WO2018070801A3 - 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법 - Google Patents

다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법 Download PDF

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Publication number
WO2018070801A3
WO2018070801A3 PCT/KR2017/011242 KR2017011242W WO2018070801A3 WO 2018070801 A3 WO2018070801 A3 WO 2018070801A3 KR 2017011242 W KR2017011242 W KR 2017011242W WO 2018070801 A3 WO2018070801 A3 WO 2018070801A3
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WO
WIPO (PCT)
Prior art keywords
electronic product
same
element transfer
manufacturing
transfer method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2017/011242
Other languages
English (en)
French (fr)
Other versions
WO2018070801A2 (ko
Inventor
김재현
황보윤
장봉균
김광섭
김경식
이학주
최병익
이승모
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Machinery and Materials KIMM
Center for Advanced Meta Materials
Original Assignee
Korea Institute of Machinery and Materials KIMM
Center for Advanced Meta Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Institute of Machinery and Materials KIMM, Center for Advanced Meta Materials filed Critical Korea Institute of Machinery and Materials KIMM
Priority to JP2019517749A priority Critical patent/JP6807454B2/ja
Publication of WO2018070801A2 publication Critical patent/WO2018070801A2/ko
Publication of WO2018070801A3 publication Critical patent/WO2018070801A3/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/043—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Laminated Bodies (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)

Abstract

본 발명의 일 실시예에 따른 다층형 캐리어 필름은, 베이스 필름; 상기 베이스 필름의 일면에 일정 두께로 형성되고, 제1경도를 가지되, 에너지에 의해 상기 제1경도보다 높은 제2경도를 가지도록 변하는 변형층; 및 상기 변형층의 일면에 일정 두께로 형성되고, 상기 변형층의 제1경도보다 높은 경도로 구성되는 경질층;을 포함하고, 상기 변형층의 경도에 반비례하는 점착력을 가진다.
PCT/KR2017/011242 2016-10-12 2017-10-12 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법 Ceased WO2018070801A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019517749A JP6807454B2 (ja) 2016-10-12 2017-10-12 多層型キャリアフィルムおよびこれを用いた素子の転写方法とこの方法を用いて電子製品を製造する電子製品の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160132250A KR101866901B1 (ko) 2016-10-12 2016-10-12 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법
KR10-2016-0132250 2016-10-12

Publications (2)

Publication Number Publication Date
WO2018070801A2 WO2018070801A2 (ko) 2018-04-19
WO2018070801A3 true WO2018070801A3 (ko) 2018-08-09

Family

ID=61906388

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/011242 Ceased WO2018070801A2 (ko) 2016-10-12 2017-10-12 다층형 캐리어 필름 및 이를 이용한 소자 전사 방법과 이 방법을 이용하여 전자제품을 제조하는 전자제품 제조방법

Country Status (3)

Country Link
JP (1) JP6807454B2 (ko)
KR (1) KR101866901B1 (ko)
WO (1) WO2018070801A2 (ko)

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CN117004335A (zh) * 2018-12-07 2023-11-07 昆山摩建电子科技有限公司 电子元器件组装用泡棉胶组件
KR102385376B1 (ko) * 2019-07-05 2022-05-11 한국과학기술원 마이크로 진공모듈을 이용한 마이크로 led 어레이 전사를 위한 기판, 마이크로 led 어레이, 마이크로 진공모듈 간의 배치 구조 및 이를 이용한 마이크로 led 디스플레이 제작 방법
KR102283056B1 (ko) * 2019-10-11 2021-07-29 숭실대학교 산학협력단 목표체의 배열을 변화시켜 전사하는 점탈착 전사 장치
KR102279643B1 (ko) * 2019-11-15 2021-07-20 한국기계연구원 캐리어 기판 및 이를 이용한 소자 전사방법
KR102334577B1 (ko) 2019-11-22 2021-12-03 한국기계연구원 소자 전사방법 및 이를 이용한 전자패널 제조방법
KR102409849B1 (ko) * 2020-04-29 2022-06-16 최지훈 마이크로 엘이디 제조시스템 및 마이크로 엘이디 제조방법
JP6978129B1 (ja) * 2021-03-18 2021-12-08 株式会社写真化学 デバイスチップの移載機構
JP7011745B1 (ja) 2021-04-20 2022-02-10 ナカンテクノ株式会社 デバイス実装装置及びそれを用いたデバイス実装方法
KR102812676B1 (ko) * 2022-06-24 2025-05-27 한국기계연구원 마이크로 소자용 전사필름 및 이를 이용한 마이크로 소자 전사장치와 전사방법
EP4621836A1 (en) * 2022-11-18 2025-09-24 LG Electronics Inc. Transfer substrate
KR102861387B1 (ko) * 2023-04-17 2025-09-17 중앙대학교 산학협력단 소자 전사 방법 및 이에 의해 제조된 디스플레이

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JPH1012673A (ja) * 1996-06-27 1998-01-16 Japan Synthetic Rubber Co Ltd 半導体素子実装用シートおよび半導体装置
JP3617504B2 (ja) * 1996-10-08 2005-02-09 日立化成工業株式会社 半導体素子搭載用接着フィルム
JP2005248088A (ja) * 2004-03-05 2005-09-15 Jsr Corp 部品実装用フィルム及びこれを用いた実装基板
JP3707516B2 (ja) * 1997-09-17 2005-10-19 富士通株式会社 半導体素子の実装方法、およびこれに使用する素子実装用シート
KR20100006575A (ko) * 2007-06-08 2010-01-19 미쓰이 긴조꾸 고교 가부시키가이샤 전자 부품 실장용 적층 필름, 전자 부품 실장용 필름 캐리어 테이프 및 반도체 장치

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Publication number Priority date Publication date Assignee Title
JPH1012673A (ja) * 1996-06-27 1998-01-16 Japan Synthetic Rubber Co Ltd 半導体素子実装用シートおよび半導体装置
JP3617504B2 (ja) * 1996-10-08 2005-02-09 日立化成工業株式会社 半導体素子搭載用接着フィルム
JP3707516B2 (ja) * 1997-09-17 2005-10-19 富士通株式会社 半導体素子の実装方法、およびこれに使用する素子実装用シート
JP2005248088A (ja) * 2004-03-05 2005-09-15 Jsr Corp 部品実装用フィルム及びこれを用いた実装基板
KR20100006575A (ko) * 2007-06-08 2010-01-19 미쓰이 긴조꾸 고교 가부시키가이샤 전자 부품 실장용 적층 필름, 전자 부품 실장용 필름 캐리어 테이프 및 반도체 장치

Also Published As

Publication number Publication date
JP2019521530A (ja) 2019-07-25
KR20180040770A (ko) 2018-04-23
WO2018070801A2 (ko) 2018-04-19
JP6807454B2 (ja) 2021-01-06
KR101866901B1 (ko) 2018-06-14

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