WO2020043580A1 - Gestion de la qualité pour l'impression de pâte à braser sur les pistes conductrices - Google Patents

Gestion de la qualité pour l'impression de pâte à braser sur les pistes conductrices Download PDF

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Publication number
WO2020043580A1
WO2020043580A1 PCT/EP2019/072428 EP2019072428W WO2020043580A1 WO 2020043580 A1 WO2020043580 A1 WO 2020043580A1 EP 2019072428 W EP2019072428 W EP 2019072428W WO 2020043580 A1 WO2020043580 A1 WO 2020043580A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
conductor tracks
circuit board
printed circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/072428
Other languages
German (de)
English (en)
Inventor
Rene Blank
Peter Frühauf
Matthias Heimann
Stefan Nerreter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of WO2020043580A1 publication Critical patent/WO2020043580A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Definitions

  • the invention relates to a printed circuit board with a structure predetermined by conductor tracks for applying solder paste, such that the conductor tracks are spaced apart from one another, and a method for quality management of solder paste printing on conductor tracks.
  • Solder paste printing is a quality-determining factor for the production of electronic assemblies in the SMT process. If mistakes are made undetected, this has a direct, negative influence on the FPY (first pass yield) and leads to rejects or expensive rework. A possible error is offset printing, i.e. , The printed image is offset in the lateral direction compared to the copper structuring of the circuit board. This makes it easy for bridges between adjacent structures to appear, especially with small, high-pitch connection pitches.
  • the object of the present invention is to provide a printed circuit board which is improved in terms of quality and to provide a method for quality management.
  • this object is achieved according to the invention by a circuit board with the features of claim 1 and by a method with the features of claim 8.
  • Advantageous training and further developments, which can be used individually or in combination with one another, are the subject of the dependent claims.
  • this object is achieved by a printed circuit board with a structure predetermined by conductor tracks for applying solder paste, in such a way that the conductor tracks are spaced apart from one another by spaces.
  • the invention is characterized in that an offset of the solder paste from the predetermined structure of conductor tracks can be determined by measuring an electrical variable.
  • the invention is based on a comb structure which e.g. at the edge of the circuit boards, i.e. , at the unused edges, in the normal circuit board process and at corresponding openings in the template. These breakthroughs are designed so that the copper tracks are printed with solder paste, but the gaps remain free.
  • the copper / solder paste structure has the same width as the insulating gaps, for example 200 ml copper / breakthrough - 200 mm gap. If there is an offset during printing, the solder paste depots are pressed in whole or in part into the spaces between the copper tracks. The width of the insulating gaps is reduced, and a certain electrical conductivity is formed by the solder paste.
  • the comb structures are designed in such a way that opposite electrical potentials face each other, so that the entire structure is designed as a capacitor. Its capacity changes with the material in the space - in this case, through the solder paste.
  • the degree of offset can therefore be determined by means of a capacitance measurement. If these comb structures are arranged in 0 ° and 90 °, the offset in both main directions x and y can be determined. If the structures are placed at the corners of the usable area, the offset in the template or PCB can be determined and corrected. Furthermore, an offset angle can also be determined via a suitable arrangement of the combs.
  • the novelty of the invention consists in the inline determination of the offset in solder paste printing, ie, after printing, a decision can be made directly about the quality of the printed circuit board and their further use as rejects or as an intermediate to be further processed in the manufacturing process. In contrast to the SPI, this is not very time-consuming and requires little computing power.
  • the correction values can be determined directly in the machine. According to the invention, a capacitive measurement or a resistance measurement for determining the offset is carried out here, in contrast to the known optical method.
  • the measurement is a resistance measurement or a determination of a capacitive variable.
  • a further development of this concept according to the invention can consist in that the structure predetermined by conductor tracks is designed as a comb structure.
  • the comb structures are designed in such a way that opposite electrical potentials oppose each other, so that the entire comb structure is designed as a capacitor.
  • the combination of conductor track and solder paste has the same width as the resulting insulating spaces between the conductor tracks.
  • the combination of conductor track and solder paste or the insulating spaces has a width of 150 to 300 mpi, in particular of 200 mta.
  • a continuation of the concept according to the invention can consist in that the structures of the predetermined conductor tracks are arranged at an angle of 0 ° or 90 ° to one another.
  • the object is also achieved by a method for the quality management of solder paste printing on conductor tracks, a comb structure being produced in the manufacturing process of a printed circuit board with openings, in such a way that the conductor tracks are printed with solder paste, but gaps remain free, the conductor track / solder paste Structure has the same width as the insulating gaps and the degree of offset, which results from solder paste depots in the gaps, is determined by measuring an electrical variable.
  • a continuation of this concept provides that the quality management of the solder paste printing on conductor tracks is carried out via a capacitive measurement or a resistance measurement.
  • the printed circuit board according to the invention has a special comb structure on the top and / or underside, which is positioned, for example, on the edge or on unused areas of the printed circuit board.
  • This comb structure is produced in the normal manufacturing process of the printed circuit board and has conductor tracks and openings in its structural design.
  • This defined comb structure is designed in such a way that the conductor tracks, preferably made of copper, are printed with solder paste, but the spaces remain free, the conductor track / solder paste combination having the same width as the insulating spaces. Structural units separate from one another result which have the same geometry and are congruent when superimposed.
  • the structure units can, for example, have a printed main web, from which printed secondary webs branch off at a preferably 90 ° angle at preferably uniform intervals.
  • two of these structural units form a comb structure, wherein the structural units can be mirrored opposite one another in such a way that the branch lines of the structural units are arranged alternately and at a defined distance from one another.
  • the comb structure is designed so that opposing potentials oppose each other so that the comb structure acts as a capacitor. The capacitance of this capacitor correlates with the material, ie the solder paste, in the spaces.
  • Fig. 1 shows a schematic representation of an inventive circuit board with an embodiment of a
  • Figure 2 is a sectional view of a circuit board with conductor tracks.
  • FIG. 3 shows a sectional view of a printed circuit board according to the invention with conductor tracks which are printed with solder paste without offset;
  • Fig. 4 is a sectional view of a circuit board according to the invention with conductor tracks, which are partially printed incorrectly with an offset of solder paste.
  • the circuit board 1 shows a circuit board 1 according to the invention with an exemplary embodiment of a comb structure 2.
  • the circuit board 1 according to the invention has a top and / or bottom Special comb structure 2, which is positioned, for example, on the edge or on unused areas of the circuit board 1.
  • This comb structure 2 is produced in the normal manufacturing process of the circuit board 1 and has conductor tracks 3 and openings in its structural design.
  • This defined comb structure 2 is designed such that the conductor tracks 3, preferably made of copper, are printed with solder paste, but the spaces 4 remain free, the conductor track / solder paste combination having the same width as the insulating spaces 4.
  • Structural units 5 that are separate from one another result, which have the same geometry and are congruent when superimposed.
  • the structural units 5 can, for example, have a printed main track 6 from which branched printed secondary webs 7 branch off at a preferably 90 ° angle at preferably uniform intervals.
  • two of these structural units 5 form a comb structure 2, the structural units 5 being able to lie opposite one another in a mirrored manner in such a way that the secondary tracks 7 of the structural units 5 are arranged alternately and at a defined distance from one another.
  • Comb structure 2 is designed in such a way that opposite potentials 8, 9 face each other, so that the
  • Comb structure 2 acts as a capacitor.
  • the capacitance of this capacitor correlates with the material, i.e. the solder paste, in the spaces 4.
  • FIG. 2 shows a circuit board 1 with conductor tracks 3, the individual capacitances 10 resulting between the individual, adjacent conductor tracks 3, which additively form a total capacitance.
  • FIG. 3 shows a printed circuit board 1 according to the invention with conductor tracks 3 which are printed with solder paste without offset.
  • the individual capacitances 10 which additively form a total capacitance.
  • Fig. 4 shows a circuit board 1 according to the invention with conductor tracks 3, which are partially printed incorrectly with an offset of solder paste.
  • the faulty solder paste printing 11 results in the sum of the individual capacities 10, which are shown in the example in FIG. 3 with an optimal solder paste printing 11, no longer the sum of the individual capacities, which in the example in FIG. 4 with the faulty solder paste printing 11 are shown. This capacitive measurement is therefore a quality criterion for the solder paste printing 11 on conductor tracks 1.
  • the printed circuit board according to the invention with a structure for applying solder paste, which is predetermined by conductor tracks, is characterized in that quality management for solder paste printing on the conductor tracks can be carried out by simply measuring an electrical variable such as a capacitance measurement or a resistance measurement.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (1) comprenant une structure prédéterminée à l'aide des pistes conductrices (3) pour une application de pâte à braser, conçue de telle sorte que les pistes conductrices (3) sont espacées les unes des autres à l'aide des espaces intermédiaires (4), ainsi qu'un procédé de gestion de la qualité d'une impression de pâte à braser ( 11) sur les pistes conductrices (3). L'invention est caractérisée en ce que, à l'aide d'une mesure d'une variable électrique, un décalage de la pâte à braser par rapport à la structure prédéterminée des pistes conductrices (3) peut être déterminé.
PCT/EP2019/072428 2018-08-28 2019-08-22 Gestion de la qualité pour l'impression de pâte à braser sur les pistes conductrices Ceased WO2020043580A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018214520.2 2018-08-28
DE102018214520.2A DE102018214520A1 (de) 2018-08-28 2018-08-28 Qualitätsmanagement für den Lotpastendruck auf Leiterbahnen

Publications (1)

Publication Number Publication Date
WO2020043580A1 true WO2020043580A1 (fr) 2020-03-05

Family

ID=67956693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/072428 Ceased WO2020043580A1 (fr) 2018-08-28 2019-08-22 Gestion de la qualité pour l'impression de pâte à braser sur les pistes conductrices

Country Status (2)

Country Link
DE (1) DE102018214520A1 (fr)
WO (1) WO2020043580A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0909117A2 (fr) * 1997-10-08 1999-04-14 Delco Electronics Corporation Méthode de fabrication de circuits à film épais

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10311822A1 (de) * 2003-03-13 2004-10-07 Ekra Eduard Kraft Gmbh Maschinenfabrik Verfahren und Vorrichtung zur Kontrolle oder Beeinflussung des Druckprozesses beim Lotpastendruck
KR101491037B1 (ko) * 2012-04-27 2015-02-23 주식회사 고영테크놀러지 스크린 프린터 장비의 보정방법 및 이를 이용한 기판 검사시스템

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0909117A2 (fr) * 1997-10-08 1999-04-14 Delco Electronics Corporation Méthode de fabrication de circuits à film épais

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ROCAK D ET AL: "Solder paste for fine line printing in hybrid microelectronics", MICROELECTRONICS JOURNAL, MACKINTOSH PUBLICATIONS LTD. LUTON, GB, vol. 26, no. 5, 1 July 1995 (1995-07-01), pages 441 - 447, XP004002155, ISSN: 0026-2692, DOI: 10.1016/0026-2692(95)98946-O *

Also Published As

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