WO2019162985A1 - Dispositif de détermination de procédure de montage, procédé de détermination de procédure de montage, programme de détermination de procédure de montage, support d'enregistrement et système de montage de composant - Google Patents

Dispositif de détermination de procédure de montage, procédé de détermination de procédure de montage, programme de détermination de procédure de montage, support d'enregistrement et système de montage de composant Download PDF

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Publication number
WO2019162985A1
WO2019162985A1 PCT/JP2018/005864 JP2018005864W WO2019162985A1 WO 2019162985 A1 WO2019162985 A1 WO 2019162985A1 JP 2018005864 W JP2018005864 W JP 2018005864W WO 2019162985 A1 WO2019162985 A1 WO 2019162985A1
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WO
WIPO (PCT)
Prior art keywords
mounting
mode
component
production plan
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/005864
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English (en)
Japanese (ja)
Inventor
大介 春日
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to PCT/JP2018/005864 priority Critical patent/WO2019162985A1/fr
Priority to TW107135539A priority patent/TWI689233B/zh
Publication of WO2019162985A1 publication Critical patent/WO2019162985A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

  • This invention is a component mounting system comprising a transport unit capable of transporting a plurality of substrates in the transport direction in sequence, and a plurality of mounting units arranged in the transport direction and capable of mounting the same type of components on the substrate, respectively.
  • the present invention relates to a technique for determining a procedure for mounting components on a board.
  • a component mounting system having a plurality of mounting portions arranged in the board conveyance direction.
  • mounting of components on a single board can be shared by a plurality of mounting units. That is, the board stops in order at a plurality of mounting sections while being transported in the transport direction, and each mounting section mounts a component in charge on the stopped board. Thereby, the efficiency of component mounting can be improved.
  • this method may not always be efficient.
  • the board that is first carried into the component mounting system stops at the most upstream mounting portion in the transport direction, and receives the mounting of the component at this mounting portion.
  • the mounting part on the downstream side in the transport direction from the most upstream mounting part does not operate, so the operation rate of the component mounting system is lower than that when the downstream mounting part operates.
  • the operating rate can be similarly reduced.
  • the mounting unit on the upstream side in the transport direction from the most downstream mounting unit does not operate, so the operation rate of the component mounting system is lower than when the upstream mounting unit operates.
  • Such a decrease in operating rate is particularly noticeable when there are few boards to be transferred to the component mounting system.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a technique for enabling efficient component mounting according to the situation in a component mounting system including a plurality of mounting units arranged in the board transfer direction.
  • a mounting procedure determining apparatus includes a transport unit capable of transporting a plurality of substrates having a plurality of mounting target points in order in the transport direction, and M mounting positions (M is an integer of 2 or more) arranged in the transport direction. J parts mounted on the mounting target point (J is M or more) by a component mounting system provided with M mounting parts that can be mounted on the mounting target point.
  • Integer Integer
  • Implementation that determines the mounting mode for mounting components at the mounting target points in the production plan based on the production plan acquisition unit that acquires the production plan to be produced and the evaluation result on the production time required to execute the production plan
  • a mounting mode determining unit that stops the substrate one by one at each of the M mounting positions, and a plurality of mounting target points on the substrate at the mounting position corresponding to each of the M mounting units. Parts for all Whether the first mounting mode is used for execution of the production plan based on the evaluation result regarding the production time when the production plan is executed using the first mounting mode for unloading the board from each of the M mounting positions. Decide whether or not.
  • the mounting procedure determining method includes a transport unit capable of transporting a plurality of substrates having a plurality of mounting target points in order in the transport direction, and M mounting positions (M is an integer of 2 or more) arranged in the transport direction.
  • Integer with a process for obtaining a production plan to be produced and a process for determining a mounting mode for mounting a component at a mounting target point in the production plan based on the result of evaluating the production time required to execute the production plan.
  • the mounting procedure determination program causes a computer to execute the mounting procedure determination method described above.
  • the recording medium according to the present invention records the above mounting procedure determination program so as to be readable by a computer.
  • a plurality of substrates having a plurality of mounting target points are sequentially transferred in the transport direction.
  • a component mounting procedure by the component mounting system provided is required. That is, a production plan for producing J parts mounted on the mounting target point is acquired, and an evaluation regarding the production time required to execute the production plan is performed.
  • the mounting mode determination unit stops the board in order at the M mounting positions when the production plan is executed using the first mounting mode, and mounts components on a plurality of mounting target points on the board. Based on the result of evaluating the difference in production time between the case where the production plan is executed using the second implementation mode assigned to the M mounting units, either the first implementation mode or the second implementation mode is used to execute the production plan.
  • the mounting procedure determining device may be configured to determine whether to use the function. In such a configuration, the first mounting mode and the second mounting mode can be used properly according to the situation. Therefore, efficient component mounting according to the situation can be executed.
  • the mounting mode determination unit T (N ⁇ ) where T (N ⁇ ) is the total number of mounting target points on each of the first to Nth substrates that are sequentially transported in the transport direction.
  • the mounting procedure determining apparatus may be configured to determine the execution mode of the first mode based on the number N of substrates satisfying ⁇ J ⁇ T (N).
  • the mounting mode determination unit executes the first mounting mode (N / M) times when determining that the first mounting mode is used for execution of the production plan.
  • the mounting procedure determining device may be configured to determine to execute the production plan.
  • the production plan can be completed by repeating the parallel mounting process of mounting components on M boards in parallel N times. Therefore, a high operating rate of the mounting unit can be ensured and efficient component mounting can be performed.
  • the mounting mode determination unit determines that the first mounting mode is used for execution of the production plan when N is a value obtained by adding K to a multiple of M (K is an integer greater than or equal to 1 and less than M)
  • K is an integer greater than or equal to 1 and less than M
  • the mounting mode is executed ((NK) / M) times, one board is stopped at each of the M mounting positions, and the board at the mounting position corresponding to each of the M mounting portions.
  • the mounting procedure determining device may be configured to determine to execute the production plan in the first modified mounting mode to be executed by the mounting unit.
  • T (NK) components among J components are subjected to parallel mounting processing ((NK) / M) times for mounting components in parallel on M boards.
  • parallel mounting processing ((NK) / M) times for mounting components in parallel on M boards.
  • JT (NK) parallel mounting processing
  • one board is stopped on each of the M mounting portions, and the mounting position corresponding to each of the M mounting portions is set.
  • a component is mounted on the board (first change mounting mode). In this way, a total of (JT (NK)) parts are mounted on the mounting target points on the M mounting parts, so that a high operating rate of the mounting part is secured and efficient component mounting is executed. It becomes possible.
  • the mounting mode determination unit determines that the first mounting mode is used for execution of the production plan when N is a value obtained by adding K to a multiple of M (K is an integer greater than or equal to 1 and less than M)
  • the board is stopped at K mounting positions among the M mounting positions, and K mountings corresponding to the K mounting positions are performed.
  • the mounting procedure determining device is configured to determine to execute the production plan in the second modified mounting mode in which when the component is mounted on all of the plurality of mounting target points on the board, the board is unloaded from the K mounting positions. It may be configured.
  • T (NK) components among J components are subjected to parallel mounting processing ((NK) / M) times for mounting components in parallel on M boards.
  • parallel mounting processing ((NK) / M) times for mounting components in parallel on M boards.
  • JT (NK) parallel mounting processing
  • the board is stopped at K mounting positions among the M mounting positions, and K mountings corresponding to the K mounting positions are performed.
  • the component is mounted on all of the plurality of mounting target points on the board (second modified mounting mode).
  • the production plan can be completed by mounting (JT (NK)) parts on the mounting target points using the K mounting parts.
  • the mounting mode determination unit may configure the mounting procedure determination device so as to determine to execute the production plan while completing the production plan early among the first changed mounting mode and the second changed mounting mode. good. This makes it possible to efficiently execute a production plan by using one of the first change mounting mode and the second change mounting mode that is more appropriate.
  • the mounting mode determination unit may configure the mounting procedure determination device so as to evaluate the production time based on the transport time required for transporting the substrate executed in the production plan. In such a configuration, it is possible to accurately evaluate the production time based on the conveyance time.
  • the mounting mode determination unit may configure the mounting procedure determination device so as to perform an evaluation on the production time based on the mounting time and the transport time required for mounting the component on the board executed in the production plan. In such a configuration, it is possible to accurately evaluate the production time based on the mounting time and the conveyance time.
  • the component mounting system includes a transport unit capable of transporting a plurality of boards having a plurality of mounting target points in the transport direction in order and M mounting positions (M is an integer of 2 or more) arranged in the transport direction.
  • M is an integer of 2 or more
  • a control unit that executes by controlling the transport unit and the M mounting units, and the control unit stops the substrate one by one at each of the M mounting positions, and each of the M mounting units
  • the production plan can be executed using the first mounting mode in which the board is unloaded from each of the M mounting positions.
  • a transport unit capable of transporting a plurality of substrates having a plurality of mounting target points in the transport direction in order, and M pieces (M is two or more) arranged in the transport direction.
  • M mounting portions that can be mounted on the mounting target points and are provided corresponding to mounting positions of (integer). Then, when one board is stopped in each of the M mounting parts and components are mounted on all of the plurality of mounting target points of the board at the mounting positions corresponding to each of the M mounting parts,
  • the production plan can be executed using the first mounting mode in which the board is unloaded from each mounting position. Therefore, in a situation where the first mounting mode is efficient, the production plan can be executed in the first mounting mode.
  • efficient component mounting according to the situation can be executed.
  • a standby position for waiting the substrate is provided between the first mounting position and the second mounting position counted from the upstream side in the transport direction.
  • the mounting mode when the mounting of the components to the plurality of mounting target points on the first board at the first mounting position is completed, the next board is moved to the standby position from the first mounting position.
  • the mounting mode can be changed to the third mounting mode in which the board is stopped at the first mounting position and components are mounted on a plurality of mounting target points on the next board at the first mounting position.
  • a component mounting system may be configured. That is, basically, component mounting at each mounting position in the first mounting mode should be completed almost simultaneously.
  • the progress of component mounting may differ at each mounting position. Therefore, for example, when the mounting of the component is completed at the first mounting position counted from the upstream side in the transport direction, the mounting of the component may continue at the second mounting position. On the other hand, while moving the first board from the first mounting position to the standby position, the next board of the first board is stopped at the first mounting position, and the next board at the first mounting position.
  • Such a case can be dealt with by enabling the mounting mode to be changed to the third mounting mode in which components are mounted on a plurality of mounting target points. In this way, efficient component mounting according to the situation can be executed.
  • the control unit mounts the component to the plurality of mounting target points out of the M mounting positions.
  • the component mounting system may be configured to determine whether to change to the third mounting mode or to continue the first mounting mode based on the number of components already mounted at the mounting position that is most delayed. Thereby, efficient component mounting according to the progress of component mounting at each mounting position can be executed.
  • a component mounting system including a plurality of mounting units arranged in the board conveyance direction, it is possible to execute efficient component mounting according to the situation.
  • the top view which shows typically an example of the component mounting system which concerns on this invention.
  • movement in 1st mounting mode typically.
  • movement in 2nd mounting mode typically.
  • movement in 2nd mounting mode typically.
  • the block diagram which shows the structure of the host computer which functions as an example of the mounting procedure determination apparatus which concerns on this invention.
  • the flowchart which shows an example of the mounting procedure determination method which a host computer performs.
  • FIG. 1 is a plan view schematically showing an example of a component mounting system according to the present invention.
  • XYZ orthogonal coordinate axes configured by a conveyance direction X, a width direction Y, and a vertical direction Z are appropriately used.
  • the transport direction X and the width direction Y are parallel to the horizontal direction and orthogonal to each other, and the vertical direction Z is orthogonal to the transport direction X and the width direction Y.
  • the component mounting system 1 includes a single component mounter 10 that mounts components on the board B carried in from the upstream side in the transport direction X and transports the components downstream in the transport direction X.
  • a plurality of mounting target points Bp are provided on the board B, and the control unit 100 provided in the component mounting machine 10 controls each part of the component mounting machine 10 so that the component Wp is assigned to each mounting target point Bp. Install one by one.
  • Each component Wp is a bare chip of a diced wafer W, and has the same configuration.
  • the substrate B is provided with 64 (8 ⁇ 8) target candidate points separated by a broken line in a matrix, and L determined as a non-defective product among the 64 target candidate points.
  • the component mounter 10 includes a transport unit 2 that transports the substrate B in the transport direction X.
  • the transport unit 2 includes a standby conveyor 21, a mounting conveyor 22, a standby conveyor 23, a mounting conveyor 24, and an unloading conveyor 25 that are arranged in this order in the transport direction X, and these conveyors 21 to 25 cooperate in the transport direction.
  • the substrate B can be transferred to X.
  • the standby conveyor 21 is provided with respect to the standby position P1, and waits for the board B carried in from the outside of the component mounting system 1 at the standby position P1 or transfers it to the mounting conveyor 22.
  • the mounting conveyor 22 is provided with respect to the mounting position P2 located downstream of the standby position P1 in the transport direction X, and the substrate B received from the standby conveyor 21 is fixed to the mounting position P2 or transferred to the standby conveyor 23.
  • the standby conveyor 23 is provided with respect to the standby position P3 located downstream of the mounting position P2 in the transport direction X, and waits for the substrate B received from the mounting conveyor 22 at the standby position P3 or transfers it to the mounting conveyor 24.
  • the mounting conveyor 24 is provided with respect to the mounting position P4 located downstream of the standby position P3 in the transport direction X, and the substrate B received from the standby conveyor 23 is fixed to the mounting position P4 or transferred to the carry-out conveyor 25.
  • the carry-out conveyor 25 is provided at a position downstream of the mounting position P4 in the transport direction X, and carries the board B received from the mounting conveyor 24 out of the component mounting system 1.
  • M mounting positions P2 and P4 are provided side by side in the transport direction X.
  • M is an integer greater than or equal to 2
  • M 2 in the example of FIG.
  • the component mounter 10 also includes a component supply mechanism 3 that supplies the component Wp.
  • the component supply mechanism 3 includes a wafer storage unit 31 that can store a plurality of wafers W, and a wafer extraction unit 33 that extracts the wafer W from the wafer storage unit 31 to the wafer supply position Pp.
  • the wafer storage unit 31 raises and lowers in a vertical direction Z a rack for storing a plurality of wafer holders Wh each holding a wafer W in the vertical direction Z so that the wafer extraction unit 33 can receive the wafer W.
  • the wafer holder Wh can be positioned, and the wafer holder Wh can be pushed out to the wafer extraction portion 33.
  • the wafer lead-out unit 33 is attached to the wafer support table 331 provided in the width direction Y, a wafer support table 331 that supports the wafer holder Wh, a fixed rail 332 that supports the wafer support table 331 so as to be movable in the width direction Y. And a Y-axis motor 334 that drives the ball screw 333. Therefore, by rotating the ball screw 333 by the Y-axis motor 334, the wafer support table 331 can be moved in the width direction Y along the fixed rail 332. As shown in FIG. 1, the wafer storage unit 31 and the wafer supply position Pp are arranged so as to sandwich the transfer unit 2 from the width direction Y, and the wafer support table 331 passes below the transfer unit 2.
  • the wafer support table 331 receives the wafer holder Wh from the wafer storage unit 31 at the reception position adjacent to the wafer storage unit 31 and moves from the reception position to the wafer supply position Pp away from the wafer storage unit 31 in the width direction Y. As a result, the wafer W is pulled out to the wafer supply position Pp.
  • the component supply mechanism 3 has a component take-out unit 35 that extracts the component Wp from the wafer supply position Pp.
  • the component take-out unit 35 has a take-out head 36 that takes out the component Wp from the wafer supply position Pp, and can drive the take-out head 36 in the XY directions.
  • the component extraction unit 35 includes a support member 351 that supports the extraction head 36 so as to be movable in the conveyance direction X, and an X-axis motor 352 that is provided in the conveyance direction X and drives a ball screw attached to the extraction head 36.
  • the take-out head 36 can be moved in the transport direction X by driving the ball screw by the X-axis motor 352.
  • the component take-out unit 35 includes a fixed rail 353 that supports the support member 351 so as to be movable in the width direction Y, a ball screw 354 that is provided in the width direction Y and attached to the fixed rail 353, and a Y that drives the ball screw 354.
  • the take-out head 36 has a bracket 361 extending in the transport direction X and two nozzles 362 rotatably supported by the bracket 361. Each nozzle 362 is positioned at either a suction position facing downward or a delivery position (position in FIG. 1) facing upward by rotating around a rotation axis parallel to the transport direction X.
  • the bracket 361 can be moved up and down with each nozzle 362.
  • the component supply mechanism 3 When the nozzle 362 positioned at the suction position is opposed to the component Wp on the wafer supply position Pp from above, the component supply mechanism 3 lowers the nozzle 362 to contact the component Wp. Further, the component supply mechanism 3 sucks the component Wp from the wafer supply position Pp by raising the nozzle 362 while applying a negative pressure to the nozzle 362. Then, the component supply mechanism 3 supplies the component Wp by positioning the nozzle 362 at the delivery position.
  • the component mounter 10 includes mounting units 4A and 4B that mount the component Wp supplied by the component supply mechanism 3 on the board B in this way.
  • the mounting portions 4A and 4B include a support member 41 movable along a fixed rail provided in the width direction Y on the ceiling of the component mounting machine 10, and a mounting head supported by the support member 41 so as to be movable in the transport direction X. 42, and the mounting head 42 can be moved in the XY directions.
  • the mounting head 42 has two nozzles 421 facing downward.
  • each of the mounting portions 4A and 4B moves above the take-out head 36 and makes the nozzle 421 face the component Wp held by the nozzle 362 located at the delivery position from above. Then, the nozzle 421 is lowered and brought into contact with the component Wp. Subsequently, the component supply mechanism 3 releases the negative pressure of the nozzle 362, and the mounting portions 4A and 4B raise the nozzle 421 while applying a negative pressure to the nozzle 421.
  • the mounting unit 4A mounts the component Wp on the mounting target point Bp of the substrate B fixed at the corresponding mounting position P2, and the mounting unit 4B is mounted on the corresponding mounting position P4. The component Wp is mounted on the mounting target point Bp of the fixed substrate B. As described above, the mounting portions 4A and 4B mount a single type of component Wp on the board B.
  • the control unit 100 can mount the component Wp on the mounting target point Bp of the board B using a plurality of mounting modes including the first and second mounting modes.
  • the transport unit 2 stops the substrate B one by one at each of the two mounting positions P2 and P4, and each of the two mounting units 4A and 4B is within the corresponding mounting positions P2 and P4.
  • the transport unit 2 carries the substrate B out of the component mounting system 1 from each of the two mounting positions P2 and P4.
  • the transport unit 2 stops one board B in order at the two mounting positions P2 and P4, and components to a plurality of (L) mounting target points Bp on one board B.
  • the two mounting parts 4A and 4B share the mounting of Wp.
  • FIG. 2 is a diagram schematically showing an example of the operation in the first mounting mode.
  • the transport unit 2 starts transporting the first board B1 to the mounting position P4 (step S101), and then starts transporting the second board B2 to the mounting position P2. (Step S102).
  • the transport unit 2 fixes the first board B1 to the mounting position P4 and fixes the second board B2 to the mounting position P2.
  • the mounting parts 4A and 4B start mounting the component Wp on the boards B2 and B1 fixed to the corresponding mounting positions P2 and P4.
  • the mounting unit 4A mounts the component Wp on all of the plurality of mounting target points Bp of the substrate B2 fixed at the mounting position P2
  • the mounting unit 4B mounts the plurality of mountings of the substrate B1 fixed at the mounting position P4.
  • the component Wp is mounted on all the target points Bp (step S104).
  • step S104 in parallel with the component mounting, the third board B3 is placed on standby at the standby position P1, and the fourth board B4 is adjacent to the standby position P1 on the upstream side in the transport direction X.
  • the transport unit 2 unloads the substrate B1 from the mounting position P4 to the outside of the component mounting system 1 and unloads the substrate B2 from the mounting position P2 to the outside of the component mounting system 1 ( Step S105).
  • the transport unit 2 transports the third substrate B3 to the mounting position P4 and transports the fourth substrate B4 to the mounting position P2. .
  • the transport unit 2 fixes the third board B3 to the mounting position P4 and fixes the fourth board B4 to the mounting position P2.
  • the mounting unit 4A mounts the component Wp on all of the plurality of mounting target points Bp of the substrate B4 fixed at the mounting position P2, and the mounting unit 4B mounts the plurality of substrates B3 fixed at the mounting position P4.
  • the component Wp is mounted on all the target points Bp (step S107).
  • the transport unit 2 unloads the board B3 from the mounting position P4 to the outside of the component mounting system 1 and mounts the mounting position.
  • the board B4 is unloaded from P2 to the outside of the component mounting system 1 (step S108).
  • each mounting unit 4A, 4B mounts the component Wp on all mounting target points Bp provided on the board B in charge, and one board B has M mountings.
  • the component Wp is received from only one of the parts 4A and 4B.
  • 3 and 4 are diagrams schematically showing an example of the operation in the second mounting mode.
  • the transport unit 2 starts transporting the first board B1 to the mounting position P2 (step S201), and fixes the first board B1 to the mounting position P2 (step S202).
  • the mounting unit 4A starts mounting the component Wp on the board B1 fixed at the corresponding mounting position P2. That is, the mounting unit 4A mounts the component Wp on 1 / M of the plurality of mounting target points Bp of the substrate B1 fixed at the mounting position P2, that is, (L / M) mounting target points Bp ( Step S203).
  • the transport unit 2 causes the second board B2 to wait at the standby position P1.
  • the transport unit 2 transports the first board B1 from the mounting position P2 to the mounting position P4, and transports the second board B2 from the standby position P1 to the mounting position P2.
  • the transport unit 2 fixes the first board B1 to the mounting position P4 and fixes the second board B2 to the mounting position P2 (step S205).
  • the mounting part 4A starts mounting the component Wp on the board B2 fixed to the corresponding mounting position P2, and the mounting part 4B
  • the mounting of the component Wp on the board B1 fixed at the mounting position P4 is started. That is, the mounting unit 4A mounts the component Wp on the mounting target point Bp of 1 / M among the plurality of mounting target points Bp of the substrate B2 fixed at the mounting position P2, and the mounting unit 4B is mounted on the mounting position P4.
  • the component Wp is mounted on the remaining 1 / M mounting target points Bp of the plurality of mounting target points Bp of the substrate B1 fixed to (step S206).
  • the remaining mounting target points Bp are mounting target points Bp in which the component Wp is not mounted at the mounting position P2 in step S203 among the plurality of mounting target points Bp on the substrate B1.
  • the second mounting mode in which the mounting units 4A and 4B share the mounting of the component Wp on the plurality of mounting target points Bp of one board B is completed for the first board B1.
  • the transport unit 2 causes the third board B3 to wait at the standby position P1.
  • step S207 the transport unit 2 transports the second board B2 from the mounting position P2 to the mounting position P4, and transports the third board B3 from the standby position P1 to the mounting position P2. Then, the transport unit 2 fixes the second board B2 to the mounting position P4 and fixes the third board B3 to the mounting position P2 (step S208).
  • the mounting unit 4A has a mounting target of 1 / M among the plurality of mounting target points Bp of the board B3 fixed to the corresponding mounting position P2.
  • the mounting unit 4B moves to the remaining 1 / M mounting target point Bp among the plurality of mounting target points Bp of the substrate B2 fixed at the corresponding mounting position P4.
  • the component Wp is mounted (step S209).
  • the transport unit 2 causes the fourth board B4 to wait at the standby position P1.
  • step S210 the transport unit 2 transports the third board B3 from the mounting position P2 to the mounting position P4, and transports the fourth board B4 from the standby position P1 to the mounting position P2. Then, the transport unit 2 fixes the third board B3 to the mounting position P4 and fixes the fourth board B4 to the mounting position P2 (step S211).
  • the mounting unit 4A has a mounting target of 1 / M among the plurality of mounting target points Bp of the board B4 fixed to the corresponding mounting position P2. While mounting the component Wp on the point Bp, the mounting unit 4B moves to the remaining 1 / M mounting target point Bp among the plurality of mounting target points Bp of the board B3 fixed at the corresponding mounting position P4. The component Wp is mounted (step S212). Thus, the second mounting mode is completed for the third board B2.
  • step S212 the transport unit 2 carries the board B3 out of the component mounting system 1 from the mounting position P4 (step S213).
  • step S213 the transport unit 2 transports the fourth board B4 from the mounting position P2 to the mounting position P4. Then, the transport unit 2 fixes the fourth board B4 to the mounting position P4 (step S214).
  • the mounting unit 4B is configured to mount the remaining 1 / M mounting target points Bp among the plurality of mounting target points Bp of the substrate B4 fixed at the corresponding mounting position P4.
  • the component Wp is mounted on (step S215).
  • the second mounting mode is completed for the fourth board B2.
  • the transport unit 2 carries the board B4 out of the component mounting system 1 from the mounting position P4 (step S216).
  • each mounting unit 4A, 4B mounts the component Wp on the mounting target point Bp shared by each of the plurality of mounting target points Bp of the substrate B, and one substrate B is
  • Each of the M mounting parts 4A and 4B receives mounting of the component Wp.
  • FIG. 5 is a block diagram showing a configuration of a host computer that functions as an example of a mounting procedure determination apparatus according to the present invention.
  • the host computer 7 includes a calculation unit 71, a storage unit 72, a UI (User Interface) 73, and a communication unit 74.
  • the arithmetic unit 71 is a processor composed of a CPU (Central Processing Unit) and a RAM (Random Access Memory).
  • the storage unit 72 is composed of, for example, an HDD (Hard Disk Disk Drive), and in the component mounting system 1, obtains a production plan 81 for producing J components Wp mounted on the mounting target point Bp (J is an integer greater than or equal to M). And remember.
  • HDD Hard Disk Disk Drive
  • the UI 73 includes an input device such as a mouse and a keyboard and an output device such as a display.
  • the UI 73 accepts a user input operation by the input device and displays information to the user by the output device.
  • the UI 73 may include an input device and an output device integrally, such as a touch panel display.
  • the communication unit 74 performs communication with the component mounter 10 of the component mounting system 1.
  • the computing unit 71 executes the mounting procedure determination program 82, thereby determining a mounting mode for mounting the component Wp on the mounting target point Bp in the production plan 81.
  • the mounting procedure determination program 82 may be provided in the form of being downloaded from an Internet server, or may be provided in a state stored in the recording medium 9 so as to be readable by the host computer 7.
  • the recording medium 9 for example, an optical disc, USB (Universal Serial Bus), or the like is applicable.
  • FIG. 6 is a flowchart showing an example of a mounting procedure determination method executed by the host computer.
  • the flowchart of FIG. 6 is executed by the calculation unit 71 according to the mounting procedure determination program 82.
  • step S ⁇ b> 301 for example, the storage unit 72 acquires and stores the production plan 81 input by a user operation on the UI 73.
  • step S302 the difference in production time between when the production plan 81 is executed in the component mounting system 1 using the first mounting mode and when the production plan 81 is executed in the component mounting system 1 using the second mounting mode. Is evaluated by the calculation unit 71.
  • the production plan 81 for producing the component Wp mounted on the mounting target point Bp with the substrate B as a lot unit will be described as an example. That is, the number J of components Wp already mounted on the mounting target point Bp produced by the production plan 81 is the number obtained by multiplying the number L of mounting target points Bp on the substrate B by the number of lots I (I is an integer). .
  • the production plan 81 is not limited to the example shown here. For example, even if the production plan 81 is to produce J mounted parts Wp with the wafer W as a lot, J pieces are determined regardless of the substrate B and the wafer W. The part Wp may be produced.
  • time Tt is required to transport the substrate B between two adjacent positions (for example, positions P1 and P2) among the positions P1 to P4, and the mounting positions P2 and P4
  • a mounting time Tm is required to mount the component Wp on the (L / M) mounting target points Bp, and the next substrate B is transported from the standby position P1 to the mounting position P4.
  • a replacement time Tc1 is required to transport B to the mounting position P2.
  • the time required to carry the substrate B1 to the mounting position P4 and the substrate B2 to the mounting position P2 in steps 101 to S103 is the time required to transfer the substrate B1 from the position of step S101 to the position of step S103. (4 ⁇ Tt).
  • step S104 the time required to mount the component Wp on the L mounting target points Bp on each of the substrates B1 and B2 is (2 ⁇ Tm). Therefore, the total time required for steps S101 to S104 is (4 ⁇ Tt + 2 ⁇ Tm).
  • the time required for carrying out the boards B1 and B2 from the component mounting system 1 and transporting the boards B3 and B4 to the mounting positions P4 and P2 through steps S105 to S106 is a replacement time Tc1. Therefore, the total time required for steps S101 to S106 is (4 ⁇ Tt + 2 ⁇ Tm + Tc1).
  • step S107 the time required to mount the component Wp on each of the L mounting target points Bp of the substrates B3 and B4 is (2 ⁇ Tm). Therefore, the total time required for steps S101 to S107 is (4 ⁇ Tt + 4 ⁇ Tm + Tc1).
  • the time required to carry out the boards B3 and B4 from the component mounting system 1 in step S108 is 4 ⁇ Tt corresponding to the time required to carry out the board B4 from the position of step S107 to the outside of the component mounting system 1.
  • the production time when the number N of boards B on which the component Wp is mounted is an even number
  • the production time when the number N is an odd number is 6 ⁇ Tt + (N + 1) ⁇ Tm + (N ⁇ 1) ⁇ Tc1 / 2 Formula 1b Can be calculated.
  • the time required to carry the substrate B1 to the mounting position P2 in steps 201 to S202 corresponds to the time required to transport the substrate B1 from the position of step S201 to the position of step S202 (2 ⁇ Tt). .
  • step S203 the time required to mount the component Wp on the (L / M) mounting target points Bp of the base B1 at the mounting position P2 is Tm. Therefore, the total time required for steps S201 to S203 is (2 ⁇ Tt + Tm).
  • steps S204 to S205 the time required to transfer the substrate B1 from the mounting position P2 to the mounting position P4 and to transfer the substrate B2 from the standby position P1 to the mounting position P2 is a replacement time Tc2. Therefore, the total time required for steps S201 to S205 is (2 ⁇ Tt + Tm + Tc2).
  • step S206 the time required to mount the component Wp on the (L / M) mounting target points Bp of the boards B1 and B2 is Tm. Therefore, the total time required for steps S201 to S206 is (2 ⁇ Tt + 2 ⁇ Tm + Tc2).
  • the board B1 is carried out of the component mounting system 1 from the mounting position P4, the board B2 is transferred from the mounting position P2 to the mounting position P4, and the board B3 is transferred from the standby position P1 to the mounting position P2.
  • the time required for this is the replacement time Tc2. Therefore, the total time required for steps S201 to S208 is (2 ⁇ Tt + 2 ⁇ Tm + 2 ⁇ Tc2).
  • step S209 the time required to mount the component Wp on the (L / M) mounting target points Bp of the boards B2 and B3 is Tm. Therefore, the total time required for steps S201 to S209 is (2 ⁇ Tt + 3 ⁇ Tm + 2 ⁇ Tc2).
  • the board B2 is carried out of the component mounting system 1 from the mounting position P4, the board B3 is transferred from the mounting position P2 to the mounting position P4, and the board B4 is transferred from the standby position P1 to the mounting position P2.
  • the time required for this is the replacement time Tc2. Therefore, the total time required for steps S201 to S211 is (2 ⁇ Tt + 3 ⁇ Tm + 3 ⁇ Tc2).
  • step S212 the time required to mount the component Wp on the (L / M) mounting target points Bp of the boards B3 and B4 is Tm. Therefore, the total time required for steps S201 to S212 is (2 ⁇ Tt + 4 ⁇ Tm + 3 ⁇ Tc2).
  • steps S213 to S214 the time required to carry the board B3 out of the component mounting system 1 from the mounting position P4 and to transport the board B4 from the mounting position P2 to the mounting position P4 is 2 ⁇ Tt. Therefore, the total time required for steps S201 to S214 is (4 ⁇ Tt + 4 ⁇ Tm + 3 ⁇ Tc2).
  • step S215 the time required to mount the component Wp on the (L / M) mounting target points Bp of the board B4 is Tm. Therefore, the total time required for steps S201 to S215 is (4 ⁇ Tt + 5 ⁇ Tm + 3 ⁇ Tc2).
  • step S216 the time required to carry the board B4 out of the component mounting system 1 from the mounting position P4 and to transport the board B4 from the mounting position P2 to the mounting position P4 is the replacement time 2 ⁇ Tt.
  • the time required for the production plan 81 for mounting the component Wp on the four substrates B using the second mounting mode is (6 ⁇ Tt + 5 ⁇ Tm + 3 ⁇ Tc2). Further, the time required for the production plan 81 increases by (Tc2 + Tm) every time the number of the boards B on which the component Wp is mounted increases by one. Therefore, the production time when the component Wp is mounted on the N boards B using the second mounting mode is as follows. 6 ⁇ Tt + (N + 1) ⁇ Tm + (N ⁇ 1) ⁇ Tc2 Equation 2 Can be calculated.
  • Formula 2 > Formula 1a, that is, 6 ⁇ Tt + (N + 1) ⁇ Tm + (N ⁇ 1) ⁇ Tc2> 8 ⁇ Tt + N ⁇ Tm + N ⁇ Tc1 / 2 Satisfy, that is, Tm> 2 ⁇ Tt + N ⁇ Tc1 / 2 ⁇ (N ⁇ 1) ⁇ Tc2 Conditional expression Ca If it is satisfied, it can be determined that the production time can be shortened by using the first mounting mode.
  • Formula 2 > Formula 1b, that is, 6 * Tt + (N + 1) * Tm + (N-1) * Tc2> 6 * Tt + (N + 1) * Tm + (N-1) * Tc1 / 2 That is, Tc2> Tc1 / 2 ...
  • Conditional expression Cb If it is satisfied, it can be determined that the production time can be shortened by using the first mounting mode.
  • step S302 in FIG. 6 the calculation unit 71 executes the production plan 81 in the component mounting system 1 using the first mounting mode, and the production plan 81 in the component mounting system 1 using the second mounting mode.
  • the difference in production time from the case of executing is evaluated using conditional expression Ca or conditional expression Cb.
  • conditional expression Ca conditional expression
  • Tt, Tm, Tc1, and Tc2 in the conditional expressions Ca and Cb are obtained in advance by simulation or experimentally and stored in the storage unit 72, and the calculation unit 71 performs evaluation using them.
  • step S303 the computing unit 71 determines a mounting mode used for execution of the production plan 81 based on the evaluation result in step S302. That is, when N is an even number, the calculation unit 71 determines to use the first implementation mode if the right side of the conditional expression Ca is less than the left side (that is, if the conditional expression Ca is satisfied), and the left side of the conditional expression Ca Is less than or equal to the right side (that is, if the conditional expression Ca is not satisfied), it is determined that the second mounting mode is used.
  • the calculation unit 71 determines to use the first implementation mode if the right side of the conditional expression Cb is less than the left side (that is, if the conditional expression Cb is satisfied), and the left side of the conditional expression Cb Is less than or equal to the right side (that is, if conditional expression Cb is not satisfied), it is determined to use the second mounting mode.
  • the calculating part 71 performs the procedure which performs the production plan 81 using the mounting mode determined by step S303 (namely, operation
  • the production time is evaluated when the production plan 81 is executed using the first mounting mode in which the board B is unloaded from each of the M mounting positions P2 and P4. (Step S302).
  • step S303 it is determined whether or not the first mounting mode is used for the execution of the production plan 81 (step S303).
  • the production plan 81 can be executed in the first mounting mode.
  • efficient component mounting according to the situation can be executed.
  • the first mounting mode is particularly suitable in a situation where the reduction in the operation rate at the time of component mounting on the first and last boards B in the second mounting mode is significant.
  • the calculation unit 71 stops the board B in order at the M mounting positions P2 and P4, and a plurality of mounting target points Bp of the board B A difference in production time is evaluated between the case where the production plan 81 is executed using the second mounting mode in which the mounting of the component Wp to the M mounting parts 4A, 4B is shared (step S302). Then, based on the evaluation result, the calculation unit 71 determines which of the first mounting mode and the second mounting mode is used for executing the production plan 81 (step S303). In such a configuration, the first mounting mode and the second mounting mode can be used properly according to the situation. Therefore, efficient component mounting according to the situation can be executed.
  • the production time is evaluated based on the transport times Tt, Tc1, and Tc2 required for transporting the substrate B executed in the calculation unit 71 and the production plan 81 (conditional expressions Ca and Cb). In such a configuration, it is possible to accurately evaluate the production time based on the transport times Tt, Tc1, and Tc2.
  • the calculation unit 71 performs an evaluation on the production time based on the mounting time Tm and the transport times Tt, Tc1, and Tc2 required for mounting the component Wp on the board B executed in the production plan 81 (conditional expression Ca).
  • the production time can be accurately evaluated based on the mounting time Tm and the transport times Tt, Tc1, and Tc2.
  • the transport unit 2 capable of transporting a plurality of substrates B having a plurality of mounting target points Bp in the transport direction X in order and a plurality of M pieces arranged in the transport direction X.
  • M mounting portions 4A and 4B are provided corresponding to the mounting positions P2 and P4, respectively, and can mount the same type of component on the mounting target point Bp. Then, one board B is stopped in each of the M mounting parts 4A and 4B, and a plurality of mounting target points of the board B at the mounting positions P2 and P4 corresponding to the M mounting parts 4A and 4B, respectively.
  • the production plan 81 can be executed using the first mounting mode in which the board B is unloaded from each of the M mounting positions P2 and P4. Therefore, in a situation where the first mounting mode is efficient, the production plan 81 can be executed in the first mounting mode. Thus, efficient component mounting according to the situation can be executed.
  • FIG. 7 is a diagram schematically showing the operation in the mounting mode that can be used in the modification example of the mounting procedure determination method.
  • J components are determined depending on whether N obtained from the above inequality is an even number or an odd number.
  • the mounting mode for mounting the last (JT (N-1)) parts Wp is changed.
  • J L ⁇ N
  • the first mounting mode is executed (N / 2) times so that L components are provided on each of the N boards B. Decide to implement Wp. Therefore, all of the last L components Wp are mounted on one board B.
  • the first mounting mode is executed ((N ⁇ 1) / 2) times to mount L components Wp on each of (N ⁇ 1) substrates B. Then, it is determined that the last L components Wp are mounted in the first modified mounting mode of FIG.
  • the transport unit 2 stops and fixes one substrate B at each of the mounting positions P2 and P4 (step S401). Then, each of the mounting portions 4A and 4B mounts (L / 2) components Wp on the substrate B at the corresponding mounting positions P2 and P4 (step S402).
  • the transport unit 2 carries the board B out of the component mounting system 1 from the mounting positions P2 and P4 (step S403). That is, in the first modified mounting mode, the last L components Wp are mounted separately on the two boards B.
  • the calculation unit 71 determines that the first mounting mode is to be used for the execution of the production plan 81 when N is a multiple of M (step S303), the first mounting mode is set to (N / M). It is determined that the production plan 81 is executed by executing it once. In such a configuration, the production plan 81 can be completed by repeating the parallel mounting process (steps S104, S107, etc. in FIG. 2) for mounting the component Wp in parallel on the M substrates B N times. Therefore, it is possible to secure a high operation rate of the mounting units 4A and 4B and to perform efficient component mounting.
  • the arithmetic unit 71 calculates the remaining number (K ⁇ L in this example) obtained by subtracting the number of components Wp mounted in the ((N ⁇ K) / M) times of the first mode from J. It is determined that the production plan 81 is executed by causing the M mounting units 4A and 4B to mount the component Wp on the mounting target point Bp.
  • the parallel mounting process for mounting the components Wp in parallel on the M boards B (step S104 in FIG.
  • the board B is stopped on each of the M mounting parts 4A and 4B, and the M mounting parts 4A and 4B are stopped.
  • the component Wp is mounted on the board B at the mounting positions P2 and P4 corresponding to each (first change mounting mode). In this way, by mounting a total of (JT (NK)) parts Wp on the mounting target point Bp on the M mounting parts 4A and 4B, a high operating rate of the mounting part is ensured and efficient. Component mounting is possible.
  • FIG. 8 is a diagram schematically showing another operation in the mounting mode that can be used in the modified example of the mounting procedure determination method.
  • the last of the J parts Wp is determined depending on whether N is an even number or an odd number.
  • the mounting mode for mounting (JT (N-1)) parts Wp is changed.
  • the first mounting mode is executed (N / 2) times to mount L components Wp on each of the N boards B. Then decide.
  • the first mounting mode is executed ((N ⁇ 1) / 2) times to mount L components Wp on each of (N ⁇ 1) substrates B. Thereafter, it is determined that the last (JT (N-1)), in this example, L components Wp are mounted in the second modified mounting mode of FIG.
  • the transport unit 2 stops and fixes one substrate B at the mounting position P4 (step S501). Then, the mounting unit 4B mounts L components Wp on the board B at the corresponding mounting position P4 (step S502).
  • the transport unit 2 carries the board B out of the component mounting system 1 from the mounting position P4 (step S503).
  • the last L components Wp are mounted on one board B.
  • the calculation unit 71 determines that the first mounting mode is used to execute the production plan 81 (step S303), and the first mounting mode is set to (N / M) It is determined that the production plan 81 is to be executed by executing it a number of times.
  • the production plan 81 can be completed by repeating the parallel mounting process (steps S104, S107, etc. in FIG. 2) for mounting the component Wp in parallel on the M substrates B N times. Therefore, it is possible to secure a high operation rate of the mounting units 4A and 4B and to perform efficient component mounting.
  • the parallel mounting process for mounting the components Wp in parallel on the M boards B (step S104 in FIG.
  • the parallel mounting process for mounting the components Wp in parallel on the M boards B (step S104 in FIG.
  • the parallel mounting process for mounting the components Wp in parallel on the M boards B (step S104 in FIG.
  • one board B is stopped at K mounting positions P4 out of M mounting positions P2 and P4, and K components
  • the components Wp are mounted on all of the plurality of mounting target points Bp of the substrate B on the K mounting portions 4B corresponding to the mounting position P4 (second change mounting mode).
  • the production plan 81 can be completed by mounting the (JT (NK)) parts Wp on the mounting target point Bp using the K mounting parts 4B.
  • the calculation unit 71 may select one of the first mounting change mode in FIG. 7 and the second mounting change mode in FIG. 8 and decide to use it for the mounting procedure. In this modification, the calculation unit 71 calculates the time required to execute the production plan 81 when using the first change mounting mode and when using the second change mounting mode. It is determined that the production plan 81 is executed in one modified mounting mode in which 81 is completed earlier. Thus, the production plan 81 can be efficiently executed by a more appropriate one of the first change mounting mode and the second change mounting mode.
  • FIG. 9 is a flowchart showing an example of the mounting mode change executed by the component mounting system.
  • the component mounting system 1 that executes the production plan 81 in the first mounting mode according to the determination by the mounting procedure determination method spontaneously changes the mounting mode according to the progress of the production plan 81.
  • Such a flowchart is executed under the control of the control unit 100 of the component mounting system 1.
  • the control unit 100 determines whether or not the mounting of the component Wp on the board B is completed at the most upstream mounting position P2 in the transport direction X among the M mounting positions P2 and P4. Is confirmed (step S601).
  • the control unit 100 confirms whether or not the mounting of the component Wp on the board B is continued at the mounting position P4 on the downstream side of the mounting position P2 (step S601). S602).
  • the transport unit 2 moves the board B from both the mounting positions P2 and P4 to the outside of the component mounting system 1. Unload (step S609).
  • the control unit 100 confirms whether the board B exists at the standby position P3 (step S603).
  • the presence / absence of the substrate B at the standby position P3 can be determined by, for example, a substrate detection sensor constituted by an optical sensor or the like.
  • the control unit 100 maintains the substrate B at the mounting position P2 (step S610) and moves to the substrate B at the mounting position P4. Wait until the mounting of the component Wp is completed (step S611).
  • step S611 When the completion of mounting at the mounting position P4 is confirmed (“YES” in step S611), the conveyance unit 2 moves from the mounting position P2, the standby position P3, and the mounting position P4 to the outside of the component mounting system 1 to the board B. Is carried out (step S609).
  • step S603 determines that the substrate B does not exist at the standby position P3 (“NO” in step S603), the control unit 100 proceeds to step S604, and a plurality (L pieces) of the substrate B at the mounting position P4.
  • the number of mounting target points Bp on which the component Wp is not mounted is less than a predetermined value (for example, (L / M)).
  • steps S610 and S611 are executed in the same manner as described above, and in step S609, the transport unit 2 moves the mounting position P2 and the mounting position.
  • the board B is carried out of the component mounting system 1 from each of the P4.
  • the transport unit 2 transports the substrate B from the mounting position P2 to the standby position P3 (step S605), and the next substrate B Is transported and fixed to the mounting position P2 (step S606). Then, the component Wp is mounted on the plurality of mounting target points Bp of the next board B, where the mounting portion 4A is fixed at the mounting position P2 (step S607).
  • the transport unit 2 moves from the mounting position P2, the standby position P3, and the mounting position P4 to the outside of the component mounting system 1. The substrate B is unloaded. After that.
  • the control unit 100 executes the flowchart of FIG. 9 while continuing to execute the first mounting mode.
  • a standby position for waiting the substrate B between the first mounting position P2 and the second mounting position P4 counted from the upstream side in the transport direction X. P3 is provided.
  • the control unit 100 changes the mounting mode from the first mounting mode to the third mounting mode.
  • the mounting mode (steps S605 to S609) can be changed as appropriate.
  • the third mounting mode the first board B is moved from the first mounting position P2 to the standby position P3, and the next board B of the first board B is stopped at the first mounting position P2.
  • the component Wp is mounted on the plurality of mounting target points Bp of the next board B at the mounting position P2. That is, basically, the mounting of the components Wp at the mounting positions P2 and P4 in the first mounting mode should be completed almost simultaneously.
  • the progress of the component mounting differs between the mounting positions P2 and P4 due to, for example, a component Wp suction error in the mounting units 4A and 4B.
  • the mounting of the component Wp is completed at the first mounting position P2
  • such a case can be dealt with by changing the mounting mode to the third mounting mode. In this way, efficient component mounting according to the situation can be executed.
  • control unit 100 mounts the component Wp on the plurality of mounting target points Bp when the mounting of the component Wp on the plurality of mounting target points Bp on the substrate B at the first mounting position P2 is completed. Based on the number of components Wp that have been mounted at the mounting position P4 that is the most delayed among the M mounting positions P2, P4, it is determined whether to change to the third mounting mode or to continue the first mounting mode (step). S604). This makes it possible to execute efficient component mounting according to the progress of component mounting at the mounting positions P2 and P4.
  • the host computer 7 corresponds to an example of the “mounting procedure determination device” and “computer” of the present invention
  • the storage unit 72 corresponds to an example of the “production plan acquisition unit” of the present invention
  • the calculation unit 71 corresponds to an example of the “mounting mode determination unit” of the present invention
  • the component mounting system 1 corresponds to an example of the “component mounting system” of the present invention
  • the transport unit 2 corresponds to the “transport unit” of the present invention.
  • the two mounting parts 4A, 4B correspond to an example of “M mounting parts” of the present invention
  • the two mounting positions P2, P4 correspond to “M mounting positions” of the present invention.
  • the standby position P3 corresponds to an example of the “standby position” of the present invention
  • the production plan 81 corresponds to an example of the “production plan” of the present invention
  • the substrate B corresponds to an example of the “substrate” of the present invention.
  • the mounting target point Bp corresponds to an example of the “mounting target point” of the present invention
  • the component Wp The example corresponds to an example of the “component” of the present invention
  • the transport direction X corresponds to an example of the “transport direction” of the present invention
  • the mounting procedure determination program 82 corresponds to an example of the “mounting procedure determination program” of the present invention
  • the recording medium 9 corresponds to an example of the “recording medium” of the present invention.
  • standby positions such as the standby position P1 and the standby position P3 are provided. However, it is not always necessary to provide such a standby position.
  • the component mounting system 1 described above is composed of one component mounter 10.
  • the component mounting system 1 may be configured by arranging a plurality of component mounting machines 10 each having a single mounting position in the transport direction X.
  • the transport unit 2 stops and fixes the board B at the mounting position in each component mounter 10 while sequentially transporting the board B to the plurality of component mounters 10.
  • the component Wp is mounted on the board B fixed at the mounting position.
  • the number of components Wp shared by the mounting units 4A and 4B need not be the same and may be different. In this case, in the second mounting mode, the difference between the number of components Wp shared by the mounting unit 4A and the number of components Wp shared by the mounting unit 4B is less than a predetermined value (eg, “1”). In addition, the mounting procedure may be determined.
  • a predetermined value eg, “1”.
  • the mounting unit 4A mounts the component Wp on the mounting target point Bp on the left half of the board B, and the mounting unit 4B mounts on the mounting target point Bp on the right half of the board B.
  • the component Wp was mounted.
  • the mounting target point Bp where each of the mounting parts 4A and 4B mounts the component Wp in the second mounting mode is not limited to this example.
  • the number of components Wp shared by the mounting units 4A and 4B is not necessarily the same, and may be different.
  • the difference between the number of components Wp shared by the mounting unit 4A and the number of components Wp shared by the mounting unit 4B is equal to or less than a predetermined value (eg, “1”).
  • the mounting procedure may be determined. That is, the mounting procedure may be determined so that the difference in the number of components Wp shared by the M mounting parts 4A and 4B is equal to or less than a predetermined value.
  • the specific method for evaluating the production time when the first mounting mode is used and the evaluation regarding the production time when using the second mounting mode are not limited to the above example. Therefore, based on the result of simulating the operation of the component mounting system 1 when the production plan 81 is executed using the first mounting mode, the production time when using the first mounting mode can be obtained.
  • the production time when the second mounting mode is used may be similarly obtained by simulation.
  • the board B is carried into the mounting position P4.
  • the board B may be carried into the mounting position P2 and the second mounting change mode may be executed.
  • the number of target candidate points determined to be defective may differ depending on the substrate B, and therefore the number of the plurality of mounting target points Bp may differ depending on the substrate B.
  • the production number J of the mounted parts Wp indicated by the production plan 81 is the total number of mounting target points Bp of the board B corresponding to the number of lots.
  • the production of the mounted component Wp does not require the board B to be a lot unit. Even in this case, as described above, based on the calculation result of the production time when the production plan 81 is executed using the first mounting mode, whether or not the first mounting mode is used, and the execution when it is used What is necessary is just to determine an aspect.
  • the production number J of the mounted parts Wp indicated by the production plan 81 is not related to the number of mounting target points Bp that the board B has, so that the last one that is carried into the transport unit 2 according to the production plan 81, that is, N
  • the number of components Wp to be mounted on the first board B may be less than the number of mounting target points Bp on the board B in some cases.
  • N is an even number of 4 or more, components are mounted in the first mounting mode on the first to (N ⁇ 2) th boards B, while the total on the last two boards B.
  • the mounting procedure may be determined so as to mount (JT (N-2)) parts Wp.
  • N is an odd number of 3 or more, components are mounted on the first to (N ⁇ 1) th boards B in the first mounting mode, while the last board B is (
  • the mounting procedure may be determined so as to mount JT (N-2)) parts Wp.

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Abstract

La présente invention porte sur l'acquisition d'un plan de production (81) destiné à produire un nombre (N × L) de composants (Wp) qui ont été montés sur des points cibles de montage (Bp), et sur la réalisation d'une évaluation concernant le temps de production nécessaire pour mettre en œuvre le plan de production (81). De façon précise, l'évaluation est effectuée en ce qui concerne le temps de production pour un cas où le plan de production (81) est mis en œuvre à l'aide d'un premier mode de montage, dans lequel un substrat (B) est arrêté à chaque emplacement de montage d'un nombre M d'emplacements de montage (P2, P4) correspondant respectivement à un nombre M d'unités de montage (4A, 4B) et, lorsque des composants (Wp) sont montés sur tous les points cibles de montage d'un nombre L de points cibles de montage (Bp) des substrats (B) au niveau des emplacements de montage (P2, P4), alors les substrats (B) sont évacués de chaque emplacement de montage des M emplacements de montage (P2, P4). Sur la base du résultat de cette évaluation, il est déterminé s'il faut, ou non, utiliser le premier mode de montage pour mettre en œuvre le plan de production (81). Par conséquent, le plan de production (81) peut être mis en œuvre selon le premier mode de montage dans une situation dans laquelle le premier mode de montage est efficace. Il est donc possible de mettre en œuvre un montage de composant efficace en fonction de la situation.
PCT/JP2018/005864 2018-02-20 2018-02-20 Dispositif de détermination de procédure de montage, procédé de détermination de procédure de montage, programme de détermination de procédure de montage, support d'enregistrement et système de montage de composant Ceased WO2019162985A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2018/005864 WO2019162985A1 (fr) 2018-02-20 2018-02-20 Dispositif de détermination de procédure de montage, procédé de détermination de procédure de montage, programme de détermination de procédure de montage, support d'enregistrement et système de montage de composant
TW107135539A TWI689233B (zh) 2018-02-20 2018-10-09 安裝順序決定裝置、安裝順序決定方法、安裝順序決定程式、記錄媒體、零件安裝系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/005864 WO2019162985A1 (fr) 2018-02-20 2018-02-20 Dispositif de détermination de procédure de montage, procédé de détermination de procédure de montage, programme de détermination de procédure de montage, support d'enregistrement et système de montage de composant

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WO2019162985A1 true WO2019162985A1 (fr) 2019-08-29

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WO2024057434A1 (fr) * 2022-09-14 2024-03-21 ヤマハ発動機株式会社 Dispositif de gestion de condition de fonctionnement de montage, machine de montage de composant, procédé de gestion de condition de fonctionnement de montage, programme de gestion de condition de fonctionnement de montage et support d'enregistrement

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JPH0383400A (ja) * 1989-08-28 1991-04-09 Matsushita Electric Works Ltd 自動部品実装装置
JP2001237599A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2007110003A (ja) * 2005-10-17 2007-04-26 Yamaha Motor Co Ltd 表面実装機および実装方法
JP2010073828A (ja) * 2008-09-17 2010-04-02 Hitachi High-Tech Instruments Co Ltd 電子部品の装着方法
JP2011054711A (ja) * 2009-09-01 2011-03-17 Panasonic Corp 電子部品実装装置
JP2012064613A (ja) * 2010-09-14 2012-03-29 Panasonic Corp 電子部品実装装置及び電子部品実装方法
JP2013214781A (ja) * 2013-07-23 2013-10-17 Panasonic Corp 電子部品実装方法

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EP2073620A1 (fr) * 2007-12-18 2009-06-24 Siemens Aktiengesellschaft Dispositif de transport de substrat pour un automate d'implantation
JP4883071B2 (ja) * 2008-10-03 2012-02-22 パナソニック株式会社 電子部品実装システム

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JPH0383400A (ja) * 1989-08-28 1991-04-09 Matsushita Electric Works Ltd 自動部品実装装置
JP2001237599A (ja) * 2000-02-24 2001-08-31 Matsushita Electric Ind Co Ltd 電子部品実装方法
JP2007110003A (ja) * 2005-10-17 2007-04-26 Yamaha Motor Co Ltd 表面実装機および実装方法
JP2010073828A (ja) * 2008-09-17 2010-04-02 Hitachi High-Tech Instruments Co Ltd 電子部品の装着方法
JP2011054711A (ja) * 2009-09-01 2011-03-17 Panasonic Corp 電子部品実装装置
JP2012064613A (ja) * 2010-09-14 2012-03-29 Panasonic Corp 電子部品実装装置及び電子部品実装方法
JP2013214781A (ja) * 2013-07-23 2013-10-17 Panasonic Corp 電子部品実装方法

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