WO2017007200A3 - 테스트 소켓, 테스트 소켓 제조 방법, 및 테스트 소켓용 지그 어셈블리 - Google Patents

테스트 소켓, 테스트 소켓 제조 방법, 및 테스트 소켓용 지그 어셈블리 Download PDF

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Publication number
WO2017007200A3
WO2017007200A3 PCT/KR2016/007183 KR2016007183W WO2017007200A3 WO 2017007200 A3 WO2017007200 A3 WO 2017007200A3 KR 2016007183 W KR2016007183 W KR 2016007183W WO 2017007200 A3 WO2017007200 A3 WO 2017007200A3
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WO
WIPO (PCT)
Prior art keywords
test socket
jig assembly
jig
manufacturing
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2016/007183
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English (en)
French (fr)
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WO2017007200A2 (ko
Inventor
박성규
전진국
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Okins Electronics Co Ltd
Original Assignee
Okins Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020150095483A external-priority patent/KR101683016B1/ko
Priority claimed from KR1020150144960A external-priority patent/KR101737047B1/ko
Priority claimed from KR1020150144958A external-priority patent/KR101706677B1/ko
Priority claimed from KR1020150144959A external-priority patent/KR101717679B1/ko
Priority claimed from KR1020150144949A external-priority patent/KR101705693B1/ko
Priority claimed from KR1020150144953A external-priority patent/KR101694507B1/ko
Priority claimed from KR1020150144955A external-priority patent/KR101717676B1/ko
Priority claimed from KR1020150181170A external-priority patent/KR101763369B1/ko
Priority claimed from KR1020160032581A external-priority patent/KR101744015B1/ko
Priority to JP2018500344A priority Critical patent/JP6827029B2/ja
Priority to US15/741,213 priority patent/US20180188290A1/en
Priority to CN201680039562.4A priority patent/CN108450012A/zh
Application filed by Okins Electronics Co Ltd filed Critical Okins Electronics Co Ltd
Publication of WO2017007200A2 publication Critical patent/WO2017007200A2/ko
Publication of WO2017007200A3 publication Critical patent/WO2017007200A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10795—Details of lead tips, e.g. pointed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

테스트 소켓 제조 방법은, 본딩 패드가 구비되는 PCB를 준비하는 단계, 상기 본딩 패드 상에 도전 와이어를 본딩하는 단계, 상기 PCB 상면에 상기 본딩 패드를 노출시키는 스페이스를 장착하는 단계, 상기 스페이스 상면에 상기 본딩 패드를 노출시키는 베이스를 장착하는 단계, 상기 베이스 상면에 상기 본딩 패드를 커버하는 지그를 장착하는 단계, 및 상기 PCB, 그리고 상기 스페이스, 상기 베이스, 및 상기 지그로 구성되는 지그 어셈블리를 금형으로 하여 액상 실리콘 고무를 상기 지그 어셈블리 내부에 주입하는 단계를 포함한다.테스트 소켓 제조 방법은, 본딩 패드가 구비되는 PCB를 준비하는 단계, 상기 본딩 패드 상에 도전 와이어를 본딩하는 단계, 상기 PCB 상면에 상기 본딩 패드를 노출시키는 스페이스를 장착하는 단계, 상기 스페이스 상면에 상기 본딩 패드를 노출시키는 베이스를 장착하는 단계, 상기 베이스 상면에 상기 본딩 패드를 커버하는 지그를 장착하는 단계, 및 상기 PCB, 그리고 상기 스페이스, 상기 베이스, 및 상기 지그로 구성되는 지그 어셈블리를 금형으로 하여 액상 실리콘 고무를 상기 지그 어셈블리 내부에 주입하는 단계를 포함한다.
PCT/KR2016/007183 2015-07-03 2016-07-04 테스트 소켓, 테스트 소켓 제조 방법, 및 테스트 소켓용 지그 어셈블리 Ceased WO2017007200A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US15/741,213 US20180188290A1 (en) 2015-07-03 2016-07-04 Test socket, test socket manufacturing method, and jig assembly for test socket
JP2018500344A JP6827029B2 (ja) 2015-07-03 2016-07-04 テストソケット、テストソケットの製造方法、およびテストソケット用治具アセンブリー
CN201680039562.4A CN108450012A (zh) 2015-07-03 2016-07-04 测试插座、测试插座制造方法及测试插座用夹具组件

Applications Claiming Priority (18)

Application Number Priority Date Filing Date Title
KR1020150095483A KR101683016B1 (ko) 2015-07-03 2015-07-03 테스트 소켓, 및 그 제조 방법
KR10-2015-0095483 2015-07-03
KR1020150144959A KR101717679B1 (ko) 2015-10-16 2015-10-16 와이어별 독립적인 개별 실리콘 지지 구조를 가지는 테스트 소켓
KR1020150144949A KR101705693B1 (ko) 2015-10-16 2015-10-16 테스트 소켓의 제조 방법 및 그 제조에 사용되는 지그 어셈블리
KR10-2015-0144949 2015-10-16
KR10-2015-0144953 2015-10-16
KR1020150144953A KR101694507B1 (ko) 2015-10-16 2015-10-16 와이어마다 개별 도전 실리콘 고무에 의하여 가압 전도되는 테스트 소켓
KR1020150144955A KR101717676B1 (ko) 2015-10-16 2015-10-16 다수 와이어 복합체를 포함하는 테스트 소켓
KR10-2015-0144958 2015-10-16
KR10-2015-0144955 2015-10-16
KR1020150144958A KR101706677B1 (ko) 2015-10-16 2015-10-16 개선된 콘택 구조를 가지는 테스트 소켓
KR10-2015-0144960 2015-10-16
KR10-2015-0144959 2015-10-16
KR1020150144960A KR101737047B1 (ko) 2015-10-16 2015-10-16 메탈 코어 솔더 볼을 이용하는 도전 와이어 본딩 구조체 및 그 제조방법, 그리고 이를 포함하는 테스트 소켓
KR1020150181170A KR101763369B1 (ko) 2015-12-17 2015-12-17 개별 ｐｃｂ 랜드를 포함하는 테스트 소켓
KR10-2015-0181170 2015-12-17
KR10-2016-0032581 2016-03-18
KR1020160032581A KR101744015B1 (ko) 2016-03-18 2016-03-18 와이어 본딩 시 솔더 볼의 높이 편차가 해소되는 테스트 소켓의 제조 방법

Publications (2)

Publication Number Publication Date
WO2017007200A2 WO2017007200A2 (ko) 2017-01-12
WO2017007200A3 true WO2017007200A3 (ko) 2017-03-16

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Application Number Title Priority Date Filing Date
PCT/KR2016/007183 Ceased WO2017007200A2 (ko) 2015-07-03 2016-07-04 테스트 소켓, 테스트 소켓 제조 방법, 및 테스트 소켓용 지그 어셈블리

Country Status (4)

Country Link
US (1) US20180188290A1 (ko)
JP (1) JP6827029B2 (ko)
CN (1) CN108450012A (ko)
WO (1) WO2017007200A2 (ko)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107009414B (zh) * 2017-03-01 2018-11-02 南安市弈诚机械科技有限公司 一种pcb分板机用pcb板体固定模具移动装置
KR101879806B1 (ko) * 2017-12-07 2018-07-18 (주)티에스이 반도체 테스트 소켓의 이력관리 패드, 이의 제작 방법 및 이력관리 패드를 포함하는 반도체 테스트 장치
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