WO2019114441A1 - 扁平线缆及扁平线缆的制造方法 - Google Patents

扁平线缆及扁平线缆的制造方法 Download PDF

Info

Publication number
WO2019114441A1
WO2019114441A1 PCT/CN2018/112611 CN2018112611W WO2019114441A1 WO 2019114441 A1 WO2019114441 A1 WO 2019114441A1 CN 2018112611 W CN2018112611 W CN 2018112611W WO 2019114441 A1 WO2019114441 A1 WO 2019114441A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive member
flat cable
cover layer
metal conductive
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2018/112611
Other languages
English (en)
French (fr)
Inventor
张�杰
李腾飞
李扬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bozhou Lanto Electronic Ltd
Original Assignee
Bozhou Lanto Electronic Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bozhou Lanto Electronic Ltd filed Critical Bozhou Lanto Electronic Ltd
Priority to EP18887761.7A priority Critical patent/EP3726539A4/en
Priority to US16/954,431 priority patent/US20210090759A1/en
Priority to KR1020207020551A priority patent/KR20200098647A/ko
Priority to JP2020552080A priority patent/JP6974628B2/ja
Publication of WO2019114441A1 publication Critical patent/WO2019114441A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0838—Parallel wires, sandwiched between two insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/02—Cables with twisted pairs or quads
    • H01B11/06—Cables with twisted pairs or quads with means for reducing effects of electromagnetic or electrostatic disturbances, e.g. screens
    • H01B11/10—Screens specially adapted for reducing interference from external sources
    • H01B11/1091—Screens specially adapted for reducing interference from external sources with screen grounding means, e.g. drain wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B11/00—Communication cables or conductors
    • H01B11/02—Cables with twisted pairs or quads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/06—Insulating conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/02—Disposition of insulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0807—Twin conductor or cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/18—Protection against damage caused by wear, mechanical force or pressure; Sheaths; Armouring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0861—Flat or ribbon cables comprising one or more screens

Definitions

  • the present disclosure relates to a method of manufacturing a flat cable and a flat cable.
  • the flat cable has the advantages of small footprint, warpage, etc., and is widely used for signal transmission in a variety of electronic devices.
  • the conventional flat cable includes a plurality of conductors arranged at right and left intervals, insulation covering the upper and lower surfaces of the conductor, and covering.
  • the conductive shielding layer on the outer side of the insulating body however, in the signal transmission process, especially in the process of high-frequency signal transmission, the flat cable is extremely susceptible to interference from external electromagnetic signals, and thus the structure inside the flat cable needs to be improved.
  • the present disclosure provides a flat cable having an improved grounding effect and a signal shielding function, and a method of manufacturing the flat cable.
  • the present disclosure provides a flat cable comprising: a plurality of pairs of differential signal conductors, a ground conductor, an insulating sheath, a cover layer, and a metal conductive member; each adjacent pair of the differential signal conductors is disposed between The grounding conductor; the insulating sheath is wrapped on an outer side of the plurality of pairs of differential signal conductors and the grounding conductor; the covering layer covers an outer side of the insulating sheath; the insulating sheath is provided with an opening, The grounding conductor is in communication with the opening and the area of the opening is larger than an area of the grounding conductor; at least a portion of the metal conductive member is received in the opening and is in electrical contact with the grounding conductor.
  • the present disclosure further provides a method of manufacturing a flat cable, comprising: providing a plurality of pairs of differential signal conductors, a ground conductor, and an insulation, and placing the pair between each adjacent pair of the differential signal conductors Grounding a conductor, and wrapping the insulation on the outer side of the pair of differential signal conductors and the ground conductor; removing part of the insulation to form an opening, and connecting the ground conductor to the opening
  • the area of the opening is larger than the area of the grounding conductor;
  • a metal conductive member is provided, and at least a portion of the metal conductive member is received in the opening and electrically in contact with the grounding conductor;
  • a cover layer is provided, and The cover layer is coated on the outer side of the insulating sheath and the metal conductive member.
  • FIG. 1 is a schematic cross-sectional view of a flat cable according to an embodiment of the present disclosure
  • FIG. 2 is a schematic cross-sectional view of another flat cable according to an embodiment of the present disclosure.
  • FIG. 3 is a flowchart of a method for manufacturing a flat cable according to an embodiment of the present disclosure
  • FIG. 4 is a schematic cross-sectional view of a flat cable according to an embodiment of the present disclosure.
  • the first flat cable 100 provided by the present disclosure includes a plurality of pairs of differential signal conductors 11 , a ground conductor 12 between each adjacent pair of differential signal conductors 11 , and a differential signal conductor.
  • 11 is an insulating skin 20 on the outer side of the grounding conductor 12, a covering layer 30 covering the outside of the insulating sheath 20, and a metal conductive member 40 electrically connected to the grounding conductor 12.
  • the flat cable provided by the present disclosure has a plurality of grounding conductors electrically connected in series through a metal conductive member or a cover layer to form a common grounding path, which is beneficial to improving the grounding effect of the flat cable, and improving the signal shielding function and the high frequency. Signal transmission quality.
  • the metal conductive member 40 may be a metal sheet.
  • the insulating skin 20 is provided with an opening 21 at the position of the grounding conductor 12, and the grounding conductor 12 communicates with the opening 21 and the area of the opening 21 is larger than the area of the grounding conductor 12, that is, the grounding conductor 12 is exposed in the opening 21.
  • the cover layer 30 is provided as a conductive shielding layer or an insulating layer.
  • the cover layer 30 is made of a copper foil, an aluminum foil, a conductive cloth or a composite shielding material sandwiched with a conductive material.
  • the metallic conductive member 40 is soldered, welded, brushed, or baked to solidify on the ground conductor 12.
  • the metal conductive member 40 is of a unitary structure or a split structure.
  • the cover layer 30 is an insulating layer.
  • the number of the ground conductors 12 is two or more, and the metal conductive member 40 short-circuits at least two of the ground conductors 12 through the metal members 40.
  • the cover layer 30 is a conductive shield layer.
  • the metal conductive member 40 connects the cover layer 30 and the ground conductor 12 to electrically connect the cover layer 30 to the ground conductor 12.
  • the number of the ground conductors 12 is one or more.
  • At least a portion of the metal piece is located in the opening 21, soldered or welded to the ground conductor 12.
  • the metal piece is of a unitary structure, the plurality of grounding conductors 12 are electrically connected in series to form a common The grounding path is designed to enhance the grounding effect of the first flat cable 100. In the case where the grounding of the individual grounding conductors 12 is not stable, the grounding effect is not affected.
  • the metal piece When the cover layer 30 is a conductive shielding layer, the metal piece may be a one-piece structure or a split structure, the outer side of the metal piece is in electrical contact with the cover layer 30, and the cover layer 30 electrically connects the plurality of grounding conductors 12 in series.
  • the common grounding path can also be formed to cause the plurality of grounding conductors 12 to form a common grounding circuit with the cover layer 30.
  • the cover layer 30 can guide the noise of the first flat cable 100 to the ground by using the grounding, improving the first flat cable 100.
  • the signal shielding function is beneficial to improve the transmission quality of high-frequency signals.
  • the metal conductive member 40 may be a silver paste or a solder paste.
  • an embodiment of the present disclosure further provides a method for manufacturing a flat cable, as shown in FIG. 3, including:
  • Step 310 providing a plurality of pairs of differential signal conductors, a ground conductor, and an insulating sheath.
  • a ground conductor is disposed between each adjacent pair of differential signal conductors, and the insulating sheath is wrapped around the differential signal conductor and the ground conductor.
  • step 320 part of the insulation is removed to form an opening, and the ground conductor is connected to the opening and the area of the opening is larger than the area of the ground conductor, that is, the ground conductor is exposed in the opening.
  • Step 330 providing a metal conductive member, and accommodating at least a portion of the metal conductive member in the opening and electrically contacting the ground conductor.
  • Step 340 providing a cover layer and covering the outer cover of the insulating skin and the metal conductive member.
  • the flat cable is manufactured.
  • the metal conductive member 40 may be a metal sheet.
  • receiving at least a portion of the metal conductive member 40 in the opening 21 and electrically contacting the ground conductor 12 may include: soldering or welding at least a portion of the metal conductive member 40 to the bare ground conductor 12
  • the welding method uses tin welding or laser welding.
  • the metallic conductive member 40 is soldered, welded, brushed, or baked to solidify on the ground conductor 12.
  • the metal conductive member 40 is of a unitary structure or a split structure.
  • the cover layer 30 is an insulating layer or a conductive shielding layer.
  • the number of the ground conductors 12 is at least two, and at least two ground conductors 12 are short-circuited together by the metal conductive members 40.
  • the cover layer 30 is a conductive shielding layer, the cover layer 30 is in electrical contact with the metal conductive member 40.
  • the number of the ground conductors 12 is at least one, and at least one grounding conductor 12 is electrically connected to the cover layer 30.
  • the conductive shielding layer is a copper foil, an aluminum foil, a conductive cloth or a composite shielding material sandwiched with a conductive material.
  • the manner in which a portion of the insulation 20 is removed includes: laser, die cutting, or drilling of a film material.
  • the second flat cable 200 and the first flat cable 100 of the above embodiment is that the silver paste or the solder paste 50 is used to replace the metal sheet, and the silver paste or solder paste 50 is painted or baked and solidified on the ground conductor 12.
  • the cover layer 30 is covered on the outside of the silver paste or solder paste 50, and the plurality of ground conductors 12 are electrically connected in series by the silver paste or the solder paste 50 or the cover layer 30 to form a common ground path.
  • the metal conductive member 40 may include a metal piece, a silver paste or a solder paste 50.
  • the metal conductive member 40 is electrically connected to the ground conductor 12, and the metal conductive member 40 itself or the cover layer 30 is used.
  • the plurality of grounding conductors 12 are electrically connected in series to form a common grounding path, which is beneficial to improve the grounding effect of the first flat cable 100 or the second flat cable 200.
  • the covering layer 30 is a conductive shielding layer
  • the covering layer The noise of the first flat cable 100 or the second flat cable 200 can be derived by using the grounding to improve the signal shielding function of the first flat cable 100 or the second flat cable 200, which is beneficial to improving high-frequency signal transmission. quality.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Insulated Conductors (AREA)

Abstract

扁平线缆及其制造方法，扁平线缆（100）包括多对差分信号导体（11）、接地导体（12）、绝缘皮（20）、覆盖层（30）及金属导电件（40）；每相邻两对差分信号导体（11）之间设置接地导体（12）；绝缘皮（20）包裹在差分信号导体（11）与接地导体（12）的外侧；覆盖层（30）覆盖在绝缘皮（20）的外侧；绝缘皮（20）设有开孔（21），接地导体（12）与开孔（21）连通且开孔（21）的面积大于接地导体（12）的面积；金属导电件（40）的至少一部分收容于开孔（21）并与接地导体（12）电性接触。扁平线缆各接地导体通过金属导电件或覆盖层电性串联在一起，形成共同的接地路径，有利于改善扁平线缆的接地效果，提高信号屏蔽功能，提升高频信号传输品质。

Description

扁平线缆及扁平线缆的制造方法
本申请要求在2017年12月16日提交中国专利局、申请号为201711356575.7的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本公开涉及一种扁平线缆及扁平线缆的制造方法。
背景技术
扁平线缆具有占用空间小、可翘曲等优点，广泛应用于多种电子设备内进行信号传输，常规的扁平线缆包括左右间隔排列的多个导体、包裹在导体上下表面的绝缘皮及覆盖在绝缘皮外侧的导电屏蔽层，然而在信号传输过程中，尤其是在高频信号传输过程中，扁平线缆极易受外界电磁信号的干扰，因而需改善扁平线缆内部的结构。
发明内容
本公开提供了一种具有改善接地效果与信号屏蔽功能的扁平线缆以及该扁平线缆的制造方法。
在一实施例中，本公开提供一种扁平线缆，包括：多对差分信号导体、接地导体、绝缘皮、覆盖层以及金属导电件；每相邻两对所述差分信号导体之间设置有所述接地导体；所述绝缘皮包裹在所述多对差分信号导体与所述接地导体的外侧；所述覆盖层覆盖在所述绝缘皮的外侧；所述绝缘皮设有开孔，所述接地导体与所述开孔连通且所述开孔的面积大于所述接地导体的面积；所述金属导电件的至少一部分收容于所述开孔并与所述接地导体电性接触。
在一实施例中，本公开还提供一种扁平线缆的制造方法，包括：提供多对差分信号导体、接地导体以及绝缘皮，在每相邻两对所述差分信号导体之间设置所述接 地导体，并将所述绝缘皮包裹在所述多对差分信号导体与所述接地导体的外侧；去除部分所述绝缘皮以形成开孔，使所述接地导体与所述开孔连通且所述开孔的面积大于所述接地导体的面积；提供金属导电件，并将所述金属导电件的至少一部分收容于所述开孔内并与所述接地导体电性接触；提供覆盖层，并将所述覆盖层包覆在所述绝缘皮和所述金属导电件的外侧。
附图说明
图1为本公开实施例提供的一种扁平线缆的截面示意图；
图2为本公开实施例提供的另一种扁平线缆的截面示意图；
图3为本公开实施例提供的一种扁平线缆的制造方法的流程图；
图4为本公开实施例提供的还一种扁平线缆的截面示意图。
附图标记：差分信号导体-11；接地导体-12；绝缘皮-20；开孔-21；覆盖层-30；金属导电件-40；银浆或锡膏-50；第一扁平线缆-100；第二扁平线缆-200。
具体实施方式
图1为本公开实施例提供的一种扁平线缆的截面示意图，图2为本公开实施例提供的另一种扁平线缆的截面示意图，在图2中未显示导电屏蔽层与金属片。请参阅图1至图2所示，本公开提供的第一扁平线缆100包括多对差分信号导体11、位于每相邻两对差分信号导体11之间的接地导体12、包裹在差分信号导体11与接地导体12外侧的绝缘皮20、覆盖在绝缘皮20外侧的覆盖层30以及与接地导体12电性接触连接的金属导电件40。
本公开提供的扁平线缆，多个接地导体通过金属导电件或覆盖层电性串联在一起，形成共同的接地路径，有利于改善扁平线缆的接地效果，同时提高信号屏蔽功能，提升高频信号传输品质。
在一实施例中，金属导电件40可以为金属片。
绝缘皮20在接地导体12位置处设置有开孔21，接地导体12与开孔21连通且开孔21的面积大于接地导体12的面积，即，接地导体12裸露于开孔21内。
覆盖层30设置为导电屏蔽层或绝缘层，当覆盖层30为导电屏蔽层时，覆盖层30采用铜箔、铝箔、导电布或夹层有导电材料的复合式屏蔽材料。
在一实施例中，金属导电件40焊接、熔接、涂刷或烘烤凝固于接地导体12上。
在一实施例中，金属导电件40为一体式结构或分体式结构。
在一实施例中，覆盖层30为绝缘层。当覆盖层30为绝缘层时，接地导体12的数量为2个或2个以上，金属导电件40将至少两个接地导体12通过金属导电件40短路在一起。
在一实施例中，覆盖层30为导电屏蔽层。当覆盖层为导电屏蔽层时，金属导电件40连接覆盖层30与接地导体12，使覆盖层30与接地导体12电性连接，此时，接地导体12的数量为1个或1个以上。
在一实施例中，金属片的至少一部分位于开孔21内，焊接或熔接于接地导体12上，当金属片为一体式结构时，则将多个接地导体12电性串联在一起，形成共同的接地路径，如此设计，有利于加强第一扁平线缆100的接地效果，在个别接地导体12接地不太稳定的情形下，接地效果也不受影响。
当覆盖层30为导电屏蔽层时，金属片可以是一体式结构或分体式结构，金属片的外侧面与覆盖层30电性接触，覆盖层30将多个接地导体12电性串联在一起，同样可以形成共同的接地路径，促使多个接地导体12与覆盖层30形成共同的接地回路，覆盖层30能够将第一扁平线缆100的杂讯利用接地导出，改善第一扁平线缆100的信号屏蔽功能，有利于提升高频信号传输品质。
在一实施例中，金属导电件40可以为银浆或锡膏。在一实施例中，本公开实施例还提供了一种扁平线缆的制造方法，如图3所示，包括：
步骤310，提供多对差分信号导体、接地导体以及绝缘皮，在每相邻两对差分信号导体之间设置接地导体，并将绝缘皮包裹在差分信号导体与接地导体的外侧。
步骤320，去除部分绝缘皮以形成开孔，使接地导体与开孔连通且开孔的面积大于接地导体的面积，即，使接地导体裸露在开孔内。
步骤330，提供金属导电件，并将金属导电件的至少一部分收容于开孔内并与接地导体电性接触。
步骤340，提供覆盖层，并将覆盖层包覆盖在绝缘皮和金属导电件的外侧。
在实现上述步骤后，扁平线缆制造完成。
在一实施例中，金属导电件40可以为金属片。
在一实施例中，将金属导电件40的至少一部分收容于开孔21内并与接地导体12电性接触，可以包括：将金属导电件40的至少一部分焊接或熔接于上述裸露的接地导体12上，焊接方式采用加锡焊接或激光焊接等。
在一实施例中，金属导电件40焊接、熔接、涂刷或烘烤凝固于接地导体12上。在一实施例中，金属导电件40为一体式结构或分体式结构。
在一实施例中，覆盖层30为绝缘层或导电屏蔽层。当覆盖层30为绝缘层时，接地导体12的数量为至少两个，至少两个接地导体12通过金属导电件40短路在一起。当覆盖层30为导电屏蔽层时，覆盖层30与金属导电件40电性接触，接地导体12的数量为至少一个，至少一个接地导体12与覆盖层30电性连接。
在一实施例中，导电屏蔽层为铜箔、铝箔、导电布或夹层有导电材料的复合式屏蔽材料。
在一实施例中，去除部分绝缘皮20的方式包括：镭射、冲切、或皮膜原材打孔等。
请参阅图4所示的本公开实施例提供的还一种扁平线缆的截面示意图。第二扁平线缆200与上述实施方式的第一扁平线缆100的区别在于：利用银浆或锡膏50取代金属片，银浆或锡膏50涂刷或烘烤凝固于接地导体12上，覆盖层30覆盖在银浆或锡膏50的外侧，多个接地导体12通过银浆或锡膏50或覆盖层30电性串联在一起，形成共同的接地路径。
综述所述，本公开实施例提供的金属导电件40可以包括金属片、银浆或锡膏50，金属导电件40与接地导体12电性接触连接，利用金属导电件40自身或覆盖层30将多个接地导体12的电性串联在一起，形成共同的接地路径，有利于改善第一扁平线缆100或第二扁平线缆200的接地效果，当覆盖层30为导电屏蔽层时，覆盖层30还能够将第一扁平线缆100或第二扁平线缆200的杂讯利用接地导出，改善第一扁平线缆100或第二扁平线缆200的信号屏蔽功能，有利于提升高频信号传输品质。

Claims (15)

  1. 一种扁平线缆，包括：多对差分信号导体、接地导体、绝缘皮、覆盖层以及金属导电件；
    每相邻两对所述差分信号导体之间设置有所述接地导体；
    所述绝缘皮包裹在所述多对差分信号导体与所述接地导体的外侧；
    所述覆盖层覆盖在所述绝缘皮的外侧；
    所述绝缘皮设有开孔，所述接地导体与所述开孔连通且所述开孔的面积大于所述接地导体的面积；所述金属导电件的至少一部分收容于所述开孔并与所述接地导体电性接触。
  2. 根据权利要求1所述的扁平线缆，其中，所述金属导电件为金属片、银浆或锡膏。
  3. 根据权利要求1或2所述的扁平线缆，其中，所述金属导电件焊接、熔接、涂刷或烘烤凝固于所述接地导体上。
  4. 根据权利要求1或2所述的扁平线缆，其中，所述金属导电件为一体式结构或分体式结构。
  5. 根据权利要求1或4所述的扁平线缆，其中，所述覆盖层为绝缘层；所述接地导体的数量为至少两个，所述至少两个接地导体通过所述金属导电件短路在一起。
  6. 根据权利要求1或4所述的扁平线缆，其中，所述覆盖层为导电屏蔽层，所述覆盖层与所述金属导电件电性接触；所述接地导体的数量为至少一个，所述至少一个接地导体与所述覆盖层电性连接。
  7. 根据权利要求6所述的扁平线缆，其中，所述导电屏蔽层为铜箔、铝箔、导电布或夹层含有导电材料的复合式屏蔽材料。
  8. 一种扁平线缆的制造方法，包括：
    提供多对差分信号导体、接地导体以及绝缘皮，在每相邻两对所述差分信号导体之间设置所述接地导体，并将所述绝缘皮包裹在所述多对差分信号导体与所述接地导体的外侧；
    去除部分所述绝缘皮以形成开孔，使所述接地导体与所述开孔连通且所述开孔的面积大于所述接地导体的面积；
    提供金属导电件，并将所述金属导电件的至少一部分收容于所述开孔内并与所述接地导体电性接触；
    提供覆盖层，并将所述覆盖层包覆在所述绝缘皮和所述金属导电件的外侧。
  9. 根据权利要求8所述的方法，其中，所述金属导电件为金属片、银浆或锡膏。
  10. 根据权利要求8或9所述的方法，其中，所述金属导电件焊接、熔接、涂刷或烘烤凝固于所述接地导体上。
  11. 根据权利要求8或9所述的方法，其中，所述金属导电件为一体式结构或分体式结构。
  12. 根据权利要求8或11所述的方法，其中，所述覆盖层为绝缘层；所述接地导体的数量为至少两个，所述至少两个接地导体通过所述金属导电件短路在一起。
  13. 根据权利要求8或11所述的方法，其中，所述覆盖层为导电屏蔽层，所述覆盖层与所述金属导电件电性接触；所述接地导体的数量为至少一个，所述至少一个接地导体与所述覆盖层电性连接。
  14. 根据权利要求13所述的方法，其中，所述导电屏蔽层为铜箔、铝箔、导电布或夹层有导电材料的复合式屏蔽材料。
  15. 根据权利要求8所述的方法，其中，所述去除部分所述绝缘皮的方式包括：镭射、冲切或皮膜原材打孔。
PCT/CN2018/112611 2017-12-16 2018-10-30 扁平线缆及扁平线缆的制造方法 Ceased WO2019114441A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP18887761.7A EP3726539A4 (en) 2017-12-16 2018-10-30 FLAT CABLE, AND FLAT CABLE MANUFACTURING METHOD
US16/954,431 US20210090759A1 (en) 2017-12-16 2018-10-30 Flat cable and method for manufacturing a flat cable
KR1020207020551A KR20200098647A (ko) 2017-12-16 2018-10-30 플랫 케이블 및 플랫 케이블 제조 방법
JP2020552080A JP6974628B2 (ja) 2017-12-16 2018-10-30 フラットケーブルおよびフラットケーブルの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201711356575.7 2017-12-16
CN201711356575.7A CN108109740A (zh) 2017-12-16 2017-12-16 扁平线缆及其制造方法

Publications (1)

Publication Number Publication Date
WO2019114441A1 true WO2019114441A1 (zh) 2019-06-20

Family

ID=62216506

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/112611 Ceased WO2019114441A1 (zh) 2017-12-16 2018-10-30 扁平线缆及扁平线缆的制造方法

Country Status (6)

Country Link
US (1) US20210090759A1 (zh)
EP (1) EP3726539A4 (zh)
JP (1) JP6974628B2 (zh)
KR (1) KR20200098647A (zh)
CN (1) CN108109740A (zh)
WO (1) WO2019114441A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115359965A (zh) * 2022-07-04 2022-11-18 任宏才 一种新型多点接地电缆、方法及系统
CN115777238A (zh) * 2020-07-16 2023-03-10 三菱电机株式会社 噪声抑制带

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108109740A (zh) * 2017-12-16 2018-06-01 亳州联滔电子有限公司 扁平线缆及其制造方法
CN111724930A (zh) * 2019-03-20 2020-09-29 海信视像科技股份有限公司 Ffc线缆和电子设备
CN111768898B (zh) * 2019-05-20 2021-08-31 上海熊猫电线有限公司 一种机器人超柔网格导体电缆及其生产方法
CN120496945B (zh) * 2025-05-13 2026-04-17 阳谷鑫辉电缆有限公司 矿用交联聚乙烯绝缘铠装自修复电缆及其制造方法
CN120496946A (zh) * 2025-07-17 2025-08-15 中航光电科技股份有限公司 具有多通道串扰抑制能力的柔性扁平线缆及其制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005008686A1 (de) * 2003-07-11 2005-01-27 W.L. Gore & Associates Gmbh Bandkabel
CN2922071Y (zh) * 2006-01-07 2007-07-11 达昌电子科技(苏州)有限公司 可挠式软性排线
CN103456393A (zh) * 2012-05-29 2013-12-18 东莞新兴盛端子制品有限公司 柔性扁平电缆及其制造方法
CN206322493U (zh) * 2016-12-20 2017-07-11 凡甲电子(苏州)有限公司 扁平线缆
CN108109740A (zh) * 2017-12-16 2018-06-01 亳州联滔电子有限公司 扁平线缆及其制造方法
CN207587418U (zh) * 2017-12-16 2018-07-06 亳州联滔电子有限公司 扁平线缆

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296651A (en) * 1993-02-09 1994-03-22 Hewlett-Packard Company Flexible circuit with ground plane
JP3564053B2 (ja) * 2000-10-06 2004-09-08 キヤノン株式会社 フレキシブルケーブル
JP2007193999A (ja) * 2006-01-17 2007-08-02 Sony Chemical & Information Device Corp 伝送ケーブル
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
EP2402959B1 (en) * 2009-03-30 2021-12-01 Panasonic Intellectual Property Management Co., Ltd. Flexible cable
JP5541122B2 (ja) * 2010-11-30 2014-07-09 山一電機株式会社 フレキシブル配線板
CN103514997A (zh) * 2013-10-09 2014-01-15 昆山联滔电子有限公司 扁平线缆
CN204143908U (zh) * 2014-08-15 2015-02-04 达昌电子科技(苏州)有限公司 软性扁平电缆结构

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005008686A1 (de) * 2003-07-11 2005-01-27 W.L. Gore & Associates Gmbh Bandkabel
CN2922071Y (zh) * 2006-01-07 2007-07-11 达昌电子科技(苏州)有限公司 可挠式软性排线
CN103456393A (zh) * 2012-05-29 2013-12-18 东莞新兴盛端子制品有限公司 柔性扁平电缆及其制造方法
CN206322493U (zh) * 2016-12-20 2017-07-11 凡甲电子(苏州)有限公司 扁平线缆
CN108109740A (zh) * 2017-12-16 2018-06-01 亳州联滔电子有限公司 扁平线缆及其制造方法
CN207587418U (zh) * 2017-12-16 2018-07-06 亳州联滔电子有限公司 扁平线缆

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3726539A4 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115777238A (zh) * 2020-07-16 2023-03-10 三菱电机株式会社 噪声抑制带
CN115359965A (zh) * 2022-07-04 2022-11-18 任宏才 一种新型多点接地电缆、方法及系统

Also Published As

Publication number Publication date
JP2021508409A (ja) 2021-03-04
EP3726539A4 (en) 2021-08-04
CN108109740A (zh) 2018-06-01
JP6974628B2 (ja) 2021-12-01
EP3726539A1 (en) 2020-10-21
KR20200098647A (ko) 2020-08-20
US20210090759A1 (en) 2021-03-25

Similar Documents

Publication Publication Date Title
WO2019114441A1 (zh) 扁平线缆及扁平线缆的制造方法
JP5589778B2 (ja) 差動信号伝送用ケーブルと回路基板の接続構造及び接続方法
US9414502B2 (en) Flat cable assembly and method of assembling the same
TWI433618B (zh) 堆疊式基板結構
TWI643334B (zh) 高頻信號傳輸結構及其製作方法
US20150235966A1 (en) Wiring board and semiconductor device using the same
TW201918125A (zh) 具有電磁波遮罩功能的電路板、電路板的製造方法及利用電路板的排線
JP2012064338A (ja) 同軸ケーブルの端末構造、コネクタ及び基板ユニット
JP2021508409A5 (zh)
US9713252B2 (en) Ceramic insulator for electronic packaging and method for fabricating the same
TW201603236A (zh) 電子元件之製造方法
TW201340261A (zh) 半導體裝置及其製造方法
US10490320B2 (en) Long straight high-frequency transmission cable
JP2011028903A (ja) ケーブル付コネクタ及びその製造方法
TWI608769B (zh) 柔性電路板及其製作方法
WO2017094836A1 (ja) シールドを有するモジュール
US9343840B2 (en) Interface connector
JP2008218225A (ja) 電子装置
JP2014183290A (ja) 差動信号伝送用ケーブルの接続構造およびケーブルコネクタアッセンブリ
CN207587418U (zh) 扁平线缆
JP2020149946A (ja) 電気コネクタ
JP6320629B2 (ja) 多極コネクタおよびコネクタ装置
JP5928242B2 (ja) 差動信号伝送用ケーブルおよびその回路基板への接続方法
TWM492554U (zh) 連接器之纜線內屏蔽層的接地結構
TWM473596U (zh) 撓性排線結構

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18887761

Country of ref document: EP

Kind code of ref document: A1

DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
ENP Entry into the national phase

Ref document number: 2020552080

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 20207020551

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2018887761

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2018887761

Country of ref document: EP

Effective date: 20200716