WO2020003881A1 - Procédé de production d'un corps moulé ayant un motif métallique - Google Patents

Procédé de production d'un corps moulé ayant un motif métallique Download PDF

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Publication number
WO2020003881A1
WO2020003881A1 PCT/JP2019/021515 JP2019021515W WO2020003881A1 WO 2020003881 A1 WO2020003881 A1 WO 2020003881A1 JP 2019021515 W JP2019021515 W JP 2019021515W WO 2020003881 A1 WO2020003881 A1 WO 2020003881A1
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WO
WIPO (PCT)
Prior art keywords
metal
layer
group
plating
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2019/021515
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English (en)
Japanese (ja)
Inventor
深澤　憲正
聡健 古谷
亘 冨士川
白髪　潤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
DIC Corp
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DIC Corp, Dainippon Ink and Chemicals Co Ltd filed Critical DIC Corp
Priority to JP2019556384A priority Critical patent/JPWO2020003881A1/ja
Publication of WO2020003881A1 publication Critical patent/WO2020003881A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • the adhesion between the substrate and the plating film is ensured by roughening the surface of the molded body.
  • a base material whose surface is difficult to roughen such as a low base or a too high chemical resistance.
  • the surface of the plating film is easily roughened by reflecting the roughened surface of the molded body because the surface of the molded body is roughened. Since it is necessary to increase the film thickness and lengthen the plating time, not only the productivity is reduced and the cost is increased, but also the weight of the molded body is increased.
  • the electroless plating layer is removed by laser beam irradiation. However, in order to cut and remove a continuous film of metal, burrs are generated at the peripheral portion of the removal region, or the pattern peripheral portion due to thermal damage is removed. There has been a problem that the pattern is disturbed due to swelling.
  • the present inventors have conducted intensive studies to solve the above-described problems, and as a result, formed a metal layer containing metal particles on the surface of the molded body, and by removing the unnecessary portion of the metal layer of the metal layer, containing the metal particles
  • a metal pattern having high adhesion is formed on various compacts without performing a roughening process and without requiring a special device.
  • the inventors have found that the present invention can be performed and completed the present invention.
  • the present invention provides a step 1 ′ of forming a primer layer (B) on the insulating molded article (A), and then forming a metal layer (M1) containing metal particles on the primer layer (B). Forming a patterned metal layer (PM1) by removing a part of the metal layer (M1); and forming a metal plating layer (PM1) on the patterned metal layer (PM1) by a plating method. It is intended to provide a method for producing a molded article having a metal pattern, which has a step 3 of forming PM2).
  • the heat resistance, mechanical strength, and insulating properties of the insulating molded body (A) are used.
  • a light absorbing pigment such as a cyanine compound, a phthalocyanine compound, a dithiol metal complex, a naphthoquinone compound, a diimmonium compound, an azo compound
  • a dye may be contained as a light absorber in the insulating molded article (A). These pigments and dyes may be appropriately selected according to the wavelength of the electromagnetic wave to be used.
  • Specific coating methods include, for example, a gravure method, an offset method, a flexo method, a pad printing method, a gravure offset method, a letterpress method, a letterpress inversion method, a screen method, a microcontact method, a reverse method, an air doctor coater method, Blade coater method, air knife coater method, squeeze coater method, impregnation coater method, transfer roll coater method, kiss coater method, cast coater method, spray coater method, inkjet method, die coater method, spin coater method, bar coater method, dip coater method And the like.
  • aging or annealing is further performed, if necessary, for the purpose of improving the adhesion to the metal plating layer (PM2) described later. You may.
  • the temperature and time of aging or annealing may be appropriately selected depending on the heat-resistant temperature of the insulating molded article (A) to be used, the required steps, productivity, and the like.
  • the insulating molded body (A) on which the metal layer (M1) is formed is performed at a temperature range of 60 to 200 ° C. for 30 minutes to 2 weeks.
  • the step 3 described below when performing the electroplating, it is preferable to perform the electroplating in a temperature range of 80 to 250 ° C. for 5 minutes to 1 hour.
  • the above-mentioned drying and aging or annealing are carried out in the case where the insulating molded body (A) is a single-sheet film, sheet, plate, or a three-dimensional three-dimensional molded body. In addition, it can be performed in a dryer such as a blower or a constant temperature dryer.
  • a dryer such as a blower or a constant temperature dryer.
  • drying is performed by continuously moving the roll material in the installed non-heated or heated space following the coating step. It can be performed.
  • the average particle diameter is preferably in the range of 1 to 20,000 nm. Further, when a fine metal pattern is formed, the homogeneity of the metal layer (M1) is further improved, and the removability by the electromagnetic wave in the step 2 described later can be further improved, so that the average particle diameter is 1 to 200 nm. Are more preferable, and those in the range of 1 to 50 nm are more preferable.
  • the “average particle size” for the nanometer-sized particles is a volume average value obtained by diluting the silver particles with a good dispersion solvent and measuring the diluted silver particles by a dynamic light scattering method. For this measurement, “Nanotrack UPA-150” manufactured by Microtrack can be used.
  • the metal particle dispersion used for forming the metal layer (M1) is obtained by dispersing metal particles in various solvents.
  • the particle size distribution of the metal particles in the dispersion is monodisperse. And a mixture of particles having the above average particle diameter range.
  • the solvent is such that the metal particles are stably dispersed and the metal layer (M1) is formed on the insulating molded article (A) or a primer layer (B) formed on the insulating molded article (A) described later. ) Is not particularly limited as long as it forms satisfactorily.
  • the solvents may be used alone or in combination of two or more.
  • preservative general preservatives can be used, for example, isothiazoline preservative, triazine preservative, imidazole preservative, pyridine preservative, azole preservative, pyrithion preservative, etc. Is mentioned.
  • the insulating molded article (A) is subjected to a surface treatment before the primer coating (step 1 ′) for the purpose of improving the coatability of the primer and the adhesion of the metal plating layer (PM2) to the base material. May be performed.
  • the surface treatment method of the insulating molded body (A) is the same as the surface treatment method in the case of forming the metal plating layer (PM2) containing silver particles on the insulating molded body (A). Can be formed.
  • silsesquioxane compound can also be used as a compound forming the primer layer (B).
  • a resin that generates a reducing compound by heating is preferable because the adhesion of the metal plating layer (PM2) to the insulating molded body (A) can be further improved.
  • the reducing compound include a phenol compound, an aromatic amine compound, a sulfur compound, a phosphoric acid compound, and an aldehyde compound. Among these reducing compounds, phenol compounds and aldehyde compounds are preferred.
  • a resin that generates a reducing compound by heating is used as a primer, a reducing compound such as formaldehyde and phenol is generated in a heating and drying step when forming the primer layer (B).
  • a resin that generates a reducing compound by heating include, for example, a resin obtained by polymerizing a monomer containing N-alkylol (meth) acrylamide, and a resin containing a urethane resin as a shell and containing N-alkylol (meth) acrylamide.
  • a core-shell type composite resin having a core of a resin obtained by polymerizing a monomer containing N-alkylol (meth) acrylamide with a shell of a urethane resin, a melamine resin, and a phenol Blocked isocyanates are preferred.
  • the functional group preferably has 1 to 10 functional groups in one molecule of the blocked isocyanate, more preferably 2 to 5 functional groups.
  • the blocked isocyanate those having an aromatic ring are preferable from the viewpoint of further improving the adhesion.
  • the aromatic ring include a phenyl group and a naphthyl group.
  • the blocked isocyanate can be produced by reacting a part or all of the isocyanate groups of the isocyanate compound with a blocking agent.
  • isocyanate compound examples include those obtained by reacting the above-exemplified polyisocyanate compound with a compound having a hydroxyl group or an amino group.
  • polyisocyanate compound having an aromatic ring When introducing an aromatic ring into the blocked isocyanate, it is preferable to use a polyisocyanate compound having an aromatic ring.
  • polyisocyanate compounds having an aromatic ring 4,4'-diphenylmethane diisocyanate, tolylene diisocyanate, isocyanurate of 4,4'-diphenylmethane diisocyanate and isocyanurate of tolylene diisocyanate are preferred.
  • crosslinking agent examples include a metal chelate compound, a polyamine compound, an aziridine compound, a metal salt compound, and an isocyanate compound.
  • a thermal crosslinking agent that reacts at a relatively low temperature of about 25 to 100 ° C. to form a crosslinked structure; Thermal crosslinking agents, such as melamine compounds, epoxy compounds, oxazoline compounds, carbodiimide compounds, and blocked isocyanate compounds, which react at a relatively high temperature of 100 ° C. or more to form a crosslinked structure, and various photocrosslinking agents.
  • the amount of the cross-linking agent used varies depending on the type, from the viewpoint of improving the adhesion of the metal plating layer (PM2) on the insulating molded body (A), the amount of the cross-linking agent is 100 parts by mass in total of the resin contained in the primer. On the other hand, the range is preferably 0.01 to 60 parts by mass, more preferably 0.1 to 10 parts by mass, and still more preferably 0.1 to 5 parts by mass.
  • a molded circuit component having a high-density, high-performance printed wiring board and three-dimensional wiring on a base material of various materials, various shapes and sizes, for which surface roughening treatment is difficult.
  • Molded Interconnect Device can be provided at low cost, and thus has high industrial applicability in the field of printed wiring.
  • the remaining monomer pre-emulsion 114 parts by mass
  • 30 parts by mass of an aqueous solution of potassium persulfate (1.0% by mass of the active ingredient) were separately dropped.
  • the solution was added dropwise over 180 minutes. After completion of the dropwise addition, the mixture was stirred at the same temperature for 60 minutes.
  • a laser writing apparatus (“MD-V9900A” manufactured by Keyence Corporation; YVO4 laser, wavelength 1,064 nm), a laser intensity of 50%, a writing speed of 500 mm / sec, and a frequency of 100 kHz were formed on a metal layer containing silver particles.
  • Laser irradiation was performed to remove the metal layer containing silver particles in the irradiated area, thereby forming a patterned metal layer (3 / FIG. 2) having an L / S of 500/500 ⁇ m.
  • Example 4 The primer (B-1) obtained in Production Example 1 was coated on the surface of a polyimide film (“Kapton 150EN-C” manufactured by Du Pont-Toray Co., Ltd .; thickness: 38 ⁇ m) with a desktop small coater (RK Printcoat Instrument Co., Ltd.). ("K printing profiler") manufactured by Co., Ltd.) so that the thickness after drying was 100 nm. Next, a primer layer was formed on the surface of the polyimide film by drying at 80 ° C. for 5 minutes using a hot air dryer.
  • PC transparent polycarbonate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de production d'un corps moulé ayant un motif métallique, qui est caractérisé en ce qu'il comprend : une étape 1 pour former une couche métallique (M1), qui contient des particules métalliques, sur un corps moulé isolant (A) ; une étape 2 de formation d'une couche métallique à motifs (PM1) par retrait d'une partie de la couche métallique (M1) ; et une étape 3 pour former une couche de placage métallique (PM2) sur la couche métallique à motifs (PM1) au moyen d'un procédé de placage. En variante, la présente invention concerne un procédé de production dans lequel une couche d'apprêt (B) est formée avant la formation de la couche métallique (M1), qui contient des particules métalliques, sur le corps moulé isolant (A). Le présent procédé de production est capable de former un motif métallique ayant une adhérence élevée sans rendre rugueuse la surface du corps moulé, et est également capable de produire un corps moulé qui a un motif métallique sur la surface sans nécessiter un appareil à vide ou un dispositif spécial.
PCT/JP2019/021515 2018-06-26 2019-05-30 Procédé de production d'un corps moulé ayant un motif métallique Ceased WO2020003881A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019556384A JPWO2020003881A1 (ja) 2018-06-26 2019-05-30 金属パターンを有する成形体の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-120978 2018-06-26
JP2018120978 2018-06-26

Publications (1)

Publication Number Publication Date
WO2020003881A1 true WO2020003881A1 (fr) 2020-01-02

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PCT/JP2019/021515 Ceased WO2020003881A1 (fr) 2018-06-26 2019-05-30 Procédé de production d'un corps moulé ayant un motif métallique

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JP (1) JPWO2020003881A1 (fr)
TW (1) TW202020222A (fr)
WO (1) WO2020003881A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022097483A1 (fr) * 2020-11-05 2022-05-12 Dic株式会社 Corps multicouche pour procédé semi-additif et carte de circuit imprimé utilisant ce dernier

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7627102B2 (ja) * 2020-10-14 2025-02-05 日東電工株式会社 積層体、タッチセンサ、調光素子、光電変換素子、熱線制御部材、アンテナ、電磁波シールド部材、画像表示装置および積層体の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766533A (ja) * 1993-08-26 1995-03-10 Matsushita Electric Works Ltd 回路板の製造方法
JPH08307038A (ja) * 1995-02-14 1996-11-22 Lpkf Cad Cam Syst Gmbh 基板表面にパターン化された金属被覆を形成する方法
WO2013146195A1 (fr) * 2012-03-28 2013-10-03 Dic株式会社 Motif électroconducteur, circuit électrique, blindage contre les ondes électromagnétiques et procédé de fabrication d'un motif électroconducteur

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0766533A (ja) * 1993-08-26 1995-03-10 Matsushita Electric Works Ltd 回路板の製造方法
JPH08307038A (ja) * 1995-02-14 1996-11-22 Lpkf Cad Cam Syst Gmbh 基板表面にパターン化された金属被覆を形成する方法
WO2013146195A1 (fr) * 2012-03-28 2013-10-03 Dic株式会社 Motif électroconducteur, circuit électrique, blindage contre les ondes électromagnétiques et procédé de fabrication d'un motif électroconducteur

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022097483A1 (fr) * 2020-11-05 2022-05-12 Dic株式会社 Corps multicouche pour procédé semi-additif et carte de circuit imprimé utilisant ce dernier
JPWO2022097483A1 (fr) * 2020-11-05 2022-05-12
JP7260065B2 (ja) 2020-11-05 2023-04-18 Dic株式会社 セミアディティブ工法用積層体及びそれを用いたプリント配線板

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Publication number Publication date
JPWO2020003881A1 (ja) 2020-07-02
TW202020222A (zh) 2020-06-01

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