WO2016202021A1 - Réseau de microélectrode neurale flexible - Google Patents

Réseau de microélectrode neurale flexible Download PDF

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Publication number
WO2016202021A1
WO2016202021A1 PCT/CN2016/076183 CN2016076183W WO2016202021A1 WO 2016202021 A1 WO2016202021 A1 WO 2016202021A1 CN 2016076183 W CN2016076183 W CN 2016076183W WO 2016202021 A1 WO2016202021 A1 WO 2016202021A1
Authority
WO
WIPO (PCT)
Prior art keywords
microelectrode
flexible substrate
insulating layer
flexible
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2016/076183
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English (en)
Chinese (zh)
Inventor
张贯京
陈兴明
葛新科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Huake Anycheck Information Technologies Ltd
Original Assignee
Shenzhen Huake Anycheck Information Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Huake Anycheck Information Technologies Ltd filed Critical Shenzhen Huake Anycheck Information Technologies Ltd
Publication of WO2016202021A1 publication Critical patent/WO2016202021A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes

Definitions

  • the utility model relates to the field of biomedical equipment, in particular to a flexible neural microelectrode array.
  • the presence of the insulating layer causes the metal electrode portion to be depressed. In the state, the electrode is difficult to form a good contact with the position to be measured as the size is reduced; 2. As the electrode size decreases, the surface impedance of the electrode increases, and the neuroelectrophysiological signal is generally weak, and the electrode surface An increase in impedance affects the measurement of the signal.
  • the main purpose of the utility model is to provide a flexible neural microelectrode array capable of reducing contact impedance, which can effectively improve the contact area between the flexible neural microelectrode and the part to be tested, and reduce the contact impedance between the flexible neural microelectrode and the part to be tested.
  • the utility model can also reduce the mechanical strength of the microelectrode site, and ensure that no damage is caused to the site to be tested while being in good contact with the site to be tested.
  • the present invention provides a flexible neural microelectrode array comprising a flexible substrate, an insulating layer, a microelectrode unit, a wire and a lead solder joint, wherein the microelectrode unit, the wire and the lead solder joint are disposed in the On the flexible substrate, the microelectrode unit and the lead solder joint are connected by the wire, the insulating layer covers the flexible substrate, and the microelectrode unit is exposed In the insulating layer, the flexible substrate is provided with a plurality of hollow protrusions exposed on the insulating layer, and an adhesive layer is disposed on the hollow protrusions of the insulating layer. An electrode unit is disposed on the adhesive layer.
  • the insulating layer is provided with an opening at a position of the wire bonding point, and the wire bonding point is exposed through an opening of the insulating layer.
  • an adhesive layer is disposed on the hollow protrusion of the insulating layer, and the microelectrode unit is disposed on the adhesive layer.
  • the material of the adhesion layer comprises titanium, chromium, or an alloy containing one or two of the two elements, and the microelectrode unit is made of gold.
  • the material of the flexible substrate comprises polydimethylsiloxane
  • the material of the insulating layer comprises a photolithographic polydimethylsiloxane
  • the insulating layer is composed of a plurality of sheet-shaped insulating materials.
  • the utility model provides a flexible neural microelectrode array, which comprises a flexible substrate, an insulating layer, a microelectrode unit, a wire and a lead solder joint, the microelectrode unit, the wire and the lead solder joint are all disposed on the flexible substrate, and the micro electrode unit And the wire solder joint is connected by a wire, the insulating layer covers the flexible substrate, and the micro electrode unit is exposed to the insulating layer.
  • the flexible substrate of the present invention is provided with a plurality of hollow protrusions exposed on the insulating layer, and the microelectrode The unit is disposed on the adhesive layer on the hollow protrusion of the flexible substrate.
  • the micro-electrode unit is disposed on the hollow protrusion on the flexible substrate in the present invention, compared to the plane.
  • Flexible substrate microelectrode, the microelectrode on the protrusion increases the surface area of the electrical stimulation site, can effectively reduce the contact resistance, and since the protrusion on the flexible substrate in the present invention is hollow, it can reduce micro The overall strength of the electrode site makes it difficult to damage the measured position during use;
  • the utility model is formed by using a plate-shaped microelectrode with a plurality of protrusions to form a template, and a flexible base layer is spin-coated on the microelectrode fabrication template, and then the wire and the lead solder joint are laid on the flexible base layer, and the flexibility is
  • the microelectrode unit is deposited on the convex portion of the base layer, and the insulating layer is laid on the flexible base layer, and the micro electrode unit on the convex portion and the convex portion of the flexible base layer is exposed to the insulating layer, and the manufacturing process is simple and quick. And the cost is low.
  • FIG. 1 is a schematic perspective view of a flexible neural microelectrode array in the present invention
  • FIG. 2 is a side cross-sectional view showing a flexible neural microelectrode array of the present invention
  • FIG. 3 is a schematic side view showing the structure of a template prepared by using a microelectrode used in a method for preparing a flexible neural microelectrode array according to the present invention.
  • FIG. 1 is a schematic perspective view of a flexible neural microelectrode array according to the present invention
  • FIG. 2 is a schematic diagram of FIG.
  • a side structural view of a flexible neural microelectrode array in the present invention a flexible neural microelectrode array comprising a flexible substrate 1, an insulating layer 2, a microelectrode unit 3, a wire 4 and a wire bonding point 5, said micro
  • the electrode unit 3, the wire 4 and the wire bonding point 5 are disposed on the flexible substrate 1, and the microelectrode unit 3 and the wire bonding point 5 are connected by the wire 4, the insulation
  • the layer 2 is covered on the flexible substrate 1 , and the microelectrode unit 3 is exposed on the insulating layer 2 , and the flexible substrate 1 is provided with a plurality of hollow protrusions exposed on the insulating layer 2 .
  • an adhesive layer 6 is disposed on the hollow protrusion 7
  • the micro electrode unit 3 is disposed on the adhesion layer 6 of the hollow protrusion 7 of the flexible substrate, and the micro electrode unit 3 and the adhesion layer 6 Easier to combine, improve the stability of the microelectrode unit 3, so that the microelectrode Unit 3 is more secure.
  • a flexible neural microelectrode array adopts a flexible substrate 1 having a hollow convex structure, and the microelectrode unit 3 is deposited on the adhesive layer 6 on the hollow protrusion 7 on the flexible substrate 1, the wire 4 and the wire bonding point 5 is arranged in a similar manner to the conventional microelectrode array, and the microelectrode unit 3 and the wire bonding pad 5 can be connected by the wire 4 according to the corresponding arrangement of different kinds of microelectrode arrays, and the insulating layer 2 is covered.
  • the micro in the present invention is capable of forming a larger contact area with the portion to be tested, that is, the microelectrode unit 3 on the convex structure of the flexible substrate 1 can increase the surface area of the electrode stimulation site, lower the contact resistance, and on the flexible substrate 1
  • the hollow convex structure can also reduce the strength of the electrode position of the microelectrode unit 3 without causing any damage to the measured position.
  • the insulating layer 2 is provided with openings at the positions of the microelectrode unit 3 and the wire bonding pads 5, and the wire bonding pads 5 are exposed through the opening of the insulating layer 2.
  • the insulating layer 2 can also use a plurality of insulating layers of a single sheet structure. At this time, after the flexible substrate 1 is fabricated and the microelectrode unit 3, the wires, and the wire bonding pads 5 are laid on the flexible substrate 1, only A plurality of individual sheet-like insulating layers 2 are covered on the flexible substrate 1 to cover the wires 4, and the microelectrode unit 3 and the lead pads 5 are exposed.
  • the material of the adhesive layer 6 comprises titanium, chromium, or an alloy containing one or two of the two elements, and the microelectrode unit 3 is made of gold. .
  • the material of the flexible substrate 1 comprises polydimethylsiloxane
  • the material of the insulating layer comprises a photolithographic polydimethylsiloxane
  • the shape of the protrusion on the flexible substrate 1 is not limited to the hollow hemisphere given in the drawing, and may also be a hollow conical shape, a hollow pyramid, a quadrangular pyramid, a polygonal pyramid or the like.
  • the effect is similar to the hollow hemispherical protrusions in the present invention, and belongs to the same replacement of the present invention, and will not be enumerated here.
  • the template is first fabricated using the microelectrode shown in FIG. 3, and the flexible substrate is spin-coated on the microelectrode fabrication template. Since the microelectrode is formed with a plurality of protrusions on the template, the plurality of protrusions and the The hollow convex shape of the prepared flexible neural microelectrode array is matched, so after the spin-coated flexible substrate, the flexible substrate forms a plurality of hollow convex structures, and then the microelectrode unit is deposited on the hollow convex structure, and a wire and a lead solder joint are laid on the flexible substrate, and the microelectrode unit and the lead solder joint are connected by the wire, and then an insulating layer is laid on the flexible substrate, and the insulating layer is on the microelectrode unit and the lead solder joint Positioning, the microelectrode unit and the lead solder joint are exposed through the insulating layer, and after the flexible substrate and the insulating layer are solid
  • a layer of polydimethylsiloxane can be spin-coated on the microelectrode fabrication template as a flexible substrate, and a metal template having the same shape as the microelectrode can be used, and the metal template is applied to the micro template.
  • a layer of titanium or chromium is deposited as an adhesion layer on the raised portion, after which a layer of gold is deposited on the adhesion layer as a microelectrode unit, wires and lead pads are laid on the flexible substrate layer, and the microelectrode unit and wire bonding are connected by wires.
  • Micro-electrode unit, the wire and the bond pad is connected by a wire after the unit between microelectrodes and a lead solder metal template is removed, it can be more easily produced microelectrode array.
  • the optional material of the adhesive layer in the present invention includes titanium, chromium, or an alloy containing one or two of the two elements, which can be controlled by magnetron sputtering. Titanium or chromium or an alloy comprising one or both of these two elements is deposited on the raised portion of the flexible substrate, the microelectrode unit is made of gold, and the flexible substrate may be made of materials including but not Limited to polydimethylsiloxane, the insulating layer may be selected from materials including, but not limited to, photolithographic polydimethylsiloxane.

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Electrotherapy Devices (AREA)

Abstract

L'invention concerne un réseau de microélectrode neurale souple, qui comprend un substrat flexible (1), une couche d'isolation (2), une unité de microélectrode (3), des fils conducteurs (4) et des joints par soudure en plomb (5). Les unités de microélectrode (3), les fils conducteurs (4) et les joints par soudure en plomb (5) sont agencés sur le substrat flexible (1). Les unités de microélectrode (3) et les joints par soudure en plomb (5) sont connectés par les fils conducteurs (4). La couche d'isolation (2) recouvre le substrat flexible (1). L'unité de microélectrode pénètre la couche d'isolation (2)et est exposée (3) à partir de cette dernière. Le substrat flexible (1) est pourvu d'une pluralité de protubérances creuses (7) qui pénètrent la couche d'isolation (2) et sont exposées à partir de cette dernière. Les unités de microélectrode (3) sont agencées sur les protubérances creuses (7) du substrat flexible (1). Une couche d'adhésion (6) est agencée sur les protubérances creuses (7) sur la couche d'isolation (2). Les unités de microélectrode (3) sont agencées sur la couche d'adhésion (6), de manière à réduire efficacement la résistance de contact et la résistance mécanique de microélectrodes.
PCT/CN2016/076183 2015-06-13 2016-03-12 Réseau de microélectrode neurale flexible Ceased WO2016202021A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520407229.7 2015-06-13
CN201520407229.7U CN204767032U (zh) 2015-06-13 2015-06-13 一种柔性神经微电极阵列

Publications (1)

Publication Number Publication Date
WO2016202021A1 true WO2016202021A1 (fr) 2016-12-22

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CN (1) CN204767032U (fr)
WO (1) WO2016202021A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105147280A (zh) * 2015-06-13 2015-12-16 深圳市前海安测信息技术有限公司 具有空心凸起结构的柔性神经微电极阵列及其制备方法
CN204767032U (zh) * 2015-06-13 2015-11-18 深圳市易特科信息技术有限公司 一种柔性神经微电极阵列
CN109310861B (zh) * 2016-06-14 2023-06-09 高丽大学校产学协力团 利用内窥镜联动式电极的治疗装置
WO2017219330A1 (fr) * 2016-06-23 2017-12-28 彭鹏 Électrode flexible.
CN106388807B (zh) * 2016-08-30 2019-12-20 中国科学院深圳先进技术研究院 一种表面帖附电极阵列制备方法
CN117976294B (zh) * 2024-02-26 2026-02-17 首都医科大学附属北京天坛医院 一种神经鞘瘤术中载瘤神经走形绘制阵列微电极装置
CN119690243B (zh) * 2024-11-15 2025-11-14 武汉衷华脑机融合科技发展有限公司 柔性微电极阵列及其制备方法、脑机接口装置

Citations (5)

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Publication number Priority date Publication date Assignee Title
CN101398614A (zh) * 2008-09-12 2009-04-01 北京大学 一种基于Parylene的三维针尖电极阵列的制作方法
JP4914403B2 (ja) * 2008-05-29 2012-04-11 日本電信電話株式会社 細胞外マイクロ電極及びその製造方法
CN103202690A (zh) * 2013-03-14 2013-07-17 深圳先进技术研究院 柔性心外膜心电电极芯片及其制备方法
CN204767032U (zh) * 2015-06-13 2015-11-18 深圳市易特科信息技术有限公司 一种柔性神经微电极阵列
CN105147280A (zh) * 2015-06-13 2015-12-16 深圳市前海安测信息技术有限公司 具有空心凸起结构的柔性神经微电极阵列及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4914403B2 (ja) * 2008-05-29 2012-04-11 日本電信電話株式会社 細胞外マイクロ電極及びその製造方法
CN101398614A (zh) * 2008-09-12 2009-04-01 北京大学 一种基于Parylene的三维针尖电极阵列的制作方法
CN103202690A (zh) * 2013-03-14 2013-07-17 深圳先进技术研究院 柔性心外膜心电电极芯片及其制备方法
CN204767032U (zh) * 2015-06-13 2015-11-18 深圳市易特科信息技术有限公司 一种柔性神经微电极阵列
CN105147280A (zh) * 2015-06-13 2015-12-16 深圳市前海安测信息技术有限公司 具有空心凸起结构的柔性神经微电极阵列及其制备方法

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