WO2020151297A1 - Unité rayonnante microruban et antenne réseau - Google Patents

Unité rayonnante microruban et antenne réseau Download PDF

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Publication number
WO2020151297A1
WO2020151297A1 PCT/CN2019/115523 CN2019115523W WO2020151297A1 WO 2020151297 A1 WO2020151297 A1 WO 2020151297A1 CN 2019115523 W CN2019115523 W CN 2019115523W WO 2020151297 A1 WO2020151297 A1 WO 2020151297A1
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WIPO (PCT)
Prior art keywords
radiation unit
microstrip
circuit
radiation
dielectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/115523
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English (en)
Chinese (zh)
Inventor
骆胜军
潘波
程季
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Hongxin Telecommunication Technologies Co Ltd
Original Assignee
Wuhan Hongxin Telecommunication Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan Hongxin Telecommunication Technologies Co Ltd filed Critical Wuhan Hongxin Telecommunication Technologies Co Ltd
Priority to ES19912014T priority Critical patent/ES3037635T3/es
Priority to EP19912014.8A priority patent/EP3916906B1/fr
Publication of WO2020151297A1 publication Critical patent/WO2020151297A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/062—Two dimensional planar arrays using dipole aerials

Definitions

  • the embodiments of the present disclosure relate to the field of communication technologies, and in particular, to a microstrip radiating unit and an array antenna.
  • the 5th-Generation (5G) mobile communication technology applies large-scale antenna technology, deploying dozens or even hundreds of antenna-scale antenna arrays at the base station to increase network capacity.
  • the large-scale antenna technology in the 5G era has turned the antenna into an integrated active antenna (Active Antenna Unit, AAU).
  • AAU integrates the antenna and the radio remote unit (RRU), resulting in a straight line in the weight of the AAU.
  • RRU radio remote unit
  • the existing radiation unit mainly includes the following three solutions.
  • the first solution is to use an aluminum alloy integral die-casting structure. Due to the use of a high-density metal base material, the weight of the vibrator is heavier, which does not meet the demand for lightweight large-scale antennas. Moreover, the radiating part and the feeding part are separated, and the assembly is relatively complicated, which is not suitable for large-scale automated production.
  • the second solution uses a PCB structure. The radiating part and the feeding part are etched on different flat substrate PCBs, and then the various components are welded together to produce electrical contact. Although this implementation method greatly reduces the weight of the radiating unit, Due to the large number of parts, complex assembly and low reliability, it is very unfavorable for large-scale automated production.
  • the third scheme is improved on the basis of the first scheme.
  • the radiator part is made of engineering plastic injection molding, and then the whole is electroplated. Although the weight of the radiating unit is reduced, the radiating part and the feeding part still belong to Separate structure, assembly is
  • the embodiments of the present disclosure provide a microstrip radiating unit and an array antenna to solve the problems of heavy weight and complicated assembly of the existing radiating unit.
  • embodiments of the present disclosure provide a microstrip radiation unit, including a dielectric substrate, a radiation circuit, and a feed circuit;
  • the media base material is integrally injection molded, and the media base material includes a top part, a support part and a welding part, and the support part is connected to the top part and the welding part respectively;
  • the radiation circuit is arranged on the upper surface of the top, and the feed circuit is arranged on the lower surface of the top and extends along the support part to the welding part.
  • embodiments of the present disclosure provide an array antenna, including a plurality of microstrip radiating units as provided in the first aspect, and a feeding network for installing each of the microstrip radiating units.
  • the embodiment of the present disclosure provides a microstrip radiating unit and an array antenna.
  • the weight of the radiating unit is reduced by an integrally injection-molded dielectric substrate, and the radiating circuit and the feeding circuit are both arranged on the dielectric substrate to realize the radiating unit.
  • the integration simple structure, no assembly required, improved reliability and consistency of the radiation unit, and more suitable for large-scale manufacturing.
  • the single-layer radiation circuit is used to realize the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and realizes the lightweight of the radiation unit.
  • FIG. 1 is a schematic structural diagram of a microstrip radiation unit provided by an embodiment of the disclosure
  • FIG. 2 is a schematic structural diagram of a microstrip radiation unit provided by another embodiment of the disclosure.
  • FIG. 3 is a top view of a microstrip radiation unit provided by an embodiment of the disclosure.
  • FIG. 4 is a top view of a microstrip radiation unit provided by another embodiment of the disclosure.
  • Figure 5 is a top view of a microstrip radiation unit provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of an array antenna provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic structural diagram of a feed network provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic diagram of differential feeding of an integrated microstrip radiating unit provided by an embodiment of the disclosure.
  • FIG. 1 is a schematic structural diagram of a microstrip radiation unit provided by an embodiment of the disclosure.
  • the microstrip radiation unit includes a dielectric substrate 11, a radiation circuit 12, and a feed circuit 13; wherein the dielectric substrate 11 is integrated
  • the dielectric substrate 11 includes a top portion 111, a support portion 112, and a welding portion 113.
  • the support portion 112 is connected to the top portion 111 and the welding portion 113, respectively; the radiation circuit 12 is arranged on the upper surface of the roof 111, and the feed circuit 13 is arranged on the top 111 The lower surface extends along the supporting portion 112 to the welding portion 113.
  • the dielectric substrate 11 is a single part that includes a top part 111, a support part 112 and a welding part 113 from top to bottom.
  • the support part 112 is a connecting part between the top part 111 and the welding part 113.
  • the support part 112 may be a single columnar structure shown in FIG. 1, or may be composed of a plurality of supporting components.
  • the side of the top 111 in contact with the supporting portion 112 is confirmed as the lower surface of the top 111, and accordingly the side of the top 111 not in contact with the supporting portion 112 is confirmed as the upper surface of the top 111.
  • the radiating circuit 12 is arranged on the upper surface of the top 111.
  • the radiating circuit 12 can completely cover the upper surface of the top 111, or it can be arranged on the upper surface of the top 111 in a shape consistent with the upper surface of the top 111, or it can be arranged on the top 111 based on a preset shape.
  • the preset position of the upper surface is not limited in the embodiment of the present disclosure.
  • the feeder circuit 13 is arranged on the back of the arrangement surface of the radiation circuit 12, that is, the lower surface of the top 111, and the supporting portion 112 contacting the lower surface of the top 111, and finally extends to the soldering portion 113 to facilitate the operation in the microstrip radiation unit During installation, when the welding part 113 is connected to the feeding network, the electric connection between the feeding circuit 13 and the feeding network is realized through the welding part 113.
  • the radiating circuit 12 is arranged on the upper surface of the top 111
  • the feeding circuit 13 is arranged on the lower surface of the top 111
  • the specific arrangement position of the radiating circuit 12 on the upper surface of the top 111 and the specific arrangement of the feeding circuit 13 on the lower surface of the top 111 The arrangement positions are corresponding, so that the radiation circuit 12 arranged on the upper surface of the top 111 and the feed circuit 13 arranged on the lower surface of the top 111 form a radiating unit for coupling and feeding.
  • the arrangement of the radiating circuit 12 and the feeding circuit 13 on the dielectric substrate 11 can be implemented by 3D-MID (3D Molded Interconnect Device) technology.
  • the microstrip radiation unit provided by the embodiment of the present disclosure reduces the weight of the radiation unit through the integrated injection-molded dielectric substrate 11, and both the radiation circuit 12 and the feed circuit 13 are arranged on the dielectric substrate 11 to realize the Integration, simple structure, no assembly required, improved reliability and consistency of the radiation unit, and more suitable for large-scale manufacturing.
  • the single-layer radiation circuit is used to realize the microstrip radiation unit, which has good low profile characteristics, effectively reduces the height of the radiation unit, further reduces the weight of the radiation unit, and realizes the lightweight of the radiation unit.
  • FIG. 2 is a schematic structural diagram of a microstrip radiation unit provided by another embodiment of the present disclosure.
  • an extension hole 114 is opened in the center of the top 111, and the extension hole 114 is The support part extends in the direction of the welding part; the radiation circuit is extended to the wall of the extension hole 114.
  • an extension hole 114 is opened in the center of the top 111, and the extension hole 114 extends in the direction of the welding part.
  • the extension hole 114 may be a through hole, that is, the support part and the welding part of the dielectric substrate are of hollow design, and the extension hole 114 It may also be a blind hole, that is, the extension hole 114 extends in the support portion but is not opened, which is not specifically limited in the embodiment of the present disclosure.
  • the radiation circuit arranged on the upper surface of the top 111 is extended to the wall of the extension hole 114.
  • the radiation circuit is divided into two parts, one part is the radiation circuit arranged on the upper surface of the top 111.
  • the other part of the top radiation circuit 121 is the radiation circuit extending to the wall of the extension hole 114, that is, the extension radiation circuit 122.
  • the support part can be regarded as a hollow design
  • the hole wall of the extension hole 114 is regarded as the inner wall of the support part
  • the surface of the support part on which the feed circuit is arranged is regarded as the support part
  • a non-conductive area is also arranged on the radiation circuit.
  • FIG. 3 is a top view of the microstrip radiation unit provided by an embodiment of the disclosure.
  • the top 111 of the dielectric substrate is circular, the top 111 is provided with a radiation circuit 12, and the center of the top 111 is provided with an extension hole 114, The center of 111 is the center, and four groups of non-conductive areas 14 are evenly distributed on the upper surface, and each non-conductive area 14 is in a line shape.
  • 4 is a top view of a microstrip radiation unit provided by another embodiment of the present disclosure. As shown in FIG.
  • the top 111 of the dielectric substrate is octagonal, the top 111 is provided with a radiation circuit 12, and the center of the top 111 is provided with an extension hole 114 , With the center of the top 111 as the center, four groups of demetallized non-conductive regions 14 are evenly distributed on the upper surface, and each non-conductive region 14 is a figure eight.
  • a reinforcing rib is also arranged on the top.
  • stiffeners on the top of the media base material by adding stiffeners on the top of the media base material, the structural strength of the integrated media base material and the flatness of the top planar structure can be improved, and the “mouth”-shaped skirt ribs can be provided at the periphery of the top.
  • a cross-shaped stiffener may be provided on the top surface based on the top center, which is not specifically limited in the embodiment of the present disclosure.
  • the radiation circuit and the feed circuit are arranged symmetrically based on the central axis of the dielectric substrate. Therefore, when the microstrip radiation unit is used as a single component for the whole machine assembly, the radiation unit and the feed circuit The electrical connection assembly of the network does not require additional identification, which is very suitable for automated production in large-scale array antenna applications.
  • FIG. 5 is a top view of the microstrip radiating unit provided by the embodiment of the disclosure.
  • the microstrip radiating unit includes four groups of feeder circuits 13, and the four groups of feeder circuits 13 are dielectric
  • the center axis of the substrate 11 is uniformly distributed on the axis.
  • each group of feeder circuits 13 has the same structure, and is distributed in 90° rotation along the central axis in sequence.
  • the microstrip radiation unit including four groups of feeder circuits 13 is a dual-polarized radiation unit.
  • Each polarization of the dual-polarized radiation unit is differentiated by two groups of feeder circuits 13 arranged oppositely and symmetrically (with a 180° phase difference). ) Feeding to suppress high-order modes, further reduce the coupling between the two ports, and improve the pattern consistency and isolation of the dual-polarized oscillator +45° polarization and -45° polarization.
  • the welding portion 113 includes four pins 1131 evenly distributed around the center axis of the dielectric substrate 11, and each feed circuit 13 wraps a pin 1131 .
  • each feeder circuit 13 includes a top feeder circuit 131, an intermediate connection portion 132, and a bottom soldering portion 133.
  • the top feeder circuit 131 is the set of feeder circuits 13 arranged on the top 111 of the dielectric substrate.
  • the middle connecting portion 132 is the part of the group of feeding circuits 13 that is laid on the dielectric substrate support 112 to connect the top feeding circuit 131 and the bottom welding portion 133
  • the bottom welding portion 133 is the group of feeding circuits 13 It is arranged on the welding part 113 of the dielectric base material 11 and is wrapped around a part of a pin 1131 corresponding to the welding part 113.
  • the bottom welding part 133 of the wrapping pin 1131 is used to electrically connect with the feed network port to realize signal excitation.
  • a slot 1132 is provided between any two adjacent pins 1131 of the welding portion 113.
  • the slot 1132 may be a slot of various shapes such as a U-shaped groove and a V-shaped groove.
  • the microstrip radiation unit is a three-dimensional molded interconnection device, and the entire microstrip radiation unit is a single component, which simplifies the supply chain, has a simple structure, improves the reliability and consistency of the radiation unit, and is suitable for large-scale manufacture.
  • FIG. 6 is a schematic structural diagram of an array antenna provided by an embodiment of the present disclosure.
  • the array antenna includes a plurality of microstrip radiating units 1, and is used to install each microstrip radiating unit 1.
  • each microstrip radiating unit 1 is welded to the feeder network 2 through the welding part of the dielectric substrate to realize the electrical connection between the feeder circuit and the feeder network 2.
  • the welding part can be a pin type welding structure, or It may be a soldering type welding structure, and the embodiment of the present disclosure does not specifically limit the installation method between the microstrip radiation unit 1 and the feed network 2.
  • FIG. 7 is a schematic structural diagram of a feed network provided by an embodiment of the disclosure.
  • a number of feed ports 21 are provided on the feed network 2 for electrical connection with the welding part of the microstrip radiation unit.
  • four feed ports 21 are provided for the microstrip radiation unit with four pins in the welding part, and each pin corresponds to a feed port 21.
  • the four pins have rotational center symmetry. In this case, during assembly, only the four pins need to be directly connected to the four feed ports 21, without additional identification, blind mating assembly can be realized, which can significantly shorten the assembly time in antenna production and improve assembly efficiency , Very suitable for realizing automated production in large-scale array antenna applications.
  • FIG. 8 is a schematic diagram of differential feeding of an integrated microstrip radiating unit provided by an embodiment of the disclosure, including an integrated microstrip radiating unit 1 and a differential feeding network 2 thereof.
  • the four solder pins of the integrated radiating unit are blindly inserted into the four feed ports of the differential feed network 2 without additional identification.
  • the two feed ports 21a and 21b (or 22a and 22b) of the same set of polarizations are arranged oppositely and have a phase difference of 180°.
  • the microstrip radiation unit 1 includes a dielectric substrate 11, a radiation circuit 12 and a feeding circuit 13.
  • the dielectric substrate 11 is an integrated structure and is integrally injection molded from high temperature resistant engineering plastics.
  • the dielectric substrate 11 includes a top 111, a supporting portion 112, a welding portion 113 and a reinforcing rib 15.
  • An extension hole 114 is provided at the center of the top 111, and The supporting portion 112 forms a smooth transition structure, which is unobstructed from the top view.
  • the radiation circuit 12 includes a top radiation circuit 121 provided on the upper surface of the top 111 of the dielectric substrate and an extension radiation circuit 122 provided on the surface of the extension hole 114.
  • the top radiation circuit 121 is provided with a demetallization gap, that is, non-conductive.
  • Area 14 The feeding circuit 13 includes a top feeding circuit 131 arranged on the lower surface of the top 111 of the dielectric substrate, an intermediate connecting portion 132 arranged on the outer wall surface of the dielectric substrate supporting portion 112, and a welding portion 113 arranged on the dielectric substrate and covering the entire dielectric substrate.
  • the bottom welding portion 133 of the four welding legs of the material welding portion 113 is provided with a demetallization gap, that is, non-conductive.
  • the planar structure of the top 111 of the dielectric substrate is a square, and can also be a round or other polygonal structure.
  • the extended hole 114 provided in the center of the top 111 can reduce materials and reduce the weight of the integrated dielectric substrate 11.
  • the top radiation circuit 121 provided on the top 111 of the dielectric substrate has a circuit shape consistent with the planar shape of the top 111 of the dielectric substrate 11.
  • On the top radiating circuit 121 with the central axis of the dielectric substrate 11 as the axis, four groups of non-conductive regions 14 with the same structure are arranged, and the shape is "one" or " ⁇ " or other deformed shapes to improve the pole ⁇ Isolation.
  • the extension radiating circuit 122 extending downwardly from the extension hole 114 of the top portion 111 of the dielectric substrate and the connecting portion of the dielectric substrate support portion 112 toward the inner surface of the dielectric substrate support portion 112, that is, the wall of the extension hole 114, can greatly Improve the cross-polarization ratio index of the microstrip radiation unit 1.
  • Reinforcing ribs 15 are respectively arranged on the peripheral edges of the top 111 of the media substrate, forming a “mouth” skirt, and the center of the bottom surface of the top 111 is a “cross” to improve the structural strength of the integrated media substrate 11 and the plane of the top 111 The flatness of the structure.
  • the supporting portion 112 forms a hollow closed structure to enhance the structural strength of the integrated media substrate 11.
  • the supporting portion 112 may be a barrel shape or other closed shapes.
  • the welding part 113 includes four socket pins 1131 that rotate around 90°, and the socket pins 1131 are provided with “U”-shaped slots 1132 in two adjacent areas to further reduce the weight of the integrated dielectric substrate 11.
  • the microstrip radiating unit 1 includes a total of four groups of feeding circuits 13, each of which has the same structure and is distributed along the central axis 90° in turn.
  • the top feeder circuit 131 arranged on the bottom surface of the top 111 of the feeder circuit 13 and the radiation circuit 12 form a radiating unit coupling feed, and the middle connecting portion 132 connects the top feeder circuit 131 and the bottom welding portion 133 , In order to realize the continuous electrical connection of the entire feeder circuit 13.
  • the bottom welding part 133 of the wrapping pin 1131 is used for electrical connection with the feeding port of the feeding network 2 to realize signal excitation.
  • the bottom welding portion 133 may be configured as a pin-type plug-welding type structure, or may be configured as a disc-shaped soldering type structure, which is not specifically limited in the embodiment of the present disclosure.
  • the four groups of feed circuits 13 based on the above structure jointly realize the feed excitation of the dual-polarized microstrip radiation unit 1 to suppress high-order modes, further reduce the coupling between the two ports, and increase the dual-polarized oscillator +45° Polarization and -45° polarization pattern consistency and isolation. It should be noted that in the embodiments of the present disclosure, the coupling feed mode can effectively increase the matching bandwidth of the oscillator.
  • the microstrip radiation unit 1 provided by the embodiment of the present disclosure adopts a single-layer radiation circuit 12 structure.
  • the overall height of the microstrip radiation unit 1 is less than 0.15 ⁇ (where ⁇ represents the wavelength), and has good low profile characteristics; secondly, the microstrip The radiation unit 1 is specially equipped with an extended radiation circuit 122, which greatly improves the cross-polarization index of the microstrip radiation unit 1.
  • the microstrip radiation unit 1 is a 3D-MID molded interconnection device with very light weight and is suitable for Large-scale array antenna application, and the entire microstrip radiating unit 1 is a single component, which simplifies the supply chain, has a simple structure, improves the reliability and consistency of the radiating unit, and is suitable for large-scale manufacturing; in addition, the radiation of the microstrip radiating unit 1
  • the part and the feed part are all based on the center symmetry of the single component of the radiating unit.
  • the four solder pins can be blindly inserted into the four feed ports of the feed network 2 without additional identification, which significantly shortens the assembly time in antenna production and improves assembly efficiency , Very suitable for realizing automated production in large-scale array antenna applications.

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  • Computer Networks & Wireless Communication (AREA)
  • Waveguide Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

Selon des modes de réalisation, la présente invention concerne une unité rayonnante microruban et une antenne réseau. L'unité rayonnante microruban comprend un matériau de base diélectrique, un circuit de rayonnement et un circuit d'alimentation. Le matériau de base diélectrique est formé d'un seul tenant par moulage par injection, et le matériau de base diélectrique comprend une partie supérieure, une partie de support et une partie de soudage, la partie de support étant reliée respectivement à la partie supérieure et à la partie de soudage ; et le circuit de rayonnement est agencé sur une surface supérieure de la partie supérieure, et le circuit d'alimentation est agencé sur une surface inférieure de la partie supérieure et s'étend le long de la partie de support jusqu'à la partie de soudage. L'unité rayonnante microruban et l'antenne réseau décrites dans les modes de réalisation de la présente invention réalisent l'intégration de l'unité rayonnante, de sorte que l'unité rayonnante présente une structure simple et n'a pas besoin d'être assemblée, améliorant la fiabilité et la cohérence de l'unité rayonnante, et étant appropriée pour une fabrication à grande échelle. De plus, l'unité rayonnante microruban présente une bonne caractéristique de profil bas, réduisant efficacement la hauteur de l'unité rayonnante, réduisant davantage le poids de l'unité rayonnante, et obtenant une unité de rayonnante légère.
PCT/CN2019/115523 2019-01-22 2019-11-05 Unité rayonnante microruban et antenne réseau Ceased WO2020151297A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ES19912014T ES3037635T3 (en) 2019-01-22 2019-11-05 Microstrip radiation unit and array antenna
EP19912014.8A EP3916906B1 (fr) 2019-01-22 2019-11-05 Unité rayonnante microruban et antenne réseau

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910058017.5 2019-01-22
CN201910058017.5A CN109755721B (zh) 2019-01-22 2019-01-22 微带辐射单元和阵列天线

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WO2020151297A1 true WO2020151297A1 (fr) 2020-07-30

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EP (1) EP3916906B1 (fr)
CN (1) CN109755721B (fr)
ES (1) ES3037635T3 (fr)
WO (1) WO2020151297A1 (fr)

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CN113437506A (zh) * 2021-07-02 2021-09-24 中信科移动通信技术股份有限公司 一种贴片辐射单元与阵列天线
CN114243286A (zh) * 2021-12-03 2022-03-25 中国电子科技集团公司第二十九研究所 一种抗振动和冲击的微带馈电天线结构
EP4270641A4 (fr) * 2020-12-31 2024-12-11 Prose Technologies (Suzhou) Co., Ltd. Oscillateur d'antenne et antenne

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CN109755721B (zh) * 2019-01-22 2021-03-05 中信科移动通信技术有限公司 微带辐射单元和阵列天线
CN110165374B (zh) * 2019-05-27 2021-03-05 中信科移动通信技术有限公司 一种用于5g天线的辐射单元
WO2021000137A1 (fr) * 2019-06-30 2021-01-07 瑞声声学科技(深圳)有限公司 Oscillateur d'antenne
CN110416721A (zh) * 2019-08-27 2019-11-05 武汉虹信通信技术有限责任公司 辐射单元及阵列天线
CN112467343B (zh) * 2019-09-09 2023-07-04 普罗斯通信技术（苏州）有限公司 一种高增益小型化天线振子及天线
CN110571533A (zh) * 2019-09-29 2019-12-13 武汉虹信通信技术有限责任公司 Mimo天线的功分网络
CN113422201B (zh) * 2021-06-18 2023-07-07 京信通信技术(广州)有限公司 辐射单元及天线

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CN109755721A (zh) 2019-05-14
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