WO2018169201A1 - Dispositif d'empreinte et procédé d'empreinte - Google Patents

Dispositif d'empreinte et procédé d'empreinte Download PDF

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Publication number
WO2018169201A1
WO2018169201A1 PCT/KR2018/001076 KR2018001076W WO2018169201A1 WO 2018169201 A1 WO2018169201 A1 WO 2018169201A1 KR 2018001076 W KR2018001076 W KR 2018001076W WO 2018169201 A1 WO2018169201 A1 WO 2018169201A1
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WIPO (PCT)
Prior art keywords
mold
substrate
roll
pattern
separating
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Ceased
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PCT/KR2018/001076
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English (en)
Korean (ko)
Inventor
구자붕
이남식
구황섭
김현제
정희석
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GigaLane Co Ltd
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GigaLane Co Ltd
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Publication date
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Publication of WO2018169201A1 publication Critical patent/WO2018169201A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Definitions

  • the present invention relates to an imprint apparatus and an imprint method, and more particularly, to an imprint apparatus and an imprint method for printing on a wafer using a film-shaped mold having a pattern formed on the surface.
  • the nanoimprint lithography process is an economical and effective technique for fabricating nano-structures, in which spin-coating or dispensing of resin on a substrate and patterning on the surface of the resin It is a technique of transferring a pattern by pressing a mold.
  • Nanoimprint lithography processes can be broadly classified into thermal-type and ultraviolet irradiation methods.
  • the heated process called hot embossing or thermal imprint lithography, is brought into contact with the mold and the substrate on which the polymer layer is formed. This is how you create the pattern you want on the floor.
  • Such a heating process has a problem that it is difficult to align the multilayer by thermal deformation, and there is a problem in that the pattern is easily broken because high pressure is required to imprint a resin having a high viscosity.
  • the ultraviolet irradiation nanoimprint lithography process developed to improve the problems of such a heating process is a method of using a low viscosity photocurable resin and ultraviolet rays to cure it, and since the process can be performed at room temperature and low pressure, And suitable for mass production.
  • the conventional ultraviolet irradiation nanoimprint lithography process first coating the ultraviolet curing resin on the substrate, and then pressed using a mold, the curing resin is filled between the patterns of the mold. At this time, since the viscosity is low, it is easy to fill the mold pattern between the resin even at low pressure. Thereafter, when the UV light source exposes the resin through the transparent mold, the resin is cured. Subsequently, when the mold is peeled off, a residual layer remains between the patterns, which are removed by oxygen ashing or the like to complete the process.
  • the self-assembled monomolecular film may be coated on the mold surface to improve releasability, but the coating process takes a long time, and there is a problem in that the productivity of the product is lowered.
  • Patent Document 1 Republic of Korea Patent No. 10-0747877 (08 August 2007)
  • Patent Document 2 Republic of Korea Patent No. 10-0763669 (October 04, 2007)
  • Patent Document 3 Republic of Korea Patent No. 10-1413346 (June 27, 2014)
  • the present invention has been made to solve the above-mentioned conventional problems, an imprint apparatus that can improve the printing performance by reducing the printing time of the pattern on the substrate at the same time to reuse the pattern by modifying the surface of the pattern by plasma treatment And an imprint method.
  • the present invention provides an imprint apparatus and an imprint method that can facilitate the transfer and reverse transfer of the film-shaped mold by the forward rotation and the reverse rotation of the transfer unit and at the same time improve the running performance of the mold to improve the supply performance and discharge performance. Another purpose is to provide.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of easily grasping a running state of a traveling mold while reducing a loss of a subsequent process due to poor driving.
  • Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving driving movement performance by aligning the upper and lower positions of a mold to uniformly process plasma in a pattern and maintaining a constant tension of the mold. do.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating tension control of a mold by controlling the rotational speed of the supply roll and the discharge roll by the controller.
  • Another object of the present invention is to provide an imprint apparatus and an imprint method capable of improving plasma processing performance and improving plasma processing defects.
  • another object of the present invention is to provide an imprint apparatus and an imprint method for facilitating bonding between a substrate and a mold, and at the same time, curing a mold stamped on the substrate to improve the adhesion performance of the pattern.
  • another object of the present invention is to provide an imprint apparatus and an imprint method capable of facilitating separation between the substrate and the mold and at the same time improving the separation running performance of the mold.
  • the transfer unit for transferring the film-shaped mold having a pattern formed on the surface in one direction and the other direction;
  • a surface modification unit for treating the surface of the pattern transferred by the transfer unit with plasma;
  • a coupling part for coupling the mold and the substrate so that the pattern of the plasma-treated mold can be stamped onto the substrate;
  • a separating part separating the bonded mold and the substrate.
  • the transfer unit of the present invention the supply roll for winding the mold in one direction to feed the feed and the transfer in the other direction by winding the mold; And it characterized in that it comprises a discharge roll winding the mold in one direction to feed the feed and to the reverse direction by winding the mold in the other direction.
  • At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion characterized in that it comprises a position measuring means for detecting the position of the center or side end of the mold.
  • the position measuring means of the present invention is characterized in that it is interlocked with the position correction means for correcting the position of the center or side end of the mold.
  • At least one of the supply roll and the coupling portion of the present invention and between the discharge roll and the separation portion characterized in that it comprises a tension measuring means for measuring the tension of the mold.
  • the tension measuring means of the present invention is characterized in that it is interlocked with a control unit for controlling the rotational speed of the supply roll and the discharge roll.
  • the surface modification part of the present invention includes a plasma generating part to which a high frequency is applied, and a distance between the mold and the plasma generating part is 1 to 10 mm, and when the pattern surface of the mold is treated with plasma, the mold is 5 to 100 mm. It is characterized in that the transfer to / s.
  • the surface modification of the present invention is characterized in that it further comprises a gas supply for supplying a gas containing at least one of argon, oxygen and nitrogen.
  • Said gas supply part of this invention is provided along the width direction of the said mold, It is characterized by the above-mentioned.
  • the gas supply part of the present invention is characterized by supplying gas at a rate of 1 to 50 L / min.
  • the coupling portion of the present invention is the chamber in and out is maintained in a vacuum state; Support means installed on an inner lower layer of the chamber to support a substrate; Elevating means for elevating the substrate to a lower portion of the supporting means to pressurize and mold the mold; And curing means installed on the inner upper layer of the chamber to cure the stamped substrate.
  • the coupling part of the present invention characterized in that it further comprises a fixing means for fixing the front and rear mold located inside the chamber outside the chamber.
  • the separation unit of the present invention the stamping means for fixing the substrate bonded to the mold stamped in the coupling portion; Shanghai moving means installed in the lower portion of the suction means for moving the substrate up and down; Separating means for separating the mold from the substrate stamped at the bonding portion; And a front and rear movement means installed on one side of the separation means to advance the separation means forward and backward.
  • the separating means of the present invention the first separation roll for separating the mold from the substrate; And a second separation roll which is installed on the first separation roll and guides the mold separated therefrom.
  • the discharge roll and the separating portion of the present invention characterized in that it comprises a dancer roll for adjusting the tension of the mold is changed as the separating means is moved by the front and rear movement means.
  • the present invention provides a supply step of transferring the film-shaped mold having a pattern formed on the surface in one direction; A surface modification step of plasma treating a surface of the mold to be transferred; Combining the mold with the substrate such that a pattern of the plasma treated mold can be stamped onto the substrate; A separation step of separating the bonded mold and the substrate; And a discharging step of discharging and discharging the separated mold.
  • It is characterized in that it further comprises; repeating the step of repeating the surface modification step, the bonding step and the separation step in sequence by transferring the mold separated in the separation step of the present invention in the other direction.
  • the present invention is to modify the film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and to separate the substrate and the mold, thereby modifying the surface of the pattern by plasma treatment to reuse the pattern It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
  • the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
  • the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
  • the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit.
  • the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
  • FIG. 1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention.
  • FIG. 2 is a state diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention.
  • FIG. 3 is a block diagram showing an imprint method according to an embodiment of the present invention.
  • first transfer unit 20 second transfer unit
  • FIG. 1 is a block diagram showing an imprint apparatus according to an embodiment of the present invention
  • Figure 2 is a block diagram showing a surface modification of the imprint apparatus according to an embodiment of the present invention
  • Figure 3 is an embodiment of the present invention It is a block diagram which shows the imprint method by this.
  • the imprint apparatus includes a transfer part 10, 20, a surface modification part 30, a coupling part 40, and a separation part 50. It is an imprint apparatus which prints a pattern on the board
  • the transfer units 10 and 20 are transfer means for transferring the film-shaped mold F having a pattern formed on its surface in one direction and the other direction, and include the first transfer unit 10 provided upstream and the second transfer unit 20 provided downstream. )
  • the first conveying part 10 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and feeding the mold in the other direction.
  • the feed roll 11, the first position measuring means 12, and the guide roll 13 are provided.
  • the feed roll 11 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor.
  • the mold is recommended and wound by the rotation control.
  • the first position measuring means 12 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the supply roll 11 and the engaging portion 30, such measurement means EPC (Edge It is of course possible to use a position control sensor.
  • first position measuring means 12 is preferably interlocked with the position correcting means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
  • the guide roll 13 is a guide means provided downstream of the first position measuring means 12, and is installed to move up and down and move forward and backward to guide the mold in the advancing direction.
  • the tension measuring means 14 is a measuring means provided between the supply roll 11 and the engaging portion 30, and measures the tension of the traveling mold, and the tension measuring means includes the supply roll 11 and the discharge roll 21. It is preferable to interlock with the control unit for controlling the rotational speed of h).
  • the second conveying unit 20 is a conveying means for supplying and conveying the mold in one direction and winding the mold in the other direction, and transporting the mold.
  • the second conveying unit 20 includes a discharge roll 21, a second position measuring means 22, and a second tension measurement. Means (23).
  • the discharge roll 21 is a roll member which feeds and transfers the mold in one direction and winds the mold in the other direction, and is connected to a rotation driving means capable of controlling forward and reverse rotation, such as a servo motor.
  • the mold is recommended and wound by the rotation control.
  • the second position measuring means 22 is a measuring means for detecting the position of the center or side end portion of the mold that is installed and moved between the discharge roll 21 and the separating part 50.
  • Such measuring means is EPC (Edge). It is of course possible to use a position control sensor.
  • the second position measuring means 22 is preferably interlocked with the position correction means for correcting the position of the center or side end portion of the mold traveling between the first conveying portion 10 and the second conveying portion 20. .
  • the tension adjusting means 23 is a tension means provided between the discharge roll 21 and the separating part 50, and adjusts the tension of the mold to move and the tension adjusting means includes a supply roll 11 and a discharge roll ( It is preferable to interlock with the control unit 60 for controlling the rotational speed of 21.
  • the surface modification part 30 is a surface modification means which processes the pattern surface of the mold conveyed by the conveyance part with plasma, and consists of the plasma generation part 31 and the gas supply parts 32, 33, 34. As shown in FIG.
  • Plasma generator 31 the plasma generating means to which high frequency is applied, the distance between the mold and the plasma generator 31 is 1 to 10mm, when the pattern surface of the mold is treated with plasma, the mold is 5 to 100mm / s It is preferably controlled by the control unit 60 to be conveyed.
  • control unit 60 includes a matching unit 61 for sufficiently matching the impedance of the high frequency load to the transmission line impedance so that the high frequency is applied from the plasma generating unit 31 to enable plasma processing, and the high frequency providing the high frequency load. It consists of a power supply 62, a matching unit 61, and a commercial power supply 63 of 220V for supplying power to the high frequency power supply.
  • the gas supply unit is a gas supply means for supplying a gas containing at least one of argon, oxygen, and nitrogen, which is provided along the width direction of the mold, and preferably supplies the gas at a rate of 1 to 50 L / min. It consists of a reservoir 32, a pressure regulator 33 and a flow regulator 34.
  • the gas storage tank 32 is gas storage means for storing one gas of argon, oxygen, and nitrogen, respectively, and in this embodiment, includes an argon storage tank 32a for storing argon and an oxygen storage tank 32b for storing oxygen. have.
  • the pressure regulator 33 is a pressure regulating means for regulating the gas pressure of one of argon, oxygen and nitrogen, respectively.
  • the argon pressure regulator 33a for adjusting the pressure of argon and oxygen for adjusting the pressure of oxygen. It consists of a pressure regulator 33b.
  • the pressure regulator is preferably to measure and control the pressure by using a two-gauge regulator to adjust the gas pressure of argon, oxygen and nitrogen, respectively.
  • the flow regulator 34 is a flow regulating means for regulating the gas flow rate of one of argon, oxygen and nitrogen, respectively.
  • the argon flow regulator 32a for adjusting the argon flow rate and the oxygen for adjusting the flow rate of oxygen. It consists of a flow regulator 32b.
  • MFC mass flow controller
  • Coupling portion 40 is a coupling means for coupling the mold (F) and the substrate (W) so that the pattern of the plasma-treated mold can be stamped on the substrate, the chamber 41, the support means 42, the lifting means ( 43), the gear box 44, the drive means 45, the hardening means 46, the weighing means 47 and the fixing means (48).
  • the chamber 41 is a vacuum space in which the mold is moved in and out and is maintained in a vacuum state.
  • the chamber 41 provides a vacuum space for joining the mold F and the substrate W so that the pattern of the mold can be stamped onto the substrate. .
  • the support means 42 is provided in the lower layer of the inside of the chamber 41 and supports the board
  • the support means 42 adsorb
  • the elevating means 43 is provided on the lower portion of the supporting means 42 and is an elevating means for elevating and stamping the substrate W by pressing the lower portion of the mold F.
  • the elevating means 43 is provided with an elevating driving force in an up and down direction like a bellows. It expands and contracts up and down.
  • the gear box 44 is installed at the lower part of the elevating means 43 and transmits the elevating driving force.
  • the gear box 44 receives the elevating driving force from the driving means 45 and transmits the elevating driving force to the elevating means 43.
  • the driving means 45 is a power source for providing the elevating driving force to the elevating means 43, and is connected to one of the gear boxes 44 to provide the elevating driving force to the elevating means 43 via the gear box 44. have.
  • the hardening means 46 is a hardening means installed on the inner upper layer of the chamber 41 to harden the stamped substrate, and is made of a heating member such as an LED UV lamp to harden the stamped pattern on the upper surface of the substrate.
  • the load measuring means 47 is a measuring means provided on the upper part of the hardening means 46.
  • the load measuring means 47 measures a load such as a load cell so as to measure the pressing force when the substrate W is raised by the elevating means 43. Done.
  • Fixing means 48 is a fixing means for fixing the front and rear of the mold (F) located inside the chamber 41 from the outside of the chamber 41, and prevents the movement or movement of the mold pattern when stamping the pattern on the substrate Gripper member such as gripper is used to
  • Separation unit 50 is a separation means for separating the mold (F) and the substrate (W) coupled in the coupling portion 40, the adsorption means 51, shandong movement means 52, separation means 53, 54 And back and forth movement means (55).
  • Adsorption means 51 is a fixing means for fixing the substrate bonded to the mold stamped in the coupling portion 40, the substrate is fixed by an adsorption force equal to a negative pressure, such as an adsorption chuck to separate the substrate from the mold.
  • the shank moving means 52 is provided below the suction means 51 to move the substrate up and down, and is moved up and down using a linear moving member such as a linear motor or a hydraulic cylinder.
  • Separation means (53, 54) is a means for separating the mold from the substrate stamped in the coupling portion 40, the first separation roll 53 for separating the mold from the substrate by rolling, and the first separation roll ( The second separation roll 54 is installed on the upper portion of the 53 to guide the separated mold.
  • the first separation roll 53 is a roll member installed below the separation means, and is rolled on the upper part of the mold to separate the mold stamped on the upper part of the mold and transferred upward to the second separation roll 54. .
  • the second separation roll 54 is a guide roll that guides the mold separated by being installed on the first separation roll 53 and guides the mold separated by the first separation roll 53 downstream.
  • the forward and backward movement means 55 is a movement means provided on one side of the separation means to advance the separation means forward and backward, and reciprocates back and forth using a linear movement member such as a linear motor or a hydraulic cylinder.
  • the dancer roll as the tension adjusting means 23 for measuring and adjusting the tension of the mold changed as the separation means moves by the front and rear movement means 55.
  • the dancer roll as the tension adjusting means 23 for measuring and adjusting the tension of the mold changed as the separation means moves by the front and rear movement means 55.
  • the mold supply step S10 the surface modification step S20, the bonding step S30, the separation step S40, and the repeating step S50.
  • a discharging step (S60) the pattern is printed on the substrate (W) using a film-shaped mold (F) having a pattern formed on its surface.
  • the mold supply step S10 is a step of feeding and feeding a film-shaped mold having a pattern formed on a surface in one direction.
  • the mold-feeding step S10 is carried out in one direction by the film-shaped mold in the first conveying part 10 and in the second conveying part 20.
  • the film mold is wound up in one direction to supply the mold.
  • the diameter of the discharge roll 21 is measured to calculate the moving distance of the mold, and the mold is transferred by the predetermined moving distance to supply the mold to the operation position of the surface modification unit 30.
  • Surface modification step (S20) is a step of surface modification of the surface of the mold to be transferred by plasma treatment, surface modification by the plasma treatment to modify the surface of the mold transferred to the surface modification unit 30 by the transfer unit .
  • Joining step (S30) is a step of joining the mold and the substrate so that the pattern of the plasma-treated mold can be stamped on the substrate, the support means in which the substrate is adsorbed at the same time while transferring the mold in the other direction by the reverse rotation of the transfer unit ( 42) is raised to combine the mode and the substrate to stamp and harden by the hardening means 46.
  • Separation step (S40) is a step of separating the mold and the substrate bonded in the bonding step (S30), by transporting the mold bonded to the substrate in one direction by the forward rotation of the transfer portion while fixing the substrate by the adsorption means (51) The mode and the substrate are separated from each other by rolling the separating means.
  • the repetition step (S50) is a step of repeating the mold reforming step (S20), the coupling step (S30) and the separation step (S40) sequentially by transferring the mold separated in the separation step (S40) in another direction, The mold is transferred back to the surface modification unit 30 by reverse rotation to the transfer unit, and the previous processing steps are repeated a plurality of times or five times.
  • Discharge step (S60) is a step of transporting and discharging the separated mold, the mold separated in the separation step (S40) after the final repetition step is transferred to the discharge roll 21 by the forward rotation of the transfer unit is wound up and discharged here Done.
  • the present invention by modifying a film-shaped mold having a pattern formed on the surface with a plasma to stamp the pattern on the substrate and separating the substrate and the mold, the surface of the pattern is modified by plasma treatment to reuse the pattern. It provides an effect of improving the printing performance by shortening the printing time of the pattern on the substrate.
  • the forward and reverse rotation of the transfer portion facilitates the transfer and reverse transfer of the film-shaped mold, and at the same time improve the running performance of the mold to improve the supply performance and discharge performance It can be effective.
  • the position detecting means for detecting the traveling position of the mold around the supply roll or the discharge roll it is possible to easily determine the running state of the mold to move the travel and at the same time reduce the loss of the subsequent process due to poor driving. Provide the effect.
  • the tension measuring means is interlocked with the control unit for controlling the rotational speed of the supply roll and the discharge roll, thereby providing an effect that can easily control the tension of the mold by controlling the rotational speed of the supply roll and the discharge roll by the control unit.
  • the chamber, the support means, the lifting means, the hardening means and the fixing means as a coupling portion, to facilitate the bonding between the substrate and the mold and at the same time harden the mold stamped on the substrate to improve the adhesion performance of the pattern Provide effect.
  • an imprint apparatus and an imprint method for printing onto a wafer using a film-shaped mold having a pattern formed on its surface are provided.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

La présente invention concerne un dispositif d'empreinte et un procédé d'empreinte. Le dispositif d'empreinte comprend : une partie de transfert permettant de transférer un moule en forme de film dans une direction ou dans une autre, le moule en forme de film comportant un motif formé sur sa surface ; une partie de modification de surface permettant de traiter par plasma la surface du motif transféré par la partie de transfert ; une partie d'accouplement permettant d'accoupler le moule à un substrat de sorte que le motif traité au plasma du moule puisse être estampé sur le substrat ; et une partie de séparation permettant de séparer le moule et le substrat qui ont été accouplés l'un à l'autre. Dans la présente invention, le moule en forme de film avec un motif formé sur sa surface est modifié par plasma, le motif est estampé sur le substrat, et le substrat et le moule sont séparés l'un de l'autre. Par conséquent, la présente invention offre un effet avantageux en ce que la modification de surface du motif par traitement au plasma permet la réutilisation du motif et la réduction du temps nécessaire pour imprimer le motif sur un substrat, ce qui permet d'améliorer la performance d'impression.
PCT/KR2018/001076 2017-03-15 2018-01-24 Dispositif d'empreinte et procédé d'empreinte Ceased WO2018169201A1 (fr)

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KR1020170032502A KR20180105433A (ko) 2017-03-15 2017-03-15 임프린트 장치 및 임프린트 방법
KR10-2017-0032502 2017-03-15

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KR102203205B1 (ko) * 2019-11-04 2021-01-14 주식회사 기가레인 전사 장치 및 이를 이용한 전사된 기판의 생산 방법
KR20250153308A (ko) * 2019-12-02 2025-10-24 에베 그룹 에. 탈너 게엠베하 스탬프를 분리하는 방법 및 장치
KR102441184B1 (ko) * 2020-07-15 2022-09-07 주식회사 기가레인 필름 교환이 용이한 전사 장치 및 필름 교환 방법

Citations (5)

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JP2004148494A (ja) * 2002-10-24 2004-05-27 Hewlett-Packard Development Co Lp 硬化ナノインプリントスタンプ
US20070204953A1 (en) * 2006-02-21 2007-09-06 Ching-Bin Lin Method for forming structured film as molded by tape die
KR20110098093A (ko) * 2010-02-26 2011-09-01 주식회사 송산 패턴드 시트 제조장치
KR20120130246A (ko) * 2010-03-08 2012-11-29 도시바 기카이 가부시키가이샤 시트 형상 몰드 위치 검출 장치, 전사 장치 및 전사 방법
KR20140144716A (ko) * 2012-05-08 2014-12-19 아사히 가세이 이-매터리얼즈 가부시키가이샤 전사 방법 및 열 나노임프린트 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004148494A (ja) * 2002-10-24 2004-05-27 Hewlett-Packard Development Co Lp 硬化ナノインプリントスタンプ
US20070204953A1 (en) * 2006-02-21 2007-09-06 Ching-Bin Lin Method for forming structured film as molded by tape die
KR20110098093A (ko) * 2010-02-26 2011-09-01 주식회사 송산 패턴드 시트 제조장치
KR20120130246A (ko) * 2010-03-08 2012-11-29 도시바 기카이 가부시키가이샤 시트 형상 몰드 위치 검출 장치, 전사 장치 및 전사 방법
KR20140144716A (ko) * 2012-05-08 2014-12-19 아사히 가세이 이-매터리얼즈 가부시키가이샤 전사 방법 및 열 나노임프린트 장치

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KR20180105433A (ko) 2018-09-28

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