WO2017202097A1 - 支撑设备及支撑方法 - Google Patents

支撑设备及支撑方法 Download PDF

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Publication number
WO2017202097A1
WO2017202097A1 PCT/CN2017/075450 CN2017075450W WO2017202097A1 WO 2017202097 A1 WO2017202097 A1 WO 2017202097A1 CN 2017075450 W CN2017075450 W CN 2017075450W WO 2017202097 A1 WO2017202097 A1 WO 2017202097A1
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WIPO (PCT)
Prior art keywords
carrier substrate
protrusion
dividing plate
hole
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/075450
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English (en)
French (fr)
Inventor
苏志玮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Publication date
Application filed by BOE Technology Group Co Ltd, Hefei Xinsheng Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US15/558,378 priority Critical patent/US10354906B2/en
Priority to EP17761425.2A priority patent/EP3467868B1/en
Publication of WO2017202097A1 publication Critical patent/WO2017202097A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Definitions

  • Embodiments of the present invention relate to a support apparatus and a support method.
  • the display substrate In the preparation process of the display substrate, various processing such as evaporation, sputtering, and the like of the display substrate are required.
  • the display substrate is usually supported by a carrier substrate.
  • the carrier substrate and the display substrate are transferred together to the separation chamber, and the display substrate is lifted up by the top pin base to realize separation of the display substrate from the carrier substrate.
  • the separation process since the contact area between the display substrate and the top pin is small, the display substrate is subjected to pressure at a position in contact with the top pin, thereby easily damaging the display substrate, resulting in product defects, especially for a large-sized display substrate. Words can lead to serious shape variables.
  • One aspect of the present invention provides a support apparatus including: a carrier substrate carrying a carried member, the carrier substrate having a first major surface facing the carried member and an opposite side of the first major surface a second main surface; and a partial pressure plate disposed on the first main surface of the carrier substrate and between the carrier substrate and the supported member; wherein the voltage dividing plate is configured to drive the carried member Separated from the carrier substrate.
  • the carrier substrate is provided with a first through hole penetrating the first main surface and the second main surface in a thickness direction thereof;
  • the supporting device further includes a separating device, and the separating device includes a first protrusion; and the first protrusion may pass through the first through hole and jack up the voltage dividing plate.
  • a surface of the voltage dividing plate facing the carrier substrate is provided with a positioning structure and/or a bonding structure corresponding to the first through hole.
  • the positioning structure is a blind hole extending from a side of the voltage dividing plate facing the carrier substrate toward a side away from the carrier substrate.
  • the first protrusion is provided with another bonding structure; and the minute a joint structure on the pressure plate and another joint structure on the first protrusion are coupled to each other to the first protrusion and the pressure plate during the jacking of the pressure plate by the first protrusion Fixed to each other.
  • the bonding structure on the voltage dividing plate and the other bonding structure on the first protrusion are combined with each other by magnetic attraction.
  • the first major surface of the carrier substrate is provided with a support structure that supports the supported component.
  • the support structure is provided with a bond that bonds the supported component to the carrier substrate.
  • the support structure has a dimension in a direction from the carrier substrate to the supported component that is greater than a thickness of the partial pressure plate.
  • the first main surface of the carrier substrate is provided with a first fixing structure; a surface of the voltage dividing plate facing the carrier substrate is disposed at a position corresponding to the first fixing structure. a second fixing structure; and the first fixing structure and the second fixing structure are coupled to each other to fix the pressure dividing plate to the carrier substrate.
  • first fixed structure and the second fixed structure are coupled to each other by magnetic attraction.
  • the carrier substrate is provided with a second through hole penetrating the first main surface and the second main surface; the voltage dividing plate is provided with a pass corresponding to the position of the second through hole
  • the support device further includes a transfer device including a second protrusion; and the second protrusion may pass through the second through hole and the through hole of the voltage dividing plate.
  • the second projection comprises an adsorption device disposed at an end thereof.
  • Another aspect of the present invention provides a support method comprising: providing a carrier substrate carrying a carried member, the carrier substrate having a first major surface facing the supported member and an opposite side of the first major surface a second main surface; a partial pressure plate disposed on the first main surface of the carrier substrate and located between the carrier substrate and the supported member; and the side of the voltage dividing plate away from the carrier substrate Moving to drive the carried member to be separated from the carrier substrate.
  • the carrier substrate has a first through hole penetrating the first main surface and the second main surface in a thickness direction thereof; and moving the voltage dividing plate away from the carrier substrate Side movement to drive the carried member to be separated from the carrier substrate includes: providing a separating device, The separating device includes a first protrusion; and the first protrusion passes through the first through hole and jacks up the pressure dividing plate, so that the dividing plate drives the carried member and the bearing The substrate is separated.
  • a positioning structure and/or a bonding structure corresponding to the first through hole is disposed on a surface of the voltage dividing plate facing the carrier substrate; the first protruding portion passes through the first a through hole is then combined with the partial pressure plate by the positioning structure and/or the combined structure to the first protruding portion and the partial pressure plate during the process of lifting the partial pressure plate by the first protrusion Fixed to each other.
  • the carrier substrate is provided with a second through hole penetrating the first main surface and the second main surface; the voltage dividing plate is provided with a pass corresponding to the position of the second through hole And the supporting method further includes: providing a transfer device including a second protrusion; and after the second protrusion passes through the second through hole and the through hole of the voltage dividing plate The carried member is placed on the second protrusion, and then the second protrusion is controlled to move the carried member placed thereon onto the carrier substrate.
  • FIG. 1a is a schematic top view of a supporting device according to an embodiment of the present invention.
  • Figure 1b is a cross-sectional view taken along line A-A1 of Figure 1a;
  • FIG. 2a is a schematic structural view of a carrier substrate provided with a first through hole according to an embodiment of the present invention
  • FIG. 2b is a schematic structural view of a separating device according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of separating a supported component from a carrier substrate according to an embodiment of the present invention.
  • FIG. 4a is a top plan view showing a portion of a pressure dividing plate provided with a blind hole according to an embodiment of the present invention
  • Figure 4b is a side view of Figure 4a
  • FIG. 5a is a schematic view showing another first structure of a first protruding portion according to an embodiment of the present invention.
  • FIG. 5b is a schematic view showing a combination structure of a pressure dividing plate according to an embodiment of the present invention.
  • 6a is a top plan view showing a support structure disposed on a carrier substrate according to an embodiment of the present invention.
  • Figure 6b is a cross-sectional view taken along line C-C1 of Figure 6a;
  • FIG. 7a is a schematic top plan view showing a first fixing structure of a carrier substrate according to an embodiment of the present invention.
  • 7b is a top plan view showing a second fixing structure of a voltage dividing plate according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of a transfer device transferring a supported component to a carrier substrate according to an embodiment of the present invention
  • FIG. 9 is a schematic top plan view showing a plurality of voltage dividing plates disposed on a carrier substrate according to an embodiment of the present invention.
  • An aspect of an embodiment of the present invention provides a support apparatus including: a carrier substrate carrying a carried member, the carrier substrate having a first major surface facing the carried member and an opposite of the first major surface a second main surface of the side; and a partial pressure plate disposed on the carrier substrate and located between the carrier substrate and the supported member.
  • the pressure dividing plate is configured to be capable of driving the carried member to be separated from the carrier substrate. For example, when separating the carried member and the carrier substrate, the voltage dividing plate moves in a direction away from the carrier substrate to drive the supported member to be separated from the carrier substrate.
  • the supporting apparatus by providing the pressure dividing plate, it is possible to prevent the loaded member from being damaged when separated from the carrier substrate, thereby improving product yield; for example, when an external force is applied to separate the carried member from the carrier substrate, This external force can be applied directly to the partial pressure plate without being directly applied to the carried member to avoid damage to the loaded member.
  • the supported component is a display substrate; in this case, by providing a voltage dividing plate, the display substrate can be prevented from being damaged when separated from the carrier substrate, and the product yield can be improved, especially for a large-sized display substrate. A deformation variable when separated from the carrier substrate.
  • Figure 1a is a top plan view of a support device according to an embodiment of the present invention (the load-bearing member blocks the pressure-dividing plate in the figure, and the load-bearing member is shown with low visibility in order to illustrate the partial pressure plate);
  • Figure 1b is a view along Figure 1a.
  • a schematic cross-sectional view of the A-A1 direction. 1a and 1b, the supporting device comprises a carrier substrate 1 having a first major surface 11 facing the supported component 2 and a second major surface 12 on the opposite side of the first major surface; and a partial pressure plate 3, a partial pressure plate 3 is disposed on the carrier substrate 1 On the first major surface, and between the carrier substrate 1 and the supported component 2.
  • the voltage dividing plate 3 moves away from the carrier substrate 1 to drive the carrier member 2 to be separated from the carrier substrate 1.
  • the pressure dividing plate can be clamped by the robot and the partial pressure plate 3 can be moved to move away from the side of the carrier substrate.
  • the pressure-dividing plate may be lifted from the side of the pressure-dividing plate 3 close to the carrier substrate 1 by the jacking mechanism.
  • the carrier substrate 1 is provided with a first through hole 13 penetrating the first main surface 11 and the second main surface 12 in a thickness direction thereof.
  • the support apparatus further comprises a separating device 4 comprising a first projection 42.
  • the first protrusion 42 passes through the first through hole 13 and is placed on the voltage dividing plate 3 to place the pressure dividing plate 3
  • the jacking plate 3 drives the carrier member 2 to be separated from the carrier substrate 1.
  • the separating device 4 further includes a first base 41 on which the first protrusion 42 is disposed.
  • the specific structure of the first base 41 and the first protruding portion 42 is not limited to the structure shown in the figure, as long as the first protruding portion 42 can pass through the first through hole 13 and jack up the pressure dividing plate 3 and The supported member 2 located above the pressure dividing plate 3 may be used.
  • the portion through which the first protrusion 42 passes can be placed on the pressure dividing plate 3, thereby driving the pressure dividing plate 3 to separate the carrier member from the carrier substrate. Therefore, the length of the first protrusion 42 is, for example, larger than the length of the first through hole 13.
  • the first pedestal 41 may be a plate-shaped structure, and the first protrusions 42 are vertically disposed on the surface of the first pedestal 41 facing the carrier substrate 1 and correspond to the first through holes 13 on the carrier substrate 1 in one-to-one correspondence.
  • the first through holes 13 are vertically disposed in the thickness direction of the carrier substrate.
  • Figure 3 shows a schematic view of the carrier member separated from the carrier substrate.
  • the separating device 4 is moved in a direction toward the carrier substrate 1, so that the first protruding portion 42 of the separating device 4 first passes through the first through hole 13 and contacts the pressure dividing plate 3; then, the moving separation device continues to be moved,
  • the pressure dividing plate 3 is jacked up, and the partial pressure plate drives the carried member 2 located above it to move the carrier member 2 and the carrier substrate 1 apart from each other.
  • the first protruding portion 42 and the first through hole 13 may have a one-to-one correspondence.
  • the carried member 2 can be transported to the next process position by a transport device (for example, a robot), and the separating device 4 is moved in a direction away from the carrier substrate 1 so that the first A protrusion 42 exits the first through hole 13 and the partial pressure plate 3 is placed on the carrier substrate 1 again.
  • a transport device for example, a robot
  • the surface of the voltage dividing plate 3 facing the carrier substrate 1 is provided with a positioning structure 31 and/or a bonding structure 32 corresponding to the first through hole 13 , so that the first protruding portion 42 After passing through the first through hole 13, the positioning structure 31 and/or the bonding structure 32 can be positioned to prevent the first protruding portion 41 and the pressure dividing plate 3 from sliding relative to each other during the separation of the carrier substrate 1 from the supported member 2. Stability of separation.
  • the positioning structure 31 may be a blind hole extending from a side of the voltage dividing plate 3 close to the carrier substrate 1 toward a side away from the carrier substrate 1.
  • the "blind hole” refers to a hole that extends from a side of the pressure-dividing plate 3 close to the carrier substrate 1 toward a side away from the carrier substrate 1 without penetrating the pressure-dividing plate 3.
  • the first protrusion 41 of the separating device 4 can be placed in the blind hole after passing through the first through hole 13, avoiding the relative movement of the first protrusion 41 and the pressure dividing plate 3, thereby improving the separation process. stability.
  • a total of six positioning blind holes are illustrated in two rows, but the embodiment of the present invention does not limit this.
  • the number and location of blind holes may correspond to the number and location of the first through holes.
  • the first protrusion 42 is provided with another bonding structure 43.
  • the bonding structure 32 on the pressure dividing plate 3 and the other bonding structure 43 on the first protruding portion 42 are combined with each other to make the first protruding portion in the process of the first protruding portion 42 lifting the pressure dividing plate 3 42 and the pressure dividing plate 3 are fixed to each other to ensure the stability of separation.
  • the joining structure 32 of the pressure dividing plate 3 corresponds to, for example, the coupling structure 43 on the first protruding portion 42 in one-to-one correspondence.
  • the bonding structure 31 on the pressure dividing plate 3 and the other bonding structure 43 on the first protruding portion 42 are coupled to each other by magnetic attraction force, so that the first protruding portion 42 can be easily removed when the first protruding portion 42 is withdrawn from the first through hole 13.
  • a projection 42 and the pressure dividing plate 3 are separated.
  • the other bonding structure 43 on the first protruding portion 42 is a magnet
  • the bonding structure 32 on the voltage dividing plate 3 is a ferromagnetic material
  • the bonding structure 32 of the pressure dividing plate 3 is a magnet
  • the other one on the first protruding portion 42 The bonding structure 43 is a ferromagnetic material; or the other bonding structure 43 on the first protrusion 42 and the bonding structure 32 on the voltage dividing plate 3 are magnets attracted to each other, that is, the magnetic portions of at least the portions in contact with each other are opposite.
  • both the positioning structure 31 and the bonding structure 32 may be provided on the pressure dividing plate 3.
  • a blind hole 31 may be provided on the pressure dividing plate 3 while a magnet or a magnet is disposed at the bottom of the blind hole 31 a ferromagnetic material; correspondingly, the other bonding structure 43 on the first protrusion 42 is provided as a ferromagnetic material or a magnet; thereby, after the first protrusion 42 passes through the first through hole 13, is confined in the blind hole and The magnetic field and the partial pressure plate are adsorbed to each other to further improve the stability of the separation process. That is to say, in this embodiment, the positioning action of the positioning structure and the bonding action of the bonding structure are simultaneously combined, so that the separation process of the carried member and the carrier substrate is more stable.
  • the first major surface of the carrier substrate is provided with a support structure that supports the supported component.
  • the carrier substrate 1 is provided with a support structure 14 on the first major surface 11.
  • the support structure 14 is uniformly disposed, for example, along the edge of the carrier substrate 1.
  • the support structure is provided with a bonding portion that bonds the carried member and the carrier substrate to each other.
  • the bonding portion is disposed on a side of the support structure 14 away from the first major surface 11.
  • the support structure has a dimension in a direction from the carrier substrate to the supported component that is greater than a thickness of the partial pressure plate.
  • FIG. 6b is a schematic top view showing a support structure disposed on a carrier substrate in a supporting device according to an embodiment of the invention. Referring to FIG. 6b, the dimension h1 of the support structure 14 from the carrier substrate 1 to the supported component 2 is greater than the thickness h2 of the partial pressure plate 3. That is, the size of the support structure 14 in the thickness direction of the carrier substrate 1 is larger than the thickness of the partial pressure plate 3, so that the carrier member 2 is placed on the support structure 14 when the carrier substrate 1 carries the member to be carried. For example, as shown in FIG. 6b, when the carrier substrate 1 carries the carried member, the loaded member 2 does not come into contact with the pressure dividing plate 3.
  • the first main surface 11 of the carrier substrate 1 is provided with a first fixing structure 15; the surface of the voltage dividing plate 3 facing the carrier substrate 1 Provided with a second fixing structure 33 corresponding to the first fixing structure 15; and the first fixing structure 15 and the second fixing structure 33 are coupled to each other to fix the pressure dividing plate 3 to the bearing Substrate.
  • the first fixing structure 15 and the second fixing structure 33 are bonded to each other by magnetic attraction, so that the pressure dividing plate 3 and the carrier substrate 1 can be easily separated.
  • the first fixing structure 15 is a ferromagnetic material
  • the second fixing structure 33 is a magnet
  • the first fixing structure 15 is a magnet
  • the second fixing structure 33 is a ferromagnetic material
  • the first fixing structure 15 and the second fixing structure 33 Magnets that are attracted to each other, that is, magnet poles of portions where the first fixing structure 15 and the second fixing structure 33 are in contact with each other The opposite is true.
  • the pressure-dividing plate 3 and the carrier substrate 1 By joining the pressure-dividing plate 3 and the carrier substrate 1 to each other through the first fixing structure 15 and the second fixing structure 33, the pressure-dividing plate 3 and the carrier substrate 1 can be fixed to each other when the pressure-dividing plate 3 is placed on the carrier substrate 1. Further, in a case where the first fixing structure 15 and the second fixing structure 33 are coupled to each other by magnetic attraction, the pressure dividing plate 3 can be easily separated from the carrier substrate 1 during the separation.
  • the carrier substrate is further provided with a second through hole 16 penetrating the first main surface and the second main surface; the voltage dividing plate is provided with a through hole 34 corresponding to the position of the second through hole 16;
  • the support device also includes a transfer device 5 that includes a second projection 52. Referring to FIG. 8, in the process of placing the carried member 2 on the carrier substrate 1, the second protrusion 52 passes through the second through hole 16 and the through hole 34 of the pressure dividing plate 3, and the carried member 2 is placed at On the second protrusion 52, the second protrusion 52 is then controlled to move downward to move the carried member 2 onto the carrier substrate 1.
  • the transfer device 5 further includes a second base 51 on which the second protrusion 52 is disposed.
  • the second pedestal 51 may be a plate-like structure, and the second protrusion 52 may be disposed on a surface of the plate-like structure facing the carrier substrate 1.
  • the second protrusion 52 corresponds in position to the through hole 34 on the voltage dividing plate 3 and the second through hole 16 on the carrier substrate 1.
  • the second protrusion 52 can simultaneously pass through the second through hole 16 and the through hole 34 on the pressure dividing plate 3, that is, the length of the second protrusion 52 is greater than the depth of the second through hole 16 and the through hole 34 of the pressure dividing plate 3.
  • the sum of the depths is to move the carried member 2 onto the carrier substrate 1 after passing through the second through hole 16 and the pressure dividing plate 3 corresponding to the through hole 34.
  • the second through holes 16 on the carrier substrate 1 are vertically disposed along the thickness direction thereof, for example, the through holes 34 on the pressure dividing plate 3 are vertically disposed along the thickness direction of the dividing plate 3, and the second protruding portion is perpendicular to The second pedestal 51 is disposed such that the second protrusion 52 can more easily pass through the second through hole 16 and the through hole 34 in the pressure dividing plate 3, thereby transferring the carried member 2 onto the carrier substrate 1.
  • the second projection 52 includes an adsorption device disposed at an end thereof.
  • the adsorption head may be, for example, a vacuum adsorption head to efficiently adsorb and move a member to be carried (for example, a display substrate) onto the carrier substrate.
  • the pressure dividing plates disposed between the supported component and the carrier substrate may be, for example, one or more, that is, one or more voltage dividing plates may be disposed corresponding to one of the supported components.
  • the voltage dividing plate may be uniformly arranged along the first main surface of the carrier substrate (shown in the drawing) There are 6 partial pressure plates). The embodiment of the present invention does not limit the number of the partial pressure plates.
  • Another aspect of the present invention provides a supporting method comprising: providing a carrier substrate having a first major surface facing the supported member and a second facing opposite side of the first major surface, and a pressure dividing plate a main surface; wherein the pressure dividing plate is disposed on the first main surface, and the bearing member is disposed above the pressure dividing plate; and the pressure dividing plate is moved toward a side away from the supporting substrate to drive the The carried member is separated from the carrier substrate.
  • the carrier substrate has a first through hole penetrating the first main surface and the second main surface in a thickness direction thereof; and the dividing plate is moved away from the side of the carrier substrate
  • Moving to drive the carried member to be separated from the carrier substrate comprises: providing a separating device; the separating device comprising a first protrusion disposed on the first base; and causing the first protrusion Passing through the first through hole and over the partial pressure plate to jack up the partial pressure plate, so that the partial pressure plate drives the carried member to be separated from the carrier substrate.
  • a positioning structure and/or a bonding structure corresponding to the first through hole is disposed on a surface of the voltage dividing plate facing the carrier substrate; the first protruding portion passes through the first a through hole is then combined with the partial pressure plate by the positioning structure and/or the combined structure to the first protruding portion and the partial pressure plate during the process of lifting the partial pressure plate by the first protrusion Fixed to each other.
  • the separation of the supported member from the carrier substrate can be made more stable by providing a positioning structure and/or a bonding structure corresponding to the first protrusion on the voltage dividing plate.
  • the positioning structure is a blind hole extending from a side of the voltage dividing plate facing the carrier substrate toward a side away from the carrier substrate.
  • the first protrusion can stand against the top of the blind hole, thereby avoiding sliding between the first protrusion and the pressure dividing plate during the separation process, further improving the separation process. stability.
  • the first protrusion is provided with another bonding structure; and the bonding structure on the voltage dividing plate and another bonding structure on the first protrusion are combined with each other to A protrusion fixes the first protrusion and the pressure dividing plate to each other in the process of jacking up the pressure dividing plate.
  • the bonding structure on the voltage dividing plate and the other bonding structure on the first protrusion are combined with each other by magnetic attraction.
  • the pressure dividing plate and the first protruding portion are combined with each other by attracting magnetic attraction forces, not only the structure is simple, but also the partial pressure can be quickly realized.
  • the positioning of the plate and the first protrusions with each other improves the separation efficiency.
  • the first major surface of the carrier substrate is provided with a support structure that supports the supported component.
  • the support structure is provided with a bond that bonds the supported component to the carrier substrate.
  • the supported member can be stably placed on the carrier substrate by providing a bonding portion on the support structure.
  • the support structure has a dimension in a direction from the carrier substrate to the supported component that is greater than a thickness of the partial pressure plate.
  • the carrier substrate is provided with a second through hole penetrating the first main surface and the second main surface; the voltage dividing plate is provided with a pass corresponding to the position of the second through hole And the supporting method further includes: providing a transfer device including a second protrusion; and after the second protrusion passes through the second through hole and the through hole of the voltage dividing plate The carried member is placed on the second protrusion, and then the second protrusion is controlled to move the carried member placed thereon onto the carrier substrate.
  • the terms “mounted,” “connected,” and “connected” are used in a broad sense, and may be, for example, a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be directly connected, or it can be connected indirectly through an intermediate medium, which can be the internal connection of two components.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

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Abstract

一种支撑设备及支撑方法，支撑设备包括：承载基板（1），用于承载被承载部件（2），承载基板具有面向被承载部件的第一主表面（11）以及位于第一主表面的相反侧的第二主表面（12）；以及分压板（3），设置在承载基板的第一主表面上并位于承载基板和被承载部件之间，其中分压板构造为可带动被承载部件与承载基板分离。能够避免被承载部件在与承载基板分离时受到损伤，提高产品良率。

Description

支撑设备及支撑方法 技术领域
本发明的实施例涉及一种支撑设备及支撑方法。
背景技术
在显示基板的制备过程中，需要对显示基板进行各种加工处理，例如蒸镀、溅射等。在进行各种加工处理时，通常采用承载基板支撑显示基板。在加工处理结束之后，承载基板与显示基板被一同传送到分离腔室，通过顶销基座将显示基板顶起，以实现显示基板与承载基板的分离。在该分离过程中，由于显示基板与顶销的接触面积较小，显示基板在与顶销接触的位置处承受压力，从而容易损伤显示基板，导致产品缺陷，尤其是对于大尺寸的显示基板而言可能会导致严重的形变量。
发明内容
本发明的一个方面提供了一种支撑设备，包括：承载基板，承载被承载部件，所述承载基板具有面向所述被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；以及分压板，设置在所述承载基板的第一主表面上并位于所述承载基板和所述被承载部件之间；其中所述分压板构造为可带动所述被承载部件与所述承载基板分离。
在一个实施例中，所述承载基板在其厚度方向上设置贯穿所述第一主表面和所述第二主表面的第一通孔；所述支承装置还包括分离装置，所述分离装置包括第一突出部；并且所述第一突出部可穿过所述第一通孔并将所述分压板顶起。
在一个实施例中，所述分压板的面向所述承载基板的表面上设置有位置与所述第一通孔对应的定位结构和/或结合结构。
在一个实施例中，所述定位结构为从所述分压板的面向所述承载基板的一侧向远离所述承载基板的一侧延伸的盲孔。
在一个实施例中，所述第一突出部上设置有另一结合结构；并且所述分 压板上的结合结构和所述第一突出部上的另一结合结构相互结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。
在一个实施例中，所述分压板上的结合结构和所述第一突出部上的另一结合结构通过磁性吸附力而相互结合。
在一个实施例中，所述承载基板的所述第一主表面上设有支撑结构，该支撑结构支撑所述被承载部件。
在一个实施例中，所述支撑结构设置有粘结部，该粘结部将所述被承载部件粘结至所述承载基板。
在一个实施例中，所述支撑结构在从所述承载基板到所述被承载部件的方向上的尺寸大于所述分压板的厚度。
在一个实施例中，所述承载基板的所述第一主表面上设置有第一固定结构；所述分压板的面向所述承载基板的表面上设置有位置与所述第一固定结构相对应的第二固定结构；并且所述第一固定结构和所述第二固定结构相互结合以将所述分压板固定到所述承载基板。
在一个实施例中，所述第一固定结构和所述第二固定结构通过磁性吸附力而彼此结合。
在一个实施例中，所述承载基板设有贯穿所述第一主表面和所述第二主表面的第二通孔；所述分压板设置有与所述第二通孔位置相对应的通孔；所述支撑设备还包括转移装置，该转移装置包括第二突出部；并且所述第二突出部可穿过所述第二通孔和所述分压板的所述通孔。
在一个实施例中，所述第二突出部包括设置在其端部的吸附装置。
本发明的另一个方面提供了一种支撑方法，包括：提供承载基板，承载被承载部件，所述承载基板具有面向被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；提供分压板，设置在所述承载基板的第一主表面上并位于所述承载基板和所述被承载部件之间；使所述分压板向远离所述承载基板的一侧运动，以带动所述被承载部件与所述承载基板分离。
在一个实施例中，所述承载基板在其厚度方向上设置贯穿所述第一主表面和所述第二主表面的第一通孔；并且使所述分压板向远离所述承载基板的一侧运动以带动所述被承载部件与所述承载基板分离包括：提供分离装置， 所述分离装置包括第一突出部；并且使所述第一突出部穿过所述第一通孔且将所述分压板顶起，从而所述分压板带动所述被承载部件与所述承载基板分离。
在一个实施例中，所述分压板的面向所述承载基板的表面上设置有位置与所述第一通孔对应的定位结构和/或结合结构；所述第一突出部穿过所述第一通孔后通过所述定位结构和/或结合结构与所述分压板结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。
在一个实施例中，所述承载基板设有贯穿所述第一主表面和所述第二主表面的第二通孔；所述分压板设置有与所述第二通孔位置相对应的通孔；并且所述支撑方法还包括：提供转移装置，该转移装置包括第二突出部；并且在所述第二突出部穿过所述第二通孔和所述分压板的所述通孔之后，所述被承载部件被放置在所述第二突出部上，然后控制第二突出部运动以将放置在其上的被承载部件移动至所述承载基板上。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a为本发明实施例的支撑设备的俯视示意图；
图1b为沿图1a的A-A1方向的剖视示意图；
图2a为本发明实施例的设有第一通孔的承载基板的结构示意图；
图2b为本发明实施例的分离装置结构示意图；
图3为本发明实施例的将被承载部件与承载基板分离的示意图；
图4a为本发明实施例的分压板设有盲孔的俯视示意图；
图4b为图4a的侧视示意图；
图5a为本发明实施例的第一突出部设有另一结合结构的示意图；
图5b为本发明实施例的分压板设有结合结构的示意图；
图6a为本发明实施例的在承载基板上设置支撑结构的俯视示意图；
图6b为沿图6a的C-C1方向的剖视示意图；
图7a为本发明实施例的承载基板设置第一固定结构的俯视示意图；
图7b为本发明实施例的分压板设置第二固定结构的俯视示意图；
图8为本发明实施例的转移装置将被承载部件转移至承载基板的示意图；以及
图9为本发明实施例的承载基板上设置多个分压板的俯视示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例的一个方面提供了一种支撑设备，包括：承载基板，承载被承载部件，所述承载基板具有面向所述被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；以及分压板，设置在所述承载基板上并位于所述承载基板和所述被承载部件之间。分压板构造为可带动所述被承载部件与所述承载基板分离。例如，在分离所述被承载部件与所述承载基板时，所述分压板向远离所述承载基板的方向运动以带动所述被承载部件与所述承载基板分离。在根据本发明实施例的支撑设备中，通过设置分压板，可避免被承载部件在与承载基板分离时受到损伤，提高产品良率；例如，在施加外力以分离被承载部件与承载基板时，该外力可以直接施加在分压板上而不直接施加在被承载部件上，以避免被承载部件受到损伤。例如，被承载部件为显示基板；在此情形下，通过设置分压板，可避免显示基板在与承载基板分离时受到损伤，提高产品良率，尤其是对于大尺寸显示基板而言可以明显降低其在与承载基板分离时的形变量。
下面，将结合附图对根据本发明实施例的支撑设备进行详细的描述。
图1a为本发明实施例的支撑设备的俯视示意图(图中被承载部件遮挡住分压板，为了示意出分压板，被承载部件采用了低可透视度示出)；图1b为沿图1a的A-A1方向的剖视示意图。参照图1a和图1b，支撑设备包括承载基板1，承载基板具有面向被承载部件2的第一主表面11以及位于第一主表面相反侧的第二主表面12；以及分压板3，分压板3设置于承载基板1的 第一主表面上，且位于承载基板1和被承载部件2之间。在分离被承载部件2与承载基板1时，分压板3向远离承载基板1的方向运动，以带动被承载部件2与承载基板1分离。例如，可以通过机械手夹住分压板，并带动分压板3向远离承载基板一侧运动。例如，也可以是通过顶起机构，从分压板3的靠近承载基板1的一侧将分压板顶起。
在一个实施例中，参照图2a，所述承载基板1在其厚度方向上设置贯穿所述第一主表面11和所述第二主表面12的第一通孔13。参照图2b，所述支撑设备还包括分离装置4，分离装置4包括第一突出部42。在分离所述被承载部件2与所述承载基板1的过程中，所述第一突出部42穿过所述第一通孔13且顶在所述分压板3上以将所述分压板3顶起，从而所述分压板3带动所述被承载部件2与所述承载基板1分离。例如，分离装置4还包括第一基座41，第一突出部42设置在第一基座41上。
需要说明的是，第一基座41和第一突出部42的具体结构不限于图中所示的结构，只要保证第一突出部42可以穿过第一通孔13并顶起分压板3及位于分压板3上方的被承载部件2即可。例如，第一突出部42在穿过第一通孔13后，穿出的部分可以顶在分压板3上，从而带动分压板3将被承载部件与承载基板分离。因此，第一突出部42的长度例如大于第一通孔13的长度。例如，第一基座41可以为板形结构，第一突出部42垂直设置于第一基座41的面向承载基板1的表面上且与承载基板1上的第一通孔13一一对应。例如，第一通孔13沿承载基板的厚度方向垂直设置。通过垂直设置第一突出部及第一通孔，可以提高分离过程的可靠性，避免损伤基板。
图3示出了被承载部件与承载基板分离的示意图。如图3所示，沿着朝向承载基板1的方向移动分离装置4，使分离装置4的第一突出部42首先穿过第一通孔13并接触分压板3；然后，继续移动分离装置，将分压板3顶起，进而分压板带动位于其上方的被承载部件2运动以使被承载部件2与承载基板1彼此分离。例如，如图3所示，第一突出部42与第一通孔13可以一一对应。通过设置分压板，可以使受力点位于分压板上，避免被承载部件直接受力而造成损伤。在被承载部件2与承载基板1彼此分离之后，可以采用输送装置(例如，机械手)将被承载部件2输送到下一个工序位置，并且分离装置4沿着远离承载基板1的方向移动以使得第一突出部42退出第一通孔 13且将分压板3重新放置在承载基板1上。
在一个实施例中，所述分压板3的面向所述承载基板1的表面上设置有位置与所述第一通孔13对应的定位结构31和/或结合结构32，从而第一突出部42在穿过第一通孔13后，可通过定位结构31和/或结合结构32定位，防止承载基板1与被承载部件2分离过程中，第一突出部41与分压板3发生相对滑动，确保分离的稳定性。
例如，参照图4a和图4b，定位结构31可以为从分压板3的靠近承载基板1的一侧向远离承载基板1的一侧延伸的盲孔。“盲孔”是指从分压板3的靠近承载基板1的一侧向远离承载基板1的一侧延伸而未穿通分压板3的孔。通过设置盲孔，例如分离装置4的第一突出部41在穿过第一通孔13后可以顶在这些盲孔中，避免第一突出部41与分压板3相对运动，从而提高分离过程的稳定性。需要说明的是，图4a和图4b中示意出了两行共六个定位盲孔，但本发明实施例对此不作限制。例如，盲孔的数量和位置可以与第一通孔的数量和位置对应。
在一个实施例中，参照图5a和图5b，所述第一突出部42上设置有另一结合结构43。所述分压板3上的结合结构32和所述第一突出部42上的另一结合结构43相互结合，以在所述第一突出部42将分压板3顶起的过程中第一突出部42与分压板3相互固定，确保分离的稳定性。分压板3的结合结构32例如与第一突出部42上的结合结构43一一对应。
例如，分压板3上的结合结构31和第一突出部42上的另一结合结构43通过磁性吸附力而相互结合，这样可以在第一突出部42退出第一通孔13时容易地将第一突出部42和分压板3分离。例如，第一突出部42上的另一结合结构43为磁铁，分压板3上的结合结构32为铁磁性材料；或者分压板3的结合结构32为磁铁，第一突出部42上的另一结合结构43为铁磁性材料；或者第一突出部42上的另一结合结构43与分压板3上的结合结构32为彼此吸引的磁铁，即至少二者相接触的部分的磁性相反。通过使第一突出部42上的另一结合结构43与分压板3的结合结构32通过磁性吸附力相互结合，可以使被承载部件与承载基板的分离更加稳定。
例如，可以在分压板3上设置定位结构31和结合结构32二者。进一步地，例如，可以在分压板3上设置盲孔31，同时在盲孔31底部设置磁铁或 铁磁性材料；相应的，将第一突出部42上的另一结合结构43设置为铁磁性材料或磁铁；从而使第一突出部42穿过第一通孔13之后，限制在盲孔内并通过磁力与分压板彼此吸附，进一步提高分离过程的稳定性。也就是说，在该实施例中，同时结合了定位结构的定位作用以及结合结构的结合作用，从而使被承载部件与承载基板的分离过程更加稳定。
在一个实施例中，所述承载基板的所述第一主表面上设有支撑结构，该支撑结构支撑所述被承载部件。参照图6a，承载基板1在第一主表面11上设置有支撑结构14。该支撑结构14例如沿承载基板1的边缘均匀设置。
在一个实施例中，所述支撑结构设置有粘结部，该粘结部将所述被承载部件与所述承载基板彼此粘结。例如，粘接部设置于支撑结构14的远离第一主表面11一侧。通过设置粘结部，可以将被承载部件更加稳固地放置在承载基板上。
在一个实施例中，所述支撑结构在从所述承载基板到所述被承载部件的方向上的尺寸大于所述分压板的厚度。图6b为本发明实施例的支撑设备中承载基板上设置支撑结构的俯视示意图。参照图6b，支撑结构14从承载基板1到被承载部件2的方向上的尺寸h1大于分压板3的厚度h2。也就是说，支撑结构14在承载基板1的厚度方向的尺寸大于分压板3的厚度，从而在承载基板1承载被承载部件时，被承载部件2放置在支撑结构14上。例如，如图6b所示，在承载基板1承载被承载部件时，被承载部件2并不与分压板3接触。
在一个实施例中，参照图7a和图7b，所述承载基板1的所述第一主表面11上设置有第一固定结构15；所述分压板3的面向所述承载基板1的表面上设置有位置与所述第一固定结构15相对应的第二固定结构33；并且所述第一固定结构15和所述第二固定结构33相互结合以将所述分压板3固定到所述承载基板。
例如，所述第一固定结构15和所述第二固定结构33通过磁性吸附力而彼此结合，这样可以容易分离分压板3和承载基板1。例如第一固定结构15为铁磁材料，第二固定结构33为磁铁；或者第一固定结构15为磁铁，第二固定结构33为铁磁材料；或者第一固定结构15和第二固定结构33为彼此吸引的磁铁，即第一固定结构15与第二固定结构33彼此接触的部分的磁铁极 性相反。通过使分压板3与承载基板1通过第一固定结构15和所述第二固定结构33彼此结合，可以在分压板3放置在承载基板1上时使分压板3与承载基板1彼此固定。另外，在所述第一固定结构15和所述第二固定结构33通过磁性吸附力而彼此结合的情形下，可以在分离的过程中容易地将分压板3与承载基板1分离开。
在一个实施例中，参照图8，承载基板还设有贯穿第一主表面和第二主表面的第二通孔16；分压板设置有与第二通孔16位置相对应的通孔34；支撑设备还包括转移装置5，该转移装置5包括第二突出部52。参照图8，在将被承载部件2放置在承载基板1上的过程中，第二突出部52穿过所述第二通孔16和分压板3的通孔34，将被承载部件2放置在所述第二突出部52上，然后控制第二突出部52向下运动以将被承载部件2移动至承载基板1上。在被承载部件2移动至承载基板1上之后，继续向下移动第二突出部52以将第二突出部52移出第二通孔16和分压板3的通孔34。例如，转移装置5还包括第二基座51，第二突出部52设置在第二基座51上。
例如，第二基座51可以为板状结构，第二突出部52可以设置于该板状结构的面向承载基板1的表面上。第二突出部52在位置上与分压板3上的通孔34和承载基板1上的第二通孔16相对应对应。第二突出部52可以同时穿过第二通孔16和分压板3上的通孔34，即第二突出部52的长度大于第二通孔16的深度与分压板3上的通孔34的深度之和，以在穿过第二通孔16和分压板3对应通孔34之后，将被承载部件2移动至承载基板1上。继续参照图7，例如，承载基板1上的第二通孔16沿其厚度方向垂直设置，例如分压板3上的通孔34沿分压板3的厚度方向垂直设置，且第二突出部垂直于第二基座51设置，从而第二突出部52可以更加容易的穿过第二通孔16和分压板3上的通孔34，进而将被承载部件2转移至承载基板1上。
在一个实施例中，所述第二突出部52包括设置在其端部的吸附装置。该吸附头例如可以为真空吸附头，以有效的将被承载部件(例如显示基板)吸附并移动到承载基板上。
需要说明的是，设置于被承载部件和承载基板之间的分压板例如可以为一个或多个，也就是说，对应于一个被承载部件可以设置一个或多个分压板。参照图9，例如，分压板可以是沿承载基板的第一主表面均匀布置(图中示 出了6个分压板)。本发明实施例对分压板的数量不作限制。
本发明的另一个方面提供了一种支撑方法，包括：提供承载基板和分压板，所述承载基板具有面向被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；其中，所述分压板设置于所述第一主表面上，被承载部件设置于所述分压板的上方；使所述分压板向远离所述承载基板的一侧运动，以带动所述被承载部件与所述承载基板分离。
在一个实施例中，所述承载基板在其厚度方向上设置贯穿所述第一主表面和所述第二主表面的第一通孔；使所述分压板向远离所述承载基板的一侧运动，以带动所述被承载部件与所述承载基板分离包括：提供分离装置；所述分离装置包括设置于所述第一基座上的的第一突出部；并且使所述第一突出部穿过所述第一通孔且顶在所述分压板上以将所述分压板顶起，从而所述分压板带动所述被承载部件与所述承载基板分离。
在一个实施例中，所述分压板的面向所述承载基板的表面上设置有位置与所述第一通孔对应的定位结构和/或结合结构；所述第一突出部穿过所述第一通孔后通过所述定位结构和/或结合结构与所述分压板结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。通过在分压板上设置与第一突出部对应的定位结构和/或结合结构，可以使被承载部件与承载基板的分离更加稳定。
在一个实施例中，所述定位结构为从所述分压板的面向所述承载基板的一侧向远离所述承载基板的一侧延伸的盲孔。例如，第一突出部在穿过承载基板的第一通孔之后，可以顶住盲孔的顶部，从而避免第一突出部与分压板之间在分离过程中发生彼此滑动，进一步提高分离过程的稳定性。
在一个实施例中，所述第一突出部上设置有另一结合结构；并且所述分压板上的结合结构和所述第一突出部上的另一结合结构相互结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。通过在分压板上设置结合结构并在第一突出部上设置另一结合结构，可以使第一突出部与分压板彼此固定的效果更好，提高分离过程的稳定性。
在一个实施例中，所述分压板上的结合结构和所述第一突出部上的另一结合结构通过磁性吸附力而相互结合。通过采用磁性吸附力彼此吸引的方式使分压板与第一突出部彼此结合，不仅结构简单，而且能够快速的实现分压 板与第一突出部的彼此定位，提高了分离效率。
在一个实施例中，所述承载基板的所述第一主表面上设有支撑结构，该支撑结构支撑所述被承载部件。
在一个实施例中，所述支撑结构设置有粘结部，该粘结部将所述被承载部件粘结至所述承载基板。通过在支撑结构上设置粘结部，可以将被承载部件稳定地放置在承载基板上。
在一个实施例中，所述支撑结构在从所述承载基板到所述被承载部件的方向上的尺寸大于所述分压板的厚度。通过限定支撑结构与分压板的尺寸，可以在承载基板承载被承载部件时使被承载部件通过支撑结构支撑。
在一个实施例中，所述承载基板设有贯穿所述第一主表面和所述第二主表面的第二通孔；所述分压板设置有与所述第二通孔位置相对应的通孔；并且所述支撑方法还包括：提供转移装置，该转移装置包括第二突出部；并且在所述第二突出部穿过所述第二通孔和所述分压板的所述通孔之后，所述被承载部件被放置在所述第二突出部上，然后控制第二突出部运动以将放置在其上的被承载部件移动至所述承载基板上。
另外，以上有关分压板、承载基板的结构的各种变形，均可在本发明实施例的支撑方法中采用，并具有相应的技术效果。本发明实施例在此不作赘述。
在本文中，诸如“第一”、“第二”等术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不要求或者暗示这些实体或操作之间存在任何关系或者顺序。术语“包括”、“包含”这些表述为开放式的，并不排除所包括的过程、方法、物品，还存在其他要素。还需要说明的是，“上”、“下”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2016年5月27日递交的第201610365366.8号中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (17)

  1. 一种支撑设备，包括：
    承载基板，承载被承载部件，所述承载基板具有面向所述被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；以及
    分压板，设置在所述承载基板的第一主表面上并位于所述承载基板和所述被承载部件之间，
    其中所述分压板构造为可带动所述被承载部件与所述承载基板分离。
  2. 根据权利要求1所述的支撑设备，其中，
    所述承载基板在其厚度方向上设置贯穿所述第一主表面和所述第二主表面的第一通孔；
    所述支承装置还包括分离装置，所述分离装置包括第一突出部；并且
    所述第一突出部可穿过所述第一通孔并将所述分压板顶起。
  3. 根据权利要求2所述的支撑设备，其中，所述分压板的面向所述承载基板的表面上设置有位置与所述第一通孔对应的定位结构和/或结合结构。
  4. 根据权利要求3所述的支撑设备，其中，所述定位结构为从所述分压板的面向所述承载基板的一侧向远离所述承载基板的一侧延伸的盲孔。
  5. 根据权利要求3所述的支撑设备，其中，
    所述第一突出部上设置有另一结合结构；并且
    所述分压板上的结合结构和所述第一突出部上的另一结合结构相互结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。
  6. 根据权利要5所述的支撑设备，其中，所述分压板上的结合结构和所述第一突出部上的另一结合结构通过磁性吸附力而相互结合。
  7. 根据权利要求1至6任一项所述的支撑设备，其中，
    所述承载基板的所述第一主表面上设有支撑结构，该支撑结构支撑所述被承载部件。
  8. 根据权利要求7所述的支撑设备，其中，所述支撑结构设置有粘结部，该粘结部将所述被承载部件粘结至所述承载基板。
  9. 根据权利要求7所述的支撑设备，其中，所述支撑结构在从所述承载 基板到所述被承载部件的方向上的尺寸大于所述分压板的厚度。
  10. 根据权利要求1至6任一项所述的支撑设备，其中，
    所述承载基板的所述第一主表面上设置有第一固定结构；
    所述分压板的面向所述承载基板的表面上设置有位置与所述第一固定结构相对应的第二固定结构；并且
    所述第一固定结构和所述第二固定结构相互结合以将所述分压板固定到所述承载基板。
  11. 根据权利要求10所述的支撑设备，其中，所述第一固定结构和所述第二固定结构通过磁性吸附力而彼此结合。
  12. 根据权利要求1至6任一项所述的支撑设备，其中，
    所述承载基板设有贯穿所述第一主表面和所述第二主表面的第二通孔；
    所述分压板设置有与所述第二通孔位置相对应的通孔；
    所述支撑设备还包括转移装置，该转移装置包括第二突出部；并且
    所述第二突出部可穿过所述第二通孔和所述分压板的所述通孔。
  13. 根据权利要求12所述的支撑设备，其中，所述第二突出部包括设置在其端部的吸附装置。
  14. 一种支撑方法，包括：
    提供承载基板，承载被承载部件，所述承载基板具有面向被承载部件的第一主表面以及位于所述第一主表面的相反侧的第二主表面；
    提供分压板，设置在所述承载基板的第一主表面上并位于所述承载基板和所述被承载部件之间；
    使所述分压板向远离所述承载基板的一侧运动，以带动所述被承载部件与所述承载基板分离。
  15. 根据权利要求14所述的支撑方法，其中，
    所述承载基板在其厚度方向上设置贯穿所述第一主表面和所述第二主表面的第一通孔；并且
    使所述分压板向远离所述承载基板的一侧运动以带动所述被承载部件与所述承载基板分离包括：
    提供分离装置，所述分离装置包括第一突出部；并且
    使所述第一突出部穿过所述第一通孔且将所述分压板顶起，从而所述分 压板带动所述被承载部件与所述承载基板分离。
  16. 根据权利要求15所述的支撑方法，其中，所述分压板的面向所述承载基板的表面上设置有位置与所述第一通孔对应的定位结构和/或结合结构；所述第一突出部穿过所述第一通孔后通过所述定位结构和/或结合结构与所述分压板结合，以在所述第一突出部将所述分压板顶起的过程中所述第一突出部与所述分压板相互固定。
  17. 根据权利要求14至16任一项所述的支撑方法，其中，
    所述承载基板设有贯穿所述第一主表面和所述第二主表面的第二通孔；
    所述分压板设置有与所述第二通孔位置相对应的通孔；并且
    所述支撑方法还包括：
    提供转移装置，该转移装置包括第二突出部；并且
    在所述第二突出部穿过所述第二通孔和所述分压板的所述通孔之后，所述被承载部件被放置在所述第二突出部上，然后控制第二突出部运动以将放置在其上的被承载部件移动至所述承载基板上。
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