WO2020141692A1 - Antenne utilisant un élément latérale conducteur et dispositif électronique la comportant - Google Patents

Antenne utilisant un élément latérale conducteur et dispositif électronique la comportant Download PDF

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Publication number
WO2020141692A1
WO2020141692A1 PCT/KR2019/011831 KR2019011831W WO2020141692A1 WO 2020141692 A1 WO2020141692 A1 WO 2020141692A1 KR 2019011831 W KR2019011831 W KR 2019011831W WO 2020141692 A1 WO2020141692 A1 WO 2020141692A1
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WIPO (PCT)
Prior art keywords
conductive
electronic device
antenna
antenna structure
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2019/011831
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English (en)
Korean (ko)
Inventor
김성수
윤영중
김성회
배장환
안용준
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Industry Academic Cooperation Foundation of Yonsei University
Original Assignee
Samsung Electronics Co Ltd
Industry Academic Cooperation Foundation of Yonsei University
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Filing date
Publication date
Application filed by Samsung Electronics Co Ltd, Industry Academic Cooperation Foundation of Yonsei University filed Critical Samsung Electronics Co Ltd
Publication of WO2020141692A1 publication Critical patent/WO2020141692A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly

Definitions

  • Various embodiments of the present invention relate to an antenna using a conductive side member and an electronic device including the same.
  • the next-generation wireless communication technology can transmit and receive signals using frequencies in the range of 3 GHz to 100 GHz, and overcome the high free space loss due to the frequency characteristics, and an efficient mounting structure to increase the gain of the antenna and a new antenna module corresponding thereto Is being developed.
  • the above-described antenna module may include an antenna module in the form of an array in which various numbers of antenna elements (eg, conductive patches) are arranged at regular intervals. These antenna elements may be arranged to form a beam pattern in any one direction inside the electronic device.
  • the electronic device may include a metal structure such as a conductive side member for strengthening rigidity and forming a beautiful appearance.
  • a metal structure such as a conductive side member for strengthening rigidity and forming a beautiful appearance.
  • Various embodiments of the present invention can provide an antenna using a conductive side member and an electronic device including the antenna.
  • Various embodiments of the present invention can provide an antenna using a conductive side member configured to enable beam steering in various directions and an electronic device including the same.
  • the electronic device includes a side plate including a first plate, a second plate facing in a direction opposite to the first plate, and a space surrounding the space between the first plate and the second plate and including a conductive portion.
  • the first antenna structure including the connecting parts and the second plurality of conductive patches arranged at regular intervals in parallel with the first antenna structure and the second plurality of conductive connecting parts electrically connecting each of the second conductive patches It includes a second antenna structure including a printed circuit board and the printed circuit board disposed adjacent to the antenna structure in the space, and is electrically connected to the antenna structure through the printed circuit board, the first And at least one first wireless communication circuit configured to transmit and/or receive signals in the frequency band.
  • the electronic device includes a side plate including a first plate, a second plate facing in a direction opposite to the first plate, and a space surrounding the space between the first plate and the second plate and including a conductive portion.
  • An antenna structure including a housing including a plurality of conductive patches arranged at regular intervals, and a plurality of conductive connecting parts electrically connecting each of the conductive patches as an antenna structure formed through at least a portion of the conductive portion.
  • the conductive side member is utilized as an antenna structure including a plurality of conductive patches that are physically connected by a conductive connection, thereby reducing the radiation performance of the antenna by the conductive side member. It can be prevented, it can help to reinforce the rigidity of the conductive side member through the connection structure of the conductive patch connected to each other by the conductive connection.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.
  • FIG. 2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks according to various embodiments.
  • 3A is a perspective view of a mobile electronic device according to various embodiments.
  • 3B is a rear perspective view of a mobile electronic device according to various embodiments.
  • 3C is an exploded perspective view of a mobile electronic device according to various embodiments.
  • FIG. 4A shows an embodiment of the structure of the third antenna module described with reference to FIG. 2.
  • FIG. 4B shows a cross section of the third antenna module 246 shown in FIG. 4A (a) with respect to line Y-Y'.
  • FIG. 5 is a view showing the configuration of an antenna module according to various embodiments of the present invention.
  • FIG. 6 is a sectional view of main parts illustrating a state in which an antenna module is coupled according to various embodiments of the present disclosure.
  • FIG. 7 is a graph illustrating a reflection coefficient of the antenna module of FIG. 5 according to various embodiments of the present invention.
  • 8A to 10B are radiation pattern views showing a beam steering state in an yz-plane according to the operation of the antenna module of FIG. 5 according to various embodiments of the present invention.
  • FIG. 11 is a graph illustrating a beam scanning state in an xy-plane according to a phase change of the antenna module of FIG. 5 according to various embodiments of the present invention.
  • FIG. 12 is a partially enlarged perspective view of an antenna structure according to various embodiments of the present invention.
  • 13A and 13B are diagrams comparing an electric field distribution of an antenna structure according to a thickness of a conductive connection part according to various embodiments of the present invention.
  • 14A to 14C are diagrams illustrating a structure of an antenna structure according to various embodiments of the present invention.
  • 15 is a view showing the configuration of an antenna module according to various embodiments of the present invention.
  • 16 is a diagram illustrating an arrangement relationship of an antenna module in an electronic device according to various embodiments of the present invention.
  • FIG. 17 is a graph showing an operating frequency band of the legacy antenna of FIG. 16 according to a change of a variable element according to various embodiments of the present invention.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present invention.
  • the electronic device 101 communicates with the electronic device 102 through the first network 198 (eg, a short-range wireless communication network), or the second network 199. It may communicate with the electronic device 104 or the server 108 through (eg, a remote wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the first network 198 eg, a short-range wireless communication network
  • the server 108 e.g, a remote wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, a sensor module ( 176), interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ).
  • the components for example, the display device 160 or the camera module 180
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the display device 160 eg., a display
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • software eg, the program 140
  • the processor 120 may receive instructions or data received from other components (eg, the sensor module 176 or the communication module 190) in the volatile memory 132. Loaded into, process instructions or data stored in volatile memory 132, and store result data in non-volatile memory 134.
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and an auxiliary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or together. , Sensor hub processor, or communication processor). Additionally or alternatively, the coprocessor 123 may be set to use lower power than the main processor 121, or to be specialized for a specified function. The coprocessor 123 may be implemented separately from the main processor 121 or as a part thereof.
  • a main processor 121 eg, a central processing unit or an application processor
  • an auxiliary processor 123 eg, a graphics processing unit, an image signal processor
  • the coprocessor 123 may be set to use lower power than the main processor 121, or to be specialized for a specified function.
  • the coprocessor 123 may be implemented separately from the main processor 121 or as a part thereof.
  • the coprocessor 123 may replace, for example, the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 may be active (eg, execute an application) ) With the main processor 121 while in the state, at least one component of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It can control at least some of the functions or states associated with.
  • the coprocessor 123 eg, image signal processor or communication processor
  • may be implemented as part of other functionally relevant components eg, camera module 180 or communication module 190). have.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176).
  • the data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto.
  • the memory 130 may include a volatile memory 132 or a nonvolatile memory 134.
  • the program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.
  • the input device 150 may receive commands or data to be used for components (eg, the processor 120) of the electronic device 101 from outside (eg, a user) of the electronic device 101.
  • the input device 150 may include, for example, a microphone, mouse, keyboard, or digital pen (eg, a stylus pen).
  • the audio output device 155 may output an audio signal to the outside of the electronic device 101.
  • the audio output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call.
  • the receiver may be implemented separately from, or as part of, the speaker.
  • the display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 160 may include a touch circuitry configured to sense a touch, or a sensor circuit (eg, a pressure sensor) configured to measure the strength of the force generated by the touch. .
  • the audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 acquires sound through the input device 150 or an external electronic device (eg, directly or wirelessly) connected to the sound output device 155 or the electronic device 101 Sound may be output through the electronic device 102 (eg, speakers or headphones).
  • the audio module 170 acquires sound through the input device 150 or an external electronic device (eg, directly or wirelessly) connected to the sound output device 155 or the electronic device 101 Sound may be output through the electronic device 102 (eg, speakers or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biological sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that can be used for the electronic device 101 to be directly or wirelessly connected to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or movement) or electrical stimuli that the user can perceive through tactile or motor sensations.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 388 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishing and performing communication through the established communication channel.
  • the communication module 190 operates independently of the processor 120 (eg, an application processor) and may include one or more communication processors supporting direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : Local area network (LAN) communication module, or power line communication module.
  • the corresponding communication module among these communication modules includes a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 199 (for example, a cellular network, the Internet, or It can communicate with external electronic devices through a computer network (eg, a telecommunication network, such as a LAN or WAN).
  • a computer network eg, a telecommunication network, such as a LAN or WAN.
  • the wireless communication module 192 uses a subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • IMSI International Mobile Subscriber Identifier
  • the antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive it from the outside.
  • the antenna module may include a single antenna including a conductor formed on a printed circuit board (eg, a PCB) or a radiator made of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas, for example, by the communication module 190. Can be.
  • the signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as part of the antenna module 197.
  • peripheral devices for example, a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the electronic devices 102 and 104 may be the same or a different type of device from the electronic device 101.
  • all or some of the operations performed on the electronic device 101 may be performed on one or more external devices of the external electronic devices 102, 104, or 108.
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead executes the function or service itself.
  • one or more external electronic devices may be requested to perform at least a portion of the function or the service.
  • the one or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and deliver the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result, as it is or additionally, and provide it as at least part of a response to the request.
  • cloud computing distributed computing, or client-server computing technology This can be used.
  • the electronic device may be various types of devices.
  • the electronic device may include, for example, a portable antenna module (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable antenna module eg, a smart phone
  • the electronic device according to the embodiment of the present document is not limited to the above-described devices.
  • any (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the term “functionally” or “communically”
  • any of the above components can be connected directly to the other component (eg, by wire), wirelessly, or through a third component.
  • module may include units implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic blocks, components, or circuits.
  • the module may be an integrally configured component or a minimum unit of the component or a part thereof performing one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (e.g., program 140) that includes.
  • a processor eg, processor 120
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the storage medium readable by the device may be provided in the form of a non-transitory storage medium.
  • a signal eg, electromagnetic waves
  • a method according to various embodiments disclosed in this document may be provided as being included in a computer program product.
  • Computer program products are commodities that can be traded between sellers and buyers.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play StoreTM) or two user devices ( It can be distributed (eg, downloaded or uploaded) directly or online between smartphones).
  • a portion of the computer program product may be stored at least temporarily on a storage medium readable by a device such as a memory of a manufacturer's server, an application store's server, or a relay server, or may be temporarily generated.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, or omitted Or, one or more other actions can be added.
  • FIG. 2 is a block diagram 200 of an electronic device 101 in a network environment including a plurality of cellular networks, according to various embodiments.
  • the electronic device 101 includes a first communication processor 212, a second communication processor 214, a first radio frequency integrated circuit (RFIC) 222, a second RFIC 224, and a third RFIC 226, fourth RFIC 228, first radio frequency front end (RFFE) 232, second RFFE 234, first antenna module 242, second antenna module 244, and antenna (248).
  • the electronic device 101 may further include a processor 120 and a memory 130.
  • the second network 199 may include a first cellular network 292 and a second cellular network 294. According to another embodiment, the electronic device 101 may further include at least one component among the components illustrated in FIG. 1, and the second network 199 may further include at least one other network.
  • the first communication processor 212, the second communication processor 214, the first RFIC 222, the second RFIC 224, the fourth RFIC 228, the first RFFE 232, And the second RFFE 234 may form at least a part of the wireless communication module 192.
  • the fourth RFIC 228 may be omitted or included as part of the third RFIC 226.
  • the first communication processor 212 may support establishment of a communication channel in a band to be used for wireless communication with the first cellular network 292, and legacy network communication through the established communication channel.
  • the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.
  • the second communication processor 214 establishes a communication channel corresponding to a designated band (for example, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294, and a 5G network through the established communication channel Can support communication.
  • the second cellular network 294 may be a 5G network defined in 3GPP.
  • the first communication processor 212 or the second communication processor 214 is assigned to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294.
  • the establishment of a corresponding communication channel and 5G network communication through the established communication channel can be supported.
  • the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package.
  • the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120, the coprocessor 123, or the communication module 190. have.
  • the first RFIC 222 when transmitting, transmits a baseband signal generated by the first communication processor 212 to the first cellular network 292 (eg, a legacy network) of about 700 MHz to It can be converted into a radio frequency (RF) signal of about 3 GHz.
  • RF radio frequency
  • an RF signal is obtained from the first cellular network 292 (eg, legacy network) through an antenna (eg, first antenna module 242), and an RFFE (eg, first RFFE 232) is received.
  • the first RFIC 222 may convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor 212.
  • the second RFIC 224 upon transmission, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 in the second cellular network 294 (eg, 5G network). It can be converted to an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, 5G network) via an antenna (eg, second antenna module 244), and an RFFE (eg, second RFFE 234) ). The second RFIC 224 may convert the pre-processed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding communication processor among the first communication processor 212 or the second communication processor 214.
  • a 5G Above6 RF signal may be obtained from a second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248) and pre-processed through a third RFFE 236.
  • the third RFIC 226 may convert the pre-processed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214.
  • the third RFFE 236 may be formed as part of the third RFIC 226.
  • the electronic device 101 may include the fourth RFIC 228 separately or at least as part of the third RFIC 226 according to an embodiment.
  • the third RFIC 226 may convert the IF signal into a 5G Above6 RF signal.
  • the 5G Above6 RF signal can be received from the second cellular network 294 (eg 5G network) via an antenna (eg antenna 248) and converted into an IF signal by the third RFIC 226. have.
  • the fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214.
  • the first RFIC 222 and the second RFIC 224 may be implemented as a single chip or at least part of a single package.
  • the first RFFE 232 and the second RFFE 234 may be implemented as a single chip or at least part of a single package.
  • at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.
  • the third RFIC 226 and the antenna 248 may be disposed on the same printed circuit board to form the third antenna module 246.
  • the wireless communication module 192 or the processor 120 may be disposed on a first printed circuit board (eg, main PCB).
  • the third RFIC 226 in some areas (eg, the lower surface) of the second printed circuit board (eg, the sub PCB) separate from the first printed circuit board, and the antenna ( 248) may be disposed to form a third antenna module 246.
  • a high frequency band eg, about 6 GHz to about 60 GHz
  • the electronic device 101 can improve the quality or speed of communication with the second cellular network 294 (eg, 5G network).
  • the antenna 248 may be formed of an antenna array including a plurality of antenna elements that can be used for beamforming.
  • the third RFIC 226 may include a plurality of phase shifters 238 corresponding to a plurality of antenna elements, for example, as part of the third RFFE 236.
  • each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. .
  • each of the plurality of phase converters 238 may convert the phase of the 5G Above6 RF signal received from the outside to the same or substantially the same phase through a corresponding antenna element. This enables transmission or reception through beamforming between the electronic device 101 and the outside.
  • the second cellular network 294 may be operated independently of the first cellular network 292 (eg, legacy network) (eg, Stand-Alone (SA)) or connected and operated ( Example: Non-Stand Alone (NSA)).
  • a 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)), and no core network (eg, next generation core (NGC)).
  • the electronic device 101 may access the access network of the 5G network, and then access the external network (eg, the Internet) under the control of the core network (eg, evolved packed core (EPC)) of the legacy network.
  • the core network eg, evolved packed core (EPC)
  • Protocol information (eg, LTE protocol information) for communication with a legacy network or protocol information (eg, New Radio (NR) protocol information) for communication with a 5G network is stored in the memory 230, and other components (eg, a processor) 120, the first communication processor 212, or the second communication processor 214.
  • LTE protocol information for communication with a legacy network
  • protocol information eg, New Radio (NR) protocol information
  • 5G network is stored in the memory 230, and other components (eg, a processor) 120, the first communication processor 212, or the second communication processor 214.
  • 3A is a perspective view of the front of a mobile electronic device 300 according to various embodiments.
  • 3B is a rear perspective view of a mobile electronic device 300 according to various embodiments.
  • a mobile electronic device 300 includes a first side (or front side) 310A, a second side ( Or it may include a housing 310 including a back (310B), and a side (310C) surrounding the space between the first surface (310A) and the second surface (310B).
  • the housing may refer to a structure forming some of the first surface 310A, the second surface 310B, and the side surfaces 310C.
  • the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) at least partially transparent.
  • the second surface 310B may be formed by an opaque back plate 311.
  • the back plate 311 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be.
  • the side surface 310C may be formed by a side bezel structure (or “side member”) 318 that is coupled to the front plate 302 and the back plate 311 and includes metal and/or polymer.
  • back plate 311 and side bezel structure 318 may be integrally formed and include the same material (eg, a metal material such as aluminum).
  • the front plate 302 includes two first regions 310D that are curved from the first surface 310A toward the rear plate 311 and extend seamlessly. It may be included at both ends of the long edge (302).
  • the back plate 311 has a long edge that extends from the second side 310B toward the front plate 302 and extends two second regions 310E seamlessly. It can be included at both ends.
  • the front plate 302 (or the back plate 311) may include only one of the first regions 310D (or the second regions 310E). In one embodiment, some of the first regions 310D or the second regions 310E may not be included.
  • the side bezel structure 318 when viewed from the side of the electronic device 300, is the first side 310D or the second region 310E that is not included in the side. It may have a second thickness thinner than the first thickness on the side surface including the first region 310D or the second region 310E.
  • the electronic device 300 includes a display 301, audio modules 303, 307, 314, sensor modules 304, 316, 319, camera modules 305, 312, 313, and key input. It may include at least one of the device 317, the light emitting element 306, and the connector hole (308, 309). In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317, or the light emitting element 306), or additionally include other components.
  • the display 301 can be exposed, for example, through a significant portion of the front plate 302. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first surface 310A and the first area 310D of the side surface 310C. In some embodiments, the edges of the display 301 may be formed to be substantially the same as the adjacent outer shape of the front plate 302. In one embodiment (not shown), in order to expand the area where the display 301 is exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 301, and the audio module 314 and the sensor aligned with the recess or the opening At least one of the module 304, the camera module 305, and the light emitting device 306 may be included.
  • an audio module 314, a sensor module 304, a camera module 305, a fingerprint sensor 316, and a light emitting element 306 are provided on the rear surface of the screen display area of the display 301. ).
  • the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and/or a digitizer detecting a magnetic field type stylus pen. Can be deployed. In some embodiments, at least a portion of the sensor modules 304 and 319, and/or at least a portion of the key input device 317, are provided in the first region 310D and/or the second region 310E. Can be deployed.
  • the audio modules 303, 307, and 314 may include a microphone hole 303 and speaker holes 307 and 314.
  • a microphone for acquiring external sound may be disposed therein, and in some embodiments, a plurality of microphones may be arranged to sense the direction of sound.
  • the speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314.
  • the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).
  • the sensor modules 304, 316, and 319 may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 300 or an external environmental state.
  • the sensor modules 304, 316, 319 may include, for example, a first sensor module 304 (eg, a proximity sensor) and/or a second sensor module disposed on the first side 310A of the housing 310 ( Not shown) (eg fingerprint sensor), and/or a third sensor module 319 (eg HRM sensor) and/or a fourth sensor module 316 disposed on the second side 310B of the housing 310 ) (Eg, fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 310A (eg, the display 301) of the housing 310 as well as on the second surface 310B.
  • the electronic device 300 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a bio sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 304.
  • a sensor module for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a bio sensor, a temperature sensor, It may further include at least one of a humidity sensor or an illuminance sensor 304.
  • the camera modules 305, 312, and 313 include a first camera device 305 disposed on the first surface 310A of the electronic device 300, and a second camera device 312 disposed on the second surface 310B. ), and/or flash 313.
  • the camera modules 305 and 312 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300.
  • the key input device 317 may be disposed on the side surface 310C of the housing 310.
  • the electronic device 300 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 not included may be soft keys on the display 301, etc. It can be implemented in other forms.
  • the key input device can include a sensor module 316 disposed on the second side 310B of the housing 310.
  • the light emitting element 306 may be disposed on the first surface 310A of the housing 310, for example.
  • the light emitting device 306 may provide, for example, state information of the electronic device 300 in a light form.
  • the light emitting device 306 may provide, for example, a light source interlocked with the operation of the camera module 305.
  • the light emitting element 306 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 308 and 309 may include a first connector hole 308 that can receive a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. And a second connector hole (for example, an earphone jack) 309 that can accommodate a connector for transmitting and receiving audio signals.
  • a connector eg, a USB connector
  • a second connector hole for example, an earphone jack
  • the electronic device 300 may include an antenna module (eg, the antenna module of FIG. 5) using at least a portion of the side member 318 as an antenna structure (eg, the antenna structures 520 and 530 of FIG. 5 ). (500)).
  • the antenna structure may be disposed in at least a portion of a lower region (eg, region A of FIG. 3A) of the side bezel 318 of the electronic device 300.
  • the antenna structure may include an upper region (eg, A1 region in FIG. 3A), a right region (eg, A2 region in FIG. 3A), or a left region (eg, in the side bezel 318 of the electronic device 300 0). 3A region of FIG. 3A).
  • 3C is an exploded perspective view of a mobile electronic device 320 according to various embodiments.
  • the mobile electronic device 320 (eg, the mobile electronic device 300 of FIG. 3A) includes a side bezel structure 321, a first support member 3211 (eg, a bracket), and a front plate ( 322), a display 323, a printed circuit board 324, a battery 325, a second support member 326 (eg, a rear case), an antenna 327, and a back plate 328 may be included. .
  • the electronic device 320 may omit at least one of the components (eg, the first support member 3211 or the second support member 326) or additionally include other components.
  • At least one of the components of the electronic device 320 may be the same as or similar to at least one of the components of the electronic device 300 of FIG. 3A or 3B, and a duplicate description will be omitted below.
  • the first support member 3211 may be disposed inside the electronic device 320 to be connected to the side bezel structure 321 or may be integrally formed with the side bezel structure 321.
  • the first support member 3211 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 323 may be coupled to one surface of the first support member 3211, and the printed circuit board 324 may be coupled to the other surface.
  • the printed circuit board 324 may be equipped with a processor, memory, and/or interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 320 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 325 is a device for supplying power to at least one component of the electronic device 320, and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 325 may be disposed, for example, on a substantially coplanar surface with the printed circuit board 324. The battery 325 may be integrally disposed inside the electronic device 320 or may be detachably disposed with the electronic device 320.
  • the antenna 327 may be disposed between the back plate 328 and the battery 325.
  • the antenna 327 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 327 may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • the antenna structure may be formed by a part of the side bezel structure 321 and/or the first support member 3211 or a combination thereof.
  • FIG. 4A shows an embodiment of the structure of the third antenna module 246 described with reference to FIG. 2, for example.
  • 4A(a) is a perspective view of the third antenna module 246 viewed from one side
  • FIG. 4A(b) is a perspective view of the third antenna module 246 viewed from the other side
  • 4A (c) is a cross-sectional view of X-X' of the third antenna module 246.
  • the third antenna module 246 is a printed circuit board 410, antenna array 430, radio frequency integrate circuit (RFIC) 452, power management integrate circuit (PMIC) (454).
  • the third antenna module 246 may further include a shielding member 490.
  • at least one of the aforementioned components may be omitted, or at least two of the components may be integrally formed.
  • the printed circuit board 410 may include a plurality of conductive layers and a plurality of non-conductive layers stacked alternately with the conductive layers.
  • the printed circuit board 410 may provide electrical connection between the printed circuit board 410 and/or various electronic components disposed outside using wirings and conductive vias formed in the conductive layer.
  • the antenna array 430 may include a plurality of antenna elements 432, 434, 436, or 438 arranged to form a directional beam.
  • the antenna elements 432, 434, 436, or 438 may be formed on the first surface of the printed circuit board 410, as shown.
  • the antenna array 430 may be formed inside the printed circuit board 410.
  • the antenna array 430 may include a plurality of antenna arrays of the same or different shapes or types (eg, dipole antenna arrays, and/or patch antenna arrays).
  • the RFIC 452 may be placed in another area of the printed circuit board 410 (eg, the second side opposite the first side) spaced apart from the antenna array. have.
  • the RFIC is configured to process signals of a selected frequency band, which are transmitted/received through the antenna array 430.
  • the RFIC 452 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal of a designated band during transmission. When received, the RFIC 452 may convert the RF signal received through the antenna array 430 into a baseband signal and transmit it to the communication processor.
  • the RFIC 452 selects an IF signal (eg, about 9 GHz to about 11 GHz) obtained from an intermediate frequency integrate circuit (IFIC) (eg, 228 of FIG. 2) during transmission. You can up-convert to the RF signal.
  • IFIC intermediate frequency integrate circuit
  • the RFIC 452 may down-convert the RF signal obtained through the antenna array 430, convert it into an IF signal, and transmit the converted RF signal to the IFIC.
  • the PMIC 454 may be disposed in another part of the printed circuit board 410 (eg, the second surface) spaced apart from the antenna array 430.
  • the PMIC may be supplied with a voltage from a main PCB (not shown) to provide power required for various components (eg, RFIC 452) on the antenna module.
  • the shielding member 490 may be disposed on a part (eg, the second surface) of the printed circuit board 410 to electromagnetically shield at least one of the RFIC 452 or the PMIC 454.
  • the shielding member 490 may include a shield can.
  • the third antenna module 246 may be electrically connected to another printed circuit board (eg, a main circuit board) through a module interface.
  • the module interface may include a connecting member, for example, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB).
  • the RFIC 452 and/or PMIC 454 of the antenna module may be electrically connected to the printed circuit board through the connecting member.
  • FIG. 4B shows a cross-section of the third antenna module 246 shown in FIG. 4A (a) with respect to line Y-Y'.
  • the printed circuit board 410 of the illustrated embodiment may include an antenna layer 411 and a network layer 413.
  • the antenna layer 411 includes at least one dielectric layer 437-1, and an antenna element 436 and/or a power supply unit 425 formed on or inside the outer surface of the dielectric layer. It can contain.
  • the feeding part 425 may include a feeding point 427 and/or a feeding line 429.
  • the network layer 413 includes at least one dielectric layer 437-2, and at least one ground layer 433 formed on or inside the outer surface of the dielectric layer, at least one conductive via 435, and a transmission line. 423, and/or signal line 429.
  • the RFIC 452 of FIG. 4A (c) may include, for example, first and second solder bumps 440. -1, 440-2) may be electrically connected to the network layer 413.
  • various connection structures eg, solder or BGA
  • the RFIC 452 may be electrically connected to the antenna element 436 through a first connection part 440-1, a transmission line 423, and a power supply part 425.
  • the RFIC 452 may also be electrically connected to the ground layer 433 through the second connection part 440-2 and the conductive via 435.
  • the RFIC 452 can also be electrically connected to the module interface mentioned above, via the signal line 429.
  • FIG. 5 is a diagram illustrating a configuration of an antenna module 500 according to various embodiments of the present invention.
  • the antenna module 500 of FIG. 5 may be at least partially similar to the third antenna module 246 of FIG. 2, or further include other embodiments of the antenna module.
  • an electronic device may include an antenna module 500.
  • the antenna module 500 includes antenna structures 520 and 530 disposed in at least a portion of the conductive side member 510 (eg, the side bezel structure 318 of FIG. 3A) and the electronic device. It may include a printed circuit board 540 disposed to face the antenna structures 520 and 530 in the interior space and a wireless communication circuit 590 disposed on the printed circuit board 540.
  • the wireless communication circuit is disposed in the internal space of the electronic device spaced apart from the printed circuit board 540 and may be electrically connected through an electrical connection member (eg, FPCB).
  • the wireless communication circuit 590 directs signals having frequencies in the range of about 3 GHz to 100 GHz through the antenna structures 520 and 530 that are electrically connected using the printed circuit board 540 in a designated direction.
  • the side member 510 may be configured to transmit and/or receive in a direction (eg, -y axis direction in FIG. 5).
  • the antenna structures 520 and 530 may be disposed in at least some of the side members of the electronic device (eg, the side bezel structure 318 of FIG. 3A) (eg, the area A of FIG. 3A ).
  • the side member 510 includes a first conductive portion 511, a second conductive portion 512 spaced apart from the first conductive portion 511, and a first conductive portion 511 and a second conductive portion And antenna structures 520 and 530 disposed between the portions 512.
  • the first conductive portion 511 and the second conductive portion 512 may be physically connected through the antenna structures 520 and 530.
  • the antenna structures 520 and 530 may be formed together when the side member 510 is formed. According to one embodiment, the antenna structures 520 and 530 may be formed of a conductive material that is substantially the same as the conductive side member 510. In another embodiment, the antenna structures 520 and 530 may be formed of a conductive material of a different material from the conductive side member 510.
  • the antenna structures 520 and 530 may include a first antenna structure 520 and/or a first antenna structure 511 and/or a second conductive portion 512 of the side member 510. It may include a second antenna structure 530 spaced apart from the one-antenna structure 520.
  • the first antenna structure 520 or the second antenna structure 530 when the first antenna structure 520 or the second antenna structure 530 is viewed from the top of the second plate (eg, the back plate 311 of FIG. 3B), the first antenna structure 520 is disposed at a position overlapping each other. Can be.
  • the side member 510 is aligned in a vertical direction (eg, the z-axis direction of FIG. 5 ). Can be placed.
  • the first antenna structure 520 may include a plurality of conductive patches 521, 522, 523 and 524 that are arranged to be spaced apart at regular intervals.
  • the first antenna structure 520 is the first conductive patch 521, the second conductive patch 522, the third conductive patch 523, and/or the fourth conductive patch arranged side by side at regular intervals 524.
  • the conductive patches 521, 522, 523, 524 are between each conductive patch 521, 522, 523, 524 between the first conductive portion 511 and the second conductive portion 512. They may be physically and electrically connected to each other through a plurality of conductive chains (525, 526, 527, 528, 529).
  • the plurality of conductive connections 525, 526, 527, 528, and 529 includes a first conductive connection portion 525 connecting the first conductive portion 511 and the first conductive patch 521, A second conductive connecting portion 526 connecting the first conductive patch 521 and the second conductive patch 522, and a third conductive connecting portion 527 connecting the second conductive patch 522 and the third conductive patch 523 , A fifth conductive connecting portion 528 connecting the third conductive patch 523 and the fourth conductive patch 524 and/or a fifth conductive connecting the fourth conductive patch 524 and the second conductive portion 512 It may include a connecting portion (529).
  • the second antenna structure 530 may include a plurality of conductive patches 531, 532, 533, and 534 arranged to be spaced apart at regular intervals.
  • the second antenna structure 530 includes a fifth conductive patch 531, a sixth conductive patch 532, a seventh conductive patch 533, and/or an eighth conductive patch arranged side by side at regular intervals 534.
  • the conductive patches 531, 532, 533, 534 are between respective conductive patches 531, 532, 533, 534 between the first conductive portion 511 and the second conductive portion 512.
  • a plurality of conductive connections is a first conductive portion 511 and a fifth conductive connection 535 connecting the fifth conductive patch 531, the first 7th conductive connecting portion 536 connecting the 5th conductive patch 531 and the 6th conductive patch 532, 8th conductive connecting portion 537 connecting the 6th conductive patch 532 and the 7th conductive patch 533 , A ninth conductive connecting portion 538 connecting the seventh conductive patch 533 and the eighth conductive patch 534 and/or a tenth conductive connecting the eighth conductive patch 534 and the second conductive portion 512 It may include a connecting portion (539).
  • the antenna structures 520 and 530 may include conductive patches 521, 522, 523, 524, 531, 532, 533, and 534 in a 2 ⁇ 4 array structure.
  • the antenna structure may include various arrangements and various numbers of conductive patches.
  • the side member 510 is disposed in a space excluding the first antenna structure 520 and the second antenna structure 530 between the first conductive part 511 and the second conductive part 512. It may include a non-conductive material (513). According to one embodiment, the non-conductive material 513 may include a polymer. According to one embodiment, the conductive portions 511, 512, the antenna structures 520, 530 and the non-conductive material 513 may be formed into at least a portion of the side member 510 through insert injection or double injection. have.
  • the side member 510 is formed of a conductive member formed of a conductive member (511, 512) and the antenna structure (520, 530) and a non-conductive material 513 together, the side member through an opaque coating As it is applied to the outer surface of 510, the portion of the antenna structure placed outside the electronic device may be processed so as not to be visually identified.
  • the antenna structures 520 and 530 may include a plurality of conductive patches 521 by a plurality of conductive connections 525, 526, 527, 528, 529, 535, 536, 537, 538, 539. Since 522, 523, 524, 531, 532, 533, and 534 are disposed to be physically connected to each other between the first conductive portion 511 and the second conductive portion 512, the antenna structures 520 and 530 are included. It can help reinforce the rigidity of the side member 510.
  • a plurality of conductive connections (525, 526, 527, 528, 529, 535, 536, 537, 538, 539) a plurality of conductive patches (521, 522, 523, 524, 531, 532 , 533, 534), the mutual interference between unit conductive patches may be reduced.
  • the antenna module 500 may be formed through the shape of the conductive patches 521, 522, 523, 524, 531, 532, 533, 534 of the antenna structures 520, 530 or the interval between unit conductive patches. Frequency characteristics can be adjusted.
  • the conductive patches 521, 522, 523, 524, 531, 532, 533, 534 are conductive connections 525, 526, 527, 528, 529, 535, 536, 537 having an electrical length of ⁇ /2 , 538, 539).
  • the printed circuit board 540 includes a first surface 5401 disposed to face the antenna structures 520 and 530 and a second surface 5402 facing the opposite direction to the first surface 5401. It can contain.
  • the wireless communication circuit 590 may be disposed on the second surface 5402.
  • the first surface 5401 of the printed circuit board 540 may be disposed to make surface contact with the antenna structures 520 and 530.
  • the printed circuit board 540 may be disposed in a manner in which at least one other area, other than the first surface 5401, in the interior of the electronic device is in close contact with or in contact with the antenna structures 520 and 530. .
  • the wireless communication circuit 590 may include a plurality of feed ports.
  • each of the plurality of feed ports is a plurality of conductive patches (521, 522, 523, 524, 531, 532, 533, 534) of the antenna structure (520, 530) through the printed circuit board 540 It can be electrically connected to correspond to each.
  • the printed circuit board 540 may include a plurality of conductive paths that are electrically connected to each of the plurality of feed ports.
  • each of the plurality of conductive paths may be electrically connected to each of the plurality of conductive patches 521, 522, 523, 524, 531, 532, 533, and 534 capacitively coupled. .
  • a plurality of conductive patches 521, 522, 523, 524, 531, 532, 533, when the plurality of conductive paths are disposed to be exposed on the first surface 5401 of the printed circuit board 540, 534) may be electrically connected by physical contact with each.
  • At least one processor of the electronic device includes a first antenna structure 520 and/or a second antenna structure.
  • the wireless communication circuit 590 may be controlled to form a beam pattern in at least one designated direction (eg, 2D beam steering).
  • the electronic device eg, the electronic device 300 of FIG. 3A
  • the antenna module 500 may include a phase shifter disposed on each RF chain connected from each feed port of the wireless communication circuit 590 to a corresponding conductive patch.
  • At least one processor of the electronic device controls the phase shifter to control each conductive patch from the wireless communication circuit 590 ( 521, 522, 523, 524, 531, 532, 533, 534) by feeding the specific phase difference is provided, it is also possible to perform a beam scanning operation in the xy-plane.
  • 6 is a cross-sectional view illustrating a main portion of a state in which an antenna module 500 is coupled according to various embodiments of the present invention. 6 is a cross-sectional view of the antenna module 500 of FIG. 5 when viewed in the z-axis direction.
  • the structure 530 may have substantially the same arrangement configuration.
  • the antenna module 500 includes a first antenna structure 520 disposed in at least a portion of the conductive side member 510 and a printed circuit board 540 disposed close to the first antenna structure 520. And a wireless communication circuit 590 disposed on the printed circuit board 540.
  • the printed circuit board 540 faces the first surface 5401 and the first surface 5401 facing the first antenna structure 520, and the wireless communication circuit 590 is disposed It may include a second surface (5402).
  • the printed circuit board 540 may include a multilayer insulating layer.
  • the printed circuit board 540 is parallel to the first side 5401 of the multilayer insulating layer at a position facing each of the conductive patches 521, 522, 523, 524 at regular intervals. It may include a plurality of conductive paths (541, 542, 543, 544) disposed.
  • the printed circuit board 540 may include a ground plane 545 for ground disposed at a position close to the second surface 5402 of the multilayer insulating layer.
  • each of the plurality of conductive paths 541, 542, 543, and 544 has a plurality of conductive patches 521, 522, 523 in a position close to the first surface 5401 of the printed circuit board 540 , 524) may be arranged to have a distance (d) that can be coupled (capacitively coupled) with each.
  • the plurality of conductive paths 541, 542, 543, and 544 when the plurality of conductive paths 541, 542, 543, and 544 are arranged to be exposed on the first surface 5401 of the printed circuit board 540, the plurality of conductive paths 541, 542, Each of 543 and 544 may be disposed to be in physical contact with each of the conductive patches 521, 522, 523, and 524.
  • the plurality of conductive paths 541, 542, 543, and 544 penetrate at least a portion of the insulating layer and are electrically connected to the wireless communication circuit 590 through the first feeding line 5212.
  • the first conductive path 541 is disposed to be electrically connected through the first conductive connection member 5161, penetrates at least a portion of the insulating layer, and is electrically connected to the wireless communication circuit 590 through the second feeding line 5542.
  • the second conductive path 542 is disposed to be electrically connected through the second conductive connection member 5221 connected to, penetrates at least a portion of the insulating layer, and the wireless communication circuit 590 through the third feeding line 5322 ) Through a third conductive path 543 and/or at least a portion of the insulating layer disposed to be electrically connected through a third conductive connecting member 5331 electrically connected to the fourth feeding line 5442 And a fourth conductive path 544 disposed to be electrically connected through a fourth conductive connection member 5451 electrically connected to the wireless communication circuit 590.
  • the first conductive path 541, the second conductive path 542, the third conductive path 543 and/or the fourth conductive path 544 are conductive patches 521, 522, 523, It may include a conductive pattern having a predetermined shape to provide an effective coupling area according to the shape and the separation distance of 524).
  • the first conductive connecting member 5161, the second conductive connecting member 5221, the third conductive connecting member 5351 and/or the fourth conductive connecting member 5451 are printed circuit boards 590 It may include a conductive via passing through.
  • a plurality of conductive patches of the second antenna structure eg, the second antenna structure 530 of FIG. 5
  • the substrate 590 may have substantially the same arrangement as described above.
  • the processor 580 of the electronic device may include a first antenna structure 520 and/or an antenna module 500 for beam steering in the yz-plane
  • the operation of the second antenna structure may be controlled.
  • the processor 580 may be configured to operate only the first antenna structure 520 through the wireless communication circuit 590.
  • the processor 580 may be configured to operate only the second antenna structure (eg, the second antenna structure 530 of FIG. 5) through the wireless communication circuit 590.
  • the processor 580 is configured to operate both the first antenna structure 520 and the second antenna structure (eg, the second antenna structure 530 of FIG. 5) through the wireless communication circuit 590. Can.
  • FIG. 7 is a graph showing a reflection coefficient of the antenna module 500 of FIG. 5 according to various embodiments of the present invention.
  • an antenna module (for example, the antenna module 500 of FIG. 5) is configured through a first antenna structure (eg, the first antenna structure of FIG. 5) through a processor (for example, the processor 580 of FIG. 6 ). 520)) only (e.g., the graph of patch array_1 shown), or the second antenna structure (e.g., the second antenna structure 530 of FIG. 5) only operates (e.g., the graph of patch array_2 shown), or It can be seen that even if both the 1-antenna structure and the 2nd-antenna structure are controlled to operate (eg, a graph of mutual coupling shown), they all operate smoothly in the main operating frequency band shown (eg, about 28 GHz band).
  • 8A to 10B are radiation pattern diagrams illustrating beam steering states in an yz-plane according to operation of the antenna module 500 of FIG. 5 according to various embodiments of the present invention.
  • the antenna module 500 may be capable of beam steering in the yz-plane through control of the first antenna structure 520 and the second antenna structure 530 arranged side by side in the z-axis direction.
  • only the first antenna structure 520 of the antenna module 500 operates through a processor (for example, the processor 580 of FIG. 6) of an electronic device (for example, the electronic device 300 of FIG. 3A ).
  • a processor for example, the processor 580 of FIG. 6
  • an electronic device for example, the electronic device 300 of FIG. 3A .
  • the beam pattern is tilted in the upward direction (eg, the direction in which the front plate 302 of FIG. 3A faces) in the yz-plane.
  • the second antenna structure 530 of the antenna module 500 is operated through the processor (eg, the processor 580 of FIG. 6) of the electronic device (eg, the electronic device 300 of FIG. 3A ).
  • the processor eg, the processor 580 of FIG. 6
  • the electronic device eg, the electronic device 300 of FIG. 3A .
  • the beam pattern is tilted in the downward direction in the yz-plane (for example, the direction in which the back plate 311 of FIG. 3B faces).
  • 10A and 10B show the first antenna structure 520 of the antenna module 500 through a processor (eg, the processor 580 of FIG. 6) of an electronic device (eg, the electronic device 300 of FIG. 3A).
  • FIG. 11 is a graph illustrating a beam scanning state in an xy-plane according to a phase change of the antenna module 500 of FIG. 5 according to various embodiments of the present invention.
  • FIG. 11 shows that the antenna module 500 of FIG. 5 may change beam patterns in various scanning angles in the xy-plane according to various phase changes in an operating frequency band of about 28 GHz.
  • FIG. 12 is a partially enlarged perspective view of an antenna structure 1210 according to various embodiments of the present invention.
  • the side member 1210 of FIG. 12 may be at least partially similar to the side member 510 of FIG. 5, or may further include other embodiments of the side member.
  • the side member 1210 (eg, the side member 510 of FIG. 5) includes at least one conductive member 1211 (eg, the conductive members 511 and 512 of FIG. 5) and a conductive member It includes a plurality of conductive patches 1221, 1222 spaced apart at regular intervals from 1211 (e.g., conductive patches 521, 522, 523, 524, 531, 532, 533, 534 of FIG. 5).
  • the conductive connections 1223 of the conductive patches 1221, 1222 eg, the conductive connections 525, 526, 527, 528, 529, 535, 536, 537, 538, 539 of FIG.
  • an antenna structure 1220 including a pair of conductive patches 1221 and 1222 disposed adjacent to each other and physically connected by a conductive connection portion 1223 is illustrated and described.
  • the remaining conductive patches and the conductive connecting portions connecting them may also have substantially the same configuration.
  • the first conductive patch 1221 of the antenna structure 1220 (eg, the fourth conductive patch 524 of FIG. 5) and the second conductive patch 1222 adjacent thereto (eg, of FIG. 5)
  • the third conductive patch 523 may be physically connected through the conductive connection portion 1223 (eg, the fourth conductive connection portion 528 of FIG. 5 ).
  • the first conductive patch 1221 and the second conductive patch 1222 may be formed in a rectangular shape in consideration of radiation characteristics.
  • the first conductive patch 1221 and the second conductive patch 1222 may be formed in various shapes such as circular or polygonal shapes.
  • the antenna module (eg, the antenna module 500 of FIG.
  • the conductive connection portion 1223 has a thickness (t1) and a length (l) of the conductive connection portion 1223 (eg, a distance between two conductive patches 1221 and 1222) ) Or the width (w) may be determined by at least one of the radiation characteristics.
  • the thickness t1 of the conductive connection portion 1223 may be formed to be smaller than the thickness t2 of the conductive patches 1221 and 1222.
  • the length 1 of the conductive connection portion 1223 may be formed to have an electrical length of ⁇ /2.
  • the width w is not the same as or equal to the conductive patches 1221 and 1222. It may be formed.
  • 13A and 13B are diagrams comparing the electric field distribution of the antenna structure 1220 according to the thickness of the conductive connection portion 1223 according to various embodiments of the present invention, wherein the thickness t1 of the conductive connection portion 1223 is conductive
  • FIGS. 14A to 14C are diagrams illustrating the configuration of the antenna structures 1410, 1420, and 1430 according to various embodiments of the present invention.
  • the side member 1410 includes a first conductive member 1411, a second conductive member 1412 and a first conductive member 1411 and a second conductive member spaced apart from the first conductive member 1411 It may include an antenna structure (1414, 1415) disposed between the member (1412).
  • the antenna structures 1414 and 1415 include a first antenna structure 1414 and a first antenna structure 1414 disposed between the first conductive member 1411 and the second conductive member 1412, and /Or a second antenna structure 1415, which has a certain spacing 1413 and is arranged side by side.
  • the first antenna structure 1414 is a first conductive patch 1414a, a second conductive patch 1414b, a third conductive patch 1414c, and/or a fourth conductive patch spaced apart at regular intervals (1414d).
  • each conductive patch may be physically connected to each other through a plurality of conductive connections.
  • the plurality of conductive connecting portions connect the first conductive portion 1414e connecting the first conductive portion 1411 and the first conductive patch 1414a, the first conductive patch 1414a and the second conductive patch 1414b
  • the second conductive connecting portion 1414f, the third conductive connecting portion 1414g connecting the second conductive patch 1414b and the third conductive patch 1414c, the third conductive patch 1414c and the fourth conductive patch 1414d It may include a fourth conductive connecting portion 1414h and/or a fifth conductive connecting portion 1414i connecting the fourth conductive patch 1414d and the second conductive portion 1412.
  • the second antenna structure 1415 is a fifth conductive patch 1415a, a sixth conductive patch 1415b, a seventh conductive patch 1415c, and/or an eighth conductive patch spaced apart at regular intervals (1415d).
  • each conductive patch may be physically connected to each other through a plurality of conductive connections.
  • the plurality of conductive connecting portions connect the first conductive portion 1411 and the fifth conductive patch 1415a to connect the sixth conductive connection portion 1415e, the fifth conductive patch 1415a, and the sixth conductive patch 1415b 7th conductive connecting portion 1415f, 6th conductive patch 1415b and 7th conductive patch 1415c, 8th conductive connecting portion 1415g, 7th conductive patch 1415c and 8th conductive patch 1415d It may include a ninth conductive connecting portion 1415h and/or an eighth conductive patch 1415d and a tenth conductive connecting portion 1415i connecting the second conductive portion 1412.
  • a plurality of conductive connections 1414e, 1414f, 1414g, 1414h, 1414i, 1415e, 1415f, 1415g, 1415h, 1415i, conductive patches 1414a, 1414b, 1414c, 1414d, 1415a, 1415b, 1415c , 1415d) (e.g., thickness t1 in FIG. 12), but the same as the conductive patches 1414a, 1414b, 1414c, 1414d, 1415a, 1415b, 1415c, 1415d for rigid reinforcement of the side member 1410 It may be formed to have a width (for example, width w in FIG. 12).
  • the antenna structure 1420 includes the conductive patches 1414a, 1414b, 1414c, 1414d, 1415a, 1415b, 1415c, 1415d of FIG. 14A, and conductive connections 1414e, 1414f, 1414g, 1414h, 1414i, 1415e, 1415f, 1415g, 1415h, 1415i), and may have the same configuration, disposed in a space 1413 between the first antenna structure 1414 and the second antenna structure 1415, and the first conductive member 1411 ) And a first conductive rigid reinforcement member 1421 connecting the second conductive member 1412.
  • the first conductive rigid reinforcement member 1421 may be integrally formed when the side member 1410 is formed.
  • the antenna structure may have the same configuration as the conductive patches 1414a, 1414b, 1414c, 1414d, 1415a, 1415b, 1415c, 1415d of FIG. 14A, and conductive connection portions 1414e, 1414f,
  • the width of 1414g, 1414h, 1414i, 1415e, 1415f, 1415g, 1415h, 1415i) may be substantially smaller than the width of the conductive patches, thereby substantially having the same configuration as the antenna structures 520 and 530 of FIG. 5.
  • the side member 1410 may include a second conductive rigid reinforcement member 1431 disposed to cover the antenna structures 1414 and 1415.
  • the second conductive rigid reinforcement member 1431 may be attached to coincide with the outer surface of the side member, or may be integrally formed with the side member 1410.
  • FIG. 15 is a diagram illustrating a configuration of an antenna module 1500 according to various embodiments of the present invention.
  • the antenna module 1500 of FIG. 15 may be at least partially similar to the antenna module 246 of FIG. 2, or further include other embodiments of the antenna module.
  • an electronic device may include an antenna module 1500.
  • the antenna module 1500 includes an antenna structure 1520 disposed in at least a portion of the conductive side member 1510 (eg, the side bezel structure 318 of FIG. 3A ), and the internal space of the electronic device. It may include a printed circuit board 1540 disposed to face the antenna structure 1520 and a wireless communication circuit 1590 disposed on the printed circuit board 1540.
  • the wireless communication circuit 1590 directs a signal having a frequency in a range of about 3 GHz to 100 GHz through an antenna structure 1520 that is electrically connected using a printed circuit board 1540 (eg : Generally, the side member 1510 may be configured to transmit and/or receive in a direction (eg, -y axis direction in FIG. 15).
  • the arrangement relationship for the electrical connection of the antenna structure 1520 and the printed circuit board 1540 is the arrangement of the antenna structures 520 and 530 and the printed circuit board 540 of FIGS. 5 and 6 described above. Since the configuration is substantially the same, the detailed description has been omitted.
  • the antenna structure 1520 may be disposed in at least a portion of a side member of the electronic device (eg, the side bezel structure 318 of FIG. 3A) (eg, region A of FIG. 3A ). According to an embodiment, the antenna structure 1520 may be disposed through an opening 1501 formed in some regions of the side member 1510. According to one embodiment, the opening 1501 may be formed in the form of a closed loop in the side member 1510, and the antenna structure 1520 is disposed at the opening 1501, and at both ends opposite to each other in the opening 1501. Can be supported respectively. In another embodiment, antenna structure 1520 may be disposed in an opening that is at least partially open. In another embodiment, the antenna structure 1520 may be substantially the same as the configuration of any one of the pair of antenna structures 520 and 530 of FIG. 5.
  • the antenna structure 1520 may include a plurality of conductive patches 1521, 1522, 1523, and 1524 which are arranged to be spaced apart at regular intervals from the opening 1501 of the side member 1510.
  • the antenna structure 1520 is the first conductive patch 1521, the second conductive patch 1522, the third conductive patch 1523 and/or the first conductive patch 1521 arranged side by side at regular intervals in the opening 1501 It may include a four-conductive patch (1524).
  • the conductive patches 1521, 1522, 1523, 1524 are a plurality for interconnecting each conductive patch 1521, 1522, 1523, 1524 in the opening 1501 and fixing it to the opening 1501 It may include a conductive connection (1525, 1526, 1527, 1528, 1529).
  • a plurality of conductive connections is a first conductive connecting portion (1525), the first conductive connecting the first conductive patch 1521 and one end of the opening 1501 A second conductive connecting portion 1526 connecting the conductive patch 1521 and the second conductive patch 1522, a third conductive connecting portion 1527 connecting the second conductive patch 1522 and the third conductive patch 1523, A fourth conductive connecting portion 1528 connecting the third conductive patch 1523 and the fourth conductive patch 1524 and/or a fifth conductive connecting portion connecting the other end of the fourth conductive patch 1524 and the opening 1501 ( 1529).
  • the side member 1510 is a non-conductive material 1511 for filling a space except for conductive patches 1521, 1522, 1523, 1524 and conductive connections 1525, 1526, 1527, 1528, 1529 It may include.
  • the non-conductive material 1511 may include a polymer.
  • the antenna structure 1520 includes conductive patches 1521, 1522, 1523, and 1524 in a 1 ⁇ 4 arrangement, and a closed loop-shaped opening 1501 formed in the side member 1510 Since the antenna structure 1520 is formed on the side member 1510 because it is disposed in the inside, it can help reinforce the rigidity of the electronic device (eg, the electronic device 300 of FIG. 3A ).
  • 16 is a diagram illustrating an arrangement relationship of an antenna module AR in the electronic device 600 according to various embodiments of the present invention.
  • the electronic device of FIG. 16 may be at least partially similar to the electronic device 200 of FIG. 2 or the electronic device 300 of FIG. 3A, or may include other embodiments of the electronic device.
  • the conductive side member 610 has a first frequency band (eg, about 3 GHz to 100 GHz) through an antenna structure (eg, antenna structures 520 and 530 of FIG. 5) as described above. Range of frequency band), and may be configured to operate in a second frequency band different from the first frequency band (for example, about 600 MHz to 1000 MHz band) through at least a portion of the conductive side member 610.
  • a first frequency band eg, about 3 GHz to 100 GHz
  • Range of frequency band may be configured to operate in a second frequency band different from the first frequency band (for example, about 600 MHz to 1000 MHz band) through at least a portion of the conductive side member 610.
  • the electronic device 600 may include a side member 610.
  • the side member 610 is a unit segmented by the first non-conductive portion 6104 and/or the second non-conductive portion 6105 spaced apart from the first non-conductive portion 6104 at regular intervals.
  • a conductive portion 612 may be included.
  • the first non-conductive portion 6104 and the second non-conductive portion 6105 may be formed of an insulating material such as a polymer.
  • at least a portion of the conductive portion 612 of the side member 610 is an antenna structure described above (eg, the antenna structures 520 and 530 of FIG. 5 or the antenna structures 1520 of FIG. 15). Can be utilized.
  • the antenna module AR is a printed circuit board (for example, FIG. 5) disposed close to the antenna structure (eg, the antenna structures 520 and 530 of FIG. 5) in the internal space 6001 of the electronic device 600.
  • 5 may include a printed circuit board 540 and a first wireless communication circuit (eg, the wireless communication circuit 590 of FIG. 5) disposed on the printed circuit board.
  • the first wireless communication circuit (for example, the wireless communication circuit 590 of FIG. 5) may be provided in a range of about 3 GHz to 100 GHz through an antenna structure (eg, the antenna structures 520 and 530 of FIG. 5). It may be configured to transmit and/or receive signals in one frequency band.
  • the side member 610 includes a first connection piece 6121 and a second position L2 formed at the first position L1 of the conductive part 612 from the first non-conductive part 6104. It may include a second connecting piece (6122) formed on.
  • the first position L1 may be disposed closer to the second non-conductive portion 6105 than the second position L2.
  • the first position L1 and the second position L2 may be arranged interchangeably.
  • the antenna module AR may be disposed between the first position L1 and the second position L2.
  • the first position L1 and/or the second position L2 may be arranged in an area in which the antenna module AR is disposed.
  • first connecting piece 6121 and the second connecting piece 6122 may be integrally formed with the conductive portion 612. According to one embodiment, the first connecting piece 6121 and the second connecting piece 6122 are arranged on at least a portion of the inner space 6001 of the electronic device 600 (eg, main printing) Circuit board).
  • the main substrate 640 may include a first connection portion 641 (eg, a feeding pad) electrically connected to the first connection piece 6121.
  • the main board 340 is a first electrical path 6401 connected from the first connection unit 641 to the second wireless communication circuit 642 (eg, a power supply unit) disposed on the main board 640. ) (For example, a wiring line).
  • the second wireless communication circuit 642 eg, the wireless communication module 192 of FIG. 1 has a first position (1) of a conductive portion 612 electrically connected through the first electrical path 6401. In L1), a signal in the second frequency band can be transmitted.
  • the second wireless communication circuit 642 may be connected to the RF chains of the first communication processor 212, the first RFIC 222, and the first RFFE 232 in the wireless communication module 192 of FIG. 2.
  • at least one matching circuit 644 may be disposed in the first electrical path 6401.
  • the first electrical path 6401 has a configuration in which the main substrate 640 is in direct electrical contact with the conductive side member 610 forming the exterior of the electronic device 600, thereby preventing electric shock.
  • at least one electric shock prevention circuit 643 for discharging static electricity.
  • the matching circuit 644 may include a variable element (eg, a tunable IC) that shifts an operating frequency band by selectively switching at least one of a plurality of passive elements.
  • the main substrate 640 may include a second connection part 645 (eg, a ground pad) electrically connected to the second connection piece 6122.
  • the main substrate 640 includes a second electrical path 6402 (eg, a wiring line) connected from the second connection part 645 to the ground (GND) 646 of the main substrate 640. can do.
  • the main substrate 640 may include at least one variable element 647 (tunable IC) disposed in the second electrical path 6402.
  • the variable element 647 may include a plurality of capacitors having different capacitance values and a switching element to selectively switch them. For example, the operating frequency band of the second frequency band may be shifted according to the variable capacitance value of the variable element 647.
  • the electronic device 600 may include at least one processor 680 (eg, the processor 580 of FIG. 6 ).
  • the processor 680 may control a variable element (eg, the variable element 647 of FIG. 16) based on the external environment of the electronic device 600.
  • the processor 680 may control the beam steering operation in the yz-plane and/or the beam scanning operation in the xy-plane, as described above, through the antenna module AR.
  • the second electrical path 6402 is a ground flag of a printed circuit board (eg, the printed circuit board 540 of FIG. 6) disposed close to the antenna structure (eg, the antenna structure 520 of FIG. 6). Phosphorus (e.g., ground plane 545 in FIG. 6), thereby being electrically connected, the second by coupling between the ground plane (e.g., ground plane 545 in FIG. 6) and the conductive portion 612.
  • the electrical path 6402 can be electrically connected to the conductive portion 612.
  • FIG. 17 is a graph showing an operating frequency band of the legacy antenna of FIG. 16 according to a change of a variable element (for example, the variable element 647 of FIG. 16) according to various embodiments of the present invention.
  • a variable element for example, the variable element 647 of FIG. 16
  • a conductive portion of the side member (eg, the side member 610 of FIG. 16) (eg, the conductive portion 612 of FIG. 16) is a second wireless communication circuit (eg, the second wireless of FIG. 16)
  • the communication circuit 642 Through the communication circuit 642, it can be confirmed that it can operate in a second frequency band in the range of about 600 MHz to 1000 MHz (for example, 1701 band in FIG. 17).
  • the operating frequency band may be shifted according to a change in the capacitance value of the variable element 647 (eg, variable element 647 in FIG. 16). For example, the higher the capacitance value of a variable element (eg, variable element 647 in FIG. 16) It can be seen that the shift to the low frequency band.
  • an electronic device (eg, the electronic device 300 of FIG. 3A) includes a conductive portion (eg, a first conductive portion 511 or a second conductive portion 512 of FIG. 5)
  • a housing including a member eg, side bezel structure 318 of FIG. 3A) (eg, housing 310 of FIG. 3A), and an antenna structure formed through at least a portion of the conductive portion (eg, antenna of FIG. 5)
  • a first plurality of conductive patches eg, a plurality of conductive patches 521, 522, 523, 524 of FIG. 5) disposed at regular intervals, and the first plurality of conductive
  • a first antenna structure e.g., FIG.
  • a printed circuit board including an antenna structure (eg, the second antenna structure 530 of FIG.
  • first wireless communication circuit disposed on the printed circuit board, electrically connected to the antenna structure through the printed circuit board, and configured to transmit and/or receive signals in a first frequency band (eg, FIG. 5).
  • the first frequency band may have a range of 3 GHz to 100 GHz.
  • the first plurality of conductive patches and the second conductive patches may be disposed at least partially overlapping each other.
  • the first plurality of conductive connections and the second plurality of conductive connections are more than the first plurality of conductive patches and the second plurality of conductive patches. It may be formed to have a small thickness (eg, the thickness t1 in FIG. 12).
  • the first plurality of conductive connections and the second plurality of conductive connections look at the side member from the outside
  • the first plurality of conductive patches and the second plurality of conductive patches It may be formed to have the same or smaller width (for example, the width (w) of Figure 12).
  • each of the first plurality of conductive connections and the second plurality of conductive connections may be connected to each other by connecting the first plurality of conductive patches and the second plurality of conductive patches to each other. It may have an electrical length of 2 (for example, the length (l) of FIG. 5).
  • the side member may include a first conductive portion (eg, the first conductive portion 511 of FIG. 5) disposed in at least some areas and a second conductive portion spaced apart from the first conductive portion at regular intervals. (Eg, the second conductive portion 512 of FIG. 5), and the first conductive portion and the second conductive portion may be physically connected through the antenna structure.
  • a first conductive portion eg, the first conductive portion 511 of FIG. 5
  • second conductive portion spaced apart from the first conductive portion at regular intervals.
  • the first conductive portion and the second conductive portion may be physically connected through the antenna structure.
  • the side member eg, the side member 1510 of FIG. 15
  • the side member 1510 of FIG. 15 includes an opening (eg, the opening 1501 of FIG. 15) formed in at least some regions, and the antenna structure (eg: The antenna structure 1520 of FIG. 15 may be disposed through the opening.
  • an area other than the area where the antenna structure of the side member is disposed may be formed of a non-conductive part (eg, the non-conductive material 513 of FIG. 5 ).
  • the printed circuit board includes a plurality of insulating layers, disposed on any one of the plurality of insulating layers, and each of the first plurality of conductive patches and the second plurality of The plurality of conductive paths (eg, a plurality of conductive paths 541, 542, 543, 544 of FIG. 6) electrically facing the first wireless communication circuit and facing each other so as to be coupled with each of the conductive patches It can contain.
  • the plurality of conductive paths eg, a plurality of conductive paths 541, 542, 543, 544 of FIG. 6
  • the plurality of conductive paths may include a conductive pattern formed on an insulating layer of the printed circuit board and having a shape or size in which a coupling area is determined.
  • a main substrate disposed in the space (eg, the main substrate 640 of FIG. 16) and a first electrical path disposed on the main substrate and disposed on the main substrate (eg, the product of FIG. 16)
  • a second wireless communication electrically connected to a first point (for example, the first point L1 in FIG. 16) of the side member (for example, the side member 610 in FIG. 16) through an electrical path 6401.
  • Circuit eg, second wireless communication circuit 642 of FIG. 16
  • the second wireless communication circuit may be configured to transmit and/or receive signals in a second frequency band through the side member.
  • the second frequency band may have a range of 600 MHz to 1000 MHz.
  • the side member is disposed at the second substrate spaced apart from the first point (eg, the second point (L2) in FIG. 16) and a second electrical path (eg, in FIG. 16).
  • the second electrical path 6402 may be electrically connected to a ground part (eg, the ground part 646 of FIG. 16 ).
  • the antenna structure may overlap at least partially between the first point and the second point.
  • the second frequency band may further include at least one variable element (for example, the variable element 647 of FIG. 16) disposed in the second electrical path, and change the set value of the variable element. In the shift of the operating frequency band can be determined.
  • at least one variable element for example, the variable element 647 of FIG. 16
  • the processor further includes at least one processor (eg, the processor 580 of FIG. 6), the processor through the first wireless communication circuit of the first antenna structure and/or the second antenna structure By controlling the operation, beam steering through the antenna structure can be performed.
  • processors eg, the processor 580 of FIG. 6
  • an electronic device (eg, the electronic device 300 of FIG. 3A) includes a conductive portion (eg, a first conductive portion 511 or a second conductive portion 512 of FIG. 5)
  • a housing including a member eg, side bezel structure 318 of FIG. 3A) (eg, housing 310 of FIG. 3A), and an antenna structure formed through at least a portion of the conductive portion (eg, antenna of FIG. 15)
  • a structure 1520 As a structure 1520, a plurality of conductive patches (eg, a plurality of conductive patches 1521, 1522, 1523, 1524 of FIG.
  • an antenna structure including conductive connections (eg, a plurality of conductive connections 1525, 1526, 1527, 1528, 1529 in FIG. 15), and disposed adjacent to the antenna structure in an interior space of the housing.
  • a printed circuit board for example, the printed circuit board 1540 of FIG. 15
  • the printed circuit board electrically connected to the antenna structure through the printed circuit board, and transmitting and transmitting frequency signals in the range of 3 GHz to 100 GHz.
  • at least one first wireless communication circuit configured to receive (eg, wireless communication circuit 1540 of FIG. 15 ).
  • a main substrate disposed in the space eg, the main substrate 640 of FIG. 16
  • a first electrical path disposed on the main substrate and disposed on the main substrate
  • a second wireless communication electrically connected to a first point (for example, the first point L1 in FIG. 16) of the side member (for example, the side member 610 in FIG. 16) through an electrical path 6401.
  • Circuit eg, second wireless communication circuit 642 of FIG. 16
  • the second wireless communication circuit may be configured to transmit and/or receive a frequency signal in the range of 600 MHz to 1000 MHz through the side member. .
  • the side member may include a first conductive portion (eg, the first conductive portion 511 of FIG. 5) disposed in at least some areas and a second conductive portion spaced apart from the first conductive portion at regular intervals. (Eg, the second conductive portion 512 of FIG. 5), and the first conductive portion and the second conductive portion may be physically connected through the antenna structure.
  • a first conductive portion eg, the first conductive portion 511 of FIG. 5
  • second conductive portion spaced apart from the first conductive portion at regular intervals.
  • the first conductive portion and the second conductive portion may be physically connected through the antenna structure.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Telephone Function (AREA)
  • Support Of Aerials (AREA)
  • Transceivers (AREA)

Abstract

L'invention concerne un dispositif électronique comprenant : un boîtier comprenant une première plaque, une seconde plaque orientée dans une direction opposée à la première plaque, et un élément latéral entourant un espace entre la première plaque et la seconde plaque et comprenant une partie conductrice ; une structure d'antenne formée à travers au moins une partie de la partie conductrice, la structure d'antenne comprenant une première structure d'antenne comprenant une pluralité de premières plaques conductrices agencées à des intervalles réguliers et une pluralité de premiers connecteurs conducteurs pour connecter électriquement les premières plaques conductrices les unes aux autres, et une seconde structure d'antenne comprenant une pluralité de secondes plaques conductrices agencées à des intervalles réguliers de façon à être parallèles à la première structure d'antenne et une pluralité de seconds connecteurs conducteurs pour connecter électriquement les secondes plaques conductrices les unes aux autres ; une carte de circuit imprimé disposée de façon à être adjacente à la structure d'antenne dans l'espace ; et au moins un premier circuit de communication sans fil disposé sur la carte de circuit imprimé, électriquement connecté à la structure d'antenne par l'intermédiaire de la carte de circuit imprimé, et configuré pour émettre et/ou recevoir des signaux dans une première bande de fréquence.
PCT/KR2019/011831 2019-01-03 2019-09-11 Antenne utilisant un élément latérale conducteur et dispositif électronique la comportant Ceased WO2020141692A1 (fr)

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KR1020190000715A KR102664682B1 (ko) 2019-01-03 2019-01-03 도전성 측면 부재를 이용한 안테나 및 그것을 포함하는 전자 장치
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WO2025249761A1 (fr) * 2024-05-31 2025-12-04 삼성전자주식회사 Dispositif électronique comprenant un ensemble bouton-touche à dispositif de sortie haptique

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