WO2018014959A1 - Unité électroluminescente optoélectronique - Google Patents

Unité électroluminescente optoélectronique Download PDF

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Publication number
WO2018014959A1
WO2018014959A1 PCT/EP2016/067361 EP2016067361W WO2018014959A1 WO 2018014959 A1 WO2018014959 A1 WO 2018014959A1 EP 2016067361 W EP2016067361 W EP 2016067361W WO 2018014959 A1 WO2018014959 A1 WO 2018014959A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
light emitting
unit
silicone rubber
rubber particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2016/067361
Other languages
English (en)
Inventor
Alias ASLIZA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to PCT/EP2016/067361 priority Critical patent/WO2018014959A1/fr
Publication of WO2018014959A1 publication Critical patent/WO2018014959A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/14—Gas barrier composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/04—Thermoplastic elastomer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Definitions

  • the invention refers to an optoelectronic light emitting unit according to claim 1.
  • Optoelectronic light emitting units can be embodied as light emitting diodes that are at least partially covered with a light-transparent layer.
  • the light-transparent layer has ma ⁇ trix material and fillers and diffusors.
  • the fillers and dif- fusors are made of fumed or fused silicon dioxide.
  • the object of the invention is attained by the optoelectronic light emitting unit according to claim 1. Further embodiments of the light emitting unit are disclosed in the dependant claims.
  • the transparent layer has an improved crack resistance.
  • the im ⁇ proved crack resistance is caused by a lower rigidity of the layer.
  • the heat and ultraviolet light resistance of the layer is in ⁇ creased .
  • the transparent layer comprises particles having a diameter between 1 and 100 ym, especially between 1 and 35 ym. Experiments have shown that this range of diameter provides good mechanical and chemical and physical properties for the layer.
  • the particles have a medium diameter between 0.7 ym and 15 ym, especially between 2 ym and lOym. This medium diameter range provides a good quality for the layer.
  • the rubber particles have a spherical shape. The spherical shape provides an equal elas ⁇ ticity in different directions of the layer.
  • the provided improved light-transparent layer can be used for at least partially covering a light emitting diode.
  • the layer has epoxy resin as a ma ⁇ trix material.
  • the epoxy resin and the silicone rubber parti- cles provide a specific material system with a high function ⁇ ality for the optoelectronic light emitting unit.
  • the sili ⁇ cone rubber particles can easily be mixed in a liquid or pasty epoxy resin material.
  • the epoxy resin material is light-transparent and provides a suitable mechanical protec- tion of the light emitting unit.
  • the silicone rubber particles represent at least 0.1 weight percent of the layer. Depending on the used embodiment, the silicone rubber particles may represent more than 0.1 weight percent of the layer. The silicone rubber particles may represent up to 50 weight percent of the layer or more. This range of mixture between the matrix material and the silicone rubber particles provides a sufficient transparency of the layer and a sufficient rigidity of the layer and a sufficient elasticity of the layer.
  • the silicone rubber particles have a hard ⁇ ness between 10 durometer A and 90 durometer A. This range of hardness can be used for different applications of the light emitting unit to provide a transparent layer with suitable properties .
  • the silicone rubber particles have a tensile strength between 5 N/mm 2 and 15 N/mm 2 . This range of tensile strength is sufficient for the silicone rubber mate ⁇ rial in the provided transparent layer.
  • the transparent layer may have fur ⁇ ther particles and further material, for example luminescent material.
  • the luminescent material is embodied to convert a wave length of light to another wave length.
  • the luminescent material may be used to convert a blue light of a light emit- ting unit with a converted orange light to attain a white light .
  • the silicone rubber particles have a moisture of less than 0.5 % preferably less than 0.1 weight percent. Therefore, the transparent layer and the light emit ⁇ ting unit are protected against moisture.
  • the silicone rubber particles are coated with a cover layer.
  • the cover layer may be made of epoxy resin.
  • the cover layer is used to improve a compatibil ⁇ ity of the silicone rubber powder and the matrix material.
  • Fig. 1 shows a schematic cross-sectional view of a light emitting unit
  • Fig. 2 shows a top view on the light emitting unit
  • Fig. 3 shows a schematic cross-sectional view of a fur ⁇ ther embodiment of a light emitting unit
  • Fig. 4 shows a top view of the light emitting unit of
  • Fig. 5 shows a cross-sectional view of a further embodi ⁇ ment of a light emitting unit
  • Fig. 6 shows a top view on the light emitting unit of
  • Fig. 7 shows a schematic view of a silicone rubber par- ticle
  • Fig. 8 shows a cluster of silicone rubber particles.
  • Fig. 1 shows a schematic cross-sectional view of a light emitting unit 1 that may for example be embodied as light emitting diode.
  • the light emitting unit may be embodied as an optoelectronic semiconductor chip that is embodied to gener ⁇ ate electromagnetic radiation.
  • the light emitting unit may be embodied as a semiconductor laser diode for example.
  • the light emitting unit 1 comprises at least one emission face 2 that emits electromagnetic radiation for example visible light.
  • the emission face 2 is in this embodiment arranged on an upper side of the light emitting unit 1.
  • the emission face 2 is covered by a layer 3 that is at least transparent for the electromagnetic radiation that is generated by the light emitting unit 1.
  • a layer is transparent if at least 30 % or at least 50% or more of incident electromagnetic radiation is transmitted.
  • the transparent layer 3 comprises silicone rub ⁇ ber particles 4.
  • the layer 3 furthermore comprises matrix ma- terial 12.
  • the matrix material 12 may be for example silicone or epoxy resin.
  • the epoxy resin material may be based on a cycloaliphatic-based epoxy resin material.
  • the silicone rubber particles 4 may be provided as powder and mixed with liquid matrix material and deposited on the emis ⁇ sion face 2.
  • the silicone rubber particles 4 may be homogene- ously mixed in the matrix material 12.
  • the silicone rubber particles 4 have a distinctive property compared to inorganic filler or silicone resin particles.
  • silicone rubber particles Unlike silicone resin powder which has a cage-like structure (polymethylsiloxane) , silicone rubber particles have a linear cross-linked struc- ture that provides a flexible and stress-relieving property.
  • the silicone rubber particles may have a spherical shape. The silicone rubber particles will deform more easily under ex ⁇ erted pressure in contrast to silicone resin powder and anor ⁇ ganic fill
  • the layer 3 may comprise further material despite the matrix material and the silicone rubber particles.
  • filler particles or diffusor particles or luminescent material 13 for converting a wave- length of an electromagnetic radiation may be arranged in the layer 3.
  • the silicone rubber particles are made of an elastomer (rub ⁇ ber-like material) composed of silicone - itself a polymer - containing silicone together with carbon, hydrogen and oxygen. Silicone rubber particles may be embodied as one- or two-part polymers, and may contain fillers to improve proper ⁇ ties. Silicone rubber particles may be made of polysiloxanes that consist of Si-O-Si units. Polysiloxane is very flexible due to large bond angles and bond length when compared to basic polymers such as polyethylene. The silicone rubber par ⁇ ticles are generally non-reactive, stabile and resistant to extreme temperatures from -55 °C to +300 °C while still main ⁇ taining its properties.
  • elastomer rubber ⁇ ber-like material
  • silicone rubber particles may be embodied as one- or two-part polymers, and may contain fillers to improve proper ⁇ ties. Silicone rubber particles may be made of polysiloxanes that consist of Si-O-Si units.
  • Silicone rubber is in its uncured state a highly-adhesive gel or liquid. In order to convert it to a solid, it must be cured, vulcanized or catalysed. This is normally carried out in a two-stage process at a point of production and in a prolonged post-cure process. Silicone rubber may be cured with a platinum-catalysed cure system, a condensation cure system or a peroxide cure system.
  • a method for producing silicone rubber is disclosed in EP 0 796 883 Bl .
  • the silicone rubber particles are produced by the company Shin-Etsu with the product names KMP- 594 for example.
  • the silicone rubber particles are produced as a silicone rubber powder and are mixed with a matrix mate ⁇ rial for example epoxy resin.
  • Fig. 2 shows a schematic top view on the emission face 2 of the light emitting unit 1.
  • the layer 3 covers in this embodi ⁇ ment the whole emission face 2.
  • the silicone rubber particles 4 are for example homogeneously distributed in the matrix ma ⁇ terial 12 of the layer 3.
  • side faces 7, 8 of the light emitting unit 1 are covered by the layer 3.
  • the light emitting unit 1 is arranged on a carrier 6.
  • the carrier 6 can be made of sapphire, metal, silicon, silicone, printed circuit board or any other suitable material.
  • the side faces 7, 8 of the layer 3 are covered by the layer 3.
  • the layer 3 comprises a matrix material and the silicone rub ⁇ ber particles 4.
  • the side faces 7, 8 of the light emitting unit 1 may be embodied as emission faces that radiate electromagnetic radiation.
  • Fig. 4 shows a top view on the arrangement of Fig. 3.
  • the layer 3 circumvents the light emitting unit 1 on the four side faces 7, 8, 9, 10.
  • Fig. 5 shows a further embodiment of a light emitting unit 1 that is covered with a layer 3, wherein the layer 3 comprises silicone rubber particles 4.
  • the light emitting unit 1 is arranged on a carrier 6. All side faces 7, 8 and the upper face 2 of the light emitting unit 1 are cov ⁇ ered with the layer 3.
  • Fig. 6 shows a schematic top view on the arrangement of Fig. 5.
  • Fig. 7 shows a schematic view of a silicone rubber particle 4.
  • the silicone rubber particle 4 has in this embodiment a spherical shape. Depending on the used embodiment, the rubber particle may also have other shapes.
  • the silicone rubber particle 4 may comprise a cover layer 5.
  • the cover layer 5 may be made of a material that is different to the material of the silicone rubber particle.
  • the cover layer 5 may be made of the same material as the ma ⁇ trix material of the layer 3.
  • the cover layer 5 may be made of epoxy resin. Since the silicone rubber particle 4 has a spherical shape, it can deform its shape to- wards any direction. Therefore, an increased flexibility of the layer 3 is attained.
  • Fig. 8 shows a schematic illustration of a cluster 11 comprising several silicone rubber particles 4.
  • the silicone rubber particles 4 of the layer 3 may be connected to clusters 11 comprising several single sili ⁇ cone rubber particles 4 for example ten or more.
  • the silicone rubber particles 4 of the cluster 11 may comprise a cover layer 5 as shown in Fig. 7.
  • the layers 3 of the above explained embodiments may addition ⁇ ally comprise fillers, luminescent material or scattering ma ⁇ terial.
  • the layer 3 of the above discussed embodiments may provide a mechanical protection, a chemical protection and may provide an optical function.
  • the layer 3 may be embodied as a scattering layer or as a conversion layer.
  • the layers 3 of the above explained embodiments may have sil ⁇ icone rubber particles that have a diameter between 1 and 100 ym, especially between 1 ym and 30 ym.
  • the layers 3 of the above explained embodiments may have silicone rubber parti ⁇ cles with a medium diameter between 0,7 ym and 15 ym, especially between 2 ym and 10 ym.
  • the layers 3 of the above explained embodiments comprise ma ⁇ trix material and silicone rubber particles, wherein the sil ⁇ icone rubber particles represent 0,1 % to 50% weight of the layer.
  • the layers 3 of the above explained embodiments may have silicone rubber particles with a hardness between 10 and 90 durometer A, especially about 30 durometer A.
  • the layers 3 of the above explained embodiments may have silicone rubber particles with a tensile strength between 5 N/mm2 and 15 N/mm2.
  • the layers 3 of the above explained embodiments may have silicone rubber particles with a moisture of less than 0,5% of weight, preferably less than 0,2% of weight.
  • the layer 3 is direct ⁇ ly arranged on a face of the light emitting unit 1, for exam ⁇ ple on a face of an optoelectronic semiconductor chip.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une unité électroluminescente optoélectronique comprenant un dispositif électroluminescent (1), le dispositif électroluminescent (1) étant au moins partiellement recouvert d'une couche (3), la couche (3) présentant des particules de caoutchouc de silicone.
PCT/EP2016/067361 2016-07-21 2016-07-21 Unité électroluminescente optoélectronique Ceased WO2018014959A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/067361 WO2018014959A1 (fr) 2016-07-21 2016-07-21 Unité électroluminescente optoélectronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/067361 WO2018014959A1 (fr) 2016-07-21 2016-07-21 Unité électroluminescente optoélectronique

Publications (1)

Publication Number Publication Date
WO2018014959A1 true WO2018014959A1 (fr) 2018-01-25

Family

ID=56551379

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/067361 Ceased WO2018014959A1 (fr) 2016-07-21 2016-07-21 Unité électroluminescente optoélectronique

Country Status (1)

Country Link
WO (1) WO2018014959A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0796883B1 (fr) 1996-03-22 2003-07-30 Dow Corning Toray Silicone Company, Limited Poudre de caoutchouc de silicone et procédé de préparation
EP2584619A2 (fr) * 2011-10-18 2013-04-24 Nitto Denko Corporation Feuille d'encapsulation et dispositif semi-conducteur électroluminescent
US20130345359A1 (en) * 2012-06-22 2013-12-26 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
US20140175504A1 (en) * 2012-12-21 2014-06-26 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0796883B1 (fr) 1996-03-22 2003-07-30 Dow Corning Toray Silicone Company, Limited Poudre de caoutchouc de silicone et procédé de préparation
EP2584619A2 (fr) * 2011-10-18 2013-04-24 Nitto Denko Corporation Feuille d'encapsulation et dispositif semi-conducteur électroluminescent
US20130345359A1 (en) * 2012-06-22 2013-12-26 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
US20140175504A1 (en) * 2012-12-21 2014-06-26 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SHIN-ETSU CHEMICAL CO. ET AL: "Shin-Etsu Silicone New Products Guide", 1 March 2016 (2016-03-01), pages 1 - 10, XP055322398, Retrieved from the Internet <URL:https://www.shinetsusilicone-global.com/catalog/pdf/NewProductsGuide_E.pdf> [retrieved on 20161123] *
SHIN-ETSU CHEMICAL CO. ET AL: "Silicone Powder KMP Series", 1 May 2014 (2014-05-01), pages 1 - 8, XP055322284, Retrieved from the Internet <URL:https://www.shinetsusilicone-global.com/catalog/pdf/kmp_e.pdf> [retrieved on 20161123] *

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