WO2020022740A1 - Dispositif électronique comprenant un dispositif de transmission de del et procédé de commande associé - Google Patents

Dispositif électronique comprenant un dispositif de transmission de del et procédé de commande associé Download PDF

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Publication number
WO2020022740A1
WO2020022740A1 PCT/KR2019/009074 KR2019009074W WO2020022740A1 WO 2020022740 A1 WO2020022740 A1 WO 2020022740A1 KR 2019009074 W KR2019009074 W KR 2019009074W WO 2020022740 A1 WO2020022740 A1 WO 2020022740A1
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WIPO (PCT)
Prior art keywords
leds
transfer
substrate
target substrate
micro leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/KR2019/009074
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English (en)
Korean (ko)
Inventor
곽도영
김병철
오민섭
박상무
김은혜
이윤석
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020190088558A external-priority patent/KR102782924B1/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to CN201980049376.2A priority Critical patent/CN112470265B/zh
Priority to US17/258,061 priority patent/US12009452B2/en
Priority to EP19840826.2A priority patent/EP3780076A4/fr
Publication of WO2020022740A1 publication Critical patent/WO2020022740A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Definitions

  • the present disclosure relates to an LED electronic device and a method of controlling the same, which implements relocation upon transfer of an LED manufactured by a semiconductor process on a sapphire substrate or a wafer to a substrate of a display module.
  • LEDs Semiconductor light emitting diodes
  • LCDs Semiconductor light emitting diodes
  • micro LEDs with short edges of less than 100 ⁇ m have been developed, and micro LEDs have faster response speed, lower power, and higher luminance than conventional LEDs. It is possible to display an image at a high resolution such as 8K and the like, and it has been in the spotlight as a light emitting device of the next generation display.
  • the LED is manufactured in the form of a semiconductor chip on a wafer and disposed on a target substrate to constitute the light emitting module of the display.
  • the semiconductor LED on the wafer is disposed on the target substrate in a state where the performance of the region between the semiconductor LEDs on the wafer is different from each other, the performance between the respective regions of the semiconductor LED on the target substrate is different.
  • the difference in performance between the respective regions of the semiconductor LED on the target substrate is accompanied by a problem that the luminance or color of the manufactured display is not uniform.
  • An object of the present disclosure is to provide an electronic device including a LED transmission device to improve the uniformity of the performance or characteristics between a plurality of LEDs disposed on the target substrate and a control method thereof.
  • a transmission device capable of moving and arranging a plurality of LEDs disposed on the transfer substrate to a target substrate, a storage unit storing characteristic information of each of the plurality of LEDs, and an arrangement on each target substrate of the plurality of LEDs determined based on the stored characteristic information.
  • An electronic device comprising a processor for controlling a transmission device to place each of a plurality of LEDs in a location.
  • the processor divides the transfer substrate and the target substrate into a plurality of regions, and outputs a plurality of regions such that the output characteristics of the plurality of regions constituting the target substrate are uniform and the LEDs in different regions of the transfer substrate are disposed in one region of the target substrate. The placement of each of the LEDs can be determined.
  • the processor may control the transmission device such that LEDs in different areas of the transfer substrate are alternately disposed in one area of the target substrate.
  • the processor may control the transmission device such that a plurality of LEDs spaced apart from each other among the plurality of LEDs disposed on the transfer substrate are simultaneously picked up.
  • the transmission device simultaneously picks up a plurality of LEDs on the transfer substrate and places them on the target substrate, and the processor determines a distance between the plurality of LEDs to be picked up at the same time, and based on the determined intervals, the transmission device causes the plurality of LEDs to be picked up simultaneously. You can control it.
  • the processor may determine the placement position on the target substrate of each of the plurality of LEDs in consideration of the output characteristics between the plurality of regions of the target substrate and the moving distance of the transmission device.
  • the processor may determine a movement order of each of the plurality of LEDs and control the transmission device to place each of the plurality of LEDs on the target substrate based on the determined placement position and movement order of each of the plurality of LEDs.
  • the LED has a size shorter than 100 ⁇ m, and the characteristic information of the LED may be at least one of an output wavelength, a brightness, and a performance grade of the LED.
  • the arranging may control LEDs in different regions of the transfer substrate to be alternately disposed in one region of the target substrate.
  • a plurality of LEDs spaced apart from each other on the transfer substrate may be simultaneously picked up and disposed on the target substrate.
  • the determining step determines the spacing between the plurality of LEDs to be picked up at the same time, and the placing step may simultaneously pick up the plurality of LEDs based on the determined interval.
  • the determining may determine the arrangement position on the target substrate for the plurality of LEDs of each of the plurality of transfer substrates based on the stored characteristic information of each of the plurality of transfer substrates.
  • the determining may determine the placement position on the target substrate in consideration of the output characteristics between the plurality of regions of the target substrate and the moving distance of the transmission device.
  • the method may further include determining a movement order of each of the plurality of LEDs, and the disposing step may place each of the plurality of LEDs based on the arrangement position and the movement order of each of the determined plurality of LEDs.
  • the LED is shorter than 100 ⁇ m in size, and the characteristic information of the LED may be at least one of an output wavelength, brightness, and performance grade of the LED.
  • the disposing may include transferring a plurality of LEDs of the transfer substrate to a first plurality of rows spaced at a second interval in a first direction on the target substrate, between the plurality of LEDs transferred to the first plurality of rows. Transferring the plurality of LEDs of the transfer substrate to the second plurality of rows different from the first plurality of rows in the first direction on the target substrate and transferring the plurality of LEDs of the transfer substrate onto the target substrate. And transferring a second direction perpendicular to the first direction.
  • the method may further include rotating at least one of the transfer substrate and the target substrate.
  • the transferring of the plurality of LEDs at a second interval, and the transferring of the second direction may include transferring the plurality of LEDs between the plurality of LEDs transferred in the first direction.
  • a plurality of LEDs can be transferred.
  • the disposing may include transferring a plurality of LEDs disposed at a second interval within a first transfer area of the plurality of LEDs on the transfer substrate onto the target transfer substrate with the first transfer area, and the transfer substrate. Transferring a plurality of LEDs disposed at the second interval within a second transfer area different from the first transfer area among a plurality of LEDs to the second transfer area on the target substrate; The transferring may include transferring a plurality of LEDs in the second transfer area between the plurality of LEDs in the first transfer area.
  • Transferring to the first transfer area may be repeatedly transferred onto the target substrate, and transferring to the second transfer area may be repeatedly transferred onto the target substrate.
  • Transferring to the first transfer area and transferring to the second transfer area may be performed in a pick and place manner.
  • Transferring to the first transfer area may include transferring a plurality of LEDs disposed in the first area of the transfer substrate, and transferring the second transfer area to a different area from the first area of the transfer substrate.
  • the plurality of LEDs disposed in the second area can be transferred.
  • the LED arrangement method is divided into a plurality of regions the transfer substrate on which a plurality of LEDs are arranged;
  • the plurality of LEDs are configured such that the output characteristics of the plurality of regions constituting the target substrate are uniform and LEDs in different regions of the transfer substrate are disposed in one region of the target substrate, based on the characteristic information of each of the plurality of LEDs.
  • a computer readable recording medium comprising determining respective placement positions and outputting placement position information on a target substrate for each of the plurality of LEDs.
  • FIG. 1A is a schematic diagram illustrating an electronic device according to an embodiment of the present disclosure.
  • FIG. 1B is a schematic diagram showing a pickup device according to another embodiment of the present disclosure.
  • FIG. 2 is a block diagram illustrating a storage unit and a processor.
  • FIG. 3 is a top view of a transfer substrate in a state in which characteristic information of a plurality of micro LEDs is input.
  • FIG. 4A is a top view illustrating a target substrate in a first state in which a plurality of micro LEDs is mounted.
  • 4B is a top view illustrating a target substrate in a second state in which a plurality of micro LEDs is mounted.
  • FIG. 5 is a top view illustrating the transfer substrate after the process of FIGS. 4A and 4B.
  • FIG. 6A is a top view illustrating a target substrate in a third state in which a plurality of micro LEDs are mounted after the process of FIG. 4B.
  • 6B is a top view illustrating a target substrate in a fourth state in which a plurality of micro LEDs is mounted.
  • FIG. 7 is a top view of a plurality of transfer substrates in a state in which characteristic information of a plurality of micro LEDs is input according to another embodiment of the present disclosure.
  • 8A is a top view illustrating a target substrate on which a plurality of micro LEDs are mounted from a plurality of transfer substrates.
  • FIG. 8B is a top view illustrating a plurality of micro LEDs additionally mounted on the target substrate of FIG. 8A.
  • 9A is a flowchart illustrating a control method of an electronic device according to an embodiment of the present disclosure.
  • 9B is a flowchart illustrating a control method of an electronic device according to another exemplary embodiment of the present disclosure.
  • 11A is a schematic diagram illustrating that a transfer substrate is disposed on a target substrate according to another embodiment of the present disclosure.
  • FIG. 11B is a schematic diagram illustrating transferring a plurality of micro LEDs in a first direction to a first plurality of rows in the illustrated state of FIG. 11A.
  • 11C is a top view illustrating a target substrate transferred in a first direction in a first plurality of rows.
  • FIG. 12A is a schematic diagram showing an arrangement of a transfer substrate on a target substrate in the illustrated state of FIG. 11C.
  • FIG. 12B is a schematic diagram illustrating the transfer of a plurality of micro LEDs in a first direction in a second plurality of rows in the state shown in FIG. 12A.
  • 12C is a top view illustrating a target substrate transferred in a first direction in a second plurality of rows.
  • Fig. 13A is a schematic diagram showing another transfer substrate.
  • Fig. 13B is a schematic diagram showing the transfer substrate placed on the target substrate in a rotated state.
  • FIG. 13C is a schematic diagram illustrating transferring a plurality of micro LEDs in a second direction in the illustrated state of FIG. 13B.
  • FIG. 14 is a top view illustrating a target substrate in a state where a transfer process is finished according to another embodiment of the present disclosure.
  • Fig. 15A is a top view showing the transfer substrate.
  • 15B is a schematic diagram of a target substrate on which a plurality of first transfer areas is displayed according to another exemplary embodiment of the present disclosure.
  • 15C is a top view illustrating the target substrate partially transferred to the first transfer area.
  • Fig. 16A is a top view showing the transfer substrate after being transferred to the first transfer area.
  • 16B is a schematic diagram of a target substrate on which a plurality of second transfer areas are displayed on the target substrate after being transferred to the first transfer area.
  • 16C is a top view illustrating the target substrate partially transferred to the second transfer area.
  • 17A is a top view illustrating the target substrate in the process of transferring to the second transfer area.
  • 17B is a top view illustrating a target substrate in a state in which a transfer process is finished according to another embodiment of the present disclosure.
  • a component When a component is said to be “on” or “contacted” by another component, it may be understood that it may be directly in contact with or connected to another component, but it may be understood that there may be another component in between. something to do. On the other hand, if a component is described as being “on” or “directly” to another component, it may be understood that there is no other component in between. Other expressions describing the relationship between the components, such as “between” and “directly between”, may also be interpreted as well.
  • first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used only for the purpose of distinguishing one component from another component.
  • first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
  • uniformity or uniformity referred to in the present disclosure is meant to include the number of all cases that are the same as the reference value or included within a range around the reference value.
  • FIG. 1A is a schematic diagram illustrating an electronic device 1 according to an exemplary embodiment of the present disclosure
  • FIG. 1B is a schematic diagram illustrating a pickup device 11 ′ according to another exemplary embodiment of the present disclosure
  • FIG. 2 is a storage unit 50.
  • a processor 60 are shown.
  • the electronic device 1 may include a transfer device 10 and a plurality of micro LEDs 21 disposed on the transfer substrate 20, which may be moved to the target substrate 30.
  • a placement position on the target substrate 30 of each of the plurality of micro LEDs 21 is determined based on the storage unit 50 in which the characteristic information of each of the micro LEDs 21 of the micro LEDs 21 is stored, and the stored specific information, It may include a processor 60 for controlling the transmission device 10 to place each of the micro LEDs 21 of.
  • the transfer device 10 is connected to a pickup device 11 for picking up a plurality of micro LEDs 21 arranged on the transfer board 20 and the pickup device 11 to transfer the pickup device 11 to the transfer board 20. Or a moving device 12 for moving to the target substrate 30.
  • the transfer substrate 20 may refer to a substrate on which a plurality of micro LEDs 21 are finally transferred to a target substrate 30 used in a product.
  • the transfer substrate 20 may be referred to as a sapphire substrate, a carrier substrate, a wafer, or the like.
  • the transmission device 10 may move up, down, left, and right along the spatial coordinate system (X, Y, Z axis) on the transfer substrate 20 and the target substrate 30, and also, based on the X, Y, Z axis, Can rotate
  • the transmission device 10 may move from the position where the A1 micro LED is picked up to the position where the X1 micro LEDs spaced apart in the Y-axis direction of the A1 micro LED are arranged. .
  • the transfer apparatus 10 may pick up the plurality of micro LEDs 21 from the transfer substrate 20, and then mount the plurality of micro LEDs 21 picked up at various positions of the target substrate 30. have.
  • the pickup device 11 may pick up a plurality of micro LEDs 21 arranged on the transfer substrate 20 selectively or collectively, and may be adhesive, vacuum or electrostatic if necessary.
  • the micro LED 21 may be picked up in various ways, such as a hybrid method.
  • the pick-up device 11 may be formed in various structures as long as the pick-up device 11 is connected to the moving device 12 and simultaneously picks up a plurality of micro LEDs 21.
  • the pick-up apparatus 11 may rearrange and mount the plurality of picked-up micro LEDs 21 onto the target substrate 30.
  • the plurality of pickup apparatuses 11 and 11 ′ are picked up on the target substrate 30.
  • the method of mounting the micro LED 21 may be a pick and place method and a laser lift-off method.
  • the pickup device 11 illustrated in FIG. 1A may refer to an apparatus for transferring the plurality of micro LEDs 21 of the transfer substrate 20 onto the target substrate 30 in a pick and place manner. have.
  • the pickup device 11 ′ shown in FIG. 1B transfers the plurality of micro LEDs 21 of the transfer substrate 20 onto the target substrate 30 in a laser lift-off manner. It can mean a device.
  • the transfer substrate 20 may contact the top surfaces 21a of the plurality of micro LEDs 21 to fix the plurality of micro LEDs 21 to the transfer substrate 20. That is, the plurality of micro LEDs 21 may be attached to the lower surface 20a of the transfer substrate 20.
  • a mask plate 22 having a passage hole W formed thereon is disposed on the transfer substrate 20 at a predetermined interval or pattern, and the laser irradiated through the passage hole W passes through the passage hole W.
  • the micro LEDs 21 at corresponding positions may be separated and disposed on the target substrate 30.
  • a method in which the plurality of micro LEDs 21 arranged on the transfer substrate 20 are rearranged and mounted on the target substrate 30 may be a pick-and-place method or a laser lift-off. Applicable to both off / laser ablation schemes.
  • the moving device 12 is a structure that supports the pickup device 11 for transporting the pickup device 11, and may be coupled to a structure not shown.
  • the moving device 12 can move the pickup device 11 through conventional structures such as a multi-joint structure, a piston structure, a sliding structure, and the like.
  • the mobile device 12 may move in the state in which the mobile device 12 is connected to the pickup device 11.
  • the plurality of micro LEDs 21 are disposed on the transfer substrate 20. Specifically, as shown in FIG. 1A, when the plurality of micro LEDs 21 are transferred onto the target substrate 30 in a pick and place manner, the plurality of micro LEDs 21 may be formed on the transfer substrate 20. It may be disposed on the upper surface.
  • the plurality of micro LEDs 21 when the plurality of micro LEDs 21 are transferred onto the target substrate 30 by the laser lift-off method, the plurality of micro LEDs 21 may be disposed on the bottom surface of the transfer substrate 20.
  • the arrangement positions of the plurality of micro LEDs 21 on the transfer substrate 20 may vary.
  • the plurality of micro LEDs 21 may be arranged at a first interval P1 on the XY plane.
  • the first interval P1 means a distance between one surface of one micro LED and one surface of another neighboring micro LED.
  • the micro LED 21 may have a size of short 100 ⁇ m.
  • the micro LEDs 21 of the present disclosure are 10 ⁇ m to 100 ⁇ m in height and width, and preferably 30 ⁇ m or less.
  • the target substrate 30 has a configuration in which a plurality of micro LEDs 21 are arranged and physically connected to the plurality of micro LEDs 21.
  • the target substrate 30 may be referred to as a display module substrate, a thin film transistor substrate, a thin film transistor glass substrate, a backplane, or the like, and may be various shapes to be applied to a display product. Can be.
  • the stage 40 has a configuration in which the transfer substrate 20 and the target substrate 30 are loaded and unloaded, respectively, and may be formed of a flat plate.
  • the stage 40 may move relative to the transfer apparatus 10 in a state where the transfer substrate 20 and the target substrate 30 are loaded.
  • the storage unit 50 is embedded in the electronic device 1 and may be configured as a memory.
  • the storage unit 50 may include a flash memory type, a ROM, a RAM, a hard disk type, a multimedia card micro type, and a card type memory. (Eg, SD or XD memory, etc.).
  • the storage unit 50 is electrically connected to the processor 60 to transmit signals and information to and from the processor 60. Accordingly, the storage unit 50 may store the characteristic information of the plurality of micro LEDs 21 that are input or irradiated and transmit the characteristic information stored in the processor 60.
  • the processor 60 is embedded in the electronic device 1 and may control overall operations of the electronic device 1. In addition, the processor 60 may function to control the overall operation of the electronic device 1.
  • the processor 60 may include one or more of a central processing unit (CPU), a controller, an application processor (AP), a communication processor (CP), and an ARM processor. It may include.
  • CPU central processing unit
  • AP application processor
  • CP communication processor
  • ARM processor ARM processor
  • the processor 60 may be electrically connected to the storage unit 50 to use characteristic information of the plurality of micro LEDs 21 stored in the storage unit 50. Specific functions of the processor 60 according to an embodiment of the present disclosure will be described later.
  • FIG. 3 is a top view of the transfer substrate 20 in which the characteristic information of the plurality of micro LEDs 21 is input
  • FIG. 4A illustrates a target substrate 30 in a first state in which the plurality of micro LEDs 21 are mounted.
  • 4B is a top view showing the target substrate 30 in the second state in which the plurality of micro LEDs 21 are mounted.
  • a plurality of micro LEDs 21 may be disposed on the transfer substrate 20 at first intervals P1.
  • the number of micro LEDs 21 disposed on the transfer substrate 20 is shown for convenience of description and is not limited to the number and size formed in FIG. 3.
  • the plurality of micro LEDs 21 may have good characteristics of a specific region on the transfer substrate 20 due to manufacturing tolerances in the manufacturing process.
  • the characteristics of the plurality of micro LEDs 21 disposed in the first characteristic region S0 on the transfer substrate 20 are different from those of the plurality of micro LEDs 21 disposed outside the first characteristic region S0 region. It may be better than the characteristic.
  • the characteristics of the micro LEDs 21 may be different from each other.
  • the characteristics of the plurality of micro LEDs 21 may be one of an output wavelength, a brightness, and a performance grade.
  • the output wavelength is related to the color emitted by the micro LED 21 and the color represented by the micro LED 21 may vary according to the output wavelength.
  • the micro LED 21 when the micro LED 21 emits light in the wavelength range of about 630 nm to 780 nm, it may emit red. When the light emits light in the wavelength range of about 520 nm to 570 nm, the micro LED 21 may exhibit green color. When it emits light, blue may appear.
  • a wavelength band close to about 520 nm may represent bluish green, and a wavelength band close to about 570 nm is yellow green. Can be represented.
  • the characteristics of the micro LED 21 may also vary depending on the output wavelength emitted by the micro LED 21.
  • the brightness represents the brightness of the light source having a predetermined range
  • the brightness represented by the plurality of micro LEDs 21 may vary according to the brightness of the plurality of micro LEDs 21 disposed on the transfer substrate 20.
  • the performance class is a classification of the output wavelength or luminance according to a specific criterion, and the specific criterion may vary according to a user's needs.
  • the closer to the wavelength range of the specific reference, the higher the performance class, and the farther away from the wavelength range of the particular reference can be set to a lower performance class.
  • the performance grade may consider both the output wavelength and the luminance according to the user's arbitrary criteria.
  • the micro LED 21 has a specific gravity of U / 100 at the output wavelength (where U is a natural number of 100 or less) and a specific gravity of (100-U) / 100 at the luminance. Performance level can be set.
  • the characteristics of the plurality of micro LEDs 21 may be measured using an external measuring device (not shown) for the plurality of micro LEDs 21 disposed on the transfer substrate 20.
  • characteristic information including characteristics of each of the plurality of measured micro LEDs 21 may be stored in the storage unit 50.
  • the characteristic information stored in the storage unit 50 may be input through a separate input device (not shown).
  • the characteristic information may be a measurement value for the output wavelength or the luminance of each of the plurality of micro LEDs 21 or may be at least one of the input output wavelength, luminance, and performance grade.
  • the processor 60 may determine the performance grade of each of the plurality of micro LEDs 21 disposed on the transfer substrate 20 by using the characteristic information stored in the storage unit 50.
  • the processor 60 may divide the transfer substrate 20 into a plurality of regions A, B, C, and D based on the characteristic information stored in the storage 50 and the determined performance grade.
  • a micro LED having a grade 1 performance in the region A of the transfer substrate 20 may be referred to as an A1 micro LED, and a micro LED having a grade 5 performance in the region A may be referred to as an A5 micro LED.
  • A1 micro LED a micro LED having a grade 1 performance in the region A of the transfer substrate 20
  • A5 micro LED a micro LED having a grade 5 performance in the region A
  • a micro LED having a grade 1 performance in the region B of the transfer substrate 20 may be referred to as a B1 micro LED
  • a micro LED having a grade 5 performance in the region B may be referred to as a B5 micro LED.
  • the processor 60 divides the target substrate 30 into a plurality of regions Q3 to Q5, and output characteristics between the plurality of regions Q3 to Q5 constituting the target substrate 30 are uniform and the target substrate 30 is uniform.
  • the position of each of the plurality of micro LEDs 21 may be determined such that the micro LEDs in different areas A, B, C, and D of the transfer substrate 20 are disposed in one regions Q3 to Q5 of FIG. .
  • the arrangement position means a position where the plurality of micro LEDs 21 are arranged on the target substrate 30, which means an arrangement in which the plurality of micro LEDs 21 are rearranged.
  • the processor 60 may determine an arrangement position on the target substrate 30 of each of the plurality of micro LEDs 21 so that output characteristics between the plurality of regions constituting the target substrate 30 are uniform based on the stored characteristic information. have.
  • the output characteristic may correspond to any one of an output wavelength, a luminance, and a performance grade constituting the characteristic information.
  • the processor 60 determines the arrangement interval P2 between the plurality of micro LEDs 21 to be picked up at the same time, and the determined arrangement interval P2. ), The plurality of micro LEDs 21 can be simultaneously picked up.
  • the transfer device 10 may simultaneously pick up a plurality of micro LEDs 21 on the transfer substrate 20 and place them on the target substrate 30.
  • the mounting method of the plurality of micro LEDs 21 is a laser lift-off method
  • the arrangement interval P2 may be greater than the first interval P1, which is an interval between the plurality of micro LEDs 21 disposed on the transfer substrate 20, and may be an integer multiple of the first interval P1.
  • the processor 60 is based on the characteristic information stored in the storage unit 50 of the A1 to A5 micro LEDs in the A region and the B1 to B5 micro LEDs in the B region, and the specific region Q1 to the specific region on the target substrate 30.
  • the batch interval P2 can be determined such that the average value of the output characteristics or performance grades between Q3) is uniform.
  • an average value of performance grades of the A5 micro LEDs and the B1 micro LEDs included in the first region Q1 on the target substrate 30 is 3 and is included in the second region Q2.
  • the average value of the performance class of the A3 micro LED, B3 micro LED is 3, and the average value of the performance class of the A1 micro LED, B5 micro LED included in the third area Q3 is 3.
  • the transmission device 10 includes a plurality of regions A, B, and B of the transfer substrate 20.
  • the plurality of micro LEDs may be simultaneously picked up at an arrangement interval P2 that is twice the first interval P1.
  • the processor 60 may determine the arrangement interval P2 such that the standard deviation of the output characteristic or the performance grade between the specific regions Q1 to Q3 on the target substrate 30 is included in a preset range.
  • the processor 60 may simulate the placement on the target substrate 30 according to the placement interval P2 based on the characteristic information of the plurality of micro LEDs 21 disposed on the transfer substrate 20. You can run
  • the standard deviation is calculated for the performance grade of the plurality of micro LEDs included in the specific areas Q1 to Q3 of the target substrate 30, and if the standard deviation is within a preset range, the arrangement determined by the processor 60 is determined. Micro LEDs may be picked up and positioned on the target substrate 30 at a position and an interval P2.
  • the processor 60 may calculate a new standard deviation based on the new placement position and the placement interval P2.
  • the specific areas Q1 to Q3 are arbitrary areas and may have various shapes, ranges, and widths according to a user's selection.
  • the average value and the standard deviation between the specific areas Q1 to Q3 are disclosed as one example for determining that the plurality of micro LEDs 21 mounted on the target substrate 30 have an even distribution of performance grade.
  • the present invention is not limited to evaluating the performance grades of all the micro LEDs 21 included in the specific region, and the distribution of each performance class may be determined by calculating a sample of the plurality of micro LEDs included in the specific region.
  • the distribution can be determined through various samples, such as the average and the median value of the maximum value minimum value among the performance classes of the micro LED included in a specific region, if necessary. have.
  • the processor 60 determines an arrangement position on the target substrate 30 of each of the plurality of micro LEDs 21 in consideration of the output characteristics between the plurality of regions of the target substrate 30 and the moving distance of the transmission device 10. Can be.
  • the transmission device 10 has the arrangement interval P2 being the first spacing P1. Since moving twice more than twice, the transport distance can be increased. Therefore, as the conveying distance increases, the conveying speed and production speed of disposing the plurality of micro LEDs 21 disposed on the transfer substrate 20 on the target substrate 30 may be slowed down.
  • the processor 60 determines an arrangement position on the target substrate 30 of each of the micro LEDs 21 in consideration of the output characteristics between the plurality of regions of the target substrate 30 and the moving distance of the transmission device 10. You can decide.
  • the processor 60 may include a first interval P1 for a plurality of micro LEDs 21 included in a plurality of areas A, B, C, and D on the transfer substrate 20. It may be determined to separate from the pick-up or transfer substrate 20 at a placement interval P2 which is twice the interval of.
  • the processor 60 simultaneously transmits the A5 micro LEDs, the A3 micro LEDs, and the A1 micro LEDs in which the transmission device 10 is arranged at an arrangement interval P2 among the micro LEDs included in the A region of the transfer substrate 20. It can be controlled to pick up or separate from the transfer substrate 20 at the same time.
  • the processor 60 controls the transfer device 10 to move on the target substrate 30, and then transfer device 10 is picked up at a placement interval P2 or separated from the transfer substrate 20.
  • the A5 micro LED, the A3 micro LED, and the A1 micro LED may be controlled to be mounted on the target substrate 30 at an arrangement interval P2.
  • the processor 60 may control the transmission apparatus 10 such that micro LEDs in different areas of the transfer substrate 20 are alternately disposed in one area of the target substrate 30.
  • the processor 60 picks up the A5 micro LED, the A3 micro LED, and the A1 micro LED included in the A area of the transfer substrate 20, and then selects a different B area from the A area of the transfer substrate 20.
  • the included B1 micro LED, B3 micro LED, and B5 micro LED may be controlled to be simultaneously picked up or separated from the transfer substrate 20 at the same time.
  • the order of separation from the pick-up or transfer substrate 20 of the A region and the B region may vary.
  • the processor 60 controls the transfer device 10 to move on the target substrate 30, and then the transfer device 10 is picked up or placed at the placement interval P2.
  • the B1 micro LED, the B3 micro LED, and the B5 micro LED separated from the use substrate 20 may be controlled to be mounted on the target substrate 30 at an arrangement interval P2.
  • B1 micro LED, B3 micro LED, B5 micro LED may be disposed between the A5 micro LED, A3 micro LED, A1 micro LED, which are previously disposed on the target substrate 30.
  • the A5 micro LED, the B1 micro LED, the A3 micro LED, the B3 micro LED, the A1 micro LED, and the B5 micro LED may be disposed at the first interval P1 on the target substrate 30.
  • the average value of the performance grade between the specific areas Q1 to Q3 on the target substrate 30 may be uniform, and a plurality of micro LEDs having different performance grades may be evenly distributed.
  • the processor 60 determines a movement order of each of the plurality of micro LEDs 21, and transmits each of the plurality of micro LEDs to the target substrate 30 based on the arrangement position and the movement order of each of the determined plurality of micro LEDs.
  • the transmission device 10 may be controlled to be arranged.
  • FIG. 5 is a top view illustrating the transfer substrate 20 after the processes of FIGS. 4A and 4B
  • FIG. 6A is a target substrate 30 in a third state in which a plurality of micro LEDs 21 are mounted after the process of FIG. 4B
  • 6B is a top view illustrating the target substrate 30 in a fourth state in which a plurality of micro LEDs 21 are mounted.
  • the transfer substrate 20 may be a top view of the transfer substrate 20 in FIG. 5, and in the laser lift-off method, FIG. 5 is a bottom view of the transfer substrate 20. May be degree.
  • the transfer substrate 20 after the A5 micro LED, B1 micro LED, A3 micro LED, B3 micro LED, A1 micro LED, B5 micro LED is picked up or separated from the transfer substrate 20. ), The remaining micro LEDs are arranged.
  • A4 micro LEDs and A2 micro LEDs are disposed in an area A of the transfer substrate 20 at an arrangement interval P2 that is twice the first distance P1, and in the area B, a first interval P1 may be disposed.
  • B2 micro LEDs and B4 micro LEDs are arranged at twice the spacing (P2).
  • the processor 60 controls the transmission device 10 to simultaneously pick up or separate the A4 micro LEDs and the A2 micro LEDs from the transfer substrate 20 at the determined placement interval P2, and to pick up or transfer the substrate 20.
  • A4 micro LED, A2 micro LED separated from the control can be controlled to be placed in the placement position of the determined target substrate 30.
  • the arrangement position where the A4 micro LED and the A2 micro LED are arranged on the target substrate 30 is a region where the previous A5 micro LED, B1 micro LED, A3 micro LED, B3 micro LED, A1 micro LED, and B5 micro LED are disposed. May be placed in a different column, and in a different row.
  • the processor 60 controls the transmission device 10 to simultaneously pick up the B2 micro LEDs and the B4 micro LEDs at the determined placement interval P2 or to separate them from the transfer substrate 20 at the same time.
  • the B2 micro LED, B4 micro LED separated from 20) can be controlled to be placed between the previously determined determined A4 micro LED, A2 micro LED.
  • A4 micro LEDs, B2 micro LEDs, A2 micro LEDs, and B4 micro LEDs may be disposed on the target substrate 30 at a first interval P1.
  • the average value of the performance grade between the specific areas Q4 to Q5 on the target substrate 30 may be uniform, and a plurality of micro LEDs having different performance grades may be evenly distributed.
  • FIG. 7 is a top view of a plurality of transfer substrates 20-1 and 20-2 in a state in which characteristic information of a plurality of micro LEDs 21 is input, according to another embodiment of the present disclosure
  • FIG. 8B is a top view showing a target substrate 30 on which a plurality of micro LEDs 21 are mounted from the transfer substrates 20-1 and 20-2.
  • FIG. 8B shows a plurality of micros in the target substrate 30 of FIG. 8A. Top view showing that the LED 21 is additionally mounted.
  • a plurality of micro LEDs having different characteristics from each other may be disposed on the plurality of transfer substrates 20-1 and 20-2.
  • E1 micro LEDs to E5 micro LEDs having different characteristics at first intervals P1 are disposed on the first transfer substrate 20-1, and the first intervals are disposed on the second transfer substrate 20-2.
  • F5 micro LEDs to F1 micro LEDs having different characteristics may be disposed.
  • the plurality of micro LEDs disposed on the first to second transfer substrates 20-1 and 20-2 measure characteristics of the plurality of micro LEDs using an external measuring device (not shown), and measure the plurality of micro LEDs. Characteristic information including the characteristics of each of the micro LEDs of the may be stored in the storage unit 50.
  • the storage unit 50 may store characteristic information of each of the plurality of transfer substrates 20-1 and 20-2.
  • the characteristic information stored in the storage unit 50 may be inputted through a separate input device (not shown) measured characteristic information using an external measuring device (not shown).
  • the processor 60 may each of the plurality of transfer substrates 20-1 and 20-2 based on the characteristic information of each of the stored plurality of transfer substrates 20-1 and 20-2.
  • the placement position on the target substrate 30 for the plurality of micro LEDs may be determined.
  • the processor 60 determines the placement interval P2 between the plurality of micro LEDs to be picked up at the same time, and is arranged on the transfer substrates 20-1 and 20-2 based on the determined placement interval P2. Allows micro LEDs to be picked up simultaneously.
  • the processor 60 moves E1 micro LEDs, E3 micro LEDs, and E5 micro LEDs simultaneously picked up at the placement interval P2 from the first transfer substrate 20-1 to the target substrate 30, and thus the target substrate 30 moves to the target substrate 30.
  • the transmission device 10 may be controlled to be disposed on the substrate 30 at a placement interval P2.
  • E1 micro LEDs, E3 micro LEDs, and E5 micro LEDs are disposed on the target substrate 30 at an arrangement interval P2.
  • the processor 60 may simultaneously pick up or separate the F5 micro LEDs, F3 micro LEDs, and F1 micro LEDs from the second transfer substrate 20-2 at a placement interval P2 or from the transfer substrate 20.
  • the transmission device 10 may be controlled to be disposed on the target substrate 30 at a placement interval P2.
  • the picked-up F5 micro LED, F3 micro LED, F1 micro LED may be disposed between the E1 micro LED, the E3 micro LED, the E5 micro LED previously disposed on the target substrate 30, respectively.
  • the E1 micro LED, the F5 micro LED, the E3 micro LED, the F3 micro LED, the E5 micro LED, and the F1 micro LED may be disposed on the target substrate 30 at the first interval P1.
  • the average value of the performance grade between the specific areas Q1 to Q3 on the target substrate 30 may be uniform, and a plurality of micro LEDs having different performance grades may be evenly distributed.
  • the specific regions of the target substrate 30 are located.
  • the variety of rearrangements can be increased such that the standard deviation of the performance class of the micro LEDs included is within a preset range.
  • the time for the processor 60 to determine the placement position and placement interval P2 to be placed on the target substrate 30 may be shortened, and various rearrangements may be possible.
  • the disclosure according to the present disclosure is not limited to the pick and place scheme, but may also be applied to the laser lift off scheme.
  • the time for the processor 60 to determine the placement position and the placement interval P2 to be placed on the target substrate 30 may be shortened, and various rearrangements may be possible.
  • 9A is a flowchart illustrating a control method of an electronic device according to an embodiment of the present disclosure.
  • the characteristic information of each of the plurality of micro LEDs 21 arranged on the transfer substrate 20 is stored in the storage unit 50 (S10).
  • the processor 60 may determine at least one of an arrangement position and an arrangement interval P2 on the target substrate 30 of each of the plurality of micro LEDs 21 based on the characteristic information stored in the storage unit 50 ( S20).
  • the processor 60 performs a simulation for determining the placement position and the placement interval P2.
  • the processor 60 determines an arbitrary arrangement position and an arrangement interval P2 (S20-1). Thereafter, the processor 60 calculates a standard deviation or an average value of the plurality of micro LEDs to be disposed in a specific region of the target substrate 30 according to the determined arbitrary placement position and placement interval P2 (S20-2).
  • the processor 60 determines whether the calculated standard deviation or average value is within a preset range set by the user (S20-3).
  • the process may proceed to step S30 along the R1 route.
  • the processor 60 again performs the plurality of micro LEDs 21 based on the characteristic information stored in the storage unit 50 along the R2 route.
  • at least one of a new placement position and a placement interval P2 ′ on each target substrate may be determined.
  • the processor 60 may refer to the previously calculated simulation results for the placement position and placement interval P2.
  • the processor 60 may control the transmission device 10 to simultaneously pick up the plurality of micro LEDs at the determined placement interval P2 (S30).
  • the processor 60 may control the transmission device 10 to place the plurality of micro LEDs picked up at the determined placement interval P2 at the determined placement position of the target substrate 30 (S40).
  • the processor 60 may control the transmission apparatus 10 to repeatedly execute steps S30 and S40 along the R3 root. Accordingly, the transmission device 10 may manufacture the light emitting module of the display by rearranging the plurality of micro LEDs disposed on the transfer substrate 20 to the target substrate.
  • FIG. 9B is a flowchart for describing a control method of the electronic device 1 according to another exemplary embodiment.
  • the steps S10 and S20 of FIG. 10B are the same as the above-described steps S10 and S20, and descriptions thereof will not be repeated.
  • the processor 60 may simultaneously separate the plurality of micro LEDs 21 from the transfer substrate 20 at the determined placement interval P2.
  • the mask plate 22 having the passage opening W formed thereon is disposed on the transfer substrate 20 at a predetermined placement interval P2, and the laser is irradiated to detect a plurality of micro LEDs (at a determined placement interval P2). 21 may be separated from the transfer substrate 20 at the same time (S30).
  • the plurality of micro LEDs separated from the transfer substrate 20 may be mounted on the target substrate 30 disposed on the bottom surface of the transfer substrate 20 (S40).
  • the processor 60 may control the transmission apparatus 10 to repeatedly execute steps S30 and S40 along the R3 root.
  • the transfer device 10 may reposition the plurality of micro LEDs disposed on the transfer substrate 20 to the target substrate 30 to manufacture the light emitting module of the display.
  • FIG. 10 is a top view illustrating the transfer substrate 20, and FIG. 11A is a schematic view illustrating the transfer substrate 20 disposed on the target substrate 30 according to another embodiment of the present disclosure.
  • 11A is a schematic diagram showing the transfer of a plurality of micro LEDs 21 in a first plurality of rows in a first direction G1 in the illustrated state of FIG. 11A
  • FIG. 11C is a first direction in a first plurality of rows n1.
  • 12A is a schematic view showing the transfer substrate 20 disposed on the target substrate 30 in the illustrated state of FIG. 11C
  • FIG. 12B is a top view of the target substrate 30 transferred to FIG.
  • FIG. 12C is a schematic diagram showing the transfer of a plurality of micro LEDs 21 in a second plurality of rows n2 in a first direction G1 in the state shown in FIG. 13A is a top view showing the target substrate 30 transferred in the direction G1, and FIG. 13A is a schematic view showing another transfer substrate 20 '. 13B is a schematic view showing the transfer substrate 30 disposed on the target substrate 30 in a rotated state, and FIG. 13C shows the plurality of micro LEDs 21 in the second direction G2 in the illustrated state of FIG. 13B. ) Is a schematic diagram showing the transfer to Fig. 14, and FIG. 14 is a top view illustrating the target substrate 30 in the state where the transfer process is finished according to another embodiment of the present disclosure.
  • the same member number is used for the same configuration, and overlapping description is omitted.
  • the plurality of micro LEDs 21, the transfer substrate 20, the target substrate 30, the storage 50, and the processor 60 are the same as described above.
  • the electronic device 1 may transfer the plurality of micro LEDs 21 disposed on the transfer substrate 20 onto the target substrate 30 using the characteristic information stored in the storage unit 50.
  • the plurality of micro LEDs 21 on the transfer substrate 20 may have different characteristics as the first to third characteristic regions S0 to S2.
  • the processor 60 may determine the transfer area T on the transfer substrate 20 based on the characteristic information of the plurality of micro LEDs 21 stored in the storage 50.
  • the transfer region T may be any region of the transfer substrate 20 including the plurality of micro LEDs 21 to be transferred to the target substrate 30.
  • the processor 60 selects the transfer region T as a simulation result of the arrangement position of the plurality of micro LEDs 21 on the target substrate 30 based on the characteristic information of the plurality of micro LEDs 21. You can decide.
  • the electronic device 1 may arrange the transfer substrate 20 on the target substrate 30.
  • a plurality of micro LEDs 21 may be disposed on the transfer substrate 20 at a first interval P1.
  • the plurality of micro LEDs 21 may include first to third plurality of micro LEDs 21-1, 21-2, and 21-3.
  • the first plurality of micro LEDs 21-1 mean a plurality of micro LEDs transferred in the first plurality of rows n1 in the first direction G1, and the second plurality of micro LEDs 21-2.
  • the target substrate 30 may have a rectangular shape in which the first length L1 of the first side 30a is longer than the second length L2 of the second side 30b.
  • the target substrate 30 is not limited to the rectangular shape, but may be a square shape if necessary.
  • the laser line L may be fixedly disposed on an area where the transfer substrate 20 and the target substrate 30 face each other.
  • the laser line (L) is a plurality of micro LEDs 21 of the transfer substrate 20 by the laser lift-off (LLO, laser lift-off) or laser ablation (laser ablation) target substrate 30 It may mean a line to which the laser for transferring the image is irradiated.
  • the laser line L is fixed and may move in a direction in which the transfer substrate 20 and the target substrate 30 face each other. Accordingly, the plurality of micro LEDs 21 of the transfer substrate 20 positioned on the laser line L may be transferred onto the target substrate 30 positioned on the laser line L.
  • FIG. 11A the laser line L is fixed and may move in a direction in which the transfer substrate 20 and the target substrate 30 face each other. Accordingly, the plurality of micro LEDs 21 of the transfer substrate 20 positioned on the laser line L may be transferred onto the target substrate 30 positioned on the laser line L.
  • the laser line L is illustrated as extending along the first side 30a for convenience of description, the laser line L may be irradiated to a required width. Further, the laser line L is not limited to the fixed one, and may move on the transfer substrate 20 and the target substrate 30 as necessary.
  • the electronic device 1 moves the transfer substrate 20 in the H1 direction parallel to the first direction G1 with respect to the laser line L, and the target substrate 30. ) May be transferred in the H2 direction parallel to the first direction G1 to transfer the plurality of micro LEDs 21.
  • the H1 direction and the H2 direction may be opposite directions.
  • the processor 60 may transfer the plurality of micro LEDs 21 in the first direction G1 on the target substrate 30.
  • the first direction G1 may be referred to as a vertical direction and may be parallel to the Y-axis direction.
  • the first direction G1 may mean a direction parallel to the second side 30b of the target substrate 30.
  • the processor 60 may include the plurality of micro LEDs 21 of the transfer substrate 20 on the target substrate 30 in the first plurality of rows n1 at a second interval P2 in the first direction G1. Can be killed.
  • the first plurality of columns n1 may refer to n1 columns arranged at a second interval P2.
  • n1 may mean a natural number.
  • the plurality of micro LEDs in the seven rows in the second interval P2 may be transferred by moving in the first direction G1.
  • first interval P1 and the second interval P2 may be integer multiples.
  • the processor 60 may repeatedly transfer the plurality of micro LEDs 21 to the first plurality of columns n1 at a second interval P2 on the target substrate 30 in the first direction G1. Can be.
  • the plurality of first micro LEDs 21-1 may be transferred on the target substrate 30 at a second interval P2.
  • the plurality of micro LEDs may be transferred to a plurality of columns other than the first plurality of columns n1 in the plurality of rows n1 ′ of the edge regions of the target substrate 30.
  • first plurality of micro LEDs 21-1 may be transferred at a horizontal and vertical second interval P2.
  • first plurality of micro LEDs 21-1 may be transferred at a second interval P2 along a direction parallel to the second side 30b.
  • the first plurality of micro LEDs 21-1 may be disposed on the target substrate 30 at a second interval P2.
  • the processor 60 may arrange the transfer substrate 20 on the target substrate 30 on which the first plurality of micro LEDs 21-1 are disposed.
  • the electronic device 1 moves the transfer substrate 20 in the H1 direction parallel to the first direction G1 with respect to the laser line L, and the target substrate 30. May be transferred in the H2 direction parallel to the first direction G1 to transfer the second plurality of micro LEDs 21-2.
  • the processor 60 targets the plurality of micro LEDs 21 of the transfer substrate 20 between the first plurality of micro LEDs 21-1 transferred to the first plurality of rows n1.
  • the first plurality of rows n1 and the second plurality of rows n2 may be transferred onto the 30 in the first direction G1.
  • the second plurality of micro LEDs 21-1 may be transferred at a second interval P2 horizontally and vertically.
  • the second plurality of micro LEDs 21-2 may be transferred at a second interval P2 along a direction parallel to the second side 30b.
  • the second plurality of columns n2 may refer to n2 columns arranged at a second interval P2.
  • n2 may mean a natural number.
  • the number of the second plurality of columns n2 may be smaller than the number of the first plurality of columns n1.
  • the first plurality of columns n1 are 7 and the first plurality of micro LEDs 21-1 are arranged at the second interval P2, and the second plurality of columns n2 are 3 and the second
  • a first transfer is performed in one direction in the first direction G1.
  • the plurality of micro LEDs 21-1 may be arranged in rows 1, 3, 5, 7, 9, 11, and 13 in a direction parallel to the first side 30a, and the second plurality of micro LEDs 21-21. 2) may be arranged in the second, fourth, and sixth rows in a direction parallel to the first side 30a.
  • the second plurality of micro LEDs 21-2 transferred to the second plurality of rows n2 are disposed between the first plurality of micro LEDs 21-1 transferred to the first plurality of rows n1.
  • the first plurality of micro LEDs 21-1 and the second plurality of micro LEDs 21-2 may be disposed at a first interval P1 to each other in a direction parallel to the first side 30a. .
  • the processor 60 may include the second plurality of rows in which the plurality of micro LEDs 21 of the transfer substrate 20 are disposed on the target substrate 30 at a second interval P2 in the first direction G1. n2) can be repeatedly transferred.
  • the first plurality of micro LEDs 21-1 and the second plurality of micro LEDs 21-2 are along the horizontal direction (X-axis direction). It may be arranged at a first interval P1.
  • the plurality of micro LEDs 21 of the transfer substrate 20 are transferred to the first plurality of rows n1.
  • the characteristic regions can be evenly distributed.
  • the uniformity of the color and brightness of the plurality of micro LEDs arranged on the target substrate 30 can be improved.
  • n2 may not be a divisor of n1. That is, n1 may not be a multiple of n2. For example, when n1 is 8 and n2 is 4, n2 is a divisor of n1 and a pattern between a plurality of columns may be repeated. Accordingly, the repeated pattern causes the user to recognize the luminance of the micro LED at a predetermined cycle, which may be a factor that hinders the uniformity of the luminance on the target substrate 30.
  • n2 is not a divisor of n1
  • the first plurality of first micro LEDs 21-1 and the plurality of second micro LEDs 21-2 are transferred in the first direction G1
  • the first plurality of first micro LEDs 21-1 are transferred.
  • the target substrate 30 in a state where the micro LEDs 21-1 and the second plurality of micro LEDs 21-2 are disposed may rotate in a predetermined direction R.
  • the target substrate 30 is not limited to rotating in the predetermined direction R, and at least one of the transfer substrate 20 and the target substrate 30 may be rotated.
  • a transfer substrate 20 ′ different from the transfer substrate 20 transferred in the first direction G1 may be used.
  • another transfer substrate 20 ′ may be used to transfer the plurality of micro LEDs in the second direction G2.
  • the present invention is not limited thereto, and the transfer substrate 20 used for the transfer in the first direction G1 may be used.
  • the electronic device 1 moves the transfer substrate 20 ′ with respect to the laser line L in a direction I1 parallel to the second direction G2,
  • the plurality of micro LEDs 21 may be transferred by moving the target substrate 30 in a direction I2 parallel to the second direction G2.
  • the I1 direction and the I2 direction may be opposite directions.
  • the second direction G2 may be a direction parallel to the first side 30a of the rotated target substrate 30.
  • the processor 60 transfers the plurality of micro LEDs 21 ′ of the other transfer substrate 20 ′ onto the target substrate 30 in a second direction G 2 perpendicular to the first direction G 1. can do.
  • the processor 60 transfers a plurality of micro LEDs 21 ′ of different transfer substrates 20 ′ between the plurality of micro LEDs 21-1 and 21-2 transferred in the first direction G1. can do.
  • the processor 60 may transfer the plurality of third micro LEDs 21-3 at a second interval P2.
  • the first plurality of micro LEDs 21-1 and the second plurality of micro LEDs 21-2 have a second spacing in a direction parallel to the second side 30 b.
  • the third plurality of micro LEDs 21-3 which are disposed with respect to P2 and transferred in the second direction G2, are between the first plurality of micro LEDs 21-1 and the second plurality of micro LEDs. Can be transferred between (21-2).
  • the third plurality of micro LEDs 21-3 may be transferred onto the target substrate 30 in the second direction G2 as the plurality of third columns n3.
  • n3 may be a natural number.
  • the first to third micro LEDs 21-1, 21-2, and 21-3 that are transferred onto the target substrate 30 are separated from each other by the first interval P1. It can be arranged as.
  • the first plurality of micro LEDs 21-1 and the second plurality of micro LEDs ( 21-2) may be transferred in stages by dividing into a plurality of rows.
  • the processor 60 uses first and third micro LEDs 21-1 to be transferred on the target substrate 30 by using the characteristic information of the transfer substrate 20 and the other transfer substrate 20 ′. 21-2, 21-3).
  • the processor 60 may determine the optimized first plurality of columns n1 and the second plurality of columns n2 through simulation.
  • the plurality of micro LEDs 21 may implement a relatively uniform brightness and color, and greatly reduce the visibility of mura of the display screen implemented by the plurality of micro LEDs 21 distributed in a distributed manner. .
  • FIGS. 15A to 17B a method of arranging the micro LEDs 21 according to still another embodiment of the present disclosure will be described.
  • FIG. 15A is a top view of the transfer substrate 20
  • FIG. 15B is a schematic view of the target substrate 30 on which the plurality of first transfer areas J1 is displayed, according to another embodiment of the present disclosure
  • FIG. 15C FIG. 16A is a top view showing the target substrate 30 partially transferred to the first transfer area J1
  • FIG. 16A is a top view showing the transfer substrate 20 after being transferred to the first transfer area J1.
  • 16B is a schematic diagram of the target substrate 30 on which the plurality of second transfer areas J2 are displayed on the target substrate 30 after being transferred to the first transfer area J1
  • FIG. 16C is a second view.
  • 17A is a top view showing the target substrate 30 partially transferred to the transfer area J2
  • FIG. 17A is a top view showing the target substrate in the process of transferring to the second transfer area J2
  • FIG. 17B shows the present disclosure.
  • Top view of the target substrate 30 in the transfer process is finished according to another embodiment of the.
  • the same member number is used for the same configuration, and overlapping description is omitted.
  • the plurality of micro LEDs 21, the transfer substrate 20, the target substrate 30, the storage 50, and the processor 60 are the same as described above.
  • the transfer substrate 20 exhibits different characteristic regions due to manufacturing tolerances, and the processor 60 moves the transfer substrate 20 into a plurality of regions A, B, C, and D. ) Can be partitioned.
  • the electronic device 1 may transfer the plurality of micro LEDs 21 disposed on the transfer substrate 20 onto the target substrate 30 using the characteristic information stored in the storage unit 50.
  • the processor 60 may divide the target substrate 30 into a plurality of first transfer areas J1 in consideration of the size of the target substrate 30.
  • the processor 60 may transfer the plurality of fourth micro LEDs 21-4 to the first transfer area J1, and the second transfer area J2 different from the first transfer area J1.
  • the plurality of fifth micro LEDs 21-5 may be transferred.
  • the processor 60 is based on the mura dispersion value of the target substrate 30 and the transfer area of the plurality of micro LEDs 21 transferred at once based on the characteristic information of the plurality of micro LEDs 21 of the transfer substrate 20. In consideration of the transfer time, the transfer areas J1 and J2 on the target substrate 30 may be determined.
  • the mura dispersion value may mean a distribution diagram of characteristic information of the plurality of micro LEDs 21 when the plurality of micro LEDs 21 having different characteristic information are disposed on the target substrate 30.
  • the plurality of micro LEDs 21 on the transfer substrate 20 have a mura dispersion value on the target substrate 30. This can be big. Therefore, when a plurality of micro LEDs 21 are operated on the target substrate 30, it is possible to implement uniform luminance on the target substrate 30. However, as the transfer area transferred from the transfer substrate 20 to the target substrate 30 becomes smaller, the transfer time to the target substrate 30 increases.
  • the processor 60 may determine an optimal transfer area through simulation in consideration of characteristic information, mura dispersion values, and transfer time of the plurality of micro LEDs 21.
  • the plurality of micro LEDs 21 may be transferred onto the target substrate 30 with the first transfer area J1 on the transfer substrate 20. That is, the plurality of micro LEDs 21 of the transfer substrate 20 may be transferred onto the target substrate 30 in the first transfer area J1.
  • the plurality of micro LEDs 21 corresponding to the transfer area may be transferred onto the target substrate 30 in a pick and place manner.
  • the plurality of micro LEDs 21 included in the first transfer area J1 may be repeatedly transferred to a position corresponding to the first transfer area J1 of the target substrate 30.
  • the electronic device 1 transfers the plurality of micro LEDs 21 of the first transfer area J1 eight times.
  • the plurality of first transfer areas J1 of the target substrate 30 may be filled.
  • the plurality of fourth micro LEDs 21-4 of the transfer substrate 20 may be transferred onto the target substrate 30 in the first transfer area J1.
  • the plurality of fourth micro LEDs 21-4 included in the first transfer area J1 are spaced apart from each other by the second interval P2 in the horizontal and vertical directions. 30) can be transferred.
  • the plurality of fourth micro LEDs 21-4 arranged in odd-numbered columns and odd-numbered rows of the first transfer area J1 may be transferred onto the target substrate 30.
  • the processor 60 may transfer the plurality of micro LEDs 21 disposed in the first area A of the transfer substrate 20 onto the target substrate 30.
  • the processor 60 may include a second transfer area J2 different from the first transfer area J1 among the plurality of micro LEDs 21 of the transfer substrate 20.
  • the plurality of micro LEDs 21 arranged in the second interval P2 may be transferred to the second transfer area J2 on the target substrate 30.
  • the processor 60 may transfer the plurality of micro LEDs 21 in the second transfer area J2 between the plurality of micro LEDs 21 in the first transfer area J1.
  • the second transfer area J2 is formed on the target substrate 30 to which the plurality of fourth micro LEDs 21-4 of the first transfer area J1 are transferred.
  • the plurality of fifth micro LEDs 21-5 may be transferred.
  • the first transfer area J1 and the second transfer area J2 may overlap each other on the target substrate 30.
  • the fifth plurality of micro LEDs 21-5 in the second transfer area J2 may be disposed between the plurality of fourth micro LEDs 21-4 at the second interval P2.
  • the fourth plurality of micro LEDs 21-5 and the fifth plurality of micro LEDs 21-5 may be alternately transferred and disposed at the first interval P1 in the horizontal and vertical directions.
  • the second transfer area J2 may not be a divisor of the first transfer area J1. If the second transfer area J2 is a divisor of the first transfer area J1, the pattern between the plurality of rows may be repeated.
  • the repeated pattern causes the user to recognize the luminance of the micro LED at a predetermined cycle, which may be a factor that hinders the uniformity of the luminance on the target substrate 30.
  • the second transfer area J2 is not a divisor of the first transfer area J1, uniformity in color and brightness of the plurality of micro LEDs disposed on the target substrate 30 by preventing repeated patterns. Can improve.
  • the processor 60 uses the plurality of micro LEDs 21 disposed in the second region D different from the first region A of the transfer substrate 20 as the second transfer area J2, and is a target substrate. It can transfer on (30).
  • the first transfer area J1 is transferred in the first region A of the transfer substrate 20, and the second transfer area J2 is transferred in the second region D of the transfer substrate 20. Since it is transferred, a distributed arrangement of a predetermined level or more of the plurality of micro LEDs 21 having different characteristic information is possible.
  • a third transfer area J3 and a fourth transfer area J4 having a size that does not correspond to the second transfer area J2 by the size of the target substrate 30 may be included. Can be.
  • the plurality of micro LEDs 21 included in the second transfer area J2 are transferred to the third transfer area J3 and the fourth transfer area J4, so that the plurality of micro LEDs 21 as shown in FIG. 17B. May be transferred at a first interval P1.
  • a plurality of micro LEDs corresponding to the third transfer area J3 and the fourth transfer area J4 may be transferred.
  • the electronic device 1 repeatedly transfers the transfer areas J1 and J2 having various sizes onto the target substrate 30, thereby transferring a plurality of micro LEDs having various characteristic information onto the target substrate 30. It can be dispersed and transferred.
  • the plurality of micro LEDs 21 may implement a relatively uniform brightness and color, and greatly reduce the visibility of mura of the display screen implemented by the plurality of micro LEDs 21 distributed.
  • the various embodiments described above may be implemented in a recording medium readable by a computer or a similar device by using software, hardware, or a combination thereof.
  • the embodiments described herein may be implemented by the processor 130 itself.
  • embodiments such as the procedures and functions described herein may be implemented as separate software modules. Each of the software modules may perform one or more functions and operations described herein.
  • computer instructions for performing a processing operation of the electronic device 100 may be stored in a non-transitory computer-readable medium.
  • the computer instructions stored in the non-transitory computer readable medium allow the specific device to perform processing operations in the electronic device 100 according to the above-described various embodiments when executed by the processor of the specific device.
  • a non-transitory computer readable medium refers to a medium that stores data semi-permanently and is readable by a device, not a medium storing data for a short time such as a register, a cache, a memory, and the like.
  • Specific examples of non-transitory computer readable media may be CD, DVD, hard disk, Blu-ray disk, USB, memory card, ROM, and the like.

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Abstract

L'invention concerne un dispositif électronique. Le dispositif électronique comprend : un dispositif de transmission capable de se déplacer, vers un substrat cible, une pluralité de DEL agencées dans un substrat de transfert, et l'agencement de celles-ci; une unité de stockage dans laquelle des informations de caractéristique de chacune de la pluralité de DEL sont stockées; et un processeur pour commander le dispositif de transmission de telle sorte que chacune de la pluralité de DEL est agencée dans un emplacement d'agencement sur le substrat cible de chacune de la pluralité de DEL sur la base des informations de caractéristiques stockées.
PCT/KR2019/009074 2018-07-23 2019-07-23 Dispositif électronique comprenant un dispositif de transmission de del et procédé de commande associé Ceased WO2020022740A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201980049376.2A CN112470265B (zh) 2018-07-23 2019-07-23 包括led传送装置的电子装置及其控制方法
US17/258,061 US12009452B2 (en) 2018-07-23 2019-07-23 Electronic device including LED transmission device, and control method therefor
EP19840826.2A EP3780076A4 (fr) 2018-07-23 2019-07-23 Dispositif électronique comprenant un dispositif de transmission de del et procédé de commande associé

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20180085177 2018-07-23
KR10-2018-0085177 2018-07-23
KR10-2019-0088558 2019-07-22
KR1020190088558A KR102782924B1 (ko) 2018-07-23 2019-07-22 Led 전송 장치를 포함하는 전자 장치 및 그 제어 방법

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WO2020022740A1 true WO2020022740A1 (fr) 2020-01-30

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CN113972233A (zh) * 2021-10-12 2022-01-25 深圳市华星光电半导体显示技术有限公司 一种发光器件转印方法及发光器件转印系统

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KR20130064010A (ko) * 2011-12-07 2013-06-17 울트라테크 인크. 제품 웨이퍼 특성을 기초로 반도체 발광 디바이스를 특성분석하는 방법
KR20140109890A (ko) * 2011-11-18 2014-09-16 럭스뷰 테크놀로지 코포레이션 마이크로 소자 이송 헤드 히터 조립체 및 마이크로 소자의 이송 방법
KR20180035430A (ko) * 2016-09-29 2018-04-06 엘지이노텍 주식회사 반도체 소자 이송방법, 반도체 소자 이송장치 및 표시패널 제조방법

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US6961993B2 (en) * 2000-10-06 2005-11-08 Sony Corporation Method of transferring and mounting elements
US20110275171A1 (en) * 2010-05-06 2011-11-10 Wen-Pin Chen Method of Wafer Level Purifying Light Color Emitting from a Light Emitting Semiconductor Wafer
KR20140109890A (ko) * 2011-11-18 2014-09-16 럭스뷰 테크놀로지 코포레이션 마이크로 소자 이송 헤드 히터 조립체 및 마이크로 소자의 이송 방법
KR20130064010A (ko) * 2011-12-07 2013-06-17 울트라테크 인크. 제품 웨이퍼 특성을 기초로 반도체 발광 디바이스를 특성분석하는 방법
KR20180035430A (ko) * 2016-09-29 2018-04-06 엘지이노텍 주식회사 반도체 소자 이송방법, 반도체 소자 이송장치 및 표시패널 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113972233A (zh) * 2021-10-12 2022-01-25 深圳市华星光电半导体显示技术有限公司 一种发光器件转印方法及发光器件转印系统

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