WO2020107592A1 - Procédé et dispositif de réfrigération électrocalorique - Google Patents

Procédé et dispositif de réfrigération électrocalorique Download PDF

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Publication number
WO2020107592A1
WO2020107592A1 PCT/CN2018/123209 CN2018123209W WO2020107592A1 WO 2020107592 A1 WO2020107592 A1 WO 2020107592A1 CN 2018123209 W CN2018123209 W CN 2018123209W WO 2020107592 A1 WO2020107592 A1 WO 2020107592A1
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WO
WIPO (PCT)
Prior art keywords
heat
electric card
material layer
cooling
card material
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Ceased
Application number
PCT/CN2018/123209
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English (en)
Chinese (zh)
Inventor
于淑会
阮盼盼
于均益
孙蓉
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Shenzhen Institute of Advanced Technology of CAS
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Shenzhen Institute of Advanced Technology of CAS
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Publication of WO2020107592A1 publication Critical patent/WO2020107592A1/fr
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Ceased legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Definitions

  • the invention relates to the technical field of electromechanical engineering, in particular to an electric card refrigeration device and a refrigeration method.
  • Refrigeration technology plays a vital role in people's daily lives. It is widely used, from the use of air conditioners, the preservation of food, to the protection of various electronic devices.
  • the traditional vapor compression refrigeration will emit organic gases, causing damage to the environment, and has reached the limit; the new type of thermoelectric refrigeration is too low to be suitable for large-scale and large cooling capacity; the magnetic field generation in the magnetic card refrigeration requires magnets, which hinders
  • the miniaturization of refrigeration devices is very inflexible in design. Therefore, it is necessary to develop a refrigeration equipment with low cost, high energy conversion efficiency and environmental protection.
  • Electric card refrigeration equipment is based on the electric card effect, that is, by applying an electric field, the temperature of the material changes.
  • the temperature of the material increases when an electric field is applied, and when the electric field is removed, the temperature of the electric card material decreases to achieve cooling or heating purposes; and for materials with a negative electric card effect, The situation is just the opposite.
  • the present invention provides an electric card cooling device and a cooling method that can be commercialized.
  • the electric card cooling device has a simple structure, is easy to implement, and has a good cooling effect.
  • An electric card refrigerating device includes a disc-shaped electric card material layer, two electrodes respectively connected to the upper and lower surfaces of the electric card material layer, arranged on the periphery of the electric card material layer and opposite to the electric card material layer
  • a rotating heat conduction ring which is formed by connecting the heat conduction part and the heat insulation part end to end in the circumferential direction, and the electric card material layer can be controlled to be periodically powered on and off through the two electrodes;
  • At least one of the heat-insulating portions blocks the cooling inlet to isolate heat
  • at least one of the heat-conductive portions blocks the cooling inlet to transfer heat.
  • the heat conducting ring is disposed in contact with the electric card material layer.
  • the thermally conductive portion is at least one of copper, aluminum, graphene, BN (boron nitride), graphite, carbon fiber, and C/C (carbon/carbon) composite material.
  • the heat-conducting ring includes at least two heat-conducting parts and at least two heat-insulating parts, and the number of the cooling inlets is consistent with the number of the heat-conducting parts and the number of the heat-insulating parts .
  • each of the electric card material layers and one of the heat conduction rings form a cooling unit
  • the electric card cooling device includes a plurality of layers of the cooling units stacked one above the other.
  • the heat conduction portion of the cooling unit of at least one layer coincides with the orthographic projection of the heat conduction portion of the cooling unit of the adjacent layer.
  • the heat conduction portion of the refrigeration unit of at least one layer coincides with the orthographic projection of the heat insulation portion of the refrigeration unit of the adjacent layer.
  • the electric card refrigeration device further includes a heat insulation sheet for heat insulation, and a layer of the heat insulation sheet is interposed between the two heat conduction rings whose orthographic projections of the heat conduction portions of adjacent layers overlap .
  • the thickness of the heat-insulating portion is greater than the sum of the thickness of the electric card material layer and the two electrodes, and the thickness of the heat-conducting portion is not greater than the thickness of the heat-insulating portion and not less than the electrical The sum of the thickness of the card material layer and the two electrodes.
  • Another object of the present invention is to provide a cooling method using any one of the above electric card cooling devices, including:
  • the electric card refrigeration device of the present invention has a simple structure and is easy to implement. By controlling the rotation of the heat conducting ring relative to the internal electric card material layer, and periodically changing the on and off states of the electric card material layer accordingly, the device can continue to cool down , So that the device can maximize the maximum efficiency of the cooling effect.
  • FIG. 1 is a schematic structural diagram of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic diagram of a first use state of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic diagram of a second use state of an electric card refrigeration device according to Embodiment 1 of the present invention.
  • FIG. 5 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 2 of the present invention.
  • FIG. 6 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 3 of the present invention.
  • FIG. 7 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 4 of the present invention.
  • FIG. 8 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 5 of the present invention.
  • FIG. 9 is a schematic cross-sectional structural diagram of an electric card refrigeration device according to Embodiment 6 of the present invention.
  • an electric card cooling device includes a disc-shaped electric card material layer 11, two electrodes 12 respectively connected to the upper and lower surfaces of the electric card material layer 11, and disposed on the periphery of the electric card material layer 11 And a heat conducting ring 20 that rotates relative to the electric card material layer 11.
  • the heat conducting ring 20 is formed by connecting the heat conducting portion 21 and the heat insulating portion 22 end to end in the circumferential direction.
  • the electric card material layer 11 can be controlled to be periodically energized and Power off.
  • the electric card material layer 11 and the two electrodes 12 on the lower surface of the electrode form an electric card unit 10.
  • the cooling space as a cooling object has at least one cooling inlet.
  • At least one insulating portion 22 blocks cooling The inlet is to isolate heat.
  • at least one heat-conducting portion 21 blocks the cooling inlet to transfer heat.
  • Both the heat-conducting portion 21 and the heat-insulating portion 22 are arc blocks, preferably fan-shaped arc blocks.
  • the electric card material layer 11 is in contact with the thermally conductive ring 20, at least in contact with the thermally conductive portion 21 of the thermally conductive ring 20, to better transfer heat.
  • a heat insulating material for heat insulation may also be provided between the heat conducting portion 21 and the heat insulating portion 22 to prevent heat from being transferred from the heat conducting portion 21 to the heat insulating portion 22.
  • the heat-conducting portion 21 and the heat-insulating portion 22 are alternately arranged in the ring direction, the heat-conducting ring 20 is concentrically arranged with the electric card material layer 11, and the cooling inlet is arranged to communicate with at least one part of the heat-conducting ring.
  • the heat-conducting portion 21 and the heat-insulating portion 22 of the heat-conducting ring 20 alternately pass through the cooling inlet, and heat can be radiated to the cooling inlet through the heat-conducting portion 21, thereby cooling the refrigeration space
  • the temperature of the electric card material layer 11 increases, and during the electric card material layer 11 is powered off, the temperature of the electric card material layer 11 decreases. Therefore, when the electric card material layer 11 is energized, the insulating portion 22 blocks the cooling inlet to isolate the heat, and the heat of the electric card material layer 11 cannot be radiated into the cooling space.
  • the heat conduction portion 21 Rotating to block the cooling inlet to transfer heat, the heat of the electric card material layer 11 can be dissipated into the cooling space to achieve continuous cooling of the cooling space.
  • each cooling inlet is directly opposed to one heat-conducting portion 21 or heat-insulating portion 22.
  • the heat conducting ring 20 of this embodiment is described by taking four parts as an example.
  • the heat conducting ring 20 is composed of two heat conducting parts 21 and two heat insulating parts 22.
  • the heat conducting parts 21 and The heat-insulating portions 22 are connected end to end and are alternately arranged in the circumferential direction of the heat-conducting ring 20, and the cooling space has two cooling inlets corresponding to the number of heat-conducting portions 21.
  • the two electrodes 12 of the electric card material layer 11 are not energized, and the two heat-insulating portions 22 respectively correspond to the two cooling inlets.
  • the electric card material layer 11 is energized through the two electrodes 12, the temperature of the electric card material rises, but because the heat insulating portion 22 is blocked at the refrigeration inlet, the heat conduction portion 21 is staggered from the refrigeration inlet and is directly opposite to the external environment, Therefore, the heat of the electric card material layer 11 cannot enter the cooling space through the cooling inlet, and can only be dissipated into the external environment through the heat conducting portion 21 located outside the cooling inlet; the heat conducting ring 20 rotates relative to the electric card material layer 11 when the heat insulating portion 22 When it rotates to be staggered from the refrigeration inlet, and the heat-conducting portion 21 rotates to correspond to the refrigeration inlet, the insulating portion 22 blocks the external environment, the electric card material layer 11 is de-energized and the temperature decreases, and the heat of the electric card material layer 11 enters
  • the thermally conductive portion 21 is a material with good thermal conductivity, such as gold, silver, copper, aluminum, zinc, titanium, tin, lead, nickel, steel, silicon, iron, silicon dioxide, SiC, GaAs, At least one of GaP, Kavor, graphene, BN, graphite, carbon fiber and C/C composite materials, thermally conductive rubber, and the like.
  • the heat insulation part 22 is glass fiber, asbestos, rock wool, slag wool, silicate, diatomaceous earth, expanded vermiculite, expanded perlite, foamed clay, lightweight concrete, microporous calcium silicate, foam glass, ceramic fiber , Heat-absorbing glass, heat reflective glass, insulating glass, at least one of aerogel felt, vacuum board, foam plastic, etc., preferably foam plastic, glass fiber, asbestos, rock wool, silicate aerogel felt , Vacuum board, etc.
  • the electric card material layer 11 is at least one of single crystal, ferroelectric ceramic, ferroelectric thin film, ferroelectric polymer, ferroelectric polymer composite material and the like.
  • the electrode 12 is at least one of a metal alloy electrode, a coated electrode, a porous gas diffusion electrode, and the like.
  • the diameter of the electric card material layer 11 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 1 m.
  • the diameter of the electrode 12 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 10 cm.
  • the diameter of the heat-conducting portion 21 and the heat-insulating portion 22 is preferably 1 ⁇ m to 1 m, and the thickness is 1 nm to 1 m.
  • the electrode 12 is preferably at least one of a metal alloy electrode, a coated electrode, a porous gas diffusion electrode, and the like.
  • this embodiment does not limit the number of the heat conduction portion 21 and the heat insulation portion 22 in the heat conduction ring 20, and the number of the heat conduction portion 21 and the heat insulation portion 22 may be one or more.
  • the method of using the above electric card cooling device to achieve cooling includes:
  • the voltage is periodically applied to and removed from the electric card material layer 11 through the two electrodes 12, and the heat conduction ring 20 is controlled to rotate relative to the electric card material layer 11;
  • At least one insulating portion 22 blocks the cooling inlet to isolate heat
  • At least one heat-conducting portion 21 rotates to block the cooling inlet to transfer heat.
  • the cooling space can be To achieve continuous cooling.
  • the electric card cooling device of this embodiment is based on the electric card material layer 11 and the heat conducting ring 20 in Embodiment 1.
  • Each electric card material layer 11 and a heat conducting ring 20 form a cooling unit
  • the card refrigeration device includes a plurality of layers of cooling units stacked up and down, and the heat conduction rings 20 of the cooling units of each layer are stacked together with no gap between the two.
  • the number of cooling inlets is the same as the number of heat conducting parts 21 and the number of heat insulating parts 22.
  • the orthographic projections of the heat conduction portion 21 of the cooling unit of at least one layer and the heat conduction portion 21 of the cooling unit of the adjacent layer coincide. That is, the heat conduction portion 21 and the heat insulation portion 22 of at least one layer of the heat conduction ring 20 are directly opposite to the heat conduction portion 21 and the heat insulation portion 22 of the lower layer, and the two heat conduction portions 21 overlap each other.
  • the electricity card material layers 11 of all refrigeration units are regularly turned on and off, so that all The cooling inlets are cooled at the same time, and at the same time, the rotation speed of the heat conduction ring 20 is controlled so that the heat can be collected through the cooling inlets of each layer at the same time.
  • the heat conduction part 21 and the heat insulation part 22 are directly opposite the electric card material layer 11 of the two-layer refrigeration unit
  • the on-off state and the rotation speed of the heat-conducting ring 20 can be the same, which can greatly improve the cooling efficiency.
  • a heat insulating sheet for preventing heat from being emitted in the longitudinal direction may be interposed between the heat conduction ring 20 of the upper layer and the heat conduction ring 20 of the lower layer.
  • the electric card cooling device of this embodiment is also based on the electric card material layer 11 and the heat conduction ring 20 in Embodiment 1, and the heat conduction portion 21 of at least one cooling unit and the cooling unit of the adjacent layer
  • the orthographic projections of the heat-insulating portion 22 coincide, that is, the heat-conducting portion 21 and the heat-insulating portion 22 of at least one layer of the heat-conducting ring 20 are directly opposite to the heat-insulating portion 22 and the heat-conducting portion 21 of the lower layer, and the heat-conducting portions 21 of the two are in a staggered state.
  • the electric card cooling device of this embodiment further includes a heat insulation sheet 30 for heat insulation, and a layer is sandwiched between the two heat conduction rings 20 whose heat projections of the heat insulation portion 21 of the adjacent layer coincide with the orthographic projection of the heat conduction portion 21 of the adjacent layer
  • the heat insulation sheet 30 can prevent heat loss caused by heat transfer between the heat conduction ring 20 and the heat insulation sheet 30 opposed in the longitudinal direction.
  • the heat-insulating portion 22 and the heat-conducting portion 21 of the other-layer refrigeration device can be kept coincident with each other.
  • the heat insulating sheet 30 at least completely covers the heat conducting ring 20, for example, it may be consistent with the shape and size of the heat conducting portion 21 or larger than the area of the heat conducting ring 20.
  • the on and off states of the electric card material layer 11 of the two layers of the cooling unit with the heat conduction part 21 staggered from each other are opposite, and the rotation speed of the heat conduction ring 20 is the same, so that the heating/cooling processes of the two layers are the same To improve the cooling efficiency.
  • the thickness of the heat-insulating portion 22 of this embodiment is greater than the sum of the thicknesses of the electric card material layer 11 and the two electrodes 12, and the thickness of the heat-conducting portion 21 is not greater than the thickness of the heat-insulating portion 22, It is greater than or equal to the sum of the thickness of the electric card material layer 11 and the two electrodes 12.
  • the size of the cooling inlet is the same as the size of the heat-insulating portion 22.
  • the heat can also pass through The gap between the heat conduction portion 21 and the cooling inlet enters, and a part of the bottom surface of the heat conduction portion 21 can also serve as a heat dissipation surface, increasing the heat dissipation area.
  • each electrical card material layer 11 and a thermally conductive ring 20 in Embodiment 4 are regarded as a refrigeration unit, and the electrical card refrigeration device includes a plurality of layers stacked up and down In the provided cooling unit, the heat conduction rings 20 of the cooling units of each layer are stacked together, and a gap is formed between the electric card material layers 11 of the cooling units of each layer.
  • the number of cooling inlets is the same as the number of heat conducting parts 21 and the number of heat insulating parts 22.
  • the orthographic projections of the heat conduction portion 21 of the cooling unit of at least one layer and the heat conduction portion 21 of the cooling unit of the adjacent layer coincide. That is, the heat conduction portion 21 and the heat insulation portion 22 of at least one layer of the heat conduction ring 20 are directly opposite to the heat conduction portion 21 and the heat insulation portion 22 of the lower layer, and the two heat conduction portions 21 overlap each other.
  • the heat insulation portions 22 of the two-layer refrigeration units whose orthographic projections coincide are attached to each other, and the heat conduction portions 21 form a gap through which heat can pass.
  • the electricity card material layers 11 of all refrigeration units are regularly turned on and off, so that all The cooling inlets are cooled at the same time, and at the same time, the rotation speed of the heat conduction ring 20 is controlled so that the heat can be collected through the cooling inlets of each layer at the same time.
  • the heat conduction part 21 and the heat insulation part 22 are directly opposite the electric card material layer 11 of the two-layer refrigeration unit
  • the on-off state and the rotation speed of the heat-conducting ring 20 can be the same, which can greatly improve the cooling efficiency.
  • a heat insulating sheet for preventing heat from being emitted in the longitudinal direction may be interposed between the heat conduction ring 20 of the upper layer and the heat conduction ring 20 of the lower layer.
  • the electric card cooling device of this embodiment is also based on the electric card material layer 11 and the heat conduction ring 20 in the embodiment 4, at least one layer of the heat conduction portion 21 of the cooling unit and the adjacent layer of the cooling unit
  • the orthographic projections of the heat-insulating portion 22 coincide, that is, the heat-conducting portion 21 and the heat-insulating portion 22 of at least one layer of the heat-conducting ring 20 are directly opposite to the heat-insulating portion 22 and the heat-conducting portion 21 of the lower layer, and the heat-conducting portions 21 of the two are in a staggered state.
  • the on and off states of the electric card material layer 11 of the two layers of the cooling unit with the heat conduction portion 21 staggered from each other are opposite, and the rotation speed of the heat conduction ring 20 is the same, so that the heating/cooling process of the two layers is the same, and it can also start To improve the cooling efficiency.
  • a gap between the heat conduction rings 20 of the two-layer refrigeration unit is formed for heat to pass through, and a layer of heat insulation sheet 30 is interposed between the two heat conduction rings 20 of the two-layer refrigeration unit, which can prevent the longitudinally opposed heat conduction rings Heat is transferred between 20 and the heat insulating sheet 30 to cause heat loss.
  • the heat-insulating portion 22 and the heat-conducting portion 21 of the other-layer refrigeration device can be kept coincident with each other.
  • the electric card refrigeration device of the present invention has a simple structure and is easy to implement.
  • the on and off states of the electric card material layer are periodically changed accordingly.
  • the device can continue to cool down, so that the device can maximize the cooling efficiency of the maximum efficiency.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

Dispositif de réfrigération électrocalorique, comprenant une couche de matériau électrocalorique en forme de disque (11), deux électrodes (12) reliant respectivement une surface inférieure d'une électrode supérieure de la couche de matériau électrocalorique (11), et un anneau conducteur (20) disposé sur la périphérie de la couche de matériau électrocalorique (11) et tournant par rapport à celle-ci (11). L'anneau conducteur (20) est formé par raccordement de parties conductrices (21) et de parties d'isolation thermique (22) bout à bout dans une direction circonférentielle. La mise sous tension et celle hors tension de la couche de matériau électrocalorique (11) peuvent être commandées périodiquement par les deux électrodes (12). Pendant un processus d'élévation de température de la couche de matériau électrocalorique (11), au moins une partie d'isolation thermique (22) bloque une entrée de réfrigération pour isoler la chaleur; et pendant un processus de refroidissement de la couche de matériau électrocalorique (11), au moins une partie conductrice (21) bloque l'entrée de réfrigération pour transférer de la chaleur. L'invention concerne en outre un procédé de réfrigération. Le dispositif de réfrigération électrocalorique est de structure simple et facile à mettre en œuvre. En commandant l'anneau conducteur (20) de tourner par rapport à la couche de matériau électrocalorique interne (11), et en modifiant de manière correspondante périodiquement l'état de mise sous tension ou hors tension de la couche de matériau électrocalorique (11), le dispositif peut effectuer en continu un refroidissement, et peut améliorer l'effet de réfrigération à une étendue et à un rendement maximaux.
PCT/CN2018/123209 2018-11-29 2018-12-24 Procédé et dispositif de réfrigération électrocalorique Ceased WO2020107592A1 (fr)

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CN201811439742.9A CN111238077B (zh) 2018-11-29 2018-11-29 一种电卡制冷装置及制冷方法
CN201811439742.9 2018-11-29

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CN113959112B (zh) * 2021-10-22 2022-09-30 南开大学 一种基于电卡效应的毛细管制冷器件的制备方法
CN113996259B (zh) * 2021-11-19 2023-04-07 浙江海洋大学 一种石油化工反应釜
CN116951811B (zh) * 2022-04-19 2025-12-12 青岛海尔智能技术研发有限公司 电卡制冷系统及设备
CN118929854B (zh) * 2024-09-26 2026-01-02 青岛理工大学 一种基于金属负载型海藻酸钠碳气凝胶的颗粒生物电极及其制备方法和应用
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CN114719463B (zh) * 2022-04-25 2023-05-16 湘潭大学 一种螺旋固态电卡制冷器及制冷方法

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