WO2020076020A1 - Masque intégré à un cadre et procédé de fabrication d'un masque intégré à un cadre - Google Patents

Masque intégré à un cadre et procédé de fabrication d'un masque intégré à un cadre Download PDF

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Publication number
WO2020076020A1
WO2020076020A1 PCT/KR2019/013085 KR2019013085W WO2020076020A1 WO 2020076020 A1 WO2020076020 A1 WO 2020076020A1 KR 2019013085 W KR2019013085 W KR 2019013085W WO 2020076020 A1 WO2020076020 A1 WO 2020076020A1
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WO
WIPO (PCT)
Prior art keywords
mask
frame
sheet portion
temperature
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/013085
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English (en)
Korean (ko)
Inventor
이유진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olum Material Corp
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Olum Material Corp
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Publication date
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Priority to CN201980062038.2A priority Critical patent/CN112740438A/zh
Publication of WO2020076020A1 publication Critical patent/WO2020076020A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

Definitions

  • the present invention relates to a frame-integrated mask and a method for manufacturing the frame-integrated mask. More specifically, the present invention relates to a frame-integrated mask and a method for manufacturing the frame-integrated mask, which can make the mask integrally with the frame, and can clearly align the masks between the masks.
  • a FMM (Fine Metal Mask) method is used, in which a thin metal mask is closely adhered to a substrate to deposit an organic material at a desired location.
  • the mask is manufactured in a stick form, a plate form, etc., and then the mask is welded and fixed to the OLED pixel deposition frame.
  • a plurality of cells corresponding to one display may be provided.
  • several masks can be fixed to the OLED pixel deposition frame for large-area OLED manufacturing.
  • each mask is tensioned to be flat. Adjusting the tensile force so that the entire part of the mask is flat is a very difficult task.
  • the current QHD image quality is 500 ⁇ 600 pixel per inch (PPI), and the pixel size reaches about 30 ⁇ 50 ⁇ m, and 4K UHD, 8K UHD high image quality is higher than ⁇ 860 PPI, ⁇ 1600 PPI, etc. It has the resolution of.
  • the alignment error between each cell should be reduced to a few ⁇ m in consideration of the pixel size of the ultra-high quality OLED, and an error out of this may lead to product failure, so the yield may be very low. Therefore, there is a need to develop a technique that prevents deformation such as a mask being crushed or distorted, a technique for making alignment clear, and a technique for fixing a mask to a frame.
  • the present invention has been made to solve the problems of the prior art as described above, and an object thereof is to provide a frame-integrated mask and a method for manufacturing a frame-integrated mask capable of forming an integrated structure.
  • an object of the present invention is to provide a frame-integrated mask and a method for manufacturing the frame-integrated mask, which can prevent deformation such as a mask being crushed or distorted and make alignment clear.
  • an object of the present invention is to provide a frame-integrated mask and a method for manufacturing the frame-integrated mask, which significantly reduce the manufacturing time and significantly increase the yield.
  • the above object of the present invention is a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed, the frame comprising: a border frame portion including a hollow region; It has a plurality of mask cell regions, includes a mask cell sheet portion connected to the edge frame portion, each mask is composed of a metal sheet (sheet) produced by a rolling (rolling) process, each mask is a mask cell sheet It is achieved by a frame-integrated mask, connected to the top of the part.
  • the mask cell sheet portion may include a plurality of mask cell regions along at least one of a first direction and a second direction perpendicular to the first direction.
  • the mask cell sheet portion includes a border sheet portion; At least one first grid sheet portion extending in the first direction and having both ends connected to the edge sheet portion; And at least one second grid sheet portion formed to extend in a second direction perpendicular to the first direction, intersecting the first grid sheet portion, and having both ends connected to the edge sheet portion.
  • Each mask may correspond to each mask cell region.
  • the mask includes a mask cell on which a plurality of mask patterns are formed, and a dummy around the mask cell, and at least a portion of the dummy may be attached to the mask cell sheet portion.
  • the thickness of the border frame portion may be thicker than that of the mask cell sheet portion, and the thickness of the mask cell sheet portion may be thicker than that of the mask.
  • the mask may be formed to have a thinner thickness on the metal sheet produced by the rolling process.
  • the mask and the frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.
  • the above object of the present invention is a method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting a mask are integrally formed, comprising: (a) preparing a border frame portion including a hollow region; (b) connecting a mask cell sheet portion having a plurality of mask cell regions to an edge frame portion; (c) a mask made of a metal sheet manufactured by a rolling process corresponding to one mask cell region of the mask cell sheet portion; And (d) attaching at least a portion of the rim of the mask to the mask cell sheet portion.
  • the above object of the present invention is a method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting a mask are integrally formed, comprising: (a) preparing a border frame part including a hollow region; (b) connecting the planar mask cell sheet portion to the border frame portion; (c) forming a plurality of mask cell regions on the mask cell sheet portion; (d) corresponding to a mask cell region of a mask cell sheet portion comprising a mask made of a metal sheet manufactured by a rolling process; And (e) attaching at least a portion of the rim of the mask to the mask cell sheet portion.
  • the mask cell sheet portion includes a border sheet portion; At least one first grid sheet portion extending in one direction and having both ends connected to the edge sheet portion; And at least one second grid sheet portion formed to extend in a second direction perpendicular to the first direction, intersecting the first grid sheet portion, and having both ends connected to the edge sheet portion.
  • the edges of the mask cell sheet portion may be welded to the edge frame portion.
  • the step of raising the temperature of the process region including the frame to the first temperature is further performed, and at least a part of the border of the mask is mask cell.
  • the step of lowering the temperature of the process region including the frame to the second temperature may be further performed.
  • the first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature
  • the second temperature is at least a temperature lower than the first temperature
  • the first temperature is any one of 25 ° C to 60 ° C
  • the second temperature is the first temperature.
  • the temperature is any one of 20 ° C to 30 ° C lower than 1 temperature
  • the OLED pixel deposition process temperature may be any one of 25 ° C to 45 ° C.
  • tension may not be applied to the mask.
  • the mask attached to the frame is contracted so that tension can be applied.
  • the mask and the frame can achieve an integral structure.
  • FIG. 1 is a schematic view showing a conventional OLED pixel deposition mask.
  • FIG. 2 is a schematic diagram showing a process of attaching a conventional mask to a frame.
  • FIG. 3 is a schematic diagram showing that an alignment error occurs between cells in the process of stretching a conventional mask.
  • FIG. 4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
  • FIG. 5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
  • FIG. 7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing a state in which a tension type of a mask according to an embodiment of the present invention and a mask correspond to a cell region of a frame.
  • FIG. 9 is a schematic diagram illustrating a process of attaching a mask according to an embodiment of the present invention in correspondence with a cell region of a frame.
  • FIG. 10 is a partially enlarged cross-sectional view illustrating a form in which a mask according to various embodiments of the present invention is attached to a frame.
  • 11 to 13 are schematic views showing a process of attaching a frame to a mask according to another embodiment of the present invention.
  • FIG. 14 is a schematic diagram showing an OLED pixel deposition apparatus using an integrated frame mask according to an embodiment of the present invention.
  • FIG. 1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.
  • the conventional mask 10 may be manufactured in a stick-type or plate-type.
  • the mask 10 shown in (a) of FIG. 1 is a stick-shaped mask and can be used by welding and fixing both sides of the stick to an OLED pixel deposition frame.
  • the mask 100 illustrated in FIG. 1B is a plate-type mask and may be used in a large area pixel formation process.
  • the body 10 of the mask 10 (or the mask film 11) is provided with a plurality of display cells C.
  • One cell C corresponds to one display such as a smartphone.
  • the pixel pattern P is formed in the cell C to correspond to each pixel of the display.
  • a plurality of pixel patterns P corresponding to R, G, and B appear.
  • the pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P form a cluster to form one cell C, and a plurality of cells C may be formed on the mask 10.
  • FIG. 2 is a schematic view showing a process of attaching the conventional mask 10 to the frame 20.
  • 3 is a schematic diagram showing that alignment errors between cells occur in the process of tensioning (F1 to F2) of the conventional mask 10.
  • the stick mask 10 having six cells C: C1 to C6 shown in FIG. 1A will be described as an example.
  • the stick mask 10 must be flattened.
  • the stick mask 10 is stretched as it is pulled by applying tensile force F1 to F2 in the long axis direction of the stick mask 10.
  • the stick mask 10 is loaded on the frame 20 in the form of a square frame.
  • the cells C1 to C6 of the stick mask 10 are positioned in an empty area inside the frame of the frame 20.
  • the frame 20 may be sized such that cells C1 to C6 of one stick mask 10 are positioned in an empty area inside the frame, and cells C1 to C6 of the plurality of stick masks 10 are framed. It may be large enough to be located in the interior empty area.
  • Fig. 2 (c) shows a cross-section of a stick mask 10 and a frame connected to each other.
  • the alignment between the mask cells (C1 ⁇ C3) does not work well.
  • the distances D1 to D1 "and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed.
  • the stick mask 10 is a large area including a plurality of (for example, six) cells C1 to C6 and has a very thin thickness of several tens of ⁇ m, so it is easily struck or distorted by a load.
  • the fine error of the tensile force may cause an error in the degree of stretching or unfolding each cell (C1 ⁇ C3) of the stick mask 10, accordingly, the distance (D1) between the mask pattern (P) ⁇ D1 ", D2 ⁇ D2") causes a problem that is different.
  • the alignment error does not exceed 3 ⁇ m. It is desirable not to.
  • the alignment error between adjacent cells is referred to as pixel position accuracy (PPA).
  • the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 to form an integral structure with the frame 200.
  • the mask 100 integrally formed in the frame 200 is prevented from being deformed, such as being struck or twisted, and can be clearly aligned with the frame 200.
  • the manufacturing time for integrally connecting the mask 100 to the frame 200 is significantly reduced, and the yield can be significantly increased.
  • Figure 4 is a front view showing a frame-integrated mask according to an embodiment of the present invention [Fig. 4 (a)] and side cross-sectional view [Fig. 4 (b)], Figure 5 according to an embodiment of the present invention It is a front view (FIG. 5 (a)) and a side cross-sectional view (FIG. 5 (b)) showing the frame.
  • the frame-integrated mask may include a plurality of masks 100 and one frame 200.
  • a plurality of masks 100 are attached to the frame 200 one by one.
  • the mask 100 having a square shape will be described as an example, but the masks 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200, and the frame 200 ), The protrusion can be removed.
  • a plurality of mask patterns P may be formed in each mask 100, and one cell C may be formed in one mask 100.
  • One mask cell C may correspond to one display such as a smartphone.
  • the mask 100 may use a metal sheet produced by a rolling process.
  • the mask 100 may be made of an invar having a coefficient of thermal expansion of about 1.0 X 10 -6 / ° C, and a super invar of about 1.0 X 10 -7 / ° C. Since the mask 100 of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask is deformed by thermal energy, and thus can be used as a fine metal mask (FMM) or shadow mask in manufacturing a high-resolution OLED. In addition, considering that technologies for performing a pixel deposition process in a range in which the temperature change value is not large recently, the mask 100 has nickel (Ni), nickel-cobalt (Ni-Co) having a slightly higher thermal expansion coefficient than this. ).
  • the metal sheet produced by the rolling process may have a thickness of tens to hundreds of ⁇ m in the manufacturing process.
  • a process of thinning the metal sheet to a thickness of about 50 ⁇ m or less by using a method such as CMP may be further performed on the metal sheet.
  • the thickness of the mask is preferably formed to about 2 ⁇ m to 50 ⁇ m, more preferably, the thickness can be formed to about 5 ⁇ m to 20 ⁇ m. However, it is not necessarily limited thereto.
  • the frame 200 is formed to attach a plurality of masks 100.
  • the frame 200 may include various edges formed in a first direction (for example, a horizontal direction) and a second direction (for example, a vertical direction) including the outermost border. These various corners may partition the area to which the mask 100 is to be attached on the frame 200.
  • the frame 200 may include a frame frame 210 having a substantially square shape or a square frame shape.
  • the inside of the frame portion 210 may be hollow. That is, the border frame unit 210 may include a hollow region R.
  • the frame 200 may be made of a metal material such as invar, super invar, aluminum, titanium, etc., and is composed of invar, super invar, nickel, nickel-cobalt, etc. having the same thermal expansion coefficient as the mask in consideration of thermal deformation.
  • these materials can be applied to both the frame portion 210 of the frame 200, the mask cell sheet portion 220.
  • the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet portion 220 connected to the edge frame portion 210.
  • the mask cell sheet portion 220 may be formed by rolling like the mask 100 or may be formed using other film forming processes such as electroforming.
  • the mask cell sheet unit 220 may be connected to the edge frame unit 210 after forming a plurality of mask cell regions CR through laser scribing, etching, or the like on a flat sheet.
  • the mask cell sheet unit 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting a planar sheet to the edge frame unit 210.
  • the mask cell sheet unit 220 may include at least one of the edge sheet unit 221 and the first and second grid sheet units 223 and 225.
  • the border sheet portions 221 and the first and second grid sheet portions 223 and 225 refer to portions divided in the same sheet, and they are integrally formed with each other.
  • the edge sheet portion 221 may be substantially connected to the edge frame portion 210. Therefore, the edge sheet portion 221 may have an approximately square shape and a square frame shape corresponding to the edge frame portion 210.
  • first grid sheet portion 223 may be formed to extend in the first direction (horizontal direction).
  • the first grid sheet portion 223 is formed in a straight shape so that both ends may be connected to the edge sheet portion 221.
  • the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 has equal intervals.
  • the second grid sheet portion 225 may be formed to extend in the second direction (vertical direction).
  • the second grid sheet portion 225 may be formed in a straight line shape, and both ends may be connected to the edge sheet portion 221.
  • the first grid sheet portion 223 and the second grid sheet portion 225 may cross each other vertically.
  • each second grid sheet portion 225 has an equal interval.
  • an interval between the first grid sheet parts 223 and an interval between the second grid sheet parts 225 may be the same or different depending on the size of the mask cell C.
  • the first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of the cross section perpendicular to the longitudinal direction is a rectangular shape, a rectangular shape such as a trapezoid (Fig. 5 (b). And FIG. 10], a triangular shape, etc., and the sides and corners may be partially rounded.
  • the cross-sectional shape can be adjusted in processes such as laser scribing and etching.
  • the thickness of the frame portion 210 may be thicker than the thickness of the mask cell sheet portion 220.
  • the border frame portion 210 may be formed to a thickness of several mm to several cm because it is responsible for the overall rigidity of the frame 200.
  • the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 14) passes through the mask 100 in the OLED pixel deposition process. This can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure rigidity sufficient to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet portion 220 may be formed about 0.1 mm to 1 mm. In addition, the widths of the first and second grid sheet portions 223 and 225 may be formed about 1 to 5 mm.
  • a plurality of mask cell regions CR: CR11 to CR56 may be provided except for regions occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the planar sheet.
  • the mask cell region CR is an area occupied by the border sheet portions 221 and the first and second grid sheet portions 223 and 225 in the hollow region R of the border frame portion 210. Except for, it may mean an empty area.
  • the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixels of the OLED are substantially deposited through the mask pattern P.
  • one mask cell C corresponds to one display such as a smartphone.
  • Mask patterns P constituting one cell C may be formed in one mask 100.
  • one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but the clear alignment of the mask 100 may be performed. For this, it is necessary to avoid the large area mask 100, and the small area mask 100 having one cell C is preferable.
  • one mask 100 having a plurality of cells C may correspond to one cell region CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of 2-3.
  • the frame 200 includes a plurality of mask cell regions CR, and each of the masks 100 may be attached such that one mask cell C corresponds to the mask cell region CR.
  • Each mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy around the mask cell C (corresponding to a portion of the mask film 110 excluding the cell C). have.
  • the dummy may include only the mask film 110 or may include the mask film 110 on which a predetermined dummy pattern having a shape similar to the mask pattern P is formed.
  • the mask cell C corresponds to the mask cell region CR of the frame 200, and a part or all of the dummy may be attached to the frame 200 (mask cell sheet portion 220). Accordingly, the mask 100 and the frame 200 can achieve an integral structure.
  • FIGS. 4 and 5 may be provided.
  • 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.
  • the border frame part 210 may have a rectangular frame shape including the hollow region R.
  • a mask cell sheet portion 220 is manufactured.
  • the mask cell sheet portion 220 may be manufactured by manufacturing a planar sheet using a rolling or other film forming process, and then removing the mask cell region CR through laser scribing, etching, or the like. .
  • description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed.
  • Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.
  • the mask cell sheet portion 220 may correspond to the border frame portion 210.
  • the mask cell sheet portion 220 is flattened and the border sheet portion 221 is attached to the border frame portion 210. You can respond.
  • One side can hold and hold the mask cell sheet portion 220 with several points (eg, 1 to 3 points in FIG. 6 (b), for example).
  • the mask cell sheet portion 220 may be tensioned (F1, F2) along some side directions rather than all sides.
  • the edge sheet portion 221 of the mask cell sheet portion 220 may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 can be firmly attached to the frame portion 220. Welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to reduce the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 as much as possible to increase adhesion.
  • the welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 and integrally forms the border frame portion 210 and the mask cell sheet portion 220. It can be a medium to connect to.
  • FIG. 7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
  • the mask cell sheet portion 220 having the mask cell region CR is first manufactured and attached to the border frame portion 210.
  • the flat sheet of the border frame portion After attaching to 210), a portion of the mask cell region CR is formed.
  • a border frame portion 210 including a hollow region R is provided.
  • a flat sheet (the flat mask cell sheet part 220 ′) may correspond to the border frame part 210.
  • the mask cell sheet portion 220 ′ is in a planar state in which the mask cell region CR is not yet formed.
  • all sides of the mask cell sheet portion 220 ' are tensioned (F1 to F4), so that the mask cell sheet portion 220' can be flattened to correspond to the border frame portion 210.
  • One side can hold and hold the mask cell sheet portion 220 'with several points (for example, 1 to 3 points in FIG. 7 (a)).
  • the mask cell sheet portion 220 ' may be tensioned (F1, F2) along some side directions rather than all sides.
  • the edge portion of the mask cell sheet portion 220' may be welded (W) and attached. It is preferable to weld (W) all sides so that the mask cell sheet portion 220 ′ can be firmly attached to the frame portion 220.
  • the welding (W) should be performed as close as possible to the edge of the edge frame portion 210 to minimize the excitation space between the edge frame portion 210 and the mask cell sheet portion 220 'and increase adhesion.
  • the welding (W) portion may be generated in the form of a line or a spot, and has the same material as the mask cell sheet portion 220 ', and the frame portion 210 and the mask cell sheet portion 220'. It can be a medium to integrally connect.
  • a mask cell region CR is formed on a planar sheet (planar mask cell sheet portion 220 ').
  • the mask cell region CR may be formed by removing the sheet of the mask cell region CR portion through laser scribing, etching, or the like.
  • description will be given taking an example in which 6 X 5 mask cell regions CR: CR11 to CR56 are formed.
  • the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids
  • the mask cell sheet portion 220 having the sheet portion 225 may be configured.
  • the present invention is not limited thereto.
  • the adhesion may be performed by a method using a tick adhesion part (EM), an electroplating part 150, and other organic / inorganic adhesives.
  • FIG. 8 is a state in which the tensile form of the mask 100 (FIG. 8 (a)) and the mask 100 correspond to the cell region CR of the frame 200 according to an embodiment of the present invention [FIG. 8] (b)].
  • the mask 100 on which a plurality of mask patterns P are formed may be provided. It has been described above that a mask 100 made of an in-bar and super-in-bar material may be manufactured by a rolling method, and one cell C may be formed in the mask 100.
  • a mask pattern (P) may be formed by applying an etch process using photolithography on a metal sheet made thin.
  • the width of the mask pattern P may be smaller than 40 ⁇ m, and the thickness of the mask 100 may be about 2 to 50 ⁇ m, preferably about 5 to 20 ⁇ m.
  • the frame 200 includes a plurality of mask cell regions (CR: CR11 to CR56), a mask 100 having mask cells (C: C11 to C56) corresponding to each of the mask cell regions (CR: CR11 to CR56) ) Can also be provided in plural.
  • the mask 100 may correspond to one mask cell area CR of the frame 200.
  • the mask cell C is flattened in a state where the mask 100 is flattened by stretching (F1 to F2) the two sides along the uniaxial direction of the mask 100 ) May correspond to the mask cell area CR.
  • One side can hold and hold the mask 100 with several points (eg, 1 to 3 points in FIG. 8). Meanwhile, all sides of the mask 100 may be tensioned (F1 to F4) along the axial direction, not the uniaxial direction.
  • the tensile force applied to each side of the mask 100 may not exceed 4N.
  • the tensile force applied according to the size of the mask 100 may be the same or different.
  • the mask 100 of the present invention is a size including one mask cell C, the tensile force required is the same as that of the conventional stick mask 10 including a plurality of cells C1 to C6, or , At least it is likely to shrink.
  • 9.8N means a gravitational force of 1 kg
  • 1N is a force smaller than the gravitational force of 400 g
  • the mask 100 remains in the frame 200
  • the tension applied to the, or, conversely, the frame 200 exerts very little tension on the mask 100.
  • deformation of the mask 100 and / or the frame 200 due to tension is minimized, so that alignment errors of the mask 100 (or mask pattern P) can be minimized.
  • the conventional mask 10 of FIG. 1 includes six cells (C1 to C6), and thus has a long length, while the mask 100 of the present invention includes a cell (C) to shorten the length.
  • the degree of distortion of the pixel position accuracy (PPA) may be reduced.
  • the mask 100 of the present invention Can be 1 / n of the above error range according to the relative length reduction (corresponding to the reduction in the number of cells (C)).
  • the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 ⁇ m is generated over the entire length of 100 mm. , Alignment error is significantly reduced.
  • the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell region CR of the frame 200, within the range in which the alignment error is minimized,
  • the mask 100 may correspond to a plurality of mask cell areas CR of the frame 200.
  • the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Also in this case, considering the process time and productivity according to the alignment, it is preferable that the mask 100 has as few cells C as possible.
  • each cell C11 to C16 included in the six masks 100 corresponds to one cell region CR11 to CR16, respectively, and the alignment state is checked.
  • time can be significantly shortened compared to a conventional method in which six cells C1 to C6 are simultaneously mapped and all six cells C1 to C6 are aligned at the same time.
  • the product yield in 30 processes of 30 masks 100 corresponding to and aligned with 30 cell regions is 6 cells (C1). ⁇ C6), each of the five masks 10 (see FIG. 2 (a)), which correspond to and align the frame 20, may appear to be much higher than the conventional product yield in the five steps. Since the conventional method of arranging six cells C1 to C6 in a region corresponding to six cells C at a time is a much cumbersome and difficult operation, the product yield is low.
  • the mask 100 may be temporarily fixed through a predetermined adhesive on the frame 200. Thereafter, the attaching step of the mask 100 may be performed.
  • FIG. 9 is a schematic diagram showing a process of attaching the mask 100 according to an embodiment of the present invention in correspondence with the cell area CR of the frame 200.
  • FIG. 10 is a cross-sectional view taken along line B-B 'of FIG. 9, and is a partially enlarged cross-sectional view showing a form in which a mask 100 according to various embodiments of the present invention is attached to a frame 200 (first grid sheet portion 223).
  • a part or all of the border of the mask 100 may be attached to the frame 200.
  • the attachment can be performed by welding (W), preferably by laser welding (W).
  • the welded (W) portion may be integrally connected with the same material as the mask 100 / frame 200.
  • the welding (W) portion may be generated in the form of a line or a spot, and may be a medium having the same material as the mask 100 and integrally connecting the mask 100 and the frame 200. .
  • first grid sheet portion 223 On the upper surface of the first grid sheet portion 223 (or the second grid sheet portion 225), a shape in which one border of two neighboring masks 100 is attached (W) is shown.
  • the width and thickness of the first grid sheet portion 223 (or the second grid sheet portion 225) may be formed to about 1 to 5 mm, and to improve product productivity, the first grid sheet portion 223 [ Or, it is necessary to reduce the width of the overlap of the border of the second grid sheet portion 225] and the mask 100 to about 0.1 to 2.5 mm.
  • the shape of the cross section perpendicular to the longitudinal direction of the first and second grid sheet portions 223 and 225 may be a low-height square or a trapezoidal shape.
  • the welding (W) method is only one method of attaching the mask 100 to the frame 200, and is not limited to this embodiment.
  • the mask 100 may be adhered to the frame 200 using an adhesive material EM.
  • the adhesive material EM is an adhesive containing at least two metals, and may have various shapes such as a film, a line, or a bundle, and may have a thin thickness of about 10 to 30 ⁇ m.
  • the adhesive portion EM of the eutectic material may include at least one metal in groups such as In, Sn, Bi, Au, and Sn, Bi, Ag, Zn, Cu, Sb, Ge. .
  • the adhesive material (EM) of the eutectic material includes at least two metallic solid phases, and at the specific temperature / pressure eutectic point, both metallic solid phases may be in a liquid phase. . And if you leave the eutectic point, you can become two metal solids again. Accordingly, it is possible to perform a role as an adhesive through a phase change of solid-> liquid-> solid.
  • the eutectic adhesive part (EM) does not contain any volatile organic substances. Therefore, the volatile organic material of the adhesive reacts with the process gas to adversely affect the pixels of the OLED, or the outgas of the organic material contained in the adhesive itself contaminates the pixel process chamber or prevents the adverse effect of being deposited on the OLED pixel as an impurity I can do it.
  • the eutectic adhesive portion (EM) is a solid, it is not cleaned by an OLED organic cleaning solution, and thus has corrosion resistance.
  • the mask 100 and the frame 200 which are the same metal material as compared to the organic adhesive, and since it is a metal material, there is an advantage that the possibility of deformation is low.
  • the mask 100 may be adhered to the frame 200 by further forming an adhesive plating portion 150 of the same material as the mask 100.
  • an insulating portion such as PR may be formed in the direction of the lower surface of the mask 100.
  • the adhesive plating unit 150 may be electrodeposited on the rear surface of the mask 100 and the frame 200 exposed without the insulating unit covering.
  • the adhesive plating portion 150 As the adhesive plating portion 150 is electrodeposited on the exposed surface of the mask 100 and the frame 200, it may be a medium for integrally connecting the mask 100 and the frame 200. At this time, since the adhesive plating unit 150 is integrally connected to the rim portion of the mask 100 and electrodeposited, it has a state in which a tensile force is applied in an inner or outer direction of the frame 200 and can support the mask 100. Thus, without the need to perform the process of tensioning and aligning the mask separately, it is possible to integrally form the mask 100 stretched toward the frame 200 and the frame 200.
  • the thickness and width of the welded (W) part and the adhesive part (EM) part of the eutectic material are somewhat exaggerated, and in fact, this part is hardly projected and is attached to the mask 100. It may be a part that connects the frame 200 in an included state.
  • the remaining masks 100 are sequentially mapped to the remaining mask cells C, and the process of attaching them to the frame 200 is repeated. can do. Since the mask 100 already attached to the frame 200 can present a reference position, the time in the process of sequentially matching the remaining masks 100 to the cell area CR and checking the alignment state is significantly reduced. It has the advantage of being. In addition, the pixel position accuracy (PPA) between the mask 100 attached to one mask cell region and the mask 100 attached to a neighboring mask cell region does not exceed 3 ⁇ m, so that the alignment is clear and ultra-high definition. There is an advantage that can provide a mask for forming an OLED pixel.
  • PPA pixel position accuracy
  • 11 to 13 are schematic views showing a process of attaching a frame to a mask according to another embodiment of the present invention.
  • a mask 100 on which a plurality of mask patterns P are formed may be provided. This process is the same as in Fig. 8 (a).
  • the mask 100 may correspond to one mask cell area CR of the frame 200.
  • Another embodiment of the present invention is characterized in that no tension is applied to the mask 100 in a process in which the mask 100 corresponds to the mask cell area CR of the frame 200.
  • the mask cell sheet portion 220 of the frame 200 has a thin thickness, when attached to the mask cell sheet portion 220 with tensile force applied to the mask 100, the tensile force remaining in the mask 100 is masked.
  • the cell sheet portion 220 and the mask cell region CR may be actuated to deform them. Therefore, the mask 100 should be attached to the mask cell sheet portion 220 without applying a tensile force to the mask 100.
  • a frame-integrated mask is manufactured by attaching it to the frame 200 (or the mask cell sheet portion 220) without applying a tensile force to the mask 100, and there is one problem when using the frame-integrated mask in the pixel deposition process. Can occur.
  • the mask 100 thermally expands by a predetermined length.
  • a length of about 1 to 3 ppm may change according to a temperature rise of about 10 ° C. to form a pixel deposition process atmosphere. For example, when the total length of the mask 100 is 500 mm, the length may be increased by about 5 to 15 ⁇ m. Then, the mask 100 is struck by its own weight, or it is stretched in a fixed state in the frame 200, causing deformation such as warping, which causes a problem that the alignment errors of the patterns P become large.
  • the present invention is characterized in that it corresponds to and attaches to the mask cell region CR of the frame 200 without applying a tensile force to the mask 100 at a higher temperature than normal temperature.
  • the mask 100 corresponds to and adheres to the frame 200 after raising (ET) the temperature of the process region to the first temperature.
  • the term “process area” may mean a space in which components such as the mask 100 and the frame 200 are located, and an attachment process of the mask 100 is performed.
  • the process region may be a space in a closed chamber or an open space.
  • the term “first temperature” may mean a temperature that is higher than or equal to the temperature of the pixel deposition process when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45 ° C, the first temperature may be about 25 ° C to 60 ° C.
  • the temperature rise of the process region can be performed by installing a heating means in the chamber or by providing a heating means around the process region.
  • the temperature of the process region including the frame 200 may be increased (ET) to the first temperature. have.
  • the mask 100 may correspond to the mask cell region CR.
  • the temperature of the process region is increased to the first temperature after the masks 100 are mapped to each mask cell region CR. (ET).
  • a part or all of a frame of the mask 100 may be attached to the frame 200. This process is the same as in FIGS. 9 and 10.
  • the temperature of the process region is lowered (LT) to the second temperature.
  • the term "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25 ° C to 60 ° C, the second temperature may be about 20 ° C to 30 ° C on the premise that it is lower than the first temperature, and preferably, the second temperature may be room temperature.
  • the temperature drop of the process region may be performed by a method of installing a cooling means in the chamber, a method of installing a cooling means around the process region, a method of naturally cooling to room temperature, or the like.
  • the mask 100 may heat shrink by a predetermined length.
  • the mask 100 may be isotropically heat-shrinked along all lateral directions.
  • W welding
  • TS tension
  • the tension (TS) is applied by itself.
  • the mask 100 may be more tightly attached to the frame 200 by applying the own tension (TS) of the mask 100.
  • each of the masks 100 is attached to the corresponding mask cell region CR, the temperature of the process region is lowered to the second temperature (LT), so that all the masks 100 simultaneously cause heat shrink, thereby framing the frame. A problem in which the alignment errors of the 200 or the patterns P are increased may be prevented.
  • the tension TS is applied to the mask cell sheet portion 220, since the plurality of masks 100 apply the tension TS in opposite directions, the force is canceled and the mask cell sheet portion is canceled. No deformation occurs at 220.
  • the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is directed to the right side of the mask 100 attached to the CR11 cell area.
  • the acting tension TS and the tension acting in the left direction of the mask 100 attached to the CR12 cell region may be canceled.
  • the deformation of the frame 200 (or the mask cell sheet part 220) by the tension TS is minimized, so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.
  • FIG. 14 is a schematic diagram illustrating an OLED pixel deposition apparatus 1000 using frame-integrated masks 100 and 200 according to an embodiment of the present invention.
  • the OLED pixel deposition apparatus 1000 includes an organic material source 600 from a magnet plate 300 in which a magnet 310 is accommodated, a coolant line 350 is disposed, and a lower portion of the magnet plate 300. It includes a deposition source supply unit 500 for supplying.
  • a target substrate 900 such as glass on which the organic source 600 is deposited may be interposed.
  • the target substrate 900 may be disposed such that the frame-integrated masks 100 and 200 (or FMMs) that allow the organic material source 600 to be deposited on a pixel-by-pixel basis or are very close.
  • the magnet 310 generates a magnetic field and can be in close contact with the target substrate 900 by the magnetic field.
  • the deposition source supply unit 500 may supply the organic material source 600 while reciprocating the left and right paths, and the organic material sources 600 supplied from the deposition source supply unit 500 may include patterns P formed in the frame-integrated masks 100 and 200. ) To be deposited on one side of the target substrate 900. The deposited organic source 600 that has passed through the pattern P of the frame-integrated masks 100 and 200 may act as the pixel 700 of the OLED.
  • the patterns of the frame-integrated masks 100 and 200 may be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in the diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the pixel 700 may be uniformly deposited in thickness as a whole.

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Abstract

La présente invention concerne un masque intégré à un cadre et un procédé de fabrication d'un masque intégré à un cadre. Le masque intégré à une cadre selon la présente invention comprend : de multiples masques (100) ; et un cadre (200) intégré aux masques (100) de façon à supporter les masques (100), le cadre (200) comprenant : une partie de cadre de bord (210) comprenant une région creuse (R) ; et une partie de siège de cellule de masque (220) comprenant de multiples régions de cellule de masque (CR) et connectées à la partie de cadre de bord (210), et chacun des masques (100) est formée d'une feuille métallique fabriquée par un procédé de laminage et est reliée à la partie supérieure de la partie de siège de cellule de masque (200).
PCT/KR2019/013085 2018-10-10 2019-10-07 Masque intégré à un cadre et procédé de fabrication d'un masque intégré à un cadre Ceased WO2020076020A1 (fr)

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KR1020180120434A KR20200040474A (ko) 2018-10-10 2018-10-10 프레임 일체형 마스크 및 프레임 일체형 마스크의 제조 방법
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KR20240166060A (ko) * 2023-05-16 2024-11-26 삼성디스플레이 주식회사 마스크 어셈블리 및 이의 제조방법

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TW202028856A (zh) 2020-08-01
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