WO2019238544A3 - Carte de circuit imprimé, transformateur et agencement comprenant une carte de circuit imprimé ou un transformateur - Google Patents

Carte de circuit imprimé, transformateur et agencement comprenant une carte de circuit imprimé ou un transformateur Download PDF

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Publication number
WO2019238544A3
WO2019238544A3 PCT/EP2019/064895 EP2019064895W WO2019238544A3 WO 2019238544 A3 WO2019238544 A3 WO 2019238544A3 EP 2019064895 W EP2019064895 W EP 2019064895W WO 2019238544 A3 WO2019238544 A3 WO 2019238544A3
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
terminals
transformer
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/064895
Other languages
German (de)
English (en)
Other versions
WO2019238544A2 (fr
Inventor
Johannes Dehn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Trumpf Huettinger GmbH and Co KG
Original Assignee
Trumpf Huettinger GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102018209371.7A external-priority patent/DE102018209371B4/de
Priority claimed from DE202018107224.2U external-priority patent/DE202018107224U1/de
Priority claimed from DE202018107223.4U external-priority patent/DE202018107223U1/de
Priority claimed from DE202018107226.9U external-priority patent/DE202018107226U1/de
Application filed by Trumpf Huettinger GmbH and Co KG filed Critical Trumpf Huettinger GmbH and Co KG
Publication of WO2019238544A2 publication Critical patent/WO2019238544A2/fr
Publication of WO2019238544A3 publication Critical patent/WO2019238544A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2847—Sheets; Strips
    • H01F27/2852—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Dans une carte de circuit imprimé comportant un composant à courant alternatif qui est relié à un agencement de bornes par le biais d'une première ligne et d'une deuxième ligne, les première et deuxième lignes s'étendant au moins partiellement en parallèle et étant espacées dans la direction de la hauteur de la carte de circuit imprimé, et l'ensemble de bornes comportant une première borne reliée électriquement à la première ligne et une deuxième borne reliée électriquement à la deuxième ligne, lesquelles bornes sont espacées dans la direction de la hauteur de la carte de circuit imprimé, l'une des bornes est disposée sur une face supérieure et l'une des bornes sur une face inférieure de la carte de circuit imprimé. Les bornes sont conçues pour être en contact avec deux portions de conducteur plat guidées parallèlement et les bornes sont conçues de telle sorte que les portions de conducteur plat puissent être raccordées aux bornes de sorte que le rapport de l'espacement des portions de conducteur plat au niveau des bornes à l'espacement des lignes soit inférieur à dix.
PCT/EP2019/064895 2018-06-12 2019-06-06 Carte de circuit imprimé, transformateur et agencement comprenant une carte de circuit imprimé ou un transformateur Ceased WO2019238544A2 (fr)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
DE102018209371.7 2018-06-12
DE102018209371.7A DE102018209371B4 (de) 2018-06-12 2018-06-12 Anordnung mit einer Leiterkarte und einem Transformator sowie Verwendung einer solchen Anordnung
DE202018107226.9 2018-12-18
DE202018107223.4 2018-12-18
DE202018107224.2U DE202018107224U1 (de) 2018-12-18 2018-12-18 Leistungswandler zum bidirektionalen Wandeln von elektrischer Leistung
DE202018107223.4U DE202018107223U1 (de) 2018-12-18 2018-12-18 Leistungswandlereinheit
DE202018107224.2 2018-12-18
DE202018107226.9U DE202018107226U1 (de) 2018-12-18 2018-12-18 Leiterkarte mit mehreren Datenleitungen

Publications (2)

Publication Number Publication Date
WO2019238544A2 WO2019238544A2 (fr) 2019-12-19
WO2019238544A3 true WO2019238544A3 (fr) 2020-04-23

Family

ID=67137887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/064895 Ceased WO2019238544A2 (fr) 2018-06-12 2019-06-06 Carte de circuit imprimé, transformateur et agencement comprenant une carte de circuit imprimé ou un transformateur

Country Status (1)

Country Link
WO (1) WO2019238544A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3826967A (en) * 1973-05-29 1974-07-30 Pioneer Magnetics Inc Low leakage secondary circuit for a power transformer including conductive strips forming the secondary and connections for rectifying diodes
JPH08264342A (ja) * 1995-03-17 1996-10-11 Omron Corp コイル装置
US20040074669A1 (en) * 2001-12-06 2004-04-22 Mitsunori Nagashima Circuit board and method of making circuit board
US20080272874A1 (en) * 2007-05-01 2008-11-06 Zippy Technology Corp. Winding structure of transformer
WO2017099508A1 (fr) * 2015-12-11 2017-06-15 엘지이노텍 주식회사 Dispositif de capteur pour la détection de pression
US20170287627A1 (en) * 2016-03-29 2017-10-05 Eaton Corporation Current transformer apparatus that is mountable to a circuit board

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018107224U1 (de) 2018-12-18 2019-01-17 TRUMPF Hüttinger GmbH + Co. KG Leistungswandler zum bidirektionalen Wandeln von elektrischer Leistung
DE202018107226U1 (de) 2018-12-18 2019-02-25 TRUMPF Hüttinger GmbH + Co. KG Leiterkarte mit mehreren Datenleitungen
DE202018107223U1 (de) 2018-12-18 2019-03-01 TRUMPF Hüttinger GmbH + Co. KG Leistungswandlereinheit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3826967A (en) * 1973-05-29 1974-07-30 Pioneer Magnetics Inc Low leakage secondary circuit for a power transformer including conductive strips forming the secondary and connections for rectifying diodes
JPH08264342A (ja) * 1995-03-17 1996-10-11 Omron Corp コイル装置
US20040074669A1 (en) * 2001-12-06 2004-04-22 Mitsunori Nagashima Circuit board and method of making circuit board
US20080272874A1 (en) * 2007-05-01 2008-11-06 Zippy Technology Corp. Winding structure of transformer
WO2017099508A1 (fr) * 2015-12-11 2017-06-15 엘지이노텍 주식회사 Dispositif de capteur pour la détection de pression
US20180364112A1 (en) * 2015-12-11 2018-12-20 Lg Innotek Co., Ltd. Sensor device for detecting pressure
US20170287627A1 (en) * 2016-03-29 2017-10-05 Eaton Corporation Current transformer apparatus that is mountable to a circuit board

Also Published As

Publication number Publication date
WO2019238544A2 (fr) 2019-12-19

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