WO2017008247A1 - Terminal mobile - Google Patents

Terminal mobile Download PDF

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Publication number
WO2017008247A1
WO2017008247A1 PCT/CN2015/083973 CN2015083973W WO2017008247A1 WO 2017008247 A1 WO2017008247 A1 WO 2017008247A1 CN 2015083973 W CN2015083973 W CN 2015083973W WO 2017008247 A1 WO2017008247 A1 WO 2017008247A1
Authority
WO
WIPO (PCT)
Prior art keywords
mobile terminal
hole
adapter plate
antenna
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/083973
Other languages
English (en)
Chinese (zh)
Inventor
任红强
李浩杰
李堃
吕馨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN201580081608.4A priority Critical patent/CN107836105B/zh
Priority to PCT/CN2015/083973 priority patent/WO2017008247A1/fr
Publication of WO2017008247A1 publication Critical patent/WO2017008247A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present invention relates to a mobile terminal, and more particularly to an architecture for arranging an ambient light sensor module in an antenna area in a mobile terminal.
  • Ambient light is one of the basic functions of mobile terminals (such as smart phones). Its main function is to output relevant signals to the system processor according to the changes of ambient light.
  • the system processor makes corresponding processing, such as turning off the screen when making a call.
  • the ambient light sensor needs to be designed to the front end of the mobile terminal, and the front case photosensitive holes are close to each other.
  • the mobile terminal includes a main set antenna and a diversity antenna, and the main set antenna is disposed in the mobile terminal.
  • the diversity antenna is placed at the top of the mobile terminal.
  • the diversity antenna and the ambient light sensor are both disposed at the top of the mobile terminal, and the two are stacked, the diversity antenna is close to the back of the mobile terminal, and the ambient light sensor is close to the front of the mobile terminal.
  • the antenna In order to improve the radiation efficiency of the antenna, there is no metal in the antenna clearance area (the antenna has no metal in a certain space around the antenna feeding point in order to improve the radiation efficiency), and the ambient light sensor has a metal component, and the conventional method is to The ambient light sensor is soldered directly to the motherboard.
  • This method although simple in method and low in cost, results in insufficient space in the antenna clearance area, which affects antenna performance.
  • the embodiment of the invention provides a mobile terminal.
  • the ambient light sensor module in the mobile terminal is installed on the main board of the mobile terminal, which can ensure sufficient space of the antenna clearance area and ensure the transmission efficiency of the antenna.
  • the present invention provides a mobile terminal, which includes a main board, an ambient light sensor module, and an antenna
  • the main board includes a first surface and a second surface disposed opposite to each other, the antenna facing the first surface,
  • the first surface is provided with a feeding point of the antenna
  • the ambient light sensor module comprises a sensor and an adapter plate, and the sensor is disposed on a top surface of the adapter plate, and a bottom surface of the adapter plate
  • the interposer board includes a circuit layer, a ground layer, a first clearance area, and a connection portion, the circuit layer is located on the top surface, and the ground layer is adjacent to the circuit layer and located at the Line layer and bottom
  • the first clearance area is located between the ground layer and the main board, and the connection part is used for electrically connecting the circuit layer and the circuit on the main board, and the connection part is located Outside the first clearance area, a portion of the main board sandwiched between the antenna and the interposer forms a second clearance area.
  • the adapter plate is a rigid printed circuit board.
  • the connecting portion extends perpendicularly from a top surface of the adapter plate to a bottom surface of the adapter plate.
  • the adapter board includes a side connected between the top surface and the bottom surface, and the connecting portion is located on the adapter board The side.
  • the second surface of the main board is provided with a plurality of first reinforcing pads and a plurality of first signal pads, the first A reinforcing pad is used to solder a portion of the first clearance area of the bottom surface of the interposer, the first signal pad for soldering a portion of the connection portion of the bottom surface of the interposer.
  • the bottom surface of the interposer includes a plurality of second reinforcing pads located in the first clearance area and a plurality of a second signal pad outside the first clearance area, the plurality of second reinforcement solders are respectively disposed opposite to the plurality of first reinforcement pads and soldered to each other, the plurality of second signal pads respectively The plurality of first signal pads are disposed opposite to each other and soldered to each other, and the plurality of second signal pads are electrically connected to the connecting portion.
  • the connecting portion is provided with a first blind hole, a buried hole and a second blind hole, and the buried hole is disposed in the adapter plate Between the first intermediate layer and the second intermediate layer, the first blind hole is disposed between the circuit layer and the first intermediate layer, and the second blind hole is located at the second intermediate layer and The circuit layer is electrically connected to the second signal pad through the first blind via, the buried via, and the second blind via between the second signal pads.
  • the first blind hole, the buried hole, and the second blind hole are both perpendicular to the circuit layer, the first blind The hole and the second blind hole are symmetrically disposed on two sides of the buried hole, and the first blind hole and the buried hole are electrically connected by the first intermediate layer, and the second blind hole is The buried vias are electrically connected by the second intermediate layer.
  • the connecting portion is configured a through hole communicating from the wiring layer to the bottom surface, an opening of the through hole on the bottom surface being outside the second signal pad, and the through hole being on the bottom surface
  • the upper opening and the second signal pad are electrically connected by a circuit board trace
  • the circuit layer is electrically connected to the second signal pad through the through hole and the circuit board trace.
  • the connecting portion includes a side connected between the top surface and the bottom surface, and the second signal pad is disposed on the An end of the bottom surface adjacent to the side surface, the side surface being provided with a slot, the slot being connected between the circuit layer and the second signal pad.
  • the mobile terminal provided by the present invention fixes the ambient light sensor on the transfer board, the adapter plate includes a first clearance area, and the adapter plate is soldered on the main board, and the main board includes a second clearance area.
  • the structure design of the invention makes the antenna in the mobile terminal have sufficient space of the clearance area, and can ensure the transmission efficiency of the antenna.
  • the ambient light sensor is framed by the adapter plate and is closer to the photosensitive hole on the front shell of the mobile terminal. The sensor's photographic performance can be guaranteed.
  • FIG. 1 is a partial cross-sectional view of a mobile terminal according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a pad design on a motherboard of a mobile terminal of the present invention.
  • FIG. 3 is a schematic diagram of a pad design on an adapter board of a mobile terminal according to a first embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of the adapter plate of FIG. 3.
  • FIG. 5 is a schematic diagram of a pad design on an adapter board of a mobile terminal according to a second embodiment of the present invention.
  • Figure 6 is a cross-sectional view of the adapter plate of Figure 5.
  • FIG. 7 is a schematic diagram of a pad design on an adapter board of a mobile terminal according to a third embodiment of the present invention.
  • Figure 8 is a cross-sectional view of the adapter plate of Figure 7.
  • the present invention provides a mobile terminal, which may be a smart phone.
  • the mobile terminal includes a main board 10, an ambient light sensor 22 module 20, and an antenna 30.
  • the main board 10 includes a first surface 12 and a second surface 14 which are oppositely disposed.
  • the main board 10 is mounted inside the mobile terminal between the front case 40 and the back cover (not shown).
  • the first surface 12 is provided with a feeding point 32 of the antenna 30, the antenna 30 faces the first surface 12, the antenna 30 can be disposed between the main board 10 and the back cover, and the antenna 30 can also be disposed at On the back cover.
  • the antenna 30 is close to the top end of the mobile terminal.
  • the ambient light sensor 22 module 20 includes a sensor 22 and an adapter plate 24 .
  • the sensor 22 is disposed on a top surface of the adapter plate 24 , and a bottom surface of the adapter plate 24 is soldered to the second surface 14 .
  • the adapter plate 24 is a rigid printed circuit board.
  • the sensor 22 is first soldered to the adapter plate 24, and the adapter plate 24 is soldered to the motherboard 10 together with the sensor 22 by SMT mounting.
  • the adapter plate 24 includes a circuit layer 242, a ground layer 244, a first clearance region 246, and a connection portion 248.
  • the circuit layer 242 is located on the top surface, and the ground layer 244 is adjacent to the circuit layer 242 and located at the Between the circuit layer 242 and the bottom surface, specifically, a dielectric layer 243 is disposed between the ground layer 244 and the wiring layer 242.
  • the ground layer 244 is a whole piece.
  • the ground layer 244 is disposed between the circuit layer 242 and the antenna 30, and has a shielding function to ensure the transmission accuracy and transmission efficiency of the signal of the circuit layer 242.
  • the first clearance area 246 is located between the ground layer 244 and the main board 10, and the first clearance area 246 does not include any metal or line.
  • the connecting portion 248 is configured to electrically connect the circuit layer 242 with the circuit on the main board 10, and the connecting portion 248 is located outside the first clearance area 246.
  • the connecting portion 248 Adjacent to one side 249 of the adapter plate 24, the connector 248 includes metal traces.
  • a portion of the main board 10 sandwiched between the antenna 30 and the interposer 24 forms a second clearance area 16, and a portion of the second clearance area 16 does not include any metal or routing, such that the slave antenna 30
  • a first clearing area 246 and a second clearing area 16 are provided. The two parts of the clearing area can ensure sufficient space of the clearing area of the antenna 30, thereby ensuring the transmission efficiency of the antenna 30.
  • the connecting portion 248 extends perpendicularly from the top surface of the adapter plate 24 to the
  • the bottom surface of the adapter plate 24 has such a structure that the adapter plate 24 can be made small in size and cost-effective, and the vertically extending structure also makes the signal transmission distance short and improves signal transmission efficiency.
  • the adapter plate 24 includes a side 249 that is coupled between the top surface and the bottom surface, the connection portion 248 being located on a side 249 of the adapter plate 24.
  • the second surface 14 of the motherboard 10 is provided with a plurality of first reinforcement pads 142 and a plurality of first signal pads 144 , and a plurality of first reinforcement pads 142 are located in the second clearance area 16 .
  • a plurality of first signal pads 144 are located outside the range of the second clear area 16 within the range.
  • the first reinforcing pad 142 is used to solder a portion of the first clearing region 246 of the bottom surface of the interposer 24, and the first signal pad 144 is used to solder the bottom surface of the interposer 24.
  • the first surface 12 of the main board 10 includes two feed pads 122 for connecting the feed points 32 of the antennas 30, each feed pad 122 being located between adjacent two first reinforcement pads 142. At the office.
  • the bottom surface of the adapter plate 24 includes a plurality of second reinforcing pads 245 located in the range of the first clearance area 246 and a plurality of the first clearance areas 246.
  • a second signal pad 247, the plurality of second reinforcing pads 245 are respectively disposed opposite to the plurality of first reinforcing pads 142 and are soldered to each other, and the plurality of second signal pads 247 are integrated
  • the plurality of first signal pads 144 are respectively disposed opposite to each other and soldered to each other, and the plurality of second signal pads 247 are electrically connected to the connection portion 248.
  • the connecting portion 248 is provided with a first blind hole 2482 , a buried hole 2484 and a second blind hole 2486 .
  • the buried hole 2484 is provided.
  • the first blind hole 2482 is disposed between the circuit layer 242 and the first intermediate layer 2481.
  • Two blind vias 2486 are located between the second intermediate layer 2482 and the second signal pad 247, and the circuit layer 242 passes through the first blind via 2482, the buried via 2484, and the second blind via 2486 is electrically coupled to the second signal pad 247.
  • first blind via 2482, the buried via 2484, and the inner wall of the second blind via 2486 are electrically connected by electroplating metal.
  • first intermediate layer 2481 and the ground layer 244 are schematically overlapped.
  • the two layers may be separated from the same layer of the circuit board or may be connected together.
  • the bottom opening of the second blind via 2486 is located within the second signal pad 247, as shown in Figures 3 and 4.
  • first blind hole 2482, the buried hole 2484 and the second blind hole 2486 are both perpendicular to the circuit layer 242, and the first blind hole 2482 and the second blind hole 2486 are symmetric.
  • first blind hole 2482 and the buried hole 2484 are electrically connected by the first intermediate layer 2481, and the second blind hole 2486 and the buried hole 2484 are The second intermediate layer 2843 is electrically connected.
  • the aperture of the blind via can be designed to be relatively small, and the opening of the blind via is designed to be within the range of the second signal pad 247 without affecting the stability of soldering of the second signal pad 247.
  • the cost of the design of the present embodiment may be slightly higher, it is advantageous to make the size of the adapter plate 24 small.
  • the connecting portion 248 is provided with a through hole 2487 , and the through hole 2487 is communicated from the circuit layer 242 to the bottom surface, and the through hole 2487 is in the An opening on the bottom surface is located outside the second signal pad 247, and an opening of the through hole 2487 on the bottom surface and the second signal pad 247 are electrically connected through a circuit board trace.
  • the circuit layer 242 is electrically connected to the second signal pad 247 through the via 2487 and the circuit board trace.
  • the via 2487 is particularly easy to process, but the aperture of the via 2487 is slightly larger, so the via 2487 needs to be placed outside of the second signal pad 247.
  • the via 2487 allows the wiring layer 242 to be electrically connected directly to the bottom surface, so that it is not necessary to provide any intermediate layer in the connecting portion 248 of the adapter plate 24.
  • the advantage of this embodiment is that it is low in cost and easy to process.
  • the connecting portion 248 includes a side surface 249 connected between the top surface and the bottom surface, and the second signal pad 247 is disposed on the bottom surface. Adjacent to one end of the side surface 249, the side surface 249 is provided with a slot 2489 that communicates between the circuit layer 242 and the second signal pad 247.
  • the fabrication process of the slot 2489 is similar to the through hole 2487.
  • the mobile terminal provided by the present invention fixes the ambient light sensor 22 on the adapter plate 24, and the adapter plate 24 includes a first clearance area 246 for soldering the adapter plate 24 to the main board 10, and the main board 10 includes a second clearance area. 16.
  • the structural design of the present invention allows the antenna 30 in the mobile terminal to have sufficient clearance space to ensure the transmission efficiency of the antenna 30.
  • the ambient light sensor 22 is erected by the adapter plate 24, closer to the front of the mobile terminal.
  • the photosensitive hole on the upper side can ensure the photographic performance of the sensor 22.
  • the mobile terminal and the antenna 30 provided by the embodiments of the present invention are described in detail above.
  • the principles and implementation manners of the present invention are described herein by using specific examples.
  • the description of the above embodiments is only used to help understand the method of the present invention.
  • the core idea of the present invention at the same time, those skilled in the art, according to the idea of the present invention, there will be changes in the specific embodiments and application scope.
  • the content of the present specification should not be construed as the present invention. limits.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un terminal mobile comprend une carte principale (10), un module de détection de lumière ambiante (20), et une antenne (30). La carte principale (10) comprend une première face (12) et une seconde face (14) qui sont à l'opposé l'une à l'autre. La première face (12) est dirigée vers l'antenne (30) et comprend un point d'alimentation (32) de l'antenne (30). Le module de détection de lumière ambiante (20) comprend un capteur (22) et une carte d'adaptation (24). Le capteur (22) est placé sur une face supérieure de la carte d'adaptation (24) et une face inférieure de la carte d'adaptation (24) est soudée à la seconde face (14). La carte d'adaptation (24) comprend une couche de ligne (242) placée sur la face supérieure, une couche de masse (244) proche de la couche de ligne (242) et placée entre la couche de ligne (242) et la face inférieure, une première région de dégagement (246) placée entre la couche de masse (244) et la carte principale (10), et une partie de connexion (248) configurée pour connecter électriquement la couche de ligne (242) à un circuit de la carte principale (10). La partie de connexion (248) est placée à l'extérieur de la première région de dégagement (246) et une région de la carte principale (10), prise en sandwich entre l'antenne (30) et la carte d'adaptation, forme (24) une seconde zone de dégagement (16). Le terminal mobile garantit un espace de dégagement d'antenne suffisant et, partant, une bonne efficacité de transmission de l'antenne.
PCT/CN2015/083973 2015-07-14 2015-07-14 Terminal mobile Ceased WO2017008247A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580081608.4A CN107836105B (zh) 2015-07-14 2015-07-14 移动终端
PCT/CN2015/083973 WO2017008247A1 (fr) 2015-07-14 2015-07-14 Terminal mobile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/083973 WO2017008247A1 (fr) 2015-07-14 2015-07-14 Terminal mobile

Publications (1)

Publication Number Publication Date
WO2017008247A1 true WO2017008247A1 (fr) 2017-01-19

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ID=57756714

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/083973 Ceased WO2017008247A1 (fr) 2015-07-14 2015-07-14 Terminal mobile

Country Status (2)

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CN (1) CN107836105B (fr)
WO (1) WO2017008247A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020233225A1 (fr) * 2019-05-20 2020-11-26 维沃移动通信有限公司 Terminal
CN113055505A (zh) * 2019-12-26 2021-06-29 青岛海信移动通信技术股份有限公司 移动终端

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163521A (ja) * 2001-11-27 2003-06-06 Nec Corp 折り畳み式携帯電話機用アンテナ及びそれを備えた折り畳み式携帯電話機
CN101854411A (zh) * 2010-05-21 2010-10-06 中兴通讯股份有限公司 一种移动通信终端
CN102299983A (zh) * 2010-05-18 2011-12-28 Nec卡西欧移动通信株式会社 便携式通信终端
CN104582359A (zh) * 2013-09-23 2015-04-29 苹果公司 嵌入陶瓷材料的电子元件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6122503B2 (ja) * 2013-07-30 2017-04-26 ▲華▼▲為▼終端有限公司Ｈｕａｗｅｉ Ｄｅｖｉｃｅ Ｃｏ．， Ｌｔｄ． 無線端末
CN203813014U (zh) * 2014-04-08 2014-09-03 深圳市金立通信设备有限公司 电路板和具有该电路板的终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003163521A (ja) * 2001-11-27 2003-06-06 Nec Corp 折り畳み式携帯電話機用アンテナ及びそれを備えた折り畳み式携帯電話機
CN102299983A (zh) * 2010-05-18 2011-12-28 Nec卡西欧移动通信株式会社 便携式通信终端
CN101854411A (zh) * 2010-05-21 2010-10-06 中兴通讯股份有限公司 一种移动通信终端
CN104582359A (zh) * 2013-09-23 2015-04-29 苹果公司 嵌入陶瓷材料的电子元件

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020233225A1 (fr) * 2019-05-20 2020-11-26 维沃移动通信有限公司 Terminal
US11996870B2 (en) 2019-05-20 2024-05-28 Vivo Mobile Communication Co., Ltd. Terminal
CN113055505A (zh) * 2019-12-26 2021-06-29 青岛海信移动通信技术股份有限公司 移动终端

Also Published As

Publication number Publication date
CN107836105A (zh) 2018-03-23
CN107836105B (zh) 2020-01-10

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