WO2016147828A1 - Procédé d'assemblage de pièces de fabrication par laminage - Google Patents

Procédé d'assemblage de pièces de fabrication par laminage Download PDF

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Publication number
WO2016147828A1
WO2016147828A1 PCT/JP2016/055580 JP2016055580W WO2016147828A1 WO 2016147828 A1 WO2016147828 A1 WO 2016147828A1 JP 2016055580 W JP2016055580 W JP 2016055580W WO 2016147828 A1 WO2016147828 A1 WO 2016147828A1
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WIPO (PCT)
Prior art keywords
workpiece
bonding
atmospheric pressure
contact angle
pressure plasma
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2016/055580
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English (en)
Japanese (ja)
Inventor
真 和佐本
史敏 竹元
鈴木　信二
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Ushio Denki KK
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Ushio Denki KK
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Priority to US15/559,372 priority Critical patent/US10286640B2/en
Priority to JP2016541689A priority patent/JP6195022B2/ja
Publication of WO2016147828A1 publication Critical patent/WO2016147828A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/746—Joining plastics material to non-plastics material to inorganic materials not provided for in groups B29C66/742 - B29C66/744
    • B29C66/7465—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0092—Other properties hydrophilic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B2037/0092—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding in which absence of adhesives is explicitly presented as an advantage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/422—Luminescent, fluorescent, phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/542—Shear strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/228—Presence of unspecified polymer in the pretreated surface to be joined
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/1092—All laminae planar and face to face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/14—Surface bonding means and/or assembly means with shaping, scarifying, or cleaning joining surface only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Definitions

  • the present invention relates to a method for bonding workpieces made of synthetic resin, glass, silicon wafer, crystal or sapphire.
  • This microreactor is composed of a microchip in which a microscale analysis channel or the like is formed on a small substrate made of, for example, silicon, silicone resin or glass by a semiconductor microfabrication technique.
  • a reaction analysis system using such a microreactor is called a micro total analysis system (hereinafter referred to as “ ⁇ TAS”).
  • ⁇ TAS micro total analysis system
  • a chip suitable for various applications can be configured.
  • Applications of the microchip include chemical analysis such as gene analysis, clinical diagnosis, drug screening, analysis in the fields of chemistry, pharmacy, medicine, medicine, veterinary medicine, compound synthesis, environmental measurement, and the like.
  • Such a microchip typically has a structure in which a pair of substrates are bonded to face each other. Fine channels (for example, about 10 to several hundred ⁇ m in width and about 10 to several hundred ⁇ m in depth) are formed on the surface of at least one substrate.
  • a glass substrate is mainly used because it is easy to manufacture and can be optically detected. Recently, development of a microchip using a resin substrate that is lightweight but is less likely to be damaged than a glass substrate and that is inexpensive.
  • the conventional bonding method has a problem that a bonded state with a high strength may not be obtained in the bonded body even though the substrate surface is irradiated with a sufficient amount of ultraviolet rays. did.
  • an object of the present invention is to provide a method for bonding workpieces that can reliably achieve a high strength bonded state in the obtained bonded body.
  • the method of laminating a workpiece of the present invention is a method of laminating a workpiece made of resin and a workpiece made of resin or glass, A surface activation step of treating the bonded surface of the workpiece made of at least resin with vacuum ultraviolet light or atmospheric pressure plasma, A joining step of joining the two workpieces in a stacked state so that their bonding surfaces are in contact with each other; In the surface activation step, at the time when the cumulative amount of vacuum ultraviolet light or atmospheric pressure plasma applied to the bonding surface is within an initial decrease section in the change curve of the water contact angle of the bonding surface with respect to the integrated processing amount. The treatment with the vacuum ultraviolet ray or the atmospheric pressure plasma on the bonding surface is stopped.
  • the bonded surface in the surface activation step, before the water contact angle of the bonded surface becomes less than 30 °, the bonded surface is treated with vacuum ultraviolet light or atmospheric pressure plasma. It is preferable to stop. Further, in the surface activation step, after the contact angle of water on the bonding surface is lower than the initial contact angle before the surface activation step, the processing on the bonding surface with vacuum ultraviolet light or atmospheric pressure plasma is stopped. It is preferable. Moreover, it is preferable that resin which comprises the said workpiece
  • the integrated processing amount of vacuum ultraviolet light or atmospheric pressure plasma on the bonding surface of the workpiece is the contact angle of water on the bonding surface with respect to the integrated processing amount.
  • the processing with the vacuum ultraviolet ray or atmospheric pressure plasma on the workpiece bonding surface is stopped. Therefore, a high strength bonded state can be reliably achieved in the obtained bonded body.
  • FIG. 5 is a curve diagram showing the relationship between the contact angle of water on the bonded surface and the tensile shear strength measured for workpiece A, workpiece B and workpiece C in Experimental Examples 1 to 4.
  • FIG. 9 is a curve diagram showing the relationship between the contact angle of water on the bonded surface and the tensile shear strength measured for workpiece A, workpiece B, and workpiece C in Experimental Examples 5 to 8.
  • the workpiece bonding method of the present invention is a method of bonding two plate-shaped workpieces, for example.
  • one work is made of resin
  • the other work is made of resin or glass.
  • Each of the two workpieces may be made of the same material or different materials.
  • a resin constituting the workpiece a silicone resin such as polydimethylsiloxane, a cycloolefin resin, an acrylic resin, or the like can be used.
  • As the glass constituting the workpiece quartz glass, sapphire glass, alkali glass, borosilicate glass, or the like can be used.
  • the workpiece bonding method of the present invention includes a surface activation process in which a bonding surface of a workpiece made of at least a resin is treated with vacuum ultraviolet light or atmospheric pressure plasma, and two workpieces are laminated so that the bonding surfaces are in contact with each other. And a joining step for joining in a state of being performed.
  • a surface activation process it is only necessary to process the workpiece made of resin, but when bonding the workpiece made of resin and the workpiece made of glass, the processing is performed on both of the two workpieces. You may go.
  • the surface activation process using vacuum ultraviolet rays is referred to as “ultraviolet treatment process”, and the surface activation process using atmospheric pressure plasma is referred to as “plasma treatment process”.
  • the surface activation process is one of an ultraviolet treatment process and a plasma treatment process.
  • the ultraviolet ray treatment step is performed by irradiating at least a bonded surface of a workpiece made of resin with vacuum ultraviolet rays having a wavelength of 200 nm or less.
  • a light source for emitting vacuum ultraviolet rays an excimer lamp such as a xenon excimer lamp having an emission line at a wavelength of 172 nm, a low-pressure mercury lamp having an emission line at a wavelength of 185 nm, or a deuterium lamp having an emission line in the wavelength range of 120 to 200 nm is preferably used. be able to.
  • the integrated amount of vacuum ultraviolet light irradiated on the bonding surface of the workpiece is set as the integrated processing amount of vacuum ultraviolet light on the bonding surface.
  • This integrated processing amount (integrated light amount) is an initial decrease section in a change curve of the contact angle of water on the bonded surface with respect to the integrated processing amount (hereinafter also referred to as “contact angle / integrated processing amount change curve”).
  • contact angle / integrated processing amount change curve the processing (vacuum ultraviolet irradiation) with the vacuum ultraviolet ray on the bonded surface of the workpiece is stopped.
  • the initial decrease interval in the contact angle / integrated treatment amount change curve is obtained as follows. First, the bonded surface of the workpiece is irradiated with vacuum ultraviolet light having a predetermined illuminance, and the water contact angle of the bonded surface is measured every time the integrated light amount on the bonded surface reaches a predetermined value. The measured values of the contact angle of water obtained are plotted in a coordinate system in which the vertical axis indicates the contact angle and the horizontal axis indicates the integrated light quantity.
  • a range of measured values in which the measured value of the contact angle of water decreases approximately in proportion to the integrated light amount is selected, and an approximate straight line (hereinafter referred to as “approximate straight line”) of the selected measured value group is selected.
  • A a measurement range having a small difference from the previous measurement value
  • an approximate straight line hereinafter referred to as “approximate straight line B”
  • the intersection between the approximate straight line A and the approximate straight line B is set as a displacement point, and the interval from the start point of the vacuum ultraviolet irradiation to the displacement point is set as an initial decrease interval.
  • the ultraviolet treatment process it is preferable to stop the irradiation of the vacuum ultraviolet ray on the bonded surface of the workpiece before the contact angle of water on the bonded surface of the workpiece becomes less than 30 °.
  • the contact angle of water on the workpiece bonding surface is less than 30 ° and the irradiation of the vacuum ultraviolet ray on the workpiece bonding surface is stopped, a high strength bonded state is achieved in the resulting bonded body. May be difficult.
  • the ultraviolet treatment process it is preferable to stop the irradiation of the vacuum ultraviolet ray on the workpiece bonding surface after the contact angle of water on the workpiece bonding surface is lower than the initial contact angle before the ultraviolet treatment step. If the irradiation of vacuum ultraviolet rays on the workpiece bonding surface is stopped before the water contact angle of the workpiece bonding surface falls below the initial contact angle, a high strength bonding state is achieved in the resulting bonded body. Can be difficult.
  • the illuminance of the vacuum ultraviolet rays applied to the workpiece bonding surface is, for example, 10 to 100 mW / cm 2 .
  • the irradiation time of the vacuum ultraviolet rays applied to the bonding surface of the workpiece is appropriately set within a range where the integrated light quantity on the bonding surface satisfies the above conditions.
  • FIG. 1 is an explanatory diagram illustrating a configuration of an example of an atmospheric pressure plasma apparatus.
  • This atmospheric pressure plasma apparatus has a rectangular parallelepiped casing 10 made of, for example, aluminum.
  • a plate-like electrode 20 electrically connected to the high frequency power supply 25 is disposed horizontally.
  • a dielectric layer 21 is formed on the lower surface of the electrode 20.
  • the electrode 20 constitutes a high voltage side electrode
  • the casing 10 constitutes a ground side electrode.
  • a gas supply port 11 for supplying plasma gas into the casing 10 is provided on the upper surface of the casing 10.
  • a plurality of nozzles 12 for discharging atmospheric pressure plasma generated in the casing 10 to the outside are formed on the lower surface of the casing 10.
  • plasma gas is supplied into the casing 10 from the gas supply port 11 under atmospheric pressure or a pressure in the vicinity thereof.
  • a high frequency electric field is applied between the electrode 20 and the casing 10 via the dielectric layer 21 by the high frequency power supply 25
  • a dielectric barrier discharge is generated between the electrode 20 and the casing 10
  • the casing The plasma gas existing between 10 and the dielectric layer 21 is ionized or excited to generate atmospheric pressure plasma.
  • the generated atmospheric pressure plasma is discharged from the nozzle 12 of the casing 10 to the outside.
  • the plasma gas it is preferable to use a gas mainly containing nitrogen gas, argon gas or the like and containing 0.01 to 5% by volume of oxygen gas.
  • a mixed gas of nitrogen gas and clean dry air (CDA) can be used.
  • the power supplied from the high frequency power supply 25 has a frequency of 20 to 70 kHz and a voltage of 5 to 15 kVp-p.
  • the integrated amount of atmospheric pressure plasma with respect to the bonding surface is calculated by the product of the electric power supplied to the atmospheric pressure plasma apparatus and the processing time (atmospheric pressure plasma contact time). . If the power supplied to the atmospheric pressure plasma apparatus is constant, the processing time by the atmospheric pressure plasma can be regarded as the integrated processing amount of the atmospheric pressure plasma. Then, when the integrated processing amount is within the initial decrease section in the contact angle / integrated processing amount change curve, the processing (atmospheric pressure plasma contact) with the atmospheric pressure plasma on the workpiece bonding surface is stopped.
  • the initial decrease section in the contact angle / integrated processing amount change curve is obtained as follows.
  • the atmospheric pressure plasma apparatus is operated with a predetermined power, and the generated atmospheric pressure plasma is brought into contact with the bonding surface of the workpiece, and each time the integrated processing amount on the bonding surface reaches a predetermined value, the bonding surface Measure the water contact angle.
  • the measured values of the contact angle of water obtained are plotted in a coordinate system in which the vertical axis indicates the contact angle and the horizontal axis indicates the integrated processing amount.
  • a range of measured values in which the measured value of the water contact angle decreases approximately in proportion to the integrated processing amount is selected, and an approximate straight line A of the selected measured value group is obtained.
  • a measurement range having a small difference from the preceding measurement value is selected, and an approximate straight line B of the selected measurement value group is obtained.
  • the intersection between the approximate straight line A and the approximate straight line B is defined as a displacement point, and the interval from the start point of contact with atmospheric pressure plasma to the displacement point is defined as an initial decrease interval.
  • the plasma treatment step it is preferable to stop the treatment by the atmospheric pressure plasma on the workpiece bonding surface before the contact angle of water on the workpiece bonding surface becomes less than 30 °.
  • the plasma processing step it is preferable to stop the processing by atmospheric pressure plasma on the workpiece bonding surface after the water contact angle of the workpiece bonding surface is lower than the initial contact angle before the plasma processing step.
  • joining process In the joining step, the two workpieces are joined in a stacked state so that their bonding surfaces are in contact with each other.
  • Specific methods for joining the workpieces include (1) a method of heating in a state in which two workpieces are laminated, (2) a method of pressing in the thickness direction in a state of laminating two workpieces, (3) Examples include a method of heating while pressing in the thickness direction in a state where two workpieces are stacked, and a method of heating after pressing in the thickness direction in a state where two workpieces are stacked and releasing the pressurization.
  • Specific conditions in the joining process are appropriately set within a range in which the workpieces are not deformed, depending on the material constituting the workpieces.
  • specific heating conditions when two workpieces are heated, the heating temperature is 100 to 110 ° C. Further, when two workpieces are pressurized, the applied pressure is 0.2 to 10 MPa.
  • the processing with the vacuum ultraviolet ray or the atmospheric pressure plasma is stopped when the integrated processing amount is within the initial decrease section in the contact angle / integrated processing amount change curve. It is possible to prevent or suppress part of the coalescence from being decomposed. Therefore, it is estimated that it is possible to achieve a high strength joining state for two workpieces in the joining process.
  • the workpiece A is made of a cycloolefin resin (“Zeonex 480R” manufactured by Nippon Zeon Co., Ltd.) and has a rectangular plate shape with dimensions of 25 mm ⁇ 45 mm ⁇ 3 mm.
  • the workpiece B is made of an acrylic resin (“SUMIPEX” manufactured by Sumitomo Chemical Co., Ltd.) and has a rectangular plate shape with dimensions of 25 mm ⁇ 45 mm ⁇ 2 mm.
  • the workpiece C is made of a silicone resin (“Silicone impression material SIM-260” manufactured by Shin-Etsu Chemical Co., Ltd.) and has a rectangular plate shape with dimensions of 25 mm ⁇ 45 mm ⁇ 4 mm.
  • Casing (10) material Aluminum Electrode (20) material: Super Invar (with 500 ⁇ m alumina coating formed on the surface by thermal spraying))
  • Each of the workpiece A, the workpiece B, and the workpiece C was disposed at a position where the distance between the bonding surface and the nozzle 12 of the atmospheric pressure plasma apparatus was 3 mm.
  • the atmospheric pressure plasma emitted from the nozzle (12) is brought into contact with the bonded surfaces of the workpiece A, workpiece B and workpiece C. Each time a predetermined processing time elapses, the contact angle of water on the bonded surface was measured.
  • the measured values of the contact angle of water were plotted in a coordinate system in which the vertical axis represents the contact angle and the horizontal axis represents the integrated light quantity.
  • a graph obtained for the workpiece A is shown in FIG.
  • work B is shown in FIG.
  • a graph obtained for the workpiece C is shown in FIG.
  • the displacement point of the initial reduction area was calculated
  • the processing time at the displacement point for the workpiece A was 4 seconds
  • the processing time at the displacement point for the workpiece B was 5 seconds
  • the processing time at the displacement point for the workpiece C was 15 seconds.
  • the contact area which contacts each other in the bonding surface of each of the two workpieces is 625 mm 2 .
  • the two workpieces were joined by applying pressure under the conditions of a pressure of 2 MPa and a pressing time of 300 seconds.
  • the tensile shear strength was measured based on JISK6850. The results are shown in Table 1. Further, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • the contact area which contacts each other in the bonding surface of each of the two workpieces is 625 mm 2 .
  • the two workpieces were joined by applying pressure under the conditions of a pressure of 2 MPa and a pressing time of 300 seconds.
  • the tensile shear strength was measured based on JISK6850. The results are shown in Table 1. Further, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • the contact area which contacts each other in the bonding surface of each of the two workpieces is 625 mm 2 .
  • the two workpieces were joined by applying pressure under the conditions of a pressure of 2 MPa and a pressing time of 300 seconds.
  • the tensile shear strength was measured based on JISK6850. The results are shown in Table 1. Further, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • the contact area which contacts each other in the bonding surface of each of the two workpieces is 625 mm 2 .
  • the two workpieces were joined by applying pressure under the conditions of a pressure of 2 MPa and a pressing time of 300 seconds.
  • the tensile shear strength was measured based on JISK6850. The results are shown in Table 1. Further, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • Example 6 The two workpieces B were bonded together by performing the plasma treatment step and the joining step in the same manner as in Experimental Example 5 except that the treatment time in the plasma treatment step was changed according to Table 2 below. Moreover, after the plasma treatment process was completed, the contact angle of water on the bonded surface of the workpiece was measured. The results are shown in Table 2. Moreover, the tensile shear strength was measured about the obtained joined body based on JISK6850. The results are shown in Table 2. In addition, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • Example 7 The two workpieces C were bonded together by performing the plasma treatment step and the joining step in the same manner as in Experimental Example 5 except that the treatment time in the plasma treatment step was changed according to Table 2 below. Moreover, after the plasma treatment process was completed, the contact angle of water on the bonded surface of the workpiece was measured. The results are shown in Table 2. Moreover, the tensile shear strength was measured about the obtained joined body based on JISK6850. The results are shown in Table 2. In addition, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.
  • Example 8 Except that the processing time in the plasma processing step was changed according to Table 2 below, the workpiece A and the workpiece B having different materials were bonded together by performing the plasma processing step and the bonding step in the same manner as in Experimental Example 5. . Moreover, after the plasma treatment process was completed, the contact angle of water on the bonded surface of the workpiece was measured. The results are shown in Table 2. Moreover, the tensile shear strength was measured about the obtained joined body based on JISK6850. The results are shown in Table 2. In addition, a curve diagram showing the relationship between the contact angle of water and the tensile shear strength on the bonded surface is shown in FIG.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
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  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne un procédé d'assemblage de pièces de fabrication par laminage, permettant d'obtenir de manière fiable un état d'assemblage à haute résistance dans un corps assemblé obtenu. Plus précisément, l'invention concerne un procédé d'assemblage par laminage d'une pièce de fabrication faite d'une résine et d'une pièce de fabrication faite d'une résine ou de verre. Ledit procédé comprend : une étape d'activation de surface consistant à traiter moins une surface de laminage de la pièce de fabrication faite de résine avec des rayons ultraviolets sous vide ou par plasma sous pression atmosphérique ; et une étape d'assemblage consistant à assembler les deux pièces l'une à l'autre dans un état stratifié, leurs surfaces de laminage étant en contact mutuel. Ledit procédé est caractérisé en ce que, à l'étape d'activation de surface, le traitement de la surface de laminage avec les rayons ultraviolets sous vide ou avec le plasma sous pression atmosphérique est interrompu à un point auquel une quantité de traitement intégrale des rayons ultraviolets sous vide ou du plasma sous pression atmosphérique par rapport à la surface de laminage se situe dans une section de réduction initiale d'une courbe de changement d'un angle de contact avec l'eau sur la surface de laminage par rapport à la quantité de traitement intégrale.
PCT/JP2016/055580 2015-03-19 2016-02-25 Procédé d'assemblage de pièces de fabrication par laminage Ceased WO2016147828A1 (fr)

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JPWO2016147828A1 (ja) 2017-04-27
JP6195022B2 (ja) 2017-09-13

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