WO2020036645A2 - Ensemble de lentille à led - Google Patents

Ensemble de lentille à led Download PDF

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Publication number
WO2020036645A2
WO2020036645A2 PCT/US2019/029097 US2019029097W WO2020036645A2 WO 2020036645 A2 WO2020036645 A2 WO 2020036645A2 US 2019029097 W US2019029097 W US 2019029097W WO 2020036645 A2 WO2020036645 A2 WO 2020036645A2
Authority
WO
WIPO (PCT)
Prior art keywords
secondary lens
gasket
lens
led
bezel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2019/029097
Other languages
English (en)
Other versions
WO2020036645A3 (fr
Inventor
Brian Koelling
Michael G. Chen
Craig Raleigh
Paul A. Scherrer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUR-SEAL Corp
Original Assignee
SUR-SEAL Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUR-SEAL Corp filed Critical SUR-SEAL Corp
Publication of WO2020036645A2 publication Critical patent/WO2020036645A2/fr
Publication of WO2020036645A3 publication Critical patent/WO2020036645A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F21V5/048—Refractors for light sources of lens shape the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10—Outdoor lighting
    • F21W2131/103—Outdoor lighting of streets or roads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • LED light fixtures (alternately referred to as "LED light engines”) are becoming commonplace as utilities, governments, businesses, and individuals seek methods of decreasing energy costs. LED light fixtures have the advantage of decreased energy usage when compared to traditional light sources such as incandescent, metal halide, and high-pressure sodium light sources. Additionally, with projected lives of 100,000 hours or more, they provide the ideal replacement for applications were maintenance costs are high, such as in street lighting applications.
  • a typical LED light fixture includes an LED light source mounted within a fixture housing.
  • the LED light source comprises a single LED chip or a small grouping of LED chips.
  • a primary lens also referred to as a "primary optic” is often formed over and otherwise encases each LED chip to protect the LED chip from environmental damage and/or contamination.
  • a secondary lens also referred to as a “secondary optic” is coupled to the housing and arranged to receive, diffuse, and direct light emitted from the LED light source.
  • a gasket is commonly used to generate a seal between the housing and the secondary lens. Creating a sealed environment is particularly important when the fixture will be exposed to harsh environments, such when the fixture is used for outdoor street lighting.
  • Some LED light fixtures also include a bezel that helps secure the secondary lens and the gasket to the housing.
  • the secondary lens, the gasket, and the bezel are collectively referred to as a "lens assembly" and are commonly made from plastics or polymers.
  • the secondary lens, the gasket, and the bezel are formed as separate components that must be preassembled prior to securing the lens assembly to the housing.
  • lens assemblies in recent years have been fabricated as a one-piece component part.
  • the one-piece lens assembly can be formed, for example, via injection molding, such as through an over- molding or co-molding process.
  • the secondary lens, the gasket, and the bezel are often made of different materials that exhibit different softening and curing temperatures.
  • the softening temperature of a second material abnormalities and/or defects can result in the second material.
  • the mold is typically heated to an approximate range of 160°C or 200°C.
  • PMMA, Nylon, Polyester or optical material used for the secondary optics would often deform at these temperatures because temperatures of the mold are above the glass transition of the optical materials.
  • FIG. 1 is an isometric view of an example LED light fixture that may incorporate one or more principles of the present disclosure.
  • FIG. 2 is a cross-sectional side view of the LED light fixture of
  • FIGS. 3A and 3B are isometric and exploded views, respectively, of the LED lens assembly of FIGS. 1 and 2.
  • FIG. 4A depicts an electrical connector operatively coupled to an LED light source.
  • FIG. 4B is an enlarged view of the electrical connector of FIG.
  • the present disclosure is related to LED light fixtures and, more particularly, to LED lens assemblies used in LED light fixtures and methods of manufacturing the LED lens assemblies.
  • the embodiments discussed herein describe an LED lens assembly having at least a secondary lens and a gasket molded to the secondary lens.
  • the gasket may be over-molded or co-molded to the secondary lens, and at least one of the secondary lens and the gasket is made of a material that is curable using low temperature electromagnetic radiation.
  • the gasket may be made of a silicone that is curable using ultraviolet (UV) light emitted at or near room temperature. This may prove advantageous in mitigating damage to the secondary lens, which may be made of a material having glass transition temperature below the cure temperature of conventional gasket materials.
  • the embodiments discussed herein also describe a fluid-tight electrical connector that can be used with an LED light fixture that incorporates the LED lens assembly briefly described above.
  • the electrical connector may be electrically coupled to an LED light source to power one or more LED chips mounted thereon.
  • the electrical connector may extend into the LED light fixture at a point of entry, and the point of entry may be sealed. The combination of the gasket of the LED lens assembly and the sealed point of entry effectively isolate the interior of the LED light fixture from external contamination, such as moisture, dust, and other contaminants.
  • FIG. 1 is an isometric view of an example LED light fixture 100 that may incorporate one or more principles of the present disclosure.
  • the LED light fixture 100 includes a housing 102, a lens assembly 104 coupled to the housing 102, and a support 104 used to support the LED light fixture 100 in a desired orientation.
  • the LED light fixture 100 can be used as an indoor or an outdoor luminaire.
  • FIG. 2 is a cross-sectional side view of the LED light fixture
  • the housing 102 defines an interior 202 and an LED light source 202 is mounted to the housing 102 within the interior 202.
  • the LED light source 202 may include a circuit board 204 and one or more LED chips 206 operatively coupled to the circuit board 204.
  • the circuit board 204 may be coupled to the housing 102 with a bracket 208 or another suitable form of attachment.
  • Each LED chip 206 may have a primary lens 210 (alternately referred to as a "primary optic") formed thereon or otherwise encapsulating the corresponding LED chip 206.
  • the primary lens 210 serves to protect the corresponding LED chip 206 from environmental damage or contamination. While six LED chips 206 and corresponding primary lenses 210 are shown in FIG. 2, more or less than six may be employed, without departing from the scope of the disclosure. In at least one embodiment, for example, the several primary lenses 210 may be integrally formed as a unitary structure that is attached to the circuit board 204 as a single component part.
  • the lens assembly 104 may include a secondary lens 212
  • the bezel 214 holds the secondary lens 212 and is removably coupled to the housing 102 with one or more mechanical fasteners 218.
  • the gasket 216 interposes the bezel 214 and the housing 102 to seal the interior 202 of the housing 102.
  • the gasket 216 may prove vital in preventing contamination of the interior 202, such as by preventing the ingress of moisture and dust. In other embodiments, the gasket 216 may instead directly interpose the secondary lens 212 and the housing 102.
  • the bezel 214 may be omitted and the mechanical fasteners 218 may instead be configured to extend through and secure the secondary lens 212 to the housing 102.
  • the secondary lens 212 is offset from the LED light source 202. The space and distance separating the secondary lens 212 and the LED light source 202 allows full distribution of the light emitted from the LED chips 206 to the secondary lens 212. More specifically, the secondary lens 212 is arranged relative to the LED light source 202 and designed to direct the light produced by the LED chip(s) 206 to an area where the light is needed, and otherwise away from areas where it is not needed or might otherwise cause light trespass. Light trespass occurs when light spills into areas where it is not wanted.
  • the secondary lens 212 may be designed to create a very intense, but small light pattern, to create a broad and diffused light pattern, to truncate the light to prevent light trespass, or to achieve any combination of those objectives.
  • FIGS. 3A and 3B are isometric and exploded views, respectively, of the LED lens assembly 104, according to one or more embodiments.
  • a plurality of fastener holes 302 may be defined in one or both of the bezel 214 and the gasket 216 for receiving the mechanical fasteners 218 (FIG. 2) used to secure the LED lens assembly 104 to the housing 102 (FIGS. 1 and 2).
  • the bezel 214 may be omitted from the LED lens assembly 104.
  • the gasket 216 may be sized and otherwise configured to secure the secondary lens 212 to the housing 102 and simultaneously seal the interior 202 (FIG. 2).
  • FIG. 3B depicts three distinct secondary lenses 212, it is contemplated herein to have more or less than three distinct secondary lenses 212, including an embodiment with a single secondary lens 212, without departing from the scope of the disclosure.
  • the bezel 214 may be made of a metal, a hard plastic, or any other material that is sufficiently rigid to secure the secondary lens 212 to the housing 102 (FIGS. 1 and 2).
  • the bezel 214 may be stamped from sheet metal in a die.
  • Suitable metals for the bezel 214 include, but are not limited to, aluminum, stainless steel, copper, brass, or any combination thereof.
  • the bezel 214 may be injection molded.
  • Suitable plastics for the bezel 214 include, but are not limited to, an acrylic, a polycarbonate, a silicone, or another suitable polymer or thermoplastic.
  • the secondary lens 212 may be made of an optical (i.e., including but not limited to transparent or translucent) material that is injection molded.
  • Suitable optical materials for the secondary lens 212 include, but are not limited to, an acrylic (for example, acrylate polymer(such as poly(methyl methacrylate), alicyclic acrylate), a polycarbonate, a polystyrene, cyclic olefins, liquid silicone rubber (LSR), a polyester, polyetherimide, NAS (styrene acrylic copolymer), SAN (styrene acrylonitrile), glass, optical cramics, or another optical material including but not limited to thermoplastic, thermosetting (collectively organic) or inorganic materials.
  • the secondary lens 212 may be made of glass.
  • the gasket 216 may also be injection molded and made of a silicone or another type of material capable of forming a fluid-tight seal.
  • the gasket 216 would traditionally be made individually and subsequently assembled together for joint coupling to the housing 102 (FIGS. 1 and 2).
  • some or all of the component parts of the LED lens assembly 104 may be fabricated as a one-piece structure.
  • the term "one-piece structure" refers to two or more of the secondary lens 212, the bezel 214, and the gasket 216 forming a unitary and/or integral structure fabricated via an over-molding process or a co-molding process.
  • the secondary lens 212 and the gasket 216 may be formed as a one-piece structure via an over-molding process.
  • the secondary lens 212 may be formed in a first mold during a first injection molding process.
  • the gasket 216 may then be molded onto the secondary lens 212 during a second injection molding process.
  • the secondary lens 212 may be transferred to a second mold to undertake the second injection molding process. In other cases, however, the secondary lens 212 may remain, and a portion of the first mold may be modified to facilitate the second injection molding process.
  • the over-molded material of the gasket 216 forms a bond with the material of the secondary lens 212 and thereby creates a one-piece structure.
  • the process may be swapped (reversed), where the gasket 216 is instead formed first and the secondary lens 212 is over-molded onto the gasket 216, without departing from the scope of the disclosure.
  • the secondary lens 212 and the gasket 216 may be formed as a one-piece structure during a co-molding process.
  • the secondary lens 212 and the gasket 216 are simultaneously formed during a single injection molding process. More specifically, the secondary lens 212 may be formed through a first injection molding shot, and the gasket 216 is subsequently formed through a second injection molding shot. This process can be facilitated with a single mold or with multiple molds and, as with the above-described over-molding process, the co-molded material of the gasket 216 forms a bond with the material of the secondary lens 212.
  • the co-molding process may also be swapped (reversed), where the gasket 216 is instead formed via the first shot and the secondary lens 212 is then formed on the gasket 216 via a second shot, without departing from the scope of the disclosure.
  • the bezel 214 may be over-molded to the secondary lens 212 before or after over-molding the gasket 216 to the secondary lens 212.
  • the bezel 214 may be co-molded to the secondary lens 212 before or after co-molding the gasket 216 to the secondary lens 212, without departing from the scope of the disclosure.
  • the secondary lens 212 may be made of an acrylic that exhibits a glass transition temperature of around 200 °F (93.3 °C)
  • the gasket 216 may be made of a traditional platinum curable silicone that exhibits a curing temperature ranging between about 250 °F (121.1 °C) and about 450°F, and in some instances from between about 300-400°F.
  • the secondary lens 212 will be subjected to temperatures exceeding the glass transition temperature of acrylic, which might result in abnormalities and/or defects developing in the secondary lens 212.
  • At least one of the secondary lens 212 and the gasket 216 may be made of a material that is curable (catalyzed) using low temperature electromagnetic radiation.
  • electromagnetic radiation refers to ultraviolet (UV) light, visible light, radio waves, microwave radiation, infrared and near-infrared radiation, X-ray radiation, gamma ray radiation, or any combination thereof.
  • low temperature electromagnetic radiation refers to electromagnetic radiation emitted, dispersed, or otherwise absorbed at a temperature of around 185-200 °F or below.
  • the glass transition temperature (Tg) of atactic PMMA is around 105 °C (221 °F).
  • the Tg values of many commercial grades of PMMA range from 85 to 165 °C (185 to 329 °F); the range is wide due to the vast number of commercial compositions which are copolymers with co-monomers other than methyl methacrylate.
  • the low temperature electromagnetic radiation may comprise UV light transmitted or emitted at ambient (room) temperature, or typically between about 59 °F (15 °C) and about 77 °F (25 °C), but as high as approximately 100-110°F.
  • the secondary lens 212 may be made of an optically clear material, such as an acrylic, a polycarbonate, liquid silicone rubber (LSR), a polyester, or glass.
  • the gasket 216 may be made of a material that is curable using low temperature electromagnetic radiation. Suitable materials that may be curable using low temperature electromagnetic radiation include, but are not limited to, UV curable silicone rubber, UV curable polyester, UV curable PMMA, other UV curable optical materials, and any combination thereof.
  • the material for the gasket 216 may be cured at or near room temperature upon being exposed to UV light. This may prove advantageous in mitigating any adverse effects on the secondary lens 212 that might otherwise occur with materials requiring elevated cure temperatures.
  • the material for the gasket 216 may be cured by passing the UV light through the secondary lens 212, if needed.
  • FIG. 4A depicts an example electrical connector 402 operatively coupled to a LED light source 404, according to one or more embodiments.
  • the LED light source 404 may be similar to or the same as the LED light source 202 of FIG. 2 and may therefore be best understood with reference thereto, where like numerals represent like components not described again.
  • the LED light source 404 includes the circuit board 204 and a plurality of LED chips 206 mounted thereon.
  • the electrical connector 402 includes one or more wires 406
  • An adapter 408 is coupled to the distal end of the wires 406 and enables the electrical connector 402 to be electrically coupled to a source of electrical power.
  • FIG. 4B is an enlarged view of a portion of the electrical connector 402 entering an example LED light fixture 410, according to one or more embodiments.
  • the LED light fixture 410 may be similar in some respects to the LED light fixture 100 of FIGS. 1 and 2.
  • the LED light fixture 410 may include a secondary lens 412 and a bezel 414 that secures the secondary lens to the circuit board 204.
  • a gasket 416 (shown in dashed lines) may interpose the circuit board 204 and one or both of the secondary lens 412 and the bezel 414 to provide a sealed interface at the circuit board 204.
  • the bezel 414 may be omitted and the gasket 416 may be configured to secure the secondary lens 412 to the circuit board 204 and simultaneously provide a sealed interface.
  • the secondary lens 412, the bezel 414, and the gasket 416 may be the same as or similar to the secondary lens 212, the bezel 214, and the gasket 216 of FIG. 2. Accordingly, in at least one embodiment, the gasket 416 may be over-molded onto the secondary lens 412 or co-molded with the secondary lens 412, as generally described above. Moreover, the bezel 614 may be over-molded to the secondary lens 412 before or after over-molding the gasket 416 to the secondary lens 412, or alternatively co-molded to the secondary lens 412 before or after co-molding the gasket 416 thereto.
  • the wires 406 of the electrical connector 402 extend into the LED light fixture 410 at a point of entry 418.
  • the point of entry 418 may comprise, for example, an aperture formed in a sidewall of the LED light fixture 410.
  • the point of entry 418 is defined in the bezel 414, but may otherwise comprise any opening that facilitates access into the interior of the LED light fixture 410.
  • the wires 406 extend through the gasket 416. In other embodiments, the gasket 406 is compressed over the wires 406 to form a seal thereon.
  • the point of entry 418 may be sealed with a seal 420 to prevent the ingress of moisture, dust, and other contaminants into the interior of the LED light fixture 410 via the point of entry 418.
  • the electrical connector 402 may be referred to as a "fluid- tight" electrical connector. The combination of the gasket 416 and the seal 420 effectively isolate the interior of the LED light fixture 410 from external contamination.
  • the seal 420 may be made of any material capable of providing a fluid-tight seal.
  • the seal 420 may comprise room temperature vulcanizing (RTV) silicone.
  • the seal 420 may comprise a molded gasket or seal configured (sized) to receive the wires 406 and provide a fluid-tight seal around the wires 406 and the point of entry 412.
  • compositions and methods are described in terms of “comprising,” “containing,” or “including” various components or steps, the compositions and methods can also “consist essentially of” or “consist of” the various components and steps. All numbers and ranges disclosed above may vary by some amount. Whenever a numerical range with a lower limit and an upper limit is disclosed, any number and any included range falling within the range is specifically disclosed. In particular, every range of values (of the form, “from about a to about b,” or, equivalently, “from approximately a to b,” or, equivalently, “from approximately a-b”) disclosed herein is to be understood to set forth every number and range encompassed within the broader range of values.
  • phrases "at least one of” allows a meaning that includes at least one of any one of the items, and/or at least one of any combination of the items, and/or at least one of each of the items.
  • the phrases “at least one of A, B, and C” or “at least one of A, B, or C” each refer to only A, only B, or only C; any combination of A, B, and C; and/or at least one of each of A, B, and C.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

La présente invention concerne un ensemble de lentille à LED qui comprend une lentille secondaire, et un joint d'étanchéité moulé sur la lentille secondaire. Ladite lentille secondaire et/ou ledit joint d'étanchéité sont constitués d'un matériau qui est durcissable à l'aide d'un rayonnement électromagnétique basse température.
PCT/US2019/029097 2018-04-26 2019-04-25 Ensemble de lentille à led Ceased WO2020036645A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862663045P 2018-04-26 2018-04-26
US62/663,045 2018-04-26

Publications (2)

Publication Number Publication Date
WO2020036645A2 true WO2020036645A2 (fr) 2020-02-20
WO2020036645A3 WO2020036645A3 (fr) 2020-07-23

Family

ID=68292352

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2019/029097 Ceased WO2020036645A2 (fr) 2018-04-26 2019-04-25 Ensemble de lentille à led

Country Status (2)

Country Link
US (1) US20190331317A1 (fr)
WO (1) WO2020036645A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020100757A1 (de) * 2020-01-15 2021-07-15 HELLA GmbH & Co. KGaA Lichteinheit für eine Beleuchtungseinrichtung eines Fahrzeugs mit einem Halbleiter-Leuchtmittel und mit einer Schutzeinrichtung für das Halbleiter-Leuchtmittel

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002091030A2 (fr) * 2001-05-07 2002-11-14 Opticast Inc. Procede et appareil de fabrication de lentilles optiques en plastique et de moules
US7517486B2 (en) * 2003-05-16 2009-04-14 Du Pont Performance Elastomers L.L.C. Process for preparing UV curable sealing assemblies
US9176260B2 (en) * 2013-02-26 2015-11-03 Sur-Seal Corporation LED lens assembly
DK3128231T3 (en) * 2015-08-06 2018-12-17 Schreder IMPROVEMENTS OR RELATING TO LIGHT-EMITTING DIODEMULS
US10690315B2 (en) * 2017-07-12 2020-06-23 Ideal Industries Lighting Llc Luminaire utilizing gasket vent

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Publication number Publication date
WO2020036645A3 (fr) 2020-07-23
US20190331317A1 (en) 2019-10-31

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