WO2018216320A1 - 溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 - Google Patents
溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 Download PDFInfo
- Publication number
- WO2018216320A1 WO2018216320A1 PCT/JP2018/009739 JP2018009739W WO2018216320A1 WO 2018216320 A1 WO2018216320 A1 WO 2018216320A1 JP 2018009739 W JP2018009739 W JP 2018009739W WO 2018216320 A1 WO2018216320 A1 WO 2018216320A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solution composition
- plating solution
- molten salt
- titanium
- mol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Definitions
- the present disclosure relates to a molten salt titanium plating solution composition and a method for producing a titanium plated member.
- the present disclosure claims priority based on Japanese Patent Application No. 2017-1000075, which is a Japanese patent application filed on May 22, 2017. All the descriptions described in the Japanese patent application are incorporated herein by reference.
- Patent Document 1 Japanese Unexamined Patent Publication No. 2015-193899
- Patent Document 1 an alloy film of Fe and Ti is formed on the surface of an Fe wire by using a plating bath in which K 2 TiF 6 and TiO 2 are added to KF-KCl. It is described.
- Non-Patent Document 1 describes a method of forming a titanium film on the surface of Ni and Fe substrates using a plating bath in which K 2 TiF 6 is added to LiF—NaF—KF.
- the molten salt titanium plating solution composition contains at least one Group 1 metal ion, fluoride ion, and titanium ion among lithium ions and sodium ions.
- the content of potassium ions with respect to 100 mol% of all ion components contained in the molten salt titanium plating solution composition is 5 mol% or less.
- the titanium plating member manufacturing method includes a step of preparing a base material having a conductive surface, a step of immersing the base material in the molten salt titanium plating solution composition, and the melting A step of forming a titanium plating film on the surface by energizing the base material immersed in the titanium salt plating solution composition to become a cathode and coating the surface of the base material with titanium. Including.
- FIG. 1 is a schematic cross-sectional view showing an example of a part of a titanium plating member.
- FIG. 2 is a flowchart showing a procedure for manufacturing a titanium plated member.
- FIG. 3 is a schematic cross-sectional view showing an example of a state in which a substrate is immersed in the molten salt titanium plating solution composition.
- FIG. 4 is a graph showing the corrosion current density of each electrode in physiological saline.
- FIG. 5 is a graph showing the correlation between the current density and potential of each electrode in simulated seawater.
- FIG. 6 is a graph showing the correlation between the current density and potential of each electrode in a simulated electrolyte solution of a polymer electrolyte fuel cell (PEFC).
- FIG. 7 is another graph showing the correlation between the current density and potential of each electrode in a simulated electrolyte solution of a polymer electrolyte fuel cell (PEFC).
- PEFC polymer electrolyte fuel cell
- a molten salt titanium plating solution composition (hereinafter also referred to as “plating solution composition”) according to one embodiment of the present disclosure includes at least one Group 1 metal ion of lithium ion and sodium ion, and fluoride. Ion and titanium ion are contained. The content of potassium ions with respect to 100 mol% of all ion components contained in the plating solution composition is 5 mol% or less.
- Titanium has a strong binding force with oxygen, so it easily reacts with water to form oxides and hydroxides and is not suitable for plating from aqueous solutions. Therefore, in order to form a titanium plating film on a substrate, a plating bath of a molten salt titanium plating solution composition made of a molten salt containing titanium ions is used.
- a molten salt titanium plating solution composition that contains a predetermined amount of a metal fluoride that is a source of fluoride ions.
- Potassium fluoride is used as a metal fluoride that is a source of fluoride ions.
- the molten salt titanium plating solution composition of the present disclosure can form a titanium plating film with high surface smoothness while suppressing generation of metal mist. That is, since the molten salt titanium plating solution composition of the present disclosure contains fluoride ions, a titanium plating film with high surface smoothness can be formed.
- the molten salt titanium plating solution composition of the present disclosure includes at least one of lithium and sodium ions having a lower reduction potential than potassium (less likely to be reduced) as a cation, and a potassium ion content of 5 mol%. It is as follows. From the lithium ions and sodium ions, metal fog is unlikely to occur under the conditions for titanium plating. The amount of potassium contained in the molten salt titanium plating solution composition is also sufficiently small. Therefore, generation
- the ratio of the fluoride ion in the total anion contained in the molten salt titanium plating solution composition may be 30 mol% or more and 100 mol% or less.
- a titanium plated member having a titanium plated film excellent in surface smoothness can be produced.
- the molten salt titanium plating solution composition may further contain chloride ions.
- chloride ions By containing chloride ions together with fluoride ions, the melting point of the molten salt titanium plating solution composition can be lowered by lowering the melting point. As a result, the titanium plating film can be formed at a lower temperature.
- the amount of the fluoride ion relative to a total of 100 mol% of the chloride ion and the fluoride ion may be 30 mol% or more and 50 mol% or less. Within such a range, the melting point of the molten salt titanium plating solution composition can be further lowered. As a result, it becomes possible to form a titanium plating film at an even lower temperature.
- the content of the titanium ion with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition is 0.1 mol% or more and 12 mol% or less. Thereby, a titanium plating film having high surface smoothness can be formed with high yield.
- the molten salt titanium plating solution composition is used for producing an insoluble electrode.
- the insoluble electrode which has a titanium plating film excellent in surface smoothness can be manufactured.
- the molten salt titanium plating solution composition is used for producing a current collector.
- the electrical power collector which has a titanium plating film excellent in surface smoothness can be manufactured.
- the molten salt titanium plating solution composition is used for the production of biomaterials.
- the biomaterial which has the titanium plating film excellent in surface smoothness can be manufactured.
- Such a biomaterial can also be excellent in corrosion resistance.
- a method for producing a titanium plated member includes a step of preparing a base material having a conductive surface, a step of immersing the base material in the molten salt titanium plating solution composition, Applying a current so that the substrate immersed in the molten salt titanium plating solution composition becomes a cathode, and coating the surface of the substrate with titanium, thereby forming a titanium plating film on the surface. And including.
- the titanium plating member which has a titanium plating film with high surface smoothness can be manufactured, suppressing generation
- a to B means the upper and lower limits of the range (that is, not less than A and not more than B), and there is no unit description in A, and the unit is described only in B.
- the unit of and the unit of B are the same.
- the molten salt titanium plating solution composition of the present embodiment includes at least one Group 1 metal ion of lithium ions (Li + ) and sodium ions (Na + ), fluoride ions (F ⁇ ), and titanium ions. (Ti n + (n is an integer of 2 or more and 4 or less; the same applies hereinafter)).
- the content of potassium ions (K + ) with respect to 100 mol% of all ion components contained in the plating solution composition is 5 mol% or less.
- the plating solution composition preferably further contains chloride ions (Cl ⁇ ).
- the plating solution composition contains Ti in a mixture of at least one of lithium fluoride (LiF) and sodium fluoride (NaF) and at least one of lithium chloride (LiCl) and sodium chloride (NaCl). It can be prepared as a molten salt by dissolving a titanium compound that is a source of n + .
- the plating solution composition can contain multiple types having different valences as Ti n + in the titanium compound.
- titanium compounds that supply Ti n + include hexafluorotitanic acid (H 2 TiF 6 ), potassium potassium fluoride (K 2 TiF 6 ), ammonium titanium fluoride ((NH 4 ) 2 TiF 6 ), and titanium fluoride. Soda (Na 2 TiF 6 ), potassium potassium oxalate dihydrate (K 2 TiO (C 2 O 4 ) 2 .2H 2 O), titanium chloride (III) (TiCl 3 ), titanium chloride (IV) (TiCl 4 ).
- Titanium potassium fluoride (K 2 TiF 6 ) and potassium potassium oxalate dihydrate (K 2 TiO (C 2 O 4 ) 2 ⁇ 2H 2 O) contain potassium ions, so all ions contained in the plating solution composition It is used in such an amount that the content of K + with respect to 100 mol% of the component is 5 mol% or less, or is used in combination with another titanium compound that does not generate K + (for example, titanium (IV) chloride).
- the plating solution composition that is a molten salt
- LiF, NaF, LiCl, and NaCl are ionized and exist in the states of Li + , Na + , F ⁇ , and Cl ⁇ .
- the titanium compound is ionized and exists in the state of Ti n + .
- the presence of Li + , Na + , F ⁇ , Cl ⁇ and Ti n + in the plating solution composition of the present embodiment means that, for example, the plating solution composition is dissolved in a mixed solution of nitric acid and hydrofluoric acid,
- the solution can be confirmed by analyzing by ICP emission spectroscopy (Inductively Coupled Plasma Spectrometry) or IC analysis (Ion Chromatography).
- ICP emission spectroscopic analyzer for example, iCAP6200 manufactured by Thermo Fisher Scientific Co., Ltd. can be used.
- the ratio of the fluoride ion in the total anion contained in the molten salt titanium plating solution composition can be 30 mol% or more and 100 mol% or less.
- the ratio of fluoride ions in all the anions is preferably 40 mol% or more and 90 mol% or less, more preferably 45 mol% or more and 75 mol% or less.
- the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is preferably 30 mol% or more and 50 mol% or less.
- Cl - and F - F to the total 100 mol% of the - is a large melting point depression effect when in a predetermined range ratio. Specifically, if the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is in the range of 30 mol% or more and 50 mol% or less, the decrease in melting point is large, and plating can be easily performed even at lower temperatures. Become. If the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is in the range of 30 mol% or more and 45 mol% or less, the amount of decrease in the melting point is more preferable.
- the content of Ti n + in the plating solution composition is not particularly limited, and is appropriately set according to the plating conditions. However, if the content of Ti n + is too large, unnecessary precipitates are formed, resulting in a large reduction in current efficiency. On the other hand, if the amount is too small, the titanium plating film is not sufficiently formed. Therefore, the content of Ti n + is preferably 20 mol% or less, more preferably 12 mol% or less with respect to 100 mol% of all cations in the plating solution composition.
- the content of Ti n + is preferably 0.1 mol% or more, more preferably 0.5 mol% or more with respect to 100 mol% of all cations in the plating solution composition. That is, it is preferable that the content of the titanium ion with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition is 0.1 mol% or more and 12 mol% or less.
- FIG. 1 is a schematic cross-sectional view showing an example of a part of a titanium plating member.
- FIG. 2 is a flowchart showing a procedure for manufacturing a titanium plated member.
- FIG. 3 is a schematic cross-sectional view showing an example of a state in which a substrate is immersed in the molten salt titanium plating solution composition.
- a titanium plating member 1 includes a base material 10 and a titanium plating film 20 (hereinafter, also simply referred to as “plating film 20”) formed on the surface of the base material 10.
- the plating film 20 is a film made of titanium.
- titanium plated member 1 is manufactured through steps S10 to S40 shown in FIG.
- the manufacturing method of the titanium plating member 1 according to the present embodiment includes a step of preparing the base material 10 having a conductive surface (S10) and a step of immersing the base material 10 in the plating solution composition 50 (S20).
- the manufacturing method of the titanium plating member 1 includes the step (S40) of cleaning the surface of the plating film 20.
- processes other than S10, S20, S30, and S40 may be included. Hereinafter, each of these steps will be described.
- a base material 10 having a conductive surface is prepared (S10).
- the material which comprises the base material 10 is not specifically limited as long as it is a material which has an electroconductive surface.
- Examples of the base material 10 include a base material made of iron or nickel, or a base material made of an alloy thereof, or a multilayer base material having a layer of iron, nickel, or an alloy thereof on the surface.
- the shape of the substrate 10 is not particularly limited.
- a substrate 10 having various shapes such as a plate shape, a column shape, a pipe shape, and a mesh shape can be employed.
- the base material 10 is immersed in the plating solution composition 50 (S20).
- the plating solution composition 50 the plating solution composition prepared as described above is used.
- the plating solution composition 50 includes at least one Group 1 metal ion of lithium ions (Li + ) and sodium ions (Na + ), fluoride ions ( F ⁇ ), titanium ions (Ti n + ), and chloride ions (Cl ⁇ ). Furthermore, the plating solution composition 50 is prepared such that the content of potassium ions (K + ) with respect to 100 mol% of all ionic components contained in the plating solution composition 50 is 5 mol% or less.
- the plating solution composition 50 is prepared such that the ratio of fluoride ions in all anions contained in the molten salt titanium plating solution composition is 30 mol% or more and 100 mol% or less. preferable. Furthermore, the plating solution composition 50 is preferably prepared so that the amount of F ⁇ relative to the total of 100 mol% of Cl ⁇ and F ⁇ is 30 mol% or more and 50 mol% or less. It is preferable that the plating solution composition 50 is prepared such that the content of Ti n + with respect to 100 mol% of all cations contained in the plating solution composition 50 is 0.1 mol% or more and 12 mol% or less.
- the substrate 10 immersed in the plating solution composition 50 is energized so as to become a cathode, and the surface of the substrate 10 is coated with titanium, thereby forming the titanium plating film 20 on the surface (S30). .
- a voltage is applied between the anode 30 immersed in the plating solution composition 50 and the substrate 10 as a cathode in a state where the substrate 10 is immersed in the plating solution composition 50. It is carried out by applying and energizing to electrolyze the plating solution composition 50. Thereby, titanium ions are reduced to titanium on the surface of the base material 10 which is a cathode, and the surface of the base material 10 is covered with titanium, whereby the plating film 20 is formed on the surface of the base material 10.
- the electrolysis of the plating solution composition 50 is performed so that the absolute value of the current density on the substrate 10 of the current flowing between the anode 30 and the substrate 10 is 1 mA / cm 2 or more and 500 mA / cm 2 or less.
- the absolute value of the current density is preferably 1 mA / cm 2 or more and 300 mA / cm 2 or less.
- the plating film 20 having high surface smoothness can be formed.
- the surface of the plating film 20 is washed (S40).
- Components contained in the plating solution composition 50 remain on the surface of the plating film 20 formed as described above. Therefore, the residual component on the surface of the plating film 20 can be removed by cleaning the surface of the plating film 20 with a cleaning agent.
- a cleaning agent water may be used. That is, the substrate 10 on which the plating film 20 is formed may be washed with water.
- Titanium plated member The titanium-plated member 1 produced in this way can be used in various fields as a member having a protective film having high hardness, high surface smoothness, and excellent corrosion resistance and wear resistance. it can.
- the ratio ((Ra / R) ⁇ 100 (%)) of the surface average roughness Ra to the average thickness R of the plating film 20 of the titanium plated member 1 manufactured by the above manufacturing method is preferably 10% or less. More preferably, it is 5% or less. If it is such a range, the titanium plating member 1 which has the plating film 20 with sufficiently high surface smoothness can be provided.
- the surface average roughness Ra of the plating film 20 can be measured using a cross-sectional observation by SEM (Scanning Electron Microscope) or a surface roughness meter.
- the average thickness R of the plating film 20 can be obtained by cross-sectional observation with an SEM.
- the surface average roughness Ra of the plating film 20 means the arithmetic average roughness Ra defined in JIS B 0601 (2001).
- the average thickness R of the plating film 20 can be, for example, an arithmetic average of the thickness of the plating film 20 at any 10 points in the SEM image.
- the above-described molten salt titanium plating solution composition is preferably used for the production of an insoluble electrode.
- a molten salt titanium plating solution composition for producing an insoluble electrode an insoluble electrode having a titanium plating film excellent in surface smoothness can be produced.
- the insoluble electrode is preferably for hydrogen production.
- the insoluble electrode is for hydrogen production, it can be provided as an insoluble electrode for hydrogen production with low resistance. This makes it possible to produce high purity hydrogen.
- the above-described molten salt titanium plating solution composition is preferably used for producing a current collector.
- a current collector having a titanium plating film excellent in surface smoothness can be produced.
- the current collector is preferably for a fuel cell.
- the current collector is for a fuel cell, it can be provided as a fuel cell current collector having good electrical conductivity.
- the current collector is for a fuel cell, it is more preferably for a polymer electrolyte fuel cell.
- the above-mentioned molten salt titanium plating solution composition is preferably used for the production of biomaterials.
- a molten salt titanium plating solution composition for producing a biomaterial a biomaterial having a titanium plating film excellent in surface smoothness can be produced. This biomaterial is also excellent in corrosion resistance.
- the use of the biomaterial is preferably selected from the group consisting of spinal fixation devices, fracture fixing materials, artificial joints, artificial valves, intravascular stents, denture bases, artificial tooth roots and orthodontic wires.
- the molten salt titanium plating solution composition 50 according to the present embodiment it is possible to suppress the generation of metal mist during plating. Furthermore, according to the manufacturing method of the titanium plating member 1 which concerns on this Embodiment, the titanium plating member 1 which has the plating film 20 with high surface smoothness can be manufactured.
- the molten salt titanium plating solution composition 50 containing chloride ions (Cl ⁇ ) has been described.
- the molten salt titanium plating solution composition 50 can also be prepared without including Cl ⁇ .
- the molten salt titanium plating solution composition 50 can be prepared so as to include other anions instead. In this case, it is desirable to select the other anions so as not to form a residue such as a salt that is stable at the plating temperature and difficult to remove after plating.
- the amount of F ⁇ with respect to 100 mol% in total of Cl ⁇ and F ⁇ is 30 mol% or more and 50 mol% or less, and with respect to 100 mol% of all cations contained in the plating solution composition 50.
- the plating solution composition 50 is preferably prepared so that the content of Ti n + is 0.1 mol% or more and 12 mol% or less.
- these amounts are not necessarily limited, and can be appropriately set in consideration of the required plating temperature and plating properties.
- Experiment No. 1 is an example using the plating solution composition of the example within the range of the molten salt titanium plating solution composition of the present disclosure.
- Experiment No. 2 to No. 4 is an example using the plating solution composition of the comparative example which is out of the range of the molten salt titanium plating solution composition of the present disclosure.
- Example 1 Preparation of molten salt titanium plating solution composition and preparation of titanium plated member] Experiments were conducted by dissolving one or both of K 2 TiF 6 powder and TiCl 4 gas as a titanium source in a ratio of 2 mol in total with respect to 100 mol of the main agent in the main agent of the plating solution composition shown in Table 1. No. 1-No. No. 4 molten salt titanium plating solution composition was prepared. Further, through the steps S10 to S40 (see FIG. 2) in the above-described method for producing a titanium plated member, 1-No. Using the molten salt titanium plating solution composition of No. 4, titanium plating was performed on the surface of a base material (made of nickel, thickness 0.1 mm, 5 mm ⁇ 25 mm square).
- “Good” means that the abnormal part is less than 5%
- “normal” means that the abnormal part is 5% or more and less than 20%
- “slightly bad” means that the abnormal part is Means 20% or more and less than 50%
- “bad” means that the abnormal part is 50% or more.
- small amount generation” in the presence or absence of occurrence of metal mist means that white smoke was confirmed during washing
- “generation” means that white smoke and sparks were confirmed.
- the plating property was good and the occurrence of metal fog was not confirmed.
- the metal of potassium is obtained by performing titanium plating using the molten salt titanium plating solution composition whose K + content is 5 mol% or less with respect to 100 mol% of the total ionic components contained in the molten salt titanium plating solution composition.
- the generation of fog could be suppressed.
- Example 2 [Preparation of molten salt titanium plating solution composition and preparation of titanium plated member]
- a titanium source one or both of K 2 TiF 6 powder and TiCl 4 gas are dissolved in a ratio shown in Tables 2 to 4 with respect to 100 mol of the base material in the base materials of the plating solution compositions shown in Tables 2 to 4. In this way, Experiment No. 5-No. Sixteen molten salt titanium plating solution compositions were prepared.
- the molten salt titanium plating solution composition of No. 5 is a comparative example because the content of K + with respect to 100 mol% of all ion components contained in the molten salt titanium plating solution composition is more than 5 mol%.
- Experiment No. 6-No. No. 16 molten salt titanium plating solution composition is an example because the content of K + with respect to 100 mol% of all ion components contained in the molten salt titanium plating solution composition is 5 mol% or less.
- the molten salt titanium plating solution composition of 15 is an example which does not contain chloride ions.
- the 16 molten salt titanium plating solution composition is an example in which the amount of fluoride ions is 30 mol% or more and 50 mol% or less with respect to 100 mol% in total of chloride ions and fluoride ions.
- Experiment No. Twelve molten salt titanium plating solution compositions have a titanium ion content of more than 12 mol% with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition.
- the content of titanium ions with respect to 100 mol% of all cations contained in the molten salt titanium plating solution composition is less than 0.1 mol%.
- Experiment No. 5-No. By using the molten salt titanium plating solution composition of No. 16, through the steps S10 to S40 (see FIG. 2) of the above-described method for producing a titanium plated member, a base material (made of nickel, thickness 0.1 mm, 5 mm ⁇ Titanium plating was performed on the surface of 25 mm square). As a result, Experiment No. 5-No. Sixteen titanium plating members were produced. Furthermore, Experiment No. 5-No. With respect to 16 titanium plated members, plating properties were evaluated by the same evaluation method as in Example 1. Experiment No. 5-No. 16, the presence or absence of metal fog in the process of titanium plating was also confirmed by the same evaluation method as in Example 1. The results are shown in Tables 2-4.
- Experiment No. 5-No. No. 16 molten salt titanium plating solution composition and Experiment No. 5-No.
- the correspondence with 16 titanium plated members is as follows. That is, Experiment No. The titanium plating member produced using the molten salt titanium plating solution composition of No. 5 corresponds to the titanium plating member. Thereafter, the experiment No. The titanium plating member produced using the molten salt titanium plating solution composition of “X” was tested in Experiment No. It corresponds to a titanium plated member of “X” (X means any number).
- the manufacturing method of the molten salt titanium plating solution composition 50 and the titanium plating member 1 according to the present embodiment it is possible to suppress the generation of metal fog during plating.
- Example 3 Corrosion resistance to physiological saline
- the corrosion resistance with respect to the physiological saline was evaluated in the following procedures.
- Ni porous body (trade name: “Celmet (registered trademark)”, manufactured by Sumitomo Electric Industries, Ltd.) and a Ti metal plate (manufactured by Niraco Co., Ltd.) were prepared as test samples of comparative examples.
- Electrolyte solution 0.9 mass% sodium chloride aqueous solution (saline)
- Working electrode Test specimen of Example or Comparative specimen (Ti plated product, Ni or Ti)
- Reference electrode Ag / AgCl electrode
- Counter electrode Ni metal plate Scanning speed: 10 mV / sec Liquid temperature: 25 degreeC.
- the results of FIG. 4 show that the Ti-plated product as an example has a low corrosion current density compared to the Ni porous material as a comparative example, and is stable in a physiological saline environment. It was done. From this result, it was found that the Ti plated product as an example is suitable as a biomaterial. Further, the Ti plated product as an example had a low corrosion current density compared to the Ti metal plate as a comparative example. From this result, it was shown that the stability with respect to the environment of physiological saline is further improved by adopting the structure of the metal porous body instead of the metal plate.
- Example 4 Corrosion resistance to salt water simulating seawater.
- the corrosion resistance with respect to the salt solution which simulated seawater was evaluated in the following procedures.
- a Ti-plated product produced by the same method as the Ti-plated product used in Example 3 was prepared as a test body of the example.
- a Ti metal plate manufactured by Niraco Co., Ltd. was prepared as a test sample of a comparative example.
- the Ti plated product as an example has a lower current density than the Ti commercial product as a comparative example, and exhibits high corrosion resistance against seawater. Thereby, it turned out that the Ti plating goods which are an Example are promising as an insoluble electrode (anode) for salt electrolysis.
- Example 5 Evaluation of suitability for polymer electrolyte fuel cells.
- the Ti plating product described later was evaluated for suitability for a polymer electrolyte fuel cell by the following procedure.
- a Ti-plated product produced by the same method as the Ti-plated product used in Example 3 was prepared as a test body of the example.
- a test body of a comparative example a Ni porous body (trade name: “Celmet (registered trademark)”, manufactured by Sumitomo Electric Industries, Ltd.) and a Ti metal plate (manufactured by Nilaco Corporation) were prepared.
- the Ti plated product as an example has a lower current density than that of a comparative Ni sample, and a current collector used in a polymer electrolyte fuel cell It proved promising as a material.
- titanium plating member 10 base material, 20 plating film, 30 anode, 40 container, 50 plating solution composition.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
チタンめっきにおいて表面が平滑な膜を得るためには溶融塩チタンめっき液組成物中にフッ化物イオン(F-)が存在することが重要である。フッ化物イオン源としては、フッ化カリウム(KF)が広く用いられている。KFは良好なフッ化物イオン源であるとともに、KFから生じるカリウムイオン(K+)を含有する溶融塩チタンめっき液組成物は、チタンめっきにおいて良好なめっき性を示す。
上記溶融塩チタンめっき液組成物によれば、めっき時の金属霧の発生を抑制することが可能となる。
最初に本開示の実施態様を列記して説明する。
次に、本開示の溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法の一実施の形態の詳細を以下に説明する。本明細書において「A~B」という形式の表記は、範囲の上限下限(すなわちA以上B以下)を意味し、Aにおいて単位の記載がなく、Bにおいてのみ単位が記載されている場合、Aの単位とBの単位とは同じである。
本実施の形態の溶融塩チタンめっき液組成物は、リチウムイオン(Li+)およびナトリウムイオン(Na+)のうち少なくとも1つの第1族金属イオンと、フッ化物イオン(F-)と、チタニウムイオン(Tin+(nは2以上4以下の整数。以下において同じ。))と、を含有する。上記めっき液組成物に含まれる全イオン成分100mol%に対するカリウムイオン(K+)の含有量が5mol%以下である。めっき液組成物は、塩化物イオン(Cl-)をさらに含有することが好ましい。
次に、図1~図3を参照して、本実施の形態におけるチタンめっき部材の製造方法について説明する。図1は、チタンめっき部材の一部の一例を示す概略断面図である。図2は、チタンめっき部材を製造するための手順を示すフローチャートである。図3は溶融塩チタンめっき液組成物に基材を浸漬した状態の一例を示す概略断面図である。
このようにして製造されたチタンめっき部材1は、高硬度を有し、表面平滑性が高く、かつ耐腐食性、耐摩耗性に優れた保護膜を有する部材として種々の分野において使用することができる。
このように、本実施の形態に係る溶融塩チタンめっき液組成物50によれば、めっき時の金属霧の発生を抑制することが可能となる。さらに本実施の形態に係るチタンめっき部材1の製造方法によれば、表面平滑性の高いめっき膜20を有するチタンめっき部材1を製造することができる。
[溶融塩チタンめっき液組成物の調製およびチタンめっき部材の作製]
表1に示すめっき液組成物の主剤に対し、チタン源として、K2TiF6粉末およびTiCl4ガスのいずれか一方または両方を、主剤100molに対して合計2molの割合で溶解させることによって、実験No.1~No.4の溶融塩チタンめっき液組成物を調製した。さらに、上述したチタンめっき部材の製造方法におけるS10~S40の工程(図2参照)を経ることにより、実験No.1~No.4の溶融塩チタンめっき液組成物を用いて、基材(ニッケル製、厚み0.1mm、5mm×25mm角)の表面にチタンめっきを行なった。これにより実験No.1~No.4のチタンめっき部材を作製した。次いで、実験No.1~No.4のチタンめっき部材に対し、それぞれめっき性を評価した。さらに実験No.1~No.4においてチタンめっきを行なう過程における金属霧の発生の有無を目視により確認した。結果を表1に示す。めっき性の評価は、具体的にはめっき面において変色、めっき未着などが発生することにより、めっき異常部となった割合を面積比(%)を用いて評価した。これを表1において、めっき性の優劣として「良好」、「普通」、「やや不良」、「不良」という用語を用いて分類した。「良好」は、上記異常部が5%未満であることを意味し、「普通」は、上記異常部が5%以上20%未満であることを意味し、「やや不良」は、上記異常部が20%以上50%未満であることを意味し、「不良」は、上記異常部が50%以上であることを意味する。表1中、金属霧の発生の有無において「少量発生」とは、水洗時に白煙が確認されたことを意味し、「発生」とは白煙と火花とが確認されたことを意味する。
[溶融塩チタンめっき液組成物の調製およびチタンめっき部材の作製]
表2~4に示すめっき液組成物の主剤に対し、チタン源として、K2TiF6粉末およびTiCl4ガスのいずれか一方または両方を、主剤100molに対して表2~4に示す割合で溶解させることによって、実験No.5~No.16の溶融塩チタンめっき液組成物を調製した。
[生理食塩水に対する耐食性]
後述するTiめっき品について、生理食塩水に対する耐食性を以下の手順で評価した。
実験No.8の溶融塩チタンめっき液組成物を用い、上述したチタンめっき部材の製造方法のS10~S40の工程(図2参照)を経ることにより、ニッケル製の多孔体基材(3cm×5cm×1mmt、気孔率は96%、平均気孔径は300μm、以下では「ニッケル多孔体」と記す。)の表面にチタンめっきを行なった。これにより実施例の試験体となるTiめっき品を準備した。
以下の条件によりサイクリックボルタンメトリーを行なった。結果を図4に示す。図4中、実施例の試験体ならびに比較例の試験体(Niの多孔体およびTiの金属板)を、それぞれ「Tiめっき品」、「Ni」および「Ti」と表記した。
電解液 :0.9質量%の塩化ナトリウム水溶液(生理食塩水)
作用極 :実施例の試験体または比較例の試験体(Tiめっき品、NiまたはTi)
参照極 :Ag/AgCl電極
対極 :Niの金属板
走査速度:10mV/sec
液温 :25℃。
[海水を模擬した食塩水に対する耐食性]
後述するTiめっき品について、海水を模擬した食塩水に対する耐食性を以下の手順で評価した。
実施例の試験体として、実施例3で用いたTiめっき品と同じ方法により作製したTiめっき品を準備した。比較例の試験体として、Tiの金属板(株式会社ニラコ製)を準備した。
電解液として海水を模擬した3.3質量%の食塩水を使用したこと以外、上述した[生理食塩水に対する耐食性]の欄に示した条件と同じ条件により、サイクリックボルタンメトリーを行った。結果を図5に示す。図5中、実施例の試験体および比較例の試験体を、それぞれ「Tiめっき品」および「Ti市販品」と表記した。
[固体高分子型燃料電池への適性評価]
後述するTiめっき品について、固体高分子型燃料電池への適性を以下の手順で評価した。
実施例の試験体として、実施例3で用いたTiめっき品と同じ方法により作製したTiめっき品を準備した。比較例の試験体として、Niの多孔体(商品名:「セルメット(登録商標)」、住友電気工業株式会社製)およびTiの金属板(株式会社ニラコ製)をそれぞれ準備した。
電解液として10質量%の硫酸ナトリウム水溶液(硫酸を加えてpH=3に調整した)(PEFC模擬電解液)を使用したこと以外、上述した[生理食塩水に対する耐食性]の欄に示した条件と同じ条件により、サイクリックボルタンメトリーを行った。結果を図6および図7に示す。図6および図7中、実施例の試験体、ならびに比較例の試験体(Niの多孔体およびTiの金属板)を、それぞれ「Tiめっき品」、「Ni比較用」および「Ti比較用」と表記した。なお図6において、「Tiめっき品」および「Ti比較用」における各電極の電流密度と電位との相関関係のプロットが重複して現れたため、図7において縦軸(電流密度)を拡大することにより、「Tiめっき品」および「Ti比較用」における上記相関関係のプロットが区別可能に現れるようにした。
Claims (9)
- 溶融塩チタンめっき液組成物であって、
リチウムイオンおよびナトリウムイオンのうち少なくとも1つの第1族金属イオンと、
フッ化物イオンと、
チタニウムイオンと、を含有し、
前記溶融塩チタンめっき液組成物に含まれる全イオン成分100mol%に対するカリウムイオンの含有量が5mol%以下である、溶融塩チタンめっき液組成物。 - 前記溶融塩チタンめっき液組成物中に含まれる全アニオン中の前記フッ化物イオンの割合は、30mol%以上100mol%以下である、請求項1に記載の溶融塩チタンめっき液組成物。
- 塩化物イオンをさらに含有する、請求項1または請求項2に記載の溶融塩チタンめっき液組成物。
- 前記塩化物イオンと前記フッ化物イオンとの合計100mol%に対する前記フッ化物イオンの量が30mol%以上50mol%以下である、請求項3に記載の溶融塩チタンめっき液組成物。
- 前記溶融塩チタンめっき液組成物中に含まれる全カチオン100mol%に対する前記チタニウムイオンの含有量は、0.1mol%以上12mol%以下である、請求項1から請求項4のいずれか1項に記載の溶融塩チタンめっき液組成物。
- 請求項1から請求項5のいずれか1項に記載の溶融塩チタンめっき液組成物は、不溶性電極の製造に用いられる、溶融塩チタンめっき液組成物。
- 請求項1から請求項5のいずれか1項に記載の溶融塩チタンめっき液組成物は、集電体の製造に用いられる、溶融塩チタンめっき液組成物。
- 請求項1から請求項5のいずれか1項に記載の溶融塩チタンめっき液組成物は、生体材料の製造に用いられる、溶融塩チタンめっき液組成物。
- 導電性の表面を有する基材を準備する工程と、
前記基材を、請求項1から請求項5のいずれか1項に記載の溶融塩チタンめっき液組成物に浸漬する工程と、
前記溶融塩チタンめっき液組成物に浸漬された前記基材がカソードとなるように通電し、前記基材の前記表面をチタンで被覆することにより、前記表面上にチタンめっき膜を形成する工程と、を含むチタンめっき部材の製造方法。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019519485A JP6947212B2 (ja) | 2017-05-22 | 2018-03-13 | 溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 |
| CN201880025988.3A CN110582594A (zh) | 2017-05-22 | 2018-03-13 | 熔融盐钛镀液组合物以及镀钛部件的制造方法 |
| EP18806263.2A EP3633076A4 (en) | 2017-05-22 | 2018-03-13 | COMPOSITION OF MOLTEN SALT TITANIUM PLATE SOLUTION AND METHOD FOR MANUFACTURING THE TITANIUM PLATED ELEMENT |
| US16/603,920 US20200080216A1 (en) | 2017-05-22 | 2018-03-13 | Molten-salt titanium plating solution composition and method for manufacturing titanium-plated member |
| KR1020197031022A KR20200010199A (ko) | 2017-05-22 | 2018-03-13 | 용융염 티탄 도금액 조성물 및 티탄 도금 부재의 제조 방법 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-100757 | 2017-05-22 | ||
| JP2017100757 | 2017-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018216320A1 true WO2018216320A1 (ja) | 2018-11-29 |
Family
ID=64395403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/009739 Ceased WO2018216320A1 (ja) | 2017-05-22 | 2018-03-13 | 溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20200080216A1 (ja) |
| EP (1) | EP3633076A4 (ja) |
| JP (1) | JP6947212B2 (ja) |
| KR (1) | KR20200010199A (ja) |
| CN (1) | CN110582594A (ja) |
| WO (1) | WO2018216320A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019171744A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
| WO2020017148A1 (ja) * | 2018-07-18 | 2020-01-23 | 住友電気工業株式会社 | チタンめっき用電解質、チタンめっき用電解質の評価方法及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 |
| JP7489309B2 (ja) | 2020-12-24 | 2024-05-23 | 東邦チタニウム株式会社 | チタンめっき材の製造方法 |
| WO2025221318A3 (en) * | 2024-01-17 | 2026-01-29 | Battelle Memorial Institute | Composition for plating metal coatings and methods of making and using the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50136238A (ja) * | 1974-04-18 | 1975-10-29 | ||
| JPS51138511A (en) * | 1975-05-27 | 1976-11-30 | Sony Corp | Method for regulating the hardness of metallic tita nium |
| JPH06173065A (ja) * | 1992-12-09 | 1994-06-21 | Japan Energy Corp | Tiの精製方法 |
| JP2015193899A (ja) | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
| JP2017100757A (ja) | 2015-11-30 | 2017-06-08 | 株式会社吉野工業所 | 内容物を計量して塗布する塗布容器 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3479159A (en) * | 1966-11-10 | 1969-11-18 | Gen Electric | Process for titaniding base metals |
| US3979267A (en) * | 1972-01-24 | 1976-09-07 | Townsend Douglas W | Electrolytic method |
| US4483752A (en) * | 1982-09-28 | 1984-11-20 | Eltech Systems Corporation | Valve metal electrodeposition onto graphite |
| JP3779368B2 (ja) * | 1996-02-09 | 2006-05-24 | 松田医科工業株式会社 | 生体用複合インプラント材 |
| JP2000256898A (ja) * | 1999-03-03 | 2000-09-19 | Permelec Electrode Ltd | ウェーハの銅めっき方法 |
| CN101035930B (zh) * | 2004-10-01 | 2012-12-12 | 住友电气工业株式会社 | 熔融盐浴、利用该熔融盐浴获得的析出物、金属制品制造方法及金属制品 |
| WO2006057231A1 (ja) * | 2004-11-24 | 2006-06-01 | Sumitomo Electric Industries, Ltd. | 溶融塩浴、析出物および金属析出物の製造方法 |
| JP4919225B2 (ja) * | 2007-02-02 | 2012-04-18 | 住友電気工業株式会社 | 電気二重層キャパシタ用電極 |
| JP2013147731A (ja) * | 2011-12-22 | 2013-08-01 | Sumitomo Electric Ind Ltd | 溶融塩電解による金属の製造方法 |
| CN103882477B (zh) * | 2012-12-21 | 2016-12-28 | 攀钢集团攀枝花钢铁研究院有限公司 | 一种用于制备金属钛的电解质和熔盐及金属钛的制备方法 |
| CN105112963B (zh) * | 2015-10-10 | 2017-10-24 | 东北大学 | 一种利用熔盐电沉积法制备金属铝及其合金的方法 |
| US20200063281A1 (en) * | 2016-11-22 | 2020-02-27 | Sumitomo Electric Industries, Ltd. | Method for preparing titanium plating solution and method for manufacturing titanium plated product |
| JP7086172B2 (ja) * | 2018-03-08 | 2022-06-17 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
-
2018
- 2018-03-13 KR KR1020197031022A patent/KR20200010199A/ko not_active Withdrawn
- 2018-03-13 EP EP18806263.2A patent/EP3633076A4/en not_active Withdrawn
- 2018-03-13 JP JP2019519485A patent/JP6947212B2/ja active Active
- 2018-03-13 WO PCT/JP2018/009739 patent/WO2018216320A1/ja not_active Ceased
- 2018-03-13 US US16/603,920 patent/US20200080216A1/en not_active Abandoned
- 2018-03-13 CN CN201880025988.3A patent/CN110582594A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50136238A (ja) * | 1974-04-18 | 1975-10-29 | ||
| JPS51138511A (en) * | 1975-05-27 | 1976-11-30 | Sony Corp | Method for regulating the hardness of metallic tita nium |
| JPH06173065A (ja) * | 1992-12-09 | 1994-06-21 | Japan Energy Corp | Tiの精製方法 |
| JP2015193899A (ja) | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
| JP2017100757A (ja) | 2015-11-30 | 2017-06-08 | 株式会社吉野工業所 | 内容物を計量して塗布する塗布容器 |
Non-Patent Citations (4)
| Title |
|---|
| A. ROBIN: "ELECTOLYTIC COATING OF TITANIUM ONTO IRON AND NICKEL ELECTRODES IN THE MOLTEN LiF+NaF+KF EUTECTIC", JOURNAL OF ELECTROANAL. CHEM., vol. 230, 1987, pages 125 - 141, XP026763330, doi:10.1016/0022-0728(87)80137-7 |
| F. R. CLAYTON ET AL.: "Electrochemical Studies of Titanium in Molten Fluorides, J. Electrochem. Soc.", ELECTROCHEMICAL SCIENCE AND TECHNOLOGY, vol. 120, no. 9, 1973, pages 1193 - 1199, XP055555016 * |
| See also references of EP3633076A4 |
| SONG JIANXUN ET AL.: "The Influence of Fluoride Anion on the Equilibrium between Titanium Ions and Electrodeposition of Titanium in Molten Fluoride-Chloride Salt", MATERIALS TRANSACTIONS, vol. 55, no. 8, 2014, pages 1299 - 1303, XP055557019 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019171744A1 (ja) * | 2018-03-08 | 2019-09-12 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
| JPWO2019171744A1 (ja) * | 2018-03-08 | 2021-03-11 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
| JP7086172B2 (ja) | 2018-03-08 | 2022-06-17 | 住友電気工業株式会社 | チタンめっき部材の製造方法及びチタンめっき部材 |
| WO2020017148A1 (ja) * | 2018-07-18 | 2020-01-23 | 住友電気工業株式会社 | チタンめっき用電解質、チタンめっき用電解質の評価方法及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 |
| JPWO2020017148A1 (ja) * | 2018-07-18 | 2021-08-02 | 住友電気工業株式会社 | チタンめっき用電解質、チタンめっき用電解質の評価方法及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 |
| JP7207411B2 (ja) | 2018-07-18 | 2023-01-18 | 住友電気工業株式会社 | チタンめっき用電解質の評価方法及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 |
| JP7489309B2 (ja) | 2020-12-24 | 2024-05-23 | 東邦チタニウム株式会社 | チタンめっき材の製造方法 |
| WO2025221318A3 (en) * | 2024-01-17 | 2026-01-29 | Battelle Memorial Institute | Composition for plating metal coatings and methods of making and using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110582594A (zh) | 2019-12-17 |
| US20200080216A1 (en) | 2020-03-12 |
| JP6947212B2 (ja) | 2021-10-13 |
| KR20200010199A (ko) | 2020-01-30 |
| EP3633076A1 (en) | 2020-04-08 |
| JPWO2018216320A1 (ja) | 2020-03-19 |
| EP3633076A4 (en) | 2021-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6960095B2 (ja) | 金属多孔体、不溶性陽極、燃料電池用電極、水素の製造装置、生体材料、および金属多孔体の製造方法 | |
| Oliveira et al. | Studies on electrodeposition and characterization of the Ni–W–Fe alloys coatings | |
| JP6960096B2 (ja) | 複合金属多孔体、不溶性陽極、燃料電池用電極、水素の製造装置、形状記憶合金、生体材料、および複合金属多孔体の製造方法 | |
| JP6947212B2 (ja) | 溶融塩チタンめっき液組成物およびチタンめっき部材の製造方法 | |
| BR112017021409B1 (pt) | Método para fosfatação de uma superfície metálica, e, superfície metálica revestida com fosfato | |
| Norikawa et al. | Electrodeposition of titanium in a water-soluble KF–KCl molten salt | |
| WO2018216319A1 (ja) | チタンめっき部材の製造方法 | |
| JP2015165053A (ja) | 電着浴、電着システム、及び電着方法 | |
| JP4883534B2 (ja) | 溶融塩浴、溶融塩浴の製造方法およびタングステン析出物 | |
| Sharma et al. | Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings | |
| Shekhanov et al. | Electrodeposition of zinc–nickel alloys from ammonium oxalate electrolytes | |
| TWI507564B (zh) | 具有改善腐蝕表現之塗料及使用其之方法 | |
| CN113463148A (zh) | 一种在钛或钛合金基材表面电镀金的方法 | |
| JPWO2019098378A1 (ja) | 黒色酸化被膜を備えるマグネシウム又はアルミニウム金属部材及びその製造方法 | |
| JP7086172B2 (ja) | チタンめっき部材の製造方法及びチタンめっき部材 | |
| WO2022138219A1 (ja) | 金属充填微細構造体および金属充填微細構造体の製造方法 | |
| US20220243338A1 (en) | Electrode coating | |
| CA3221841A1 (en) | Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions | |
| Kublanovsky et al. | Electrodeposition of palladium coatings from iminodiacetate electrolyte | |
| Liu et al. | Electrodeposition of molybdenum from water-in-acetate electrolytes | |
| JP7575445B2 (ja) | チタンめっき用電解質及びチタンめっき用電解質を用いたチタンめっき部材の製造方法 | |
| JP7846770B2 (ja) | 黒鉛含有層のための分散体電解液 | |
| CA3141530C (en) | Electrode coating | |
| Tasic et al. | Influence of electrodeposition parameters of NieW on Ni cathode for alkaline water electrolyser |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 18806263 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2019519485 Country of ref document: JP Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: 20197031022 Country of ref document: KR Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 2018806263 Country of ref document: EP |
|
| ENP | Entry into the national phase |
Ref document number: 2018806263 Country of ref document: EP Effective date: 20200102 |



