WO2020150902A1 - Panneau d'affichage flexible et son procédé de fabrication - Google Patents
Panneau d'affichage flexible et son procédé de fabrication Download PDFInfo
- Publication number
- WO2020150902A1 WO2020150902A1 PCT/CN2019/072698 CN2019072698W WO2020150902A1 WO 2020150902 A1 WO2020150902 A1 WO 2020150902A1 CN 2019072698 W CN2019072698 W CN 2019072698W WO 2020150902 A1 WO2020150902 A1 WO 2020150902A1
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- Prior art keywords
- flexible
- substrate
- flexible substrate
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- porous alumina
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- This application relates to the field of flexible display technology, and in particular to a flexible display panel and a manufacturing method thereof.
- the flexible display panel is a bendable display device made of a soft material.
- the preparation process of the flexible display panel is roughly as follows: first, a layer of flexible substrate is formed on the carrier substrate; then, various processes are applied to the flexible substrate, and after the various manufacturing processes of the flexible substrate are completed, the carrier substrate is separated from the flexible substrate , Get a flexible display panel.
- the inventor discovered that in the traditional method of separating the carrier substrate from the flexible substrate, it is necessary to perform preliminary separation by laser stripping first, and then achieve complete separation by mechanical stripping. It is complicated, and because the equipment used for laser lift-off and mechanical lift-off are relatively expensive, the cost of traditional separation methods is too high.
- This application aims to provide a flexible display panel and a manufacturing method thereof, so as to solve the technical problem of high cost of separating the flexible display panel from the carrier substrate in the manufacturing process of the traditional flexible display panel.
- a technical solution adopted in the embodiments of the present application is to provide a method for manufacturing a flexible display panel.
- the method includes: forming a nanoarray on the surface of a flexible substrate; and fixing a carrier substrate on the nanoarray Forming a device functional layer on the surface of the flexible base away from the carrier substrate; separating the flexible base and the carrier substrate to obtain the flexible display panel.
- the nanoarray on the surface of the flexible substrate is a polyimide nanowire array.
- the step of forming a nano-array on the surface of the flexible substrate specifically includes: preparing a porous alumina template; spreading a polyamide solution on the surface of the porous alumina template to generate the polyimide Nanowire array.
- the step of preparing the porous alumina template specifically includes: preparing the porous alumina template by a two-step anodic oxidation method.
- the step of preparing the porous alumina template by a two-step anodic oxidation method specifically includes the following steps: immersing an aluminum sheet in an oxalic acid solution for the first anodization, and generating on the surface of the aluminum sheet Preliminarily formed aluminum oxide; removing the aluminum oxide film on the surface of the preliminary formed aluminum oxide; and immersing the aluminum sheet after removing the aluminum oxide film in an oxalic acid solution for a second anodic oxidation to obtain a porous aluminum oxide template.
- the step of spreading the polyamic acid solution on the surface of the porous alumina template to generate the polyimide nanowire array specifically includes: changing the surface of the porous alumina template to aluminum The sheet is placed on the first carrier; the polyamide solution is spread on the porous alumina template; cured and dried to form a flexible substrate; a second carrier is arranged on the side of the flexible substrate away from the aluminum sheet; Flexible substrate, and remove the first carrier and the aluminum sheet; remove the porous alumina template to obtain a polyamide that forms a nanowire array on the surface where the flexible substrate and the porous alumina template meet Imine substrate.
- the porous alumina template is removed by an alkali etching method.
- the step of forming a device functional layer on the surface of the flexible base away from the carrier substrate specifically includes: turning over the flexible base again and removing the second carrier, exposing the flexible base and the The separated surface of the supporting substrate; an OLED array is prepared on the separated surface of the flexible base and the supporting substrate.
- the method further includes: generating a protective film layer on the surface of the device functional layer, the protective film layer covering the device functional layer.
- the flexible base and the carrier substrate are separated mechanically.
- a flexible display panel comprising: a flexible substrate; a device functional layer, the device functional layer is arranged on the flexible substrate
- the first surface of the flexible substrate; the second surface of the flexible substrate away from the functional layer of the device is a nano-array structure, which is used to provide adsorption or desorption capacity for the flexible substrate during the preparation of the flexible panel.
- the flexible substrate of the flexible display panel manufactured by the method has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, it has strong adsorption capacity and desorption capacity.
- the process of separating the flexible substrate from the carrier substrate it only needs to pass a simple mechanical separation step to realize the separation of the flexible substrate from the carrier substrate, and the separation process is simple. And the cost is lower.
- FIG. 1 is a schematic flowchart of a method for manufacturing a flexible display panel provided by one of the embodiments of the present application;
- FIG. 1 are structural schematic diagrams of the flexible display panel manufacturing method shown in FIG. 1 in different manufacturing stages;
- FIG. 3 is a schematic diagram of a preparation process of forming a polyimide nanowire array on the surface of a flexible substrate according to some embodiments of the present application;
- FIG. 4 is a schematic structural diagram of a manufacturing process of a flexible display panel provided by another embodiment of the present application.
- the embodiment of the application is directed to the existing manufacturing method of the flexible display panel, because the carrier substrate and the flexible substrate in the flexible display panel need to be separated by laser first to realize the looseness of the connection surface of the carrier substrate and the flexible substrate, and then mechanical separation is used. To completely separate the carrier substrate and the flexible substrate, the separation process is cumbersome and requires many processes. In addition, in the laser peeling step, it is easy to damage the surface of the flexible substrate, resulting in the problem of low yield of the flexible display panel. A method for manufacturing a flexible display panel is proposed. The embodiment of the present application can improve this defect.
- FIG. 1 is a schematic flowchart of a method for manufacturing a flexible display panel provided by one embodiment of the present application. The method includes the following steps:
- Step 11 Form a nano-array on the surface of the flexible substrate.
- the flexible substrate is the supporting structure of the flexible display panel with corresponding thickness and strength. It can be made of soft materials, such as polypropylene, polystyrene, fiber reinforced composite materials or polyimide. In a specific example, the flexible substrate can be made of polyimide, which is a wear-resistant transparent plastic with high insulation and has good temperature and oxidation resistance.
- FIG. 2a to 2c are structural schematic diagrams of the flexible display panel manufacturing method shown in FIG. 1 at different manufacturing stages. Please refer to FIG. 2a.
- the surface 211 of the flexible substrate 21 is formed with a nano-array structure.
- the highly ordered nano-array structure can Expose a large number of dominant crystal planes that are conducive to charge separation, so it has strong adsorption and desorption capabilities.
- Step 12 Fix the carrier substrate on the nano array.
- the carrier substrate can provide a clean and flat supporting surface for the production of the flexible display panel. After the flexible display panel is prepared, it needs to be separated from the flexible substrate in the subsequent manufacturing process.
- the carrier substrate is a rigid substrate, which can be prepared by using any suitable type of rigid material, such as rigid plastic.
- the rigid substrate can provide convenience for subsequent transportation of the flexible substrate, and avoid damage to the flexible substrate during transportation.
- the process of fixing the carrier substrate 22 on the flexible substrate 21 is the adsorption process of the carrier substrate 22 and the flexible substrate 21.
- the nanoarray structure makes the flexible substrate 21 and the carrier substrate 22 separate There is a strong van der Waals force between them.
- the nano-array structure can make the surface 211 of the flexible substrate 21 have a strong adsorption capacity, so that the adhesion between the flexible substrate 21 and the carrier substrate 22 is increased. The close contact with the carrier substrate 22 will be maintained, and the flexible base 21 will not be separated from the carrier substrate 22.
- Step 13 forming a device functional layer on the surface of the flexible base away from the carrier substrate.
- the device functional layer refers to one or more display devices with various structures in the flexible display panel.
- the flexible display panel is an Organic Light-Emitting Diode (OLED) display panel, which can form hole transport on the flexible substrate Layers, light-emitting layers and electron transport layers, or other various structures to form an OLED display.
- OLED Organic Light-Emitting Diode
- the flexible display panel is electronic paper, an electronic paper display device or the like can be formed on the flexible substrate, and the final device functional layer formed can be determined according to different designs or needs.
- Step 14 Separate the flexible base and the carrier substrate to obtain the flexible display panel.
- a preliminary formed flexible display panel is obtained. Before the final product leaves the factory, the flexible substrate needs to be separated from the carrier substrate.
- the traditional method of separating the flexible substrate from the carrier substrate requires the use of laser technology and mechanical technology for peeling, that is, the two production processes of laser lift-off (LLO) and mechanical separation (Mechanical De-lamination) remove the flexible substrate from Peel off the carrier substrate.
- LLO laser lift-off
- Mechanism Mechanical De-lamination
- the flexible substrate and the carrier substrate are tightly fixed based on a nano-array, and the feature size of the structure has reached the nanometer level, and the distance between neighbors in the array is usually only tens of nanometers, van der Waals force, etc.
- the intermolecular force has a very important influence on the mechanical behavior of the nanoarray.
- the flexible substrate 21 Since the intermolecular force between the flexible substrate 21 and the carrier substrate 22 in the desorption process is reduced compared to the intermolecular force during the adsorption process, the flexible substrate 21 has a strong desorption capacity, which only requires mechanical By means of separation, the flexible base 21 and the carrier substrate 22 can be separated.
- the mechanical separation described above can be achieved by using a cutting knife, a mechanical roller, etc. to separate the flexible base from the carrier substrate.
- the flexible substrate of the flexible display panel manufactured by the method has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, the flexible substrate has a surface with a nano-array structure, which has strong adsorption and desorption capabilities.
- the intermolecular force gradually decreases, and only a simple mechanical separation step is required. , The separation of the flexible base and the carrier substrate can be achieved.
- the force between the flexible base and the carrier substrate is relatively large.
- the mechanical separation method is used for separation.
- the flexible substrate of the nano-array structure has a simple separation process, which reduces the cost compared with the addition of the laser lift-off process.
- the laser lift-off is likely to burn the surface of the flexible substrate due to the high temperature of the laser, resulting in a lower yield rate of the flexible display panel
- the use of a flexible substrate with a nano-array structure reduces the impact factor and improves the yield of flexible display panels.
- the embodiment of the present application uses polyimide as the raw material for the flexible substrate, and prepares the polyimide nanowire array by the porous alumina template infiltration method. Examples are explained.
- FIG. 3 is a schematic diagram of the preparation process of forming a polyimide nanowire array on the surface of a flexible substrate provided by an embodiment of the application. As shown in FIG. 3, it includes the following steps:
- Step 31 Prepare a porous alumina template.
- This step mainly prepares nano-scale porous alumina, which has a special microstructure and rich pore structure, and can be used as a template for subsequent preparation of flexible substrates with nano-arrays.
- the porous alumina template can be prepared by a two-step oxidation method.
- the specific method for preparing the porous alumina template by the two-step oxidation method is as follows:
- the aluminum sheet is immersed in an oxalic acid solution for the first anodization, and preliminary formed aluminum oxide is generated on the surface of the aluminum sheet.
- the aluminum sheet before the aluminum sheet is subjected to the first anodization, can also be polished to remove the mechanical damage on the surface of the aluminum sheet to improve the smoothness of the surface.
- the aluminum sheet can be immersed in a mixture of perchloric acid and ethanol for polishing.
- organic acids such as phosphoric acid or chromic acid are used to remove the aluminum oxide film on the surface of the aluminum oxide that is preliminarily formed.
- the aluminum sheet after the aluminum oxide film is removed is immersed again in the oxalic acid solution for a second anodization to obtain a porous aluminum oxide template.
- an appropriate amount of phosphoric acid solution can also be used to carry out through-holes and then expand the holes to obtain the final porous alumina template.
- Step 32 Spread the polyamide acid solution on the surface of the porous alumina template to generate a polyimide nanowire array.
- the polyamide solution can obtain electrons to become polyimide, and spread out on the surface of the porous alumina template quickly, and finally the polyimide enters the template under the siphon effect of capillary force. After the holes are infiltrated for a period of time, a flexible substrate with a nano-array on the surface is formed.
- step 32 may include the following steps:
- Step 321 Place the aluminum sheet with the porous alumina template on the first carrier.
- the first carrier is a device used to provide a reaction place for the manufacturing process and facilitate the movement and fixation of the aluminum sheet during the manufacturing process.
- Step 322 Spread the polyamide acid solution on the porous alumina template.
- Step 323 curing and drying to form a flexible substrate.
- the surface of the flexible substrate and the porous alumina template can be formed into a nano-array.
- Step 324 Set a second carrier on the side of the flexible substrate away from the aluminum sheet.
- the second carrier is another carrier different from the first carrier. Its function is the same as that of the first carrier, and it is also convenient to provide a basis for reaction in the production process.
- Step 325 Turn over the flexible substrate, and remove the first carrier and the aluminum sheet.
- copper chloride solution replacement or similar methods can be used to remove part of the aluminum sheet and only the porous alumina template remains.
- Step 326 Remove the porous alumina template to obtain a polyimide substrate with a nanowire array formed on the surface where the flexible substrate and the porous alumina template are connected.
- an alkaline solution etching method can be used to remove the porous alumina template to finally obtain a polyimide nanowire array.
- a sodium hydroxide solution of a specific concentration can be used to remove the porous alumina template.
- the step of forming a device functional layer on the surface of the flexible substrate away from the carrying substrate may specifically include:
- the flexible base is turned over again and the second carrier is removed, thereby exposing the surface of the flexible base that is separated from the carrier substrate.
- the exposed surface is a smooth and flat surface, which can provide a very good deposition plane for making multiple functional devices.
- the carrier substrate is located at the bottom of the flexible base to provide support.
- an OLED array is prepared on the surface of the flexible base that is separated from the carrier substrate.
- the preparation of the OLED array can be completed by any suitable one or more manufacturing processes. It is well-known to those skilled in the art and will not be repeated here.
- the carrier substrate and the flexible base are separated by mechanical separation to complete the manufacture of the flexible display panel.
- the manufacturing process of the protective film layer may be added. That is, a protective film layer is formed on the surface of the device functional layer so as to cover the device functional layer.
- the protective film layer covers the functional layer of the device, which can provide a protective effect and avoid damage to the OLED device due to air oxidation and water mist during use.
- the protective film layer can be made of any suitable flexible material, as long as it has sufficient sealing and wear resistance.
- FIG. 4 is a schematic diagram of a manufacturing method of a flexible display panel provided in another embodiment of the application in various manufacturing processes. The manufacturing method of the flexible display panel will be described in detail below in conjunction with the manufacturing process shown in FIG. 4.
- the preparation of the flexible substrate for the nanoarray includes:
- the aluminum sheet is subjected to secondary oxidation to obtain the aluminum sheet A whose surface is the porous alumina template A1.
- the aluminum sheet A whose surface is the porous alumina template A1 is placed on the first carrier B with the porous alumina template A1 facing upward.
- the polyimide flexible substrate C can be formed.
- the side of the polyimide flexible substrate C that is connected to the porous alumina template A1 is a surface with a nano-array structure.
- the aluminum sheet A and the porous alumina template A1 need to be removed.
- the specific method for removing the aluminum sheet A and the porous alumina template A1 is:
- a second carrier D is provided on the side of the polyimide flexible substrate C away from the aluminum sheet A, as a support for the polyimide flexible substrate C. Then, the polyimide flexible substrate C is turned over so that the first carrier B and the aluminum sheet A are located on the upper part and the first carrier B and the aluminum sheet A are removed.
- the nanowire array formed on the surface of the polyimide flexible substrate C and the porous alumina template A1 can be exposed.
- the carrier substrate E is fixed and covered on the surface of the polyimide flexible substrate C.
- the carrier substrate E is tightly fixed on the polyimide flexible substrate C by the intermolecular force of the nanowire array.
- the polyimide flexible substrate C is turned over again and the second carrier D is removed, exposing the surface of the polyimide flexible substrate C that is separated from the carrier substrate E.
- an OLED array is prepared on the surface of the polyimide flexible substrate C separated from the carrier substrate E to form a device functional layer F.
- the device functional layer F can be set to a corresponding structure according to actual needs, and can be compatible with all flexible display panel device functional layers F.
- modification steps need to be performed so that the finished flexible display panel can meet the requirements of the actual application environment. These modification steps include:
- the protective film layer G covers the device functional layer and plays a protective role to prevent internal devices from being affected by oxidation, moisture, or scratches.
- the flexible display panel is turned over again so that the carrier substrate E is located on the top layer. Then, the carrier substrate E is separated and removed by means of mechanical separation.
- the embodiment of the present application also provides a flexible display panel.
- the flexible display panel includes: a flexible substrate and a device function layer.
- the device functional layer is disposed on the first surface of the flexible substrate; the second surface of the flexible substrate facing away from the device functional layer is a nano-array structure, which is used for preparing the flexible panel during the manufacturing process of the flexible panel.
- the substrate provides adsorption or desorption capacity.
- the flexible substrate of the flexible display panel has a nano-array structure, and the intermolecular force has a very important influence on the mechanical behavior of the nano-array. Therefore, the flexible substrate has a surface with a nano-array structure, which has strong adsorption and desorption capabilities.
- the process of separating the flexible substrate from the carrier substrate is involved, and the process of separating the flexible substrate from the carrier substrate Among them, the intermolecular force gradually decreases, and the flexible substrate has a strong desorption capacity. Only a simple mechanical separation step is required to realize the separation of the flexible substrate and the carrier substrate, which reduces the manufacturing cost of the flexible display panel.
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Abstract
L'invention concerne un panneau d'affichage flexible et son procédé de fabrication. Le procédé de fabrication consiste : à former un nanoréseau sur la surface (211) d'un substrat flexible (21, C) (11) ; à fixer un substrat de support (22, E) sur le nanoréseau (12) ; à former une couche fonctionnelle de dispositif (F) sur la surface du substrat flexible (21, C) la plus éloignée du substrat de support (22, E) (13) ; et à séparer le substrat flexible (21, C) et le substrat de support (22, E) de manière à obtenir un panneau d'affichage flexible (14). Le substrat flexible (21, C) d'un panneau d'affichage flexible fabriqué par l'intermédiaire du présent procédé de fabrication de panneau d'affichage flexible présente une structure de nanoréseau, et dispose par conséquent d'une capacité d'adsorption et d'une capacité de désorption élevées ; dans le processus de séparation du substrat flexible (21, C) et du substrat de support (22, E), la séparation du substrat flexible (21, C) et du substrat de support (22, E) peut être mise en œuvre au moyen d'une étape de séparation mécanique simple ; le processus de séparation est simple et les coûts sont faibles.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/072698 WO2020150902A1 (fr) | 2019-01-22 | 2019-01-22 | Panneau d'affichage flexible et son procédé de fabrication |
| CN201980073409.7A CN113243045B (zh) | 2019-01-22 | 2019-01-22 | 柔性显示面板及其制作方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/072698 WO2020150902A1 (fr) | 2019-01-22 | 2019-01-22 | Panneau d'affichage flexible et son procédé de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020150902A1 true WO2020150902A1 (fr) | 2020-07-30 |
Family
ID=71736424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2019/072698 Ceased WO2020150902A1 (fr) | 2019-01-22 | 2019-01-22 | Panneau d'affichage flexible et son procédé de fabrication |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113243045B (fr) |
| WO (1) | WO2020150902A1 (fr) |
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| CN204464252U (zh) * | 2015-04-16 | 2015-07-08 | 京东方科技集团股份有限公司 | 柔性基板母板和柔性基板 |
| US20150195915A1 (en) * | 2014-01-06 | 2015-07-09 | Samsung Display Co., Ltd. | Display device and method for manufacturing the same |
| CN107001691A (zh) * | 2014-12-03 | 2017-08-01 | (株) 希岩肯 | 剥离层及其制造方法 |
| CN107831941A (zh) * | 2017-11-22 | 2018-03-23 | 杨晓艳 | 一种柔性触摸基板的制备方法和柔性触摸基板 |
| CN108281518A (zh) * | 2018-01-30 | 2018-07-13 | 深圳市华星光电技术有限公司 | 一种柔性led器件及其制备方法 |
| CN207624673U (zh) * | 2017-08-30 | 2018-07-17 | 昆山国显光电有限公司 | 便于剥离柔性基板的预制组件 |
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| SG10201808518RA (en) * | 2013-07-31 | 2018-10-30 | 3M Innovative Properties Co | Bonding electronic components to patterned nanowire transparent conductors |
| CN104229729A (zh) * | 2014-08-21 | 2014-12-24 | 南京航空航天大学 | 一种碳纳米管垂直阵列转移至柔性聚合物基底上的方法 |
| CN105489789B (zh) * | 2016-01-18 | 2017-03-01 | 京东方科技集团股份有限公司 | 柔性器件制作方法及柔性显示器件 |
-
2019
- 2019-01-22 WO PCT/CN2019/072698 patent/WO2020150902A1/fr not_active Ceased
- 2019-01-22 CN CN201980073409.7A patent/CN113243045B/zh not_active Expired - Fee Related
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| US20150195915A1 (en) * | 2014-01-06 | 2015-07-09 | Samsung Display Co., Ltd. | Display device and method for manufacturing the same |
| CN107001691A (zh) * | 2014-12-03 | 2017-08-01 | (株) 希岩肯 | 剥离层及其制造方法 |
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| CN207624673U (zh) * | 2017-08-30 | 2018-07-17 | 昆山国显光电有限公司 | 便于剥离柔性基板的预制组件 |
| CN107831941A (zh) * | 2017-11-22 | 2018-03-23 | 杨晓艳 | 一种柔性触摸基板的制备方法和柔性触摸基板 |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN113243045B (zh) | 2022-11-29 |
| CN113243045A (zh) | 2021-08-10 |
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