WO2017196150A1 - Contacteur et dispositif électronique le comportant - Google Patents

Contacteur et dispositif électronique le comportant Download PDF

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Publication number
WO2017196150A1
WO2017196150A1 PCT/KR2017/004988 KR2017004988W WO2017196150A1 WO 2017196150 A1 WO2017196150 A1 WO 2017196150A1 KR 2017004988 W KR2017004988 W KR 2017004988W WO 2017196150 A1 WO2017196150 A1 WO 2017196150A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
layer
conductive
contactor
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/004988
Other languages
English (en)
Korean (ko)
Inventor
김대겸
조승훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Moda Innochips Co Ltd
Original Assignee
Moda Innochips Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160098568A external-priority patent/KR101842212B1/ko
Application filed by Moda Innochips Co Ltd filed Critical Moda Innochips Co Ltd
Publication of WO2017196150A1 publication Critical patent/WO2017196150A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/14—Protection against electric or thermal overload
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to a contactor, and more particularly, to a contactor and an electronic device having the same, which can prevent a user from being shocked by leakage current through an electronic device using a charger or a transformer.
  • Electronic devices having a multifunction are integrated with various components according to their functions.
  • the electronic device is provided with an antenna capable of receiving various frequency bands, such as a wireless LAN, a Bluetooth, and a Global Positioning System (GPS). It may be installed in a case constituting the electronic device. Therefore, a contactor for electrical connection is provided between the antenna installed in the case and the internal circuit board of the electronic device.
  • GPS Global Positioning System
  • static electricity having a high voltage may be instantaneously introduced through the external metal case, and the static electricity may be introduced into the internal circuit through the contactor to damage the internal circuit.
  • a leakage current is generated by charging an electronic device using a metal case with a non-genuine charger or a defective charger using a low quality device. This leakage current is transmitted to the ground terminal of the electronic device, and again from the ground terminal to the metal case, the user in contact with the metal case may be electrocuted. As a result, when an electronic device is used while charging with a non-genuine charger to an electronic device using a metal case, an electric shock may occur.
  • the present invention provides a contactor provided in an electronic device that can prevent an electric shock of a user due to leakage current.
  • the present invention provides a contactor capable of preventing an electric shock of a user and at the same time protecting an internal circuit from an overvoltage applied from the outside.
  • the present invention provides a contactor including a composite protection unit that is not dielectrically broken by an overvoltage such as an electrostatic discharge (ESD).
  • ESD electrostatic discharge
  • the present invention provides a contactor that can be transmitted by minimizing attenuation of a communication signal flowing from the outside.
  • a contactor is a contactor provided between a conductor that a user of an electronic device can contact and an internal circuit of the electronic device, the contactor being in contact with the conductor; A composite protection unit insulated from the contact unit and blocking leakage current from the internal circuit; An extension part electrically connected to the contact part and extending along the composite protection part; And a mounting part in which the complex protection part and the extension part are mounted.
  • the extension part may be manufactured integrally with the contact part or combined with the contact part.
  • a buffer member further provided between the contact portion and the composite protective part.
  • the extension part is made integral with the shock absorbing member or is coupled to the shock absorbing member.
  • the contact part may include any one of a metal, a conductive rubber, a conductive silicon, an elastic body having a conductive lead inserted therein, and an elastic body whose surface is coated or bonded with a conductor.
  • the metal contact portion includes a support provided on the composite protective part, a contact part spaced apart from the support part to contact the conductor, and a connection part provided between one end of the support part and the contact part.
  • the complex protection unit bypasses a transient voltage applied from the outside through the conductor through the internal circuit, blocks a leakage current through the internal circuit, and passes a communication signal.
  • the composite protection unit is a laminate in which a predetermined sheet is stacked, an overvoltage protection unit and a capacitor unit provided in the stack, and are provided outside the laminate and connected to the overvoltage protection unit and the capacitor unit, and are mounted in the internal circuit. It includes an external electrode.
  • the apparatus may further include a dummy electrode formed outside the composite protective part between the composite protective part and the extension part.
  • It further includes a fastening protrusion and a fastening groove formed on the contact surface of the composite protection portion and the extension, respectively.
  • the external electrode is formed on one surface of the stack, and is connected to the overvoltage protection unit and the capacitor unit through a connection electrode formed in the stack.
  • the mounting part includes an insulating layer, a conductive pad formed on one surface of the insulating layer, and a conductive pad on which the composite protective part and the extension part are mounted, and a conductive layer formed on the other surface of the insulating layer and mounted on the internal circuit. .
  • the conductive pad may include a first conductive pad on which the first external electrode of the composite protective part is mounted, and a second conductive pad on which the second external electrode and the extension of the composite protective part are respectively mounted.
  • a conductive via is formed in the insulating layer and connects the first conductive pad and the conductive layer.
  • an electronic device includes a conductor contactable by a user and an internal circuit, and a contactor is provided between the contactor, the contactor including: a contact unit capable of contacting the conductor; A composite protection unit insulated from the contact unit and blocking leakage current from the internal circuit; An extension part electrically connected to the contact part and extending along the composite protection part; And a mounting part on which one side of the composite protection part and the extension part is mounted, and the other side is mounted to the internal circuit, wherein the contact part and the composite protection part are electrically connected to each other through the extension part and the mounting part and the internal circuit.
  • One region of the internal circuit is connected to the ground terminal.
  • the mounting part may include an insulating layer, a conductive pad formed on one surface of the insulating layer, and a conductive pad on which the composite protective part and the extension part are mounted, a conductive layer formed on the other surface of the insulating layer and mounted on the internal circuit, A conductive via formed in the insulating layer and connecting at least a portion of the conductive pad to the conductive layer.
  • the contactor includes a contact part in contact with a conductor, a composite protection part for blocking leakage current, a connection part connected to the contact part, and a mounting part in which the connection part and the composite protection part are mounted. Is provided between the contactable conductor and the internal circuitry inside the electronic device.
  • the contact portion and the composite protection portion are not electrically connected directly, but are indirectly connected through the connection portion and the mounting portion.
  • leakage current that can be conducted from the internal circuit to the conductor is cut off, and an overvoltage such as ESD applied from the outside is bypassed to the ground terminal of the internal circuit through the contact portion, the connection portion, the mounting portion, and the composite protection portion.
  • the composite protection unit according to the embodiments of the present invention includes an overvoltage protection unit, and the overvoltage protection unit is made of a porous structure to flow the current through the micropores to bypass the incoming ESD to the ground terminal to maintain the insulation state of the device have. Therefore, the leakage current can be continuously interrupted and the ESD voltage applied from the outside can be bypassed to the ground terminal.
  • the attenuation of the signal may be reduced or minimized.
  • FIG 1 and 2 are a perspective view and a disassembled perspective view of the contactor according to the first embodiment of the present invention.
  • 3 and 4 are cross-sectional views taken along the line A-A 'and line B-B' of FIG.
  • FIG. 5 is a cross-sectional view of a contactor provided between a conductor and an internal circuit according to a first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view according to an example of the composite protective part of the contactor according to the first embodiment of the present invention.
  • 7 to 9 is a partial perspective view, bottom view and one side cross-sectional view of a contactor according to a second embodiment of the present invention.
  • FIG. 12 and 13 are cross-sectional views taken along the X and Y directions of FIG. 10.
  • FIG. 14 and 15 are exploded cross-sectional view and a combined perspective view of a contactor according to a fourth embodiment of the present invention.
  • 16 is a cross-sectional view of the composite protective part of the contactor according to the fourth embodiment of the present invention.
  • 17 and 18 are an exploded perspective view and a combined perspective view of a contactor according to a fifth embodiment of the present invention.
  • 19 and 20 are a perspective view and a cross-sectional view of the contact unit according to another embodiment of the contactor according to the embodiment of the present invention.
  • 21 to 23 are exploded perspective and side views of a contactor according to a sixth embodiment of the present invention.
  • 24 is a side view of a contactor provided between a conductor and an internal circuit according to a sixth embodiment of the present invention.
  • 25 is a schematic cross-sectional view of an overvoltage protection layer of a composite protection part of a first embodiment of the present invention.
  • 26 is a cross-sectional view of the composite protective unit according to the second embodiment of the present invention.
  • 27 is a cross-sectional view of the composite protective part according to the third embodiment of the present invention.
  • 29 and 30 are cross-sectional views and cross-sectional photographs of the overvoltage protection unit of the composite protection unit according to embodiments of the present invention.
  • FIG. 1 is a perspective view of the coupling of the contactor according to the first embodiment of the present invention
  • Figure 2 is an exploded perspective view
  • 3 is a cross-sectional view taken along the line AA ′ of FIG. 1
  • FIG. 4 is a cross-sectional view taken along the line B-B ′ of FIG. 1.
  • 5 is a cross-sectional view in which a contactor according to a first embodiment of the present invention is provided between a conductor and an internal circuit.
  • Figure 6 is a cross-sectional view according to an example of the composite protective part of the contactor according to the first embodiment of the present invention.
  • the contactor according to the first embodiment of the present invention may be insulated from the contact portion 1000 and the contact portion 1000 in which at least one region is in contact with the conductor 10.
  • the composite protection unit 2000 is provided below the () and blocks the leakage current, and the extension portion 3000 is formed in one region is connected to the contact portion 1000 and in contact with the side surface of the composite protection unit 2000 extending downward And a mounting part 4000 provided below the composite protection part 2000 and on which the extension part 3000 and the composite protection part 2000 are mounted.
  • Such a contactor may be provided between the conductor 10 that is provided outside the electronic device and can be contacted by the user and the internal circuit 20 that is provided inside the electronic device and performs various functions of the electronic device. That is, the contact portion 1000 may be in contact with the conductor 10 and the mounting portion 4000 may be mounted on the internal circuit 20.
  • the conductor 10 may include at least a portion of a case forming the overall appearance of the electronic device. That is, the edge of the case may be formed of a conductive material such as metal to form the conductor 10, and the remainder except for the screen display unit on the front surface may be formed of a conductive material such as metal to form the conductor 10. And, the conductor 10, that is, at least a part of the case may function as an antenna that can communicate with the outside as needed. That is, the electronic device may not be provided with a separate antenna. Of course, the electronic device may be provided with a separate antenna and at least a part of the case may be formed of the conductor 10.
  • the internal circuit 20 includes a printed circuit board (PCB) on which a plurality of passive elements, active elements, etc., which are provided for performing various functions of the electronic device, is provided, and at least one ground terminal has a ground terminal. Can be prepared.
  • the internal circuit 20 may include a ground terminal on which the mounting unit 4000 is mounted and connected to at least a portion of the mounting unit 4000.
  • the contact part 1000 may be made of a material having an elastic force so as to alleviate the impact and including a conductive material.
  • the contact part 1000 may have a clip shape as illustrated in FIGS. 1 and 2.
  • the contact part 1000 is provided on the support 1100 provided on the composite protection part 2000, and is disposed above the support 1100 so as to face the conductor 10 and at least a part of the conductor 10. It may include a contact portion 1200 that can be in contact with the support portion 1100 and the connection portion 1300 is provided between the side of the support portion 1100 and one side of the contact portion 1200 and have an elastic force. Therefore, the height of the contact part 1000 may be higher than the height of the composite protection part 2000.
  • the support part 1100 may be provided on an upper surface of the composite protection part 2000. Since the support part 1100 is provided on the upper surface of the composite protection part 2000, the support part 1100, the connection part 1300, and the extension part 3000 may be supported.
  • the support 1100 may be provided in a plate shape having a predetermined thickness, for example, may be provided in a rectangular plate shape having a predetermined thickness.
  • the support part 1100 may be provided to have the same width as the upper surface of the composite protection part 2000. That is, the width of the support part 1100 is equal to the width of the upper surface of the composite protection part 2000 such that the side surface of the composite protection part 2000 is closely packed and wrapped by the extension part 3000 formed at the edge of the support part 1100. It can be formed in width.
  • the support 1100 may be provided shorter than the length of the upper surface of the composite protection unit 2000. That is, the support part 1100 may be formed to have a length shorter than the length of the composite protection part 2000 so as not to contact the external electrodes 2510, 2520 and 2500 of the composite protection part 2000. At this time, when the connection part 1300 is contracted by the elastic force, the support part 1100 is shorter than the length of the compound protection part 2000 so that the connection part 1300 does not come into contact with the external electrode 2500 of the composite protection part 2000. It can be formed as. Meanwhile, a coupling member (not shown) may be provided between the support part 1100 and the composite protection part 2000 to couple the support part 1100 and the composite protection part 2000. As the coupling member, for example, an adhesive tape, an adhesive or the like can be used. That is, the support 1100 may be adhered to the upper surface of the composite protection part 2000 by an adhesive member such as an adhesive tape or an adhesive.
  • an adhesive member such as an adhesive tape or an adhesive.
  • One end of the contact portion 1200 is connected to the connection portion 1300, and extends in one direction from the connection portion 1300, and a portion thereof extends to be inclined upward, for example, upwardly toward the conductor 10 to contact the conductor 10.
  • the region adjacent to the other end of the contact portion 1200 may have a shape having a curvature convex in the direction in which the conductor 10 is located.
  • the contact portion 1200 may be horizontally formed to a predetermined length and formed to be inclined upward from the predetermined length, and then be formed to be inclined downward to a predetermined length again.
  • an area in contact with the conductor 10 of the contact portion 1200 may have a circular shape such as an ellipse, a semicircle, and the like. That is, the region of the contact portion 1200 may be a shape having a bent portion in which a peripheral region located far from the connection portion 1300 or including the other end of the contact portion 1200 is bent upwards, and the bent portion is the conductor 10. It is installed to be in contact with.
  • connection part 1300 is formed to connect one end of the support part 1100 and one end of the contact part 1200, and may have a curvature.
  • the circuit board 20 is pressed in the direction in which the circuit board 20 is located, and when the external force is released, the connection part 1300 has an elastic force that is restored to its original state. Therefore, the contact part 1000 may be formed of a metal material having at least the connection part 1300 having an elastic force.
  • the contact unit 1000 may be formed to be in contact with the conductor 10 that the user can contact. That is, the contact unit 1000 may be provided to be in contact with the metal case, or may be in contact with the conductor 10 serving as an antenna for transmitting a communication signal to the outside in addition to the case.
  • the metal case can also function as an antenna.
  • the complex protection unit 2000 may bypass a high voltage such as an ESD applied from the outside to the ground terminal of the internal circuit 20, and cut off a leakage current from the internal circuit 20.
  • the complex protection unit 2000 may have an insulating state below a predetermined voltage and may be electrically conductive at a voltage above a predetermined voltage.
  • the composite protection unit 2000 may be formed of a varistor, a suppressor, a diode, and the like that are conducted at a predetermined voltage or more.
  • the voltage for conducting the composite protection unit 2000 that is, the breakdown voltage or the discharge start voltage may be higher than the external rated voltage and lower than the dielectric breakdown voltage of the composite protection unit 2000.
  • the composite protection unit 2000 may conduct the applied overvoltage to the ground terminal of the internal circuit 20.
  • the complex protection unit 2000 may further include a capacitor or the like for transmitting a communication signal.
  • FIG. 6 is a cross-sectional view of a suppressor type composite protection unit 2000, and may include an overvoltage protection unit 2300 and at least one capacitor unit 2200 and 2400.
  • the composite protection unit 2000 may be made of not only a suppressor but also a varistor. That is, a varistor having at least two internal electrodes provided between the varistor materials may be used as the composite protection part 2000.
  • the composite protection unit 2000 may be further provided by further including a capacitor.
  • the complex protection unit 2000 may be provided on an internal circuit (eg, a PCB) 20 of the electronic device as shown in FIG. 3. That is, the composite protection unit 2000 may have one side mounted in the first mounting region 21 of the internal circuit 20 and the other side mounted in the second mounting region 22 of the internal circuit 20.
  • the first external electrode 2510 may be mounted on the first mounting region 21, and the second external electrode 2520 may be mounted on the second mounting region 22.
  • a more detailed description of the composite protection unit 2200 will be described later.
  • the composite protection unit 2000 may be provided between the conductor 10 and the internal circuit 20 to block the leakage current transmitted from the internal circuit 20. Therefore, the electric shock of the user by the leakage current can be prevented.
  • an overvoltage such as an ESD may be bypassed to the ground terminal, and the insulation may not be broken by the overvoltage, so that the leakage current can be continuously interrupted. That is, the composite protection unit 2000 according to the present invention maintains an insulation state below the discharge start voltage to cut off the leakage current applied from the internal circuit 20, and maintains a conductive state at an overvoltage above the discharge start voltage to prevent the The overvoltage applied to the electronic device can be bypassed to the ground terminal.
  • the extension part 3000 may be provided on at least one side of the contact part 1000 to extend in the mounting part 4000 direction, that is, the downward direction. That is, the extension part 3000 may be provided at the center of both edge portions of the support part 1100 and extend downward.
  • the extension part 3000 may be in contact with the side surface of the composite protection part 2000. That is, the support part 1100 and the extension part 3000 of the contact part 1000 may be formed to surround the top and side surfaces of the composite protection part 2000.
  • the extension part 3000 may be formed integrally with the contact part 1000.
  • the extension part 3000 may extend from both sides of the support part 1100 in the longitudinal direction, and may be bent downward from both sides of the support part 1100 to be in contact with the side surface of the composite protection part 2000.
  • the extension part 3000 may be manufactured separately from the contact part 1000 and may be coupled by a coupling member or the like.
  • the coupling member since the extension part 3000 must be electrically connected to the contact part 1000, the coupling member may include a conductive adhesive, soldering, or the like.
  • a coupling member may be provided between the contact part 1000 and the extension part 3000 and the composite protection part 2000 to couple the contact part 1000 and the extension part 3000 and the composite protection part 2000.
  • the contact part 1000, the extension part 3000, and the composite protective part 2000 may be adhered to each other using an adhesive member such as a double-sided adhesive tape, an adhesive, solder, or the like.
  • the extension part 3000 may be formed of the same material as the contact part 1000, and may be formed of a material including a metal material such as copper (Cu).
  • the extension part 3000 may be provided on at least one region of the contact part 1000, for example, a side surface of the support part 1100, and may extend in a direction of the mounting part 4000, that is, downward. Since the extension part 3000 and the contact part 1000 are electrically connected, the contact part 1000 may be connected to the mounting part 4000 through the extension part 3000. That is, the contact unit 1000 may not be electrically connected to the composite protection unit 2000 directly, but may be electrically indirectly connected through the extension 3000 and the mounting unit 4000.
  • the mounting part 4000 may be provided below the composite protection part 2000, and the composite protection part 2000 and the extension part 3000 may be mounted.
  • the mounting part 4000 in which the complex protection part 2000 and the extension part 3000 are mounted may be mounted on the internal circuit 20.
  • the mounting portion 4000 may be provided in a plate shape having a predetermined thickness, and a conductive layer may be formed on at least one surface thereof.
  • the mounting portion 4000 may include an insulating layer 4100 provided in a plate shape having a predetermined thickness, a conductive pad 4200 formed on one surface of the insulating layer 4100, and the other surface of the insulating layer 4100.
  • the formed conductive layer 4300 may be included.
  • the semiconductor device may further include a conductive via 4400 formed in the insulating layer 4100 to connect the conductive pad 4200 and the conductive layer 4300.
  • the insulating layer 4100 may be provided in a substantially rectangular plate shape having a predetermined thickness.
  • the insulating layer 4100 may be provided larger than the size of the composite protective part 2000. That is, the length in the X direction may be longer than the length of the composite protection part 2000, and the width in the Y direction may be greater than the width of the composite protection part 2000.
  • the insulating layer 4100 may be formed of, for example, a PCB material constituting the internal circuit 20, for example, a resin.
  • the conductive pad 4200 is formed on one surface of the insulating layer 4100. That is, the conductive pad 4200 is formed on one surface of the insulating layer 4100 facing the composite protective part 2000 and the extension part 3000.
  • the conductive pad 4200 may be formed at a predetermined height on one surface of the insulating layer 4100, or may be formed at a predetermined depth in the insulating layer 4100 so that an upper surface thereof may be exposed on the insulating layer 4100.
  • the conductive pad 4200 may be mounted by contacting the first and second external electrodes 2510 and 2520 and the extension 3000 of the composite protection part 2000, respectively.
  • the conductive pad 4200 extends with the first conductive pad 4210 on which the first external electrode 2510 of the composite protection part 2000 is mounted, and the second external electrode 2520 of the composite protection part 2000.
  • the unit 3000 may include a second conductive pad 4220 on which the unit 3000 is mounted.
  • the second conductive pad 4220 may have a larger area than the first conductive pad 4210 because the second external electrode 2520 and the extension 3000 must be mounted.
  • the composite protection part 2000 and the extension part 3000 may be mounted on the conductive pad 4200 by soldering, a conductive adhesive, or the like.
  • the conductive layer 4300 may be formed on the other surface of the insulating layer 4100 on which the conductive pad 4220 is not formed.
  • the conductive layer 4300 may be formed at a predetermined height on the other surface of the insulating layer 4100, or may be formed at a predetermined depth in the insulating layer 4100 so that the surface thereof is exposed to the other surface of the insulating layer 4100.
  • the conductive layer 4300 is in contact with the internal circuit 20 and serves to connect the internal circuit 20 and the contactor.
  • the conductive layer 4300 may be mounted on the internal circuit 20 using a conductive adhesive or the like.
  • the conductive via 4400 may be formed in the insulating layer 4100 in at least partially overlapping the first conductive pad 4210. That is, the conductive via 4400 is formed in a predetermined region of the insulating layer 4100 and is formed by filling a conductive material. The first conductive pad 4210 and the conductive layer 4300 are electrically connected by the conductive via 4400.
  • the extension part 3000 and the complex protection part 2000 connected to the contact part 1000 are mounted on the mounting part 4000.
  • the mounting unit 4000 on which the extension 3000 and the composite protection unit 2000 are mounted may be mounted on the internal circuit 20. Therefore, the contact unit 1000 and the composite protection unit 2000 may be connected to the internal circuit 20 through the mounting unit 4000. Accordingly, the contactor is connected between the internal circuit 20 and the conductor 10, such as a case of an electronic device that can function as an antenna, for example, and transmits a communication signal supplied from the outside to the internal circuit 20.
  • An overvoltage, such as an ESD that may be applied from the outside may be bypassed to the ground terminal of the internal circuit 20.
  • one region of the composite protection unit 2000 is mounted on the first conductive pad 4210 of the mounting unit 4000, and the second conductive pad 4220 is provided.
  • An extension part 3000 electrically connected to the other area and the contact part 1000 of the complex protection part 2000 is mounted on the mounting surface. Therefore, the contact part 1000 and the composite protection part 2000 may be electrically indirectly connected through the extension part 3000 and the mounting part 4000 instead of being electrically connected directly.
  • the mounting part 4000 may be mounted on the internal circuit 20 and a part of the internal circuit 20 connected to a part of the mounting part 4000 may be connected to the ground terminal.
  • the ESD voltage applied from the outside is transferred to the second conductive pad 4220 through the contact part 1000 and the extension part 3000 and then the other side of the composite protection part 2000 connected to the second conductive pad 4220.
  • the second external electrode 2520 may be transferred to one side of the composite protection unit 2000 through the overvoltage protection unit 2300 inside the composite protection unit 2000, for example, the first external electrode 2510. And a bypass to the ground terminal connected to the first conductive pad 4210.
  • FIG. 7 to 9 are partial views of a contactor according to a second embodiment of the present invention.
  • FIG. 7 is a perspective view illustrating an outer shape of the composite protective part
  • FIG. 8 is a bottom view.
  • 9 is sectional drawing of one side of the contactor in the Y direction.
  • the composite protection part 2000 further includes dummy electrodes 2610, 2620; 2600 formed on the other side where the first and second external electrodes 2510 and 2520 are not formed. can do. That is, the first and second external electrodes 2510 and 2520 are formed on the first and second side surfaces of the laminate 2100 that face each other, and the dummy electrode 2600 is formed of the first and second external electrodes 2510, 2520 may be formed on the third and fourth side surfaces of the laminate 2100 that are not formed. In this case, the dummy electrode 2600 is not connected to the conductive pattern inside the stack 2100, that is, the internal electrode 200 and the discharge electrode 310, and is formed only on the third and fourth side surfaces of the stack 2100. .
  • the dummy electrode 2600 is formed only on the surface of the stack 2100.
  • the dummy electrode 2600 may be formed at a predetermined width on the third and fourth side surfaces, and may be formed at a predetermined height. That is, the dummy electrode 2600 may be formed at an entire height of the third and fourth side surfaces or may be formed at a partial height.
  • the third and fourth side surfaces on which the dummy electrode 2600 is formed are regions in which the extension part 3000 is in contact with each other. Thus, as shown in FIG. 9, the extension part 3000 may cover the dummy electrode 2600 to surround the composite protection part 2000.
  • a coupling member such as an adhesive or an adhesive tape may be provided between the dummy electrode 2600 and the extension 3000.
  • solder cream may flow between the dummy electrode 2600 and the extension part 3000 to be coupled thereto. That is, a lower portion of the extension part 3000 is soldered to a predetermined height, and a part of the solder cream may flow between the extension part 3000 and the dummy electrode 2600, and accordingly, the extension part 3000 and the dummy electrode ( 2600 may be combined.
  • the contactor may have a height from the contact part 1000 to the extension part 3000 being higher than or equal to the height of the composite protection part 2000, and a part of the contact part 1000.
  • the extension part 3000 may be wrapped while being spaced apart without wrapping or touching the composite protection part 2000. That is, the supporter 1100 of the contactor 1000 may contact the upper surface of the composite protection unit 2000 so that the contactor 1000 may fix the composite protection unit 2000, and the empty space in the contactor 1000. That is, the complex protection part 2000 may be provided in the space formed by the support part 1100 and the extension part 3000.
  • the contactor 1000 and the composite protective part 2000 may be bonded using an adhesive or an adhesive tape, or may be bonded using plating.
  • the adhesive a curing or drying type adhesive can be used.
  • the extension part 3000 and the composite protection part 2000 are mounted on the mounting part 4000.
  • the contact part 1000 may be smaller than or equal to the composite protection part 2000 in the length direction (ie, the X direction), and may be equal to or larger than the composite protection part 2000 in the width direction. That is, the length of the contact portion 1000 may be smaller than the length of the complex protection portion 2000 so that the external electrode 2500 of the composite protection portion 2000 does not contact the contact portion 1000. And the width of the contact portion 1000 may be equal to or wider than the width of the composite protection portion 2000 so that the extension portion 3000 connected to the wrapped around the composite protection portion (2000).
  • the clip type contact part 1000 may use a metal having excellent restoring force and elasticity, for example, copper alloy (phosphor bronze, titanium copper), SUS, and the like, and the surface may be plated with gold, silver, tin, or the like.
  • a metal having excellent restoring force and elasticity for example, copper alloy (phosphor bronze, titanium copper), SUS, and the like
  • the surface may be plated with gold, silver, tin, or the like.
  • at least one surface of the contact part 1000, the extension part 3000, and the composite protection part 2000 may be coated or plated with a conductive material.
  • the conductive material to be coated or plated may include at least one of Sn, Ni, Au, Ag, Pt, Pd, C, Cu, Cr.
  • FIGS. 10 to 13 are diagrams for describing a contactor according to a third embodiment of the present invention. That is, FIGS. 10 and 11 are combined perspective views and separated perspective views of a contactor according to a third embodiment of the present invention, and FIGS. 12 and 13 are cross-sectional views taken along the X and Y directions of FIG. 10.
  • the contactor according to the third embodiment of the present invention is provided with a contact portion 1000 in which one region is in contact with the conductor 10, a lower portion of the contact portion 1000, and a region inside the contactor 1000.
  • It may include an extension portion 3000 that extends to, and a mounting portion 4000 on which the complex protection portion 2000 and the extension portion 3000 are mounted.
  • the third embodiment of the present invention further includes a buffer member 5000 compared to the first and second embodiments of the present invention.
  • the extension 3000 may be provided in contact with at least one region of the buffer member 5000.
  • the extension 3000 may be integrally formed with the shock absorbing member 5000. That is, the extension part 3000 may be formed at a predetermined width from the predetermined region of the side surface of the buffer member 5000 and bend downward. Of course, the extension part 3000 may be manufactured separately from the shock absorbing member 5000 and then coupled to the side surface of the shock absorbing member 5000.
  • the contact portion 1000 and the composite protection portion 2000 are the same as those described in the first and second embodiments of the present invention, the detailed description thereof will be omitted and the shock absorbing member 5000 will be described in detail. Is as follows.
  • the buffer member 5000 may be provided between the support part 1100 of the contact part 1000 and the upper surface of the composite protection part 2000.
  • the extension part 3000 may be extended from the shock absorbing member 5000, and the extension part 3000 may contact the side surface of the composite protection part 2000 and extend downward. That is, the shock absorbing member 5000 is provided to have a predetermined thickness provided between the support 1100 of the contact part 1000 and the upper surface of the composite protection part 2000, and the extension part 3000 is provided to the side at a predetermined width.
  • the side surface of the protection unit 2000 may be in contact with the mounting portion 4000.
  • the buffer member 5000 may be provided in a plate shape having a predetermined thickness, for example, may be provided in a rectangular plate shape having a predetermined thickness.
  • the buffer member 5000 may be provided with the same width as the upper surface of the composite protection part 2000 or a wider width than that. That is, the width of the shock absorbing member 5000 is the width of the upper surface of the complex protection part 2000 so that the side surface of the complex protection part 2000 is tightly wrapped by the mounting part 3200 formed at the edge of the shock absorbing member 5000. It may be formed equal to or wider than.
  • the buffer member 5000 may be provided shorter than the length of the upper surface of the composite protection unit 2000. That is, the buffer member 5000 may be formed to have a length shorter than the length of the composite protection part 2000 so as not to contact the external electrodes 2510, 2520 and 2500 of the composite protection part 2000.
  • the length of the shock absorbing member 5000 may be the same as the length of the composite protection part 2000.
  • a coupling member (not shown) may be provided between the buffer member 5000 and the support part 1100, and between the buffer member 5000 and the composite protective part 2000.
  • the contact portion 1000 and the buffer member 5000 should be electrically connected. Therefore, for example, a conductive adhesive tape, a conductive adhesive, a conductive gasket, or the like may be used as the coupling member between the support 1100 and the buffer member 5000.
  • the buffer member 5000 and the support 1100 may be coupled by soldering.
  • the shock absorbing member 5000 may be provided on the stack 2100 of the complex protection part 2000. Since the stack 2100 is insulating, the shock absorbing member 5000 and the complex protection part 2000 may be electrically conductive. Can be joined by a member. However, since the shock absorbing member 5000 must maintain an insulation state with the composite protection part 2000, the shock absorbing member 5000 and the complex protection part 2000 may be coupled by an insulating coupling member. However, since the complex protection part 2000 and the shock absorbing member 5000 may be coupled by the shock absorbing member 5000 and the side part 3200, a separate coupling member may not be provided therebetween.
  • the buffer member 5000 is provided between the contact portion 1000 and the composite protection part 2000 to prevent the contact part 1000 from being over-compressed, thereby preventing damage to the composite protection part 2000.
  • the buffer member 5000 may be formed of a conductive material.
  • the buffer member 5000 may be formed of a conductive metal such as SUS, copper, phosphor bronze, beryllium copper, titanium copper, or the like and may be formed by plating a metal on an insulator.
  • the dummy electrode 2600 may be further formed on any one of the third and fourth side surfaces of the composite protection part 2000 in which the external electrode 2500 is not formed. . Therefore, the extension part 3000 extending from the side surface of the buffer member 5000 may be formed in contact with the dummy electrode 2600.
  • Figure 16 is a cross-sectional view of the composite protection.
  • the contactor according to the fourth embodiment of the present invention is provided with a contact portion 1000 in which one region is in contact with the conductor 10, a lower portion of the contact portion 1000, and a region is mounted.
  • the composite protection part 2000 which contacts the part 4000, the buffer member 5000 provided between the contact part 1000 and the composite protection part 2000, and extends downward from the predetermined area
  • the extension part 3000 may be formed, and the mounting part 4000 may be provided below the composite protection part 2000 to mount the composite protection part 2000 and the extension part 3000. Of course, the extension part 3000 may extend from one region of the contact part 1000.
  • the contact part 1000 may include a support part 1100, a contact part 1200, a connection part 1300, and an intermediate part 1400.
  • the complex protection part 2000 includes first and second external electrodes 2510 and 2520 formed on a lower surface of the laminate 2100, and a connection electrode (eg, an inside of the laminate 2100). 2710, 2720, and 2700 are formed to connect conductors inside the stack 2100, that is, the internal electrode 200 and the discharge electrode 310, to the first and second external electrodes 2510 and 2520.
  • the contactor according to the fourth embodiment of the present invention will be described below with reference to contents not provided in the first to third embodiments of the present invention.
  • the contact part 1000 may be provided on the support part 1100 having a flat plate shape, spaced apart from the support part 1100, provided at an upper side thereof, and contacted with the conductor 10, one end of the support part 1100, and the contact part 1200.
  • a connection part 1300 provided between the connection part 1300 and the intermediate part 1400 provided between the support part 1100 and the contact part 1200.
  • the support part 1100, the contact part 1200, and the connection part 1300 may be connected to the support part 1100, the contact part 1200, and the connection part 1300 described in the first to third embodiments, in particular, the third embodiment of the present invention. Since the shape and content are the same, a detailed description thereof will be omitted. That is, the fourth embodiment of the present invention is provided between the support part 1100 and the contact part 1200 in the contact part 1000 formed of the support part 1100, the contact part 1200, and the connection part 1300 described in the third embodiment.
  • the intermediate portion 1400 further includes.
  • the intermediate part 1400 may be provided between the support part 1110 and the contact part 1200 and may have a length shorter than that of the contact part 1200.
  • the intermediate portion 1400 may be provided in a shape having a predetermined bend. For example, it may have a structure extending from the other end of the support 1100 to the upper side at a predetermined angle and then extended to the lower side at a predetermined angle and then again to the upper side at a predetermined angle.
  • connection part 1300 and the contact part 1200 are formed from one end of the support part 1100, and the first upper extension part 1410 in the direction in which the connection part 1300 is formed from the other end of the support part 1100 opposite to one end,
  • the lower extension part 1420 and the second upper extension part 1430 may be formed to provide an intermediate part 1400.
  • the structure extending upward from the other end of the support 1100 of the intermediate portion 1400 and extending downward, that is, the first upper extension portion 1410 and the lower extension portion 1420 are the conductors 10 of the contact portion 1200. It may correspond to the lower side of the curved area in contact with the.
  • the first upper extension portion 1410 and the lower extension portion 1420 of the intermediate portion 1400 may be accommodated inside the upper curved area of the intermediate portion 1400.
  • the intermediate part 1400 may be spaced apart from the support part 1100 and the contact part 1200 when no pressure is applied, and may be in contact with at least one of the support part 1100 and the contact part 1200 when the pressure is applied. That is, when pressure is applied to the contact portion 1200 and the contact portion 1200 moves in the direction of the support portion 1100, the intermediate portion 1400 between the support portion 1100 and the contact portion 1200 moves downward while contacting the contact portion 1200.
  • One area may be in contact with the support 1100.
  • at least the first upper extension 1410 of the intermediate portion 1400 may have elasticity.
  • the intermediate unit 1400 may block the movement of the contact unit 1200 without moving. That is, the intermediate part 1400 may be spaced apart from the support part 1100 and the contact part 1200 and contact the contact part 1200 when the contact part 1200 moves in the direction of the support part 1100 to limit the movement of the contact part 1200. have.
  • the intermediate portion 1400 is provided between the contact portion 1200 and the support portion 1100 to maintain a gap between the conductor 10 and the internal circuit 20 and to impart more elastic force to the contact portion 1200.
  • the elastic coupling between the conductor 10 of the contact unit 1000 and the internal circuit 20 may be further improved.
  • the shape of the contact portion 1000 has been described as an example and may be modified in various shapes.
  • the complex protection part 2000 includes at least one capacitor part 2200 and 2400 including a plurality of internal electrodes 200 in the stack 2100 and at least one discharge electrode 310.
  • One overvoltage protection unit 2300 may be provided, and an external electrode 2500 may be provided outside the stack 2100.
  • the external electrode 2500 may be formed to be spaced apart from one surface of the laminate 2100, for example, the bottom surface of the laminate 2100, at least partially facing the internal circuit 20. That is, the external electrode 2500 extends downward from two sides of the stack 2100 and may be formed on the bottom surface, and may be formed only on the bottom surface of the stack 2100, according to a fourth embodiment of the present invention.
  • connection electrodes 2710 and 2720 are connected to the internal electrode 200 and the discharge electrode 310 and drawn out to the outside, and the outside of the lower side is connected through the connection electrodes 2710 and 2720. It may be connected to the electrodes 2510 and 2520.
  • connection electrodes 2710 and 2720 may be formed inwardly spaced apart from an edge of the stack 2100 so as not to be exposed to an outer side surface of the stack 2100.
  • a via hole may be formed in a predetermined region of the stack 2100, and then the via hole may be filled with a conductive material.
  • the plurality of sheets 100 having openings formed in a predetermined region may be stacked, and then the openings may be filled in the plating process to form the connection electrodes 2700.
  • the electrode 2500 may be formed.
  • productivity may be improved by forming the external electrode 2500 under the stack 2100 and connecting the internal electrode 200 and the discharge electrode 310 using the connection electrode 2700.
  • the external electrode 2500 is formed not only on the side surface of the stack 2100 but also on the lower surface and the upper surface, and a part of the external electrode 2500 formed on the upper surface is contacted with the contact portion 1000. Since it is necessary to insulate, the shape and size of the contactor 1000 are limited, but the fourth embodiment is not limited in shape and size of the contactor 1000. Therefore, the fourth embodiment can facilitate the coupling process of the contactor 1000 and the composite protection unit 2000 compared to the first to third embodiments, thereby improving productivity.
  • the fourth embodiment of the present invention may also be mounted on the internal circuit 20 in which the first and second mounting regions 21 and 22 are separated. That is, the lower surface of the extension 3000 connected to the second external electrode 2520 and the shock absorbing member 5000 is mounted on the first mounting region 21 and the second mounting region 22 is disposed on the first mounting region 21. Can be mounted on the
  • the contact part 1000 includes a support part 1100, a contact part 1200, a connection part 1300, and an intermediate part 1400, and a region of the contact part 1000, that is, a support part.
  • An extension part 3000 is provided on the side of the 1100, and the fixing protrusion 3100 is formed on the extension part 3000, and a fixing groove 2800 is formed on the side of the composite protection part 2000. .
  • the fixing protrusion 3100 of the extension part 3000 may be inserted into the fixing groove 2800 of the composite protection part 2000, and the extension part 3000 may be fastened to the composite protection part 2000. Since the extension part 3000 and the composite protection part 2000 are coupled by the fixing protrusion 3100 and the fixing groove 2800, a coupling member such as an adhesive may be unnecessary. Of course, a coupling member such as an adhesive may be further provided to further solidify the coupling between the contact portion 1000 and the composite protection portion 2000.
  • the complex protection part 2000 may be provided with an external electrode 2500 on the lower surface of the stack 2100 and connected by an internal connection electrode 2700.
  • the fastening method using the fixing protrusion and the fixing groove may be applied to the fourth embodiment of the present invention. That is, the buffer member 5000 is provided between the contact portion 1000 and the composite protection part 2000, the extension portion 3000 is provided from the contact portion 1000 or the buffer member 5000, and the extension portion 3000 is provided.
  • a fixing protrusion 3100 is provided inwardly and a fixing groove 2800 is provided at a side surface of the composite protection unit 2000 to correspond to the fixing protrusion 3100 to the fixing groove 2800.
  • the contactor according to the embodiments of the present invention may be electrically indirectly connected through the extension part 3000 and the mounting part 4000 without the contact part 1000 and the complex protection part 2000 being electrically connected directly.
  • the mounting unit 4000 on which the extension 3000 and the complex protection unit 2000 are mounted may be mounted on the internal circuit 20. Therefore, an overvoltage such as an ESD applied from the outside is applied to the contact portion 1000, the extension portion 3000, the second conductive pad 4220 of the mounting portion 4000, the composite protection portion 2000, and the mounting portion 4000.
  • the first conductive pad 4210, the conductive via 4400, and the conductive layer 4300 may be bypassed to the ground terminal of the internal circuit 20.
  • the overvoltage protection unit 300 of the complex protection unit 2000 is conducted at an overvoltage of a predetermined voltage or more, and the overvoltage may be transmitted through the overvoltage protection unit 300.
  • the composite protection unit 2000 maintains an insulation state under an overvoltage, an electric shock current leaking from the ground terminal may be blocked.
  • the RF signal may be passed by the capacitor units 2000 and 4000 of the complex protection unit 2000.
  • the contact resistance of the contact unit 1000 and the composite protection unit 2000 may be 100M ⁇ or more before PCB mounting and 10 ⁇ or less after PCB mounting. That is, the internal circuit 20 may not be electrically connected before mounting, but may be electrically connected after the internal circuit 20 is mounted.
  • the contact portion 1000 of the present invention may include a conductive rubber, a conductive silicone, an elastic body having a conductive conductor inserted therein, and a gasket having a surface coated or bonded with a conductor.
  • the inside may be made of a non-conductive elastomer and the outside may be coated with a conductive material. That is, a component having conductivity, elasticity, and an extension portion at a side surface thereof may be used as the contact portion 1000 of the present invention.
  • a conductive gasket that can be used as the contact portion 1000 is illustrated in FIGS.
  • the contact part 1000 includes an insulating elastic core 1710 having a through hole 1711 formed therein, and a conductive layer 1720 formed to surround the insulating elastic core 1710. can do.
  • an extension 3000 may be formed on a side surface of the insulating elastic core 1710.
  • the insulating elastic core 1710 has a tube shape having a through hole 1711 formed therein, and the cross section may be formed in a substantially rectangular or circular shape, but may be formed in various shapes without being limited thereto.
  • the through hole 1711 may not be formed in the insulating elastic core 1710.
  • the insulating elastic core 1710 may be formed of silicon, elastic rubber, or the like.
  • the conductive layer 1720 may be formed to surround the insulating elastic core 1710.
  • the conductive layer 1710 may be formed of at least one metal layer, for example, gold, silver, copper, or the like. Meanwhile, the conductive powder may be mixed in the elastic core 1710 without forming the conductive layer 1710.
  • the extension part 3000 may extend downwardly on both side surfaces of the insulating elastic core 1710. In this case, the extension part 3000 may be formed below the through hole 1711. That is, when the insulating elastic core 1710 is contracted by an external force, the shape of the insulating elastic core 1710 may be deformed to both sides of the through hole 1711, so that the shape of the insulating elastic core 1710 is not affected by the extension 3000.
  • the extension part 3000 may be formed below the through hole 1711.
  • a buffer member 5000 may be further formed between the insulating elastic core 1710 on which the conductive layer 1720 is formed and the composite protective part 2000.
  • the extension part 3000 may be formed of the buffer member 5000. It may be formed on the side. That is, even when the conductive gasket is used as the contact portion 1000, the contents described in the embodiments of the present invention may be applied as it is.
  • FIG. 21 is an exploded perspective view of a contactor according to a sixth embodiment of the present invention.
  • 22 is one side view seen in the X direction of FIG. 21, and
  • FIG. 23 is another side view seen in the X direction of FIG. 21.
  • 24 is a cross-sectional view of a contactor provided between a conductor and an internal circuit according to a sixth embodiment of the present invention.
  • a contactor according to an eighth embodiment of the present invention may be insulated from the contact portion 1000 and at least one region in contact with the conductor 10 and the contact portion 1000.
  • the composite protection part 2000 provided below the () and blocking the leakage current, the buffer member 5000 provided between the contact portion 1000 and the composite protection part 2000, and the composite member from the side of the buffer member 5000 It may include an extension 3000 extending downward along the side of the protection unit 2000.
  • the contact portion 1000 may have a shape of a conductive gasket type including an insulating elastic core 1710 having a through hole 1711. That is, the sixth embodiment of the present invention may use the conductive gasket type contact part 1000 instead of the clip type contact part 1000 described in the first to fifth embodiments of the present invention.
  • the composite protection part 2000 includes a stack 2100 in which a plurality of insulating sheets 100 (101 to 111) are stacked, and are provided in the stack 2100 and have a plurality of internal electrodes 200. At least one capacitor unit 2200 and 2400 having 201 to 208, and an overvoltage protection unit 2300 including at least one discharge electrode 310 and 311 and 312 and an overvoltage protection layer 320. can do.
  • the stack 2100 may further include a dummy layer (not shown) having a predetermined thickness in which a conductive layer or the like is not formed.
  • a conductive layer including a plurality of internal electrodes 200 and discharge electrodes 310 may be formed on the insulating sheet 100 selected from the plurality of insulating sheets 100 in the laminate 2100.
  • the first and second capacitor parts 2200 and 4000 may be provided in the stack 2100, and the overvoltage protection part 2300 may be provided therebetween.
  • the laminate 2100 further includes external electrodes 2510, 2520; 2500 formed on two opposite sides of the laminate 2100 and connected to the first and second capacitor parts 2200 and 2400 and the overvoltage protection part 2300. can do.
  • the composite protection unit 2000 may include at least one capacitor unit and at least one overvoltage protection unit.
  • a capacitor may be provided on either the lower side or the upper side of the overvoltage protection unit 2300, and at least one capacitor unit may be provided on the upper side and the lower side of the two or more overvoltage protection units 2300 spaced apart from each other.
  • the overvoltage protection unit 2300 may be provided inside the stack 2100 or outside the stack 2100, and embodiments of the present disclosure will be described in the case of the stack 2100.
  • the overvoltage protection layer 320 is formed between the stack 2100 and the external electrode 2500, and the discharge electrode 310 is stacked on the stack 2100. It may be formed inside.
  • the complex protection unit 2000 may be provided on an internal circuit (eg, a PCB) 20 of the electronic device. That is, the composite protection unit 2000 may have one side contacting the internal circuit 20 and the other side spaced apart from the conductor 10 of the electronic device. Of course, since the contact part 1000 is provided between the conductor 10 and the composite protection part 2000, the other side of the composite protection part 2000 is spaced apart from the contact part 1000, and in some cases, the contact part 1000 is separated from the contact part 1000. Can be contacted. In this way, the composite protection unit 2000 may be provided between the conductor 10 and the internal circuit 20 to block leakage current flowing from the internal circuit 20. Therefore, the electric shock of the user can be prevented.
  • an internal circuit eg, a PCB
  • the composite protection unit 2000 maintains an insulation state below the breakdown voltage or the discharge start voltage to cut off the leakage current flowing from the internal circuit 20, and the conductive state above the breakdown voltage or the discharge start voltage. By maintaining the voltage, the overvoltage applied from the outside into the electronic device is bypassed to the ground terminal.
  • the laminate 2100 is formed by stacking a plurality of insulating sheets 101 to 111;
  • the laminate 2100 has a predetermined length and width, respectively, in one direction (for example, X direction) and the other direction (for example, Y direction) orthogonal thereto, and in the vertical direction (for example, Z direction). It may be provided in a substantially hexahedral shape having a predetermined height.
  • the length in the X direction may be greater than the width in the Y direction and the height in the Z direction, and the width in the Y direction may be the same as or different from the height in the Z direction. If the width (Y direction) and the height (Z direction) are different, the width may be larger or smaller than the height.
  • the ratio of length, width and height may be 2-5: 1: 0.5-1.
  • the lengths of the X, Y, and Z directions may be variously modified according to the internal structure of the electronic device to which the discharge sensing device is connected, the shape of the discharge sensing device, and the like.
  • at least one capacitor part 2200 and 2400 and at least one overvoltage protection part 2300 may be provided in the stack 2100.
  • the plurality of insulating sheets 100 may be formed of a material including at least one of dielectric material powder such as MLCC, BaTiO 3 , BaCO 3 , TiO 2 , Nd 2 O 3 , Bi 2 O 3 , Zn0, and Al 2 O 3 . Can be. Accordingly, the insulating sheet 100 may have a predetermined dielectric constant, for example, 5 to 20,000, preferably 7 to 5000, and more preferably 200 to 3000, depending on the material.
  • the plurality of insulating sheets 100 may all be formed to have the same thickness, and at least one may be formed thicker or thinner than the others. That is, the insulating sheet of the overvoltage protection unit 2300 may be formed to have a different thickness from the insulating sheets of the first and second capacitor units 2200 and 4000, and the overvoltage protection unit 2300 and the first and second capacitors ( The insulating sheet formed between 2200 and 4000 may be formed to have a different thickness from that of other sheets. For example, the thickness of the insulating sheet between the overvoltage protection part 2300 and the first and second capacitor parts 2200 and 4000, that is, the fifth and seventh insulating sheets 105 and 107 may be greater than the overvoltage protection part 2300.
  • the insulating sheets 102 to 104 and 108 to 110 of the first and second capacitors 2200 and 4000 may be formed to have the same thickness, and either one may be thinner or thicker than the other.
  • the capacitance can be adjusted by varying the thickness of any one of the insulating sheets 102 to 104, 108 to 110 of the first and second capacitor portions 2200 and 4000.
  • the insulating sheets 100 may be formed to have a thickness of, for example, 1 ⁇ m to 5000 ⁇ m, and may be formed to a thickness of 2500 ⁇ m or less. In this case, the insulating sheets 100 may be formed to have a thickness that does not break upon application of ESD.
  • the stack 2100 may further include a lower cover layer (not shown) and an upper cover layer (not shown) provided on the lower and upper portions of the first and second capacitor units 2200 and 4000, respectively.
  • the first insulating sheet 101 may function as the lower cover layer and the eleventh insulating sheet 111 may function as the upper cover layer.
  • the lower and upper cover layers may be provided by stacking a plurality of magnetic sheets, and may have the same thickness.
  • a nonmagnetic sheet for example, a glass sheet, may be further formed on the outermost portion of the lower and upper cover layers formed of the magnetic sheet, that is, the lower and upper surfaces.
  • the lower and upper cover layers may be thicker than the insulating sheets therein, that is, the second to tenth insulating sheets 102 to 110. Therefore, when the first and eleventh insulating sheets 101 and 111 function as lower and upper cover layers, they may be thicker than the second to tenth insulating sheets 102 to 110.
  • At least one capacitor part 2200 may be provided in the stack 2100.
  • the first capacitor part 2200 provided below the overvoltage protection part 2300 and the second capacitor part 2400 provided above the overvoltage protection part 2300 may be included.
  • the capacitor parts 220 and 2400 may include at least two internal electrodes and at least two insulating sheets provided therebetween.
  • the first capacitor unit 2200 may include the first to fourth insulating sheets 101 to 104 and the first to fourth internal electrodes 201 to 4 formed on the first to fourth insulating sheets 101 to 104, respectively. 204).
  • the second capacitor part 2400 may include the fifth to eighth internal electrodes 205 to 110 formed on the seventh to tenth insulating sheets 107 to 110 and the seventh to tenth insulating sheets 107 to 110, respectively. 208).
  • the internal electrodes 201 to 208 may be formed to have a thickness of, for example, 1 ⁇ m to 10 ⁇ m.
  • the internal electrodes 201 to 208; 200 are formed such that one side is connected to the external electrodes 2510, 2520; 2500 formed to face each other in the X direction, and the other side is spaced apart from each other.
  • the first, third, fifth, and seventh internal electrodes 201, 203, 205, and 207 are on the first, third, seventh, and ninth insulating sheets 101, 103, 107, and 109. It is formed in each of the predetermined area, one side is connected to the first external electrode 2510 and the other side is formed to be spaced apart from the second external electrode 2520.
  • the second, fourth, sixth, and eighth internal electrodes 202, 204, 206, and 208 are respectively disposed on the second, fourth, eighth, and tenth insulating sheets 102, 104, 108, and 110.
  • the plurality of internal electrodes 200 are alternately connected to any one of the external electrodes 2500 and are formed to overlap a predetermined region with the insulating sheet 100 interposed therebetween.
  • the plurality of internal electrodes 200 are formed in areas of 10% to 95% of the area of each of the insulating sheets 100.
  • the plurality of internal electrodes 200 are formed to overlap with an area of 10% to 95% of the area of each of these electrodes.
  • the plurality of internal electrodes 200 may be formed in various shapes such as, for example, a square, a rectangle, a predetermined pattern shape, a spiral shape having a predetermined width and spacing.
  • Capacitors 2200 and 2400 have capacitances formed between the plurality of internal electrodes 200, respectively, and the capacitance is adjusted according to the length or overlapping area of the plurality of internal electrodes 200, the thickness of the insulating sheets 100, and the like. Can be.
  • the present embodiment has been described as an example in which four internal electrodes are formed in each of the first and second capacitor parts 2200 and 24000, but two or more internal electrodes may be formed.
  • the internal electrodes 201 to 204 of the first capacitor part 2200 and the internal electrodes 205 to 208 of the second capacitor part 2400 may be formed in the same shape and the same area, and the overlap area may also be May be the same.
  • the insulating sheets 101 to 104 of the first capacitor unit 2200 and the insulating sheets 107 to 110 of the second capacitor unit 2400 may have the same thickness. In this case, when the first insulating sheet 101 functions as a lower cover layer, the first insulating sheet 101 may be thicker than the other insulating sheets. Therefore, the first and second capacitor parts 2200 and 4000 may have the same capacitance.
  • the first and second capacitor parts 2200 and 4000 may have different capacitances, and in this case, at least one of the area or length of the internal electrode, the overlapping area of the internal electrode, and the thickness of the insulating sheet may be different.
  • the internal electrodes 201 to 208 of the capacitor parts 2200 and 2400 may be formed to be longer than or equal to the discharge electrode 310 of the overvoltage protection part 2300, and may have a larger area or the same area.
  • the thicknesses of the internal electrodes 201 to 208 of the capacitor units 2200 and 2400 may be 0.05% to 50% of the thickness of the laminate 2100. That is, the sum of the thicknesses of the internal electrodes 201 to 208 may be formed to be 0.05% to 50% of the thickness of the laminate 2100.
  • each of the internal electrodes 201 to 208 may have the same thickness, or at least one may be different. For example, at least one of the internal electrodes 201 to 208 may be formed thicker or thinner than the rest. In addition, each of the internal electrodes 201 to 208 may have a thickness different from that of at least one region.
  • the thickness of the internal electrodes 201 to 208 may be different even when the thickness of at least one of the internal electrodes 201 to 208 is different and when the thickness of at least one region of each of the internal electrodes 201 to 208 is different.
  • the sum may be formed from 0.05% to 50% of the thickness of the laminate 2100.
  • the cross-sectional area of the internal electrodes 201 to 208 of the capacitor units 2200 and 2400 may be formed to be 0.05% to 50% of the cross-sectional area of the stack 2100. That is, the sum of the cross-sectional areas in the thickness direction, that is, the Z direction, of the internal electrodes 201 to 208 may be formed at 0.05% to 50% of the cross-sectional area of the stack 2100.
  • each of the internal electrodes 201 to 208 may have the same cross-sectional area, and at least one may be different. However, even when at least one cross-sectional area of the internal electrodes 201 to 208 is different, the sum of the cross-sectional areas of the internal electrodes 201 to 208 may be 0.05% to 50% of the cross-sectional area of the stack 2100. In addition, the length and width of each of the internal electrodes 201 to 208 of the capacitor parts 2200 and 2400 may be formed to be 95% or less of the length and width of the insulating sheet 100.
  • the internal electrodes 201 to 208 have a length in the X direction of 10% to 95% of the length of the X direction of the insulating sheet 100, and a width in the Y direction of the Y direction width of the insulating sheet 100. It may be formed from 10% to 95%. However, since the internal electrodes 201 to 208 should be formed by overlapping at least some regions with the insulating sheet 100 interposed therebetween, the length and width are formed to be 50% to 95% of the length and width of the insulating sheet 100. It is preferable, and it is more preferable to form by 80%-95%.
  • at least one of the internal electrodes 210 to 208 may have a length different from that of the other internal electrodes.
  • the length of one inner electrode may be longer or shorter than the length of the other inner electrodes.
  • the overlapping area is increased, and when the length of the inner electrode is small, the overlapping area is reduced. Therefore, the capacitance can be adjusted by varying the length of at least one internal electrode.
  • the overvoltage protection unit 2300 may include at least two discharge electrodes 310 (311 and 312) spaced apart from each other in the vertical direction and at least one overvoltage protection layer 320 provided between the at least two discharge electrodes 310.
  • the overvoltage protection unit 2300 may include first and second discharge electrodes 311 formed on the fifth and sixth insulating sheets 105 and 106 and the fifth and sixth insulating sheets 105 and 106, respectively. 312 and the overvoltage protection layer 320 formed through the sixth insulating sheet 106.
  • the overvoltage protection layer 320 may be formed such that at least a portion thereof is connected to the first and second discharge electrodes 311 and 312.
  • the first and second discharge electrodes 311 and 312 may be formed to have the same thickness as the internal electrodes 200 of the capacitor units 2200 and 4000.
  • the first and second discharge electrodes 311 and 312 may be formed to a thickness of 1 ⁇ m to 10 ⁇ m.
  • the first and second discharge electrodes 311 and 312 may be formed thinner or thicker than the internal electrodes 200 of the capacitor units 2200 and 4000.
  • the first discharge electrode 311 is connected to the first external electrode 2510 to be formed on the fifth insulating sheet 105, and the terminal portion is formed to be connected to the overvoltage protection layer 320.
  • the second discharge electrode 312 is connected to the second external electrode 2520 to be formed on the sixth insulating sheet 106, and the terminal portion is formed to be connected to the overvoltage protection layer 320.
  • the regions of the first and second discharge electrodes 311 and 312 that are in contact with the overvoltage protection layer 320 may be the same size or smaller than the overvoltage protection layer 320.
  • the first and second discharge electrodes 311 and 312 may be formed to completely overlap each other without leaving the overvoltage protection layer 320. That is, edges of the first and second discharge electrodes 311 and 312 may form a vertical component with edges of the overvoltage protection layer 320.
  • the first and second discharge electrodes 311 and 312 may be formed to overlap a portion of the overvoltage protection layer 320.
  • the first and second discharge electrodes 311 and 312 may be formed to overlap 10% to 100% of the horizontal area of the overvoltage protection layer 320. That is, the first and second discharge electrodes 311 and 312 are not formed beyond the overvoltage protection layer 320.
  • the first and second discharge electrodes 311 and 312 may be formed to have a larger area than one in contact with the overvoltage protection layer 320.
  • the overvoltage protection layer 320 may be formed in a predetermined region, for example, a central portion of the sixth insulating sheet 106 and connected to the first and second discharge electrodes 311 and 312.
  • the overvoltage protection layer 320 may be formed to at least partially overlap the first and second discharge electrodes 311 and 312. That is, the overvoltage protection layer 320 may be formed to overlap 10% to 100% of the horizontal area with the first and second discharge electrodes 311 and 312.
  • the overvoltage protection layer 320 may be formed to form a through hole having a predetermined size in a predetermined region, for example, a central portion of the sixth insulating sheet 106, and apply or embed at least a portion of the through hole using a printing process.
  • the overvoltage protection layer 320 may be formed to have a thickness of 1% to 20% of the thickness of the laminate 2100, and may be formed to have a length of 3% to 50% of one length of the laminate 2100.
  • the sum of the thicknesses of the plurality of overvoltage protection layers 320 may be 1% to 50% of the thickness of the laminate 2100.
  • the overvoltage protection layer 320 may be formed to have a long length in at least one direction, for example, the X direction, the length of the X direction is 5% to 75% of the length of the X direction of the insulating sheet 100 It can be formed as.
  • the overvoltage protection layer 320 may have a width in the Y direction of 3% to 50% of the width of the Y direction of the insulating sheet 100.
  • the overvoltage protection layer 320 may be formed, for example, with a diameter of 50 ⁇ m to 1000 ⁇ m and a thickness of 5 ⁇ m to 200 ⁇ m. At this time, the thinner the thickness of the overvoltage protection layer 320, the lower the discharge start voltage.
  • the overvoltage protection layer 320 may be formed using a conductive material and an insulating material. In this case, the insulating material may be a porous insulating material having a plurality of pores.
  • the overvoltage protection layer 320 may be formed by printing a mixed material of the conductive ceramic and the insulating ceramic on the sixth insulating sheet 106. Meanwhile, the overvoltage protection layer 320 may be formed on at least one insulating sheet 100.
  • overvoltage protection layers 320 are formed on at least one insulating sheet 100 stacked in a vertical direction, for example, and discharge electrodes are formed on the insulating sheet 100 so as to be spaced apart from each other. May be connected to the layer 320.
  • the structure, material, and the like of the overvoltage protection layer 320 will be described later.
  • the external electrodes 2510, 2520, and 2500 are provided on two opposite sides of the stack 2100 to be connected to the first and second capacitor parts 2200 and 2400 and the overvoltage protection part 2300.
  • the external electrode 2500 may extend to at least the lower surface of the stack 2100. That is, since the lower surface of the laminate 2100 faces the internal circuit 20 and the external electrode 2500 should be mounted on the internal circuit 20, the external electrodes formed on both side surfaces of the laminate 2100 facing each other ( 2510 and 2520 may extend to the bottom surface of the laminate 2100. In this case, the external electrodes 2500 extending on the bottom surface of the stack 2100 may be spaced apart from each other by a predetermined interval.
  • At least one of the external electrodes 2500 may extend to the top surface of the stack 2100. That is, at least one of the external electrodes 2500, for example, the first external electrode 2510 may be disposed on the top surface of the stack 2100 so as to be in contact with the contact portion 1000 facing the top surface of the stack 2100. It may be extended. In this case, the region extending on the upper surface of the laminate 2100 is formed to have a sufficient length on the upper surface of the laminate 2100 and is formed so as not to contact the second external electrode 2520. In addition, any one of the external electrodes 2500, for example, the second external electrode 2520, is not formed on the side surface of the dummy layer 2500.
  • the second external electrode 2520 is formed on the side of the stack 2100 of the portion where the first and second capacitor parts 2200 and 2400 and the overvoltage protection part 2300 are formed, but the dummy layer 2500 It is not formed on the side.
  • the first external electrode 2510 may be extended on the top surface of the stack 2100 to be in contact with the contact portion 1000, and the first and second external electrodes 2510 and 2520 may be on the bottom surface of the stack 2100. ) May be extended to be mounted on the internal circuit 20.
  • the external electrode 2500 may be formed of at least one layer.
  • the external electrode 2500 may be formed of a metal layer such as Ag, and at least one plating layer may be formed on the metal layer.
  • the external electrode 2500 may be formed by laminating a copper layer, a Ni plating layer, and a Sn or Sn / Ag plating layer.
  • the external electrode 2500 may be formed by mixing, for example, a glass frit of a multicomponent system based on 0.5% to 20% of Bi 2 O 3 or SiO 2 with a metal powder. In this case, the mixture of the glass frit and the metal powder may be prepared in a paste form and applied to two surfaces of the laminate 2100.
  • the adhesion between the external electrode 2500 and the laminate 2100 may be improved, and the contact reaction between the internal electrode 200 and the external electrode 2500 may be improved.
  • at least one plating layer may be formed on the upper portion to form the external electrode 2500. That is, the metal layer including the glass and at least one plating layer formed thereon may be formed to form the external electrode 2500.
  • the external electrode 2500 may sequentially form a Ni plating layer and a Sn plating layer through electrolytic or electroless plating after forming a layer including a glass frit and Ag and Cu.
  • the Sn plating layer may be formed to the same or thicker thickness than the Ni plating layer.
  • the external electrode 2500 may be formed of only at least one plating layer. That is, the external electrode 2500 may be formed by forming at least one layer of the plating layer using at least one plating process without applying the paste. Meanwhile, the external electrode 2500 may be formed to a thickness of 2 ⁇ m to 100 ⁇ m, the Ni plating layer may be formed to a thickness of 1 ⁇ m to 10 ⁇ m, and the Sn or Sn / Ag plating layer may have a thickness of 2 ⁇ m to 10 ⁇ m. Can be formed.
  • an oxide may be distributed on the surface of the laminate 2100 to form a surface modification member (ie, an insulation member).
  • the oxide may be dispersed and distributed on the surface of the laminate 2100 in a particulate state or a molten state.
  • the oxide may be distributed before forming a part of the external electrode 2500 in the printing process, or may be distributed before performing the plating process. That is, when the external electrode 2500 is formed by the plating process, the oxide may be distributed on the surface of the laminate 2100 before the plating process.
  • the resistance of the surface of the laminate 2100 can be made uniform, and thus the plating process can be performed uniformly.
  • the surface of the laminate 2100 may have a resistance at least in one region different from that in other regions. If the plating process is performed in a state where the resistance is uneven, the plating proceeds better than the region having high resistance in the region having low resistance. As a result, growth unevenness of the plating layer occurs. Therefore, in order to solve such a problem, the surface resistance of the laminate 2100 should be maintained uniformly, and for this purpose, a resistance adjusting member may be formed by dispersing oxides in a particulate state or a molten state on the surface of the laminate 2100. have.
  • the oxide may be partially distributed on the surface of the laminate 2100, may be distributed on the surface of the laminate 2100, and may be formed in a film form, and may be formed in a film form in at least one region and at least one region. It may be partially distributed at.
  • the oxide may be distributed in the form of islands on the surface of the laminate to form a resistance adjusting member. That is, oxides in a granular or molten state may be spaced apart from each other and distributed in an island form on the surface of the laminate 2100, thereby exposing at least a portion of the surface of the laminate 2100.
  • oxides may be distributed over the entire surface of the laminate 2100, and oxides having a predetermined thickness may be formed by connecting oxides in a particle state or a molten state with each other. In this case, since an oxide film is formed on the surface of the stack 2100, the surface of the stack 2100 may not be exposed.
  • the oxide may be formed in a film form in at least one region and distributed in an island form in at least a portion thereof. That is, at least two oxides may be connected to each other to form a film in at least one region and may be formed in an island form at least in part. Thus, at least a portion of the laminate surface may be exposed by the oxide.
  • the total area of the resistance adjusting member 400 made of an oxide distributed in at least a portion of the island shape may be, for example, 10% to 90% of the total area of the surface of the laminate 2100.
  • at least one oxide may be used as the oxide in the granular state or in the molten state to uniform the surface resistance of the laminate 2100.
  • Bi 2 O 3 , BO 2 , B 2 O 3 , ZnO At least one of Co 3 O 4 , SiO 2 , Al 2 O 3 , MnO, H 2 BO 3 , H 2 BO 3 , Ca (CO 3 ) 2 , Ca (NO 3 ) 2 , and CaCO 3 may be used. .
  • the surface modification member may be distributed over the entire region of the laminate 2100, or may be distributed only in at least one region. That is, the surface modification member may be formed on the entire surface of the laminate 2100, or may be formed only in an area in contact with the external electrode 2500 of the laminate 2100. In other words, the surface modification member in which the surface modification member is formed on a part of the surface of the laminate 2100 may be formed between the laminate 2100 and the external electrode 2500. In this case, the surface modification member may be formed in contact with the extension region of the external electrode 2500. That is, a surface modification member may be provided between one region of the external electrode 2500 formed on the upper and lower surfaces of the laminate 2100 and the laminate 2100.
  • the surface modification member may be provided in the same or different size than the external electrode 2500 formed thereon.
  • an area of 50% to 150% of an area of a part of the external electrode 2500 extended to the upper and lower surfaces of the stack 2100 may be formed. That is, the surface modification member may be formed to be smaller or larger than the size of the extension region of the external electrode 2500, or may be formed to the same size.
  • the surface modification member may also be formed between the external electrode 2500 formed on the side of the laminate 2100.
  • Such surface modification members may comprise a glass material.
  • the surface modification member may include non-borosilicate glass (SiO 2 —CaO—ZnO—MgO-based glass) that is calcinable at a predetermined temperature, for example, 950 ° C. or less.
  • the surface modification member may further include a magnetic material. That is, when the region on which the surface modification member is to be formed is formed of the magnetic sheet, a magnetic material may be partially included in the surface modification member to facilitate bonding of the surface modification member and the magnetic sheet.
  • the magnetic material may include, for example, NiZnCu-based magnetic powder, and may include, for example, 1-15 wt% of the magnetic material with respect to 100 wt% of the glass material.
  • the surface modification member may be formed on the surface of the laminate 2100.
  • at least a portion of the glass material may be evenly distributed on the surface of the stack 2100, and at least a portion of the glass material may be irregularly distributed in different sizes.
  • the surface modification member may be continuously formed on the surface of the laminate 2100 to have a film form.
  • a recess may be formed on at least part of the surface of the laminate 2100. That is, a glass material may be formed to form a convex portion, and at least a portion of the region where the glass material is not formed may be dug to form a recess.
  • the glass material may be formed to a predetermined depth from the surface of the laminate 2100 so that at least a portion of the glass material is formed higher than the surface of the laminate 2100. That is, at least a portion of the surface modification member may be coplanar with the surface of the laminate 2100, and at least a portion thereof may be maintained higher than the surface of the laminate 2100.
  • the surface of the laminate 2100 may be modified by distributing a glass material in a portion of the laminate 2100 before forming the external electrode 2500 to form a surface modification member, thereby making the surface resistance uniform. Can be. Therefore, the shape of the external electrode 2500 can be controlled, thereby facilitating the formation of the external electrode.
  • the internal electrodes 201 to 208 of the capacitor units 2200 and 2400 and the discharge electrodes 311 and 312 of the overvoltage protection unit 2300 may be formed of a conductive material.
  • a conductive material For example, Al, Cu, Ag It may be formed of a metal or a metal alloy, such as Pt, Au. That is, the internal electrodes 201 to 208 and the discharge electrode 310 may be formed of one metal or at least two metal alloys.
  • the internal electrodes 201 to 208 and the discharge electrode 310 may be formed of a conductive metal oxide, metal nitride, or the like.
  • the internal electrodes 201 to 208 and the discharge electrode 310 may be formed of the same material or may be formed of different materials.
  • the internal electrodes 201 to 208 and the discharge electrode 310 may be formed of Al, one of which may be formed of Al, and the other may be formed of Cu.
  • the internal electrodes 201 to 208 and the discharge electrode 310 may be formed by applying a paste of a metal, a metal alloy, or a metal compound, or may be formed by a deposition method such as sputtering or CVD.
  • the internal electrodes 201 to 208 and the discharge electrode 310 may include a component constituting the stack 2100. That is, the internal electrodes 201 to 208 and the discharge electrode 310 may include not only a conductive material but also a component constituting the insulating sheet 100.
  • the electrodes 201 to 208 and the discharge electrode 310 may be formed.
  • the laminate component that is, the component of the insulating sheet may be included in the conductive material at 20% or less, for example, when the mixture of the component of the insulating sheet and the conductive material is 100, the insulating sheet component may include about 1 to 20. .
  • the shrinkage of the internal electrodes 201 to 208 and the discharge electrode 310 may be similar to that of the laminate 2100, and the bonding force between the electrodes and the insulating sheet 100 may be improved. have.
  • the distance between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be shorter or equal to the distance between two internal electrodes in the capacitor units 2200 and 2400. That is, the thicknesses of the fifth and seventh insulating sheets 105 and 107 positioned between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be formed between the internal electrodes 200 in the capacitor units 2200 and 2400. It may be thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110 located at. In addition, the distance between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be shorter or equal to the distance between the two discharge electrodes 310 of the overvoltage protection unit 2300.
  • each of the thicknesses of the fifth and seventh insulating sheets 105 and 107 disposed between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 is the sixth insulating sheet 106 on which the overvoltage protection layer 320 is formed. Thinner than or equal to the thickness of As a result, the thickness of each of the fifth and seventh insulating sheets 105 and 107 positioned between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be reduced between the internal electrodes 200 in the capacitor units 2200 and 2400. Thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110, or thinner than or equal to the distance B between the two discharge electrodes 310 of the overvoltage protection unit 2300. Can be formed.
  • the overvoltage protection unit 2300 including one overvoltage protection layer 320 is provided in the stack 2100, but the plurality of overvoltage protection layers 320 are two or more.
  • a plurality of overvoltage protection units 2300 may be provided.
  • at least two overvoltage protection layers 320 are formed in a vertical direction, and discharge electrodes are further formed between the overvoltage protection layers 320 so that one composite protection unit 2000 includes at least one capacitor and two or more overvoltages. It may be made of a protective part.
  • At least two internal electrodes 200 of the capacitor parts 2200 and 2400, a discharge electrode 310 of the overvoltage protection part 2300, and an overvoltage protection layer 320 may be formed in the Y direction. Therefore, a plurality of composite protection parts 2000 may be provided in parallel in one laminate 2100.
  • 25 is a schematic cross-sectional view of the overvoltage protection layer 320 of the composite protection unit according to an embodiment of the present invention.
  • the overvoltage protection layer 320 may be formed by mixing a conductive material and an insulating material. That is, the overvoltage protection layer 320 may be formed by applying or embedding an ESD protection material mixed with a conductive material and an insulating material to at least a portion of the through hole formed in the at least one sheet 100. For example, the overvoltage protection layer 320 may be formed using an ESD protection material mixed with a conductive ceramic and an insulating ceramic. In this case, the overvoltage protection layer 320 may be formed by mixing the conductive ceramic and the insulating ceramic in a mixing ratio of 10:90 to 90:10.
  • the mixing ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the mixing ratio of the conductive ceramic increases, the discharge starting voltage decreases. Therefore, the mixing ratio of the conductive ceramic and the insulating ceramic can be adjusted to obtain a predetermined discharge start voltage.
  • a plurality of pores may be formed in the overvoltage protection layer 320. That is, since the overvoltage protection layer 320 uses a porous insulating material, a plurality of pores may be formed. The formation of pores makes it easier to bypass the ESD voltage to the ground terminal.
  • the overvoltage protection layer 300 may be formed in a predetermined stacked structure by stacking a conductive layer and an insulating layer. That is, the overvoltage protection layer 300 may be formed by stacking the conductive layer and the insulating layer at least once and separating the conductive layer and the insulating layer.
  • the overvoltage protection layer 320 may be formed in a two-layer structure by laminating a conductive layer and an insulating layer, and may be formed in a three-layer structure by laminating the conductive layer, the insulating layer, and the conductive layer.
  • the conductive layer 321 and the insulating layer 322 may be repeatedly stacked a plurality of times to form a stacked structure of three or more layers.
  • the overvoltage protection layer 300 having a three-layer structure in which the first conductive layer 321a, the insulating layer 322, and the second conductive layer 321b are stacked is formed. Can be formed.
  • the conductive layer and the insulating layer are laminated a plurality of times, the uppermost layer and the lowest layer may be a conductive layer.
  • a plurality of pores may be formed in at least a portion of the conductive layer 321 and the insulating layer 322.
  • a plurality of pores may be formed in the insulating layer 322.
  • a void may be further formed in the overvoltage protection layer 320 in a predetermined region.
  • voids may be formed between the layers in which the conductive material and the insulating material are mixed, and voids may be formed between the conductive layer and the insulating layer. That is, the first mixed layer, the voids and the second mixed layer of the conductive material and the insulating material may be laminated, and the conductive layer, the voids and the insulating layer may be laminated.
  • the overvoltage protection layer 320 may include a first conductive layer 321a, a first insulating layer 322a, a void 323, and a second insulating layer 322b as shown in FIG. 25C.
  • the second conductive layer 321b may be stacked. That is, the insulating layer 322 may be formed between the conductive layers 321, and the gap 323 may be formed between the insulating layers 322.
  • the conductive layer, the insulating layer, and the voids may be repeatedly stacked to form the overvoltage protection layer 320.
  • the conductive layer 321, the insulating layer 322, and the gap 323 are stacked, all of them may have the same thickness, and at least one thickness may be thinner than the others.
  • the void 323 may be thinner than the conductive layer 321 and the insulating layer 322.
  • the conductive layer 321 may be formed to have the same thickness as the insulating layer 322, or may be formed thicker or thinner than the insulating layer 322.
  • the void 323 may be formed by filling the polymer material and then performing a sintering process to remove the polymer material.
  • the first polymer material including the conductive ceramic, the second polymer material including the insulating ceramic, and the third polymer material not including the conductive ceramic or the insulating ceramic are filled in the via hole, and then a firing process is performed. By removing the polymer material, a conductive layer, an insulating layer and a void can be formed.
  • the gap 323 may be formed without being divided into layers.
  • the insulating layer 322 may be formed between the conductive layers 321a and 321b, and a plurality of pores may be connected in the insulating layer 322 in a vertical direction or a horizontal direction to form a gap 323. That is, the gap 323 may be formed with a plurality of pores in the insulating layer 322.
  • the void 323 may be formed in the conductive layer 321 by a plurality of pores.
  • the overvoltage protection layer 320 may be formed by applying an ESD protection material including a porous insulating material and a conductive material to a portion of the hole, and the remaining area is not coated with the ESD protection material.
  • an ESD protection material is not formed in the through hole, and a gap 323 may be formed between the two discharge electrodes 311 and 312 as shown in FIG. 25D. .
  • the conductive layer 321 used for the overvoltage protection layer 320 can flow a current with a predetermined resistance.
  • the conductive layer 321 may be a resistor having several kilowatts to several hundred kilowatts.
  • the conductive layer 321 lowers the energy level when an overvoltage flows through the ESD, so that structural destruction of the composite protection part due to the overvoltage does not occur. That is, the conductive layer 321 serves as a heat sink that converts electrical energy into thermal energy.
  • the conductive layer 321 may be formed using a conductive ceramic, and the conductive ceramic may include a mixture including at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, Fe, and Bi.
  • the conductive layer 321 can be formed to a thickness of 1 ⁇ m to 50 ⁇ m. That is, when the conductive layer 321 is formed of a plurality of layers, the sum of the total thicknesses may be 1 ⁇ m to 50 ⁇ m.
  • the insulating layer 322 used for the overvoltage protection layer 320 may be made of a discharge inducing material, and may function as an electrical barrier having a porous structure.
  • the insulating layer 322 may be formed of an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 25000.
  • the insulating ceramic may be formed of at least one of dielectric material powder such as MLCC, SiO 2 , Fe 2 O 3 , Co 3 O 4 , BaTiO 3 , BaCO 3 , TiO 2 , Nd, Bi, Zn, Al 2 O 3 . It can be formed using the mixture included.
  • the insulating layer 322 may have a porous structure in which a plurality of pores having a size of about 1 nm to about 30 ⁇ m are formed to have a porosity of about 30% to about 80%. At this time, the average of the shortest distance between the pores may be about 1nm to 50 ⁇ m. In other words, the greater the porosity, the shorter the distance between the pores, and the larger the pore size, the closer the distance between pores.
  • the insulating layer 322 is formed of an electrically insulating material through which no current flows, but since pores are formed, current may flow through the pores. In this case, as the size of the pores increases or the porosity increases, the discharge start voltage may decrease.
  • the discharge start voltage may increase.
  • the pore size exceeds 30 ⁇ m or the porosity exceeds 80% it may be difficult to maintain the shape of the overvoltage protection layer 320. Therefore, the pore size and the porosity of the insulating layer 322 may be adjusted to adjust the discharge start voltage while maintaining the shape of the overvoltage protection layer 320.
  • the overvoltage protection layer 320 is formed of a mixed material of an insulating material and a conductive material, the insulating material may use an insulating ceramic having fine porosity and porosity.
  • the insulating layer 322 may have a resistance lower than that of the insulating sheet 100 by micropores, and partial discharge may be performed through the micropores. That is, the micropore is formed in the insulating layer 322 and partial discharge is performed through the micropore.
  • the insulating layer 322 may be formed to a thickness of 1 ⁇ m 50 ⁇ m. That is, when the insulating layer 322 is formed of a plurality of layers, the sum of the total thicknesses may be formed to be 1 ⁇ m to 50 ⁇ m.
  • the composite protection unit 2000 according to the present invention as described above can block the leakage current transmitted from the ground terminal of the internal circuit 20 to the conductor 10 such as a metal case, the conductor 10 from the outside
  • An overvoltage such as an ESD applied to the internal circuit 20 may be bypassed to the ground terminal through the circuit. That is, in the composite protection unit 2000 of the present invention, current does not flow between the external electrodes 2500 at the rated voltage and the electric shock voltage, and current flows through the overvoltage protection unit 2300 at the ESD voltage to the ground terminal. Bypassed. Meanwhile, the composite protection unit 2000 may have a discharge start voltage higher than the rated voltage and lower than the ESD voltage.
  • the composite protection unit 2000 may have a rated voltage of 100 V to 240 V, an electric shock voltage may be equal to or higher than an operating voltage of a circuit, and an ESD voltage generated by external static electricity may be higher than an electric shock voltage.
  • the discharge start voltage may be 350V to 15kV.
  • a communication signal may be transmitted between the external circuit and the internal circuit 20 by the capacitor units 2200 and 2400. That is, a communication signal from the outside, for example, an RF signal may be transmitted to the internal circuit 20 by the capacitor units 2200 and 2400, and the communication signal from the internal circuit 20 is the capacitor units 2200 and 2400. It can be delivered to the outside by).
  • the composite protection unit 2000 cuts off leakage current flowing from the ground terminal of the internal circuit 20, bypasses the ESD voltage applied from the outside to the ground terminal, and between the outside and the electronic device. Can communicate communication signals.
  • the composite protection unit 2000 forms the capacitor units 2200 and 2400 by stacking a plurality of insulating sheets 100 having high breakdown voltage characteristics in the internal circuit 20 of the defective charger. Insulation resistance can be maintained so that a leakage current does not flow when an electric shock voltage of 310 V, for example, is introduced into the conductor 10, and the overvoltage protection part 2400 also has an ESD protection from the conductor 10 to the internal circuit 20. By inverting the ESD voltage during voltage inflow, the device can maintain high insulation resistance without breaking the device.
  • the overvoltage protection unit 2300 is formed of a conductive layer 310 for converting electrical energy into thermal energy by lowering an energy level, and an overvoltage protection layer made of an insulating layer 320 made of a porous structure to flow current through micropores ( By including 300) it is possible to protect the circuit by bypassing the incoming ESD voltage. Therefore, the insulation voltage is not broken even by the ESD voltage, and accordingly, the leakage current generated from the defective charger is provided in the electronic device having the conductor 10 such as the metal case to continuously transmit to the user through the metal case of the electronic device. Can be prevented.
  • the general MLCC Multi Layer Capacitance Circuit
  • the general MLCC Multi Layer Capacitance Circuit
  • an overvoltage protection layer including a conductive layer and an insulating layer is formed between the capacitor parts so that the capacitor part is not destroyed by passing the ESD voltage through the overvoltage protection layer.
  • the overvoltage protection layer 320 is formed by embedding or applying an overvoltage protection material in a through hole formed in the insulating sheet 106.
  • the overvoltage protection layer 320 may be formed in a predetermined region of the insulating sheet, and the discharge electrode 310 may be formed to contact the overvoltage protection layer 320, respectively. That is, as shown in the cross-sectional view of the second embodiment of FIG. 26, two discharge electrodes 311 and 312 are formed on the insulating sheet 106 spaced apart by a predetermined interval in the horizontal direction, and between the two discharge electrodes 311 and 312. An overvoltage protection layer 320 may be formed.
  • two discharge electrodes 311 and 312 may be provided in a direction in which the external electrodes 2500 are formed so as to be spaced apart from each other in a predetermined region of the sheet, for example, in the X direction, and an overvoltage protective layer ( 320 may be formed.
  • a plurality of discharge electrodes may be further provided in the Y direction, and the overvoltage protection layer 320 may be formed therebetween. That is, at least one discharge electrode is formed in a direction orthogonal to the direction in which the external electrode 2510 is formed, and the at least one discharge electrode is formed in a direction orthogonal to the direction in which the external electrode 2520 is formed so as to face each other at a predetermined interval. Can be formed.
  • 27 is a cross-sectional view of the composite protection unit according to the third embodiment of the present invention.
  • the composite protection unit according to the third exemplary embodiment of the present invention may include a stack 1000 in which a plurality of insulating sheets 100 (101 to 111) are stacked, a stack 1000, and a plurality of interiors. At least one capacitor unit 2200 and 2400 including electrodes 200 and 201 to 208, an overvoltage protection unit 2300 including at least one discharge electrode 310, and an overvoltage protection layer 320, and stacked. It may include external electrodes 5100, 5200; 2500 formed on two opposite sides of the sieve 1000 and connected to the first and second capacitor parts 2200 and 2400 and the overvoltage protection part 2300.
  • the distances A1 and A2 between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be shorter or equal to the distances C1 and C2 between the two internal electrodes in the capacitor units 2200 and 2400. . That is, the thicknesses of the fifth and seventh insulating sheets 105 and 107 positioned between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be formed between the internal electrodes 200 in the capacitor units 2200 and 2400. It may be thinner than or equal to the thickness of the insulating sheets 102 to 104 and 107 to 110 located at.
  • the distances A1 and A2 between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be shorter or equal to the distance B between the two discharge electrodes 310 of the overvoltage protection unit 2300. . That is, each of the thicknesses of the fifth and seventh insulating sheets 105 and 107 disposed between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 is the sixth insulating sheet 106 on which the overvoltage protection layer 320 is formed.
  • the thickness of each of the fifth and seventh insulating sheets 105 and 107 positioned between the overvoltage protection unit 2300 and the capacitor units 2200 and 2400 may be reduced between the internal electrodes 200 in the capacitor units 2200 and 2400.
  • A1 and A2 and C1 and C2 may not be the same.
  • the thicknesses D1 and D2 of the lowermost and uppermost insulating sheets, that is, the first and eleventh insulating sheets 101 and 111 may be 10 ⁇ m or more and 50% or less of the thickness of the laminate 1000, respectively.
  • the distance A between the discharge electrode and the adjacent internal electrodes is less than or equal to the distance B between the discharge electrodes (A ⁇ B)
  • the parasitic capacitance between the discharge electrode and the adjacent internal electrodes increases to increase the capacitance of the device. You can.
  • the distance A between the discharge electrode and the adjacent inner electrode is less than or equal to the distance C between the inner electrode (A ⁇ C)
  • the overlapping area of the discharge electrode and the inner electrode is smaller than the overlapping area of the inner electrodes. Since the change in capacitance due to the change in thickness of A is smaller than the change in capacitance due to the change in thickness of C, fine adjustment of the capacitance is possible.
  • the discharge electrodes 311 and 312 may be lost, thereby making it difficult to pass the ESD and thus destroying the insulating layer.
  • the distance A between the discharge electrodes 311 and 312 and the adjacent internal electrodes 204 and 205 is less than or equal to the distance B between the discharge electrodes (A ⁇ B)
  • the inner electrode 204 adjacent to the discharge electrode , 205 is the electrode closest to the ESD protection layer after the discharge electrode is lost, and the distance of A is closer than the distance of C, so that the insulating layers 102, 103, 104, 108, 109 and 110 between the internal electrodes are destroyed.
  • the inner electrode 204 and 205 are used as a substitute for the discharge electrode. Further, when A is smaller than B, the distance between the ESD protection layer and the internal electrodes 204 and 205 is closer, so that the discharge start voltage may be similar to the discharge start voltage before the discharge electrode is lost.
  • the composite protection unit according to the third embodiment of the present invention has two internal electrodes adjacent to the discharge electrodes 311 and 312, that is, the fourth and fifth internal electrodes 204 and 205 are the same as the discharge electrodes 311 and 312. It may be connected to the external electrode 2500. That is, the first, third, fifth, and seventh internal electrodes 201, 203, 205, and 207 are connected to the second external electrode 5200, and the second, fourth, sixth, and eighth internal electrodes ( 202, 204, 206, and 208 are connected to the first external electrode 5100.
  • the first discharge electrode 311 is connected to the first external electrode 5100
  • the second discharge electrode 312 is connected to the second external electrode 5200.
  • first discharge electrode 311 and the fourth internal electrode 204 adjacent thereto are connected to the first external electrode 5100, and the second discharge electrode 312 and the fifth internal electrode 205 adjacent thereto are formed of the first discharge electrode 311 and the fourth internal electrode 205 adjacent thereto. 2 is connected to the external electrode 5200.
  • the ESD voltage is not applied to the electronic device even when the insulating sheet 100 is degraded, that is, the dielectric breakdown. Do not. That is, in the case where the discharge electrode 310 and the adjacent inner electrode 200 are connected to different external electrodes 2500, when the insulating sheet 100 is insulated and destroyed, an ESD voltage applied through the one external electrode 2500 may be discharged.
  • the internal electrode 200 adjacent to 310 flows to the other external electrode 2500.
  • the thickness of the insulating sheet 100 may be formed thick, but in this case, there is a problem in that the size of the composite protective part is increased. However, as shown in FIG.
  • the ESD voltage is transferred into the electronic device. Not authorized In addition, it is possible to prevent the ESD voltage from being applied without forming the thickness of the insulating sheet 100 thickly.
  • the external electrode 2500 may be formed to at least partially overlap the internal electrode 200. That is, the external electrode 2500 may extend to the upper and lower surfaces of the stack 2100 and overlap the predetermined region with the internal electrodes 200 connected to the different external electrodes 2500.
  • the first external electrode 2510 may overlap a distal end of the first internal electrode 201 connected to the second external electrode 2520, and the second external electrode 2520 may be the first external electrode 2510.
  • the ESD resistance characteristics may be maintained.
  • at least one region of the internal electrode may be spaced apart from the predetermined region by a predetermined interval.
  • the internal electrodes spaced apart from each other and the internal electrodes adjacent to each other may be formed to overlap the spaced areas. This, combined with the design of the overvoltage protection of the electric shock protection device, provides higher ESD immunity improvement.
  • the capacitor part may be damaged and insulation breakdown may occur.
  • an ESD voltage load may be generated in the capacitor unit for a short time from 1 ns to 30 ns empty time until the reaction time of the overvoltage protection unit of the electric shock protection device, thereby causing dielectric breakdown.
  • the capacitor portion in the floating type, it is possible to improve the ESD breakdown characteristic of the capacitor layer, thereby improving the phenomenon in which the insulation resistance is destroyed and the short is generated.
  • the capacitor parts 2200 and 2400 may have at least one internal electrode floating. It can be formed into a type.
  • At least one overvoltage protection layer 320 of the protection unit 3000 may be formed. That is, one overvoltage protection layer 300 may be formed in the direction in which the external electrode is formed, or two or more overvoltage protection layers 320 may be formed in the external electrode formation direction. In this case, a plurality of overvoltage protection layers 320 may be formed in a direction perpendicular to the direction. For example, two overvoltage protection layers may be formed on the same plane, and three overvoltage protection layers may be formed on the same plane. At least two or more overvoltage protection layers may be connected by discharge electrodes.
  • overvoltage protection layers may be formed by dividing up and down two by two, or six overvoltage protection layers may be formed by dividing up and down three by three.
  • the overvoltage protection layers 320 spaced apart from each other the upper overvoltage protection layers may be connected to each other, and the lower overvoltage protection layers may be connected to each other. Even when the plurality of overvoltage protection layers 320 are formed as described above, each of the overvoltage protection layers 320 may be formed in the same structure or may be formed in a different structure.
  • a plurality of capacitor parts 2200 and 2400 and a plurality of overvoltage protection parts 2300 may be formed in a horizontal direction in the stack 1000. That is, at least one capacitor part 2200 and 2400 and the overvoltage protection part 2300 stacked in the vertical direction are arranged in at least two in the horizontal direction, and are connected to at least two or more external electrodes 2500 arranged in the horizontal direction.
  • a plurality of electric shock prevention elements including a plurality of capacitors and a plurality of overvoltage protection units may be provided in parallel. Therefore, two or more electric shock prevention devices may be implemented in one laminate 1000. Meanwhile, at least one of at least one internal electrode of the plurality of capacitor parts may be formed to have a different length.
  • At least one inner electrode of the plurality of inner electrodes formed in the horizontal direction to form different capacitor parts may be formed to be shorter or longer than the other inner electrodes.
  • the capacitance may be adjusted by adjusting not only the length of the inner electrode but also at least one of the overlapping area of the inner electrode and the stacking number of the inner electrode. Therefore, at least one capacitance of the plurality of capacitors may be different. That is, at least one of the plurality of capacitors having different capacitances may be implemented in one stack.
  • the overvoltage protection unit 3000 may include two or more discharge electrodes 310, an overvoltage protection layer 320 formed between the discharge electrodes 310, and a discharge electrode 310.
  • a discharge induction layer 330 formed between the overvoltage protection layer 320 may be included. That is, the discharge induction layer 330 may be further formed between the discharge electrode 310 and the overvoltage protection layer 320.
  • the discharge electrode 310 may include conductive layers 311a and 312a and porous insulating layers 311b and 312b formed on at least one surface of the conductive layers 311a and 312a.
  • the discharge electrode 310 may be a conductive layer on which a porous insulating layer is not formed.
  • the discharge induction layer 330 may be formed when the overvoltage protection layer 320 is formed using a porous insulating material.
  • the discharge induction layer 330 may be formed of a dielectric layer having a higher density than the overvoltage protection layer 320. That is, the discharge induction layer 330 may be formed of a conductive material or may be formed of an insulating material.
  • the overvoltage protection layer 320 is formed by using porous ZrO and the discharge electrode 310 is formed by using Al
  • a discharge induction layer of AlZrO is formed between the overvoltage protection layer 320 and the discharge electrode 310. 330 may be formed.
  • the discharge induction layer 330 may be formed of TiAlO. That is, the discharge induction layer 330 may be formed by the reaction of the discharge electrode 310 and the overvoltage protection layer 320. Of course, the discharge induction layer 330 may be formed by further reacting the insulating sheet 100 material. In this case, the discharge induction layer 330 may be formed by a reaction of a discharge electrode material (eg, Al), an overvoltage protection layer material (eg, ZrO), and an insulating sheet material (eg, BaTiO 3 ). In addition, the discharge induction layer 330 may be formed by reacting with the material of the insulating sheet 100.
  • a discharge electrode material eg, Al
  • an overvoltage protection layer material eg, ZrO
  • an insulating sheet material eg, BaTiO 3
  • the discharge induction layer 330 may be formed in the region where the overvoltage protection layer 320 is in contact with the insulating sheet 100 by the reaction of the overvoltage protection layer 320 and the insulating sheet 100. Therefore, the discharge induction layer 330 may be formed to surround the overvoltage protection layer 320. In this case, the discharge induction layer 330 between the overvoltage protection layer 320 and the discharge electrode 310 and the discharge induction layer 330 between the overvoltage protection layer 320 and the insulating sheet 100 may have different compositions. . On the other hand, the discharge induction layer 330 may be formed by removing at least one region, and may be formed differently from other regions in at least one region.
  • the discharge induction layer 330 may be discontinuously formed by removing at least one region, and the thickness of the discharge induction layer 330 may be differently formed.
  • the discharge induction layer 330 may be formed during the firing process. That is, during the firing process at a predetermined temperature, the discharge electrode material, the ESD protection material, and the like may be diffused to each other to form the discharge induction layer 330 between the discharge electrode 310 and the overvoltage protection layer 320. Meanwhile, the discharge induction layer 330 may be formed to have a thickness of 10% to 70% of the thickness of the overvoltage protection layer 320. That is, some thicknesses of the overvoltage protection layer 320 may be changed to the discharge induction layer 330.
  • the discharge induction layer 330 may be formed thinner than the overvoltage protection layer 320, and may be formed to have a thickness that is thicker, equal to, or thinner than that of the discharge electrode 310.
  • the discharge induction layer 330 may reduce the level of discharge energy induced by the ESD voltage to the overvoltage protection layer 320 or to the overvoltage protection layer 320. Therefore, it is possible to discharge the ESD voltage more easily to improve the discharge efficiency.
  • the discharge induction layer 330 may be formed to prevent diffusion of heterogeneous materials into the overvoltage protection layer 320. That is, diffusion of the insulating sheet material and the discharge electrode material into the overvoltage protection layer 320 may be prevented, and external diffusion of the overvoltage protection layer material may be prevented.
  • the discharge induction layer 330 may be used as a diffusion barrier, thereby preventing breakage of the overvoltage protection layer 320.
  • the overvoltage protection layer 320 may further include a conductive material, in which case the conductive material may be coated with an insulating ceramic.
  • the conductive material may be coated using NiO, CuO, WO, or the like.
  • a conductive material may be used as the material of the ESD hobo layer 320 together with the porous insulating material.
  • the discharge induction layer 330 is used.
  • the silver may be formed between the conductive layer 321 and the insulating layer 322.
  • the discharge electrode 310 may be formed in a shape in which some regions are removed. That is, the discharge induction layer 330 may be formed in a region in which the discharge electrode 310 is partially removed and removed.
  • the electrical characteristics are not degraded because the shape of the discharge electrode 310 is maintained as a whole.
  • the internal electrode 200 may also have a partially removed region, but in this case, electrical characteristics are not deteriorated.
  • the composite protection unit 2000 includes an overvoltage protection unit 2300 having an overvoltage protection layer 320.
  • the composite protection unit 2000 may use at least some of the varistor material, the MLCC material, the LTCC, the HTCC, the piezoelectric material, and the magnetic material, and may be manufactured in various forms capable of blocking the transient voltage. That is, the insulating sheet forming the laminate of the composite protection part 2000 may be part of the material, and at least part of the overvoltage protection part may include at least part of the material.
  • the composite protection unit 2000 may be implemented as a varistor, a diode, or the like, which maintains an insulation state below a predetermined voltage and maintains a conductive state above a predetermined voltage. That is, the composite protection unit 2000 may be formed of a varistor whose breakdown voltage is higher than the rated voltage and lower than the ESD voltage. To this end, the composite protection unit 2000 may have a structure in which a plurality of sheets made of a varistor material and a plurality of internal electrodes are stacked. Therefore, it can operate as a capacitor below the breakdown voltage and as a varistor above the breakdown voltage. Of course, the varistor part and the capacitor part may be stacked to implement the complex protection part 2000.
  • the overvoltage protection unit 2300 described in the above embodiments of the present invention may be formed of a varistor material without the overvoltage protection layer 320.
  • the surface of the composite protection unit 2000 may be formed of at least a portion of the material.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne : un contacteur disposé entre un conducteur susceptible d'être mis en contact par un utilisateur d'un dispositif électronique et le circuit interne du dispositif électronique; et un dispositif électronique le comportant, le contacteur comprenant : une unité de contact apte à venir en contact avec le conducteur; une unité de protection complexe qui est isolée de l'unité de contact et bloque un courant de fuite provenant du circuit interne; une unité d'extension qui est électriquement connectée à l'unité de contact et qui s'étend le long de l'unité de protection complexe; et une unité de montage sur laquelle sont montées l'unité de protection complexe et l'unité d'extension.
PCT/KR2017/004988 2016-05-13 2017-05-12 Contacteur et dispositif électronique le comportant Ceased WO2017196150A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20160059014 2016-05-13
KR10-2016-0059014 2016-05-13
KR1020160098568A KR101842212B1 (ko) 2016-05-13 2016-08-02 감전 방지 컨택터 및 이를 구비하는 전자기기
KR10-2016-0098568 2016-08-02

Publications (1)

Publication Number Publication Date
WO2017196150A1 true WO2017196150A1 (fr) 2017-11-16

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PCT/KR2017/004988 Ceased WO2017196150A1 (fr) 2016-05-13 2017-05-12 Contacteur et dispositif électronique le comportant

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WO (1) WO2017196150A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103175A (ja) * 2008-10-21 2010-05-06 Tdk Corp 積層コンデンサの製造方法
KR200449179Y1 (ko) * 2009-12-31 2010-06-22 주식회사 협진아이엔씨 휴대폰용 접속단자
KR20100116367A (ko) * 2009-04-22 2010-11-01 주식회사 이노칩테크놀로지 전기 전도성 가스켓 및 그 제조 방법
KR101366212B1 (ko) * 2012-09-26 2014-02-24 대일티앤씨 주식회사 터미널 콘택트
KR101585604B1 (ko) * 2015-07-01 2016-01-14 주식회사 아모텍 감전보호용 컨택터 및 이를 구비한 휴대용 전자장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010103175A (ja) * 2008-10-21 2010-05-06 Tdk Corp 積層コンデンサの製造方法
KR20100116367A (ko) * 2009-04-22 2010-11-01 주식회사 이노칩테크놀로지 전기 전도성 가스켓 및 그 제조 방법
KR200449179Y1 (ko) * 2009-12-31 2010-06-22 주식회사 협진아이엔씨 휴대폰용 접속단자
KR101366212B1 (ko) * 2012-09-26 2014-02-24 대일티앤씨 주식회사 터미널 콘택트
KR101585604B1 (ko) * 2015-07-01 2016-01-14 주식회사 아모텍 감전보호용 컨택터 및 이를 구비한 휴대용 전자장치

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