基板，其特征在于，所述基板(1)包括不同材料制成的中间部(6)和紧贴中间部(6)两侧的边缘部(7)；或者所述基板(1)由不同材料的多段拼接而成；或者所述基板包括基板本体以及至少一个与基板本体相嵌套、拼接的与基板材料不同材料制成的点状部或带状部(8)。
  4. 根据权利要求1或2所述的基板，其特征在于，所述基板由PCB板制成，该PCB板上包含有电路层(9)；或者
    所述基板(1)上制作有一个或至少两个相互独立的电路层(9)，所述电路层(9)通过超声波金丝焊接或共晶焊接在基板(1)上，
    所述电路层(9)上设有LED芯片的焊点。
  5. 根据上述权利要求任一项所述的基板，其特征在于，所述基板(1)为整体成型的单个单螺旋结构；或为整体成型的一组单螺旋结构，其中含有至少两个单螺旋结构；或是由至少两个单螺旋结构拼接而成的一组单螺旋结构，其中拼接处设有至少一个连接用的连接构件(3)；或是所述基板为整体成型的双螺旋结构；或由至少两端拼接形成的双螺旋结构，其中拼接处设有至少一个连接用的连接构件(3)。
  6. 根据上述权利要求任一项所述的基板，其特征在于，所述基板(1)为平滑上升的折线状、或者台阶状的折线状，或两者的结合。
  7. 一种立体LED封装，包括上述任一项权利要求所述的基板(1)，其特征在于，所述基板(1)上设有多个串联和/或并联的LED芯片(11)，所述多个LED芯片(11)通过基板(1)两端的电极引出线(2)引出，或者通过基板(1)一端的电 极引出线(2)和基板(1)的另一端作为另一电极引出线引出。
  8. 根据权利要求7所述的立体LED封装，其特征在于，所述基板的螺旋结构呈锥形螺旋体；或者呈等圆螺旋体；或者呈沿着轴线方向径向尺寸先变大后又缩小的单个螺旋结构；或者呈沿着轴线方向径向尺寸先变大后又缩小的双螺旋结构。
  9. 根据权利要求7所述的立体LED封装，其特征在于，所述LED芯片(11)之间以及LED芯片与电极引出线之间用电连接线连接。
  10. 根据权利要求7所述的立体LED封装，其特征在于，所述基板直接由PCB板制成，该PCB板上包含有电路层(9)；或者，所述基板(1)上制作有一个或至少两个相互独立的电路层(9)，所述电路层(9)通过超声波金丝焊接或共晶焊接在基板(1)上，电路层(9)上设有LED芯片的焊点，
    LED芯片(11)的正极与负极中的至少一个通过焊点与电路层(9)电连接，并通过电路层的连接排布实现LED芯片(11)的串联、并联或串并联。
  11. 根据权利要求7-10中任一项所述的立体LED封装，其特征在于，所述LED芯片(11)和基板(1)的表面涂覆有一层具有保护或发光功能的介质层(12)。
  12. 一种立体LED封装的制作方法，其特征在于，制备如权利要求1-5所述的基板，使所述基板整体呈平面螺旋线条形，在所述基板的表面设置多个以串联和/或并联形式连接的LED芯片(11)，在所述基板的首尾两端沿轴向以反方向拉伸从而形成立体螺旋形LED封装。
  13. 根据权利要求12所述的方法，其特征在于，还包括：在所述拉伸前在基板(1)和LED芯片(11)的表面涂覆至少一层具有保护或发光功能的介质层(12)的步骤。
  14. 根据权利要求12所述的方法，其特征在于，所述LED芯片(11)之间，以及LED芯片与电极引出线之间用电连接线连接。
  15. 根据权利要求12所述的方法，其特征在于，所述基板由PCB板制成，该PCB板上包含有电路层(9)；或者所述基板(1)上制作有一个或至少两个相互独立的电路层(9)，所述电路层(9)通过超声波金丝焊接或共晶焊接在基板(1)上，电路层(9)上设有LED芯片的焊点，
    LED芯片(11)的正极与负极中的至少一个通过焊点与电路层(9)电连接，并 通过电路层的连接排布实现LED芯片(11)的串联、并联或串并联。
  16. 一种具有权利要求7-11中任一项所述的立体LED封装的灯泡，其特征在于，包括：透光泡壳(20)，所述透光泡壳内设有引出线(31)，所述引出线(31)上连接有至少一个所述立体LED封装(10)，至少一个所述立体LED封装(10)的电极引出线(2)与引出线(31)连接，所述灯泡还具有驱动器(80)和电连接器(90)，所述引出线(31)与驱动器(80)连接，所述驱动器(80)和电连接器(90)相连。
  17. 根据权利要求16所述的灯泡，其特征在于，所述透光泡壳内设具有所述引出线(31)和芯柱排气管(32)的芯柱(30)，所述透光泡壳(20)和芯柱(30)密接，在透光泡壳(20)内部形成密封空间。
  18. 根据权利要求17所述的灯泡，其特征在于，所述透光泡壳(20)和电连接器之间设有连接结构(40)。
  19. 根据权利要求17所述的灯泡，其特征在于，所述透光泡壳(20)内还设有散热线(21)，所述散热线(21)连接在芯柱(30)和立体LED封装(10)之间。
  20. 根据权利要求16所述的灯泡，其特征在于，包括：所述透光泡壳内设有与其连接的散热支撑件(50)，所述散热支撑件(50)与电连接器(90)相连。
  21. 根据权利要求20所述的灯泡，其特征在于，散热支撑件(50)通过连接结构元件(60)与电连接器(90)相连。
  22. 根据权利要求20或21所述的灯泡，其特征在于，所述立体LED封装与散热支撑件(50)不接触，引出线(31)支撑所述立体LED封装。
  23. 一种具有立体LED封装的灯泡的制作方法，其特征在于，包括以下步骤：
    1)制备权利要求7-11中任一项所述的立体LED封装；
    2)制作带两条引出线(31)和芯柱排气管(32)的芯柱(30)；
    3)将所述立体LED封装的电极引出线(2)与芯柱(30)的引出线(31)连接；
    4)将连接的立体LED封装与芯柱(30)放入透光泡壳(20)内，并将透光泡壳(20)与芯柱(30)相连接的位置用火进行熔烧使两部分相互融合形成一体；
    5)将固定好的透光泡壳(20)通过芯柱排气管(32)进行抽真空并向透光泡壳(20)内充入保护灯丝并利于灯丝散热的气体，然后用火熔断所述芯柱排气管(32)以形成完整密接的灯壳；
    6)通过驱动器电引出线(81)将驱动器(80)与电连接器(90)连接，将芯柱(30)的引出线(31)与驱动器(80)连接，将驱动器(80)放入电连接器(90)内，并将灯壳与电连接器(90)固定，
    其中，上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
  24. 根据权利要求22的灯泡的制作方法，其特征在于，所述芯柱(30)上还设有散热线(21)，在上述步骤3)中还包括将所述散热线(21)与立体LED封装(10)相连的步骤。
  25. 一种具有立体LED封装的灯泡的制作方法，其特征在于，包括以下步骤：
    1)制备权利要求7-11中任一项所述的立体LED封装；
    2)准备带两条引出线(31)的散热支撑件(50)；
    3)将所述立体LED封装的电极引出线(2)与所述引出线(31)连接；
    4)将立体LED封装与散热支撑件(50)放入透光泡壳(20)内，并将透光泡壳(20)与所述散热支撑件(50)相固定连接；
    5)通过驱动器电引出线(81)将驱动器(80)与电连接器(90)连接，将引出线(31)与驱动器(80)连接；
    6)将驱动器(80)放入电连接器(90)内，并将电连接器(90)直接或通过连接结构元件(60)与散热支撑件(50)连接固定，
    其中，上述步骤1)与步骤2)能够任意前后进行，或者同时进行。
  26. 根据权利要求25的灯泡的制作方法，其特征在于，所述立体LED封装与散热支撑件(50)不接触，引出线(31)支撑所述立体LED封装。
PCT/CN2015/091970 2014-10-15 2015-10-15 Led封装用基板、立体led封装、具有该立体led封装的灯泡及其制作方法 Ceased WO2016058539A1 (zh)

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AU2015333293A AU2015333293B2 (en) 2014-10-15 2015-10-15 Substrate used for LED encapsulation, three-dimensional LED encapsulation, bulb comprising three-dimensional LED encapsulation and manufacturing method therefor
US15/518,983 US10563824B2 (en) 2014-10-15 2015-10-15 Substrate used for LED encapsulation, three-dimensional LED encapsulation, bulb comprising three-dimensional LED encapsulation and manufacturing method therefor
ES15851506T ES2835831T3 (es) 2014-10-15 2015-10-15 Sustrato usado para encapsulado LED, encapsulado LED tridimensional, bombilla que comprende encapsulado LED tridimensional y método de fabricación de la misma
EP15851506.4A EP3208523B1 (en) 2014-10-15 2015-10-15 Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor
JP2017539489A JP2017532793A (ja) 2014-10-15 2015-10-15 Ｌｅｄ封止に使用する基板、３次元ｌｅｄ封止体、３次元ｌｅｄ封止体を有する電球及びこれらの製造方法
PL15851506T PL3208523T3 (pl) 2014-10-15 2015-10-15 Podłoże stosowane do enkapsulacji led, trójwymiarowy element enkapsulacji led, żarówka zawierająca trójwymiarowy element enkapsulacji led i sposób ich wytwarzania
CA2964421A CA2964421C (en) 2014-10-15 2015-10-15 Substrate used for led encapsulation, three-dimensional led encapsulation, bulb comprising three-dimensional led encapsulation and manufacturing method therefor

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CN201420597293.1 2014-10-15
CN201420596769.XU CN204424304U (zh) 2014-10-15 2014-10-15 立体led封装
CN201420597293.1U CN204257694U (zh) 2014-10-15 2014-10-15 Led封装基板
CN201420596768.5U CN204176377U (zh) 2014-10-15 2014-10-15 立体led封装的灯泡
CN201420596768.5 2014-10-15
CN201420596769.X 2014-10-15
CN201420616660.8 2014-10-23
CN201420616660.8U CN204240103U (zh) 2014-10-23 2014-10-23 一种螺旋形led封装的灯泡
CN201420615380.5 2014-10-23
CN201420615380.5U CN204268119U (zh) 2014-10-23 2014-10-23 一种双螺旋形led封装的灯泡
CN201510023784.4A CN104613346A (zh) 2015-01-16 2015-01-16 一种立体led封装的灯泡的制作方法
CN201510023423.X 2015-01-16
CN201510023784.4 2015-01-16
CN201510023423.XA CN104595872A (zh) 2015-01-16 2015-01-16 一种螺旋形led封装的灯泡的制作方法

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