WO2020007712A1 - Système pourvu d'un boîtier et d'un circuit d'électronique de puissance agencé dans ce dernier sur un fond de boîtier - Google Patents

Système pourvu d'un boîtier et d'un circuit d'électronique de puissance agencé dans ce dernier sur un fond de boîtier Download PDF

Info

Publication number
WO2020007712A1
WO2020007712A1 PCT/EP2019/067213 EP2019067213W WO2020007712A1 WO 2020007712 A1 WO2020007712 A1 WO 2020007712A1 EP 2019067213 W EP2019067213 W EP 2019067213W WO 2020007712 A1 WO2020007712 A1 WO 2020007712A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
power electronics
electronics circuit
electric motor
housing base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/067213
Other languages
German (de)
English (en)
Inventor
Mircea Birdeanu
Sorin Andrei
Andrei-Radu Negrila
Sebastian Taubert
Eduard Iosif Trif
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies GmbH
Original Assignee
Vitesco Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies GmbH filed Critical Vitesco Technologies GmbH
Publication of WO2020007712A1 publication Critical patent/WO2020007712A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change

Definitions

  • Coolant to be cooled is very complex.
  • a cavity is formed at least in the housing base with connections leading to the housing exterior for supplying and discharging a cooling liquid, cooling fins being formed on the side of the housing base facing away from the cavity , and in which a fan driven by an electric motor is arranged in such a way that its Air flow is cooled by the cooling fins and then the power electronics circuit is heated.
  • the power electronics circuit is thus arranged on the housing base, which acts as a cold distributor and thus not only cools not only the cooling fins but also the components of the power electronics circuit arranged on it.
  • a fan ensures air circulation through the cooling fins and to the power electronics circuit. The fan is driven by an electric motor and is therefore independent of a coolant flow.
  • the electric motor is arranged in the housing.
  • the electric motor is arranged outside the housing, which makes it possible to replace the electric motor without having to open the housing.
  • the electric motor can advantageously be arranged on a housing wall.
  • Fig. 2 shows a second variant of an arrangement according to the invention
  • Fig. 3 shows a detail and cross section through an inventive
  • FIG. 1 The arrangement according to the embodiment of FIG. 1 has a housing 1, which is shown in the open state, that is to say without a cover is, which has a housing base 2 and housing walls 3. Electrical and electronic components such as capacitors 5, power semiconductor switching elements 6 and coils 7 are arranged on a printed circuit board 4.
  • This power electronics circuit can, for example, be a charging circuit for the conductive or inductive charging of
  • Energy storage e.g. be in a motor vehicle.
  • the Lei terplatte 4 is arranged on the housing base 2.
  • a cavity 8 is formed, which is connected to a coolant inlet 9 leading to the housing exterior and a coolant outlet 10. In this way, the housing base 2 and thus the power electronics circuit arranged on it are cooled or heated.
  • cooling fins 11 are arranged above the cavity, which are perpendicular to the housing base 2 in the illustrated embodiment and protrude into the housing 1.
  • the fan 12 is designed with an integrated electric motor, so that the electric motor is also arranged inside the housing 1. This has the advantage that there is no clutch between the drive of the fan
  • Blown power electronics circuit so that they are cooled or cooled in a geous manner.
  • FIG. 2 of an inventive arrangement with a housing and a power electronics circuit arranged therein on a housing base is essentially the same as the variant of FIG. 1, so that the same parts are provided with the same reference numerals and are not described again. In contrast to the first variant, this is the one
  • This second variant has the advantage that the housing 1 does not have to be opened when the electric motor 14 is replaced.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Cooling System (AREA)

Abstract

L'invention concerne un système pourvu d'un boîtier (1) et d'un circuit (5, 6, 7) d'électronique de puissance agencé dans ce dernier sur un fond (2) de boîtier, un espace creux (8) pourvu de raccords (9, 10) conduisant vers l'extérieur du boîtier destinés à introduire et à évacuer un liquide de refroidissement étant réalisé au moins dans le fond (2) de boîtier, des nervures de refroidissement (11) étant réalisées sur le côté du fond (2) de boîtier détourné de l'espace creux (8), un ventilateur (12 ; 13) entraîné par un moteur électrique (14) étant agencé dans le boîtier (1) de telle sorte que son flux d'air est refroidi par les nervures de refroidissement (11) et dissipe ensuite la chaleur du circuit (5, 6, 7) d'électronique de puissance.
PCT/EP2019/067213 2018-07-05 2019-06-27 Système pourvu d'un boîtier et d'un circuit d'électronique de puissance agencé dans ce dernier sur un fond de boîtier Ceased WO2020007712A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018211128.6 2018-07-05
DE102018211128.6A DE102018211128B3 (de) 2018-07-05 2018-07-05 Anordnung mit einem Gehäuse und einer darin auf einem Gehäuseboden angeordneten Leistungselektronikschaltung

Publications (1)

Publication Number Publication Date
WO2020007712A1 true WO2020007712A1 (fr) 2020-01-09

Family

ID=67137938

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/067213 Ceased WO2020007712A1 (fr) 2018-07-05 2019-06-27 Système pourvu d'un boîtier et d'un circuit d'électronique de puissance agencé dans ce dernier sur un fond de boîtier

Country Status (2)

Country Link
DE (1) DE102018211128B3 (fr)
WO (1) WO2020007712A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021097344A1 (fr) * 2019-11-13 2021-05-20 Amgen Inc. Procédé de réduction de la formation d'agrégats dans le traitement en aval de molécules de liaison à l'antigène bispécifiques

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114096115B (zh) * 2021-10-15 2024-11-29 华为数字能源技术有限公司 电源壳体、电源变换装置及电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911653A (ja) * 1982-07-12 1984-01-21 Toshiba Corp 冷却装置
US6262891B1 (en) * 1996-12-20 2001-07-17 Magnet-Motor Gesellschaft Für Magnetmotorische Technik Mbh Component holder with circulating air cooling of electrical components
JP3348552B2 (ja) * 1994-12-28 2002-11-20 富士電機株式会社 電子機器の冷却装置
US20060087810A1 (en) * 2004-10-25 2006-04-27 Uwe Rockenfeller Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
DE102007061593A1 (de) 2007-12-20 2009-07-09 Siemens Ag Elektronikeinrichtung eines Magnetresonanzgeräts sowie Magnetresonanzgerät mit einer solchen Elektronikeinrichtung
US20120315165A1 (en) * 2009-06-09 2012-12-13 Thomas Dreifert Vacuum pump
ITBO20130419A1 (it) * 2013-07-31 2015-02-01 Elenos S R L Dispositivo per il raffreddamento dei componenti in aria di un'apparecchiatura di potenza

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5783212B2 (ja) * 2013-09-06 2015-09-24 Tdk株式会社 電源装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911653A (ja) * 1982-07-12 1984-01-21 Toshiba Corp 冷却装置
JP3348552B2 (ja) * 1994-12-28 2002-11-20 富士電機株式会社 電子機器の冷却装置
US6262891B1 (en) * 1996-12-20 2001-07-17 Magnet-Motor Gesellschaft Für Magnetmotorische Technik Mbh Component holder with circulating air cooling of electrical components
US20060087810A1 (en) * 2004-10-25 2006-04-27 Uwe Rockenfeller Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection
DE102007061593A1 (de) 2007-12-20 2009-07-09 Siemens Ag Elektronikeinrichtung eines Magnetresonanzgeräts sowie Magnetresonanzgerät mit einer solchen Elektronikeinrichtung
US20120315165A1 (en) * 2009-06-09 2012-12-13 Thomas Dreifert Vacuum pump
ITBO20130419A1 (it) * 2013-07-31 2015-02-01 Elenos S R L Dispositivo per il raffreddamento dei componenti in aria di un'apparecchiatura di potenza

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021097344A1 (fr) * 2019-11-13 2021-05-20 Amgen Inc. Procédé de réduction de la formation d'agrégats dans le traitement en aval de molécules de liaison à l'antigène bispécifiques

Also Published As

Publication number Publication date
DE102018211128B3 (de) 2019-11-28

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