WO2019021609A1 - Procédé de fabrication de module de caméra et dispositif de fabrication de module de caméra - Google Patents

Procédé de fabrication de module de caméra et dispositif de fabrication de module de caméra Download PDF

Info

Publication number
WO2019021609A1
WO2019021609A1 PCT/JP2018/019957 JP2018019957W WO2019021609A1 WO 2019021609 A1 WO2019021609 A1 WO 2019021609A1 JP 2018019957 W JP2018019957 W JP 2018019957W WO 2019021609 A1 WO2019021609 A1 WO 2019021609A1
Authority
WO
WIPO (PCT)
Prior art keywords
lens
image
side lens
image plane
camera module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/019957
Other languages
English (en)
Japanese (ja)
Inventor
成植 原
章吾 広岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of WO2019021609A1 publication Critical patent/WO2019021609A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/02Bodies

Definitions

  • the present invention relates to a camera module manufacturing method and a camera module manufacturing apparatus in which an image plane side lens (LOC, Lens On Chip) is mounted on an imaging device.
  • LOC Lens On Chip
  • the present invention has been made in view of the above problems, and an object thereof is to provide a camera module manufacturing method and a camera module manufacturing apparatus capable of adjusting the position of the image plane side lens with higher accuracy.
  • an object side group lens having an optical characteristic as a reference is fixed to a through hole formed by an inner circumferential surface.
  • a camera module manufacturing apparatus is a cylinder in which an object-side group lens having an optical characteristic as a reference is fixed to a through hole formed by an inner circumferential surface.
  • a fixing mechanism configured to fix the image plane side lens whose attitude has been adjusted to the image pickup element after the suction is completed.
  • the present invention it is possible to provide a camera module manufacturing method and a camera module manufacturing apparatus capable of adjusting the position of the image plane side lens with higher accuracy.
  • FIG. 1 An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 An embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is a schematic view of a camera module manufacturing apparatus 1 according to the embodiment.
  • the camera module manufacturing apparatus 1 includes a collet 2, a sample body 6, an adjustment mechanism 8, a fixing mechanism 9, a suction mechanism 12, and a display device 13.
  • the collet 2 is a cylindrical collet in which an object-side group lens 3 having an optical characteristic as a reference is fixed to a through hole 7 formed by the inner peripheral surface thereof.
  • the image plane side lens 4 is held on the lower end surface 14 of the collet 2 by suction by interlocking the suction holes 10 and the suction mechanism 12.
  • the collet 2 is mounted on the imaging device 5 in a state where the image plane side lens 4 is held on the lower end surface 14 by suction.
  • the shape of the collet 2 is not particularly limited to a cylindrical shape, and may be appropriately designed in accordance with the shapes of the object side group lens 3 and the image side lens 4.
  • the object side group lens 3 and the image plane side lens 4 are not particularly limited, and may be, for example, conventional object side group lenses and image plane side lenses.
  • the object-side group lens 3 includes five to six lenses, and has an optical role of condensing and diverging light traveling from the sample body 6 to the imaging device 5.
  • the image plane side lens 4 has a role of correcting the light condensed and diverged by the object side group lens 3.
  • the object side group lens 3 is fixed to the through hole 7 by suction by interlocking the suction hole 11 and the suction mechanism 12.
  • the fixing method of the object side group lens 3 is not limited to adsorption
  • attaching and fixing with an adhesive agent, etc. may be selected suitably.
  • suction mechanism 12 is not particularly limited, and for example, an existing suction mechanism may be used.
  • the sample body 6 will be described with reference to FIG. As shown in FIG. 1, the sample body 6 is disposed on the upper side of the object side group lens 3.
  • the sample body 6 shows a test pattern displayed on an image captured by the imaging device 5 in order to perform active alignment (AA, Active Alignment) of the image plane side lens 4.
  • AA Active Alignment
  • the sample body 6 be arranged on the collet 2. According to such a configuration, the sample body 6 can be disposed at an appropriate distance from the object side group lens 3 and the image plane side lens 4.
  • the adjustment mechanism 8 adjusts the attitude of the image plane side lens 4 based on the image of the sample body 6 captured through the object side group lens 3 and the image plane side lens 4 by an image sensor 5 described later. It is a mechanism. Here, it is desirable that the adjustment of the attitude of the image plane side lens 4 be performed while confirming the display device 13. Conventionally, a technique of adjusting the optical axis of the lens based on the image of the sample body 6 captured by the imaging device 5, that is, active alignment (AA, Active alignment) is known. Therefore, the adjustment mechanism 8 in the present embodiment is also a mechanism that can exhibit the above function.
  • AA Active alignment
  • the inclination, height, and rotation angle of the image plane side lens 4 can be mentioned.
  • the camera module manufacturing apparatus 1 capable of adjusting the position of the image plane side lens 4 with higher accuracy can be provided.
  • the fixing mechanism 9 is a mechanism for fixing the image plane side lens 4 whose attitude has been adjusted by the adjusting mechanism 8 to the imaging element 5.
  • a UV resin is applied to the image surface side lens 4 whose posture has been adjusted by the adjustment mechanism 8, and the UV resin is cured to fix the image surface side lens 4 to the imaging device 5. .
  • the fixing method of the image plane side lens 4 is not limited to curing and fixing the UV resin in the present embodiment, and for example, a known fixing method and the like can be appropriately selected.
  • the basic configuration of the camera module manufacturing apparatus 1 in the present embodiment has been described above. According to the above configuration, compared with the prior art, the optical position adjustment of the image plane side lens 4 with respect to the object side group lens 3 can be performed, and the rotation adjustment of the image plane side lens 4 in the surface of the imaging device 5 is also possible. . Therefore, it is possible to provide a camera module manufacturing apparatus capable of adjusting the position of the image plane side lens 4 with higher accuracy.
  • FIG. 2 is a flowchart of the camera module manufacturing method according to the embodiment.
  • step S1 the image plane side lens is attracted to the lower end surface 14 of the cylindrical collet 2 in which the object side group lens 3 having the optical characteristic as a reference is fixed to the through hole 7 formed by the inner peripheral surface. Hold four. Then, the image surface side lens 4 is mounted on the imaging element 5 in a state of being held by suction on the lower end surface 14 of the collet 2.
  • step S ⁇ b> 2 the imaging device 5 captures an image of the sample body 6 disposed above the object side group lens 3 through the object side group lens 3 and the image plane side lens 4.
  • step S3 based on the image of the sample body 6 captured in step S2, the adjustment mechanism 8 adjusts the posture of the image surface side lens 4 held by suction on the lower end surface 14.
  • the adjustment of the posture includes at least one adjustment of the tilt, the height, and the rotation angle of the image side lens 4.
  • step S4 the suction by the suction mechanism 12 is ended and the fixing mechanism 9 is fixed to the image sensor 5 on the image plane side lens 4 whose attitude has been adjusted in the step S3.
  • the fixing mechanism 9 preferably fixes the image plane side lens 4 to the imaging device 5 by curing the UV resin.
  • the optical position adjustment of the image plane side lens 4 with respect to the object side group lens 3 can not be performed and the rotation adjustment of the image plane side lens 4 in the surface of the imaging device 5 can not be performed.
  • a camera module is obtained. Therefore, it is possible to provide a camera module manufacturing method capable of adjusting the position of the image plane side lens 4 with higher accuracy.
  • the lower end surface 14 of the cylindrical collet 2 in which the object-side group lens 3 having the optical characteristic as a reference is fixed to the through hole 7 formed by the inner peripheral surface.
  • the posture of the image plane side lens held by suction on the lower end face based on the imaging process of imaging by the imaging device 5 through the image plane side lens 4 and the image of the sample body 6 imaged in the imaging process It includes an adjusting step of adjusting and a fixing step of fixing the image plane side lens 4 whose attitude has been adjusted by the adjusting step to the image pickup device 5 after the suction is finished.
  • active alignment of the image plane side lens can be performed using the object side group lens having the reference optical characteristic fixed to the through hole of the collet. Therefore, a camera module can be obtained which can solve the problem of the prior art that the optical position adjustment of the image plane side lens with respect to the object side group lens can not be performed and the rotation adjustment of the image plane side lens in the image sensor surface can not be adjusted. . Therefore, it is possible to provide a camera module manufacturing method capable of adjusting the position of the image plane side lens with higher accuracy.
  • the sample body 6 may be disposed on the collet 2.
  • the sample body can be disposed at a sufficient distance from the object side group lens.
  • the object side group lens may be fixed to the through hole by suction.
  • the object side group lens can be fixed to the through hole by the same suction mechanism as the image plane side lens, and the configuration of manufacturing the camera module can be simplified.
  • the image plane side lens 4 may be fixed to the imaging element 5 by curing a UV resin.
  • the image plane side lens can be fixed to the imaging device with a simple configuration.
  • the posture of the image surface side lens 4 includes at least one of an inclination, a height, and a rotation angle of the image surface side lens 4.
  • the optical position adjustment of the image plane side lens with respect to the object side group lens can be performed, and the rotation adjustment of the image plane side lens in the image pickup device surface can also be performed.
  • the camera module manufacturing apparatus 1 is a cylindrical collet in which an object-side group lens having an optical characteristic serving as a reference is fixed to the through hole 7 formed by the inner circumferential surface, A collet 2 mounted on an image pickup device 5 with an image plane side lens 4 held by suction on the lower end face, a sample body 6 disposed above the object side group lens 3, and the object by the image pickup device 5
  • An adjusting mechanism 8 for adjusting the posture of the image surface lens 4 held by suction on the lower end surface based on the image of the sample body 6 captured through the side group lens 3 and the image surface lens 4;
  • a fixing mechanism 9 is provided which fixes the suction on the image plane side lens 4 whose posture has been adjusted by the mechanism 8 and fixes the image pickup side lens 4 to the image pickup device 5.
  • the optical position adjustment of the image plane side lens with respect to the object side group lens can be performed, and the rotation adjustment of the image plane side lens in the image sensor surface can also be performed. Therefore, it is possible to provide a camera module manufacturing apparatus capable of adjusting the position of the image plane side lens with higher accuracy.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)

Abstract

Grâce à la présente invention, la position d'une lentille côté surface d'image est réglée avec une précision plus élevée. Dans le procédé de fabrication d'un module de caméra selon la présente invention, une lentille côté surface d'image (4) retenue par aspiration sur une surface d'extrémité inférieure (14) d'une virole (2) dans laquelle une lentille de groupe côté objet (3) est fixée dans un trou traversant (7) est montée sur un élément d'imagerie (5), l'orientation de la lentille côté surface d'image (4) est réglée sur la base d'une image d'un corps d'échantillon (6) imagé par un élément d'imagerie (5), et la lentille côté surface d'image (4) est fixée à l'élément d'imagerie (5).
PCT/JP2018/019957 2017-07-28 2018-05-24 Procédé de fabrication de module de caméra et dispositif de fabrication de module de caméra Ceased WO2019021609A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017147086 2017-07-28
JP2017-147086 2017-07-28

Publications (1)

Publication Number Publication Date
WO2019021609A1 true WO2019021609A1 (fr) 2019-01-31

Family

ID=65039535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/019957 Ceased WO2019021609A1 (fr) 2017-07-28 2018-05-24 Procédé de fabrication de module de caméra et dispositif de fabrication de module de caméra

Country Status (1)

Country Link
WO (1) WO2019021609A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9318119B2 (en) 2005-09-02 2016-04-19 Nec Corporation Noise suppression using integrated frequency-domain signals

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09322075A (ja) * 1996-05-29 1997-12-12 Sony Corp レンズマウント装置
JP2005057261A (ja) * 2003-07-24 2005-03-03 Matsushita Electric Ind Co Ltd レンズ一体型撮像装置、その製造方法及び製造装置
JP2005316472A (ja) * 2004-04-26 2005-11-10 Samsung Electronics Co Ltd 自動で整列されるレンズを含むイメージセンサーモジュール及びその製造方法、並びにレンズの自動焦点調節方法
JP2014126726A (ja) * 2012-12-27 2014-07-07 Sharp Corp フォーカス調整装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09322075A (ja) * 1996-05-29 1997-12-12 Sony Corp レンズマウント装置
JP2005057261A (ja) * 2003-07-24 2005-03-03 Matsushita Electric Ind Co Ltd レンズ一体型撮像装置、その製造方法及び製造装置
JP2005316472A (ja) * 2004-04-26 2005-11-10 Samsung Electronics Co Ltd 自動で整列されるレンズを含むイメージセンサーモジュール及びその製造方法、並びにレンズの自動焦点調節方法
JP2014126726A (ja) * 2012-12-27 2014-07-07 Sharp Corp フォーカス調整装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9318119B2 (en) 2005-09-02 2016-04-19 Nec Corporation Noise suppression using integrated frequency-domain signals

Similar Documents

Publication Publication Date Title
US10154184B2 (en) Camera module and method for the production thereof
US9906695B2 (en) Manufacturing method of imaging module and imaging module manufacturing apparatus
JP6509157B2 (ja) レンズ素子搬送機構、光学モジュール製造設備
US20160323486A1 (en) Imaging module, manufacturing method of imaging module, and electronic device
US20160139357A1 (en) Imaging module and electronic device
WO2019021609A1 (fr) Procédé de fabrication de module de caméra et dispositif de fabrication de module de caméra
US9979868B2 (en) Image pickup module manufacturing method, and image pickup module manufacturing device
US20160134795A1 (en) Imaging module and electronic device
US10798304B2 (en) Optical unit with shake correction function including center-of-gravity position adjusting member and method for fixing center-of-gravity position adjusting member
KR20100121230A (ko) 촬상 소자 위치 세팅 방법
US10015401B2 (en) Imaging module, manufacturing method of imaging module, and electronic device
JP6147096B2 (ja) 撮像装置
JP6702787B2 (ja) 撮像装置
JP6448198B2 (ja) 電子装置および光学機器
JP5772409B2 (ja) 撮像装置及び撮像装置の製造方法
JP2012138664A (ja) 撮像装置
JP2010206838A (ja) 撮像装置及び電子機器
CN115016194B (zh) 光学单元
US20160118435A1 (en) Image pickup module manufacturing method, and image pickup module manufacturing device
JP2013037214A (ja) 撮像装置及びステレオカメラ
JP4604729B2 (ja) 撮像装置および電子機器
JP5532934B2 (ja) 撮像素子ユニット、レンズ鏡筒
JP2007116740A (ja) カメラモジュール及び電子機器
JP2006279353A (ja) 固体撮像装置、これを備えた電子機器及び固体撮像装置の製造方法
CN113899532A (zh) 一种光学模组的光轴校准装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18838493

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18838493

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP