WO2016175779A1 - Couvercle pour dispositifs - Google Patents

Couvercle pour dispositifs Download PDF

Info

Publication number
WO2016175779A1
WO2016175779A1 PCT/US2015/028181 US2015028181W WO2016175779A1 WO 2016175779 A1 WO2016175779 A1 WO 2016175779A1 US 2015028181 W US2015028181 W US 2015028181W WO 2016175779 A1 WO2016175779 A1 WO 2016175779A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover
projected portions
thermal radiation
coating
base structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2015/028181
Other languages
English (en)
Inventor
Kuan-Ting Wu
Ya-Ting Yeh
Chienlung YANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2015/028181 priority Critical patent/WO2016175779A1/fr
Publication of WO2016175779A1 publication Critical patent/WO2016175779A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]

Definitions

  • the device may heat up.
  • a component set of the electronic device may heat causing the device to be heated.
  • the component set may include, for instance, a power source and a chipset of the device.
  • Such heat generated by the device can be dissipated through the body of the device.
  • Figure 1 illustrates a schematic of a device having a cover, in accordance with an example of the present subject matter.
  • Figure 2 illustrates a schematic of the cover, in accordance with an example of the present subject matter.
  • Figure 3A illustrates a sectional view of the cover, in accordance with an example of the present subject matter.
  • Figure 3B illustrates a sectional view of the cover, in accordance with another example of the present subject matter.
  • Figure 4A illustrates a sectional view of the cover, in accordance with yet another example of the present subject matter.
  • Figure 4B illustrates a sectional view of the cover, in accordance with one other example of the present subject matter.
  • Figure 5 illustrates a method for forming the cover, in accordance with an example of the present subject matter.
  • a component set of a device such as a personal computer (PC), a tablet PC, and a mobile phone, may heat up during operation of the device.
  • the heating up of the component set such as a battery or a motherboard, may adversely affect operation of the device. Accordingly, such heat has to be carried away from the component set and dissipated into the atmosphere.
  • the heat from the component set may be transferred to a body of the device for being carried away. Therefore, the body of the device may be designed for the purpose of dissipating the heat from the device. For instance, portions of the body in proximity of the component set, such as a cover of the device, may be designed for dissipation of the heat.
  • the cover of the device is made of a thermally conducting material to achieve effective dissipation of the heat.
  • having the cover made of such a material may cause the cover to quickly absorb considerable amount of the heat.
  • having such a cover on the device may expose a user of the device to discomfort while handling the device and, in certain situations, may even cause heat related injuries.
  • a metallic casing of a processing unit of a PC may get heated during operation, and a toddler in the vicinity of the PC may touch the casing and may sustain heat burns.
  • the cover of the device can be fabricated from a thermally insulating material. While such a cover protects the user, it may not effectively dissipate the heat from the component set. As a result, the component set may overheat and may, in turn, affect the operation of the device.
  • the present subject matter describes a cover for a device, a device and a method for forming the cover, in accordance with aspects of the present subject matter.
  • the cover can provide effective heat dissipation from the device when deployed at the device and, additionally, can prevent any discomfort to a user of the device.
  • the cover includes a base structure, for instance, a body portion which forms the cover.
  • the base structure can have a first surface and a second surface.
  • the first surface can be towards the device and can face a heat source, such as a component set, of the device.
  • the second surface opposite to the first surface, faces away from the heat source of the device. Further, the second surface can be responsible for dissipation of the heat from the component set of the device.
  • the second surface can include a plurality of projected portions.
  • the second surface can have a plurality of projections protruding away from the second surface forming the projected portions.
  • the second surface can have a plurality of depressions and the undepressed portions of the second surface can form the projected portions of the second surface.
  • the projected portions can be provided for providing a large surface area of the second surface to enhance a surface for effective dissipation of the heat of the component set from the cover, in a deployed condition.
  • the second surface can be provided with a thermal radiation coating to achieve dissipation of the heat of the component set by radiation.
  • the thermal radiation coating can complement the effect of large surface area of the second surface and further facilitate in effective heat dissipation from the cover.
  • the thermal radiation coating can provide for effective spreading of the heat along the surface of the second surface to prevent accumulation of the heat and formation of any hot spots on the second surface of the cover.
  • a heat insulation coating can be provided on an end surface of each projected portion of the second surface.
  • the end surface of the projected portion can be a portion which comes in contact with or is potentially exposed to come in contact with a user, when the cover is deployed with the device and the device is being operated. Accordingly, when the device is operated or handled with the cover deployed thereon, the user comes in contact with the heat insulation coating instead of the hot second surface, for example, the thermal radiation coating on the second surface.
  • the provision of the heat insulation coating prevents a user holding or operating the device on which the cover is deployed from coming in direct contact with the hot second surface.
  • the heat insulation coating can be provided over the thermal radiation coating.
  • the thermal radiation coating can be applied on few portions of the second surface and not applied on portions on which the heat insulation coating is to be provided. Accordingly, in said example, the thermal radiation coating can be applied over the second surface with the end surfaces of the projected portions, referred to as non-coated regions, left uncoated. Accordingly, at the non-coated regions, the heat insulation coating can be provided as being in direct contact with the second surface of the cover.
  • the cover in accordance with the present subject matter, when deployed at the device, facilitates dissipation of heat from the device and provides suitable insulation at certain portions where the device can be held at or can come in contact of the user.
  • overheating of the component set, and therefore, of the surface of the device is minimized.
  • possible damage to the component set and occurrence of heat related injuries to the user can be prevented.
  • Figure 1 illustrates a schematic of a device 100, according to an example of the present subject matter.
  • the device 100 can be an electronic device and can include a personal computer (PC), a laptop, a tablet PC, a mobile phone, and a charging device of the aforementioned devices.
  • the device 100 can include a component set 102 and a cover 104.
  • the component set 102 can include, for example, a battery and a chipset, of the device 100 which can generate heat during operation of the device 100.
  • the component set 102 can be a heat source which can generate heat during the operation of the device 100.
  • the chipset of the device 100 can start emitting heat, for instance, due to internal resistance of various components of the chipset to passage of current through them.
  • the cover 104 of the device 100 can be a part of a body of the device 100 and can be responsible for dissipation of the heat generated by the component set 102.
  • the cover 104 can provide for convenience of use of the device 100 to the user without feeling any discomfort due to the heat.
  • the cover 104 can have a first surface 1 12 to face the component set 102 and a second surface 1 14 opposite to the first surface 1 12 to dissipate the heat generated by the component set 102, for instance, to surroundings.
  • the cover 104 can be provided with certain structural features for the aforementioned purpose.
  • the cover 104 can have projected portions, for example, on the second surface 1 14, for providing a large surface area for dissipation of heat.
  • cover 104 can be provided with a coating to facilitate heat dissipation, and can be provided with another coating at selected portions to protect a user from coming in direct contact with a hot surface of the cover 104.
  • the cover 104 is explained in detail with reference to Figure 2, Figure 3A, Figure 3B, Figure 4A, and Figure 4B.
  • FIG. 2 illustrates a schematic of the cover 104, in accordance with an example of the present subject matter.
  • the cover 104 can provide for dissipation of the heat generated by the component set 102 and prevents discomfort, due to the heat, to the user handling the device 100 during operation or operating the device 100.
  • the cover 104 can be a detachable or non- detachable part of the body of the device 100.
  • the cover 104 can be a battery cover of a mobile device or a tablet PC.
  • the cover 104 can be a bottom plate of a laptop.
  • the cover 104 can have a base structure 106, a thermal radiation coating 108, and a heat insulation coating 1 10.
  • the base structure 106 can be a skeleton structure of the cover 104 over which the coatings can be applied.
  • the base structure 108 can be comprised of a metal, a metal alloy, a polymer, carbon fiber, or a combination of such materials, to provide rigidity to the structure as well as effective heat dissipation properties.
  • the base structure 106 can be formed as having a plurality of projected portions (not shown) on a surface facing away from the component set 102 of the device 100 when deployed at the device 100.
  • the base structure 106 can have the first surface 1 12 and the second surface 1 14,
  • the first surface 1 12 can face the component set 102 in the deployed condition of the cover 104 at the device, and the second surface 1 14 can be opposite to the first surface 1 12. Accordingly, the second surface 1 14 can have the projected portions,
  • the second surface 1 14 can be provided with a plurality of projections protruding away from the component set 102 to form the projected portions.
  • the second surface 1 14 can have a plurality of depressions.
  • the undepressed portions, or in other words, the portions of the second surface 1 14 which have not been depressed, can form the projected portions of the second surface 1 14.
  • the second surface 1 14 can have a groove-like structure having a plurality of crests and troughs.
  • the crests and troughs can be formed as linear or circular serrations or in the form of a honeycomb-like structure on the second surface 1 14.
  • the projected portions on the second surface 1 14 can be formed as small structures, the size of the structures selected with the purpose of providing as large a surface area of the second surface 1 14 as possible.
  • the cover 104 can be provided with a coating for facilitating heat dissipation.
  • the second surface 1 14 can be coated with the thermal radiation coating 108 to achieve dissipation of the heat generated by the component set 102 by radiation.
  • the thermal radiation coating 108 can provide for spreading of the heat along the second surface 1 14, thereby preventing formation of hot spots on the second surface 1 14, Such prevention of formation of hot spots, in addition to facilitating in effective heat dissipation, protects the user of the device 100 from discomfort due to accumulation of heat at certain regions.
  • the thermal radiation coating 108 can augment the provision of the projected portions on the second surface 1 14 to achieve effective heat dissipation from the cover 104 and can protect a user handling or operating the device 100 when the cover 104 is deployed at the device 100.
  • the thermal radiation coating 108 can be a carbon- based coating.
  • the thermal radiation coating 108 can include carbon nanotubes, graphite, and diamond.
  • the thermal radiation coating 108 can be formed as a graphene-based coating.
  • the thermal radiation coating 108 can be formed of suspended graphene and can have a thermal conductivity of approximately 5,300 W-m ⁇ -K ⁇ 1 at room temperature.
  • the thermal radiation coating 108 can be formed of pyrolytic graphite and have a thermal conductivity of approximately 2,000 W-m " -K -1 at room temperature.
  • the cover 104 can be provided with further features to supplement the function of the thermal radiation coating 108 of preventing discomfort to the user while handling or operating the device 100.
  • the second surface 1 14 can be provided with the heat insulation coating 1 10.
  • the heat insulation coating 1 10 can provided on a portion of the second surface 1 14 which comes in contact with or is potentially exposed to come in contact with the user, when the cover 104 is deployed with the device 100 and the device 100 is being operated.
  • the heat insulation coating 1 10 can be provided on an end surface (not shown) of each projected portion of the second surface 1 14.
  • the end surface of the projected portion can be a peripheral portion of the projected portions and can come in contact with the user when the cover 104 is deployed at the device 100.
  • a tip portion of the protrusions forming the projected portions of the second surface 1 14 can be the end surfaces. Accordingly, when the device 100 is operated or handled with the cover 104 deployed thereon, the user does not come in direct contact with the hot second surface 1 14, for example, the thermal radiation coating 108, and instead comes in contact with the heat insulation coating 1 10.
  • the heat insulation coating 1 10 can comprise mineral-based insulators, fiber glass-based insulators, cellular glass-based insulators, cellulose-based insulators, polymeric foam-based insulators, polymeric resin-based insulators, silica-based insulators, or a combination of such insulators.
  • the mineral-based insulators can include mineral wools, ceramic fiber, glass, and stone;
  • the silica-based insulators can include, in portion or in entirety, silica, calcium silicate, or vermiculite;
  • the polymeric foam-based insulators can include eiastomeric foam, phenolic foam, polystyrene foam, and polyurethane foam,
  • the heat insulation coating 1 10 can be provided at the end surfaces of the projected portions, over the thermal radiation coating 108.
  • the thermal radiation coating 108 can be sandwiched between the second surface 1 14 and the heat insulation coating.
  • the heat insulation coating 1 10 can be provided as being in direct contact with the second surface 1 14 of the cover 104.
  • the thermal radiation coating 108 can be selectively applied on few portions of the second surface 1 14 and not applied on portions on which the heat insulation coating 1 10 is to be coated.
  • Such portions of the second surface 1 14 which are not coated with the thermal radiation coating 108 can be referred to as non-coated regions of the second surface 1 14.
  • the end surfaces of the projected portions can be left devoid of the thermal radiation coating 108, or in other words, can be the non-coated regions of the second surface 1 14.
  • the heat insulation coating 1 10 can be coated to be in direct contact with the second surface 1 14.
  • FIG 3A illustrates a sectional view of the cover 104 of the device 100, in accordance with an example of the present subject matter, in said example, the projected portions 300 of the second surface 1 14 of the cover 104 are formed as a plurality of protrusions 302 extending from the second surface 1 14.
  • the heat insulation coating 1 10 is coated over the thermal radiation coating 108, or as mentioned above, the thermal radiation coating 108 is between the end surface of the projected portions 300 and the heat radiation coating 1 10.
  • Figure 3B illustrates the sectional view of the cover 104, in accordance with another example of the present subject matter.
  • the second surface 1 14 has a plurality of depressions 304 formed thereon. Accordingly, in said example, the projected portions 300 of the second surface 1 14 are formed by the undepressed portions 308 of the second surface 1 14.
  • the thermal radiation coating 108 and the heat insulation coating 1 10 are provided over the second surface 1 14 in the same manner as described with reference to Figure 3A.
  • FIG 4A illustrates the sectional view of the cover 104, in accordance with yet other example of the present subject matter.
  • the second surface 1 14 has the plurality of protrusions 302 extending from the second surface 1 14, the plurality of protrusions 302 forming the projected portions 300 of the second surface 1 14.
  • the heat insulation coating 1 10 can be coated on the second surface 1 14 to be in direct contact with the second surface 1 14 of the cover 104.
  • the thermal radiation coating 108 can be selectively applied on few portions of the second surface 1 14.
  • the heat insulation coating 1 10 can be provided to be in directly on the second surface 1 14.
  • Figure 4B illustrates the sectional view of the cover 104, in accordance with one other example of the present subject matter, !n said example, similar to the example in Figure 3B, the second surface 1 14 is formed as having a plurality of depressions 304. Accordingly, in said example, the undepressed portions 306 of the second surface 1 14 form the projected portions 300 of the second surface 1 14. Further, the thermal radiation coating 108 is selectively provided on the second surface 1 14 and the heat insulation coating 1 10 is provided in direct contact with the second surface 1 14, in the same manner as described with reference to Figure 4A.
  • Figure 5 illustrates a method 500 for forming the cover 104 for the device 100, in accordance with an example of the present subject matter.
  • the cover 104 can achieve dissipation of heat generated during the operation of the device 100, and at the same time, protect any harm or discomfort to the user handling or operating the device 100,
  • the order in which the method 500 is described is not intended to be construed as a limitation, and any number of the described method blocks can be combined in any appropriate order to execute the method 500 or another similar method. Additionally, individual blocks may be deleted from the method 500 without departing from the spirit and scope of the subject matter described herein.
  • the base structure 106 of the cover 104 is formed, the base structure 106 having the first surface 1 12 and the second surface 1 14.
  • the first surface 1 12 can face the component set 102, acting as a heat source, of the device 100 in a deployed condition of the cover 104 on the device 100.
  • the second surface 1 14 can be opposite to the first surface 1 12 and can be responsible for dissipation of the heat.
  • the second surface 1 14 can include the projected portions 300.
  • the projected portions can be formed by a plurality of projections 302 protruding from the second surface 1 14.
  • the second surface 1 14 can have a plurality of depressions 304 and the undepressed portions of the second surface 1 14 can form the projected portions 300.
  • the base structure 108 can comprise a metal, a metal alloy, a polymer, carbon fiber, or a combination of such materials, to provide rigidity to the structure as well as effective heat dissipation properties.
  • the base structure 106 can be fabricated using die casting.
  • the base structure 106 comprises a plastic material
  • the base structure 106 can be made by injection molding or using a computer-numerical control (CMC) machine.
  • CMC computer-numerical control
  • the base structure 106 comprises carbon fiber
  • the base structure 106 can be fabricated by compression molding.
  • the thermal insulation coating 108 is selectively applied over the second surface 1 14 of the base structure 106 leaving few portions or the entire end surface of each projected portion uncoated, the uncoated portions being referred to as non-coated regions.
  • the thermal insulation coating 108 is selectively applied over the second surface 1 14, and the end surface of the projected portions having a non-coated region after the thermal radiation coating 108 has been applied.
  • the projected portions 300 are formed as protrusions 302
  • a tip portion of the protrusion 302 can be the end surfaces.
  • the thermal radiation coating 108 can be applied on the entire second surface 1 14. In such a case, the end surface of the projected portion does not have any non-coated region.
  • the thermal radiation coating 108 can be applied using insert molding or using out-mold decoration, for instance, when the base structure 106 is made of a metal, a metal alloy, or of plastic. Further, in case the base structure 106 is made of carbon fiber, the thermal radiation coating 108 can be applied using out-mold decoration.
  • the heat insulation coating 1 10 is provided on the non-coated regions at the end surfaces, the heat insulation coating 1 10 being in direct contact with the end surfaces, or the second surface 1 14.
  • the heat insulation coating 1 10 can be applied over the thermal radiation coating 108.
  • cover 104 for the device 100 and the method 500 for forming the cover 104 have been described in language specific to structural features and/or methods, it is to be understood that the appended claims are not limited to the specific features or methods described. Rather, the specific features and methods are disclosed as examples for the cover 104 and the method 500 for forming the cover 104.

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne des exemples d'un couvercle destiné à un dispositif. Dans un exemple, le couvercle comprend une structure de base présentant une première surface et une deuxième surface. La première surface peut faire face à une source de chaleur du dispositif et la deuxième surface peut être opposée à la première surface et peut comprendre une pluralité de parties en saillie. En outre, le couvercle peut comprendre un revêtement de rayonnement thermique sur la deuxième surface de la structure de base pour réaliser la dissipation d'une chaleur provenant de la source de chaleur. De plus, le couvercle peut comprendre un revêtement d'isolation thermique sur une surface d'extrémité de chaque partie de la pluralité de parties en saillie de la deuxième surface. Le revêtement d'isolation thermique se trouve par-dessus le revêtement de rayonnement thermique à la surface d'extrémité de chacune des parties en saillie.
PCT/US2015/028181 2015-04-29 2015-04-29 Couvercle pour dispositifs Ceased WO2016175779A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2015/028181 WO2016175779A1 (fr) 2015-04-29 2015-04-29 Couvercle pour dispositifs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/028181 WO2016175779A1 (fr) 2015-04-29 2015-04-29 Couvercle pour dispositifs

Publications (1)

Publication Number Publication Date
WO2016175779A1 true WO2016175779A1 (fr) 2016-11-03

Family

ID=57198631

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/028181 Ceased WO2016175779A1 (fr) 2015-04-29 2015-04-29 Couvercle pour dispositifs

Country Status (1)

Country Link
WO (1) WO2016175779A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4182412A (en) * 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
JPH1128419A (ja) * 1997-05-16 1999-02-02 Mitsubishi Electric Corp 表面処理部材及び表面処理方法
JPH11204949A (ja) * 1998-01-13 1999-07-30 Fujitsu Ltd 電子機器筐体構造
JP2000148306A (ja) * 1998-11-06 2000-05-26 Matsushita Electric Ind Co Ltd 電子機器筐体構造
US20080149320A1 (en) * 2006-10-19 2008-06-26 Sony Ericsson Mobile Communications Ab Electronic device with dual function outer surface

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4182412A (en) * 1978-01-09 1980-01-08 Uop Inc. Finned heat transfer tube with porous boiling surface and method for producing same
JPH1128419A (ja) * 1997-05-16 1999-02-02 Mitsubishi Electric Corp 表面処理部材及び表面処理方法
JPH11204949A (ja) * 1998-01-13 1999-07-30 Fujitsu Ltd 電子機器筐体構造
JP2000148306A (ja) * 1998-11-06 2000-05-26 Matsushita Electric Ind Co Ltd 電子機器筐体構造
US20080149320A1 (en) * 2006-10-19 2008-06-26 Sony Ericsson Mobile Communications Ab Electronic device with dual function outer surface

Similar Documents

Publication Publication Date Title
TWI346196B (en) Heat spreader with controlled z-axis conductivity
CN103443523B (zh) 二次电池单元
WO2014018491A3 (fr) Systèmes, structures et matériaux pour refroidissement de dispositif électronique
TW201528927A (zh) 新構裝散熱設計
CN103717024A (zh) 用于手持移动终端的后盖和手持移动终端
WO2017197846A1 (fr) Dispositif terminal et structure de dissipation thermique d'un tel dispositif
JP2015142005A (ja) 放熱構造
CN204377305U (zh) 一种散热装置、电路板及终端
US20180040532A1 (en) Heat sink
JP2002134666A5 (fr)
CN106852098A (zh) 超薄导电散热泡棉和制作方法
WO2016175779A1 (fr) Couvercle pour dispositifs
CN207820461U (zh) 高导热、高电磁屏蔽铜网增强石墨复合泡棉
TWM511068U (zh) 展熱裝置
TWI576558B (zh) 散熱結構
JP2013182987A (ja) カバー及び放熱装置
CN203884121U (zh) 散热片
CN104822238A (zh) 一种散热方法
CN106163213A (zh) 高导热盖及其制作方法
CN208462238U (zh) 一种散热辅料、具有该辅料的外壳以及电子装置
TWM542324U (zh) 可攜帶電子裝置之散熱塗層結構
CN105538807A (zh) 保温保暖面料
CN214708436U (zh) 一种可携带电子装置的散热绝缘薄膜
CN204482053U (zh) 发热盘及加热底座
CN201638135U (zh) 笔记本电脑冷却内胆包

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15890914

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15890914

Country of ref document: EP

Kind code of ref document: A1