WO2017012156A1 - Procédé de préparation d'un revêtement local de brasure tendre sur une surface en alliage à base d'aluminium - Google Patents

Procédé de préparation d'un revêtement local de brasure tendre sur une surface en alliage à base d'aluminium Download PDF

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Publication number
WO2017012156A1
WO2017012156A1 PCT/CN2015/086518 CN2015086518W WO2017012156A1 WO 2017012156 A1 WO2017012156 A1 WO 2017012156A1 CN 2015086518 W CN2015086518 W CN 2015086518W WO 2017012156 A1 WO2017012156 A1 WO 2017012156A1
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WO
WIPO (PCT)
Prior art keywords
aluminum alloy
solder
ultrasonic
preparing
atmospheric environment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/086518
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English (en)
Chinese (zh)
Inventor
李明雨
杨海峰
杨世华
苗峻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harbin Institute of Technology Shenzhen
Shanghai Aerospace Equipments Manufacturer Co Ltd
Original Assignee
Harbin Institute of Technology Shenzhen
Shanghai Aerospace Equipments Manufacturer Co Ltd
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Filing date
Publication date
Application filed by Harbin Institute of Technology Shenzhen, Shanghai Aerospace Equipments Manufacturer Co Ltd filed Critical Harbin Institute of Technology Shenzhen
Publication of WO2017012156A1 publication Critical patent/WO2017012156A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof

Definitions

  • the invention belongs to the technical field of materials, and in particular relates to a method for preparing a partial solder coating on an aluminum alloy surface.
  • Aluminum alloy has the advantages of small specific gravity, good heat conduction and high cost performance. In the electronic industry, it mainly plays the role of mechanical support, electrical signal transmission, heat dissipation, electromagnetic field shielding, circuit protection, etc. In recent years, due to the continuous increase in copper prices, some copper components have gradually been replaced by aluminum alloys. From the point of view of the manufacture of electronic products, aluminum alloys are required to have good solderability. Solder solders commonly used in electronic packaging are difficult to wet and spread on aluminum alloys, so the solderability of aluminum alloy members is improved in the electronics manufacturing industry by electroplating tin on the surface of aluminum alloys. The electroplating tin process of aluminum alloy is relatively mature and has been widely used in industries such as electronics manufacturing.
  • Electroplating tin has the following main steps: chemical degreasing - cleaning - acid etching activation - cleaning - nickel immersion - cleaning - pre-plating copper - cleaning - tin plating.
  • chemical degreasing - cleaning - acid etching activation - cleaning - nickel immersion - cleaning - pre-plating copper - cleaning - tin plating In contrast, electroplating on aluminum and aluminum alloys is much more difficult than plating on metals such as steel and copper. The main reasons are as follows:
  • Aluminum is a relatively active metal with a great affinity for oxygen, and it is easy to form a natural oxide film. The presence of an oxide film reduces the binding force to the coating.
  • the electrode potential of aluminum is lower When immersed in the plating solution, it can undergo a displacement reaction with a plurality of metal ions, and a contact plating layer is formed on the surface of the aluminum to lower the bonding strength between the plating layer and the substrate.
  • aluminum is an amphoteric metal, soluble in acid and alkali, unstable in acidic or alkaline metal plating solution.
  • aluminum alloy castings have sand holes, pores, will leave plating solution and hydrogen, easy to bubble, will also reduce the bonding between the coating and the substrate.
  • the present invention provides a method for preparing a surface partial solder coating of an aluminum or aluminum alloy material.
  • the method can directly form a tin plating layer or a solder coating layer of any area on the surface of the aluminum alloy in an atmospheric environment without damaging the surface morphology of the alloy.
  • the invention provides a method for preparing a local solder coating on an aluminum alloy surface in an atmospheric environment, comprising: forming an ultrasonic coating of an arbitrary area on an aluminum alloy surface in an atmospheric environment by using ultrasonic sonochemistry.
  • the method first uses a commercially available aluminum alloy oil stain cleaning agent to wipe the position of the surface of the aluminum alloy to be plated to achieve a partial degreasing and decontaminating effect.
  • the method does not need to completely clean, acid etch and remove the mechanical grain on the surface of the aluminum alloy, and only partially removes and degreases the area where the solder plating is needed, thereby reducing the production cost and the environmental pollution caused by the use of the cleaning agent.
  • the ultrasonic welding head used is a titanium-based alloy or ceramic.
  • the welding head can be divided into two categories: (1) the shape and area of the lower surface of the welding head and the shape and area of the coating to be prepared are the same. This type of welding head is suitable for preparing small-area coatings (coating area less than 0.01m 2 ). (2) The lower surface of the welding head is square or rectangular, the edges are chamfered, and the area depends on the plating area. This type of horn is suitable for the preparation of large-area coatings. The chamfering design facilitates the filling of the solder to the horn and the aluminum alloy surface during the movement of the horn. The thickness of the two types of welding heads depends on the characteristics of the ultrasonic generator and the horn, and finally the amplitude of the welding head is required to be 5 to 20 ⁇ m.
  • the method is further preferably carried out in the following steps:
  • solder 200 ⁇ m-1mm on the surface and heat it until the solder melts.
  • the solder is heated to a temperature of 10 to 50 ° C above the liquidus.
  • the ultrasonic welding head is placed on the molten solder to maintain a distance of 5 to 500 ⁇ m with the surface of the aluminum alloy.
  • the surface of the ultrasonic conductive medium and the aluminum alloy surface which are difficult to react with the solder such as a titanium-based alloy or ceramic connected to the ultrasonic horn is 5 to 200 ⁇ m and heated to 200 to 300 ° C; the ultrasonic conductive medium may be parallel to the aluminum. The surface of the alloy moves.
  • a longitudinal or transverse ultrasonic wave having an ultrasonic frequency of 15 to 100 kHz and an amplitude of 1 to 20 ⁇ m is preferably used, and the ultrasonic conductive medium is moved at a speed of 0 to 5 s or at a speed of 0 to 5 m/min to cover the entire area where plating is required. Then, air-cooled to room temperature to obtain a partially tinned or tin-based solder on the surface of the aluminum or aluminum alloy.
  • the ultrasonic application time is 2S, the plating preparation effect is deteriorated, and the aluminum alloy surface cannot form a complete plating layer.
  • the solder is pure tin or tin-based solder, and the tin-based solder is composed of: Sn: 10-100% by weight; Pb: 0-37%; Ag: 0-5%; Cu: 0-5 %; Zn: 0 to 9%; Bi: 0 to 57%; Al: 0 to 14%.
  • the solder is preferably in the form of a foil, a sphere or a block.
  • a further preferred embodiment of the method is to remove excess solder using a hot air leveling device after sonication.
  • the plating layer is prepared under an atmospheric environment, and the oxide film removing process is not required, and defects caused by incomplete removal of the aluminum oxide film are avoided.
  • Ultrasonic conductive media such as titanium-based alloys or ceramics are difficult to react with tin-based solders, and do not affect the composition of the plating layer, and are easy to clean and can be used repeatedly.
  • the invention utilizes the action of ultrasonic sonochemistry and the effect of the spatial structure on the ultrasonic conduction and the liquid metal, and forms a tin or solder coating on the aluminum alloy surface locally without using a flux.
  • the plating preparation process is simple, easy to automate, and greatly reduce the production cycle; while saving energy and environmental protection, the production cost is greatly reduced.
  • FIG. 1 is a schematic view showing a process of preparing a partial plating layer on an aluminum alloy surface according to a specific embodiment.
  • FIG. 2 is a schematic view showing a preparation process of a partial plating layer on the surface of the aluminum alloy according to the second embodiment.
  • FIG. 3 is a schematic view showing a preparation process of a partial plating layer on the surface of the seven aluminum alloy according to the specific embodiment.
  • FIG. 4 is a schematic view showing a process of preparing a partial plating layer on the surface of an aluminum alloy according to a specific embodiment.
  • Figure 5 shows the results of line scan of the EDS (Energy Dispersive Spectroscopy) of tin plating and aluminum alloy interface.
  • the results of line scanning show that tin and aluminum alloy form interdiffusion.
  • 1 is a horn (ultrasonic welding head); 2 is a titanium-based alloy or ceramic connected to the horn, such as an ultrasonic conducting medium that does not react with the solder, and the lower end of the conducting medium is chamfered to promote soldering. The material is caulked, and the conductive medium can be moved in parallel with the horn at a certain speed; 3 is a solder ball or a solder ball; 4 is an aluminum alloy.
  • the partial plating of the aluminum or aluminum alloy of the present embodiment is achieved by the following steps: 1. After decontaminating the portion of the aluminum alloy to be plated, a tin foil having an area of 15 ⁇ 15 mm and a thickness of 300 ⁇ m is deposited on the surface. 2. A titanium-based alloy ultrasonic conducting medium (lower surface area of 20 x 20 mm) connected to the ultrasonic horn is placed on the tin foil and heated to 250 °C. 3. Apply longitudinal ultrasonic waves with a frequency of 30 kHz and an amplitude of 5 ⁇ m. After ultrasonic treatment for 15 s, remove the ultrasonic conductive medium, remove the excess tin with a hot air leveling device, and cool the aluminum alloy to room temperature in air.
  • the coating was macroscopically examined and the surface of the coating was clean and free of voids.
  • the EDS line scan shows that tin and aluminum alloy form a good metallurgical bond, as shown in Figure 5.
  • the partial plating of the aluminum or aluminum alloy of the present embodiment is achieved by the following steps: 1. After decontaminating the portion of the aluminum alloy to be plated, a tin foil having a surface area of 25 ⁇ 25 mm and a thickness of 300 ⁇ m is deposited on the surface. 2. Place the ceramic ultrasonic transmission medium (lower surface area of 10 ⁇ 10 mm) connected to the ultrasonic horn on the tin foil and heat to 250 °C. 3. Apply longitudinal ultrasonic wave with a frequency of 30 kHz and an amplitude of 5 ⁇ m.
  • the ultrasonic device After ultrasonic sonication for 10 s, the ultrasonic device is moved in parallel at a speed of 0.05 m/min, so that the ceramic medium covers the entire area to be plated at a slow speed and stays at the final position for 10 s. .
  • the ultrasonically conductive medium is removed, the excess tin is removed using a hot air leveling device and the aluminum alloy is placed in air to cool to room temperature.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • This embodiment differs from the first embodiment in that longitudinal ultrasonic waves having a frequency of 20 kHz and an amplitude of 10 ⁇ m are applied, and ultrasonic treatment is performed for 8 s.
  • the other steps and parameters are the same as in the first embodiment.
  • Embodiment 4 is a diagrammatic representation of Embodiment 4:
  • This embodiment differs from the specific embodiment 1 in that Sn-3Ag-0.7Cu solder is used instead of tin, and other steps and parameters are the same as in the first embodiment.
  • Embodiment 5 is a diagrammatic representation of Embodiment 5:
  • This embodiment differs from the specific embodiment in that Sn is replaced with Sn-9Zn solder, and other steps and parameters are the same as those in the first embodiment.
  • Embodiment 6 is a diagrammatic representation of Embodiment 6
  • This embodiment differs from the second embodiment in that Sn-3Ag-0.7Cu solder is used instead of tin.
  • a longitudinal ultrasonic wave having a frequency of 20 kHz and an amplitude of 10 ⁇ m was applied, and the moving speed of the ultrasonic device was 0.01 m/min.
  • Other steps and parameters are the same as in the second embodiment.
  • the present embodiment differs from the specific embodiment in that tin balls or tin fast are used instead of tin foil, and the effect of ultrasonic caulking is used to achieve the purpose of tin wetting on the surface of the aluminum alloy.
  • the other steps and parameters are the same as in the first embodiment.
  • Embodiment 8 is a diagrammatic representation of Embodiment 8
  • the present embodiment differs from the second embodiment in that instead of tin foil, a solder ball or tin is used instead of tin foil, and the wetting of tin on the surface of the aluminum alloy is achieved by the action of ultrasonic caulking.
  • Other steps and parameters are the same as in the second embodiment.
  • Embodiment 9 is a diagrammatic representation of Embodiment 9:
  • This embodiment differs from the seventh embodiment in that a transverse ultrasonic wave having a frequency of 35 kHz and an amplitude of 5 ⁇ m is applied, and a gap between the ultrasonic conductive medium and the aluminum alloy surface is 30 ⁇ m.
  • the other steps and parameters are the same as in the seventh embodiment.
  • This embodiment differs from the eighth embodiment in that a transverse ultrasonic wave having a frequency of 35 kHz and an amplitude of 5 ⁇ m is applied, and a gap between the ultrasonic conductive medium and the aluminum alloy surface is 30 ⁇ m.
  • the other steps and parameters are the same as in the eighth embodiment.
  • This embodiment differs from the specific embodiment in that the tin foil is heated to 235 ° C and ultrasonic waves are applied.
  • the other steps and parameters are the same as in the first embodiment.
  • Plating effect Due to the temperature difference between the welding head and the brazing material, the brazing material quickly solidifies after the welding head contacts the brazing material, and the coating on the aluminum alloy surface cannot be formed.
  • This embodiment differs from the specific embodiment in that the ultrasonic welding head is placed close to the molten solder. On the surface of the near aluminum alloy, other steps and parameters are the same as in the first embodiment.
  • Plating effect Due to the strong attenuation effect of the ultrasonic wave in the metal, the plating layer is formed within a range of less than 15 mm from the welding head, and the plating layer cannot be formed beyond the distance of 15 mm.
  • This embodiment differs from the specific embodiment in that the ultrasonic application time is 50 s, and the other steps and parameters are the same as those of the specific embodiment 1.
  • Plating effect Due to the long-term application of ultrasonic waves, the surface of the solder is severely oxidized and the coating is destroyed.
  • the ultrasonic amplitude is 30 ⁇ m, and other steps and parameters are the same as those of the specific embodiment 1.
  • Plating effect Due to the large amplitude of the ultrasonic wave, the solder cannot be filled between the ultrasonic welding head and the surface of the aluminum alloy, and a continuous and complete coating cannot be formed.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Coating With Molten Metal (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

L'invention concerne un procédé de préparation d'un revêtement local de brasure tendre sur les surfaces en aluminium et un alliage à base d'aluminium dans un environnement atmosphérique dans un état de basse température. Le procédé permet de préparer un revêtement local de brasure tendre sur la surface en aluminium ou en alliage à base d'aluminium dans l'environnement atmosphérique dans un état de basse température au moyen de la fonction de sonochimie aux ultrasons. Le procédé surmonte le défaut que représente la difficulté de préparation d'un revêtement de mouillage de brasure tendre sur la surface d'aluminium ou en alliage à base d'aluminium. Par comparaison avec d'autres procédés de revêtement, tel que la galvanoplastie, le procédé est simple en termes de mise en œuvre, se réalise en un faible coût de fabrication, et est exempt de pollution, et peut former un revêtement local en une période de temps extrêmement courte.
PCT/CN2015/086518 2015-07-22 2015-08-10 Procédé de préparation d'un revêtement local de brasure tendre sur une surface en alliage à base d'aluminium Ceased WO2017012156A1 (fr)

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CN201510434535.4 2015-07-22
CN201510434535.4A CN105014175B (zh) 2015-07-22 2015-07-22 一种铝合金表面局部软钎料镀层制备方法

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Cited By (2)

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US20210205934A1 (en) * 2017-04-10 2021-07-08 Metallo Belgium Improved process for the production of crude solder
CN115415627A (zh) * 2022-08-19 2022-12-02 哈尔滨工业大学（威海） 一种镁合金与钨合金的超声辅助钎焊方法

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CN105252136B (zh) * 2015-11-23 2017-11-14 哈尔滨工业大学 一种利用搅拌摩擦处理实现金属表面镀层的方法
CN105603159A (zh) * 2016-01-21 2016-05-25 江苏科技大学 一种超声辅助炉中表面工程处理装置及方法
TWI725664B (zh) * 2018-12-14 2021-04-21 日商千住金屬工業股份有限公司 焊料合金、焊料膏、焊料預形體及焊料接頭
CN110064807B (zh) * 2019-05-17 2021-02-02 武汉大学 一种降低电解槽电压降的焊接方法
CN113061827A (zh) * 2021-02-25 2021-07-02 宁波博威合金板带有限公司 一种热浸镀锡银合金涂层及其制备方法和应用

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US20210205934A1 (en) * 2017-04-10 2021-07-08 Metallo Belgium Improved process for the production of crude solder
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CN115415627A (zh) * 2022-08-19 2022-12-02 哈尔滨工业大学（威海） 一种镁合金与钨合金的超声辅助钎焊方法
CN115415627B (zh) * 2022-08-19 2023-11-10 哈尔滨工业大学（威海） 一种镁合金与钨合金的超声辅助钎焊方法

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