WO2016193316A1 - Procédé de fabrication de substrats de circuits multicouches à base de fabrication par impression 3d à base de barbotine - Google Patents

Procédé de fabrication de substrats de circuits multicouches à base de fabrication par impression 3d à base de barbotine Download PDF

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Publication number
WO2016193316A1
WO2016193316A1 PCT/EP2016/062401 EP2016062401W WO2016193316A1 WO 2016193316 A1 WO2016193316 A1 WO 2016193316A1 EP 2016062401 W EP2016062401 W EP 2016062401W WO 2016193316 A1 WO2016193316 A1 WO 2016193316A1
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WO
WIPO (PCT)
Prior art keywords
additive manufacturing
layer
ceramic
slurry
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/EP2016/062401
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German (de)
English (en)
Inventor
Jens GÜNSTER
Torsten RABE
Andreas Roosen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bundesanstalt fuer Materialforschung und Pruefung
Friedrich Alexander Universitaet Erlangen Nuernberg
Federal Ministry for Economic Affairs and Energy
Original Assignee
Bundesanstalt fuer Materialforschung und Pruefung
Friedrich Alexander Universitaet Erlangen Nuernberg
Federal Ministry for Economic Affairs and Energy
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Filing date
Publication date
Application filed by Bundesanstalt fuer Materialforschung und Pruefung, Friedrich Alexander Universitaet Erlangen Nuernberg, Federal Ministry for Economic Affairs and Energy filed Critical Bundesanstalt fuer Materialforschung und Pruefung
Publication of WO2016193316A1 publication Critical patent/WO2016193316A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/34—Process control of powder characteristics, e.g. density, oxidation or flowability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/40—Structures for supporting workpieces or articles during manufacture and removed afterwards
    • B22F10/43—Structures for supporting workpieces or articles during manufacture and removed afterwards characterised by material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/50—Treatment of workpieces or articles during build-up, e.g. treatments applied to fused layers during build-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60—Treatment of workpieces or articles after build-up
    • B22F10/64—Treatment of workpieces or articles after build-up by thermal means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/10—Auxiliary heating means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/41—Radiation means characterised by the type, e.g. laser or electron beam
    • B22F12/43—Radiation means characterised by the type, e.g. laser or electron beam pulsed; frequency modulated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5454—Particle size related information expressed by the size of the particles or aggregates thereof nanometer sized, i.e. below 100 nm
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6025—Tape casting, e.g. with a doctor blade
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6026—Computer aided shaping, e.g. rapid prototyping
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/606—Drying
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/608—Green bodies or pre-forms with well-defined density
    • C—CHEMISTRY; METALLURGY
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    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/665—Local sintering, e.g. laser sintering
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74—Physical characteristics
    • C04B2235/77—Density
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the organic components of the films must be burned out and the green sheets are compacted to the actual ceramic.
  • the Laminating step comprises assembling the individual film layers into a stable, functional multi-layer ceramic body.
  • the lamination may be carried out under high and low pressures using, for example, thermo-compression or bonding techniques.
  • an additive manufacturing method for a circuit carrier comprising a ceramic multilayer structure comprises the following steps: a) providing a ceramic slurry; b) forming a slurry layer by doctoring the ceramic slurry onto a substrate; c) drying the slip layer; d) at least partially generating an at least horizontally and / or vertically extending conductor track; e) repeating steps b) to d), wherein the dried slurry layer serves as a base; f) obtaining a green body comprising a multilayer structure; g) thermal treatment of the green body, or of the multi-layer structure comprising component.
  • the layer-wise local local area is the layer-wise local area
  • Predetermined breaking points can be introduced or can be sawed.
  • ceramic slip a proportion between 0 and 10 wt .-%, between 1 and 8 wt .-%, or between 2.5 and 7 wt .-%.
  • a uniform drying and a high operating speed can be achieved by the choice of the drying process and on the other hand be prevented that form drying cracks. It is also advantageous that an acceleration of the drying by the suction effect of the underlying layers takes place by the application of the wet slurry layer on the already deposited layers. Since the drying takes place at the same location as the layer application, no separate aggregate is necessary and thus eliminates a transfer of the components.
  • the generation of the vertically extending conductor track comprises a section-wise removal of the dried slurry layer.
  • a recess is thus produced in the dried slurry layer.
  • This recess can then be filled, for example, with a metallizing paste.
  • electrically conductive structures are produced directly next to insulator structures, so that on the one hand a high integration density and on the other hand a small amount of time can be achieved for the production.
  • the ablation is carried out with a laser, in particular with an excimer laser or with a pulsed laser of a wavelength of 1 ⁇ at sufficiently high intensity.
  • a sufficiently high intensity is one in which the layer material at the site of action of the laser is removed from the layer, e.g. by evaporation and removal with a surrounding atmosphere.
  • generating the vertically extending trace comprises printing a metallization paste on the dried slurry layer.
  • the pressure is done so precisely that a certain height of
  • Printing layer is achieved.
  • the contours of the printed image are sharp.
  • printing advantageously achieves a lateral resolution of more than 400 dpi (dot per inch).
  • a resolution of 720 dpi is achieved.
  • a resolution up to and including 600 dpi is reliably achieved.
  • multiple printing steps may be performed sequentially until the desired height of the printed structure is achieved.
  • the printing may be followed by forming a (further) slurry layer by knife-coating of ceramic slip so that a gap between sections printed with metallization paste is filled up with ceramic slip.
  • Advantages include, for example, a reduced production cost, or a short production duration.
  • a surface of the print image of the printed metallization paste is rendered hydrophobic prior to filling the gap between printed sections or between individual sections thereof.
  • a contaminated during the formation of the slurry layer surface of a previously printed layer or a vertically extending trace is released before a subsequent process step.
  • the described cropping takes place with the aid of a laser beam.
  • Advantages include the speed of an already achievable within a fraction of a second by means of laser surface cleaning.
  • the production of the horizontally extending and / or the vertically extending conductor track takes place by means of a printing method or another additive technique.
  • a printing method or another additive technique for example, the described production by means of inkjet printing, screen printing, stencil printing or robocasting (direct ink writing).
  • the conductor track is preferably applied to a previously dried slurry layer. This application can be made once or several times repeatedly on one and the same section of the slip.
  • different printing methods can be combined with each other. For example, a first printing process may be followed by a second printing process. Two or more printing methods or additive techniques may also be used alternately. In this case, in each case differently composed liquids, dispersions, e.g. Inks, or pastes are applied.
  • this makes it possible to apply the design rules applicable or established for the LTCC technology and opens up the possibility of determining the composition of the functional structure produced by sintering with regard to a desired one
  • generating the horizontally or vertically extending trace comprises adjusting a theological property of a Print media.
  • printing media are, for example, solutions, particle dispersions, printing inks, printing pastes, screen printing paste.
  • the described generating may include adjusting a wetting property of the print medium.
  • the printing ink or paste comprises metallic particles or metallized particles, so that the
  • the rheological behavior of the respective paste results from interactions between the solvent used and the additives used. In particular, determine the amount
  • the metallic or metallized particles in the dried slurry layer can reach a defined penetration depth that exceeds the thickness of a layer.
  • generating the horizontally or vertically extending trace comprises selecting a size of metallic particles in the printing ink and / or in the screen printing paste and / or in the printing medium, such that controlling penetration of the metallic particles into the dried slurry layer is possible.
  • the contour of a conductor track can thus be precisely controlled. This also results in the possibility of the electrical conductivity of the conductor to
  • the controlling comprises preventing the penetration of the metallic particles, a partial penetration of a dried one Slip layer with the metallic particles or a complete penetration of a dried slurry layer with the metallic particles, so that setting the properties of the ink or a paste delimiting an electrically conductive layer against an electrically non-conductive slurry layer and / or a vertical
  • the production of the horizontally or vertically running conductor track comprises generating a sacrificial layer.
  • Sacrificial layer can be done by applying a sacrificial paste.
  • the sacrificial paste leaves a cavity after burnout and / or sintering.
  • Such cavities may for example be part of a cooling system and serve for heat dissipation. Likewise, for applications in the
  • the sacrificial paste may comprise an organic binder and / or elemental carbon.
  • the sacrificial paste may include graphite, starch, and / or carbon black which burn out during a thermal treatment under an oxidizing atmosphere to sinter the component.
  • Sacrificial materials are sufficiently cost-effective, can be easily processed and adjusted to a consistency comparable to that of the Keramikschiicker, so that a speedy process is guaranteed.
  • the cavity obtained is filled with a temporarily liquid phase or a temporarily liquid mixture.
  • the liquid may e.g. a polymerizable mixture, a molten metal, a
  • Polymer melt a molten glass, a particle dispersion, a particle paste or a solution which leaves a solid residue on drying - preferably in the form of a solid film.
  • the liquid is a molten metal.
  • the filling can take place in a controlled atmosphere (for example, with the exclusion of oxygen) or under reduced pressure.
  • the formation of a slip layer in particular the production of a second slip layer on a preceding first slip layer is carried out with a 90 ° rotated working direction of a doctor blade.
  • Integration density for example for the microsystem technology (MEMS) or the
  • Microelectronics by using certain properties of the green or sintered substrate.
  • the glass-ceramic of the base body may have a substantially different layer-wise material property, e.g.
  • a minimum distance between the squeegee and backing is predominantly filled by ceramic foams.
  • doctor blade in the production process of the circuit substrate is typically supplemented by the use of a print head and / or a laser, without the need to move the trained using the squeegee Schlickerbett or is converted into another unit.
  • a print head With the aid of the print head, as described above, locally limited electrically conductive sections (printed conductors) and / or layers (at least in sections) are applied. These sections differ in terms of a
  • the described embodiments can be combined with each other as desired.
  • the representation of ceramic bodies by laminating ceramic films is also used in the additive production of complex shaped ceramic bodies.
  • the additive manufacturing processes used here work in layers.
  • a prototype is designed in the computer, virtually decomposed into layers and then built up successively according to established control algorithms, for example in the powder bed or by means of laminated layers.
  • LOM Laminated Object Manufacturing
  • the present invention describes a process in which powder layers of a defined thickness are applied successively as a suspension and dried.
  • the packing density of the ceramic particles in such a layer is similar to that in a conventionally produced ceramic green sheet for constructing LTCC structures, but the proportion of organic additives is less than 10% by volume. After applying a layer, it is dried and without the need for films
  • multi-layer wiring s and possibly passive electronic components can be constructed.
  • Any powdery materials dielectrics, ferroelectrics, Ferrimagnetics, conductors, resistors, etc.
  • any desired pastes can be applied from a print head in the structure desired in each case.
  • any necessary Binderausbrand the entire composite layer is finally compacted by co-sintering.
  • Powder layers by means of a ceramic slurry can be extended such that, as an alternative to the established multilayer technology, complex three-dimensional structures can be produced.
  • a compact powder layer is understood as meaning a layer comprising a powder whose
  • Packing density is above 60% of the theoretical density of the powder forming material.
  • the proposed method allows the combined construction of complex 3D structures and integrated circuits or functional structures, wherein the presentation of ceramic films as semifinished product can be dispensed with. This allows a significant reduction in the proportion of organic additives used.
  • layers can be applied, printed, through-contacted and stacked in a single production facility. For conventional multilayer production several separate systems are required, u. a. a Folieng discernstrom, a punch, a screen printer, a via-filler and a laminating press.
  • the method described here thus offers full geometric freedom from lot size 1 and high flexibility in the individualization of components with simultaneous three-dimensional cross-linking of the interconnect levels.
  • Initial state of the materials (solid, liquid, gaseous) during the layer addition or the building process.
  • a solid powdery material as the starting material, wherein when using free-flowing powder (which are mostly used in granulated form) for the layer coating layers with only low packing density of the powder particles can be achieved.
  • the packing density is typically between 30 and 50% of the theoretical density (TD).
  • a disadvantage of this method is the representation of the powder layers by applying a dry free-flowing powder.
  • the packing density of the powder particles in the individual powder layers and in the powder bed typically only reaches between 30 and 45% of the theoretical density. Because of this low density, although an ink of metallic particles can be used to construct 3D structured tracks, this ink penetrates into the powder at a depth exceeding the thickness of the deposited powder layers, thus rendering whole volume areas of the powder conductive.
  • the resulting tracks consist of a network of fine conductive structures that span the ceramic powder particles rather than a compact layer of conductive particles.
  • the conductive structures can be structured only inaccurate.
  • their conductivity is not comparable to that of screen printed circuit traces of an LTCC structure. It follows that the high integration density of electronic components, as e.g. typical for LTCC circuits is not achievable with this method. This is a serious disadvantage, in particular for power electronic components.
  • the disadvantages of previous methods are mainly due to the fact that other methods used for the display of multilayer ceramic, for example according to the LTCC technology, are based on the use of a ceramic film as semifinished product.
  • the ceramic foil For example, powder particles of the glass-ceramic or glassy and ceramic particles used for LTCC production are connected to one another via a high proportion of organic binder in such a way that a flexible, handleable film is produced.
  • the binder content also has the task of making the film laminatable by means of thermocompression.
  • the organic content of the film is typically more than 25 to 40% by volume.
  • Laminating, etc. results in a laminate that is up to several millimeters thick and up to several 100 cm 2 in size, which is first freed from the organic fraction in a time-consuming debinding process and finally sintered.
  • Green density of the layers can be achieved.
  • Preferred layers can be sintered to ceramic bodies having a density greater than 95% of the theoretical density.
  • the proposed method makes it possible, as required, to work both without and with binders.
  • the binder content can be varied or optimized within wide limits. This flexibility with regard to binder content stems, in particular, from the fact that in
  • Mass production of LTCC components advantageous screen printing technology for applying conductive pastes applicable. Due to the high viscosity of screen-printing pastes on the one hand and the high packing density of the slurry-applied powder layers on the other hand, the conductive paste typically does not penetrate the green sheets. This is due to the fact that the particles contained in the paste can not penetrate into the porous structure of the green layer due to their size. In addition to such mechanical control of the penetration depth, the penetration can also or additionally via the wetting, for example, hydrophobic or hydrophilic properties of the layer or a locally applied by means of printing technology conditioning agent can be controlled.
  • a penetration of a last-applied layer is for a
  • VIAs Very Interconnect Access
  • Particle size are controlled, possibly also on hydrophobic / hydrophilic properties.
  • particle-filled pastes are used whose properties prevent absorption.
  • RPT Rapid Prototyping
  • connection surface can be exposed by means of material removal by laser radiation.
  • Binder gradients are formed in the layer, which in turn leads to less damage and distortion during binder burn-out and sintering.
  • drying therefore does not take place solely by evaporation on the surface of the respective layer.
  • water-based layers it is possible to use pastes and / or inks based on organic solvents for the adjustment of a hydrophobic behavior. Otherwise, the screen printing of inks is possible.
  • This is a further advantage of the method, since when printing from a nozzle, the requirement for a long processability of the paste on the screen is eliminated, which precludes the use of water as a solvent in screen printing.
  • the films are stacked and laminated alternately rotated by 90 ° in the multi-layer technique. For the same reason, therefore, the layers are alternately wound up rotated by 90 °. This is most easily accomplished by incrementally rotating the RPT table.
  • the additive manufacturing method described here allows the combined construction of complex 3D structures and integrated circuits or functional structures in a plant without having to produce ceramic green sheets as a semi-finished product.
  • Advantages achievable with the additive manufacturing method include, for example: simultaneous construction of 3D structures and inner 3D networked functional structures; no production of green films; no lamination via thermocompression; little or no amount of binder;
  • Circuits such as LTCC structures to use, the process is particularly cost-effective.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un procédé de fabrication par impression 3D d'un substrat de circuit en céramique de structure multicouche, comprenant les étapes consistant à : a) prendre une barbotine céramique ; b) former une couche de barbotine par étalement de la barbotine céramique sur une couche de base ; c) sécher la couche de barbotine : d) produire au moins dans certaines zones au moins une piste conductrice s'étendant au moins horizontalement et/ou verticalement ; e) répéter les étapes b) à d), la couche de barbotine séchée servant de couche de base ; f) obtenir un corps cru de structure multicouche ; g) soumettre le corps cru à un traitement thermique.
PCT/EP2016/062401 2015-06-01 2016-06-01 Procédé de fabrication de substrats de circuits multicouches à base de fabrication par impression 3d à base de barbotine Ceased WO2016193316A1 (fr)

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DE102015108646.8A DE102015108646A1 (de) 2015-06-01 2015-06-01 Verfahren zur Herstellung keramischer Multilagen-Schaltungsträger auf Basis einer schlickerbasierten additiven Fertigung

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EP3057777A4 (fr) * 2013-10-17 2017-06-14 Xjet Ltd. Procédés et systèmes d'impression tridimensionnelle d'objets par jet d'encre
DE102019132263A1 (de) * 2019-11-26 2021-05-27 Friedrich-Alexander-Universität Erlangen-Nürnberg Bandspannrolle für einen Zugmitteltrieb sowie Verfahren zur Herstellung einer Bandspannrolle
DE102024115204A1 (de) * 2024-03-07 2025-09-11 Tdk Electronics Ag Additives Fertigungsverfahren, Verfahren zur Konzeption eines Bauteils und Bauteil
DE202024103283U1 (de) * 2024-06-18 2025-09-25 Exentis Knowledge Gmbh Druckpaste

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