WO2019161970A1 - Dispositif, en particulier bloc d'alimentation à découpage - Google Patents

Dispositif, en particulier bloc d'alimentation à découpage Download PDF

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Publication number
WO2019161970A1
WO2019161970A1 PCT/EP2019/025034 EP2019025034W WO2019161970A1 WO 2019161970 A1 WO2019161970 A1 WO 2019161970A1 EP 2019025034 W EP2019025034 W EP 2019025034W WO 2019161970 A1 WO2019161970 A1 WO 2019161970A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
layers
connection
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/025034
Other languages
German (de)
English (en)
Inventor
Klaus Marahrens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEW Eurodrive GmbH and Co KG
Original Assignee
SEW Eurodrive GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEW Eurodrive GmbH and Co KG filed Critical SEW Eurodrive GmbH and Co KG
Priority to EP19704190.8A priority Critical patent/EP3756425A1/fr
Publication of WO2019161970A1 publication Critical patent/WO2019161970A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores
    • H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
    • H01F27/263—Fastening parts of the core together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0262—Arrangements for regulating voltages or for using plural voltages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H01F2027/2819—Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB

Definitions

  • the invention relates to a device, in particular switching power supply.
  • the invention is therefore the object of developing a switching power supply compact and high performance.
  • the device in particular switching power supply, a first circuit board and a second circuit board and a first component, in particular transistor, wherein the first circuit board with the second circuit board in SMD technology and the first component in SMD -Technique is equipped, in particular so the second circuit board and the first component surface mounted, in particular soldered, are on one side of the first circuit board.
  • the second circuit board allows an increased number of turns of flat windings, which is executed in the layers of the two circuit boards.
  • both circuit boards are executable as multilayer printed circuit boards, so multi-layer printed circuit boards, which thus not only have two outer, so arranged on the outer surface copper layers but also inner layers, which are thus spaced by means of carrier material from the other layers.
  • carrier material is a
  • the first component has a particular cuboidal housing, on which a connection surface, in particular terminal pad, is arranged and on the other side a first connection foot and second
  • Connection feet are arranged, wherein the second connection feet are electrically connected to each other, in particular are connected in parallel, ie in each case have the same electrical potential, in particular wherein the number of second connection feet is five.
  • the advantage here is that the current entering the component is divisible and thus a total of a strong current is controllable. Because the second connection feet are not overloaded, especially not overheated.
  • the first component is a transistor, wherein the first connection foot is a control input, in particular gate,
  • connection feet act as a supply input, in particular a source
  • connection surface is a third connection of the transistor, in particular a drain.
  • connection surface is electrically connected to a conductor track arranged on the surface of the side of the first printed circuit board facing away from the transistor, a cooling plate contacting the conductor track, in particular being heat-conductively connected to the conductor track, the first printed circuit board being screw-connected to the cooling plate, in particular, wherein the cooling plate carries and / or holds the first circuit board.
  • the housing of the transistor is cuboid.
  • the pad can be arranged on another side of the cuboid housing as the connection feet and thus a creepage distance is guided over an edge of the cuboid. Therefore, a long creepage distance and thus a high insulation resistance can be achieved.
  • first connection foot and the second form are identical to each other.
  • Connection feet a straight row of connection feet, which are regularly spaced from each other.
  • the advantage here is that a simple discharge of the current is made possible from the component.
  • the first printed circuit board and the second printed circuit board are each multi-layered, in particular as a multilayer printed circuit board, wherein the two outer layers of the first circuit board at least in a conductor track each lead to low voltage, the two outer layers of the second circuit board at least in one Conductor each lead low voltage.
  • a winding can be arranged as a flat winding in several of the layers of the circuit boards. Each of the windings is thus arranged on a respective layer and the windings of a respective winding are electrically connected by means of a via.
  • the pair of layers of the first printed circuit board next to an outer layer of the first printed circuit board carries high voltage at least in one printed circuit trace, and / or the inner layers of the first printed circuit board lead in pairs alternately at least in a respective printed circuit trace high voltage or low voltage, wherein the each pair is formed in each case from each other next to each other adjacent layers.
  • the advantage here is that between the high voltage leading layers low voltage leading layers are arranged and thus an increased distance between the high voltage leading camps is reachable. This also improves the insulation.
  • the outer layers carry only low voltage and are therefore safe for people who touch the circuit board. Likewise, there is no risk of voltage breakdown for the two contacting arranged printed circuit boards. Because the outer layers are coated with an electrically insulating paint, which is indeed very thin, but sufficient insulation for the low voltage.
  • the pair of layers of the second printed circuit board next to an outer layer of the second printed circuit board leads at least in one printed circuit to high voltage and the pair of layers arranged further inside the second printed circuit board leads to the pair next to the pair, at least in one printed circuit.
  • the advantage here is that between two pairs of high voltage leading layers each have a pair of low voltage leading layers is arranged. In this way, a sufficiently high insulation distance can be achieved between the high-voltage pairs, although the printed circuit boards are made very thin-walled.
  • the distances between the individual layers adjacent to each other are less than 2 mm, in particular less than 1 mm.
  • the inner layers of the second printed circuit board lead in pairs alternately at least in a conductor track high voltage or low voltage, the respective pair is formed here in each case from each next adjacent layers.
  • the advantage here is that between two pairs of high voltage leading layers each have a pair of low voltage leading layers is arranged. In this way, a sufficiently high insulation distance can be achieved between the high-voltage pairs, although the printed circuit boards are made very thin-walled.
  • the distances between the individual mutually adjacent layers are less than 2 mm, in particular less than 1 mm.
  • the high voltage is a voltage from the
  • Voltage range above 800 volts, especially measured against electrical ground and / or ground, and / or the low voltage is a voltage of less than 50 volts, in particular less than 48 volts, in particular measured against electrical ground and / or ground.
  • the advantage here is that the voltage of a DC link of an inverter is used. In the motor operation of an electric motor, the converter feeds this electric motor and in generator operation the intermediate circuit voltage increases, in particular to or above 800 V, in particular measured against electrical ground and / or ground.
  • the respective conductor carries a respective turn of a primary winding or secondary winding.
  • the windings are executable as concentric flat windings, in particular with the same maximum winding diameter.
  • the first and the second printed circuit board turns of a primary winding and turns of a secondary winding, in particular wherein the primary winding high voltage leads and / or the first component controls the current flowing through the primary winding, in particular primary current, and / or wherein the secondary winding low voltage leads.
  • the advantage here is that a device can be used which can switch high currents and thus "chop" the primary current flowing in the primary current. In this way, the secondary side one
  • the secondary side feeds a rectifier from the secondary winding and thus provides a low voltage which is brought to a constant value by means of an electronic circuit, despite the voltage applied to the primary winding being variable.
  • the voltage provided on the secondary side is detected and thereby regulated to a desired value by the first component being driven accordingly.
  • the first component is controlled pulse width modulated and determines the pulse width as a manipulated variable from a regulator unit, in particular linear regulator unit, in particular P controller, PI controller or PID controller, which supplied the detected voltage and the setpoint is predetermined.
  • a regulator unit in particular linear regulator unit, in particular P controller, PI controller or PID controller, which supplied the detected voltage and the setpoint is predetermined.
  • a spool core has at least two parts, wherein at least one of the two parts has a middle leg and outer leg, wherein the middle leg protrudes through a recess of the first printed circuit board and through a recess of the second printed circuit board, wherein the turns of the primary winding and the secondary winding are guided around the center leg.
  • FIG. 1 shows an oblique view of a switched-mode power supply according to the invention.
  • the switching power supply has a first printed circuit board 7, which is equipped with components in SMD technology.
  • the components have soldering surfaces or
  • Connection feet which are suitable for surface mounting by soldering. Passing through feet through a through hole in the first
  • Circuit board 7 is omitted.
  • a second circuit board 3 is performed on its outer periphery with solder surfaces, directly on the first circuit board 7, in particular so touching, placed and connected by SMD technology, ie by soldering the solder pads of the second circuit board 3 with traces of the first circuit board. 7
  • the first and second printed circuit boards (3, 7) are each designed in multiple layers.
  • a coil core composed of two parts has three legs, wherein at least the middle of the three legs is guided through a recess passing through the first circuit board 7 and through the second circuit board 3.
  • the switching power supply has an inductive transformer, which has a primary winding and a secondary winding.
  • the primary winding is flowed through by a transistor controlled by a high current, with voltages of more than 800 V are provided. Such voltages are referred to here and below as high voltage.
  • a low-voltage is provided on the secondary side.
  • the first circuit board 7 is made of four layers and the second circuit board 3 eight layers.
  • Two turns of the primary winding are arranged in the middle layers of the second printed circuit board 3, ie in the second and third layers of the second printed circuit board 3.
  • the second and third layers of the second printed circuit board 3 carry high voltage.
  • Further turns of the primary winding are arranged in the second and third and sixth and seventh position of the first circuit board 7 and thus carry high voltage, that is more than 800 volts. In this case, the voltage is always measured against ground, in particular so that electrical ground.
  • Insulation resistance and / or insulation are necessary. So it is sufficient, for example, a thin layer of lacquer on the outer layers to obtain sufficient insulation.
  • the layers by means of carrier material of the printed circuit board 3 and 7 are each well spaced so that a sufficiently high insulation strength.
  • the secondary winding has the number of turns six and the primary winding also has the number of turns six.
  • two or three turns of the primary winding can also be connected in parallel so that the primary current divides itself accordingly and the number of turns is three or two.
  • One of these components is a transistor, which controls the primary current, that is, has to switch large currents. This is due to the transistor high voltage.
  • the transistor 1 has on its housing a connection surface 12, in particular
  • Pad for drain of the transistor 1, on which is directly soldered to a conductor track, which is arranged on the outer surface of the first circuit board 7.
  • the pad 12 thus abuts the housing and forms part of the surface of the transistor.
  • connection foot 6 for the control input gate of the transistor 1 and five connection feet 5 for the supply terminal source of the transistor 1 out.
  • the connection feet (5, 6) are placed on the surface of the first printed circuit board 7 and then solder-joined in the said manufacturing process step.
  • Transistor 1 controllable.
  • connection pad 12 is arranged for drain at the bottom of the transistor 1 and the connection feet 5 on one side of the transistor 1 is a high distance between the drain and source and thus creepage distances for more than 800 volts, in particular more than 2000 volts feasible .
  • the connection surface 12 is arranged on a region of the underside of the transistor 1 which is as far as possible from the connection feet 5.
  • the connection feet are arranged for mechanical reasons and design reasons in the middle of the side of the transistor 1.
  • the housing of the transistor 1 is preferably designed cuboid.
  • low voltage is understood to mean a voltage of less than 50 volts, in particular less than 48 volts.
  • the second circuit board 3 carries the layers in the order NV, HV, HV, NV, NV, HV, HV, NV.
  • the inner layers are thus subjected in pairs with the same voltage.
  • the outer layers are each subjected to NV.
  • the first circuit board 7 is screw-connected to the cooling plate 2, in particular by means of screws 8.
  • the T ransistor 1 is mounted on the side remote from the cooling plate side of the first circuit board 7 on this. Its pad 12 is preferably plated through to a conductor on the cooling plate 2 facing side of the first circuit board 7, which is thermally conductively connected to the cooling plate 2, so that the heat generated by the transistor 1 via the cooling plate 2 can be discharged to the environment.
  • cooling plate 2 acts as a holding part for the first circuit board 7 and thus indirectly also for the components held by the first circuit board 7 and the second
  • the cooling plate is at another part of a
  • Electrical device can be screwed together.
  • another even number of layers of the first circuit board 7 and / or another even number of layers of the second circuit board 3 is provided. Although in turn lead the outer layers low voltage NV, but the inner layers in turn lead in alternating order in pairs HV or NV. LIST OF REFERENCE NUMBERS
  • connection surface in particular connection pad for drain

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dc-Dc Converters (AREA)

Abstract

Dispositif, en particulier bloc d'alimentation à découpage, comprenant une première carte de circuit imprimé et une deuxième carte de circuit imprimé ainsi qu'un premier élément, en particulier un transistor, la première carte de circuit imprimé étant munie de la deuxième carte de circuit imprimé par technique CMS et du premier élément par technique CMS, notamment la deuxième carte de circuit imprimé et le premier élément étant montés en surface, notamment brasés, sur une face de la première carte de circuit imprimé.
PCT/EP2019/025034 2018-02-20 2019-02-01 Dispositif, en particulier bloc d'alimentation à découpage Ceased WO2019161970A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19704190.8A EP3756425A1 (fr) 2018-02-20 2019-02-01 Dispositif, en particulier bloc d'alimentation à découpage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018001312 2018-02-20
DE102018001312.0 2018-02-20

Publications (1)

Publication Number Publication Date
WO2019161970A1 true WO2019161970A1 (fr) 2019-08-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/025034 Ceased WO2019161970A1 (fr) 2018-02-20 2019-02-01 Dispositif, en particulier bloc d'alimentation à découpage

Country Status (3)

Country Link
EP (1) EP3756425A1 (fr)
DE (1) DE102019000699A1 (fr)
WO (1) WO2019161970A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930601A (en) * 1996-08-30 1999-07-27 Scientific-Atlanta, Inc. Heat assembly and method of transferring heat
WO2003019997A1 (fr) * 2001-08-22 2003-03-06 Vanner, Inc. Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20130015936A1 (en) * 2011-07-14 2013-01-17 Delta Electronics (Shanghai) Co., Ltd. Converter and method for manufacturing the same
US20150235757A1 (en) * 2014-02-19 2015-08-20 General Electric Company System and method for reducing partial discharge in high voltage planar transformers
DE102016008013A1 (de) * 2016-07-04 2018-01-04 Sew-Eurodrive Gmbh & Co Kg Anordnung mit induktivem Übertrager

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI962803A0 (fi) * 1996-07-10 1996-07-10 Nokia Telecommunications Oy Planartransformator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5930601A (en) * 1996-08-30 1999-07-27 Scientific-Atlanta, Inc. Heat assembly and method of transferring heat
WO2003019997A1 (fr) * 2001-08-22 2003-03-06 Vanner, Inc. Dissipateur thermique ameliore pour dispositifs d'alimentation montes en surface
US20040032313A1 (en) * 2002-08-15 2004-02-19 Andrew Ferencz Simplified transformer design for a switching power supply
US20130015936A1 (en) * 2011-07-14 2013-01-17 Delta Electronics (Shanghai) Co., Ltd. Converter and method for manufacturing the same
US20150235757A1 (en) * 2014-02-19 2015-08-20 General Electric Company System and method for reducing partial discharge in high voltage planar transformers
DE102016008013A1 (de) * 2016-07-04 2018-01-04 Sew-Eurodrive Gmbh & Co Kg Anordnung mit induktivem Übertrager

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
-: "IPB065N15N3G OptiMOS 3 (TM) Power-Transistor", 25 January 2010 (2010-01-25), XP055587020, Retrieved from the Internet <URL:https://nl.mouser.com/Semiconductors/Discrete-Semiconductors/Transistors/MOSFET/Datasheets/_/N-ax1sf?P=1z0xpddZ1yw76fe> [retrieved on 20190508] *

Also Published As

Publication number Publication date
EP3756425A1 (fr) 2020-12-30
DE102019000699A1 (de) 2019-08-22

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