WO2017194408A3 - Keramische vielschichtbauelement und verfahren zur seines herstellung - Google Patents

Keramische vielschichtbauelement und verfahren zur seines herstellung Download PDF

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Publication number
WO2017194408A3
WO2017194408A3 PCT/EP2017/060783 EP2017060783W WO2017194408A3 WO 2017194408 A3 WO2017194408 A3 WO 2017194408A3 EP 2017060783 W EP2017060783 W EP 2017060783W WO 2017194408 A3 WO2017194408 A3 WO 2017194408A3
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic
production
same
ceramic component
layered ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/060783
Other languages
English (en)
French (fr)
Other versions
WO2017194408A2 (de
Inventor
Thomas Feichtinger
Bernhard Döllgast
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to CN201780042908.0A priority Critical patent/CN109416963A/zh
Priority to US16/300,533 priority patent/US20190287702A1/en
Priority to EP17725880.3A priority patent/EP3455861B1/de
Priority to JP2018558766A priority patent/JP2019523545A/ja
Publication of WO2017194408A2 publication Critical patent/WO2017194408A2/de
Publication of WO2017194408A3 publication Critical patent/WO2017194408A3/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/20—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by pyrolytic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/041—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed with two or more layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

Es wird ein Vielschichtbauelement (100) beschrieben, aufweisend ein inertes keramisches Substrat (1) und wenigstens eine Funktionskeramik (2), wobei die Funktionskeramik (2) vollständig von dem keramischen Substrat (1) umschlossen ist. Ferner wird ein Verfahren zur Herstellung eines Vielschichtbauelements (100) beschrieben.Ferner, das keramische Subtrat eine LTCC Keramik aufweist. Ferner, die Funktionskeramik eine HTCC Keramik Aufweist.
PCT/EP2017/060783 2016-05-10 2017-05-05 Vielschichtbauelement und verfahren zur herstellung eines vielschichtbauelements Ceased WO2017194408A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201780042908.0A CN109416963A (zh) 2016-05-10 2017-05-05 多层式器件和用于制造多层式器件的方法
US16/300,533 US20190287702A1 (en) 2016-05-10 2017-05-05 Multi-Layered Component and Method for Producing a Multi-Layered Component
EP17725880.3A EP3455861B1 (de) 2016-05-10 2017-05-05 Keramisches vielschichtbauelement und verfahren zu seiner herstellung
JP2018558766A JP2019523545A (ja) 2016-05-10 2017-05-05 多層素子及び多層素子を製造するための方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016108604.5A DE102016108604B4 (de) 2016-05-10 2016-05-10 Vielschichtbauelement und Verfahren zur Herstellung eines Vielschichtbauelements
DE102016108604.5 2016-05-10

Publications (2)

Publication Number Publication Date
WO2017194408A2 WO2017194408A2 (de) 2017-11-16
WO2017194408A3 true WO2017194408A3 (de) 2018-01-18

Family

ID=58772847

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/060783 Ceased WO2017194408A2 (de) 2016-05-10 2017-05-05 Vielschichtbauelement und verfahren zur herstellung eines vielschichtbauelements

Country Status (7)

Country Link
US (1) US20190287702A1 (de)
EP (1) EP3455861B1 (de)
JP (1) JP2019523545A (de)
CN (1) CN109416963A (de)
DE (1) DE102016108604B4 (de)
TW (1) TW201808625A (de)
WO (1) WO2017194408A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023272647A1 (zh) * 2021-06-30 2023-01-05 深南电路股份有限公司 埋入式电子元件及其制作方法、电压调节模块
CN113823889A (zh) * 2021-10-15 2021-12-21 深圳振华富电子有限公司 一种抑制器及其制备方法
DE102022121865A1 (de) 2022-08-30 2024-02-29 Tdk Electronics Ag Monolithisches Funktionskeramikelement und Verfahren zur Herstellung einer Kontaktierung für eine Funktionskeramik

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661882A (en) * 1995-06-30 1997-09-02 Ferro Corporation Method of integrating electronic components into electronic circuit structures made using LTCC tape
EP1369402A1 (de) * 2002-06-04 2003-12-10 E. I. du Pont de Nemours and Company Schichtzusammensetzung und Verfahren zum Zwangssintern einer Verbundkeramik bei tiefer Temperatur
DE102007051075A1 (de) * 2007-10-17 2009-04-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aktorisch wirksames und/oder sensitives Element, Verfahren zu seiner Herstellung sowie seine Verwendung
EP2362938A1 (de) * 2008-11-14 2011-09-07 Epcos AG Sensorelement und prozess zum zusammenbau eines sensorelements
DE102012110849A1 (de) * 2012-11-12 2014-05-15 Epcos Ag Temperaturfühler und Verfahren zur Herstellung eines Temperaturfühlers

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632378B2 (ja) * 1985-06-14 1994-04-27 株式会社村田製作所 電子部品内蔵多層セラミック基板
JP2559527Y2 (ja) * 1992-03-03 1998-01-19 株式会社村田製作所 サーミスタ素子
JPH09326303A (ja) * 1996-06-03 1997-12-16 Soshin Denki Kk チップ部品
DE19931056B4 (de) * 1999-07-06 2005-05-19 Epcos Ag Vielschichtvaristor niedriger Kapazität
JP2002184609A (ja) * 2000-12-14 2002-06-28 Murata Mfg Co Ltd 積層型バリスタ
JP2003332741A (ja) * 2002-05-14 2003-11-21 Murata Mfg Co Ltd セラミック多層基板の製造方法
US7416630B2 (en) * 2003-11-24 2008-08-26 Northrop Grumman Corporation Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
JP4071204B2 (ja) * 2004-02-27 2008-04-02 Ｔｄｋ株式会社 多層セラミック基板の製造方法
JP4329762B2 (ja) * 2004-09-13 2009-09-09 株式会社村田製作所 チップ型電子部品内蔵型多層基板
DE102005037456B4 (de) * 2005-08-01 2007-10-25 Technische Universität Ilmenau Verfahren zur Herstellung eines mehrlagigen Keramikverbundes
WO2007058438A1 (en) * 2005-11-18 2007-05-24 Amosense Co., Ltd. Electronic parts packages
DE102006000935B4 (de) * 2006-01-05 2016-03-10 Epcos Ag Monolithisches keramisches Bauelement und Verfahren zur Herstellung
JP2008227139A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 静電気対策部品およびこれを用いた発光ダイオードモジュール
JP4247581B2 (ja) * 2007-05-28 2009-04-02 株式会社村田製作所 Ｅｓｄ保護デバイス
KR101283521B1 (ko) * 2008-11-26 2013-07-15 가부시키가이샤 무라타 세이사쿠쇼 Ｅｓｄ 보호 디바이스 및 그 제조방법
DE102010001791A1 (de) * 2009-02-16 2010-09-30 Ledon Lighting Jennersdorf Gmbh LED-Baueinheit
WO2011099385A1 (ja) * 2010-02-15 2011-08-18 株式会社 村田製作所 Ｅｓｄ保護装置
DE102010036270B4 (de) * 2010-09-03 2018-10-11 Epcos Ag Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements
JP2012204711A (ja) * 2011-03-28 2012-10-22 Panasonic Corp セラミック多層基板とセラミック多層基板の製造方法
DE102011113496A1 (de) * 2011-09-15 2013-03-21 Epcos Ag Vielschichtbauelement und Verfahren zu dessen Herstellung
JP2013080694A (ja) * 2011-09-22 2013-05-02 Tdk Corp 静電気対策素子
CN204376195U (zh) * 2012-03-28 2015-06-03 株式会社村田制作所 Esd保护装置
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
CN103398797B (zh) * 2013-08-16 2016-11-09 广东爱晟电子科技有限公司 热敏电阻温度传感器及其制作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661882A (en) * 1995-06-30 1997-09-02 Ferro Corporation Method of integrating electronic components into electronic circuit structures made using LTCC tape
EP1369402A1 (de) * 2002-06-04 2003-12-10 E. I. du Pont de Nemours and Company Schichtzusammensetzung und Verfahren zum Zwangssintern einer Verbundkeramik bei tiefer Temperatur
DE102007051075A1 (de) * 2007-10-17 2009-04-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Aktorisch wirksames und/oder sensitives Element, Verfahren zu seiner Herstellung sowie seine Verwendung
EP2362938A1 (de) * 2008-11-14 2011-09-07 Epcos AG Sensorelement und prozess zum zusammenbau eines sensorelements
DE102012110849A1 (de) * 2012-11-12 2014-05-15 Epcos Ag Temperaturfühler und Verfahren zur Herstellung eines Temperaturfühlers

Also Published As

Publication number Publication date
EP3455861A2 (de) 2019-03-20
WO2017194408A2 (de) 2017-11-16
EP3455861B1 (de) 2025-07-16
CN109416963A (zh) 2019-03-01
TW201808625A (zh) 2018-03-16
EP3455861C0 (de) 2025-07-16
US20190287702A1 (en) 2019-09-19
DE102016108604B4 (de) 2025-08-07
JP2019523545A (ja) 2019-08-22
DE102016108604A1 (de) 2017-11-16

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