WO2019019580A1 - 封装结构、显示面板及其制作方法 - Google Patents

封装结构、显示面板及其制作方法 Download PDF

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Publication number
WO2019019580A1
WO2019019580A1 PCT/CN2018/074236 CN2018074236W WO2019019580A1 WO 2019019580 A1 WO2019019580 A1 WO 2019019580A1 CN 2018074236 W CN2018074236 W CN 2018074236W WO 2019019580 A1 WO2019019580 A1 WO 2019019580A1
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WIPO (PCT)
Prior art keywords
film
package
edge
display panel
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/074236
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English (en)
French (fr)
Chinese (zh)
Inventor
王伟
倪静凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to EP18765791.1A priority Critical patent/EP3660938B1/de
Priority to KR1020187033433A priority patent/KR102105509B1/ko
Priority to US16/085,421 priority patent/US11233217B2/en
Priority to JP2018549471A priority patent/JP7176954B2/ja
Publication of WO2019019580A1 publication Critical patent/WO2019019580A1/zh
Anticipated expiration legal-status Critical
Priority to US17/132,208 priority patent/US11527589B2/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • At least one embodiment of the present disclosure is directed to a package structure, a display panel, and a method of fabricating the same.
  • OLED organic light emitting diode
  • TFE Thin Film Encapsulation
  • At least one embodiment of the present disclosure is directed to a package structure, a display panel, and a method of fabricating the same to improve the yield and reliability of the display panel.
  • At least one embodiment of the present disclosure provides a display panel, including:
  • An edge package is on the edge of the encapsulation film and is configured to wrap the edge of the encapsulation film.
  • the edge panel is located at a periphery of the device to be packaged.
  • the edge panel is a closed loop structure.
  • the edge panel includes a hollowed out structure having a first side proximate the hollow structure and a second side remote from the hollow structure, The edge of the edge package on the second side is flush with the substrate.
  • the edge package material includes an organic material.
  • the package film includes a first film, a second film, and a third film, which are sequentially away from the substrate, and the second film is sandwiched by the first film. Between the film and the third film, and at an edge position, the first film and the third film are in contact, the edge package covering at least a stack of the first film and the third film Contact part.
  • a display panel according to one or some embodiments of the present disclosure at the edge position, the edge package and the second film have overlapping portions in a direction perpendicular to the base substrate.
  • the first film and the third film are inorganic films, and the second film is an organic film.
  • a display panel according to one or some embodiments of the present disclosure further includes a blocking portion disposed on a side of the edge package away from the package film.
  • a display panel has a space between the barrier portion and the encapsulation film.
  • An encapsulation film is overlaid on the device to be packaged, and an edge package is formed on an edge of the encapsulation film, the edge package being configured to wrap an edge of the encapsulation film.
  • a method of fabricating a display panel is provided on a periphery of the device to be packaged.
  • a method of fabricating a display panel is a closed loop structure.
  • a method of fabricating a display panel includes an organic material.
  • a method of fabricating a display panel includes a first film, a second film, and a third film, which are sequentially separated from the substrate, and the second film is sandwiched between Between the first film and the third film, and at an edge position, the first film and the third film are in contact, and the edge package covers at least the first film and the third film The laminated contact portion.
  • a method of fabricating a display panel has an overlap portion in the direction perpendicular to the base substrate at the edge position.
  • the first film and the third film are inorganic films, and the second film is an organic film.
  • a method of fabricating a display panel according to one or more embodiments of the present disclosure further comprising forming a barrier, wherein the barrier is disposed on a side of the edge package away from the package film.
  • a method of fabricating a display panel has a space between the barrier portion and the encapsulation film.
  • An LED display panel includes any of the above display panels.
  • At least one embodiment of the present disclosure also provides a package structure, including:
  • An edge package is on the edge of the encapsulation film and is configured to wrap the edge of the encapsulation film.
  • the edge package is located at a periphery of the device to be packaged.
  • the edge package is a closed loop structure.
  • the edge package includes a hollowed out structure having a first side proximate the hollow structure and a second side remote from the hollow structure, The edge of the edge package on the second side is flush with the substrate.
  • the package film includes a first film, a second film, and a third film, which are sequentially away from the substrate, and the second film is sandwiched by the first film. Between the film and the third film, and at an edge position, the first film and the third film are in contact, the edge package covering at least a stack of the first film and the third film Contact part.
  • a package structure according to one or some embodiments of the present disclosure at the edge position, the edge package and the second film have overlapping portions in a direction perpendicular to the base substrate.
  • a package structure according to one or some embodiments of the present disclosure further includes a barrier disposed on the base substrate, wherein the barrier is disposed on a side of the edge package away from the package film.
  • 1 is a top plan view of an OLED display panel
  • Figure 2A is a cross-sectional view of the portion of Figure 1 at AB (only showing the portion of the package film);
  • 2B is a schematic view showing that the falling of the particles causes fragmentation of the contact portion of the laminate to cause package failure
  • 3A is a laminate contact portion of a smaller length in an OLED display panel
  • 3B is a laminate contact portion of a larger length in an OLED display panel
  • 4A is a schematic view showing a first barrier dam disposed in an OLED display panel
  • 4B is a schematic view of the edge of the second film in the OLED display panel closer to the first barrier dam;
  • 4C is a schematic view of the OLED display panel further including a second barrier dam
  • FIG. 5 is a cross-sectional view of a display panel, for example, a cross-sectional view at a CD and an EF in FIG. 1;
  • FIG. 6A is a schematic top view of an OLED display panel/package structure according to an embodiment of the present disclosure
  • FIG. 6B is a schematic top view of an edge package according to an embodiment of the present disclosure.
  • FIG. 7A is a cross-sectional view of the GH of FIG. 6A (only the package structure portion is shown) provided by another embodiment of the present disclosure;
  • FIG. 7B is a schematic diagram of a package structure according to another embodiment of the present disclosure (a cross-sectional view at GH in FIG. 6A, showing only a package structure portion);
  • FIG. 8 is a schematic diagram of a display panel/package structure according to another embodiment of the present disclosure.
  • FIG. 9 is a cross-sectional view of a OLED display panel according to an embodiment of the present disclosure (a schematic cross-sectional view taken along line JK and MN in FIG. 6A);
  • FIG. 10 is a schematic diagram of an OLED display panel motherboard/package structure according to an embodiment of the present disclosure.
  • Figure 11 is a cross-sectional view of the PQ of Figure 10;
  • Figure 12 is a cross-sectional view of the UV portion and XY of Figure 10;
  • FIG. 13A is a schematic diagram of forming a device to be packaged on a substrate on which a TFT arranged in an array is formed in a method of fabricating an OLED display panel;
  • 13B is a schematic diagram of forming a package film on a device to be packaged in a method for fabricating an OLED display panel
  • 13C is a schematic view showing a method of fabricating an OLED display panel in which a protective film is attached on a package film;
  • FIG. 13D is a schematic diagram of a side of a method for fabricating an OLED display panel, in which a laser is used to illuminate a support substrate away from a substrate;
  • FIG. 13E is a schematic diagram of a method of fabricating an OLED display panel, in which a support substrate is separated from a substrate, and a base film is attached to a side of the substrate away from the device to be packaged;
  • 13F is a schematic diagram of cutting a display panel motherboard into a display panel in a method for fabricating an OLED display panel
  • FIG. 14 is a schematic diagram of a display panel/manufacturing method of a package structure according to an embodiment of the present disclosure
  • FIG. 15 is a schematic diagram of a method of fabricating a display panel/package structure according to an embodiment of the present disclosure.
  • the OLED display panel includes a package film covering area (protective area) 11, an unprotected area 12, and a binding area 13.
  • the unprotected region 12 does not cover the package film, the unprotected region 12 may be located at the periphery of the package film covering region 11, and the bonding region 13 may be disposed at one side of the package film covering region 11.
  • FIG. 2A shows a schematic cross-sectional view at AB in FIG. 1 (only the package film portion is shown), and as shown in FIG. 2A, a package film 1123 is provided on the base substrate 100.
  • the encapsulation film 1123 includes a first film 101, a second film 102, and a third film 103 which are sequentially separated from the substrate 100.
  • the second film 102 is interposed between the first film 101 and the third film 103, and at the edge position, the first film 101 and the third film 103 are in contact.
  • the laminated contact portion (stack contact) 1013 of the first film 101 and the third film 103 is shown in Fig. 2A.
  • the first film 101 and the third film 103 may be inorganic thin films, for example, inorganic oxides such as SiNx, SiOx, and SiOxNy, but are not limited thereto.
  • the second film 102 may be an organic film, for example, may be an organic substance such as a resin, but is not limited thereto.
  • the resin may be, for example, a thermosetting resin, and the thermosetting resin includes, for example, an epoxy resin, but is not limited thereto.
  • the resin may be, for example, a thermoplastic resin, and the thermoplastic resin includes, for example, an acrylic (PMMA) resin, but is not limited thereto.
  • the first film 101 and the third film 103 may be formed by a chemical vapor deposition (CVD) method, and the second film 102 may be formed by an inkjet printing (Ink Jet Printing, IJP) method. Both the first film 101 and the third film 103 can function as a water blocking layer.
  • the first film 101 may include a plurality of laminated sub-layers
  • the second film 102 and the third film 103 may each include a plurality of sub-layers disposed in a stack, but are not limited thereto.
  • the OLED display panel is easily affected by the water 002 and the oxygen 003, which easily affects the display area and affects the yield and reliability of the OLED display panel.
  • particles falling on the edge such as those produced by laser cutting, may cause chipping of the laminated contact portion 1013 of the edge region when the pressing is performed, thereby causing the package to fail.
  • 3A and 3B show laminate contact portions 1013 of different lengths.
  • the length L1 of the laminated contact portion 1013 is shown in Fig. 3A.
  • the length of the laminated contact portion 1013 can be increased to L2, L2>L1.
  • the probability that the particles 001 are dropped on the laminated contact portion 1013 is also increased.
  • a first barrier dam 106 may be provided in order to facilitate the fabrication of the second film 102 and/or increase the effective length of the laminate contact portion 1013.
  • the effective length is, for example, the actual length of the laminated contact portion 1013, and an increase in the effective length may be advantageous in extending the path of water oxygen permeating from the edge.
  • the climbing distance D of the second film 102 which may be the distance from the edge of the second film 102 to the distance from the edge to reach the target height.
  • the target height may be a range of thicknesses that the second film 102 may have in the display area.
  • the target height may be on the order of micrometers, for example, may be 4-15 ⁇ m, but is not limited thereto. Because the thickness of the second film is relatively small at the climbing position, if the particles 001 fall at the climbing position during the production of the packaging film, the OLED display panel is likely to be defective, and the reliability is easily reduced.
  • FIG. 4B The situation in which the edge of the second film 102 is closer to the first barrier dam 106 is shown in FIG. 4B. At this time, the climbing distance can be reduced.
  • FIG. 4C illustrates a case where the OLED display panel further includes the second barrier dam 107.
  • the arrangement of the plurality of barrier dams further increases the effective length of the laminated contact portion 1013 and prolongs the path of water oxygen infiltration from the edges.
  • a substrate substrate 100 is provided on the support substrate 200, which may be a flexible substrate, for example, may be a polyacyl group. Polyimide (PI), but is not limited to this.
  • the support substrate 200 may be a glass substrate, but is not limited thereto.
  • a Thin Film Transistor (TFT) 3123 array may be disposed on the base substrate 100, and only one thin film transistor 3123 is shown in FIG.
  • the thin film transistor 3123 may include a semiconductor layer, a gate, a gate insulating layer, a source and a drain, and the like.
  • a buffer layer 111, a semiconductor layer 112, a gate insulating layer 113, a gate electrode 114, an interlayer dielectric layer 115, and a source/drain layer 116 may be sequentially disposed on the base substrate 100.
  • the source drain layer 116 includes a source 1161 and a drain 1162, and the source 1161 and the drain 1162 are spaced apart from each other and may be connected to the semiconductor layer 112 through via holes, respectively.
  • a flat layer 117 may be disposed on the thin film transistor 3123, and the device to be packaged (OLED) 2123 may be disposed on the flat layer 117.
  • the device to be packaged (OLED) 2123 may include a first electrode 121, a light emitting function layer 122 and a second electrode 123, first The electrode 121 may be electrically connected to the drain 1162 through a via penetrating through the flat layer 117. A pixel defining layer 118 may be disposed on the first electrode 121 to facilitate formation of the light emitting function layer 122. The second electrode 123 may be electrically connected to the electrode lead 1163 through the connection electrode 1211.
  • the light emitting function layer 122 may include a light emitting layer, and may further include other functional layers, for example, at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, but is not limited thereto.
  • the electrode lead 1163 can be formed in the same layer as the source and drain layers 116 to reduce the fabrication process.
  • a package film 1123 can be formed on the device to be packaged (OLED) 2123.
  • the encapsulation film 1123 can be as described above.
  • the package film 1123 covers the device to be packaged 2123.
  • the structure of the device to be packaged (OLED) 2123 is not limited thereto.
  • first barrier dam 106 and a second barrier dam 107 are also shown in FIG. 5.
  • the first barrier dam 106 may be formed in the same layer as the pixel defining layer 118.
  • the second barrier dam 107 may include a first sub-barrier dam 1071 and a second sub-barrier dam 1072.
  • the first sub-barrier dam 1071 may be formed in the same layer as the flat layer 117
  • the second sub-barrier dam 1072 may be formed in the same layer as the pixel defining layer 118. The formation of the same layer can help reduce the manufacturing process.
  • FIG. 6A is a top plan view of an OLED display panel/package structure according to an embodiment of the present disclosure.
  • An edge package 104 is also included in the package structure of the OLED display panel, and the edge package 104 is on the edge of the package film 1123.
  • the edge package 104 can be a closed loop structure.
  • the ring shape may include, for example, a rectangular ring, a ring, or the like, and the shape of the ring is not limited.
  • the edge package 104 material may include an organic material
  • the organic material may include a resin, a silicon-based organic colloid, or the like
  • the resin as the main material of the edge package 104 may be, for example, a thermosetting resin
  • the thermosetting resin includes, for example, a ring.
  • the oxyresin is not limited thereto, and the resin as the main material of the edge package 104 may be, for example, a thermoplastic resin, and the thermoplastic resin includes, for example, a PMMA resin, but is not limited thereto.
  • the material of the edge package 104 may include other auxiliary materials in addition to the above-mentioned main materials, and the auxiliary materials include, for example, a curing agent, a leveling agent, and the like, but are not limited thereto.
  • the edge package 104 may have a thickness of 4-15 ⁇ m, but is not limited thereto.
  • the edge package 104 has a hollowed out structure 1040. That is, the edge package 104 is only located at the edge of the package film 1123, and only wraps the edge of the package film 1123. The edge package 104 is not disposed on the central portion of the encapsulation film 1123 (corresponding to the position of the hollow structure 1040).
  • the laminated contact portion 1013 is wrapped by the edge package 104 to protect the laminated contact portion 1013, and the edge of the package film 1123 is protected, so that even if particles fall, the laminated contact portion 1013 Also not easy to break. It is also possible to avoid the unevenness of the force at the time of pressing, which causes the edge position to be broken. Thereby, the yield and reliability of the OLED display panel can be improved.
  • the edge package 104 is on the edge of the package film 1123 in accordance with one or some embodiments of the present disclosure.
  • the encapsulation film 1123 may include the first film 101, the second film 102, and the third film 103 as described above, and at the edge position, the first film 101 and the third film 103 are in contact, and the edge package 104 covers at least the first The laminated contact portion of the film 101 and the third film 103.
  • the laminate contact portion 1013 can include at least two films for packaging.
  • the laminated contact portion may be referred to as a first thickness package film 11231.
  • the encapsulation film 1123 may be a second thickness encapsulation film 11232 in addition to the lamination contact portion.
  • the second thickness encapsulation film 11232 can include at least three films for encapsulation.
  • the second thickness package film 11232 is located inside the first thickness package film 11231.
  • the thickness of the second thickness encapsulation film 11232 is greater than the thickness of the first thickness encapsulation film 11231.
  • the second thickness encapsulation film 11232 can have different thicknesses at different locations, for example, the thickness near the laminate contact portion can be less than the thickness near the center of the display panel.
  • the edge package 104 covers (wrapps) at least the first thickness package film 11231.
  • the display panel/package structure may further include a barrier portion 105 that may be disposed on a side of the edge package 104 away from the package film 1123.
  • the barrier portion 105 may be made of an organic material such as a resin, but is not limited thereto.
  • FIG. 7B A display panel/package structure according to another embodiment of the present disclosure is shown in FIG. 7B, which is provided with a first barrier dam 106 to increase the effective length of the laminated contact portion 1013 as compared with the package structure shown in FIG. 7A. . Due to the provision of the edge package 104, the laminated contact portion 1013 is wrapped by the edge package 104, so that the first barrier dam 106 can be provided to obtain the laminate contact portion 1013 of a larger effective length even if particles are dropped, the laminate The contact portion 1013 is also less prone to chipping, so that the edge package 104 and the first barrier dam 106 cooperate to further increase package reliability.
  • the barrier portion 105 and the package film 1123 may have a space therebetween.
  • FIG. 8 illustrates a display panel/package structure according to another embodiment of the present disclosure, in which no barrier is provided to reduce the fabrication process.
  • a second barrier dam 107 may be disposed.
  • the second barrier dam 107 is spaced apart from the first barrier dam 106 and may be formed in the same layer as the first barrier dam 106.
  • the edge package 104 and the first barrier are The cooperation of the dam 106 and the second barrier dam 107 can further increase package reliability.
  • the blocking portion 105 may include a plurality of sub-blocking portions, for example, may include the first sub-blocking portion 1051, the second sub-blocking portion 1052, and the third sub-blocking portion 1053, but is not limited thereto.
  • the first sub-block 1051 may be formed in the same layer as the flat layer 117
  • the second sub-block 1052 may be formed in the same layer as the pixel defining layer 118
  • the third sub-block 1053 may be in the same layer as the thick support layer (PS). form.
  • PS thick support layer
  • the case thickness support layer is not shown in FIG. 9, and the case thickness support layer may be disposed on the package film 1123.
  • a display panel/package structure according to one or some embodiments of the present disclosure is provided at an edge position for better protection of an edge portion of the package film (eg, a climbing position).
  • the edge package 104 and the second film 102 have overlapping portions 41 in a direction perpendicular to the base substrate 100.
  • the edge package 104 and the second thickness package film 11232 have overlapping portions 41 in a direction perpendicular to the base substrate 100.
  • the edge package 104 is located on the periphery of the device 2123 to be packaged to facilitate edge packaging.
  • the periphery of the device to be packaged 2123 is, for example, in a direction perpendicular to the substrate 100, and the device to be packaged 2123 is located within the range enclosed by the inner edge of the edge package 104, but is not limited thereto.
  • the device to be packaged 2123 is located within the hollow structure 1040, but is not limited thereto.
  • the package film 1123 is located on the base substrate 100 and is configured to package the device to be packaged on the base substrate 100.
  • FIG. 10 illustrates a schematic diagram of an OLED display panel motherboard/package structure provided in accordance with one or some embodiments of the present disclosure, and two display panels are illustrated in FIG. 10, which may be formed by dicing to form a single OLED display panel.
  • the edge package 104 is also included in the OLED display panel.
  • FIG. 11 A cross-sectional view at PQ in Fig. 10 is shown in Fig. 11.
  • the display panel/package structure does not need to be provided with a barrier, which saves the process and facilitates the leveling of the edge package 104 during fabrication.
  • Cutting separation can be performed in the laser cutting process.
  • the width of the edge can be increased regardless of the width of the print.
  • FIG. 12 A cross-sectional view at the UV and XY in Fig. 10 is shown in Fig. 12. Compared with FIG. 9, the blocking portion 105 is not provided.
  • the outer edge of the edge package 104 is flush with the base substrate 100, and the outer edge of the edge package 104 can refer, for example, to the edge of the edge of the edge package 104 away from the hollow structure 1040, for example, It refers to an edge away from the display area or the middle area of the base substrate 100.
  • the edge package 104 has a first side FS near the hollow structure 1040 and a second side SS away from the hollow structure 1040, and the edge package 104 is located at the edge of the second side SS flush with the base substrate 100.
  • a flexible display product process flow can include the following steps.
  • fabricating a device to be packaged 2123 is performed on a base substrate 100.
  • the device to be packaged 2123 may be formed by a method such as evaporation or inkjet printing.
  • the base substrate may be a flexible base substrate.
  • the second step As shown in FIG. 13B, since the OLED device is afraid of water and oxygen attack, water and oxygen erosion easily causes the OLED to fail. Therefore, a TFE process is required to form the package film 1123.
  • the package film 1123 is described as a three-layer film as an example.
  • the first film 101, the second film 102, and the third film 103 can be referred to as described above.
  • a top protective film (TPF) 131 is attached to the package film 1123 by a filming process.
  • the upper protective film 131 is required to cover the entire base substrate 100.
  • the TPF 131 functions to protect the package film 1123 from damage during subsequent processes. At the same time, when the separation between the base substrate and the support substrate is performed, the substrate does not fall off the support substrate.
  • the base film 141 may be attached to the side of the separated base substrate 100 away from the device to be packaged 2123 for protection.
  • Step 6 As shown in Fig. 13F, the display panel mother board is cut and cut into a small display panel from a whole mother board.
  • the display panel mother board is cut and cut into a small display panel from a whole mother board.
  • four display panels are formed as an example for description.
  • Step 7 Subsequent module process.
  • the subsequent module process may include: removing the upper protective film on the display panel for subsequent processes.
  • Subsequent processes may include, for example, a filming process.
  • the method further includes the step of forming the edge package 104.
  • the edge package 104 may be formed after the encapsulation film 1123 is formed. Then, the step of attaching the protective film is performed.
  • the encapsulation film 1123 can be formed by IJP, screen printing, or edge coating.
  • At least one embodiment of the present disclosure provides a method for fabricating a display panel/package structure, including:
  • An edge package 104 is formed at the edge of the package film 1123.
  • the edge package 104 is a closed loop structure.
  • the edge package 104 material comprises an organic material.
  • FIGS. 7A-7B, 8-9, and 11-12 A method for fabricating a display panel/package structure according to an embodiment of the present disclosure, as shown in FIGS. 7A-7B, 8-9, and 11-12, at an edge position, perpendicular to the substrate 100 In the orientation, the edge package 104 and the second film 102 have overlapping portions.
  • a method for fabricating a display panel/package structure according to an embodiment of the present disclosure may further include forming a blocking portion 105 disposed on a side of the edge package 104 away from the package film 1123 In order to facilitate the fabrication of the edge package 104.
  • the blocking portion 105 may be formed in the same layer as at least one of the flat layer 117, the pixel defining layer 118, or the thick support layer when the OLED display panel is fabricated to reduce the manufacturing process.
  • the edge package 104 is located on the periphery of the device to be packaged 2123.
  • the package film 1123 includes a first film 101, a second film 102, and a third film which are sequentially away from the substrate 100.
  • the second film 102 is sandwiched between the first film 101 and the third film 103, and at the edge position, the first film 101 and the third film 103 are in contact, and the edge package 104 covers at least the first film 101 and the first film
  • the laminated contact portion of the three films 103 for example, the first film 101 and the third film 103 are inorganic films, and the second film 102 is an organic film.
  • FIG. 15 is a schematic diagram of a method of fabricating a display panel/package structure according to an embodiment of the present disclosure. Compared to the fabrication method of Figures 13A-13F, the steps of making the edge package are increased.
  • At least one embodiment of the present disclosure provides an LED display panel including any of the above package structures.
  • the LED display panel can be a flexible panel.
  • the package film includes a three-layer film as an example, but the package film may also be other structures, for example, may further include more film layers, for example, on the substrate substrate and the first film.
  • a fourth film and a fifth film may be formed, the fourth film being closer to the substrate than the fifth film, the fourth film may be an inorganic film, and the fifth film may be an organic film.
  • the number of layers of the film included in the encapsulating film is not limited to the above description.
  • the encapsulating film may be a structure in which a plurality of organic thin films and inorganic thin films are alternately laminated.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/CN2018/074236 2017-07-24 2018-01-26 封装结构、显示面板及其制作方法 Ceased WO2019019580A1 (zh)

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KR1020187033433A KR102105509B1 (ko) 2017-07-24 2018-01-26 캡슐화 구조체, 디스플레이 패널 및 그 제조 방법
US16/085,421 US11233217B2 (en) 2017-07-24 2018-01-26 Encapsulation structure, display panel and manufacturing method thereof each having edge encapsulation member on edge of encapsulation film
JP2018549471A JP7176954B2 (ja) 2017-07-24 2018-01-26 封入構造、表示パネル及びその作成方法
US17/132,208 US11527589B2 (en) 2017-07-24 2020-12-23 Encapsulation structure, display panel and manufacturing method thereof each having edge encapsulation member on edge of encapsulation film

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EP3660938A4 (de) 2021-04-07
US11233217B2 (en) 2022-01-25
KR102105509B1 (ko) 2020-04-29
CN109301079A (zh) 2019-02-01
JP7176954B2 (ja) 2022-11-22
EP3660938A1 (de) 2020-06-03
EP3660938B1 (de) 2024-03-06

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