WO2020104100A1 - Procédé pour couper une pièce au moyen d'un faisceau laser et système d'usinage laser utilisé pour mettre ce procédé en œuvre - Google Patents

Procédé pour couper une pièce au moyen d'un faisceau laser et système d'usinage laser utilisé pour mettre ce procédé en œuvre

Info

Publication number
WO2020104100A1
WO2020104100A1 PCT/EP2019/077460 EP2019077460W WO2020104100A1 WO 2020104100 A1 WO2020104100 A1 WO 2020104100A1 EP 2019077460 W EP2019077460 W EP 2019077460W WO 2020104100 A1 WO2020104100 A1 WO 2020104100A1
Authority
WO
WIPO (PCT)
Prior art keywords
cutting
laser
optical measuring
workpiece
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2019/077460
Other languages
German (de)
English (en)
Inventor
Niklas WECKENMANN
Florian OPITZ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Precitec GmbH and Co KG
Original Assignee
Precitec GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Precitec GmbH and Co KG filed Critical Precitec GmbH and Co KG
Priority to CN201980089999.2A priority Critical patent/CN113348047A/zh
Priority to EP19786772.4A priority patent/EP3883719A1/fr
Publication of WO2020104100A1 publication Critical patent/WO2020104100A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/035—Aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring

Definitions

  • the present disclosure relates to a laser machining system and a method for cutting a workpiece using a laser beam.
  • the present disclosure relates in particular to a laser cutting head with an optical coherence interferometer.
  • a laser processing head for laser cutting In a device for material processing by means of a laser, e.g., the laser beam emerging from a laser light source or an end of a laser guide fiber is focused or bundled onto the workpiece to be processed with the aid of beam guiding and focusing optics.
  • a laser processing head with collimator optics and focusing optics is used as standard, the laser light being supplied via an optical fiber, also referred to as a laser source.
  • Laser cutting is used in the automation of industrial cutting processes, since with the appropriate laser processing systems the cutting of large metal plates is largely wear-free, reliable and flexible.
  • a prerequisite for a further increase in the degree of automation in laser cutting is an improvement in process monitoring and / or process control. In particular, it is advantageous to recognize and avoid deviations occurring in the cutting process or fluctuations in the processing quality.
  • EP 1 275 465 B1 describes a system for verifying the absence of a burr with a device for focusing a laser beam onto a cutting or perforation zone, a photodiode sensor device for detecting through the cutting or perforation zone emitted radiation, and an electronic control and processing unit for processing the signals emitted by the sensor device.
  • Such conventional approaches can only insufficiently detect occurring deviations in the cutting process or fluctuations in the processing quality and are also complex to implement.
  • a laser processing system for cutting a workpiece by means of a laser beam.
  • the laser processing system comprises a laser processing head that is configured to direct the laser beam onto the workpiece to produce a cutting gap along a cutting direction; an optical measuring device with an optical coherence tomograph (OCT), the optical measuring device being set up to direct an optical measuring beam onto the cutting gap, preferably during the cutting process; and a deflection device which is set up to deflect the optical measurement beam, for example with respect to a beam axis of the laser beam and / or with respect to the cutting direction, in order to measure at least one geometric property of the cutting gap.
  • OCT optical coherence tomograph
  • the measurement with the aid of the optical coherence tomograph can therefore take place on the basis of distance data which are obtained for different positions on the workpiece or on and around the cutting gap by the deflected optical measuring beam.
  • the optical measuring beam can strike the workpiece coaxially or parallel to the laser beam and be deflected with respect to this position.
  • the at least one geometric property can include at least one of the following properties: a cutting front geometry, a width of the cutting gap and a cutting flank geometry.
  • the cutting front geometry can comprise a profile of the cutting front and / or a cutting front angle.
  • the cutting edge geometry can include a cutting edge angle.
  • Cutting here means, for example, a cutting or cutting process of a workpiece.
  • the cutting gap can be defined as a gap or cut that completely penetrates the workpiece.
  • the cutting gap can also be called a kerf.
  • the cutting gap not only includes the gap or the hole in the workpiece itself, but also its bounding edges.
  • process monitoring is carried out by measuring the geometric property and optionally process control during laser cutting.
  • an optical coherence tomograph OCT
  • OCT optical coherence tomograph
  • the detected process variables are in particular geometric variables, ie the cutting front geometry and / or the width of the cutting gap and / or the cutting flank geometry. This makes it possible to detect any deviations in the cutting process or fluctuations in the machining quality during the cutting process. Cutting errors can be avoided by adapting the current machining parameters (eg feed speed, feed direction, focus position, gas pressure, etc.).
  • a detection of various topographical properties and an associated control of the process can be carried out with only one measuring device.
  • the deflection device can be set up to deflect the optical measuring beam perpendicularly and / or parallel to the cutting direction.
  • the measurement can be carried out either continuously or discretely at different points using the optical measuring beam.
  • the deflection device is preferably set up to deflect the optical measuring beam essentially parallel to the cutting direction or to the feed movement of the cutting gap, for example for measuring the cutting front geometry of the cutting gap.
  • the Cutting direction follow a predetermined linear, non-linear or combined linear and non-linear path, the optical measuring beam being able to be deflected along the path or parallel to the path.
  • the deflection can take the form of an oscillating movement or a pendulum movement of the optical measuring beam along the current cutting direction or the local path, as a result of which, for example, the entire cutting front geometry of the cutting gap can be scanned and measured.
  • the deflection device is preferably set up to move the optical measurement beam back and forth parallel to the cutting direction through a current processing point and through at least one point in the lead and / or tail to the current processing point or to the laser beam.
  • the current machining point is used in particular to denote the point on the workpiece surface at which the beam axis of the laser beam strikes the workpiece surface. Measuring the cutting front geometry by an oscillating movement of the optical measuring beam over the cutting front can ensure that the cutting front geometry is optimal, which enables a stable laser cutting process.
  • the cutting front geometry preferably comprises a (geometric) profile of the cutting front and / or a local cutting front angle / or a global cutting front angle. This ensures that the cutting front has a specified profile or a specified cutting front angle.
  • the cutting front must not be too steep and not too flat to enable a stable laser cutting process.
  • the deflection device is preferably set up to deflect the optical measurement beam essentially perpendicular to the cutting direction.
  • the deflection device can be set up to deflect the optical measuring beam both perpendicularly and parallel to the cutting direction, or in any scanning movement.
  • the deflection device can be set up to deflect the optical measurement beam after the current machining point or to the laser beam perpendicular to the cutting direction, for example in a pendulum motion.
  • the width of the cutting gap can be approximately as large as the diameter of the laser beam on the surface of the workpiece.
  • the cutting parameters such as the feed speed, the feed direction, the focus position, the gas pressure, etc.
  • the optical coherence tomograph the cutting gap width can be measured during the separation process and the process control can be regulated accordingly.
  • the cutting edge geometry such as a cutting edge angle with respect to the top of the workpiece.
  • a perpendicularity of the cut edge with respect to the workpiece surface can provide information about the quality of the laser cut.
  • the deflection device can be set up to direct the optical measuring beam essentially perpendicular to the cutting direction, e.g. Deflect oscillatory or in a pendulum motion to measure the cutting edge angle.
  • the laser processing system preferably comprises a control device which is set up to set at least one process parameter based on the measured at least one geometric property of the cutting gap, such as the cutting front geometry and / or the width of the cutting gap and / or the cutting edge geometry.
  • the at least one process parameter can be selected from the group comprising a laser power, a focus position of the laser beam, a focus diameter of the laser beam, a process gas composition, a process gas pressure, a feed speed, direction and a distance between the laser processing head and the workpiece.
  • a process gas can usually be directed from the cutting head onto the workpiece together with the laser beam.
  • a cutting nozzle can be attached to a laser processing head of the laser processing system through which laser radiation and process gas are directed onto a workpiece to be processed.
  • the process gas can be an inert medium (eg nitrogen N 2 ) or a reactive gas (eg oxygen O 2 ).
  • the at least one process parameter can comprise a composition of the process gas and / or a pressure of the process gas.
  • the deflection device is preferably designed to oscillate the optical measuring beam with respect to the cutting direction or the cutting path in at least one spatial direction.
  • the deflection device can be set up to move the optical measuring beam parallel and / or perpendicular to the cutting direction or to the cutting path.
  • the deflection device can be set up to oscillate the optical measuring beam essentially parallel and / or perpendicular to the cutting direction or the cutting path or in any suitable form of movement. In this way, various topographical features of the cutting process can be recorded across the surface.
  • the deflection device is preferably arranged and set up in the measuring beam path in order to scan an area of the workpiece surface with the optical measuring beam.
  • the area of the workpiece surface can include the cutting gap and optionally an area surrounding the cutting gap and / or the current machining point.
  • the optical measuring beam can be positioned dynamically and independently of the laser beam on the workpiece.
  • the deflection device can have, for example, at least one reflecting mirror which can be moved about at least one axis.
  • the mirror is preferably pivotable about two mutually perpendicular axes.
  • the deflection device can in particular be a scanner system. Further embodiments of the deflection device, which include, for example, transmitting optical elements or include a displacement of the fiber end of the measurement beam, are possible for dynamic measurement spot positioning.
  • the optical measuring device is preferably set up to direct the optical measuring beam onto the workpiece before the cutting process begins and to determine a material of the workpiece from a reflection of the optical measuring beam.
  • the optical measuring beam can be directed onto the workpiece with a defined intensity and / or a defined period of time.
  • the optical measuring beam is partly reflected back and reaches the sensor of the optical measuring device with a certain intensity.
  • the ratio of the two intensities is a measure of the reflectance of the material.
  • the available material type can in turn be determined from this.
  • the control device can be set up, based on the specific material, automatically automating a corresponding process parameter set and / or values for process parameters, such as at least one of the process parameters laser power, focus position of the laser beam, focus diameter of the laser beam, process gas composition, process gas pressure, Feed direction and feed speed. It can also be checked whether the material is available in the cutting machine in accordance with the current machining task.
  • the laser processing head can have one or more optical elements. All optical elements of the laser processing head can be reflective optics. Alternatively, all of the optical elements of the laser processing head can be transmissive optics or the optical elements can include both transmissive and reflective optics.
  • the laser processing head preferably comprises at least one optical element which is displaceable with respect to an optical axis in order to set a focus position of the laser beam and / or a focus position of the at least one optical measurement beam.
  • the at least one optical element can comprise transmissive and / or reflective optics, and can for example comprise or be a lens, a lens group, a zoom optic, a mirror optic or the like.
  • the at least one optical element can be selected from the group comprising or consisting of a collimator lens for the laser beam, a collimator lens for the at least one optical measuring beam and a focusing lens.
  • the focusing optics can be a common focusing optics for the laser beam and the at least one optical measuring beam. These optics can be or include a lens or a group of lenses.
  • the laser processing head preferably has an outlet opening through which the laser beam and optionally also cutting gas can exit the laser processing head and be directed onto the workpiece.
  • the laser beam exit opening can, for example, be formed in the cutting nozzle. In this case, the outlet opening can be referred to as the “nozzle opening”.
  • the optical measuring device can be set up to measure a geometry of the outlet opening.
  • the measurement of the geometry of the outlet opening can Example for asymmetrical cutting and / or a check of the nozzle diameter can be used.
  • the optical measuring device can be set up to determine a center point or a center and / or a peripheral edge of the laser beam exit opening, for example to make an adjustment for asymmetrical cutting.
  • asymmetrical cutting means that the center of the laser beam and the center of the exit opening are not congruent.
  • the laser processing system can be set up to deflect the laser beam based on the measured geometry of the exit opening or to shift the beam axis of the laser beam so that the laser beam passes through the laser beam exit opening in a decentralized manner. Such asymmetrical cutting can improve the cutting quality in certain situations.
  • the optical measuring device is preferably set up to determine a diameter of the outlet opening.
  • the optical measuring device can be used to check the nozzle diameter after it has been installed on the cutting head. This can be used to check whether the correct nozzle has been selected or whether a nozzle has been correctly mounted on the cutting head.
  • the optical measuring device can comprise a coherence interferometer, and in particular a short coherence interferometer, in order to determine the geometric properties of the cutting gap.
  • a method for cutting a workpiece by means of a laser beam includes: directing a laser beam onto the workpiece to create a cut gap along a cutting direction; Directing an optical measuring beam of an optical coherence tomograph onto the cutting gap during the cutting process with the laser beam; Deflecting the optical measuring beam with respect to the cutting direction, and measuring at least one geometric property of the cutting gap.
  • the at least one geometric property can be selected from the group comprising a cutting front geometry, a profile of the cutting front Cutting front angle, a width of the cutting gap, a cutting edge angle and a cutting edge geometry includes.
  • a method for cutting a workpiece by means of a laser beam in which the geometric properties of the machining process and / or the components involved are monitored with an optical coherence tomograph.
  • the monitored geometric property of the machining process can be a cutting front geometry of the cutting gap.
  • An optical measuring beam of the coherence tomograph can be deflected parallel to the cutting direction in order to measure the cutting front geometry in a pendulum movement.
  • at least the distances of a point in the lead and a point in the lead of the current processing point can be recorded.
  • An average inclination of the cutting front can be calculated from the distances.
  • the monitored geometric property of the machining process can be a width of the cutting gap.
  • an optical measuring beam of the coherence tomograph can be deflected in a pendulum movement perpendicular to the cutting direction at the level of a current processing point and / or in the wake of a current processing point in relation to the cutting direction.
  • the monitored geometric property of the machining process can be a cutting edge geometry.
  • an optical measuring beam of the coherence tomograph can be deflected in a pendulum movement perpendicular to the cutting direction after a current machining point in relation to the cutting direction.
  • the cutting process can be controlled or regulated with regard to the geometric property.
  • the control parameter can be selected from the group comprising: a laser power, a focus position of the laser beam, a focus diameter of the laser beam, a process gas composition, a process gas pressure, a feed direction, a feed speed, and a distance between the laser processing head and the Workpiece.
  • the monitored geometric property of a component involved can be a diameter or a center of an outlet opening of a cutting nozzle.
  • the monitored geometric property can be used to direct the laser beam decentrally through the outlet opening of the cutting nozzle for an asymmetrical cutting process.
  • the laser processing system described here for cutting a workpiece by means of a laser beam can in particular be set up to carry out a method according to an aspect of this disclosure.
  • SW software program
  • the software program can be set up to be executed on a processor and thereby to carry out the method described in this document.
  • the storage medium can comprise a software program which is set up to be executed on a processor and thereby to carry out the method described in this document.
  • FIG. 1 shows a laser processing system according to embodiments of the present disclosure
  • FIG. 2 shows the measurement of a cutting front geometry in accordance with embodiments of the present disclosure
  • FIG. 4 shows a measurement of the width of the cutting gap in accordance with embodiments of the present disclosure
  • FIGS. 6 and 7 a measurement of a nozzle diameter in accordance with embodiments of the present disclosure
  • Figure 8 asymmetrical cutting according to embodiments of the present disclosure.
  • FIG. 1 shows a schematic illustration of a laser processing system 100 according to embodiments of the present disclosure.
  • the laser processing system 100 can comprise a laser cutting head 101.
  • a laser beam 10 and an optical measuring beam 13 are coupled into the laser cutting head 101 perpendicular to one another.
  • the present disclosure can also be used for a laser processing system in which the laser beam 10 and the optical measuring beam 13 are coupled into the laser cutting head 101 in parallel or together.
  • the laser processing system 100 comprises a cutting head 101 with a laser device 110 for providing a laser beam 10 (also referred to as a “processing beam” or “processing laser beam”) and an optical measuring device 200, which is set up to - preferably during the cutting process - an optically rule measuring beam 13 to the cutting gap generated with the laser beam 10.
  • a current processing point i.e. a point of incidence of the laser beam 10 on the workpiece surface
  • the cutting direction 20 can follow a predetermined linear path, non-linear path or combined linear and non-linear path.
  • the cutting direction 20 may be a horizontal direction in some embodiments.
  • the laser processing system 100, and in particular the cutting head 101 can be moved along a feed direction relative to the workpiece 1 during the cutting process.
  • the cutting direction 20 can also be the feed direction.
  • the laser processing system 100 further comprises a deflection device 250, which is set up to deflect the optical measuring beam 13 with respect to the beam axis of the laser beam 10 and / or with respect to the cutting direction 20, at least to measure a geometric property of the cutting gap.
  • the at least one geometric property of the cutting gap is selected from the group comprising a cutting front geometry, a width of the cutting gap and a cutting flank geometry.
  • the optical measuring beam 13 can thus enable topography measurements in and around the current processing point of the laser beam 10. In particular, various geometrical characteristics of the cutting process can be monitored.
  • the optical measuring beam 13 can be a single measuring beam or can comprise a plurality of sub-beams.
  • the laser device 110 is set up to direct the laser beam 10 onto the machining zone of the workpiece 1 in order to generate the cutting gap for separating the workpiece 1.
  • the laser device 110 can have a collimator lens 120 for collimating the laser beam 10.
  • the laser beam 10 can be deflected in the direction of the workpiece 1 by suitable optics, such as a beam deflector 220, for example.
  • the laser beam 10 and the optical measuring beam 13 can be at least partially coaxial, and in particular can be at least partially coaxially superimposed.
  • the laser beam 10 and the optical measuring beam 13 can be guided through the beam deflector 220 essentially coaxially through the cutting optics into the processing zone.
  • the optical measuring beam 13 and the laser beam 10 can be combined after the collimator optics 210 and before a focusing optics 230.
  • the beam deflector 220 is preferably reflective for the wavelength of the laser beam 10 and transmissive for the wavelength of the optical measurement beam 13.
  • the optical measuring device 200 comprises a coherence interferometer or a coherence tomograph.
  • the coherence tomograph typically comprises the collimator optics 210, which is set up to collimate the optical measurement beam 13, and the focusing optics 230, which is set up to direct the optical measurement beam 13 onto the workpiece 1, and in particular the path to the Form the cutting gap to focus.
  • the focusing optics 230 can be a common focusing optics, such as for example, a focus lens for the laser beam 10 and the optical measuring beam 13.
  • the collimator optics 210 and the focusing optics 230 are integrated in the cutting head 101.
  • the cutting head 101 can comprise a collimator module which is integrated in the cutting head 101 or mounted on the cutting head 101.
  • the principle described here for measuring the geometric properties of the incision gap is based on the principle of optical coherence tomography, which uses the coherence properties of light with the aid of an interferometer.
  • the coherence tomograph can comprise an evaluation unit 240 with a broadband light source (e.g. a superluminescent diode, SLD), which couples the measurement light into an optical waveguide 242.
  • a broadband light source e.g. a superluminescent diode, SLD
  • a beam splitter 244 which preferably has a fiber coupler, the measurement light is split into a reference arm 246 and a measurement arm, which leads into the cutting head 101 via an optical waveguide 248.
  • the collimator optics 210 serve to collimate the measuring light emerging from the optical waveguide 248 as an optical measuring beam 13.
  • the optical measuring beam 13 can be coaxially superimposed with the laser beam 10 in the cutting head 101.
  • the laser beam 10 and the optical measuring beam 13 can then be focused on the workpiece 1 by the focusing optics 230, which can be a common lens or focusing lens, in order to generate and measure the cutting gap.
  • the optical measuring beam 13 is directed to edge areas of the cutting gap and optionally to a surrounding area of the cutting gap or a current processing point.
  • the measuring light reflected back from the edge regions of the incision gap is imaged by the focusing optics 230 on the exit / entry surface of the optical waveguide 248, overlaid in the fiber coupler 244 with the reflected light from the reference arm 246 and then directed back into the evaluation unit 240 .
  • the superimposed light contains information about the path length difference between the reference arm 246 and the measuring arm. This information is evaluated in the evaluation unit 240 based on coherence interferometry or short coherence interferometry, whereby the user receives information about the distance between the workpiece and a reference, for example the cutting head 101.
  • the deflection device 250 is arranged in the measuring beam path in order to scan an area of the workpiece surface with the optical measuring beam 13.
  • the area of the workpiece surface comprises the cutting gap, in particular edge areas of the cutting gap, and optionally at least one of the current machining point or an area of the workpiece surface surrounding the cutting gap.
  • the optical measuring beam 13 can thus be positioned dynamically and independently of the laser beam 10 on the workpiece 1.
  • the deflection device 250 comprises at least one reflecting mirror which can be pivoted about at least one axis.
  • the mirror is preferably movable about two mutually perpendicular axes.
  • the deflection device 250 comprises two movable mirrors, which can be rotated about two different mutually perpendicular axes in order to position the measurement spot as desired or dynamically on the workpiece surface or the edge regions of the cutting gap.
  • the deflection device 250 can in particular be a scanner System.
  • further embodiments of the deflection device 250 which include, for example, transmitting optical elements or include a displacement of the fiber end of the optical measurement beam 13, are possible.
  • the laser processing system 100 comprises a control device that is configured to set at least one process parameter based on the measured at least one geometric property of the cutting gap.
  • the at least one process parameter can be selected from the group comprising a laser power, a focus position of the laser beam 10, a focus diameter of the laser beam 10, a process gas composition, a process gas pressure, a feed direction, a feed speed and a distance between the laser processing head 101 and the workpiece 1 .
  • the control device can communicate with the laser device 110 and / or the laser optics and / or the optical measuring device. This enables, for example, regulation of the cutting process and / or the measurement process enables.
  • the control device can, for example, be set up to set a laser power of the laser beam 10.
  • the control device can be connected to laser optics of the processing head 101 in order, for example, to set a focus position and / or a focus diameter of the laser beam 10.
  • the control device can issue control commands for moving the collimator lens 120 and / or the collimator lens 210 along the respective optical axis.
  • FIGS. 2 and 3 show the measurement of a cutting front geometry in accordance with embodiments of the present disclosure.
  • a cutting area is referred to as an edge region of the cutting gap arranged in front of the current machining point in relation to the cutting direction 20 or an edge region of the cutting gap arranged around the current machining point.
  • the deflection device is set up to deflect the optical measuring beam 13 substantially parallel to the cutting direction 20 or the cutting path for measuring the cutting front geometry of the cutting gap 2.
  • the deflection in the form of an oscillating movement of the optical measuring beam 13 can take place essentially parallel to the cutting direction 20, as a result of which the entire cutting front geometry can be scanned and measured.
  • cutting front is understood to mean a material surface of the workpiece 1 within the cutting gap 2 which the laser beam 10 strikes in order to remove the material.
  • a cutting front is, for example, an edge region of the cutting gap arranged in front of the current machining point in relation to the cutting direction 20 or an edge region of the cutting gap arranged around the current machining point.
  • the cutting front 4 “moves” based on the movement of the laser beam 10 along the cutting direction 20 in order to expand or enlarge the cutting gap 2 and thus to separate the workpiece.
  • the profile of the cutting front 4 can be parallel in one plane through the current machining point to the cutting direction 20, ie in most cases perpendicular to a surface 3 of the workpiece 1.
  • FIGS. 2 (a) - (c) show schematic sectional views through the workpiece 1 during the laser cutting process.
  • the laser beam 10 and the optical measuring beam 13 are shown.
  • the cutting direction 20 runs to the left. If the cutting process is stable, the beam caustic of the laser beam 10 almost completely covers the cutting front 4, as shown in FIG. 2 (a).
  • the laser beam 10 covers the cutting front 4 increasingly incompletely (FIG. 2 (b)).
  • the separation process threatens to be torn off, since the material to be separated can no longer be melted completely. This can be announced by an increasingly flat cutting front 4.
  • the cutting front 4 becomes too steep due to an unsuitable choice of parameters, then the entire potential of the laser beam 10 is not used and part of the power is not coupled into the material (FIG. 2 (c)).
  • a stable laser cutting process is characterized by a cutting front 4 that is not too steep and does not drop too flat.
  • the deflection device of the laser processing system in one embodiment of the present disclosure can oscillate or oscillate the optical measurement beam 13 in the cutting direction 20 over the cutting front 4, as a result of which the entire height profile of the cutting front 4 can be recorded geometrically.
  • At least two points are preferably scanned along the cutting front 4, such as, for example, a first point on the upper side of the workpiece and a second point on the lower side of the cutting face 4.
  • the optical measuring beam can only be reflected in the edge areas of the cutting gap, which are defined by the material of the workpiece.
  • the optical measuring beam cannot be reflected in the actual cutting gap itself and therefore no measuring signal can be obtained.
  • the material thickness of the workpiece 1, the beam caustic of the laser beam 10 and the focus position of the laser beam 10 are included, for example.
  • the cut-off can then be prevented by adjusting one or more cutting or process parameters.
  • the coherence tomograph can thus be used in a control loop to record the controlled variable "cutting front geometry" or "profile of the cutting front".
  • the control device of the laser processing system adjusts the cutting parameters that represent the control variables accordingly.
  • a local cutting front angle ai okai can be determined. This is shown schematically in Figure 3 (a).
  • the cutting front angle can be defined between a normal of the workpiece surface (eg a vertical) and a local tangent of the cutting front profile.
  • the cutting front profile is preferably measured continuously between a point in the lead and a point in the trail.
  • Knowledge of the local cutting front angle can in turn be used to infer the local degree of absorption. This enables a statement to be made about the efficiency of the cutting process, which can be optimized and regulated based on maximum absorption. Higher process efficiency can lead to lower energy consumption (lower laser power) and / or higher cutting speed.
  • FIG. 4 shows a measurement of the width of the cutting gap in accordance with embodiments of the present disclosure.
  • the deflection device is set up to deflect the optical measuring beam 13 essentially perpendicular to the cutting direction 20 in order to measure the width of the cutting gap 2.
  • the optical measuring beam 13 can be deflected in the form of an oscillating movement of the optical measuring beam 13 essentially perpendicular to the cutting direction 20.
  • the width of the cutting gap 2 can be defined essentially perpendicular to a longitudinal extent of the cutting gap 4 or perpendicular to the cutting direction 20.
  • the cutting gap width represents another important feature of the laser cutting process. With a stable cutting process, this is approximately as large as the diameter of the laser beam 10 on the workpiece surface 3. This is shown schematically in FIG. In particular, the outer contour of the workpiece, for example a sheet metal, and the cutting gap 2, the laser beam 10 and the optical measuring beam 13 are shown as a top view of the workpiece surface 3. The width of the cutting gap corresponds approximately to the diameter of the laser beam 10.
  • the cutting gap may widen. Such a widening can occur, in particular, when flame cutting with oxygen, if the workpiece heats up too much and too much oxygen is made available in the edge region. In this case, a strong oxidation reaction occurs on the cut edges, which melts additional material. In order to ensure stable process control, it is desirable to prevent such self-ignition.
  • the cutting gap width can be measured during the cutting process and the process control can be regulated accordingly.
  • the deflection device is set up to implement an oscillating movement of the optical measuring beam 13 essentially perpendicular to the cutting direction 20.
  • the cutting gap width is preferably measured as close as possible in the wake of the laser beam 10, so that self-ignition that occurs can be detected quickly and appropriate measures can be taken.
  • the coherence tomograph in combination with the deflection device 250 for dynamic measurement spot positioning in a spatial direction horizontal to the workpiece and transverse to the cutting direction 20, it is possible to measure the kerf width inline during the cutting process.
  • Knowledge of the kerf width in turn indicates the focus position of the laser beam 10 and can be used for inline control of the focus position of the laser beam 10, in particular since thermal focus shift occurs at high laser powers in the multi-kilowatt range.
  • FIG. 5 shows a measurement of a cutting edge 6 of the cutting gap 2 in accordance with embodiments of the present disclosure.
  • the cutting edges 6 designate lateral edge regions of the cutting gap in relation to the cutting direction 20.
  • the deflection device 250 is set up to deflect the optical measuring beam 13 essentially perpendicular to the cutting direction 20 in order to measure the cutting flank geometry of the cutting gap.
  • the deflection can take the form of an oscillating movement of the optical measuring beam 13 essentially perpendicular to the cutting direction 20.
  • the cutting edges 6 of the cutting gap 2 correspond to the side walls of the cutting gap 2 along the longitudinal extent of the cutting gap 2.
  • the cutting edges 6 can have an angle or be tilted with respect to the vertical.
  • the cut edges 6 can be formed at a cut edge angle 60 to the workpiece surface that is greater than 90 °. In other words, the cutting edges 6 cannot be perpendicular to the workpiece surface.
  • FIG. 5 shows schematically how the cutting edges 6 are inclined with respect to the vertical during laser cutting.
  • the cutting edge angle 60 can be scanned using the optical measuring beam 13.
  • One or more cutting or process parameters can be set based on the measured cutting edge angle 60 in order to form the cutting flanks 6 essentially at right angles or at a certain angle.
  • FIGS. 6 and 7 show a measurement of a diameter of the outlet opening 710 of a cutting nozzle 700 according to embodiments of the present disclosure.
  • the optical measuring device 200 is configured to scan an inner surface of a nozzle 700 with the optical measuring beam 13 in at least one direction, e.g. perpendicular to a beam axis of the laser beam 10.
  • a diameter of the outlet opening 710 and thus for example the nozzle diameter, can be determined.
  • devices for machine nozzle changing are increasingly being used.
  • the nozzle diameter can be checked after receiving the nozzle 700 on the cutting head by measuring the diameter of the outlet opening 710.
  • FIG. 7 A sectional view and a top view of a cutting nozzle 700 are shown schematically in FIG.
  • An optical measuring beam 13 is shown, which can be moved through the center of the nozzle 700. This measurement results in a distance profile, as shown in FIG. 7. It can be seen from this that the nozzle diameter can be determined, for example, from the width of the interval Ar at the distance / max .
  • the optical measuring beam 13 is preferably moved in two mutually perpendicular directions x and y in order to scan an inner surface of the nozzle.
  • a center point of the outlet opening 710 can then be determined as the center point of the interval with a maximum distance in the x and y direction.
  • FIG. 8 shows an asymmetrical cutting in accordance with embodiments of the present disclosure.
  • the laser beam 10 emerges from the cutting head 101, possibly together with cutting gas, through an outlet opening 710.
  • the Laser cutting uses a nozzle 700 in which the outlet opening 710 can be formed.
  • the center of the laser beam 10 and the center of the outlet opening 710 of the cutting head 101 and the nozzle 700 are not congruent.
  • the laser processing system can measure the exit opening 710 using the optical measuring beam 13. This takes place in a similar way to that described above with reference to FIGS.
  • the optical measuring device 200 can be set up to surround an inner surface of the cutting head 101 around the outlet opening 710 with the optical measuring beam 13 in at least one direction, for example perpendicular to a beam axis of the laser beam 10, and to determine a center point of the outlet opening 710.
  • the laser processing system can be set up to deflect the laser beam 10 based thereon such that the laser beam 10 passes through the exit opening 710 in a decentralized manner. Such asymmetrical cutting can improve the cutting quality.
  • Figure 8 (a) is a schematic diagram for symmetrical cutting.
  • Figure 8 (b) is a schematic illustration for asymmetrical cutting.
  • An asymmetrical cutting occurs in particular when the center of the laser beam 10 and the center of the outlet opening 710 are not congruent. If the laser beam and a cutting gas exit together, the optical axis of the laser beam 10 and the axis of the gas jet are not congruent, which has an influence on the characteristics of the melt expulsion.
  • a targeted misalignment of the laser beam 10 with respect to the center of the outlet opening 710 or with respect to the nozzle center, for example depending on the cutting direction, can have a positive effect on the cutting quality.
  • asymmetrical cutting can be regulated inline.
  • misalignment of the laser beam 10 in the cutting direction ie parallel to the cutting direction
  • the center point of the so-called half-shell of the cutting front can be measured inline with respect to the center point of the outlet opening 710 or to the nozzle center.
  • the laser beam 10 can then be targeted and automated with at least one optical element to the desired position with respect to the center of the outlet opening or Nozzle centers can be misaligned inline.
  • the nozzle can be misaligned with respect to the laser beam 10.
  • the optical measuring device 200 is set up to direct the optical measuring beam 13 onto the workpiece 1 before the cutting process begins and to determine a material of the workpiece 1 from a reflection of the optical measuring beam 13.
  • a separate process parameter set is stored in the control device for each combination of material type and workpiece thickness (workpiece thickness) and called up if necessary.
  • the selection or assignment of the correct process parameter set to the workpiece can be done manually using a production plan.
  • the type of material can be determined before the actual cutting process according to the present disclosure.
  • the optical measuring beam 13 can be fired onto the workpiece 1 with a defined intensity I 0 and a defined period of time.
  • the optical measuring beam 13 is partially reflected back and reaches the sensor of the intensity 1 x
  • Reflectance of the material The present type of material can in turn be determined from this, and the control device can automatically select the correct process parameter set.
  • an optical coherence tomograph is provided as the measuring sensor, which enables the simultaneous acquisition of various relevant process variables during the laser cutting.
  • the process variables recorded are, in particular, geometric variables, ie the cutting front geometry and / or the width of the cutting gap and / or the cutting flank geometry. This makes it possible to detect deviations occurring in the cutting process or fluctuations in the machining quality as early as during the cutting process.
  • By a Adjusting the current machining parameters eg feed speed, direction, focus position, gas pressure, etc.
  • different topographical properties can be detected and the process controlled accordingly with only one measuring device.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un procédé pour couper une pièce (1) au moyen d'un faisceau laser (10), comprenant les étapes consistant : à générer un interstice de coupe (2) sur la pièce (1) le long d'une direction de coupe (20) au moyen d'un faisceau laser (10) au cours d'un processus de coupe ; à diriger un faisceau optique de mesure (13) d'un appareil de tomographie par cohérence optique sur l'interstice de coupe (2) ; à faire dévier le faisceau optique de mesure (13) ; et à mesurer au moins une propriété géométrique de l'interstice de coupe (2) à l'aide de l'appareil de tomographie par cohérence optique.
PCT/EP2019/077460 2018-11-22 2019-10-10 Procédé pour couper une pièce au moyen d'un faisceau laser et système d'usinage laser utilisé pour mettre ce procédé en œuvre Ceased WO2020104100A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201980089999.2A CN113348047A (zh) 2018-11-22 2019-10-10 用于借助激光射束切割工件的方法和用于执行该方法的激光加工系统
EP19786772.4A EP3883719A1 (fr) 2018-11-22 2019-10-10 Procédé pour couper une pièce au moyen d'un faisceau laser et système d'usinage laser utilisé pour mettre ce procédé en oeuvre

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018129407.7 2018-11-22
DE102018129407.7A DE102018129407B4 (de) 2018-11-22 2018-11-22 Verfahren zum Schneiden eines Werkstücks mittels eines Laserstrahls und Laserbearbeitungssystem zum Durchführen des Verfahrens

Publications (1)

Publication Number Publication Date
WO2020104100A1 true WO2020104100A1 (fr) 2020-05-28

Family

ID=68233998

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2019/077460 Ceased WO2020104100A1 (fr) 2018-11-22 2019-10-10 Procédé pour couper une pièce au moyen d'un faisceau laser et système d'usinage laser utilisé pour mettre ce procédé en œuvre

Country Status (4)

Country Link
EP (1) EP3883719A1 (fr)
CN (1) CN113348047A (fr)
DE (1) DE102018129407B4 (fr)
WO (1) WO2020104100A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113953687A (zh) * 2021-12-08 2022-01-21 业成科技（成都）有限公司 切割方法及切割装置
WO2023179934A1 (fr) * 2022-03-22 2023-09-28 TRUMPF Werkzeugmaschinen SE + Co. KG Procédé d'usinage au laser et machine-outil à laser

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112247382A (zh) * 2020-09-10 2021-01-22 武汉光谷航天三江激光产业技术研究院有限公司 基于光学弱相干成像的激光焊接熔深信息监测系统及方法
DE102022101323A1 (de) 2022-01-20 2023-07-20 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneideverfahren mit Einstellen der Fokuslage
DE102022103016B3 (de) 2022-02-09 2023-06-01 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Einbringen einer Perforationslinie in eine Airbag-Abdeckung
EP4241913A1 (fr) * 2022-03-10 2023-09-13 Bystronic Laser AG Procédé et dispositif de découpe laser
DE102022121341A1 (de) * 2022-08-24 2024-02-29 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneiden eines Werkstücks unter Schutz der Bearbeitungsvorrichtung
CN116921883A (zh) * 2023-08-31 2023-10-24 济南邦德激光股份有限公司 一种具有自动识别切割状态的激光切割头及识别方法
DE102023135396A1 (de) * 2023-12-15 2025-06-18 TRUMPF Laser SE Verfahren zum Durchführen eines Laserbearbeitungsprozesses und Laserbearbeitungsvorrichtung
DE102024101110A1 (de) 2024-01-16 2025-07-17 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zum Kalibrieren eines Messsystems eines Laserbearbeitungskopfs
EP4628243A1 (fr) * 2024-04-04 2025-10-08 Bystronic Laser AG Machine, système et procédé de découpe au laser à plat
CN118357569A (zh) * 2024-06-17 2024-07-19 深圳市智博泰克科技有限公司 一种带oct检测的焊接振镜系统
DE102024123353A1 (de) 2024-08-15 2026-02-19 TRUMPF Werkzeugmaschinen SE + Co. KG Verfahren zum Betreiben einer Laserbearbeitungsmaschine und Laserbearbeitungsmaschine

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1275465A1 (fr) 2001-07-13 2003-01-15 SALVAGNINI ITALIA S.p.A. Système de commande de la qualité d'une coupe ou d'une perforation laser, en particulier pour des tôles
WO2014138939A1 (fr) * 2013-03-13 2014-09-18 Queen's University At Kingston Procédés et systèmes de caractérisation de propriétés d'usinage laser par mesure de dynamiques de trou de serrure utilisant une interférométrie
EP3189926A1 (fr) * 2011-02-07 2017-07-12 TRUMPF Werkzeugmaschinen GmbH + Co. KG Machine et methode pour observer, et particulierement pour controler, un procede de coupe au laser
DE102016219927A1 (de) * 2016-10-13 2018-04-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung und Verfahren zur Überwachung eines thermischen Schneidprozesses

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008030783B3 (de) * 2008-06-28 2009-08-13 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Laserstrahlschrägschneiden und Laserbearbeitungsmaschine
DE102010020183B4 (de) * 2010-05-11 2013-07-11 Precitec Kg Laserschneidkopf und Verfahren zum Schneiden eines Werkstücks mittels eines Laserschneidkopfes
DE102013017795C5 (de) 2013-10-25 2018-01-04 Lessmüller Lasertechnik GmbH Prozessüberwachungsverfahren und -vorrichtung
DE102014113283B4 (de) 2014-09-15 2016-11-03 Blackbird Robotersysteme Gmbh Vorrichtung zur Remote-Laserbearbeitung mit Sensor-Scannereinrichtung
CN104227243A (zh) * 2014-09-11 2014-12-24 深圳英诺激光科技有限公司 一种硬质材料激光深加工设备及加工方法
DE102015012565B3 (de) 2015-09-25 2016-10-27 Lessmüller Lasertechnik GmbH Vorrichtung und Verfahren zur Erhöhung der Genauigkeit eines OCT-Messsystems für die Lasermaterialbearbeitung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1275465A1 (fr) 2001-07-13 2003-01-15 SALVAGNINI ITALIA S.p.A. Système de commande de la qualité d'une coupe ou d'une perforation laser, en particulier pour des tôles
EP3189926A1 (fr) * 2011-02-07 2017-07-12 TRUMPF Werkzeugmaschinen GmbH + Co. KG Machine et methode pour observer, et particulierement pour controler, un procede de coupe au laser
WO2014138939A1 (fr) * 2013-03-13 2014-09-18 Queen's University At Kingston Procédés et systèmes de caractérisation de propriétés d'usinage laser par mesure de dynamiques de trou de serrure utilisant une interférométrie
DE102016219927A1 (de) * 2016-10-13 2018-04-19 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Vorrichtung und Verfahren zur Überwachung eines thermischen Schneidprozesses

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113953687A (zh) * 2021-12-08 2022-01-21 业成科技（成都）有限公司 切割方法及切割装置
CN113953687B (zh) * 2021-12-08 2023-05-05 业成科技（成都）有限公司 切割方法及切割装置
WO2023179934A1 (fr) * 2022-03-22 2023-09-28 TRUMPF Werkzeugmaschinen SE + Co. KG Procédé d'usinage au laser et machine-outil à laser

Also Published As

Publication number Publication date
DE102018129407A1 (de) 2020-05-28
EP3883719A1 (fr) 2021-09-29
CN113348047A (zh) 2021-09-03
DE102018129407B4 (de) 2023-03-30

Similar Documents

Publication Publication Date Title
DE102018129407B4 (de) Verfahren zum Schneiden eines Werkstücks mittels eines Laserstrahls und Laserbearbeitungssystem zum Durchführen des Verfahrens
EP3924134B1 (fr) Système d'usinage au laser pour l'usinage d'une pièce au moyen d'un faisceau laser, et procédé de commande d'un système d'usinage au laser
EP3049755B1 (fr) Procédé de mesure de la profondeur de pénétration d'un faisceau laser dans une pièce à usiner et dispositif d'usinage laser
DE102012100721B3 (de) Verfahren zum Regeln eines Laserschneidprozesses und Laserschneidmaschine
EP3140609B1 (fr) Dispositif de mesure de la profondeur d'un cordon de soudure en temps réel
EP3210714B1 (fr) Dispositif et procédé de surveillance, en particulier de réglage d'un processus de coupe
DE102013219220B4 (de) Verfahren zum Laser- Remote Bearbeiten eines Werkstücks an einer Kehle und Vorrichtung hierfür
EP0367924B1 (fr) Procédé et dispositif pour déterminer la position d'un joint d'une soudure pour le soudage à laser
EP2544849B1 (fr) Tête de travail au laser et procédé de travail au laser
DE102013008269B4 (de) Bearbeitungskopf für eine Laserbearbeitungsvorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks
DE4336136C2 (de) Laserbearbeitungsvorrichtung und -verfahren
DE102018105877B3 (de) Vorrichtung für die Bestimmung einer Ausrichtung einer optischen Vorrichtung eines Kohärenztomographen, Kohärenztomograph und Laserbearbeitungssystem
EP1640101B1 (fr) Méthode pour contrôler un procédé d'usinage automatique.
WO2018178387A1 (fr) Dispositif et procédé de fabrication additive
DE102017218494B4 (de) Bearbeitungsvorrichtung und Verfahren zur insbesondere schweißenden Bearbeitung eines Werkstücks
EP2894004B1 (fr) Dispositif de traitement laser avec une caméra et un mirroir mobile
DE102017115922B4 (de) Verfahren und Vorrichtung zur Messung und Einstellung eines Abstands zwischen einem Bearbeitungskopf und einem Werkstück sowie dazugehöriges Verfahren zur Regelung
DE102014000330B3 (de) Verfahren zur Überwachung und Regelung der Fokuslage eines Bearbeitungslaserstrahls beim Laserschneiden
DE102020000630B4 (de) Verfahren und Vorrichtung zum Durchführen und Überwachen eines Bearbeitungsprozesses eines Werkstücks
EP3883720B1 (fr) Procédé d'usinage au laser et système d'usinage au laser destiné à la mise en oeuvre du procédé
EP3837084B1 (fr) Système de traitement au laser et procédé d'usinage d'une pièce avec un faisceau laser
DE102022127484A1 (de) Laserbearbeitungssystem mit Lidar-Sensor und Verfahren zum Durchführen eines Laserbearbeitungsprozesses mittels einem solchen
EP1863612A1 (fr) Procede pour mesurer des limites de phase d'un materiau lors de l'usinage avec un faisceau d'usinage au moyen d'un rayonnement d'eclairage supplementaire et d'un algorithme de traitement d'images automatise et dispositif associe
DE102021127917A1 (de) Verfahren und System zum Einstellen einer Referenzstrecke eines OCT-Systems
DE102020000636B4 (de) Verfahren und Vorrichtung zum Durchführen und Überwachen eines Bearbeitungsprozesses eines Werkstücks

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19786772

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2019786772

Country of ref document: EP

Effective date: 20210622