WO2018065268A1 - Ensemble comportant un élément d'écartement et une carte de circuit imprimé - Google Patents

Ensemble comportant un élément d'écartement et une carte de circuit imprimé Download PDF

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Publication number
WO2018065268A1
WO2018065268A1 PCT/EP2017/074448 EP2017074448W WO2018065268A1 WO 2018065268 A1 WO2018065268 A1 WO 2018065268A1 EP 2017074448 W EP2017074448 W EP 2017074448W WO 2018065268 A1 WO2018065268 A1 WO 2018065268A1
Authority
WO
WIPO (PCT)
Prior art keywords
spacer
mold body
arrangement
circuit board
spacer element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2017/074448
Other languages
German (de)
English (en)
Inventor
Marco Braun
Sven ISSING
Steffen Meier
Frank Fischer
Stefan Schlatter
Johannes Hirschle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of WO2018065268A1 publication Critical patent/WO2018065268A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to an arrangement according to claim 1.
  • Prior art
  • an improved arrangement can be provided by comprising a mold body, a spacer and a circuit board, at least one electrical connection connecting the mold body to a circuit trace of the circuit board, the spacer being connected to the mold body and mounted on a mold is arranged to the circuit board side facing, wherein the spacer is arranged offset to the electrical connection, wherein the spacer defines a predefined distance between a bottom of the mold body and the circuit board.
  • This embodiment has the advantage that a tilting of the mold body relative to the circuit board can be prevented, so that the distance between the Moldkorper and the printed circuit board is predefined set. Furthermore, a deterioration of the electrical connection is reliably prevented by the spacer.
  • the spacer has a first spacer element.
  • the first spacer is connected to the Moldkorper with a fixed end.
  • the circuit board has a support element.
  • the support element has an electrically conductive material.
  • a free end of the first spacer element faces the support element and preferably lies in sections on the support element.
  • the support element is potential-free.
  • the support element is arranged offset to a contact element of the circuit board.
  • the electrical connection is formed between the mold body and the contact element.
  • the contact element is electrically insulated from the support element.
  • the support element has a first bearing surface and the contact element has a contact surface.
  • the support element and the contact surface are arranged in a common first plane.
  • the spacer comprises a second spacer element.
  • the second spacer is connected to a fixed end with mold body.
  • the first spacer element and the second spacer element are arranged on a common side of the mold body.
  • the first spacer element has a first end face at a free end and the second spacer element has a second end face at a free end.
  • the first end face and the second end face are arranged in a common second plane.
  • the first spacer element and the second spacer element are aligned in parallel.
  • the mold body has a side surface, wherein the side surface and the bottom adjoin one another at an edge, wherein the first spacer is arranged adjacent to the edge.
  • the circuit board has a heat sink, wherein the mold body and the heat sink are connected to each other by means of a thermal connection, wherein the first spacer between the electrical connection and the thermal connection is arranged.
  • the arrangement has a further spacer and a housing, wherein the further spacer is arranged between the housing and a further side surface of the mold body.
  • the further spacer defines a further predefined distance between the mold body and the housing.
  • the housing has a further heat sink, wherein the mold body is thermally connected by means of a further thermal connection with the further heat sink, wherein the further thermal connection comprises a heat conducting means, wherein the second spacer is embedded in the heat conducting means.
  • the further spacer has a third spacer element, wherein the third spacer element is connected to the mold body with a fixed end, the third spacer element having a third end face at a free end of the third spacer element, wherein the third end face rests against the housing.
  • the third spacer element and the first spacer element are arranged in a common fourth plane.
  • the further spacer has a fourth spacer element, wherein the fourth spacer element is connected with a fixed end to the mold body, wherein at a free end of the fourth spacer element.
  • the fourth spacer element has a fourth end face, wherein the fourth end face and the third end face are arranged in a common fifth plane.
  • Figure 1 is a sectional view through an arrangement according to a first embodiment
  • Figure 2 is a sectional view through the arrangement shown in Figure 1 after a first assembly step
  • Figure 3 is a sectional view through the arrangement shown in Figure 1 after a second assembly step
  • Figure 4 is a sectional view through an arrangement according to a second embodiment
  • Figure 5 is a sectional view through the arrangement shown in Figure 4 during the manufacture of the arrangement
  • Figure 6 is a bottom view of a mold body of the arrangement shown in Figures 4 and 5;
  • Figure 7 is a side view of the mold body shown in Figure 6;
  • Figure 8 is a plan view of a printed circuit board of the arrangement shown in Figures 4 to 7;
  • FIG. 9 shows a sectional view along a sectional plane AA shown in FIG. 8 through the printed circuit board shown in FIG. 8;
  • Figure 10 is a bottom view of an arrangement according to a third embodiment;
  • Figure 1 1 is a side view of the arrangement shown in Figure 10;
  • Figure 12 is a plan view of a circuit board of the arrangement shown in Figures 10 and 11;
  • Figure 13 is a bottom view of an assembly according to a fourth embodiment
  • Figure 14 is a plan view of a circuit board of the arrangement shown in Figure 13;
  • Fig. 15 is a sectional view taken along a sectional plane B-B shown in Fig. 14 through the circuit board shown in Fig. 14;
  • Figure 16 is a plan view of an arrangement according to a fifth embodiment.
  • the coordinate system 5 is exemplified as a legal system and has an x-axis, a y-axis and a z-axis.
  • FIG. 1 shows a sectional view through an arrangement 10 according to a first embodiment.
  • the arrangement 10 has a mold body 15, a first spacer 20, a printed circuit board 25, a housing 30 and in addition to the first spacer 20 by way of example a second spacer 35.
  • the housing 30 has a design suitable for "slug-up" components, and the housing has a heat sink 40 opposite the mold body 15.
  • the mold body 15 is disposed between the circuit board 25 and the housing 30.
  • the mold body 15 has a lower side 45 and an upper side 50.
  • the top 50 faces the housing 30.
  • the bottom 45 faces the circuit board 25.
  • the mold body 15 has a first side surface 55 and a second side surface 60.
  • the first side surface 55 is disposed opposite to the second side surface 60.
  • an electronic component 80 is embedded.
  • the electronic component 80 is electrically connected to a first contact element 85, which is arranged, for example, on the first side surface 55.
  • the electronic component 80 may be electrically connected to a second contact element 90, which is arranged, for example, on the second side surface 60.
  • the number of contact elements 85, 90 may be formed differently than shown in FIG.
  • the first contact element 85 and / or the second contact element 90 may be arranged on the underside 45.
  • the Moldgroper 15 forms a housing for the electronic component 80.
  • the Moldkorper is produced by molding.
  • electronic components 80 in particular wire-bonded, soldered or glued microelectronic assemblies, are protected with a thermomechanically adapted, robust encapsulation material, in particular with epoxy resins.
  • the encapsulation material forms the mold body 15.
  • Several variants can be distinguished, in particular casting, premolding, compression molding and transfer molding. Depending on the material used, expansion coefficients ⁇ 10 ppm / K
  • a material in particular encapsulation material, is used in the mold body 15, which has good heat conduction, in particular good thermal conductivity.
  • the heat conduction or the thermal conductivity of the material is formed such that the mold body 15 can conduct the heat energy arising during operation of the electronic component 80, in particular can lead away from it, in particular predominantly predominantly, preferably substantially completely.
  • the printed circuit board 25 has a carrier matrix 65, at least one first printed conductor 70, preferably a second printed conductor 75, a third contact element 95 and preferably at least one fourth contact element 100.
  • the third contact element 95 and the fourth contact element 100 are arranged on an upper side 105 of the printed circuit board 25.
  • the third contact element 95 is electrically connected to the first interconnect 70 and the fourth contact element 100 is electrically connected to the second interconnect 75.
  • the conductor track 70, 75 may be embedded in the carrier matrix 65 of the printed circuit board 25.
  • the first contact element 85 is electrically connected to the third contact element 95 by means of a first electrical connection 1 10.
  • the second contact element 90 is connected to the fourth contact element 100 by means of a second electrical connection 15.
  • the electrical connection 1 10, 1 15 may be formed, for example, as a bonding wire, Gullwin pin or solder joint.
  • the electrical connection 1 10, 1 15 also mechanically connects the mold body 15 with the circuit board 25th
  • the printed circuit board 25 may have a first support element 120 and / or a second support element 125.
  • the support element 120, 125 is connected to the carrier matrix 65 and formed floating.
  • the term potential free is understood to mean that the support element 120, 125 has no connection to a conductor track 70, 75 of the printed circuit board 25.
  • the freedom of potential of the support element 120, 125 is achieved in that the support element 120, 125 offset in the longitudinal direction (x-direction) to the third and / or fourth contact element 95, 100 and / or the conductor track 70, 75 is arranged.
  • the support element 120, 125 has the same material as the third and / or fourth contact element 95, 100 and / or the first and / or second conductor track 70, 75.
  • the third contact element 95 has a contact surface 130
  • the first support element 120 a first contact surface 135
  • the second support element 125 has a second contact surface 140
  • the fourth contact element 100 has a further contact surface 150.
  • the contact surface 130, the further contact surface 150 and the first and second support elements 120, 125 are preferably arranged in a common first plane 155.
  • the first level 155 is formed as an xy plane and preferably arranged parallel to the bottom 45.
  • the first spacer 20 has a first spacer element 160 and preferably at least one second spacer element 165.
  • the first distance element 160 is offset from the second distance element 165.
  • Distance element 160 is connected to the mold body 15 with a fixed end.
  • the first spacer element 160 and the second spacer element 165 are arranged between the underside 45 and the printed circuit board 25.
  • the first spacer 160 and the second spacer 165 are aligned parallel to each other and extend in the z-direction in the embodiment by way of example.
  • the first spacer element 160 and the second spacer element 165 may also be aligned with each other inclined. Also, a different orientation than shown in Figure 1 to the z-axis, conceivable.
  • the first spacer element 160 has a first end face 170.
  • the first end face 170 bears against the first support element 120.
  • the second spacer 165 is connected to the mold body 15 with a fixed end.
  • the second spacer 165 has a second end face 175, wherein with the second end face 175, the second
  • Distance element 165 rests against the second support element 125.
  • the first end face 170 and the second end face 175 are arranged in a common second plane 180.
  • the second plane 180 can be arranged to overlap the first plane 155 when the first and second end faces 170, 175 have a contact contact with the respective associated bearing element 120, 125.
  • the second plane 180 can also be arranged offset relative to the first plane 155 if the first end face 170 is arranged at a distance from the first contact surface 135 and the second end face 175 is arranged at a distance from the second contact surface 140.
  • the arrangement of the first spacer 20 between the mold body 15 and the circuit board 25, a predefined first distance di exactly between the bottom 45 of the mold body 15 and the circuit board 25 can be adjusted. In particular, this is characterized in that the first and second end face
  • the first spacer element 160 and / or the second spacer element 165 may be formed in one piece and with the same material as the mold body 15. Also, the first spacer 160 and / or the second spacer 165 may have a different material to the mold body 15 and be connected for example via a cohesive connection, in particular an adhesive bond, with the bottom 45 of the mold body 15.
  • the heat sink 40 is connected to the mold body 15 by means of a thermal connection 220.
  • the thermal connection 220 preferably has, for example, a heat conducting means 215.
  • the heat conducting 215 may be formed, for example, as a thermal paste.
  • the thermal connection 220 may be different.
  • the thermal connection 220 is designed, for example, as a heat pipe.
  • the second spacer 35 has a third spacer element 185 and preferably at least a fourth spacer element 190.
  • the third spacer 185 is connected at a fixed end to the top 50 of the mold body 15. At a free end, the third spacer 185 has a third end face 195 on.
  • the fourth spacer element 190 is connected at a fixed end to the upper side 50 of the mold body 15. At a free end, the fourth spacer 190 has a fourth end face 200.
  • the second spacer 35 has a third spacer element 185.
  • the third spacer 185 is connected at a fixed end to the top 50 of the mold body 15.
  • the third spacer 185 has a third end face 195 at a free end.
  • the second spacer 35 has a fourth spacer element 190.
  • the fourth spacer 190 is connected at a fixed end to the top 50 of the mold body 15. At a free end, the fourth spacer 190 has a fourth end face 200.
  • the third end face 195 and the fourth end face 200 are arranged in a common third plane 205. Furthermore, it is of particular advantage if the third plane 205 is aligned parallel to the first plane 155 and / or to the second plane 180. In the embodiment, by way of example, the third end face 195 and the fourth end face 200 abut on a housing surface 210 which is arranged on the heat sink 40.
  • the mold body 15 is thermally connected by means of a heat conducting means 215, which is formed by way of example in the embodiment as a thermal paste.
  • the second spacer 35 is preferably completely embedded in the heat conducting means 215. As a result, a reliable thermal connection 220 between the heat sink 40 and the mold body 15 can be ensured.
  • the second spacer 35 By means of the second spacer 35, a predefined second distance 2 between the upper side 50 and the housing surface 210 can be kept particularly well. As a result, the arrangement 10 can be aligned particularly precisely. In particular, tilting of, for example, the housing 30 relative to the printed circuit board 25 and / or tilting of the molded body 15 relative to the housing 30 and / or the printed circuit board 25 is also reliably avoided in this case. Furthermore, a reliable function of the thermal connection 220 is ensured.
  • the third spacing element 185 and the fourth spacing element 190 are also aligned parallel to one another.
  • the third spacer element 185 and the first spacer element 160 are arranged directly above one another, that is to say in a common fourth plane 225, which is designed to extend in the yz direction.
  • the fourth plane 225 is arranged perpendicular to the second plane 180.
  • the second spacer element 165 and the fourth spacer element 190 are arranged in a common fifth plane 230.
  • the fifth plane 230 is arranged by way of example in the x-direction offset to the fourth plane 225.
  • the spacer 20, 35 may be made of metal and / or plastic, for example.
  • the spacer 20, 35 can also be realized by a selective removal process, for example precision milling or etching, of the mold body 15, in which the spacer 20, 35 is retained. Also, the spacer 20, 35 can be made separately and connected to the mold body 15, for example, glued be.
  • FIG. 2 shows a sectional view through the arrangement 10 shown in FIG. 1 after a first assembly step.
  • the mold body 15 is attached to the circuit board 25 and the electrical connection 1 10, 1 15 prepared. Furthermore, the first spacer 20 and the second spacer 35 are fastened to the mold body 15 or produced on the mold body 15. Furthermore, the heat conducting means 215 is applied to the housing surface 210 of the housing 30.
  • the mold body 15 is mounted together with the printed circuit board 25 in the reverse position, so that the mold body 15 points downward with its upper side 50 shown in FIG. The housing 30 is also rotated so that the housing surface 210 faces upward.
  • FIG. 3 shows a sectional view through the arrangement 10 shown in FIG. 1 during a second assembly step.
  • an assembly force FA is introduced onto the printed circuit board 25 from top to bottom.
  • the housing 30 is supported and a counterforce FB is provided for the assembly force FA.
  • the mounting force FA and the counterforce FB are transmitted between the circuit board 25 and the mold body 15 via the first spacer 20 and between the Moldkorper 1 5 and the housing 30 via the second spacer 35.
  • the second spacer 35 is pressed into the heat conducting means 21 5.
  • a transmission of force directly from the housing 30 via the heat conducting means 21 5 in the mold body 1 5 is avoided, so that tilting of the mold body 15 relative to the housing surface 21 0 is reliably avoided.
  • the spacers 20, 35 prevent damage to other components of the arrangement 10.
  • FIG. 4 shows a sectional view through an arrangement 10 according to a second embodiment.
  • the arrangement 10 is similar to the arrangement 10 shown in FIG. By way of derogation, the housing 30 and the second spacer 35 shown in FIGS. 1 to 3 are dispensed with. Deviating from this, the printed circuit board 25 has a further heat sink 235.
  • the further heat sink 235 is arranged substantially centrally with respect to the mold body 15 relative to the mold body 15.
  • the further heat sink 235 is connected to the mold body 15 by means of a further thermal connection 240.
  • the further thermal connection 240 has the heat conducting means 215.
  • the heat conducting 21 comprises 21 In the embodiment, for example, a solder, so that the further thermal connection 240 is formed as a solder joint.
  • the thermal interface 215 may also include the thermal grease.
  • the first spacer 160 is disposed between the further thermal connection 240 and the first electrical connection 110.
  • the second spacer 165 is disposed between the second electrical connection 15 and the further thermal connection 240.
  • the electrical connection 1 10, 1 15 is wirelessly formed by a solder between the first contact element 85 and the third contact element 95 and the second electrical connection 1 15 wirelessly by a solder between the second contact element 90 and the fourth contact element 100.
  • the first spacer 20 By providing the first spacer 20, the first distance di between the bottom 45 of the mold body 15 and the printed circuit board 25 is increased compared to the conventional configuration of the arrangement 10. In order to form the solder joint particularly well, is also the first
  • Contact element 85 and the second contact element 90 are respectively arranged on the underside 45 of the mold body 15. Due to the enlarged first distance di of the underside 45 with respect to the printed circuit board 25, the electrical connection 1 10, 1 15 is elongated in the z-direction, so that in a reflow soldering process the solder travels a particularly long distance between the first contact element 85 and the first contact element 85 second contact element 90 and between the second contact element 90 and the fourth contact element 100 has to bridge.
  • the electrical connection 1 10, 15 can be checked particularly easily by means of optical control, in particular with optical image acquisition.
  • FIG. 5 shows a sectional view through the arrangement 10 shown in FIG. 4 during the production of the arrangement 10.
  • the first spacer 20 reduces tilting of the mold body 15, shown symbolically in dashed lines in FIG. 5, for example about the y-axis.
  • the first distance di indicates the first distance di a value of 50 ⁇ , so is a maximum tilt of the mold body 15 with respect to the first level 155 and / or the circuit board 25 to a maximum of 0 at a size of the mold body 15 of 8 mm in the y direction and 8 mm in the x direction , 5 ° minimized.
  • the tilt is reduced by a factor of 3 compared to conventionally produced moldings.
  • FIG. 6 shows a bottom view of the arrangement 10 shown in FIGS. 4 and 5.
  • the illustration of the printed circuit board 25 is omitted for reasons of clarity.
  • the first spacer 20 has a fifth spacer element 245, wherein the fifth spacer element 245 is arranged offset in the y direction relative to the first and second spacer elements 160, 165.
  • the mold body 15 has a first heat transfer surface 276.
  • the first heat transfer surface 276 is connected to the further heat sink 235 by means of the further thermal connection 240.
  • first and second contact elements 85, 90 are provided, wherein additionally at least one further contact element 249 can be provided, which are arranged on the underside 45 of the mold body 15.
  • first, second and further contact elements 85, 90, 249 are provided, each of which is arranged next to one another on a straight line.
  • the first spacer 160 is eccentrically, preferably arranged adjacent to a corner of the mold body 15.
  • the second spacer 165 is disposed off-center in the x and y directions adjacent to each other.
  • the fifth spacer element 245 is centered in the x direction and eccentrically in the y direction toward a direction away from the first and second spacer elements 160, 165 on the mold body 15 arranged so that the first spacer 160, the second spacer 165 and the fifth spacer 245 are arranged in an isosceles triangle to each other.
  • the fifth spacer 245 is between the thermal connection
  • FIG. 7 shows a side view of the arrangement 10 shown in FIGS. 4 to 6.
  • the fifth spacer element 245 is made wider than the first and second spacer elements 160, 165, so that the number of spacer elements 160, 165, 245 of the arrangement shown in FIGS 4 to 6 shown first spacer 20 can be limited to three.
  • the arrangement 10 can be produced particularly quickly and inexpensively.
  • FIG. 8 shows a top view of a printed circuit board 25 of the arrangement 10 shown in FIGS. 4 to 7.
  • the first and second support element 120, 125 and the third support element 250 which is provided in addition to the fifth distance element 245, are each designed and aligned correspondingly to the geometric configuration of the respectively assigned distance element 160, 165, 245. Due to the potential-free arrangement of the support element 120, 125, 250, the support element 120, 125, 250 has no electrical connection to the third and / or fourth contact element 95, 100. The support element 120, 125, 250 is thereby electrically insulated from the third and fourth contact elements 95, 100 by the carrier matrix 65 on the printed circuit board 25.
  • the further heat sink 235 is also electrically insulated from the support element 120, 125, 250.
  • the further heat sink 235 has, for example, the same material as the support element 120, 125, 250 as well as the third and / or fourth contact element 95, 100, so that a particularly good heat dissipation over the further thermal connection 240 from the mold body 15 is ensured.
  • FIG. 9 shows a sectional view along a sectional plane A-A shown in FIG. 8 through the printed circuit board 25 shown in FIG.
  • the circuit board 25 additionally has a solder stop layer 260 on.
  • the solder stop layer 260 covers an upper side of the carrier matrix 65 of the printed circuit board 25.
  • the third and fourth contact elements 95, 100 and the support element 120, 125, 250 and the further heat sink 235 are free of the solder stop layer 260
  • the support element 120, 125, 250, the number of elements within a tolerance chain can be additionally reduced, and so the assembly 10 are particularly easily manufactured precisely.
  • FIG. 10 shows a bottom view of an arrangement 10 according to a third embodiment.
  • the arrangement 10 is formed substantially identical to the arrangement 10 shown in FIGS. 6 to 9. Deviating from this, the first spacer 20 has a sixth spacer element 265 in addition to the fifth spacer element 245.
  • the first, second, fifth and sixth spacer element are the first, second, fifth and sixth spacer element
  • FIG. 11 shows a side view of the arrangement 10 shown in FIG. 10.
  • FIG. 12 shows a plan view of the printed circuit board 25 of the arrangement 10 shown in FIGS. 10 and 11.
  • the printed circuit board 25 additionally has a further fourth support element 275, wherein the fourth support element 275 is arranged corresponding to the sixth spacer element 265.
  • the third or fourth contact element 95, 100 and the first to third support elements 120, 125, 250 are arranged in respective common fifth planes 230.
  • FIG. 13 shows the bottom view of an arrangement 10 according to a fourth embodiment.
  • the arrangement 10 is essentially designed as a combination of the arrangement 10 shown in FIGS. 1 to 9.
  • the further heat sink 235 is dispensed with and the mold body 15 is cooled on the upper side via the heat sink 40.
  • the first, second and fifth spacer elements 160, 165, 245 are placed particularly close to the edge 270, so that tilting of the mold body 15 relative to the first plane 155 are kept particularly low can.
  • FIG. 14 shows a plan view of the printed circuit board 25 of the arrangement 10 shown in FIG. 13.
  • the printed circuit board 25 is made particularly simple by omitting the further heat sink 235.
  • FIG. 15 shows a sectional view along a sectional plane B-B shown in FIG. 14 through the printed circuit board 25 shown in FIG.
  • the distance a between the support element 120, 125, 250 can also be kept particularly high so that tilting is particularly low in the production of the arrangement 10.
  • FIG. 16 shows a bottom view of an arrangement 10 according to a fifth embodiment.
  • the arrangement 10 is essentially a combination of the arrangement 10 shown in FIGS. 1 to 9.
  • the mold body 15 additionally has a second 280 and preferably a third heat transfer surface 285 on the underside in addition to the (first) heat transfer surface 276.
  • the heat transfer surface 276, 280, 285 is thermally connected in each case via a separate further thermal connection 240 with the further heat sink 235, while each of the heat transfer surfaces 276, 280, 285 arranged off-center, in each case between the first and / or second contact element 85th 90, a first, second and / or fifth spacer element 160, 165, 245 is respectively arranged.
  • an electrical connection 1 10, 1 15 can be made reliable in addition.
  • a scrap in the production of the assembly 10, in particular in the context of a reflow soldering process can be reduced.
  • an optical test of the arrangement 10, for example in the context of an optical examination of solder point menisci at the electrical connection 1 10, 1 15, can be improved.
  • a so-called pin modification can be achieved exclusively by solder, in which a pin wettable by solder is produced on the first and second contact elements 85, 90 by special processes.
  • the scattering of the meniscus height by limiting the tilting of the mold body 15
  • an average value by deliberately increasing the first distance di
  • an increased solder joint reliability at the electrical connection 1 10, 1 15 is achieved.
  • the first distance di By deliberately adjusting the first distance di, it can be adjusted such that the first distance di is optimal for increased solder joint reliability. So the first distance di goes linearly into the Solder joint reliability of the assembly 10 a. An increase in the first distance di leads to an increase in solder joint reliability. At the same time scattering z. B. be minimized by the tilting of the mold body 15.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble comportant un corps moulé (15), un élément d'écartement (20) et une carte de circuit imprimé (25). Au moins une connexion électrique (110, 115) connecte le corps moulé à un tracé conducteur (70, 75) de la carte de circuit imprimé, l'élément d'écartement est connecté au corps moulé et agencé sur une face tournée vers la carte de circuit imprimé, l'élément d'écartement est agencé décalé par rapport à la connexion électrique, et l'élément d'écartement établit une distance prédéfinie (di) entre une face inférieure (45) du corps moulé et la carte de circuit imprimé.
PCT/EP2017/074448 2016-10-06 2017-09-27 Ensemble comportant un élément d'écartement et une carte de circuit imprimé Ceased WO2018065268A1 (fr)

Applications Claiming Priority (2)

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DE102016219423.2A DE102016219423A1 (de) 2016-10-06 2016-10-06 Anordnung
DE102016219423.2 2016-10-06

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WO2018065268A1 true WO2018065268A1 (fr) 2018-04-12

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PCT/EP2017/074448 Ceased WO2018065268A1 (fr) 2016-10-06 2017-09-27 Ensemble comportant un élément d'écartement et une carte de circuit imprimé

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DE (1) DE102016219423A1 (fr)
WO (1) WO2018065268A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019218263A1 (de) * 2019-11-26 2021-05-27 Robert Bosch Gmbh Leiterplatinenanordnung, insbesondere für eine Steuerelektronik einer elektromo-torischen Antriebseinheit, mit einem ersten und einem zweiten Leiterplatinenabschnitt

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020068417A1 (en) * 2000-06-08 2002-06-06 Farnworth Warren M. Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
US20020131240A1 (en) * 2001-03-16 2002-09-19 Lg Electronics Inc. Heat dissipation structure of integrated circuit (IC)
US20050195323A1 (en) * 2004-03-05 2005-09-08 Graham Luke A. Optical module
US20060043548A1 (en) * 2004-08-27 2006-03-02 Fujitsu Limited Semiconductor device having stiffener
US7138583B2 (en) 2002-05-08 2006-11-21 Sandisk Corporation Method and apparatus for maintaining a separation between contacts
DE102013016464A1 (de) * 2013-10-04 2015-04-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Verfahren zur Montage einer elektrischen Baugruppe und elektrische Baugruppe

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020068417A1 (en) * 2000-06-08 2002-06-06 Farnworth Warren M. Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures
US20020131240A1 (en) * 2001-03-16 2002-09-19 Lg Electronics Inc. Heat dissipation structure of integrated circuit (IC)
US7138583B2 (en) 2002-05-08 2006-11-21 Sandisk Corporation Method and apparatus for maintaining a separation between contacts
US20050195323A1 (en) * 2004-03-05 2005-09-08 Graham Luke A. Optical module
US20060043548A1 (en) * 2004-08-27 2006-03-02 Fujitsu Limited Semiconductor device having stiffener
DE102013016464A1 (de) * 2013-10-04 2015-04-09 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Hallstadt Verfahren zur Montage einer elektrischen Baugruppe und elektrische Baugruppe

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