WO2020011348A1 - Dispositif de rayonnement à multiple éléments et antenne - Google Patents

Dispositif de rayonnement à multiple éléments et antenne Download PDF

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Publication number
WO2020011348A1
WO2020011348A1 PCT/EP2018/068805 EP2018068805W WO2020011348A1 WO 2020011348 A1 WO2020011348 A1 WO 2020011348A1 EP 2018068805 W EP2018068805 W EP 2018068805W WO 2020011348 A1 WO2020011348 A1 WO 2020011348A1
Authority
WO
WIPO (PCT)
Prior art keywords
radiating
frequency
low
frequency radiating
upper element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/068805
Other languages
English (en)
Inventor
Ignacio Gonzalez
Ajay Babu GUNTUPALLI
Bruno BISCONTINI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to PCT/EP2018/068805 priority Critical patent/WO2020011348A1/fr
Publication of WO2020011348A1 publication Critical patent/WO2020011348A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
    • H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/378—Combination of fed elements with parasitic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the present invention is situated in the technical field of base station antennas for mobile communications.
  • the invention particularly presents a radiating device for such an antenna, and an antenna including at least one such radiating device.
  • the radiating device of the invention is a multi-element radiating device, specifically a radiating device including at least one low-frequency radiating element and at least one high-frequency radiating element. These at least two different-frequency radiating elements are integrated with each other in the radiating device.
  • the present invention aims to improve radiating devices and antennas for mobile communications.
  • the present invention has the object to provide a radiating device for an antenna that integrates different types of radiating elements, particularly elements for operating in different frequency bands.
  • the radiating device should facilitate the integration of a mMIMO antenna array and a traditional (e.g. passive) antenna array in a new kind of antenna.
  • the invention aims particularly for a radiating device that integrates one or more high-frequency elements with a low-frequency element.
  • the radiating device and antenna of the invention should respectively enable flexible configuration, easy assembly, and the possibility to decompose into sub- components.
  • the radiating device and antenna of the invention should also respect tight limits on the antenna dimensions, and should allow reuse of mechanical support structures in-site. Additionally, an increased number of ports is desired.
  • a particular challenge for the integration of one or more high-frequency radiating elements with a low-frequency radiating element is to not disturb the cross polar discrimination and isolation symmetry of the low-frequency radiating element.
  • the present invention proposes a new radiating device that combines a low- frequency radiating element with one or more high-frequency radiating elements in an embedded configuration and with minimum space requirement.
  • the invention proposes a grounded director for the low-frequency radiating element, which is designed and used such that an arbitrary configuration of one or more high-frequency radiating elements can be placed on it.
  • a first aspect of the invention provides a radiating device comprising: a low-frequency radiating element, an upper element not connected directly to the low-frequency radiating element but having a common ground with the low-frequency radiating element, a high- frequency radiating element arranged on top of the upper element, wherein the upper element serves as a grounded director for the low-frequency radiating element, and serves as a ground plane for the high-frequency radiating element.
  • the low-frequency radiating element particularly has a first operating bandwidth.
  • the high-frequency radiating element particularly has a second operating bandwidth with a center frequency higher than the center frequency of the first operating bandwidth.
  • the upper element serves particularly as a reflector for the high-frequency radiating element. Further, it may particularly be arranged above the lower frequency radiating element. Since the upper element serves both as a director for the low-frequency radiating element and as a ground plane for the at least one high-frequency element, the integration of the multi-band radiating device becomes very compact.
  • the radiating device of the first aspect allows integrating one or multiple high-frequency radiating elements with a low-frequency radiating element, without disturbing the cross polar discrimination and isolation symmetry of the low-frequency radiating element.
  • the radiating device further enables a new multi-band antenna design (e.g. an antenna including a plurality of the radiating devices) that integrates a mMIMO antenna array with a traditional (e.g. passive) antenna array in the same physical space as needed for a conventional single-band antenna.
  • the dimensions of the new antenna will facilitate site acquisition and upgrade, and will also allow reusing mechanical support structures, since the wind load of the new antenna can be equivalent to previously installed antennas.
  • the radiating device of the first aspect provides great flexibility in configuring the high-frequency radiating elements that are integrated with the low-frequency radiating element.
  • the assembly of the radiating device as a whole, and also of an antenna including at least one such radiating device, is fairly easy.
  • any new antenna based on the radiating device may be suitable for site-sharing, thus reducing significantly the operational costs of network operators.
  • the upper element is electrically symmetric for the low-frequency radiating element.
  • an electrically symmetric upper element is not necessarily symmetric in its physical dimensions, it is electrically designed such that the radiating low-frequency radiating element experiences it as being symmetric. That is, the upper element behaves like a symmetric element with respect to the operating low-frequency radiating element. This provides the freedom to place one or more high-frequency elements at arbitrary positions on the upper element.
  • the upper element comprises a signal line for feeding the high-frequency radiating element.
  • the radiating device can be built very compact.
  • the upper element may be used to route the signals for the one or more high-frequency radiating elements in a strip-line configuration or the like.
  • the radiating device further comprises a lower element that serves as a ground plane for the low-frequency radiating element, wherein the upper element is connected to the low-frequency radiating element indirectly through the lower element.
  • the lower element is arranged beneath the low-frequency radiating element.
  • the lower element may serve particularly as a reflector for the low-frequency radiating element. The lower element provides the common ground for the low-frequency radiating element and the upper element.
  • the lower element comprises a signal line for feeding the low-frequency radiating element.
  • the radiating device further comprises an interconnecting element for grounding the upper element by connecting it to the lower element.
  • the interconnecting element allows connecting the upper element and the low-frequency radiating element to the common ground via the lower element, without a direct connection.
  • the interconnecting element carries a signal line for feeding the high-frequency radiating element.
  • the interconnecting element used for making the ground connection of the upper element can also be used as support to bring the signals of the high-frequency radiating elements to its feeding plane.
  • Signal lines for these signals for feeding the high-frequency radiating elements on the interconnecting element can be connected to e.g. the above- described strip-lines for route the signals to the high-frequency radiating elements on the upper element.
  • the signal line for feeding the high- frequency radiating element is routed from the lower element through an aperture of the low-frequency radiating element via the upper element to the high-frequency radiating element.
  • the radiating device can be built with a very small form factor.
  • the aperture is a feeding slot of the low-frequency radiating element.
  • the interconnecting element is connected to the upper element in a grounding point, which grounding point is located in an area of the feeding slot of the low-frequency radiating element.
  • the feeding slot can be used to ground the upper element to the lower element without making a direct connection to the low-frequency radiating element.
  • the interconnecting element is connected to the upper element in a grounding point, which grounding point is located in a central area of the upper element.
  • the dimensions of the radiating device can be minimized.
  • the upper element in this implementation has a long electric length to work as a director for the low-frequency radiating element. Also the intrusion in terms of isolation and cross-polarization for the performance of the low-frequency radiating element is advantageously low.
  • a distance between the low-frequency radiating element and the upper element is between 0.02 l and 0.5 l, wherein l corresponds to the highest radiating frequency of an operating bandwidth of the low-frequency radiating element.
  • the above parameters lead to a very small form factor of the radiating device, while not compromising on its performance. Further, in this way the upper element is able to serve efficiently as a grounded director for the low-frequency radiating element.
  • the upper element comprises a conductive cavity, in which the high-frequency radiating element is arranged.
  • the conductive cavity is particularly a metalized or metallic cavity. This supports arbitrary placement on the high-frequency radiating element(s) on the upper element.
  • the low-frequency radiating element consists of a single bended metal sheet.
  • a plurality of said high-frequency radiating elements are arranged on top of the upper element.
  • the plurality of high-frequency radiating elements are further particularly arranged symmetrically and orthogonally from a center of the upper element. Thus, a good performance of the radiating device is achieved.
  • a second aspect of the invention provides an antenna comprising at least one radiating device according to the first aspect or any of its implementation forms.
  • the antenna of the second aspect using the radiating device of the first aspect enjoys all the above-mentioned advantages.
  • the antenna can integrate a mMIMO antenna array with a traditional (e.g. passive) antenna array.
  • the antenna can be built with compact dimensions that allow integrating it onto existing sites.
  • FIG. 1 shows a radiating device according to an embodiment of the invention.
  • FIG. 2 shows a radiating device according to an embodiment of the invention.
  • FIG. 3 shows a radiating device according to an embodiment of the invention.
  • FIG. 4 shows a radiating device according to an embodiment of the invention.
  • FIG. 5 shows different placements of high-frequency radiating elements on the upper element of a radiating device according to an embodiment of the invention.
  • FIG. 6 shows signal lines for feeding high-frequency elements on the upper element of a radiating device according to an embodiment of the invention.
  • FIG. 7 shows grounding points at the upper element of a radiating device according to an embodiment of the invention.
  • FIG. 8 shows an upper element and an interconnecting element of a radiating device according to an embodiment of the invention.
  • FIG. 9 shows an antenna according to an embodiment of the invention, wherein the antenna includes multiple radiating devices according to an embodiment of the invention.
  • FIG. 1 shows a radiating device 100 according to an embodiment of the invention.
  • the radiating device 100 may particularly be a multi-band radiating device, i.e. one that integrates radiating elements operating in different frequency bands.
  • the radiating device 100 may particularly be a multi-band radiating device, i.e. one that integrates radiating elements operating in different frequency bands.
  • a (multi-band) antenna that integrates different antenna arrays, e.g. a mMIMO antenna array and a traditional (e.g. passive) antenna array.
  • the radiating device 100 of FIG. 1 comprises a low-frequency radiating element 101, an upper element 102, which is not connected directly to the low-frequency radiating element
  • the high-frequency radiating element 104 is arranged on top of the upper element 102.
  • the upper element 102 serves as a (grounded) director for the low-frequency radiating element 101, and at the same time serves as a ground plane for the high-frequency radiating element 104.
  • the high-frequency radiating element 104 may specifically be configured to operate in a higher frequency band than the low-frequency element 101.
  • FIG. 2 shows a radiating device 100 according to an embodiment of the invention.
  • FIG. 2 shows particularly a side-view of the radiating device 100.
  • the radiating device 100 shown in FIG. 2 builds on the radiating device 100 shown in FIG. 1. Accordingly, same elements are provided with the same reference signs and have likewise functions.
  • the radiating device 100 shown in FIG. 2 includes the low-frequency radiating element 101 (here realized by a metal-made radiating plate with optional side walls at its edges), the upper element 102 provided on top of the radiating plate of the low-frequency radiating element 101, and multiple high-frequency elements 104 placed on the upper element 102.
  • the radiating plate is arranged in parallel with the upper element 102.
  • the upper element 102 is in particular distanced from the radiating plate of the low- frequency radiating element 101 by a certain distance h. Due to this distance h, and the fact that the upper element 102 is not directly connected to the low-frequency radiating element 101, a capacitance C is created between the upper element 102 and the low-frequency radiating element 101. As the upper element 102 serves as a director for the low-frequency radiating element 101, the upper element 102 and the low-frequency radiating element 101 form together a low-frequency radiating structure. The capacity C may be compensated in the design of the low-frequency radiating element 101, such that the low-frequency radiating element 101 together with the upper element 102 radiates at a desired frequency.
  • the upper element 102 may comprise a multilayer Printed Circuit Board (PCB), and may further have metalized cavities 400 (see FIG. 4 or FIG. 8 for a better view) for holding the high-frequency radiating elements 104.
  • the cavities 400 may be provided in a plastic member coupled to the multilayer PCB of the upper element 102.
  • the upper element 102 may behave as a Perfect Electric Conductor (PEC) from the perspective of the low- frequency radiating element 101.
  • PEC Perfect Electric Conductor
  • the grounding of the upper element 102 can be done in several points, and since a current flowing through an inner area of the upper element 102 is small, a matching, cross polar and isolation of the low-frequency radiating element 101 is not disturbed excessively.
  • the upper element 102 should not touch, or even be too close to, the radiating plate of the low- frequency radiating element 101, since otherwise the capacity C may become too high, feeding slots in the low-frequency radiating element 101 may be short circuited, and/or the upper element 102 may not behave efficiently as a grounded director.
  • the distance h for the capacity C may advantageously be 0.02 l > h 0.5 l, in particular may be 0.04 l > h > 0.5 l, (wherein l corresponds to the highest radiating frequency of an operating bandwidth of the low-frequency radiating element 101).
  • the capacitance C can be used to tune the low-frequency radiating element 101 and e.g. increase its bandwidth.
  • FIG. 2 shows further that the radiating device 100 may include a lower element 200 that serves as a ground plane for the low-frequency radiating element 101.
  • the grounding of the upper element 102 may also be done via the lower element 200.
  • the lower element 102 serves to provide the common ground 103.
  • the upper element 102 is thus connected to the low-frequency radiating element 101 indirectly through the lower element 200.
  • the lower element 200 may comprise a PCB (as shown in the figures), also referred to as“feeding PCB”, since it may comprise signal lines 300 for feeding the low-frequency radiating element 101 and/or feeding lines for feeding the high-frequency radiating element(s) 104.
  • the lower element 200 may additionally comprise a reflecting element (not shown in the figures), which is placed below the feeding PCB. Due to this reflecting element, the lower element 200 may also act as a reflector for the low-frequency radiating element 101.
  • the reflecting element may also serve as the ground plane for the low- frequency radiating element 101.
  • FIG. 2 shows further that the radiating device 100 may also include an interconnecting element 201 used for grounding the upper element 102 by connecting it to the lower element 200, particularly a reflecting element/ground plane thereof.
  • the interconnecting element 201 may comprise a PCB, referred to as “interconnecting PCB”.
  • the interconnecting element 201 may carry at least one signal line for feeding the at least one high-frequency radiating element 104. Said signal line may particularly be routed from the lower element 200 via the upper element 102 to the at least one high-frequency radiating element 104.
  • the at least one feeding line may be realized in a strip line, micro-strip line or coplanar line configuration on the interconnecting element 201.
  • the radiating device 100 may further include at least one feeding line 202 for feeding the low-frequency radiating element 101, for instance, held by plastic holders 402 (see FIG. 4 and FIG. 8).
  • FIG. 3 shows a radiating device 100 according to an embodiment of the invention.
  • FIG. 3 shows particularly a perspective top-view of the radiating device 100.
  • the radiating device 100 shown in FIG. 3 builds on the radiating device 100 shown in FIG. 1 and/or FIG. 2. Accordingly, same elements are provided with the same reference signs and have likewise functions.
  • the radiating device 100 of FIG. 3 includes again the low-frequency radiating element 101, the upper element 102 and at least one high-frequency radiating element 104 (but not shown, in order to better show the upper element 102).
  • the upper element 102 is used to create a symmetric environment, which allows complete freedom of placement of the high- frequency-radiating elements 104.
  • the upper element 102 is in particular electrically symmetric for the low-frequency radiating element 101. Further, it is not connected directly to low-frequency radiating element 101 but only indirectly through the lower element 200 providing the common ground 103.
  • the grounding of the upper element 102 is done such that it can radiate. Would it be grounded at its edges, it would behave more like an electromagnetic wall, and the low-frequency radiating element 101 would not work as intended.
  • the grounding may be done in a central area of the upper element 102, such that the upper element 102 may have a longer electrical length to work as director (as the electrical length will be determined from one edge of upper element 102 to its grounding point).
  • FIG. 3 shows further that a conductive ring 301 may be provided around the circumference of the upper element 102.
  • the conductive ring 301 allows to miniaturize the upper element 102 and may improve the bandwidth of the low-frequency radiating element 101.
  • FIG. 3 also illustrates that the lower element 200 may comprises a signal line 300 for feeding the low-frequency radiating element 101.
  • This feeding line 300 may be connected to the feeding line 202.
  • FIG. 4 shows a radiating device 100 according to an embodiment of the invention.
  • the radiating device 100 shown in FIG. 4 builds on the radiating device 100 shown in FIG. 1, FIG. 2 and/or FIG. 3. Accordingly, same elements are provided with the same reference signs and have likewise functions.
  • the radiating device 100 of FIG. 4 again includes the low-frequency radiating element 101, the upper element 102, and the at least one high- frequency radiating element 104.
  • FIG. 4 shows particularly a perspective top-view of the radiating device 100 as in FIG. 3. However, in contrast to FIG. 3, FIG. 4 shows the radiating device 100 with four high- frequency radiating elements 104 provided on the upper element 102.
  • the low-frequency radiating element 101 is composed of a single bended metal sheet having four feeding slots 401. Together with the upper element 102, which serves as the grounded director, and the conductive ring 301, the low- frequency radiating element 101 forms a low-frequency radiating structure.
  • the low- frequency radiating element 101 is fed by e.g. micro-strip feeding lines 202.
  • Several different plastic holders 402 e.g. rivets and mechanical supports
  • the feeding lines 202 are connected to the feeding lines 300 on the lower element 200.
  • the lower element 200 also includes grounding points 103 for the low- frequency radiating element 101 (common ground with the upper element 102).
  • FIG. 4 also illustrates that the radiating device 100 includes conductive cavities 400 in the upper element 102, particularly one cavity 400 per high-frequency radiating element 104.
  • the cavities 400 may be metalized plastic cavities in a plastic member or metallic cavities (e.g. milled and fully metallic) in a metallic member, in which the high-frequency radiating elements 104 are arranged.
  • the upper element 102 may further comprise a multilayer PCB, on which the plastic or metallic member may be provided.
  • the upper element 102, particularly the multilayer PCB may be connected via the interconnecting element 201 to the lower element 200.
  • the high-frequency radiating elements 104 can be placed in an arbitrary way and in any number on the upper element 102. In the implementation shown in FIG.
  • each high-frequency element 104 is placed symmetrically and orthogonally from the center of the upper element 102.
  • the upper element 102 can be used to combine in any desired way the high- frequency-elements 104.
  • the interconnecting element 201 grounds the upper element 102 and can be used to connect feeding lines of the high-frequency radiating elements 104 to another device.
  • FIG. 5 shows different possible placements of high-frequency radiating elements 104 on the upper element 102.
  • the upper element 102 is electrically symmetric to the low- frequency radiating element 101, the upper element 102 can be used to place high- frequency radiating elements 104 arbitrarily without affecting the low-frequency radiating element 101 performance.
  • the upper element 102 behaves as radiating ground plane (reflector) for the embedded high-frequency radiating elements 104.
  • FIG. 5 also shows (upper right), that three high-frequency radiating elements 104 can be placed, or shows (lower left) that a single high-frequency radiating element 104 can be used, or shows (lower right) that multiple high-frequency radiating elements 104 can be placed arbitrarily and unsymmetrically on the upper element 102.
  • FIG. 6 shows that the upper element 102 can be used as physical support to route signal lines 600 required to feed any high-frequency radiating element 104 placed on its surface. That is, the upper element 102, e.g. a PCB comprised by the upper element 102, may comprise one or more signal lines 600.
  • signal lines 600 may be implemented as strip line, micro-strip line or coplanar line configuration.
  • the high-frequency radiating elements 104 may be fed in pairs, i.e. two elements 104 may be fed together by a common signal line 600.
  • FIG. 6 also shows interconnections 601 for the signal lines 600, in order to route them to the lower element 200.
  • the interconnections 601 may connect the signal lines 600 with signal lines on the interconnecting element 201.
  • FIG. 7 shows grounding points 701 for the upper element 102. These grounding points 701 may also be used to route the signal lines 600 of any high-frequency radiating element 104 on the upper element 102 to the lower element 200. Thereby, the low-frequency radiating element 101 (e.g. implemented as radiating plane) can be traversed by opening apertures 700 in its surface to pass through the signaling lines. The dimensions of these apertures 700 should be minimized. To minimize the dimensions of the radiating device 100 as a whole, the grounding may be done in the central area of the upper element 102 (see left hand side of FIG. 7). In this case, the upper element 102 can also have a longer electrical length to work as director.
  • the low-frequency radiating element 101 e.g. implemented as radiating plane
  • the grounding may be done in the central area of the upper element 102 (see left hand side of FIG. 7). In this case, the upper element 102 can also have a longer electrical length to work as director.
  • the feeding slots 401 of the low-frequency radiating element 101 can also be used as the apertures 700 to traverse the routing signals. Thus, no additional apertures 700 are needed.
  • FIG. 8 shows an upper element 102 and interconnecting element 201 of a radiating device 100, e.g. as presented in the previous figures.
  • the upper element 102 comprises a multilayer PCB and a plastic member on said PCT.
  • the plastic member has cavities and a metallized surface, such that metalized cavities 104 are formed.
  • high- frequency radiating elements 104 are disposed in the cavities 400.
  • the interconnecting element 201 may be surrounded by plastic holders 402 for supporting signal lines 202 (see FIG. 2) for feeding the high-frequency radiating elements 104 disposed within the cavities 400, particularly via feeding lines 600 (see FIG. 6) provided on the multilayer PCB of the upper element 102.
  • FIG. 9 shows an antenna 900 according to an embodiment of the invention.
  • the antenna 900 comprises at least one radiating device 100, e.g. as shown in FIG. 1.
  • the antenna 900 shown in FIG. 9 includes three radiating devices 100.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Waveguide Aerials (AREA)

Abstract

La présente invention se rapporte au domaine des antennes pour communications mobiles. L'invention présente un dispositif rayonnant pour une telle antenne, et une antenne comprenant un ou plusieurs des dispositifs rayonnants. Le dispositif rayonnant comprend un élément rayonnant basse fréquence, un élément supérieur et un élément rayonnant haute fréquence. L'élément supérieur n'est pas connecté directement à l'élément rayonnant basse fréquence mais a une masse commune avec celui-ci. L'élément rayonnant haute fréquence est disposé au-dessus de l'élément supérieur. L'élément supérieur sert à la fois de directeur mis à la terre pour l'élément rayonnant basse fréquence et de plan de masse pour l'élément rayonnant haute fréquence.
PCT/EP2018/068805 2018-07-11 2018-07-11 Dispositif de rayonnement à multiple éléments et antenne Ceased WO2020011348A1 (fr)

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PCT/EP2018/068805 WO2020011348A1 (fr) 2018-07-11 2018-07-11 Dispositif de rayonnement à multiple éléments et antenne

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PCT/EP2018/068805 WO2020011348A1 (fr) 2018-07-11 2018-07-11 Dispositif de rayonnement à multiple éléments et antenne

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WO2020011348A1 true WO2020011348A1 (fr) 2020-01-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1072065B1 (fr) * 1998-06-26 2002-03-13 Allgon Ab Antenne a double bande
US20080024382A1 (en) * 2004-11-30 2008-01-31 Jesper Uddin Dual Band Antenna Feeding
US20100283707A1 (en) * 2009-04-06 2010-11-11 Senglee Foo Dual-polarized dual-band broad beamwidth directive patch antenna
DE102014014434A1 (de) * 2014-09-29 2016-03-31 Kathrein-Werke Kg Multiband-Strahlersystem
EP3166178A1 (fr) * 2015-11-03 2017-05-10 Huawei Technologies Co., Ltd. Élément d'antenne de préférence pour une antenne de station de base

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1072065B1 (fr) * 1998-06-26 2002-03-13 Allgon Ab Antenne a double bande
US20080024382A1 (en) * 2004-11-30 2008-01-31 Jesper Uddin Dual Band Antenna Feeding
US20100283707A1 (en) * 2009-04-06 2010-11-11 Senglee Foo Dual-polarized dual-band broad beamwidth directive patch antenna
DE102014014434A1 (de) * 2014-09-29 2016-03-31 Kathrein-Werke Kg Multiband-Strahlersystem
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