WO2016199633A1 - Module de bobine et son procédé de fabrication - Google Patents

Module de bobine et son procédé de fabrication Download PDF

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Publication number
WO2016199633A1
WO2016199633A1 PCT/JP2016/066150 JP2016066150W WO2016199633A1 WO 2016199633 A1 WO2016199633 A1 WO 2016199633A1 JP 2016066150 W JP2016066150 W JP 2016066150W WO 2016199633 A1 WO2016199633 A1 WO 2016199633A1
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WO
WIPO (PCT)
Prior art keywords
mass
resin
coil
less
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2016/066150
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English (en)
Japanese (ja)
Inventor
佳宏 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
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Filing date
Publication date
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Publication of WO2016199633A1 publication Critical patent/WO2016199633A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
    • H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
    • H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/08—Cooling; Ventilating
    • H01F27/22—Cooling by heat conduction through solid or powdered fillings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14—Inductive couplings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling

Definitions

  • NFC Near Field Communication, near field communication
  • NFC uses a frequency band in a higher frequency region than the position indicator.
  • wireless power transmission contactless power transmission
  • the coil modules used for these wireless communication and wireless power transmission are designed so that the maximum characteristics can be obtained at a resonance frequency of 13.56 MHz or 6.78 MHz.
  • FIG. 1 shows a cross-sectional view of one embodiment of a coil module of the present invention.
  • 2A-G are process diagrams for manufacturing the coil module of FIG. 1.
  • FIG. 2A is a process for preparing a semi-cured magnetic layer
  • FIG. 2B is a process for stacking a plurality of semi-cured magnetic layers
  • FIG. 2D is a step of providing a semi-cured adhesive layer on the magnetic layer
  • FIG. 2E is a step of arranging the semi-cured adhesive layer laminate and the coil substrate
  • FIG. 2F is a semi-cured adhesive layer.
  • FIG. 2G shows the step of obtaining the coil module.
  • the coil module 1 of the present invention includes a coil substrate 2, an adhesive layer 3, and a magnetic layer 4 in order in the thickness direction, as shown in FIG.
  • the coil module 1 preferably includes a coil substrate 2, an adhesive layer 3, and a magnetic layer 4.
  • the coil module 1 is a component such as a coil module for power reception used for wireless communication or wireless power transmission for wirelessly transmitting signals and power between power transmission / reception modules. Device.
  • the coil pattern 6 is provided on the upper side (one side in the thickness direction) of the base substrate 5. Specifically, the coil pattern 6 is disposed on the upper surface of the base substrate 5 so that the lower surface of the coil pattern 6 is in contact with the upper surface of the base substrate 5.
  • Examples of the material constituting the wiring 7 include metals such as copper, nickel, tin, aluminum, iron, chromium, titanium, gold, silver, platinum, niobium, and alloys containing them, such as polyaniline, polypyrrole, and polythiophene. , Conductive polymers such as polyacetylene, polyparaphenylene, polyphenylene vinylene, polyacrylonitrile, and polyoxadiazole. These materials can be used alone or in combination of two or more.
  • a metal More preferably, copper, silver, More preferably, copper is mentioned.
  • the width of the eaves wiring 7 is, for example, 10 ⁇ m or more, preferably 20 ⁇ m or more, and for example, 2000 ⁇ m or less, preferably 1800 ⁇ m or less.
  • the adhesive layer 3 is provided on the upper side of the coil substrate 2. Specifically, the adhesive layer 3 is disposed on the upper surface of the base substrate 5 so as to cover the upper surface and side surfaces of the coil pattern 6.
  • nitride examples include boron nitride, silicon nitride, aluminum nitride, gallium nitride, chromium nitride, tungsten nitride, magnesium nitride, molybdenum nitride, and lithium nitride.
  • boron nitride is used.
  • Examples of the metal include copper, gold, nickel, tin, iron, and alloys thereof.
  • Examples of the carbon-based material include carbon black, graphite, diamond, fullerene, carbon nanotube, carbon nanofiber, nanohorn, carbon microcoil, and nanocoil.
  • Examples of the shape of the heat conductive particles include a bulk shape, a flat shape, and a needle shape.
  • the bulk shape includes, for example, a spherical shape, a rectangular parallelepiped shape, a crushed shape, a round shape, an aggregate, or a deformed shape thereof.
  • the mass ratio of the heat conductive particles in the adhesive composition is, for example, 30% by mass or more, preferably 40% by mass or more, more preferably more than 50% by mass in terms of solid content, and for example, 90% by mass. % Or less, preferably 80% by mass or less, and more preferably 65% by mass or less.
  • the volume ratio of the heat conductive particles in the adhesive composition is, for example, 10% by volume or more, preferably 20% by volume or more, more preferably more than 30% by volume in terms of solid content. It is 70 volume% or less, Preferably, it is 60 volume% or less, More preferably, it is 50 volume% or less.
  • Preferable examples include phenol biphenylene resins, and specifically include compounds represented by the following structural formula (3).
  • n shows the polymerization degree of a monomer each independently.
  • an acrylic resin for example, an acrylic polymer obtained by polymerizing one or two or more (meth) acrylic acid alkyl esters having a linear or branched alkyl group as a monomer component, and the like are polymerized.
  • (meth) acryl means “acryl and / or methacryl”.
  • the content of the adhesive resin in the adhesive composition is, for example, 10% by mass or more, preferably 20% by mass or more, more preferably 35% by mass or more, and, for example, 70% by mass or less in terms of solid content. , Preferably, it is 60 mass% or less, More preferably, it is less than 50 mass%.
  • the content ratio of the adhesive resin with respect to 100 parts by mass of the heat conductive particles is, for example, 10 parts by mass or more, preferably 30 parts by mass or more, more preferably 60 parts by mass or more, and for example, 200 parts by mass. Hereinafter, it is preferably 150 parts by mass or less, more preferably less than 100 parts by mass.
  • imidazole compounds examples include 2-phenylimidazole (trade name; 2PZ), 2-ethyl-4-methylimidazole (trade name; 2E4MZ), 2-methylimidazole (trade name; 2MZ), and 2-undecylimidazole.
  • (Trade name; C11Z) 2-phenyl-1H-imidazole 4,5-dimethanol (trade name; 2PHZ-PW), 2,4-diamino-6- (2′-methylimidazolyl (1) ′) ethyl-
  • Examples include s-triazine / isocyanuric acid adduct (trade name: 2MAOK-PW) (all trade names are manufactured by Shikoku Kasei Co., Ltd.).
  • Examples of such an epoxy resin include the polyfunctional epoxy resins exemplified for the adhesive resin, and preferably a cresol novolac type epoxy resin.
  • thermosetting catalyst the thermosetting catalyst exemplified in the adhesive composition can be exemplified.
  • an imidazole compound is used.
  • the method for manufacturing the coil module 1 includes, for example, a magnetic layer preparation step for preparing the magnetic layer 4, a laminate formation step for obtaining the semi-cured adhesive layer laminate 8 by providing the magnetic layer 4 with the semi-cured adhesive layer 3a, and And a hot pressing step of hot pressing the semi-cured adhesive layer laminate 8 on the coil substrate 2.
  • a magnetic layer preparation step for preparing the magnetic layer 4 for preparing the magnetic layer 4
  • a laminate formation step for obtaining the semi-cured adhesive layer laminate 8 by providing the magnetic layer 4 with the semi-cured adhesive layer 3a and And a hot pressing step of hot pressing the semi-cured adhesive layer laminate 8 on the coil substrate 2.
  • Magnetic layer preparation process In the magnetic layer preparation step, the magnetic layer 4 is prepared.
  • Examples of the coating method include doctor blade coating, roll coating, screen coating, and gravure coating.
  • the average thickness of the semi-cured magnetic layer 4a is, for example, 5 ⁇ m or more, preferably 10 ⁇ m or more, and for example, 500 ⁇ m or less, preferably 250 ⁇ m or less.
  • the pressure is, for example, 1 MPa or more, preferably 3 MPa or more, and for example, 200 MPa or less, preferably 100 MPa or less.
  • thermosetting adhesive composition is dissolved or dispersed in a solvent. Thereby, a thermosetting adhesive composition solution is prepared.
  • Examples of the coating method and the peeling substrate include the coating method and the peeling substrate exemplified in the magnetic layer preparation step.
  • the pressure is, for example, 0.01 MPa or more, preferably 0.1 MPa or more, and for example, 50 MPa or less, preferably 10 MPa or less, more preferably 3 MPa or less.
  • the magnetic layer 4 contains soft magnetic particles 10 and a resin. For this reason, the magnetic flux generated at the time of communication or power transmission can be converged by the magnetic layer 4, and deterioration of communication characteristics due to interference of metal members (such as a metal housing and a battery) around the coil pattern 6 can be suppressed. Moreover, since the magnetic layer 4 contains resin, it has flexibility and is excellent in handling property. Since a sheet made of only a metal component such as a ferrite sheet is brittle, a protective support layer is necessary. However, since the magnetic layer 4 has flexibility, the coil module 1 does not require a protective support layer, and the coil module 1 is thin. Can be realized.
  • thermo diffusion coefficient (thermal diffusion coefficient) x (specific heat) x (specific gravity)
  • thermal diffusion coefficient was measured using a xenon flash method calorimeter (manufactured by Netch Japan Co., Ltd., LFA447 nanoflash).
  • specific heat was determined by a measuring method based on the standard of JIS-7123 using DSC (TA instrument, Q-2000).
  • the specific gravity was measured using an electronic hydrometer (manufactured by Alpha Mirage, “MDS-300”).
  • a coil substrate on which a magnetic layer and an adhesive layer were not laminated was prepared as a sample, and the sample was energized in the same manner to measure the amount of heat generated.
  • the communication characteristics of the coil modules of each example and each comparative example were evaluated as follows. That is, similarly to the heat dissipation evaluation, the coil patterns of the coil modules of the examples and the comparative examples were energized, and the change in inductance accompanying the temperature change was observed.
  • each component in the table indicates the solid content. Moreover, unless otherwise indicated, the numerical value in each component in a table
  • surface shows a mass part. Details of each component in the examples and tables are described below.
  • ⁇ Fe—Si—Al alloy, soft magnetic particles, flat, Sanyo Special Steel ⁇ Aluminum oxide: Al 2 O 3 , thermally conductive particles, spherical, average particle size 3 ⁇ m, manufactured by Admatechs ⁇ Boron nitride: BN, thermally conductive particles, flat shape, average particle size 46 ⁇ m, manufactured by Denki Kagaku Kogyo Co., Ltd., fused silica: spherical, average particle size 5 ⁇ m, manufactured by Denki Kagaku Kogyo Co., Ltd., cresol novolac epoxy resin: of the above structural formula (1) Epoxy resin, epoxy equivalent 199 g / eq.
  • ICI viscosity (150 ° C.) 0.4 Pa ⁇ s trade name “KI-3000-4”, manufactured by Tohto Kasei Co., Ltd., bisphenol A type epoxy resin: epoxy resin of the above structural formula (2), epoxy equivalent 180 g / eq.
  • ICI viscosity (150 ° C.) 0.05 Pa ⁇ s trade name “Epicoat YL980”, manufactured by Mitsubishi Chemical Co., Ltd., phenol biphenylene resin: phenol resin of the above structural formula (3), hydroxyl group equivalent 203 g / eq.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Soft Magnetic Materials (AREA)
  • Transformer Cooling (AREA)

Abstract

L'invention concerne un module de bobine qui est un module de bobine pour communication sans fil ou transmission d'énergie sans fil utilisant une bande de fréquence de 13,56 MHz ou 6,78 MHz. Le module de bobine est pourvu : d'un substrat à bobine qui comprend un substrat et un motif de bobine qui est disposé d'un côté du substrat dans la direction de l'épaisseur ; d'une couche adhésive qui est disposée d'un côté du substrat à bobine dans la direction de l'épaisseur et est formée à partir d'une composition adhésive qui contient des particules thermoconductrices et une résine adhésive ; et d'une couche magnétique qui est disposée sur un côté de la couche adhésive dans la direction de l'épaisseur et est formée à partir d'une composition magnétique qui contient des particules faiblement magnétiques et une résine.
PCT/JP2016/066150 2015-06-10 2016-06-01 Module de bobine et son procédé de fabrication Ceased WO2016199633A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015117746A JP2017005113A (ja) 2015-06-10 2015-06-10 コイルモジュールおよびその製造方法
JP2015-117746 2015-06-10

Publications (1)

Publication Number Publication Date
WO2016199633A1 true WO2016199633A1 (fr) 2016-12-15

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PCT/JP2016/066150 Ceased WO2016199633A1 (fr) 2015-06-10 2016-06-01 Module de bobine et son procédé de fabrication

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JP (1) JP2017005113A (fr)
TW (1) TW201712704A (fr)
WO (1) WO2016199633A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102755493B1 (ko) * 2019-11-20 2025-01-17 에스케이씨 주식회사 무선충전 패드, 무선충전 장치, 및 이를 포함하는 전기 자동차
JP7713772B2 (ja) * 2020-08-18 2025-07-28 Tdk株式会社 コイル部品及びこれを用いた無線通信回路

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006059771A1 (fr) * 2004-12-03 2006-06-08 Nitta Corporation Inhibiteur d’ interférence électromagnetique, dispositif d’antenne et appareil de communication électronique
JP2007012689A (ja) * 2005-06-28 2007-01-18 Tdk Corp Ｒｆｉｄ用複合磁性体及びｒｆｉｄ用アンテナ装置
JP2011154435A (ja) * 2010-01-26 2011-08-11 Sony Corp 情報処理装置、情報処理方法および情報処理システム
JP2013251608A (ja) * 2012-05-30 2013-12-12 Sumitomo Electric Printed Circuit Inc アンテナ装置及び該アンテナ装置の製造方法
WO2014156254A1 (fr) * 2013-03-28 2014-10-02 日東電工株式会社 Film adhésif thermodurcissable à aimantation temporaire, substrat de circuit stratifié à film magnétique, et dispositif de détection de position
JP2014200122A (ja) * 2013-03-29 2014-10-23 キヤノン株式会社 給電装置
JP2015505448A (ja) * 2011-11-15 2015-02-19 クアルコム，インコーポレイテッド 閉磁気ループによる誘導充電のためのシステムおよび方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006059771A1 (fr) * 2004-12-03 2006-06-08 Nitta Corporation Inhibiteur d’ interférence électromagnetique, dispositif d’antenne et appareil de communication électronique
JP2007012689A (ja) * 2005-06-28 2007-01-18 Tdk Corp Ｒｆｉｄ用複合磁性体及びｒｆｉｄ用アンテナ装置
JP2011154435A (ja) * 2010-01-26 2011-08-11 Sony Corp 情報処理装置、情報処理方法および情報処理システム
JP2015505448A (ja) * 2011-11-15 2015-02-19 クアルコム，インコーポレイテッド 閉磁気ループによる誘導充電のためのシステムおよび方法
JP2013251608A (ja) * 2012-05-30 2013-12-12 Sumitomo Electric Printed Circuit Inc アンテナ装置及び該アンテナ装置の製造方法
WO2014156254A1 (fr) * 2013-03-28 2014-10-02 日東電工株式会社 Film adhésif thermodurcissable à aimantation temporaire, substrat de circuit stratifié à film magnétique, et dispositif de détection de position
JP2014200122A (ja) * 2013-03-29 2014-10-23 キヤノン株式会社 給電装置

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Publication number Publication date
JP2017005113A (ja) 2017-01-05
TW201712704A (zh) 2017-04-01

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