WO2017149495A1 - Ébauche de pièce et procédé de marquage de ladite ébauche - Google Patents

Ébauche de pièce et procédé de marquage de ladite ébauche Download PDF

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Publication number
WO2017149495A1
WO2017149495A1 PCT/IB2017/051229 IB2017051229W WO2017149495A1 WO 2017149495 A1 WO2017149495 A1 WO 2017149495A1 IB 2017051229 W IB2017051229 W IB 2017051229W WO 2017149495 A1 WO2017149495 A1 WO 2017149495A1
Authority
WO
WIPO (PCT)
Prior art keywords
blank
metal
workpiece
marking
code
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2017/051229
Other languages
German (de)
English (en)
Inventor
Matthias Honal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SnapTrack Inc
Original Assignee
SnapTrack Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SnapTrack Inc filed Critical SnapTrack Inc
Publication of WO2017149495A1 publication Critical patent/WO2017149495A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/144—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

Definitions

  • the wafers are, for example, with a twelve-by-twelve-dot matrix
  • DMC Data Matrix Coding
  • An alternative solution for marking workpieces during a multi-stage process is, for example, the printing of markings.
  • this poses the problem that printed markings often can not withstand many processing steps and thus become destroyed or unreadable during the course of the process.
  • Object of the present invention is therefore, a
  • Specify marking for workpiece blanks which can also be used in materials that are transparent to laser radiation and that can be used to produce one opposite to many
  • Workpiece blanks which are used in an extensive machining ⁇ or finishing process, typically comprise an active and a passive surface area.
  • the passive surface area is an area that does not contribute to the later used workpiece properties and is virtually unused.
  • a workpiece blank is now provided in the passive surface area with a code that is stable with respect to the conditions in the machining process for the unique and permanent identification of the workpiece blank.
  • Stable code method steps includes a metal welded onto the blank.
  • a code thus generated may then comprise, for example, an array of metallic dots / dots pointing to a passive surface area of the chip
  • Blanks are welded. By welding is an intimate and sufficiently strong adhesion of the code on the
  • the metal may be made of any metal, e.g. out
  • the code includes a thin layer of a noble metal, such as gold, silver, platinum, or the like.
  • a noble metal such as gold, silver, platinum, or the like.
  • copper, nickel, chromium and tantalum are suitable, for example.
  • the welding of the metal in the form of a code or the code forming dots succeeds in a simple manner, in particular by punctiform heating, preferably with a laser.
  • the metals to be welded absorb the laser wavelengths even then, when the underlying material of the workpiece blank is transparent to the respective radiation.
  • the code is embodied as a QR code and comprises a matrix of punctiform dots, each of which again comprises a welded-on metal.
  • Such dots can be arbitrarily shaped and, for example, just punctiform.
  • QR codes can be easily read out and allow a clear identification.
  • 10-digit codes can be written with ECC 200 error correction, so that even very large numbers of material blanks can be provided with a clearly identifiable code.
  • the workpiece is designed as a wafer. It has at least a top layer consisting of egg ⁇ nem transparent to laser substantially material.
  • the wafer comprises at least one piezo-electric layer ⁇ or consists entirely of a piezo-electric material ⁇ .
  • the active surface area of the workpiece may, in one embodiment, have component structures that operate with acoustic waves, or rather be provided for such. In the wafer then several working with acoustic waves components can be generated and
  • the blank is designed as a lid wafer for wafer level packaging.
  • a lid wafer is applied as a cover over a wafer with component structures and connected to them, wherein with the aid of spacer elements, direct contact of component structures and lid wafers can be avoided.
  • the lid wafer can be provided with the code for direct identification.
  • a code on the lid wafer also has the advantage that it can act in addition to a code on the device wafer, so that the composite of device wafer and lid wafer can be identified from two different sides.
  • any data records can be assigned to the workpiece blank and in particular the wafer during the machining process, which records, for example, the history of the method previously carried out or the processes carried out so far.
  • This data set may also include specific measurement data of the blank or information about certain process conditions during the already
  • the code can be associated with measurement data of layers, structures or components generated on the blank. This data is written to an external memory and from there to the code
  • a laser spot along a pattern scanned a surface of a workpiece blank is over with a laser spot along a pattern scanned a surface of a workpiece blank.
  • the laser can work continuously or pulsed.
  • the code may also comprise a continuous and therefore linear marking.
  • a dot grid can be produced faster and with less metal and area requirements.
  • the marking metal can be introduced on the surface of the blank in the form of metal particles in the region of the laser spot, for example by means of a powder feed.
  • the particle size of these metal particles is small compared to the diameter of the laser spot, where small means at least a half or an entire order of magnitude.
  • the metal particles of the marking metal can be any metal particles of the marking metal.
  • a metal foil comprising the marking metal is arranged on the surface of the blank in the region of the laser spot.
  • the metal foil is in contact with the surface of the blank so that the metal foil melted in the area of the laser spot melts directly onto the surface of the blank.
  • the unfused part of the metal foil remains in one piece and can then be lifted off or removed by a simple mechanical method, for example by means of brushes, foil removal or high-pressure cleaning.
  • a metal paste comprising the marking metal, a paint with metal particles or an organometallic ink is applied in the region of the laser spot on the surface of the blank. This can be achieved by printing processes (rolling,
  • Stamping, screen printing and the like in particular be realized locally. It is also possible to coat the entire surface of the blank by dipping, spraying, spin-coating or similar methods.
  • Metal particles of the marking metal-containing paste, paint or ink can be predried in an annealing step, or metal particles can be produced in the organometallic ink with an annealing step so that particles of the marking metal are present directly on the surface of the blank in the marking area.
  • the laser energy is absorbed by the marking metal. This melts in the area of the spot and connects intimately with the surface of the blank. Residual organic
  • Components of the paste, the paint or the organometallic ink are decomposed in the laser spot.
  • Excess metal particles, or paste, lacquer or ink, which were not detected by the laser and thereby melted onto the surface can e.g. with organic
  • the method for marking or applying the code to the blank is preferably carried out before the start of the very first processing step.
  • the marking or the code is generated before measuring the blank. In this way it is possible already the
  • fine codes can be produced from welded point-shaped metallizations on the surface of any workpieces.
  • the geometric size of the code in particular of the QR code or another dot matrix, is predominantly dependent on the readout optics. Limiting may additionally be the available passive surface area, which has only limited dimensions depending on the component or blank.
  • One advantageous code comprises welded points from gold, which has the advantage that it can be applied well in the powder process, without that, due to small particle sizes and high surface energy ⁇ with excessive
  • the workpiece blanks may be wafers with piezoelectric materials as used to make microacoustic devices.
  • the method can also be carried out in micro-optics, in which a plurality of micro-miniaturized lenses are produced on a glass wafer, which are also not directly laser-labeled due to the transparent wafer.
  • Other applications of blanks from corresponding transparent and therefore not directly writable materials are possible.
  • Figure 1 shows a trained as a wafer
  • Figure 2 shows an exemplary code as it is on a
  • FIG. 3 shows a first method for generating a dot for a code on a workpiece blank
  • Figure 4 shows a workpiece with a on it
  • FIG. 5 shows another schematic cross section
  • FIG. 6 shows the transferred dot on the workpiece blank in schematic cross section
  • FIG. 7 shows a schematic cross section of a
  • FIG. 8 shows the transferred dot on the workpiece blank in schematic cross section.
  • FIG. 1 shows a schematic plan view of a wafer, for example of a piezoelectric material, which represents a workpiece blank according to the invention.
  • a plurality of virtual component areas BB is shown, which are also separated by virtual separation lines.
  • This component regions BB are active upper ⁇ surface areas, while not of component regions BB covered surface areas are passive surface areas of the workpiece blank WR.
  • a mark designed as code C is applied.
  • This marker is preferably an optically scannable code, for example a matrix of individual dots.
  • FIG. 2 shows an example of such a data matrix.
  • This preferably consists of an n-by-n grid, in which a code is formed by partial occupation of the grid with metallic dots D.
  • FIG. 2 shows, for example, a 7 ⁇ 7 grid, which is partially occupied by dots D.
  • data matrices are common which comprise a 12 x 12 grid. Such can still be read well by conventional optical methods if the individual dots have a diameter of e.g. have about 40 ⁇ . With these dimensions, for example, a 12 x 12 grid code code requires a surface of 475 x 475 ⁇ . It is not necessary for the individual dot to be limited to the area of the grid area or even to fill it completely.
  • Figure 3 shows a possible method for generating a dot as part of a code on a workpiece blank WR.
  • a microlaser deposition welding developed by the Fraunhofer Deutschen can be used which For example, by means of a multi-beam optics can be performed.
  • a laser spot SP is formed on the surface of the workpiece blank ⁇ WR with a laser L.
  • a particle beam PS is now made by means of a nozzle PD
  • Metal particles MP introduced. Any metals are suitable for the metal particles MP, but a noble metal is preferred if the particle size has a certain value
  • a two-beam optics can be used in which the necessary energy is generated only in the area in which both laser spots SP overlap.
  • the irradiation with the laser L is carried out until, for a dot D, sufficient metal has been melted on the surface in the region of the spot SP. Subsequently, a relative movement between the workpiece blank WR and the laser, including the particle nozzle PD, is carried out in order to produce a further dot D at a desired other location.
  • FIG. 4 shows the workpiece blank WR after the production of a dot D in schematic cross section. As shown, the metal particles are fused together to form a single dot D of spherical cross-section, whose edge angle depends on the surface tension, which in turn depends on the material of the workpiece blank WR and the metal.
  • FIG. 5 shows a further possible example on the basis of a schematic cross section through a corresponding device
  • Workpiece blank can be generated. This will be on the
  • a thin metal foil MF for example, a shape of a belt, brought into close contact with the surface.
  • a spot SP is now produced on the surface of the metal foil MF by means of a laser L.
  • the metal foil melts, with the liquid metal firmly bonding to the surface of the workpiece blank WR.
  • the metal foil can be left on the workpiece blank WR in order to generate another dot at another location, for which purpose a relative movement between the laser and the laser is possible
  • Workpiece blank is carried out together with metal foil. It may also be useful to carry the metal foil with the spot and to carry out only a small relative movement between metal foil and spot in order to save the marking metal sparingly
  • FIG. 6 shows the workpiece blank WR after removal of the metal foil. It remains on the surface of the
  • Figure 7 shows an alternative method of applying a metal-containing compound, for example a metal particle-containing paste ⁇ P on the workpiece blank WR.
  • the Paste P is applied locally in the area of the laser spot, for example by printing, stamping or rolling. In the area of the laser spot, the metal particles are melted and intimately connect with the surface of the workpiece blank.
  • Remaining paste P outside the laser spot, which has not been melted, is then removed.
  • FIG. 8 shows the workpiece blank WR after removal of the excess paste. As in the other methods, the dot D welded onto the surface of the workpiece blank also remains here.
  • the method can be used for any workpiece blanks WR
  • Workpiece blank WR may comprise a piezoelectric material, another transparent crystalline material or glass.
  • glass is also transparent to conventional laser wavelengths, so that the method for marking is also suitable for such workpiece blanks.
  • a glass workpiece blank may include, for example, a plurality of micro-optics for optical components for light generation or for light detection, for whose production or further processing a large number of further process steps are required.
  • inventive method serve the glass
  • An inventive workpiece blank is not limited to the illustrated embodiments. Also, the method may include applying a metallic dot Codes are in principle carried out with other methods involving a local melting of the marking metal

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

Le but de l'invention est de permettre une identification univoque et durable d'une ébauche de pièce pendant un processus d'usinage ou de fabrication en plusieurs étapes. A cet effet, un marquage comprenant un code est réalisé sur l'ébauche par soudage sous la forme de points métalliques. Le soudage peut être réalisé au moyen d'un laser et convient en particulier à des ébauches de pièces transparentes.
PCT/IB2017/051229 2016-03-02 2017-03-02 Ébauche de pièce et procédé de marquage de ladite ébauche Ceased WO2017149495A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016103749.4 2016-03-02
DE102016103749.4A DE102016103749A1 (de) 2016-03-02 2016-03-02 Werkstückrohling und Verfahren zur Markierung des Rohlings

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WO2017149495A1 true WO2017149495A1 (fr) 2017-09-08

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WO (1) WO2017149495A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025080950A1 (fr) * 2023-10-12 2025-04-17 Tracer Validation Inc. Procédé permettant d'assurer l'intégrité de dispositifs à semi-conducteurs à partir de la fabrication de tranches par l'intermédiaire d'un emballage

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210380919A1 (en) * 2018-10-11 2021-12-09 King Abdullah University Of Science And Technology Laser assisted metal adhesion to indium tin oxide on glass, quartz, sapphire and single crystal silicon wafer substrates for heated platforms for cell culturing
WO2023034138A1 (fr) * 2021-08-30 2023-03-09 Corning Incorporated Soudage par laser de verre à une feuille métallique mince

Citations (4)

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Publication number Priority date Publication date Assignee Title
EP0850779A1 (fr) * 1996-12-27 1998-07-01 Omron Corporation Néthode pour le marquage des objets par les rayons d'un laser
US20030039765A1 (en) * 1997-03-21 2003-02-27 Hirotoshi Hayakawa Marking method and marking material
US20070103512A1 (en) * 2005-11-08 2007-05-10 Seiko Epson Corporation Liquid ejection apparatus
WO2007121737A1 (fr) * 2006-04-25 2007-11-01 Epcos Ag Élément avec marquage optique, procédé de fabrication et utilisation

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Publication number Priority date Publication date Assignee Title
CN101488492B (zh) * 2008-01-14 2011-03-16 力成科技股份有限公司 具有基板辨识码的半导体封装构造及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0850779A1 (fr) * 1996-12-27 1998-07-01 Omron Corporation Néthode pour le marquage des objets par les rayons d'un laser
US20030039765A1 (en) * 1997-03-21 2003-02-27 Hirotoshi Hayakawa Marking method and marking material
US20070103512A1 (en) * 2005-11-08 2007-05-10 Seiko Epson Corporation Liquid ejection apparatus
WO2007121737A1 (fr) * 2006-04-25 2007-11-01 Epcos Ag Élément avec marquage optique, procédé de fabrication et utilisation

Non-Patent Citations (1)

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Title
ANONYMOUS: "Additive manufacturing: Metal vs. composites : CompositesWorld", 14 January 2015 (2015-01-14), XP055379876, Retrieved from the Internet <URL:https://web.archive.org/web/20150114054416/http://www.compositesworld.com/blog/post/additive-manufacturing-metal-vs-composites> [retrieved on 20170608] *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025080950A1 (fr) * 2023-10-12 2025-04-17 Tracer Validation Inc. Procédé permettant d'assurer l'intégrité de dispositifs à semi-conducteurs à partir de la fabrication de tranches par l'intermédiaire d'un emballage

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