WO2019132320A1 - Composition adhésive thermofusible - Google Patents

Composition adhésive thermofusible Download PDF

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Publication number
WO2019132320A1
WO2019132320A1 PCT/KR2018/015624 KR2018015624W WO2019132320A1 WO 2019132320 A1 WO2019132320 A1 WO 2019132320A1 KR 2018015624 W KR2018015624 W KR 2018015624W WO 2019132320 A1 WO2019132320 A1 WO 2019132320A1
Authority
WO
WIPO (PCT)
Prior art keywords
styrene
adhesive composition
melt adhesive
hot
butadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2018/015624
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English (en)
Korean (ko)
Inventor
박용수
김태윤
이용만
류진영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020180156147A external-priority patent/KR102377516B1/ko
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Priority to EP18896293.0A priority Critical patent/EP3715434B1/fr
Priority to US16/957,832 priority patent/US20210062052A1/en
Priority to CN201880083866.XA priority patent/CN111527174B/zh
Publication of WO2019132320A1 publication Critical patent/WO2019132320A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/387—Block-copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02—Vinyl aromatic monomers and conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F297/00—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer
    • C08F297/02—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type
    • C08F297/04—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes
    • C08F297/044—Macromolecular compounds obtained by successively polymerising different monomer systems using a catalyst of the ionic or coordination type without deactivating the intermediate polymer using a catalyst of the anionic type polymerising vinyl aromatic monomers and conjugated dienes using a coupling agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a hot melt adhesive composition.
  • the hot-melt adhesive is a thermoplastic resin which is melted by heat and forms an adhesive surface accordingly. Unlike conventional UV curing adhesives, volatile solvents and the like are not used, Are preferred as environmentally friendly and functional adhesives because of their low emission.
  • the hot-melt adhesive is not only less expensive than the UV-curing adhesive but also is easy to apply and press on the substrate or the adhesive since it exists in a liquid state at a high temperature.
  • the adhesive is then cooled and solidified within a few seconds at room temperature, Therefore, it is easy to use.
  • the hot melt adhesive generally contains a thermoplastic polymer as a base resin and is generally added with a tackifier or a viscosity adjusting agent.
  • an olefin-based copolymer having excellent flexibility and low unit cost, an unsaturated aromatic copolymer, or an unsaturated aromatic elastic copolymer is widely used.
  • Such a hot melt adhesive is applied to the adhered surface in a molten state and then forms a hard phase having cohesiveness and creep resistance while being cooled. Therefore, it is possible to provide a hot melt adhesive for a diaper, a feminine hygiene article, Pressure sensitive adhesives are widely used in a variety of industrial fields such as electronic manufacturing and structural materials. 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • the hot melt adhesive contains a base resin and an additive and the like, there arises a problem that a phase separation and a bleeding phenomenon are generated due to compatibility and the like, resulting in a problem that the adhesive force is decreased, and the melt viscosity is high, A high temperature condition is required.
  • problems such as viscosity change, odor generation, discoloration may occur, and there is an increasing demand for a low viscosity product with a relatively low melting temperature.
  • the low-viscosity hot-melt adhesive capable of being subjected to low-temperature processing has a problem in that viscosity retention rate is lowered, problems are likely to occur in adhesive strength, and there is a problem that heat resistance such as softening point is low.
  • the present invention provides a hot-melt adhesive which is capable of melt-processing at a relatively low temperature to improve processability, but also has excellent adhesion and heat resistance and also has excellent mechanical properties after curing.
  • the present invention is a.
  • the die block content is at least 55% by weight
  • melt flow index measured according to standard 131 238 show at least 30 ⁇ 10 111111
  • a hot-melt adhesive composition is provided. Further, according to the present invention,
  • the hot-melt adhesive composition of the present invention maintains a low viscosity property so that it can be melt-processed at a relatively low temperature to improve the processability, but also has excellent adhesive strength and heat resistance, and has excellent mechanical properties after curing, It can be used in various industries.
  • a hot-melt adhesive composition according to one aspect of the present invention comprises:
  • the diblock content is at least 55% by weight
  • the hot melt adhesive composition has a melt viscosity at 120 ° C of about 5500 0? 8 , preferably about 5200 0? 8 , or about 4500 to about 520? 3 , and the viscosity change rate at this time may be about 10% or less.
  • the hot melt adhesive composition comprises: 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • a melt viscosity of about 800 0? 3 , preferably about 750 0? 8 , or about 650 to about 75? 3 , and the viscosity change rate at this time may be about 10% or less.
  • the hot melt adhesive composition may contain, When the specimen prepared according to the 0638 standard, the tensile strength values are about 0.35> 1 / _ 2 or more, preferably about 0.4 / _ 2 or more, more preferably about 0.5 to about 0.6 ⁇ _ 2 days.
  • the tackifier contained in the hot melt adhesive composition may include at least one of a rosin ester compound at least partially hydrogenated and a dicyclopentadiene-based polymerized petroleum resin at least partially hydrogenated.
  • the tackifier may include about 200 to about 400 parts by weight, about 250 to about 350 parts by weight, or about 270 to 330 parts by weight based on 100 parts by weight of the styrene-butadiene-styrene triblock copolymer .
  • the plastic oil may include petroleum-based mineral oil.
  • the plastic oil may be included in an amount of about 50 to about 150 parts by weight based on 100 parts by weight of the styrene-butadiene-styrene triblock copolymer. According to another aspect of the present invention,
  • the adhesive layer being formed on at least one side of the substrate and formed by the hot melt adhesive composition.
  • An adhesive member is provided.
  • the thickness of the adhesive layer is about 10 to about 100 [mu] m, preferably about
  • the adhesive member may have a peel strength value of 10 < 111 > or more, preferably about 10 to about 15, or about 10 to about 12 according to ASTM 01876 standard. 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • first, second, etc. are used to describe various components , and the terms are used only for the purpose of distinguishing one component from another.
  • each layer or element when referring to each layer or element being “on” or “on” each layer or element, it is meant that each layer or element is formed directly on each layer or element, Layer or element can be additionally formed between each layer, the object, and the substrate.
  • Attaching means that, in the course of producing a styrene-butadiene-styrene triblock copolymer by proceeding a coupling reaction with respect to the styrene-butadiene block copolymer, coupling is not carried out and stitane-butadiene diblock Quot; refers to the content of the copolymer remaining in the form of the copolymer.
  • the styrene-butadiene-styrene triblock copolymer described in the present specification may be a form in which only the styrene-butadiene-styrene triblock is contained, and the styrene-butadiene- Block, the diblock described above, and a mixture comprising unreacted monomers.
  • the content of diblock in the triblock copolymer is , And the molecular weight distribution of the copolymer was measured to determine the proportion by weight (100%) of the total weight of the styrene-butadiene dia block contained therein).
  • the present invention may be embodied in many different forms, 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • the heat resistance is excellent and the viscosity is relatively low
  • styrene-butadiene-styrene triblock copolymer is most preferable.
  • the styrene-butadiene-styrene triblock copolymer which is used in the hot melt adhesive composition according to one aspect of the present invention
  • the melt flow index measured according to ASTM £ 1238 standard is 30 ⁇ / 1 0111111 or more.
  • Styrene-based monomer has a glass transition temperature 0) higher than room temperature, 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • a hard segment unit having relatively hard properties is formed, and the butadiene monomer has a soft segment unit having a glass transition temperature lower than room temperature and having a relatively flexible property at the time of copolymerization Respectively.
  • the styrene-butadiene-styrene triblock copolymer may have a diblock content of 55 wt% or more, preferably about 60 wt% or more, and more preferably about 60 to about 65 wt%.
  • the styrene-butadiene-styrene triblock copolymer is advantageous in that physical properties such as viscosity can be easily controlled and no change in other physical properties occurs.
  • the styrene-butadiene-styrene triblock copolymer may be prepared by copolymerizing
  • the hot-co-styrene-butadiene-styrene triblock copolymer which is the base resin of the hot melt adhesive composition
  • the low temperature flowability of the hot melt adhesive composition is improved and the adhesive force and cohesive force So that excellent workability can be obtained even at a relatively low temperature.
  • the viscosity change rate at this time may be about 10% or less.
  • the melt viscosity may be about 5500 0? 3 ⁇ 4 , preferably about 5200 0? 8 or about 4500 to about 520 ( 8 days).
  • the hot-melt adhesive composition 160 ° (:?? In, the melt viscosity reducible 800 0 8 or less, preferably, about 750 0 less than or equal to 8, or from about 650 to about 75 ( ⁇ 3 And the viscosity change rate at this time may be about 10% or less.
  • the hot-melt adhesive composition according to an embodiment of the present invention has a relatively low viscosity, hardly changes in viscosity even after aging, can be melt-processed at a low temperature, In addition, it is possible to realize excellent characteristics of adhesion and heat resistance, as well as excellent mechanical properties after curing.
  • the hot melt adhesive composition according to an embodiment of the present invention is melted, When manufacturing cured specimens conforming to the 0638 standard, tensile strength values as described above may be obtained.
  • Such a tensile strength value is a physical property that can represent the durability and physical stability of an adhesive surface at the time of forming an adhesive surface by an adhesive.
  • the hot melt adhesive composition according to an embodiment of the present invention has a tensile strength value as described above , Excellent adhesion durability can be realized.
  • the tackifier contained in the hot-melt adhesive composition may further comprise, 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • rosin refers to abietic acid (Showa 301 (1), dehydroabietic acid in which hydrogen is removed from abietic acid is added), and dihydro, to which two or four hydrogens are added, or tetrahydro
  • the abietic acid and the dihydroabietic acid to which two hydrogen atoms are added are classified into various isomers depending on the position of the double bond. All of them are used as a concept.
  • dehydroabietic acid it can be represented by the following formula.
  • dehydroabietic acid in the abietic acid structure comprising two double bonds, removes two hydrogens and forms an aromatic ring, resulting in the most stable form of the above rosin compounds.
  • abietic acid which can be regarded as a basic form of the rosin-type compound, it can be represented by the following formula (2).
  • abietic acid is conjugated to two double bonds in a three-fold hierarchical compound and has a stable form, and by this conjugation double bond, a unique hue is expressed.
  • the position of the double bond can be easily changed, and thus, various isomers are obtained, and most of these isomers also have a conjugated double bond, resulting in a unique color.
  • dehydroabietic acid in the abietic acid structure containing two double bonds, removes two hydrogens and forms an aromatic ring, resulting in the most stable form of the rosin 5 compound.
  • abietic acid which can be regarded as a basic form of the rosin-type compound, it can be represented by the following formula.
  • the abietic acid in the triple ring compound, can have a stable form, with two double bonds being 10 conjugated.
  • Such double bonds can be easily varied in their positions and thus have various forms of isomers, most of which are also conjugated double bonds.
  • abietic acid in which four hydrogen atoms are added to abietic acid, hydrogen is added to all the double bonds to have a saturated aliphatic triple ring form, and accordingly, abietic acid Compared to derivatives, they have high stability and no color appearance.
  • the above-mentioned rosin ester compound is obtained by esterifying the carboxyl group of abietic acid with an alcohol or a 0-term of a polyol based on the above-described abietic acid or hydrogenated abietic acid structure
  • These alcohols or polyols are, for example, aliphatic alcohols having 1 to 20 carbon atoms, such as monoalcohols, diols, triols, 2 5 tetraols , Pentanol, and more specifically, for example, methanol, ethanol, glycerol, ethylene glycol, diethylene glycol, or pentaerythritol 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • the abietic acid may cause an esterification reaction with all or a portion of the hydroxyl groups of the polyol, and thus a polyvalent ester such as a monoester, diastere, ternary ester, or quaternary ester .
  • At least a part of the hydrogenated rosin ester compound includes at least one selected from the group consisting of the above-mentioned abietic acid, dihydroabietic acid, and tetrahydroabietic acid Or more.
  • the above-mentioned dicyclopentadiene-based polymerized petroleum resin is obtained by purifying crude oil 05, which is produced as a by-product in the naphtha cracking process, which decomposes at high temperature, i.e., 09 produced from cyclopentadiene oil fractions
  • the cyclopentadiene generated in the naphtha cracking process is usually dimerized and present as a dicyclopentadiene structure, and the cyclopentadiene and the dicycloheptadiene, which is an alicyclic dianhydride, are present in the diel-alder reaction and the retro- By reaction, interconversion is possible, and in particular, cyclopentadiene can be polymerized with dicyclopentadiene by thermal polymerization or catalytic polymerization.
  • the tackifier used in the present invention includes at least a part of hydrogenated dicyclopentadiene-based polymerized petroleum resin, it is preferable that at least a part of the dicyclopentadiene-based petroleum resin contained in the dicyclopentadiene- To some dicyclopentadiene hydrogen may be added to include both dicyclopentane and dicyclopentadiene.
  • the tackifier may include about 200 to about 400 parts by weight based on 100 parts by weight of the styrene-butadiene-styrene triblock copolymer.
  • the plastic oil contained in the hot melt adhesive composition may include petroleum-based mineral oil.
  • Mineral oil is a liquid by-product produced in refining crude oil to petroleum. It is also called liquid paraffin. It is based on n-alkane based paraffinic oil and cycloalkane. A naphthenic oil based on naphthenic oil, and an aromatic oil based on aromatic hydrocarbon. In the present invention, the petroleum-based mineral oil is a concept including both the above-mentioned oil and the modified oil.
  • the petroleum-based mineral oil is preferably a paraffinic oil, and may be a white oil modified by hydrotreating and / or dewaxing in the presence of a footwear, May be more preferable.
  • the paraffinic oil modified by the hydrogen treatment and / or the dewaxing treatment is a hydrogenated paraffinic distillate (CAS registration number 64742-54-7) or a hydrogenated paraffinic distillate
  • the hydrotreated light paraffinic distillate (CAS registration number 64742-55-8), the solvent-dewaxed heavy paraffinic distillate (CAS registration number 64742-65-0), the solvent- Solvent-dewaxed light paraffinic distillate (CAS registration number 64742-56-9), hydrotreated and dewaxed heavy paraffinic distillate (CAS registration number 91995-39-0), and a hydrotreated and dewaxed light paraffinic distillate (CAS registration number 91995-40-3).
  • the present invention is not necessarily But is not limited thereto.
  • the plastic oil may be included in an amount of about 50 to about 150 parts by weight, or about 70 to about 130 parts by weight, or about 90 to about 110 parts by weight based on 100 parts by weight of the styrene-butadiene-styrene triblock copolymer have.
  • the content of the firing oil is too small, the problem that the flowability and low-temperature processability are lowered 2019/132320 1 »(: 1 ⁇ 1 ⁇ 2018/015624
  • the hot melt adhesive composition according to an embodiment of the present invention may further include additives such as known light stabilizers, fillers, antioxidants, ultraviolet absorbers and the like, if necessary.
  • additives may be included in an amount of about 0.1 to about 10% by weight based on the total composition in view of preventing adhesion property, workability, and deterioration of mechanical properties after bonding. According to another aspect of the present invention,
  • the adhesive layer being formed on at least one side of the substrate and formed by the hot melt adhesive composition.
  • An adhesive member is provided.
  • the adhesive member may be in the form of a film or a tape, and the substrate may be a single layer or a film having a laminated structure of two or more layers.
  • the base material film may be a paper material, a glass material, or a nonwoven fabric material, but is preferably a plastic material.
  • the plastic material is not particularly limited, and examples thereof include polyethylene terephthalate, polyethylene naphthalate, Polyesters such as phthalate and polybutylene naphthalate; Polyolefins such as polyethylene, polypropylene and ethylene-propylene copolymer; Polyvinyl alcohol; Polyvinylidene chloride; Polyvinyl chloride; Vinyl chloride-vinyl acetate copolymer; Polyvinyl acetate; Polyamide; Polyimide; Cellulose such as triacetylcellulose, diacetylcellulose and the like; Fluorine resin; Polyethers; Polyether amide; Polyether ether ketone; Polyphenylene sulfide; Polystyrene resins such as polystyrene; Polycarbonate; Polyethersulfone; And acrylic resins such as polymethyl methacrylate
  • the plastic strength, handling property, cost, dimensional stability, optical properties Etc., polyester, cellulose, acrylic resin and the like may be preferably used.
  • the thickness of the adhesive layer may be about 10 to about 100 / panel, preferably about 30 to about 70 percent.
  • the adhesive member has a peel strength, T-peeling strength value of at least about 10 N / in, preferably about 10 to about 15 N / in, according to ASTM D1876, in, or from about 10 to about 12 N / in.
  • a peel strength, T-peeling strength value of at least about 10 N / in, preferably about 10 to about 15 N / in, according to ASTM D1876, in, or from about 10 to about 12 N / in.
  • the solution polymerization reaction was carried out while raising the temperature to about 130 ° C under a pressure of 5 kgf / cm 2 .
  • the reaction temperature reached 130 O C and after about 5 minutes, cooled to 60 O C, while keeping the temperature In the butadiene 700g, and again heated to 130 O C under about 5kgf / cm 2 pressure, the polymerization reaction Respectively.
  • Taipol 4270 (TSRC Corp.), a styrene-butadiene-styrene triblock copolymer, was prepared.
  • the styrene-butadiene-styrene triblock copolymer of the preparation example is summarized in Table 1 below.
  • the styrene-butadiene-styrene triblock copolymer prepared above was slowly added dropwise and stirred at a speed of 200 rpm for 4 hours to completely dissolve the styrene-butadiene-styrene triblock copolymer to prepare a hot melt adhesive composition .
  • composition of the hot melt adhesive composition is shown in Table 2 below.
  • the hot-melt adhesive composition was fully inserted into the ring and allowed to stand for 1 hour, and then the ball (diameter: 9.525 mm, weight: 3.5 g) was placed. The sample was heated while heating at a rate of 5 ° C / min, and the temperature at which the ball was squeezed 1 inch was measured. (Relevant standard: ASTM D36). Adhesive property measurement
  • the adhesive member prepared above was measured for adhesion by T-peel method using a Texture Analyzer (TA).
  • TA Texture Analyzer
  • the adhesive member samples were cut to a width of 1 inch and a length of 100 mm and measured at a room temperature of 0.3 m / min. (Related standard: ASTM D1876) Tensile strength measurement
  • the hot melt adhesive composition according to the embodiment of the present invention has a higher softening point and a lower viscosity property than the comparative example.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne une composition adhésive thermofusible. Avec la préservation d'une caractéristique de faible viscosité, la composition adhésive thermofusible de la présente invention peut être traitée à l'état fondu à des températures relativement basses et présente une aptitude au traitement améliorée. En outre, la composition est supérieure en termes de force adhésive et de résistance thermique et également en termes de propriétés mécaniques après durcissement, et peut ainsi être utilisée dans divers domaines industriels.
PCT/KR2018/015624 2017-12-27 2018-12-10 Composition adhésive thermofusible Ceased WO2019132320A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP18896293.0A EP3715434B1 (fr) 2017-12-27 2018-12-10 Composition adhésive thermofusible
US16/957,832 US20210062052A1 (en) 2017-12-27 2018-12-10 Hot-Melt Adhesive Composition
CN201880083866.XA CN111527174B (zh) 2017-12-27 2018-12-10 热熔粘合剂组合物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20170181534 2017-12-27
KR10-2017-0181534 2017-12-27
KR1020180156147A KR102377516B1 (ko) 2017-12-27 2018-12-06 핫 멜트 접착제 조성물
KR10-2018-0156147 2018-12-06

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Citations (5)

* Cited by examiner, † Cited by third party
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KR101025778B1 (ko) * 2011-01-12 2011-04-04 (주)베이스코리아 저점도 용제형 접착제 조성물 및 그 제조방법
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