WO2020032476A1 - Système d'électroplacage à fonction de régulation de courant constant et procédé associé - Google Patents

Système d'électroplacage à fonction de régulation de courant constant et procédé associé Download PDF

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Publication number
WO2020032476A1
WO2020032476A1 PCT/KR2019/009602 KR2019009602W WO2020032476A1 WO 2020032476 A1 WO2020032476 A1 WO 2020032476A1 KR 2019009602 W KR2019009602 W KR 2019009602W WO 2020032476 A1 WO2020032476 A1 WO 2020032476A1
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WO
WIPO (PCT)
Prior art keywords
plating
current
substrate
constant current
current value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/009602
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English (en)
Korean (ko)
Inventor
유윤상
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunu Hightech Co Ltd
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Sunu Hightech Co Ltd
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Filing date
Publication date
Application filed by Sunu Hightech Co Ltd filed Critical Sunu Hightech Co Ltd
Publication of WO2020032476A1 publication Critical patent/WO2020032476A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Definitions

  • the present application relates to an electroplating system and method having a constant current control function.
  • surface treatment is to coat a thin film of another material on the surface of the material for the purpose of improving the surface state of the material.
  • the purpose of such surface treatment is various, but the method of coating a metal thin film that can endure the corrosion resistance of the first raw material in the specific environment ( ⁇ ) and the surface hardening of the metal thin film that is harder than the raw material to withstand abrasion.
  • beautification of the surface beautification of thin film of noble metal or beautiful metal alloy on the surface of the raw material fourth increase of reflectance of light or heat, or smoothing of the surface of the metal lamination for smooth surface and gloss and improvement of reflectance. .
  • wet surface treatment is a surface treatment by impregnating a workpiece in a wet environment, for example, a treatment solution
  • dry surface treatment is plasma or arc in a vacuum container. The surface is treated with heated steam.
  • a cleaning step is performed to remove reaction liquids and plating solutions used before and after the surface treatment process and during the process. I'm using the method.
  • the present invention provides an electroplating system and method having a constant current control function capable of uniformly plating all plating substrates treated in one plating solution to significantly reduce the defective rate.
  • a power source An anode part extending from an anode terminal of the power source and immersed in a plating solution in the tank; A substrate clamping unit extending from the cathode terminal of the power source to fix the plating substrate; And a constant current controller disposed between the substrate clamping unit and a cathode terminal of the power source to control a current flowing through the plating substrate, such that a plating current having a predetermined size flows through the plating substrate.
  • An electroplating system with a control function is provided.
  • a power source an anode portion extending from the anode terminal of the power source and immersed in the plating solution in the water tank, and extending from the cathode terminal of the power source to fix the plating substrate
  • the constant current controller is provided between the substrate clamping unit and a negative terminal of the power source, and the third step includes opening and closing a connection between the current source and the substrate clamping unit according to a switching signal.
  • the switching signal By the current value of the plating current flowing through the plating substrate to be a predetermined current value, the switching signal, the pulse width at which the average value of the current value of the plating current flowing through the plating substrate becomes the predetermined current value Or a current value of the plating current flowing through the plating substrate becomes a current value of the current source.
  • an electroplating method has a constant current control.
  • the current flowing in the plating substrate on the plating substrate side to receive the current is directly adjusted and preset By maintaining the plating current value, it is possible to uniformly plate all the plating substrates treated in one plating solution to significantly reduce the defective rate.
  • FIG. 1 is a configuration diagram of an electroplating system having a constant current control function according to an embodiment of the present invention.
  • FIG. 2 is a side view of the substrate clamping unit according to the embodiment of the present invention.
  • FIG. 3 is a block diagram illustrating a constant current controller according to an embodiment of the present invention.
  • FIG. 4 is a flowchart illustrating an electroplating method having a constant current control function according to an embodiment of the present invention.
  • 1 is a configuration of an electroplating system having a constant current control function according to an embodiment of the present invention.
  • 2 is a side view of the substrate clamping unit according to the embodiment of the present invention.
  • the electroplating system 100 having a constant current control function according to an embodiment of the present invention, the voltage source 110 and extending from the positive terminal of the voltage source 110 And an anode portion 120 immersed in the plating solution 1 in the water tank 10, a substrate clamping portion 140 extending from the cathode terminal of the voltage source 110 to fix the plating substrate S,
  • the constant current controller is provided between the substrate clamping unit 140 and the cathode terminal of the voltage source 110 to control the current flowing through the plating substrate S so that the plating current having a predetermined size flows through the plating substrate S.
  • 150 may be included.
  • the above-described voltage source 110 may include a positive terminal and a negative terminal, and the positive terminal 120 may be connected to the positive electrode terminal immersed in the plating solution 1 in the water tank 10, and the control module may be connected to the negative terminal.
  • the substrate clamping unit 140 may be connected to fix the plating substrate S through the 150.
  • the voltage source 110 is described as an example of a power source, but it should be noted that a current source may be used instead of the voltage source 110.
  • the substrate clamping unit 140 may be coupled to the connection frame 130, and the connection frame 130 may be coupled to the guide rail 160 through the connection member 161, and the substrate clamping unit 140 may be a guide rail ( It may move at a predetermined speed along the axial direction (D1) of 160.
  • the present invention exemplarily illustrates a continuous type in which the substrate clamping part 140 moves at a predetermined speed along the axial direction D1 of the guide rail 160, but it is a matter of course that the case of the batch type is also applicable.
  • connection frame 130 includes a horizontal support 131 to which the constant current controller 150 is coupled, a vertical support 132 to which the substrate clamping unit 140 is coupled, and is provided at an end of the horizontal support 131. Vertical supports 132 may be coupled. Connection frame 130 according to an embodiment of the present invention may be provided in plurality depending on the number of the substrate (S) for plating. The above-described constant current controller 150 may be coupled to the horizontal support 131 by the heat sink 151 for heat dissipation.
  • the substrate clamping unit 140 is coupled to the lower end of the vertical support 132 so that the plating substrate (S) is selectively fixed, the current for plating may be applied from the constant current controller 150.
  • the substrate clamping part 140 is made of a conductive material to conduct current to the plating substrate S, and may be insulated from the vertical support 132.
  • the substrate clamping part 140 may include a clamp support 141 coupled to the vertical support 132, an insulating member 143 for insulating the vertical support 132 and the clamp support 141, and a plating substrate. It may be provided with a forceps member 145 provided in the clamp support 141 to fix (S).
  • the clamp support 141 is coupled to the vertical support 132 through a coupling method such as a bolt and a nut, and a current may be applied from the constant current controller 150.
  • the insulating member 143 may be coupled between the vertical support 132 and the clamp support 141 to insulate the vertical support 132 and the clamp support 141.
  • a plurality of tong members 145 are provided to be spaced apart from the clamp support 141 so as to stably fix the plating substrate S, and part of the tong member 145 is immersed in the plating solution during the plating process of the plating substrate S. .
  • the current may be energized so that the current applied to the clamp support 141 is transferred to the plating substrate S through the tong member 145.
  • the forceps member 145 may change electrical resistance due to adsorption or surface etching of a plating material generated during plating of the plating substrate S.
  • the resistance change of the forceps member 145 changes the plating current value applied to the plating substrate S through the forceps member 145.
  • the constant current controller 150 constantly changes the plating current value. It can be maintained.
  • FIG. 3 is a block diagram illustrating a constant current controller 150 according to an embodiment of the present invention.
  • the constant current controller 150 may be provided between the substrate clamping unit 140 and the negative terminal of the voltage source 110 and may be coupled to the horizontal support 131 of the connection frame 130. (See FIG. 2).
  • the constant current controller 150 may allow a plating current of a predetermined size to flow through the plating substrate S.
  • the constant current controller 150 applies a current for plating the plating substrate S to the substrate clamping unit 140, and the plating is performed according to the change in the electrical resistance R of the substrate clamping unit 140 and the plating solution.
  • the magnitude of the plating current applied to the substrate S may have a predetermined size.
  • the constant current controller 150 is a current source 151 provided between the substrate clamping unit 140 and the negative terminal of the voltage source 110 and the current source 151 according to a switching signal. And switching between the switching element 152 and the substrate clamping part 140 so that the current value of the plating current flowing through the substrate S by the current source 151 becomes a preset current value. It may include a control unit 155 for generating a signal.
  • the current source 151 may be a power source capable of supplying a constant current thereto regardless of the load, and one end thereof may be connected to the negative terminal of the voltage source 110 at the other end of the substrate clamping unit 140.
  • the switching element 152 opens and closes the connection between the current source 151 and the substrate clamping unit 140 according to the switching signal of the controller 155, thereby plating current flowing through the plating substrate S by the current source 151.
  • the current value of may be a preset current value.
  • the switching element 152 includes an insulated gate bipolar transistor (IGBT), a field-effect transistor (FET), a gate turn-off thyristor (GTO), and a junction transistor. And at least one semiconductor switch selected from semiconductor switches including a bipolar junction transistor (BJT).
  • IGBT insulated gate bipolar transistor
  • FET field-effect transistor
  • GTO gate turn-off thyristor
  • BJT bipolar junction transistor
  • the controller 155 may generate a switching signal to be applied to the switching element 152.
  • the above-described switching signal may be a pulse width modulation signal 151a in which an average value of the current values of the plating current flowing through the plating substrate S becomes a preset current value.
  • the above-described switching signal may be an on / off signal in which the current value of the plating current flowing through the plating substrate S becomes the current value of the constant current source 151.
  • the controller 155 may control the gate drive 153 according to the switching signal.
  • the controller 155 may drive the gate drive such that the plating current value and the plating current value of the plating substrate S are maintained at a predetermined current value according to the change of the resistance C between the substrate clamping part 140 and the plating solution. 153 can be controlled.
  • the controller 155 may be formed on the substrate for plating even when an environment in which the plating current value applied to the substrate S is increased or increased may be formed.
  • the gate drive 153 may be controlled such that the current value of the flowing plating current becomes a preset current value.
  • the gate drive 153 may drive the switching element 152 according to the switching signal of the controller 155.
  • the current detector 154 detects the current value of the plating current flowing through the plating substrate S in the form of voltage through the shunt resistor Rs by opening and closing the current source 151 and the substrate clamping unit 140.
  • the current value of the detected plating current may be transmitted to the controller 155.
  • the present invention has been described as sensing current using a shunt resistor Rs in one embodiment, it is a matter of course that a device such as a hall sensor may be used.
  • the wireless communication unit 156 may wirelessly receive a current value of a plating current having a predetermined size from an external server (not shown) through an antenna ANT and transmit it to the controller 155, and may be plated through the antenna ANT.
  • the current value of the plating current flowing through the substrate S can be wirelessly transmitted to an external server in real time.
  • the wireless communication unit 156 may include a communication module of any one of zigbee, blue tooth, radio frequency identification (RFID), and Wifi, and the external server may include a PLC, Of course, various devices such as a computer and a notebook may be used.
  • the above-described constant current controller 150 may be composed of only the current source 151 connected to the substrate clamping unit 140 of course.
  • the above-described electroplating system 100 may include a single substrate clamping unit and a single constant current controller, and at least two or more substrate clamping units 140 spaced apart at predetermined intervals as shown in FIG. 1. And a constant current controller 150 corresponding thereto, in which case the current flowing through the plating substrate S fixed to the at least two substrate clamping units 140 may be individually adjustable (that is, at least two). Note that the magnitudes of the currents flowing through the plating substrate S fixed to the substrate clamping unit 140 may be the same or different sizes.
  • the current flowing through the plating substrate is controlled at the side of supplying power
  • the current flowing through the plating substrate at the side of the plating substrate which receives the current is adjusted.
  • all plating substrates treated in one plating solution can be uniformly plated to significantly reduce the defective rate.
  • FIG. 4 is a flowchart illustrating an electroplating method having a constant current control function according to an embodiment of the present invention.
  • the electroplating method having a constant current control function is connected to the voltage source 110 and the positive electrode terminal of the voltage source 110 as described above, and the plating solution in the water tank 10 ( Plating flowing through the anode portion 120 immersed in 1), the substrate clamping portion 140 extending from the cathode terminal of the voltage source 110 to fix the plating substrate S, and the plating substrate S It can be applied to an electroplating system having a constant current controller 150 for controlling the current value of the current.
  • the present invention may be initiated by fixing the substrate S for plating to the substrate clamping part 140 (S401).
  • the constant current controller 150 may wirelessly receive a current value of a plating current having a predetermined size from an external server (S402).
  • the constant current controller 150 controls the current flowing through the plating substrate S so that the plating current having a predetermined size flows through the plating substrate S so as to be a current value of the plating current having a predetermined size that is wirelessly received. It may be (S403).
  • the constant current control unit 150 opens and closes the connection between the constant current source 151 and the substrate clapping portion 140 according to the switching signal, so that the current of the plating current flowing through the plating substrate S by the constant current source 151.
  • the value can be a preset current value.
  • the above-described switching signal is a pulse width modulation signal in which the average value of the current value of the plating current flowing through the plating substrate S becomes a preset current value, or the current value of the plating current flowing through the plating substrate S is constant current. It may include any one of the on-off signal that is the current value of the source 151.
  • the constant current controller 150 may be provided between the substrate clamping unit 140 and the negative terminal of the voltage source 110.
  • the current flowing through the plating substrate is controlled at the side of supplying power
  • the current flowing through the plating substrate at the side of the plating substrate which receives the current is adjusted.
  • all plating substrates treated in one plating solution can be uniformly plated to significantly reduce the defective rate.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Un système d'électroplacage selon un mode de réalisation de la présente invention, qui a une fonction de régulation de courant constant et comprend un réservoir ayant une solution de placage reçue en son sein, peut comprendre : une source d'alimentation ; une unité d'électrode positive s'étendant de manière articulée à partir d'une borne d'électrode positive de la source d'alimentation et immergée dans la solution de placage dans le réservoir ; une unité de serrage de substrat s'étendant de manière articulée à partir d'une borne d'électrode négative de la source d'alimentation pour fixer un substrat de placage ; et une unité de régulation de courant constant disposée entre l'unité de serrage de substrat et la borne d'électrode négative de la source d'alimentation pour réguler un courant circulant à travers le substrat de placage, de sorte à permettre à un courant de placage ayant une amplitude prédéfinie de circuler à travers le substrat de placage.
PCT/KR2019/009602 2018-08-09 2019-08-01 Système d'électroplacage à fonction de régulation de courant constant et procédé associé Ceased WO2020032476A1 (fr)

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KR10-2018-0093203 2018-08-09
KR1020180093203A KR102111304B1 (ko) 2018-08-09 2018-08-09 정전류 제어기능을 갖는 전기 도금 시스템 및 방법

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Cited By (1)

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CN115505992A (zh) * 2022-01-05 2022-12-23 赵汝谦 一种电镀装置及系统

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KR102410787B1 (ko) * 2020-04-03 2022-06-20 (주)포인텍 이동형 수직애노드가 장착된 도금장치
KR102410794B1 (ko) * 2020-04-03 2022-06-20 (주)포인텍 양산형 고품질 도금 장치
KR102341098B1 (ko) * 2021-05-24 2021-12-28 제타엠텍 주식회사 스마트폰안테나용 미세패턴 몰드 자동화장치 및 방법
KR102575695B1 (ko) * 2022-12-29 2023-09-07 (주)선우하이테크 정전류 제어모듈을 이용한 습식 표면처리장치

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