WO2017169654A1 - Film de démoulage et procédé de fabrication d'article moulé - Google Patents

Film de démoulage et procédé de fabrication d'article moulé Download PDF

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Publication number
WO2017169654A1
WO2017169654A1 PCT/JP2017/009688 JP2017009688W WO2017169654A1 WO 2017169654 A1 WO2017169654 A1 WO 2017169654A1 JP 2017009688 W JP2017009688 W JP 2017009688W WO 2017169654 A1 WO2017169654 A1 WO 2017169654A1
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WO
WIPO (PCT)
Prior art keywords
release
release film
particles
layer
release layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2017/009688
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English (en)
Japanese (ja)
Inventor
誠治 山本
貴博 藤本
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2017533995A priority Critical patent/JP6299933B2/ja
Publication of WO2017169654A1 publication Critical patent/WO2017169654A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives

Definitions

  • the present invention relates to a release film and a method for producing a molded product.
  • a release film is often used for the purpose of protecting the surface of a molded product or a laminate when producing a molded product or a laminate obtained by bonding different materials.
  • the release film heats a cover lay film (hereinafter also referred to as “CL film”) via an adhesive to a flexible film (hereinafter also referred to as “circuit exposure film”) from which a circuit is exposed.
  • CL film cover lay film
  • circuit exposure film a flexible film
  • FPC flexible printed circuit board
  • required first is the ease of peeling of the said mold release film after manufacturing a molded article or a laminated body, ie, mold release property.
  • the second required property of the release film is the adhesiveness of the release film to the surface of the molded product or the laminate, that is, the followability.
  • Examples of technologies that focus on improving the releasability of a release film and technologies that focus on improving followability include the following.
  • Patent Document 1 discloses a release film having a polyester layer in which irregularities that satisfy a specific condition are formed on the surface.
  • the present invention provides a release film that is useful for producing a molded product having a good finished appearance and excellent in releasability, and a method for producing a molded product using the release film.
  • the first release layer made of the first thermoplastic resin material, the cushion layer, and the second release layer made of the second thermoplastic resin material are arranged in this order in the thickness direction.
  • a release film having a laminated structure laminated on The first release layer is disposed on one surface of the release film
  • the second release layer is disposed on the other surface of the release film
  • the cushion layer has a thickness of 10 ⁇ m or more and 200 ⁇ m or less
  • Y / X is greater than 0.2 and less than 0.9
  • Each of the first thermoplastic resin material and the second thermoplastic resin material includes a thermoplastic resin and particles having an average particle diameter d50 of 4 ⁇ m or more and 60 ⁇ m or less
  • the content of the particles with respect to the total amount of the first release layer is 0.5 wt% or more and 15 wt% or less
  • the content of the particles with respect to the total amount of the second release layer is
  • a release film having a first release layer formed of a first thermoplastic resin material on at least one surface,
  • the first thermoplastic resin material includes a thermoplastic resin and particles;
  • the average particle diameter d50 of the particles is 20 ⁇ m or more and 60 ⁇ m or less,
  • a release film in which the content of the spherical particles with respect to the total amount of the release layer is 0.5 wt% or more and 15 wt% or less is provided.
  • a release film that is useful for producing a molded product with a good finished appearance and excellent in releasability, and a method for producing a molded product using the release film.
  • FIG. 1 is a cross-sectional view of a release film according to this embodiment.
  • a release film 10 in the present embodiment includes a first release layer 1 made of a first thermoplastic resin material, a cushion layer 2, and a second release made of a second thermoplastic resin material.
  • the two release layers 3 are in this order and have a laminated structure laminated in the thickness direction.
  • the first release layer 1 is disposed on one surface of the release film 10, and the second release layer 3 is disposed on the other surface of the release film 10.
  • the thickness of the cushion layer 2 is 10 ⁇ m or more and 200 ⁇ m or less, and when the total thickness of the release film 10 is X ⁇ m and the thickness of the cushion layer 2 is Y ⁇ m, Y / X is 0.2 Largely less than 0.9.
  • the release film 10 includes a first thermoplastic resin material and a second thermoplastic resin material, both of which are thermoplastic resins and particles having an average particle diameter d50 of 4 ⁇ m or more and 60 ⁇ m or less. Including.
  • the release film 10 has a particle content of 0.5 wt% or more and 15 wt% or less with respect to the total amount of the first release layer 1, and a content of particles with respect to the total amount of the second release layer 3. 0.5 wt% or more and 15 wt% or less.
  • the resin layer that forms the surface on the side in contact with the molding target is referred to as a first release layer.
  • a resin layer that forms the mold layer 1 and forms a surface on the side opposite to the surface in contact with the molding object will be described as a second release layer 3.
  • the surface of the first release layer 1 on the side in contact with the object when the release film 10 is arranged on the object is also referred to as “first release surface” hereinafter.
  • the surface of the molding target in the previous stage where the release film 10 is disposed is usually formed of a material containing a thermosetting resin in a semi-cured state.
  • the release film 10 according to the present embodiment is used by being disposed on the surface of a molding object formed of a material containing a thermosetting resin in the semi-cured state, and on the surface of the molding object.
  • a desired molded product can be obtained by being heated and pressed in a state where 10 is arranged.
  • the second release layer 3 in the release film 10 is a resin layer that forms a surface in contact with a cushioning material such as paper or silicone rubber when the release film 10 is heated and pressed by the method described above. It is. Further, the surface on the second release layer 3 side of the release film 10 that is opposite to the first release surface is also referred to as a “second release surface” hereinafter.
  • the release film 10 employs a configuration that satisfies the following three conditions.
  • the first condition is that the first release layer 1 and the second release layer 3 are formed of a thermoplastic resin material including particles having an average particle diameter d50 of 4 ⁇ m or more and 60 ⁇ m or less together with the thermoplastic resin. It is to be.
  • the second condition is that the content of the particles with respect to the total amount of the first release layer 1 is 0.5% by weight or more and 15% by weight or less, and the content of the particles with respect to the total amount of the second release layer 3 is 0. .5% by weight or more and 15% by weight or less.
  • the third condition is to control the balance between the thickness of the cushion layer 2 and the total thickness of the release film 10 on the assumption that the thickness of the cushion layer 2 is 10 ⁇ m or more and 200 ⁇ m or less. For this reason, according to the release film 10, the following effects are acquired.
  • the release film 10 a molded product having a good finished appearance can be obtained. And the molded article produced using the release film 10 has a favorable finished appearance in that the unevenness difference is less than 100 ⁇ m with respect to the oozing shape of the adhesive, as will be described later in Examples. .
  • the release film 10 is a film in which a predetermined amount of particles having an average particle diameter d50 of 4 ⁇ m or more and 60 ⁇ m or less are contained in both the first release layer 1 and the second release layer 3. Therefore, it has a configuration in which fine irregularities are formed on both the first release surface and the second release surface. Therefore, according to the release film 10, it is possible to effectively suppress the occurrence of pressure unevenness at the time of hot pressing due to the fine unevenness formed on both surfaces of the release film 10, and as a result, the finished appearance is A good molded product can be produced.
  • the average particle diameter d50 of the particles contained in the first thermoplastic resin material forming the first release layer 1 is 4 ⁇ m or more and 60 ⁇ m or less, preferably 5 ⁇ m or more and 50 ⁇ m or less. More preferably, it is 10 ⁇ m or more and 30 ⁇ m or less.
  • the release film 10 when the average particle diameter d50 of the particles contained in the first thermoplastic resin material forming the first release layer 1 is controlled to be equal to or more than the lower limit value, the release film The rigidity of the mold can be improved, and the balance between the release property and the followability can be improved.
  • the average particle diameter d50 of the particles contained in the first thermoplastic resin material is not more than the above upper limit value, moderate unevenness can be imparted to the first release surface, and the finished appearance is good. Can be produced.
  • the average particle diameter d50 of particles contained in the second thermoplastic resin material forming the second release layer 3 is 4 ⁇ m or more and 60 ⁇ m or less. From the viewpoint of further improving the releasability of the second release layer 3, the average particle diameter d50 of the particles is preferably 20 ⁇ m or more and 60 ⁇ m or less, and more preferably 25 ⁇ m or more and 55 ⁇ m or less.
  • size can be provided with respect to a 2nd mold release surface.
  • the average particle diameter d50 of the particles contained in the second thermoplastic resin material is controlled so as to be within the above numerical range, when performing the heat press by the method described above using the release film 10.
  • the content of the particles with respect to the total amount of the first release layer 1 is 0.5 wt% or more and 15 wt% or less.
  • the content of the particles with respect to the total amount of the first release layer 1 is preferably 0.5 wt. % To 10% by weight, more preferably 2% to 10% by weight.
  • the content of the particles with respect to the total amount of the second release layer 3 is 0.5 wt% or more and 15 wt% or less. From the viewpoint of improving the releasability of the second release surface, the content of the particles with respect to the total amount of the second release layer 3 is preferably 5% by weight to 15% by weight, and more preferably 8%. % By weight or more and 13% by weight or less.
  • the surface 10-point average roughness Rz of the first release surface of the first release layer 1 is A
  • the second release layer 3 second When the 10-point average roughness Rz of the mold release surface is B, the absolute value of AB is preferably 20 or less, more preferably 1 or more and 18 or less, and still more preferably 1. 5 or more and 16 or less. By doing so, a molded product having a good finished appearance can be produced with a high yield.
  • the value of A and the value of B may be the same or different, but from the viewpoint of producing a molded product with a good finished appearance while improving the releasability.
  • the value, that is, the value of the surface 10-point average roughness Rz of the second release surface of the second release layer 3 is the value of A, that is, the surface of the first release surface of the first release layer 1. It is preferable to show a value larger than the value of 10-point average roughness Rz. This is because the shape of the cushion material surface brought into contact with the second release surface of the second release layer 3 and the first release of the first release layer 1 when the molded product is produced. When the shape of the surface of the object to be brought into contact with the surface is compared, the surface of the cushion material has a shape with smaller irregularities.
  • the surface 10-point average roughness Rz of the first release surface of the first release layer 1 has a good balance between the release property and the followability while ensuring the strength of the first release layer 1. In view of the above, it is preferably 0.5 ⁇ m or more and 25 ⁇ m or less, more preferably 1 ⁇ m or more and 20 ⁇ m or less, and further preferably 1.6 ⁇ m or more and 18 ⁇ m or less.
  • the 10-point average roughness Rz of the first release surface can be measured according to JIS-B0601-1994.
  • the surface 10-point average roughness Rz of the second release surface of the second release layer 3 is from the viewpoint of ensuring good release properties while ensuring the strength of the second release layer 3.
  • they are 0.5 micrometer or more and 25 micrometers or less, More preferably, they are 5 micrometers or more and 23 micrometers or less, More preferably, they are 11.5 micrometers or more and 22 micrometers or less.
  • the 10-point average roughness Rz of the second release surface can be measured according to JIS-B0601-1994.
  • the peel strength of the first release surface of the first release layer 1 is desirably as low as possible, but is preferably 5 N / 50 mm or less, More preferably, it is 3N / 50mm or less, More preferably, it is 1N / 50mm or less.
  • the peeling strength of a 1st mold release surface can be measured with the following method, for example.
  • the first release surface of the first release layer 1 in the release film 10 is a cover in the above-described circuit exposure film with respect to the circuit exposure film in which the coverlay film is temporarily fixed via an adhesive.
  • a test piece is prepared by laminating the release film 10 and the circuit-exposed film so as to face the surface on which the lay film is disposed, and performing a heat press treatment at 180 ° C. and 6 MPa for 2 minutes. At this time, the end of the release film 10 is pinched as a free end by not crimping the end of the test piece.
  • a stress is applied to the test piece at a speed of about 1000 mm / min from the end of the release film 10 in the direction of 180 °, so that the first release surface and the circuit exposed film coverlay are covered.
  • the peel strength of the first release surface is measured.
  • the peel strength of the second release surface of the second release layer 3 is desirably as low as possible, but is preferably 3 N / 50 mm or less, More preferably, it is 1 N / 50 mm or less.
  • the peel strength of the second release surface can be measured, for example, by the following method.
  • a test piece is prepared by performing a heat press treatment for 2 minutes under the conditions. At this time, the end of the release film 10 is pinched as a free end by not crimping the end of the test piece.
  • test piece Thereafter, using a tensile tester, stress is applied to the test piece at a speed of about 1000 mm / min from the end of the release film 10 in the direction of 180 °, so that the second release surface and the silicon rubber sheet By peeling the gap, the peel strength of the second release surface is measured.
  • stress is applied to the test piece at a speed of about 1000 mm / min from the end of the release film 10 in the direction of 180 °, so that the second release surface and the silicon rubber sheet By peeling the gap, the peel strength of the second release surface is measured.
  • the first thermoplastic resin material used for forming the first release layer 1 and the second used for forming the second release layer 3 are used.
  • Each of the thermoplastic resin materials includes a thermoplastic resin and particles.
  • the particles are preferably organic resin particles, and more preferably crosslinked organic resin particles.
  • the organic resin particles include polystyrene particles, acrylic particles (acrylic beads), polyimide particles, polyester particles, silicone particles, polypropylene particles, polyethylene particles, fluororesin particles, and core-shell particles. These may be used alone or in combination of two or more. From the viewpoint of suppressing generation of voids in the molded product while improving the balance between releasability and followability, polystyrene particles or acrylic particles (acrylic beads) are preferable, and polystyrene particles having a crosslinked structure or Acrylic particles (acrylic beads) are more preferable.
  • the organic resin particle refers to a particle containing an organic resin as a main component.
  • the crosslinked organic resin particles refer to particles containing an organic resin having a crosslinked structure as a main component.
  • the first thermoplastic resin material used for forming the first release layer 1 and the second thermoplastic resin material used for forming the second release layer 3 are included.
  • the thermoplastic resin include polyalkylene terephthalate resins such as polyethylene terephthalate resin (PET), polybutylene terephthalate resin (PBT), polytrimethylene terephthalate resin (PTT), and polyhexamethylene terephthalate resin (PHT).
  • PET polyethylene terephthalate resin
  • PBT polybutylene terephthalate resin
  • PTT polytrimethylene terephthalate resin
  • PHT polyhexamethylene terephthalate resin
  • TPX methyl 1-pentene resin
  • SPS syndiotactic polystyrene resin
  • PP polypropylene resin
  • first release layer 1 and the second release layer 3 may be used alone or in combination of two or more.
  • it is selected from the group consisting of polymethylpentene resin, polybutylene terephthalate resin, syndiotactic polystyrene resin and polypropylene resin. It is preferable to use one or more of them.
  • the first thermoplastic resin material and the second thermoplastic resin material include, in addition to the thermoplastic resin, an antioxidant, a slip agent, an antiblocking agent, an antistatic agent, a dye, a pigment, and the like.
  • Additives such as additives and stabilizers, impact resistance imparting agents such as fluororesin and silicone rubber, and inorganic fillers such as titanium oxide, calcium carbonate, and talc may be included.
  • the thickness of the first release layer 1 is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more from the viewpoint of obtaining an appropriate strength. On the other hand, the thickness of the first release layer 1 is preferably 50 ⁇ m or less and more preferably 40 ⁇ m or less from the viewpoint of improving the embedding property to the molded product.
  • the thickness of the second release layer 3 is preferably 10 ⁇ m or more, more preferably 20 ⁇ m or more from the viewpoint of obtaining an appropriate strength. On the other hand, from the viewpoint of improving the finished appearance of the molded product, the thickness of the second release layer 3 is preferably 50 ⁇ m or less, and more preferably 40 ⁇ m or less.
  • the first release layer 1 and the second release layer 3 may be made of the same material or may be made of different materials.
  • the first release layer 1 and the second release layer 3 may have the same thickness or different thicknesses.
  • the particle size and content of the particles contained in each of the first release layer 1 and the second release layer 3 may be the same, but the molded product obtained by the release film 10 may be the same. From the viewpoint of improving the appearance, it is preferable that the particle sizes and contents are different from each other. Further, the particles contained in each of the first release layer 1 and the second release layer 3 may be made of the same material or may be made of different materials.
  • the thickness of the release film 10 is 50 ⁇ m or more.
  • the thickness of the release film 10 is preferably 75 ⁇ m or more, and more preferably 100 ⁇ m or more. By setting it to the above lower limit value or more, the balance between mold release and followability can be improved.
  • the release film 10 has a thickness of 200 ⁇ m or less. Preferably, it is 150 ⁇ m or less. By setting it to the upper limit value or less, it becomes possible to uniformly apply the press pressure to the release film 10 at the time of production of a molded product.
  • the cushion layer 2 contains a resin having flexibility, and imparts cushioning properties to the entire release film 10. Thereby, when the release film 10 is used, heat and pressure from the press hot plate are easily transmitted to the adherend, and the adhesion between the release film 10 and the adherend, and the release film are facilitated. The followability to 10 adherends can be further improved.
  • the thickness of the cushion layer 2 is 10 ⁇ m or more and 200 ⁇ m or less, preferably 20 ⁇ m or more and 180 ⁇ m or less, and more preferably 30 ⁇ m or more and 150 ⁇ m or less.
  • the thickness of the cushion layer is equal to or more than the above lower limit value, it is possible to suppress a decrease in the cushioning property of the release film.
  • the thickness of the cushion layer is equal to or less than the above upper limit value, it is possible to suppress a decrease in releasability.
  • the value of Y / X is greater than 0.2 and less than 0.9 as described above. However, it is preferably 0.25 or more and 0.8 or less, and more preferably 0.3 or more and 0.75 or less.
  • Y / X is more than the above lower limit, it can control that cushion nature of release film 10 falls.
  • Y / X is less than or equal to the above upper limit value, it is possible to suppress a decrease in releasability.
  • the resin material for forming the cushion layer 2 include ⁇ -olefin polymers such as polyethylene and polypropylene, and ⁇ -olefin polymers having ethylene, propylene, butene, pentene, hexene, methylpentene and the like as polymer components.
  • ⁇ -olefin polymers such as polyethylene and polypropylene
  • engineering plastics resins such as copolymers, polyethersulfone and polyphenylene sulfide. These may be used individually by 1 type and may use 2 or more types together. Of these, ⁇ -olefin copolymers are preferred.
  • ⁇ -olefin copolymers examples include copolymers of ⁇ -olefins such as ethylene and (meth) acrylic acid esters, copolymers of ethylene and vinyl acetate, and ethylene and (meth) acrylic acid. Examples thereof include copolymers and partially ion cross-linked products thereof.
  • a mixture of ethylene and ethylene-methyl methacrylate copolymer (EMMA), a mixture of polypropylene (PP) and ethylene-methyl methacrylate copolymer (EMMA), polybutylene terephthalate (PBT), polypropylene (PP) and ethylene -A mixture with a methyl methacrylate copolymer (EMMA) is more preferable.
  • the cushion layer 2 may further contain a rubber component.
  • the rubber component include thermoplastic elastomer materials such as styrene-based thermoplastic elastomers such as styrene-butadiene copolymer and styrene-isoprene copolymer, olefin-based thermoplastic elastomers, amide-based elastomers, and polyester-based elastomers, and natural rubber. And rubber materials such as isoprene rubber, chloroprene rubber and silicon rubber.
  • the cushion layer 2 includes an antioxidant, a slip agent, an anti-blocking agent, an antistatic agent, a colorant such as a dye and a pigment, an additive such as a stabilizer, an impact resistance imparting agent such as a fluororesin and silicon rubber, an oxidation
  • An inorganic filler such as titanium, calcium carbonate, or talc may be included.
  • Examples of the method for forming the cushion layer 2 include known methods such as an air-cooling or water-cooling inflation extrusion method and a T-die extrusion method.
  • the release film 10 demonstrated the example which the 1st release layer 1, the cushion layer 2, and the 2nd release layer 3 laminated
  • the release film 10 may have a structure of four or more layers in which an adhesive layer, a gas barrier layer, and the like are laminated.
  • the adhesive layer and the gas barrier layer are not particularly limited, and known ones can be used.
  • the release film 10 in the present embodiment can be produced using a known method such as a co-extrusion method, an extrusion lamination method, a dry lamination method, or an inflation method.
  • the release film 10 may be manufactured by separately manufacturing each layer of the first release layer 1, the cushion layer 2, and the second release layer 3 with a laminator or the like. It is preferable to form a film by an air-cooled or water-cooled coextrusion inflation method or a coextrusion T-die method.
  • a method of forming a film by a coextrusion T-die method is particularly preferable because it is excellent in controlling the thickness of each layer.
  • the 1st mold release layer 1, the cushion layer 2, and the 2nd mold release layer 3 may be joined as it is, and may be joined via an contact bonding layer.
  • the manufacturing method of the molded product of this embodiment includes the following steps. 1st process: The process of arrange
  • 1st process The process of arrange
  • 2nd process The process of performing a heat press with respect to the target object in which the release film 10 is arrange
  • the first step is arranged so that the first release surface of the release film 10 is on the object side.
  • the arrangement method is not particularly limited, and the arrangement can be performed by a known method.
  • a hot press is performed on the object together with the release film 10.
  • a known press machine can be used, and a desired shape may be obtained by a press die.
  • the heating and pressing conditions can be appropriately designed according to the application.
  • the press apparatus is heated from room temperature to 170 ° C. in 15 minutes after starting pressing, and then maintained at that temperature for 35 minutes. Cool from 170 ° C. to room temperature over 50 minutes.
  • the pressing pressure at this time is appropriately adjusted at 5 to 15 MPa.
  • the release film 10 and a target object can be made to contact
  • materials those having cushioning properties are preferred. Examples of the material include paper, rubber, a fluororesin sheet, glass paper, or a combination thereof.
  • the release film 10 is used, for example, in a cover lay press laminating process which is one of the manufacturing processes of a flexible printed wiring board. That is, the release film 10 is used to protect the circuit of the circuit exposed film and to allow the cover lay film to adhere to the concavo-convex portion of the circuit pattern of the circuit exposed film during heat pressing. Specifically, first, the release film 10 is disposed so as to wrap the coverlay film such that the first release surface of the release film 10 is on the coverlay film side. Thereby, the release film 10 is interposed between the coverlay film and the subsequent press machine.
  • the above materials may be interposed between the release film 10 and the press.
  • the release film 10 is heated and pressed by a press together with the circuit exposure film and the coverlay film. After heating and pressurization, the circuit exposed film with the coverlay film adhered, that is, the flexible printed circuit board is taken out from the press machine, and a desired molded product is obtained.
  • the example of the flexible printed circuit board has been described as the molded product.
  • the surface on which the release film 10 of the object is disposed is formed of a material containing a thermosetting resin. It may be a thing.
  • the thermosetting resin may be in a semi-cured state or a cured state.
  • the operational effect of the release film 10 becomes more remarkable.
  • the thermosetting resin is a resin composition containing an epoxy resin
  • the epoxy resin is preferably in an intermediate stage of the curing reaction, that is, in a B-stage state. According to the release film 10 of this embodiment, even if the surface on which the release film 10 of the object is disposed is formed of a material containing a thermosetting resin, a molded product having a good appearance is obtained. can get.
  • the release film 10 includes a step of disposing the release film 10 on the object such that the first release layer of the release film 10 is on the object side, and an object on which the release film 10 is disposed. On the other hand, it can be used to obtain a molded product after the heat pressing. As a result, a molded product having a good appearance can be obtained.
  • positioned may be formed with the material containing a thermosetting resin.
  • the thermosetting resin is a resin composition containing an epoxy resin
  • the epoxy resin is preferably in an intermediate stage of the curing reaction, that is, in a B-stage state.
  • the release film 10 has a laminated structure in which the first release layer 1, the cushion layer 2, and the second release layer 3 are laminated in this order in the thickness direction.
  • the thickness of the cushion layer 2 is 10 ⁇ m or more and 200 ⁇ m or less
  • the total thickness of the release film 10 is X
  • the thickness of the cushion layer 2 is Y
  • Y / X is greater than 0.2 and less than 0.9.
  • the release layer 1 and the release layer 3 include particles having an average particle diameter d50 of 4 ⁇ m or more and 60 ⁇ m or less.
  • the release film 20 is formed on at least one surface.
  • the first release layer 21 having an average particle diameter d50 of 20 ⁇ m or more and 60 ⁇ m or less will be described.
  • description of the same configuration, effects, manufacturing method, and the like as in the first embodiment will be omitted as appropriate.
  • FIG. 2 is a cross-sectional view of a release film according to the second embodiment.
  • the release film 20 has a first release layer 21 made of a first thermoplastic resin material.
  • the first thermoplastic resin material includes a thermoplastic material and particles.
  • the average particle diameter d50 of the particles is 20 ⁇ m or more, preferably 23 ⁇ m or more, more preferably 25 ⁇ m or more, and further preferably 28 ⁇ m or more. Inclusion of particles having an average particle size d50 equal to or greater than the lower limit in the first release layer 21 improves the rigidity of the release film 20 and provides a good balance between release properties and followability. It can be.
  • the upper limit of the average particle diameter d50 of the particles is 60 ⁇ m or less, preferably 55 ⁇ m or less, more preferably 52 ⁇ m or less, and even more preferably 51 ⁇ m or less.
  • the first release layer 21 By allowing the first release layer 21 to contain particles having an average particle diameter d50 that is equal to or less than the above upper limit value, it is possible to improve the releasability and followability in a balanced manner. Moreover, in this embodiment, when the average particle diameter d50 of the particles is not more than the above upper limit value, a molded product with a good finished appearance can be produced.
  • the particles are preferably spherical.
  • the same materials as described in the first embodiment can be used.
  • the first release layer 21 is a surface (release surface) corresponding to the object side in the release film 20 when the release film 20 is disposed on the object.
  • the surface 10-point average roughness (Rz) of the release surface of the first release layer 21 is from the viewpoint of obtaining stable release properties while ensuring the strength of the first release layer 21.
  • the thickness is preferably 4 ⁇ m or more, more preferably 4.5 ⁇ m or more, and further preferably 5 ⁇ m or more.
  • the upper limit value of the surface 10-point average roughness (Rz) of the release surface is preferably 20 ⁇ m or less, more preferably 18 ⁇ m or less, from the viewpoint of suppressing a decrease in followability. Preferably, it is 16 ⁇ m or less.
  • the surface 10-point average roughness (Rz) of the first release layer 21 can be measured according to JIS-B0601-1994.
  • the value of the surface 10-point average roughness (Rz) refers to a numerical value of a surface (release surface) corresponding to the object side in the release film 20 when the release film 20 is disposed on the object.
  • the average interval (Sm) of the unevenness of the release surface of the first release layer 21 is preferably from the viewpoint of obtaining stable release properties while ensuring the strength of the first release layer 21. Is 150 ⁇ m or more, and more preferably 180 ⁇ m or more.
  • the upper limit of the average interval (Sm) of the unevenness of the release surface of the first release layer 21 is preferably 500 ⁇ m or less from the viewpoint of suppressing the occurrence of wrinkles on the surface of the molded product. More preferably, it is 450 ⁇ m or less.
  • the average interval (Sm) of the unevenness of the first release layer 21 can be measured according to JIS-B0601-1994.
  • the value of the average interval of unevenness (Sm) refers to the numerical value of the surface (release surface) corresponding to the object side in the release film 20 when the release film 20 is disposed on the object.
  • the arithmetic average roughness (Ra) of the release surface of the first release layer 21 is preferably from the viewpoint of obtaining stable release properties while ensuring the strength of the first release layer 21. Is 0.5 ⁇ m or more, and more preferably 0.6 ⁇ m or more.
  • the upper limit value of the arithmetic average roughness (Ra) of the release surface of the first release layer 21 is preferably 6 ⁇ m or less from the viewpoint of suppressing generation of wrinkles on the surface of the molded product. More preferably, it is 5 ⁇ m or less.
  • the arithmetic average roughness (Ra) of the first release layer 21 can be measured according to JIS-B0601-1994.
  • arithmetic mean roughness (Ra) points out the numerical value of the surface (release surface) which hits the target object side in the release film 20, when the release film 20 is arrange
  • the peel strength of the release surface of the first release layer 21 is preferably 3 N / 50 mm or less, and more preferably 1 N / 50 mm or less. By carrying out like this, it can be set as the release film which can express favorable release property compared with the conventional release film.
  • the peeling strength of the mold release surface of the 1st mold release layer 21 can be measured with the following method, for example.
  • a test film is produced in which the coverlay is temporarily fixed so that the surface of the circuit exposed film is in contact with the surface of the coverlay (CM type) manufactured by Arisawa Seisakusho.
  • CM type surface of the coverlay
  • a test piece is prepared by bonding each other so that the release surface of the first release layer 21 in the release film 20 faces the surface of the test film having the coverlay.
  • the test piece is subjected to a heat press treatment for 2 minutes under the conditions of 195 ° C. and 6 MPa. At this time, the end of the release film 20 is pinched as a free end by not crimping the end of the test piece.
  • the release surface of the first release layer 21 of the release film 20 at a speed of about 1000 mm / min from the end of the release film 20 in the direction of 180 °, and the above
  • the peel strength of the release surface of the first release layer 21 is measured by peeling between the test film and the coverlay.
  • the thickness of the first release layer 21 is preferably 15 ⁇ m or more, more preferably 20 ⁇ m or more, from the viewpoint of improving the embedding property to the molded product.
  • the thickness of the first release layer 21 is preferably 100 ⁇ m or less, more preferably 75 ⁇ m or less, and most preferably 50 ⁇ m or less.
  • the release film 20 has a first release layer 21 containing a thermoplastic resin material on at least one surface.
  • the same materials as those described in the first embodiment can be used.
  • the release film 20 employs a configuration that satisfies both of the following two conditions.
  • the first condition is to have the first release layer 21 formed of a thermoplastic resin material including particles having an average particle diameter d50 of 20 ⁇ m or more and 60 ⁇ m or less together with the thermoplastic resin.
  • the second condition is to control the content of the particles with respect to the total amount of the first release layer 21 to be 0.5 wt% or more and 15 wt% or less. For this reason, according to the release film 20, the following effects are acquired.
  • the release film 20 it is possible to produce a molded product having a good finished appearance. And about the molded article produced using the release film 20, as it mentions later in the Example, regarding the oozing shape of the adhesive, it has a good finished appearance in that the unevenness difference is less than 100 ⁇ m. It was confirmed.
  • the release film 20 even when a pressing pressure is applied to the release surface of the first release layer 21 of the release film 20 when the molded product is produced, The generation of wrinkles on the surface can be suppressed. Therefore, according to the release film 20, a molded product having a good finished appearance can be produced.
  • the release film 20 only needs to have a first release layer 21 containing a thermoplastic resin material on at least one surface, but the release film 20 has a first release in the thickness direction. It may have another layer laminated on the layer 21.
  • the release film 20 may be configured to have a second release layer 23 on the other surface.
  • the release film 20 may further include a cushion layer 22 provided with cushioning properties in addition to the second release layer 23.
  • the release film 20 has a laminated structure of three or more layers in which the first release layer 21, the cushion layer 22, and the second release layer 23 are laminated in this order in the thickness direction. It may be.
  • the 1st mold release layer 21 and the 2nd mold release layer 23 are the materials containing a thermoplastic resin, they may be formed from the same material, and are formed from different materials. It may be. Further, the first release layer 21 and the second release layer 23 may have different thicknesses.
  • the thickness of the second release layer 23 may be, for example, 15 ⁇ m or more, or 20 ⁇ m or more from the viewpoint of obtaining an appropriate strength.
  • the upper limit value of the thickness of the second release layer 23 may be set to, for example, 100 ⁇ m or less, 75 ⁇ m or less, or 50 ⁇ m or less from the viewpoint of suppressing a decrease in followability.
  • the same materials as those described in the first embodiment can be used. Further, the second release layer 23 may contain particles as long as the effect of the release film 20 is not impaired.
  • the thickness of the cushion layer 22 is preferably 10 ⁇ m or more and 100 ⁇ m or less, more preferably 20 ⁇ m or more and 90 ⁇ m or less, and most preferably 30 ⁇ m or more and 70 ⁇ m or less.
  • the thickness of the cushion layer 22 is not less than the above lower limit value, it is possible to suppress the cushioning property of the release film 20 from being lowered.
  • the thickness of the cushion layer 23 is equal to or less than the above upper limit value, it is possible to suppress a decrease in releasability.
  • the same materials as those described in the first embodiment can be used.
  • Example A ⁇ Example A-1> A thermoplastic resin material comprising a polymethylpentene resin (TPX (registered trademark)) (manufactured by Mitsui Chemicals, TPX DX845) and acrylic beads (MBX-30, manufactured by Sekisui Plastics Co., Ltd.), which are crosslinked organic resin particles.
  • the first release layer was obtained by forming a TPX film by the extrusion T-die method.
  • the average particle diameter d50 of the acrylic beads used for the production of the first release layer was 28.5 ⁇ m.
  • thermoplastic resin material used for the production of the first release layer is prepared by blending with the TPX so that the content of the acrylic beads is 4% by weight with respect to the total amount of the first release layer.
  • a thermoplastic resin material comprising a polymethylpentene resin (TPX (registered trademark)) (manufactured by Mitsui Chemicals, TPX DX845) and acrylic beads (MBX-50, manufactured by Sekisui Plastics Co., Ltd.) that are crosslinked organic resin particles.
  • TPX polymethylpentene resin
  • MBX-50 manufactured by Sekisui Plastics Co., Ltd.
  • a TPX film was formed by an extrusion T-die method to obtain a second release layer.
  • the average particle diameter d50 of the acrylic beads used for the production of the second release layer was 53 ⁇ m.
  • thermoplastic resin material used for the production of the second release layer is prepared by blending with the TPX so that the content of the acrylic beads with respect to the total amount of the second release layer is 10% by weight.
  • the first release layer obtained by the above method, the above TPX, polypropylene (manufactured by Sun Aroma, PB270A), and modified polyethylene (ethylene-methyl methacrylate copolymer, manufactured by Sumitomo Chemical Co., Ltd.) WH102) (mixing ratio: TPX: polypropylene: ethylene-methyl methacrylate copolymer: 30: 40: 30) and the second release layer in this order by an extrusion T-die method.
  • the release film of Example 1 was obtained by laminating.
  • the obtained release film had a three-layer structure in which the first release layer, the cushion layer, and the second release layer were laminated in this order in the thickness direction. Moreover, the thickness of the obtained release film was 120 micrometers. And in the obtained release film, the thickness of the said 1st mold release layer and the said 2nd mold release layer was 30 micrometers, and the thickness of the said cushion layer was 60 micrometers.
  • Example A-2 Sekisui Plastics Industries, Ltd.
  • the first release layer was produced using a thermoplastic resin material blended with the above TPX so that the content of acrylic beads with respect to the total amount of the first release layer was 10% by weight.
  • MBX-30 made by Sekisui Plastics Co., Ltd. was used as an acrylic bead instead of MBX-50 made by the company
  • the second release layer was prepared, and the thickness of the cushion layer was changed to 50 ⁇ m.
  • a release film of Example A-2 was obtained in the same manner as in Example A-1.
  • Example A-3> In place of MBX-30 manufactured by Sekisui Plastics Co., Ltd., the first example is MBX-20 manufactured by Sekisui Plastics Co., Ltd. having an average particle diameter d50 of 20.9 ⁇ m as acrylic beads as crosslinked organic resin particles. MBX-30 manufactured by Sekisui Plastics Co., Ltd. was used as an acrylic bead instead of MBX-50 manufactured by Sekisui Plastics Co., Ltd. in that the release layer was prepared, the thickness of the first release layer was 25 ⁇ m.
  • the second release layer having a thickness of 25 ⁇ m was prepared from a thermoplastic resin material blended with the TPX so that the content of the acrylic beads with respect to the total amount of the release layer was 12% by weight, the thickness of the cushion layer A release film of Example A-3 was obtained in the same manner as in Example A-1, except that was set to 70 ⁇ m.
  • Example A-4> Instead of MBX-30 manufactured by Sekisui Plastics Co., Ltd., NMB-1020 manufactured by JX Energy Co., Ltd. having an average particle diameter d50 of 10.2 ⁇ m was used as the acrylic beads as the crosslinked organic resin particles, and the total amount of the release layer
  • the first release layer having a thickness of 40 ⁇ m was made of a thermoplastic resin material blended with the above TPX so that the content of acrylic beads with respect to 2% by weight was obtained.
  • the thickness of the second release layer was 40 ⁇ m
  • a release film of Example A-4 was obtained in the same manner as in Example A-1, except that the thickness of the cushion layer was 40 ⁇ m.
  • Example A-2 having an average particle diameter d50 of 61.2 ⁇ m is used as the acrylic beads which are particles, and is blended with the above TPX so that the content of the acrylic beads with respect to the total amount of the release layer is 15% by weight. Except that the second release layer was made of a thermoplastic resin material and the thickness of the cushion layer was 50 ⁇ m, the release of Comparative Example A-2 was performed in the same manner as in Example A-1. To obtain a film.
  • Example A-3 having an average particle diameter d50 of 2.8 ⁇ m is used as the acrylic beads that are crosslinked organic resin particles, and the content of acrylic beads with respect to the total amount of the release layer is 3% by weight.
  • a method similar to that of Example A-1 was performed except that a second release layer having a thickness of 25 ⁇ m was produced from the thermoplastic resin material blended with the above TPX and that the thickness of the cushion layer was 70 ⁇ m.
  • a release film of Comparative Example A-3 was obtained.
  • Comparative Example A-4 was prepared in the same manner as in Example A-2 except that the thickness of the first release layer and the second release layer was 40 ⁇ m and the thickness of the cushion layer was 20 ⁇ m. A release film of 4 was obtained.
  • Comparative Example A-5 was prepared in the same manner as in Example A-2, except that the thickness of the first release layer and the second release layer was 10 ⁇ m, and the thickness of the cushion layer was 180 ⁇ m. A release film of 5 was obtained.
  • the surface of the circuit exposed film is coated with the adhesive of the coverlay (CM type) manufactured by Arisawa Seisakusho.
  • a test film was prepared in which the coverlay was temporarily fixed so that the surfaces were in contact.
  • what bonded together each other so that the 1st mold release surface of the 1st mold release layer in a mold release film might oppose the field of the side which has the coverlay of the above-mentioned test film was obtained as a test piece. .
  • this test piece was subjected to a heat press treatment at 180 ° C.
  • the peel strength between the first release surface of the first release layer of the release film and the coverlay of the test film was measured at a speed of 1000 mm / min.
  • the peel strength was measured immediately after the hot press treatment described above, and the releasability was evaluated based on the following criteria.
  • X Peel strength shows a value larger than 3N / 50mm, or any film which forms a test piece with heavy peeling peeled.
  • Finished appearance 1 of molded product (adhesive oozing shape): First, a 1 mm square opening was created in a coverlay (CM type) manufactured by Arisawa Seisakusho. Next, a test piece was prepared in which the coverlay having the opening was temporarily fixed so that the surface coated with the adhesive was in contact with the surface of the copper clad laminate for flexible wiring board. Next, the release film and the test piece are overlapped so that the first release surface of the first release layer in the release film faces the surface of the test piece having the coverlay. After combining, a hot press treatment was performed for 2 minutes under the conditions of 180 ° C. and 6 MPa to obtain a molded product.
  • CM type manufactured by Arisawa Seisakusho.
  • the shape of the adhesive coated on the surface of the cover tape oozing out from the outer edge of the opening (the adhesive oozes out) in the opening formed in the cover lay. Shape) was observed, and the finished appearance of the molded product was evaluated based on the following criteria.
  • Example B ⁇ Example B-1> A thermoplastic resin material comprising a polymethylpentene resin (TPX (registered trademark)) (manufactured by Mitsui Chemicals, TPX DX845) and acrylic beads (MBX-30, manufactured by Sekisui Plastics Co., Ltd.), which are crosslinked organic resin particles.
  • the first release layer was obtained by forming a TPX film by the extrusion T-die method.
  • the average particle diameter d50 of the acrylic beads used for the production of the first release layer was 28.5 ⁇ m.
  • thermoplastic resin material used for the production of the release layer was a material blended with the TPX so that the content of the acrylic beads with respect to the total amount of the first release layer was 4% by weight.
  • first release layer obtained by the above method, the above TPX, polypropylene (manufactured by Sun Aroma, PB270A), and modified polyethylene (ethylene-methyl methacrylate copolymer, manufactured by Sumitomo Chemical Co., Ltd.) WH102) (mixing ratio: TPX: polypropylene: ethylene-methyl methacrylate copolymer: 25: 50: 25) and the above-mentioned second release layer made of TPX are used as an extrusion T-die method.
  • Example B-1 Lamination was carried out in this order to obtain a release film of Example B-1.
  • the obtained release film had a three-layer structure in which the first release layer, the cushion layer, and the second release layer were laminated in this order in the thickness direction. Moreover, the thickness of the obtained release film was 120 micrometers. And in the obtained mold release film, the thickness of the said 1st mold release layer and the said 2nd mold release layer was 30 micrometers, respectively, and the thickness of the said cushion layer was 60 micrometers.
  • Example B-2 Example B-1 except that a release layer was prepared using a thermoplastic resin material blended with the TPX so that the content of acrylic beads with respect to the total amount of the first release layer was 10% by weight.
  • a release film of Example B-2 was obtained in the same manner as described above.
  • Example B-3 An example was prepared in the same manner as in Example B-1, except that MBX-20 manufactured by Sekisui Plastics Co., Ltd. having an average particle size d50 of 20.9 ⁇ m was used as the acrylic beads as the crosslinked organic resin particles. A release film of B-3 was obtained.
  • Example B-4 MBX-50 manufactured by Sekisui Plastics Co., Ltd. having an average particle diameter d50 of 50.9 ⁇ m was used as the acrylic beads that are crosslinked organic resin particles, and the content of acrylic beads with respect to the total amount of the first release layer was 10
  • the release film of Example B-4 was prepared in the same manner as in Example B-1, except that a release layer was prepared using a thermoplastic resin material blended with the above TPX so as to be in weight%. Got.
  • Comparative Example B-1 The mold release of Comparative Example B-1 was performed in the same manner as Example B-1, except that the first mold release layer was produced using the thermoplastic resin material comprising TPX not containing acrylic beads. A film was obtained.
  • Comparative Example B-2 As the acrylic beads, AR650MZ manufactured by Toyobo Co., Ltd. having an average particle diameter d50 of 61.2 ⁇ m was used, and blended with the above TPX so that the content of acrylic beads relative to the total amount of the first release layer was 15% by weight.
  • a release film of Comparative Example B-2 was obtained in the same manner as in Example B-1, except that a release layer was produced using the thermoplastic resin material.
  • Comparative Example B-3 As the acrylic beads, SSX-110 manufactured by Sekisui Plastics Co., Ltd. having an average particle size d50 of 10.2 ⁇ m was used, and the thickness of the first release layer and the second release layer was 25 ⁇ m, respectively. A release film of Comparative Example B-3 was obtained in the same manner as in Example B-1, except that a release film was prepared so that the layer thickness was 70 ⁇ m.
  • the peel strength between the release surface of the first release layer of the release film and the coverlay of the test film was measured at a speed of 1000 mm / min.
  • the peel strength was measured immediately after the hot press treatment described above, and the releasability was evaluated based on the following criteria.
  • X Peel strength shows a value larger than 3N / 50mm, or any film which forms a test piece with heavy peeling peeled.
  • Finished appearance 1 of molded product (adhesive oozing shape): First, a 1 mm square opening was created in a coverlay (CM type) manufactured by Arisawa Seisakusho. Next, a test piece was prepared in which the coverlay having the opening was temporarily fixed so that the surface coated with the adhesive was in contact with the surface of the copper clad laminate for flexible wiring board. Next, after the release film and the test piece are overlapped so that the release surface of the first release layer in the release film faces the surface of the test piece on the side having the cover lay. A hot press treatment for 2 minutes was performed at 195 ° C. and 6 MPa to obtain a molded product.
  • CM type manufactured by Arisawa Seisakusho.
  • the shape of the adhesive coated on the surface of the cover tape oozes out from the outer edge of the opening (the adhesive oozes out) in the opening formed in the cover lay. Shape) was observed, and the finished appearance of the molded product was evaluated based on the following criteria.
  • the release films of the examples were all excellent in releasability. Moreover, it was confirmed that all the molded articles produced using the release film of Example B had a good finished appearance.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

L'invention concerne un film de démoulage (10) qui a une structure multicouche dans laquelle une première couche de démoulage (1) qui est formée à partir d'un premier matériau de résine thermoplastique, une couche d'amortissement (2) et une seconde couche de démoulage (3) qui est formée à partir d'un second matériau de résine thermoplastique sont stratifiées séquentiellement dans cet ordre dans le sens de l'épaisseur. La couche d'amortissement (2) présente une épaisseur de 10 μm à 200 μm (inclus). Si X représente l'épaisseur totale du film de démoulage (10) et Y l'épaisseur de la couche d'amortissement (2), Y/X est supérieur à 0,2 mais inférieur à 0,9. Le premier matériau de résine thermoplastique et le second matériau de résine thermoplastique contiennent tous les deux une résine thermoplastique et des particules ayant un diamètre de particule moyen d50 de 4 µm à 60 µm (inclus). La teneur en particules par rapport au poids total de la première couche de démoulage (1) est comprise entre 0,5 % en poids et 15 % en poids (inclus) ; et la teneur en particules par rapport au poids total de la seconde couche de démoulage (3) est compris entre 0,5 % en poids et 15 % en poids (inclus).
PCT/JP2017/009688 2016-03-30 2017-03-10 Film de démoulage et procédé de fabrication d'article moulé Ceased WO2017169654A1 (fr)

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WO2020040240A1 (fr) * 2018-08-24 2020-02-27 住友ベークライト株式会社 Film de démoulage et procédé de fabrication d'article moulé
JP2020131461A (ja) * 2019-02-14 2020-08-31 住友ベークライト株式会社 離型フィルム
JP2020142370A (ja) * 2019-03-04 2020-09-10 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JP2021079697A (ja) * 2019-11-13 2021-05-27 積水化学工業株式会社 多層離型フィルム
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JPWO2020040240A1 (ja) * 2018-08-24 2020-09-24 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
CN112601646A (zh) * 2018-08-24 2021-04-02 住友电木株式会社 脱模膜及成型品的制造方法
WO2020040240A1 (fr) * 2018-08-24 2020-02-27 住友ベークライト株式会社 Film de démoulage et procédé de fabrication d'article moulé
JP7243258B2 (ja) 2019-02-14 2023-03-22 住友ベークライト株式会社 離型フィルム
JP2020131461A (ja) * 2019-02-14 2020-08-31 住友ベークライト株式会社 離型フィルム
JP7298194B2 (ja) 2019-03-04 2023-06-27 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JP2020142370A (ja) * 2019-03-04 2020-09-10 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JP2021079697A (ja) * 2019-11-13 2021-05-27 積水化学工業株式会社 多層離型フィルム
JP7534928B2 (ja) 2019-11-13 2024-08-15 積水化学工業株式会社 多層離型フィルム
CN114729955A (zh) * 2019-11-27 2022-07-08 住友电装株式会社 传感器装置
CN114729955B (zh) * 2019-11-27 2024-05-10 住友电装株式会社 传感器装置
JP7283639B2 (ja) 2020-08-12 2023-05-30 住友ベークライト株式会社 離型フィルムおよび成型品の製造方法
JPWO2022034834A1 (fr) * 2020-08-12 2022-02-17
WO2022034834A1 (fr) * 2020-08-12 2022-02-17 住友ベークライト株式会社 Film de démoulage et procédé de fabrication d'un produit moulé
JP2022052886A (ja) * 2020-09-24 2022-04-05 住友ベークライト株式会社 離型フィルム、および機能性フィルム
CN116600989A (zh) * 2020-12-24 2023-08-15 株式会社力森诺科 脱模膜和电子部件装置的制造方法
JP7819793B1 (ja) * 2025-01-14 2026-02-25 住友ベークライト株式会社 離型フィルム
JP7819794B1 (ja) * 2025-01-14 2026-02-25 住友ベークライト株式会社 離型フィルム

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