WO2020152967A1 - Matériau de plaque d'alliage de cuivre et procédé pour le fabriquer - Google Patents

Matériau de plaque d'alliage de cuivre et procédé pour le fabriquer Download PDF

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WO2020152967A1
WO2020152967A1 PCT/JP2019/045713 JP2019045713W WO2020152967A1 WO 2020152967 A1 WO2020152967 A1 WO 2020152967A1 JP 2019045713 W JP2019045713 W JP 2019045713W WO 2020152967 A1 WO2020152967 A1 WO 2020152967A1
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copper alloy
mass
less
plate material
value
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Japanese (ja)
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翔一 檀上
樋口　優
俊太 秋谷
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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Priority to CN201980080952.XA priority Critical patent/CN113166850B/zh
Priority to KR1020217016901A priority patent/KR102886959B1/ko
Priority to JP2020513364A priority patent/JP6762453B1/ja
Publication of WO2020152967A1 publication Critical patent/WO2020152967A1/fr
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a copper alloy plate and a method for manufacturing the same.
  • a copper alloy plate material for example, a copper alloy plate material used for electric/electronic parts and automobile in-vehicle parts, conventionally, a Cu—Ni—Si-based alloy (which is a high-strength copper alloy mainly strengthened by precipitation strengthening or work hardening) ( Corson alloys) have been widely used.
  • a Cu—Ni—Si-based alloy which is a high-strength copper alloy mainly strengthened by precipitation strengthening or work hardening
  • the Cu-Ni-Si alloy has a maximum conductivity of about 50% IACS, and when it is energized with a large current, the amount of heat generated by resistance increases, which causes the spring property of the contact portion to deteriorate and the terminal to be fixed. It is not suitable for use as a terminal material for a large current because the function of the terminal may be significantly reduced due to deterioration of the mold.
  • Patent Document 1 a Cu—Co—Si based alloy is used in place of the Cu—Ni—Si based alloy, and the frequency of equiaxed grains and twin grain boundaries in the recrystallization structure is controlled to control the plate material. It is disclosed that bendability and conductivity can be improved.
  • Patent Document 1 the Cu—Co—Si alloy strip described in Patent Document 1 has not been examined in terms of strain that greatly affects bending workability and strength, and there is room for further improvement in bending workability and strength. there were.
  • Patent Document 2 in a copper alloy containing Mg in the range of 3.3 atomic% or more and 6.9 atomic% or less, the strain introduced during processing was measured by the SEM-EBSD method in the rolling width direction. On the other hand, it is said that the bending workability can be improved by keeping the value within the range defined by the ratio of the measurement points having a low CI value on the vertical surface (that is, the TD surface).
  • Patent Document 3 in titanium copper containing Ti in an amount of 2.0 to 4.0% by mass, the area ratio having a reliability index (CI value) of 0.2 or less measured by SEM-EBSD method for surface strain It is said that the bending workability can be improved by setting the ratio to 20% or less.
  • CI value reliability index
  • Patent Document 2 improvement in bending workability is recognized, but there is no description about Cu—Co—Si alloys.
  • conductivity is 31.8 to 45. Only a low value in the range of 1% IACS was obtained, and the numerical value of conductivity is not shown in Patent Document 3.
  • An object of the present invention is to use a Cu—Co—Si alloy having a higher conductivity than a Cu—Ni—Si alloy, and to achieve excellent bending workability and high strength at a high level. And to provide a manufacturing method thereof.
  • the present inventor uses a copper alloy material having a Cu—Co—Si alloy composition having a higher electrical conductivity than Cu—Ni—Si alloy to produce a copper alloy sheet material by rolling.
  • a crystal orientation analysis was performed on a vertical cross section parallel to, by an electron backscattering diffraction (EBSD) method, the area ratio of a measurement spot region having a small reliability index (CI value) in the vertical cross section was controlled to be low, and by achieve an appropriate ratio of the average value of the reliability index (CI value) in each of the surface portion and the central portion of the longitudinal section (CI S / CI C ratio), it is possible to develop processed structure, its As a result, they have found that the strength can be improved while ensuring bending workability, and have completed the present invention.
  • EBSD electron backscattering diffraction
  • the gist of the present invention is as follows.
  • (I) A copper alloy plate containing 0.3 to 2.5 mass% of Co and 0.1 to 0.7 mass% of Si, and the balance of Cu and unavoidable impurities.
  • the crystal orientation analysis performed on the longitudinal section parallel to the rolling direction of the alloy sheet material by the electron backscatter diffraction (EBSD) method showed that all the measurement of the measurement spot area where the reliability index (CI value) was 0.2 or less.
  • the area ratio of the spot region is 40% or less, and the longitudinal section is divided into a pair of surface layer portions each including both surfaces of the plate material and a central portion located between the pair of surface layer portions.
  • Fe 0.02 to 0.5 mass%, Mg 0.01 to 0.3 mass%, Mn 0.01 to 0.5 mass%, Zn 0.01 to 0.15 mass% % And Zr are at least one optional additive selected from the group consisting of 0.01 to 0.15 mass %, and the balance is a copper alloy sheet material having an alloy composition of Cu and inevitable impurities, A crystal orientation analysis performed by an electron backscattering diffraction (EBSD) method on a longitudinal section parallel to the longitudinal direction of the copper alloy plate material shows that a reliability index (CI value) is 0.2 or less in a measurement spot region.
  • EBSD electron backscattering diffraction
  • the copper alloy plate material according to (II) which contains the optional additive component in a total amount of 1.5% by mass or less.
  • the temperature rising rate in the homogenizing heat treatment step [step 3] is set to 10 to 110° C./sec and the holding temperature is 950 to 1250° C.
  • the achievable temperature in the aging heat treatment step [step 9] is 450 to 650° C. and the holding time of 500 to 20000 sec
  • the second cooling In the inter-rolling step [Step 10] when the processing rate per pass is 10% or more and 40% or less, and the rolling roll diameter is R, the processing amount is ⁇ h, and the final plate thickness is h, the parameter M is A method for producing a copper alloy sheet material, which is represented by the following formula (1) and is 6 or more and 40 or less.
  • the copper alloy sheet of the present invention contains 0.3 to 2.5 mass% of Co and 0.1 to 0.7 mass% of Si, and further contains 0.05 to 1.0 mass of Cr, if necessary. %, Ni 0.05 to 0.7 mass %, Fe 0.02 to 0.5 mass %, Mg 0.01 to 0.3 mass %, Mn 0.01 to 0.5 mass %, An alloy containing 0.01 to 0.15% by mass of Zn and 0.01 to 0.15% by mass of Zr, and at least one optional additive component selected from the group consisting of Cu and unavoidable impurities in the balance.
  • a copper alloy sheet having a composition, and a crystal orientation analysis performed by an electron backscattering diffraction (EBSD) method on a longitudinal section parallel to the rolling direction of the copper alloy sheet has a reliability index (CI value) of 0.
  • An area ratio of the measurement spot areas of 2 or less to all the measurement spot areas is 40% or less, and a pair of surface layer portions each including both surfaces of the plate having the vertical cross section and a pair of surface layer portions.
  • a copper alloy material having an alloy composition substantially the same as the alloy composition of the above copper alloy sheet is cast into a step [step 1] and a first chamfering step [step 2].
  • the step [step 8], the aging heat treatment step [step 9], the second cold rolling step [step 10] and the annealing step [step 11] are sequentially performed, and the temperature rising rate in the homogenization heat treatment step [step 3] is set to 10 ⁇ 110°C/sec and a holding temperature of 950 to 1250°C, the cooling start temperature in the surface layer portion of the plate material in the cooling step [step 5] is 680 to 850°C, and the average cooling rate is 5 to 20°C/sec.
  • the ultimate temperature is 450 to 650° C. and the holding time is 500 to 20,000 seconds
  • the working rate per pass is 10%.
  • the rolling roll diameter is R
  • the working amount is ⁇ h
  • the final plate thickness is h
  • the parameter M is represented by the following formula (1), and is 6 or more and 40 or less. According to the above, the above-mentioned copper alloy plate material can be manufactured.
  • FIG. 1 is a schematic diagram for explaining a method of obtaining a reliability index (CI value) by performing a crystal orientation analysis by an EBSD method on a copper alloy sheet material of the present invention in a longitudinal section parallel to the rolling direction.
  • the copper alloy sheet according to the present invention is a copper alloy sheet containing Co in an amount of 0.3 to 2.5% by mass and Si in an amount of 0.1 to 0.7% by mass, with the balance being Cu and inevitable impurities. Therefore, in the crystal orientation analysis performed by the electron backscattering diffraction (EBSD) method on the longitudinal section parallel to the rolling direction of the copper alloy sheet material, the numerical value of the reliability index (CI value) is 0.2 or less.
  • EBSD electron backscattering diffraction
  • the area ratio is 40% or less, and the longitudinal section is divided into a pair of surface layer portions each including both surfaces of the plate material, and a central portion located between the pair of surface layer portions, the average value of the reliability index (CI value) of the surface layer portion of the pair and CI S, the average value of the reliability index (CI value) of the central portion when the CI C, the CI S for CI C
  • the ratio (CI S /CI C ratio) is 0.8 or more and 2.0 or less.
  • the copper alloy sheet material of the present invention contains 0.3 to 2.5 mass% of Co and 0.1 to 0.7 mass% of Si.
  • Co (cobalt) is finely precipitated in the mother phase (matrix) of Cu as a second phase particle consisting of a simple substance or a compound with Si, for example, in a size of about 50 to 500 nm. It is an important component which has effects of precipitation hardening by suppressing dislocation movement, further suppressing grain growth to increase material strength by refining crystal grains, and improving bending workability. In order to exert such an effect, it is necessary that the Co content is 0.3% by mass or more. Further, Co has a smaller decrease rate of conductivity when it forms a solid solution than Ni, but when the Co content exceeds 2.5 mass %, the decrease in conductivity becomes remarkable and exceeds 50% IACS.
  • the Co content needs to be 2.5 mass% or less.
  • the conductivity is about 38%IACS, but the Co content is 0.3.
  • the copper alloy sheet material of the present invention in the range of up to 2.5% by mass, a high numerical value is obtained in which the electrical conductivity exceeds 50% IACS.
  • the tensile strength of the copper alloy sheet material of the present invention depends on the manufacturing conditions, but by adopting specific manufacturing conditions, about 600 MPa can be obtained after aging precipitation, and a copper alloy made of a Cu-Ni-Si-based alloy High strength equivalent to plate material can be obtained.
  • the Co content is preferably in the range of 0.8 to 1.6 mass% in order to satisfy both properties of tensile strength and conductivity in a well-balanced manner. Therefore, the Co content is set in the range of 0.3 to 2.5 mass %.
  • Si silicon finely precipitates in the Cu mother phase (matrix) as precipitates of second-phase particles composed of a compound together with Co, Cr, etc., and these precipitates suppress dislocation movement to cause precipitation hardening. Further, it is an important component having an action of suppressing grain growth and increasing the material strength by refining the crystal grains. In order to exert such an effect, the Si content needs to be 0.1% by mass or more. Further, when the Si content exceeds 0.7 mass %, the conductivity is remarkably lowered and the conductivity exceeding 50% IACS cannot be obtained. Therefore, the Si content is 0.7 mass% or less. There is a need to. Therefore, the Si content is set to the range of 0.1 to 0.7 mass %. The Si content is preferably in the range of 0.2 to 0.5 mass% in order to satisfy both properties of tensile strength and conductivity in a well-balanced manner.
  • the copper alloy sheet material of the present invention contains Co and Si as essential essential contained components, and further contains 0.05 to 1.0 mass% of Cr and 0.05 to 0% of Ni as optional sub-additive components. 0.7 mass%, Fe 0.02 to 0.5 mass%, Mg 0.01 to 0.3 mass%, Mn 0.01 to 0.5 mass%, Zn 0.01 to 0.15 It may contain at least one optional additive component selected from the group consisting of mass% and Zr of 0.01 to 0.15 mass %.
  • Cr 0.05 to 1.0 mass%
  • Cr Cr (chromium) is finely precipitated as a compound or a simple substance in the matrix of Cu as a compound or a simple substance in the form of a precipitate having a size of, for example, about 50 to 500 nm, and this precipitate suppresses dislocation movement. It is a component that has the effect of precipitation hardening and further increasing the material strength by suppressing grain growth and refining the crystal grains, and also improving bendability.
  • the Cr content is preferably 0.05% by mass or more. Further, when the Cr content is 1.0% by mass or less, the rate of decrease in conductivity is small and the conductivity over 50% IACS tends to be obtained. Therefore, the Cr content is preferably 0.05 to 1.0% by mass.
  • Ni nickel
  • Ni (nickel) is finely precipitated as a compound or simple substance in the matrix of Cu (matrix) in the form of a precipitate having a size of, for example, about 50 to 500 nm, and this precipitate suppresses dislocation movement. It is a component which has effects of precipitation hardening, further suppressing grain growth, increasing the material strength by refining the crystal grains, and improving bending workability.
  • the Ni content is preferably 0.05% by mass or more. Further, when the Ni content is 0.7% by mass or less, the rate of decrease in conductivity is small, and a conductivity over 50% IACS tends to be obtained. Therefore, the Ni content is preferably 0.05 to 0.7 mass %.
  • Fe 0.02 to 0.5 mass%
  • Fe (iron) is a component having an effect of improving product characteristics such as conductivity, strength, stress relaxation characteristics, and plating properties.
  • the Fe content is preferably 0.02 mass% or more. Further, if the Fe content is more than 0.5% by mass, not only the improvement effect cannot be expected, but also the conductivity tends to decrease. Therefore, the Fe content is preferably 0.02 to 0.5 mass %.
  • Mg 0.01 to 0.3 mass%
  • Mg magnesium
  • the Mg content is preferably 0.01% by mass or more. If the Mg content is more than 0.3% by mass, the conductivity tends to decrease. Therefore, the Mg content is preferably 0.01 to 0.3 mass %.
  • Mn 0.01 to 0.5 mass%
  • Mn manganese
  • Mn forms a solid solution in the parent phase to improve the rolling workability, suppresses the rapid development of grain boundary reaction type precipitation, and controls the discontinuous precipitation cell structure generated by grain boundary reaction type precipitation. It is a component that has an enabling effect.
  • the Mn content is preferably 0.01% by mass or more. Further, if the Mn content is more than 0.5% by mass, not only the improvement effect cannot be expected, but also the conductivity may decrease and the bendability may deteriorate. Therefore, the Mn content is preferably 0.01 to 0.5 mass %.
  • Zn 0.01 to 0.15 mass%
  • Zn (zinc) is a component that has an effect of improving bending workability and improving adhesion and migration characteristics of Sn plating and solder plating.
  • the Zn content is preferably 0.01% by mass or more. Further, if the Zn content is more than 0.15 mass %, the conductivity tends to decrease. Therefore, the Zn content is preferably 0.01 to 0.15 mass %.
  • Zr 0.01 to 0.15 mass%
  • Zr zirconium
  • the Zr content is preferably 0.01 mass or more. Further, if the Zr content is more than 0.15 mass %, a compound is formed, and the conductivity and the press punching workability tend to be remarkably lowered. Therefore, the Zr content is preferably 0.01 to 0.15% by mass.
  • Total content of optional additives 1.5 mass% or less
  • the total content of the optional additive components should be 1.5% by mass or less. Preferably. This is because, if the total content of the optional additional components is 1.5% by mass or less, the press punching workability and the conductivity will not be significantly reduced.
  • the balance consists of Cu (copper) and unavoidable impurities.
  • unavoidable impurities refers generally to metal products, which are present in the raw materials and are inevitably mixed in the manufacturing process. It is an allowable impurity because it does not affect the product characteristics.
  • the components that can be cited as the inevitable impurities include silver (Ag), tin (Sn), oxygen (O), and the like. The upper limit of the content of these components may be 0.05 mass% for each of the above components, and 0.20 mass% for the total amount of the above components.
  • the copper alloy sheet of the present invention has a reliability index (CI value) of 0.2 or less in the crystal orientation analysis performed by the electron backscattering diffraction (EBSD) method on the longitudinal section parallel to the rolling direction of the copper alloy sheet.
  • the area ratio of the measurement spot area occupying in all the measurement spot areas is 40% or less, and the longitudinal section is formed into a pair of surface layer portions including both surfaces of the plate material and a pair of surface layer portions.
  • the present inventor has conducted a study to make excellent bending workability and high strength compatible with each other at a high level by using a Cu—Co—Si alloy having higher conductivity than the Cu—Ni—Si alloy. It was found that the bending workability deteriorates as the strain introduced into the rolled plate material, particularly the surface layer portion of the plate material, increases.
  • a crystal obtained by electron backscattering diffraction (EBSD) was applied to a longitudinal section parallel to the rolling direction of the copper alloy plate material.
  • the reliability index CI in each measurement spot area is calculated, and the area ratio of the measurement spot area having a reliability index (CI value) of 0.2 or less in all the measurement spot areas is 40% or less.
  • CI value reliability index
  • the area ratio is 40% or less, a high level of bending workability may not be obtained in some cases.
  • the present inventor has further conducted intensive was conducted study, in the vertical section, the average CI S reliability index of the surface layer portion (CI value), the average value of the reliability index of the central portion (CI value) by the ratio of CI S a (CI S / CI C ratio) of 0.8 to 2.0 for CI C, it made it possible to achieve both excellent bending property and high strength at a high level.
  • the CI S / CI C ratio is less than 0.8, the surface distortion surface layer of the sheet material is compared to the central portion (inside) is too large, the proportion of bending workability for tensile strength of the plate becomes lower Therefore, it becomes impossible to achieve a good balance between tensile strength and bending workability.
  • CI S / CI C ratio when the CI S / CI C ratio is greater than 2.0, although the bending ratio of workability is increased relative to the tensile strength of the plate material, uneven distribution of strain in the center portion of the plate (inside) is increased This is because there is a high possibility that variations in shape will occur during press working. Therefore, CI S / CI C ratio of 0.8 to 2.0, preferably 1.0 to 1.8.
  • the calculation method of the reliability index (CI value) is as follows.
  • the crystal orientation measured by the electron backscatter diffraction (EBSD) method is used for each measurement spot area (spot size: 0.5 ⁇ m ⁇ 0.5 ⁇ m) by using analysis software. ) was calculated.
  • a longitudinal section parallel to the rolling direction of the copper alloy sheet in other words, a section perpendicular to the rolling direction of the copper alloy sheet, is mechanically polished with water-resistant abrasive paper and diamond abrasive before measurement by the EBSD method. After that, finish polishing was performed using a colloidal silica solution.
  • the measurement was performed by the EBSD method under the conditions of a measurement area of 64 ⁇ 10 4 ⁇ m 2 (800 ⁇ m ⁇ 800 ⁇ m) and a scan step of 0.1 ⁇ m.
  • the scan step was performed in 0.1 ⁇ m steps in order to measure fine crystal grains.
  • an inverse pole figure IPF Inverse Pole Figure
  • the electron beam was generated by thermoelectrons from the W filament of the scanning electron microscope.
  • the probe diameter at the time of measurement is about 0.015 ⁇ m.
  • OIM5.0 (trade name) manufactured by TSL Solutions Co., Ltd. was used.
  • FIG. 1 illustrates a method for obtaining a reliability index (CI value) by performing crystal orientation analysis (mapping) by the EBSD method on a copper alloy sheet material 10 of the present invention in a longitudinal section parallel to the rolling direction. It is a schematic diagram. As shown in FIG. 1, each measurement spot region is scanned in the longitudinal direction parallel to the rolling direction with an electron beam from one surface layer portion 11a through the central portion 12 to the other surface layer portion 11b, and all the scanning spots are scanned. The area ratio occupied by the measurement spot region having a reliability index (CI value) of 0.2 or less was calculated with respect to the measurement spot region.
  • CI value reliability index
  • the surface layer portions 11a and 11b of the plate material in the present invention mean plate material portions corresponding to 1 ⁇ 8 of the plate thickness respectively from both sides of the plate material, and the central portion 12 is a pair of surface layer portions 11a. And 11b means a sandwiched plate material portion.
  • the average value CI S reliability index of the surface layer portion of the plate member (CI value), method of calculating the average value CI C reliability index of the central portion of the plate member (CI value), the thickness direction (FIG plate material 10 vertical lines) are drawn on the longitudinal section of the plate material at predetermined intervals (for example, 20 ⁇ m intervals), and from the distribution of the CI value on each line, the surface layer portion and the central portion of the plate material are respectively extracted.
  • the average value of the reliability index (CI value) was calculated. For the measurement, 10 fields of view were measured for each strip, and the average value was used as the value.
  • the reliability index (CI value) of this EBSD method is a value measured by the analysis software OIM Analysis of the EBSD device, and the crystal pattern of the evaluation/analysis result is not good, that is, the processed structure is The greater the distortion associated with, the lower the CI value.
  • the tensile strength when pulled in parallel with the rolling direction is preferably 600 MPa or more.
  • the measurement of the tensile strength was performed on three test pieces of No. 13B specified in JIS Z2241:2011 cut out from the rolling parallel direction, and the tensile strength was an average value of the tensile strengths obtained from the three test pieces.
  • the copper alloy sheet material of the present invention preferably has a conductivity of more than 50% IACS.
  • the electrical conductivity can be calculated from the numerical value of the specific resistance measured by the four-terminal method in a constant temperature bath kept at 20°C ( ⁇ 0.5°C).
  • a plurality of test pieces with a width of 10 mm and a length of 30 mm were sampled from each test material so that the rolling direction and the longitudinal direction of the test pieces were parallel, and a W-shaped jig with a bending angle of 90 degrees and a bending radius of 0 mm.
  • a W-shaped jig with a bending angle of 90 degrees and a bending radius of 0 mm. was used to perform a W bending test.
  • unevenness of the bent surface of the 90°W bending test piece was measured with a laser microscope at a pitch of 0.1 ⁇ m.
  • the root mean square roughness Rq is calculated in accordance with JIS B0601:2013 by substituting it into the following equation (2).
  • the small surface roughness of the bent portion indicates that the bending workability of the material is good.
  • 1 is a reference length.
  • a copper alloy material having substantially the same alloy composition as the above-described alloy composition of the copper alloy sheet is cast in the step [step 1], Chamfering step [step 2], homogenizing heat treatment step [step 3], hot rolling step [step 4], water cooling step [step 5], second chamfering step [step 6], first cold rolling step [Ste 7], solution heat treatment step [step 8], aging heat treatment step [step 9], second cold rolling step [step 10] and annealing step [step 11] are sequentially performed, and the homogenization heat treatment step [step 3 ], the holding temperature is 950 to 1250° C., the cooling start temperature in the surface layer part of the plate material in the cooling step [step 5] is 680 to 850° C., and the average cooling rate is 5 To 20° C./sec, the temperature reached in the aging heat treatment step [step 9] is 450 to 650° C., the holding time is 500 to 20000 seconds, and the second cold rolling step [
  • the homogenizing heat treatment step [step 3] and the aging heat treatment step [step 9] are controlled, and the cooling step [after the hot rolling step [step 4]] is performed. 5] and controlling the second (final) cold rolling step [step 10]. That is, in the homogenizing heat treatment step [step 3], the temperature rising rate is 10 to 110° C./sec and the holding temperature is 950 to 1250° C., and in the cooling step [step 5] performed after the hot rolling step [step 4].
  • the cooling start temperature in the surface layer part of the plate material is 680 to 850° C.
  • the average cooling rate is 5 to 20° C./sec
  • the ultimate temperature in the aging heat treatment step [step 9] is 450 to 650° C. and the holding time is 500 to 20,000.
  • the working rate per pass is 10% or more and 40% or less
  • M ⁇ (R ⁇ h) 0.5 ⁇ / It is necessary to set the parameter M represented by h to 6 or more and 40 or less.
  • (I) Casting process [Process 1] In the casting step, a copper alloy material having the alloy components shown in Table 1 is melted in a high-frequency melting furnace in the air, and the ingot is cast into a predetermined shape (for example, thickness 300 mm, width 500 mm, length 3000 mm). To manufacture.
  • the alloy composition of the copper alloy material may not always completely match the alloy composition of the copper alloy sheet material produced by adhering to the melting furnace or volatilizing depending on the additive components in each step of production. However, it has an alloy composition substantially the same as that of the copper alloy sheet.
  • the first chamfering step removes the oxide film formed on the surface of the ingot obtained in the casting step (step 1) in which the copper alloy material is melted, so that both sides of the ingot have a thickness of 0.5 mm or more. It is a process of scraping off just that much.
  • the temperature rising rate is 10 to 110° C./sec and the holding temperature is 950 to 1250° C. If the temperature rising rate in the homogenizing heat treatment step is less than 10°C/sec or more than 110°C/sec or the holding temperature is less than 950°C, the solid solution of the crystallized product produced during casting becomes insufficient, and the product is produced. In addition, it becomes impossible to obtain a satisfactory level of strength and conductivity in the copper alloy sheet material. On the other hand, if the holding temperature in the homogenizing heat treatment step exceeds 1250° C., the vicinity of the crystal grain boundaries is partially in the liquid phase, cracks are likely to occur during hot rolling, and production may not be possible in some cases.
  • the hot rolling step is a step in which the ingot immediately after the homogenizing heat treatment is hot rolled to a predetermined thickness to produce a hot rolled sheet.
  • the hot rolling conditions are, for example, preferably a rolling temperature of 600 to 1100° C., a rolling frequency of 4 or more, and a total rolling rate of 60% or more.
  • the cooling step is also performed after the hot rolling step (step 4), and is a surface layer portion (a plate material corresponding to 1/8 of the plate thickness from the surface of the plate material) of the plate material (hot rolled plate) in the cooling step. It is necessary to set the cooling start temperature in (part) to 680 to 850°C and the average cooling rate to 5 to 20°C/sec. If the cooling start temperature is lower than 680° C. or the average cooling rate is lower than 5° C./sec, coarse precipitation of solute elements will proceed during cooling, and the copper alloy sheet produced will not have satisfactory strength and electrical conductivity. Because. On the other hand, if the cooling start temperature exceeds 850° C.
  • the average cooling rate exceeds 20° C./sec, the formation of the rolling structure becomes insufficient, which adversely affects the bendability after the final step.
  • the average cooling rate exceeds 20° C./sec, the precipitation of the surface is too small, the crystal grain coarsening of the surface progresses in the solution treatment step, and strain easily accumulates, and the target CI value is obtained. Is not satisfied, and bending workability deteriorates.
  • the second chamfering step is a step of scraping both the front and back surfaces of the hot rolled material by a thickness of 0.5 mm or more in order to remove the oxide film on the surface of the hot rolled material.
  • the first cold rolling step is a step of producing a cold rolled sheet by performing cold rolling until a predetermined thickness is obtained after the second chamfering step. It is preferable that the cold rolling condition is, for example, two or more rolling cycles and a total rolling work rate of 50% or more.
  • the solution heat treatment step is a step of performing heat treatment at a temperature rising rate of 1 to 150° C./second, an ultimate temperature of 800 to 1000° C., a holding time of 1 to 300 seconds, and a cooling rate of 1 to 200° C./second.
  • the additional cold rolling step is a step that is optionally performed after the solution heat treatment step [step 8] and before the aging heat treatment step [step 9], and is not an essential step.
  • the rolling conditions are, for example, one or more rolling cycles and a total rolling rate of 10 to 70%.
  • Step 10 Second (final) cold rolling step
  • the parameter M exceeds 40, the load on the rolling equipment becomes extremely large, and Because it is not the target.
  • the number of times of rolling is 2 or more and the total rolling rate is 10% or more.
  • the parameter M becomes smaller as R and ⁇ h become smaller or h becomes larger.
  • the CI value when R becomes small, the contact length between the material and the roll is reduced, and only the vicinity of the surface is sheared, so that the strain amount becomes relatively high and the inside is uniform.
  • CI S / CI C for not distorted state tends to be low.
  • the parameter M increases as R or ⁇ h increases or h decreases.
  • the rolling roll diameter R by properly setting the etching amount ⁇ h and final thickness h, CI value, CI S / CI C, more it is possible to control the strength and bending workability.
  • the annealing step is a heat treatment performed after the second (final) cold rolling step.
  • the annealing conditions are preferably, for example, an ultimate temperature of 200 to 600° C. and a holding time of 1 to 3600 seconds.
  • the copper alloy plate material of the present invention is suitable for use in, for example, lead frames, connectors, terminal materials, relays, switches, sockets for in-vehicle parts and electric/electronic devices.
  • the cooling step (step 5) was performed under the conditions of the cooling start temperature and the cooling rate, and then both front and back surfaces of the hot rolled material were shaved by a thickness of 0.5 mm or more in order to remove the oxide film on the surface.
  • the first cold rolling step (step 7) is performed under the condition that the number of rolling times is 2 times or more and the total working rate is 50% or more, and then the temperature rising rate is 1 to
  • the solution heat treatment step (step 8) is performed under the conditions of 150° C./second, ultimate temperature of 800 to 1000° C., holding time of 1 to 300 seconds, and cooling rate of 1 to 200° C./second.
  • step 9 After performing the aging heat treatment step (step 9) under the condition of the holding time, under the conditions of the rolling rate of 2 times or more and the total working rate of 5% or more so that the processing rate per pass and the parameter M shown in Table 2 are obtained.
  • the second cold rolling step (step 10) was performed at that temperature, and then the annealing step (step 11) was performed at an ultimate temperature of 200 to 600° C. and a holding time of 1 to 3600 seconds. , 6 to 8 and 12, and Comparative Examples 1, 3, 8 and 9, after the solution heat treatment step and before the aging heat treatment step, an additional cold rolling step (step 12) was performed at a total rolling work rate of 5 to It was further performed at 70% In this way, the copper alloy sheet material of the present invention was produced.
  • [2] EBSD measurement method After mechanically polishing a vertical section parallel to the rolling direction of each of the prepared test materials (copper alloy plate materials) with water-resistant abrasive paper and diamond abrasive grains, a colloidal silica solution is used. Finish polishing was performed. Then, the measurement was performed by the EBSD method under the conditions of a measurement area of 64 ⁇ 10 4 ⁇ m 2 (800 ⁇ m ⁇ 800 ⁇ m) and a scan step of 0.1 ⁇ m. The scan step was performed in 0.1 ⁇ m steps in order to measure fine crystal grains. In the analysis, an inverse pole figure IPF (Inverse Pole Figure) was confirmed by the analysis from the EBSD measurement result of 64 ⁇ 10 4 ⁇ m 2 .
  • IPF Inverse Pole Figure
  • the electron beam was generated by thermoelectrons from the W filament of the scanning electron microscope.
  • the probe diameter at the time of measurement is about 0.015 ⁇ m.
  • OIM5.0 (trade name) manufactured by TSL Solutions Co., Ltd. was used.
  • the reliability index (CI value) of the EBSD method is a value measured by the analysis software OIM Analysis of the EBSD device.
  • Copper alloy plate material 11a, 11b Surface layer part of copper alloy plate material 12 Central part of copper alloy plate material

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Abstract

L'invention concerne un matériau de plaque d'alliage de cuivre qui a une composition d'alliage comprenant de 0,3 à 2,5 % en masse de Co, de 0,1 à 0,7 % en masse de Si, le reste étant constitué de Cu et d'impuretés inévitables. Lorsqu'une section longitudinale du matériau de plaque d'alliage de cuivre qui est parallèle à la direction de laminage du matériau de plaque d'alliage de cuivre est soumise à une analyse d'orientation cristalline par un procédé d'EBSD, le rapport de la surface d'une région de point de mesure ayant un indice de fiabilité (valeur CI) de 0,2 ou moins à la surface totale de toutes les régions de point de mesure est inférieur ou égal à 40 %. Lorsque la section longitudinale est divisée en une paire de parties de couche de surface comprenant respectivement les deux surfaces du matériau de plaque et une partie centrale située entre la paire de parties de couche de surface et que la valeur moyenne des indices de fiabilité (valeurs CI) de la paire de parties de couche de surface est définie comme CIS et la valeur moyenne des indices de fiabilité (valeurs CI) de la partie centrale est définie comme CIC, le rapport de CIS à CIC (c'est-à-dire, CIS/CIC) est de 0,8 à 2,0 inclus. Le matériau de plaque d'alliage de cuivre peut présenter à la fois une excellente aptitude au façonnage en flexion et une résistance élevée à un niveau élevé.
PCT/JP2019/045713 2019-01-22 2019-11-21 Matériau de plaque d'alliage de cuivre et procédé pour le fabriquer Ceased WO2020152967A1 (fr)

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Citations (5)

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JP2011219843A (ja) * 2010-04-14 2011-11-04 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP2012207264A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP2015203141A (ja) * 2014-04-15 2015-11-16 三菱電機株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金及びその製造方法
JP2016060957A (ja) * 2014-09-19 2016-04-25 Ｊｘ金属株式会社 電子部品用チタン銅及びその製造方法
WO2018198995A1 (fr) * 2017-04-26 2018-11-01 古河電気工業株式会社 Feuille d'alliage de cuivre et son procédé de fabrication

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EP2298945B1 (fr) * 2008-06-03 2014-08-20 The Furukawa Electric Co., Ltd. Matériau de tôle d alliage de cuivre et procédé de fabrication de celui-ci
JP5534610B2 (ja) 2011-03-31 2014-07-02 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｃｏ−Ｓｉ系合金条
JP5903838B2 (ja) 2011-11-07 2016-04-13 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅素材、電子機器用銅合金の製造方法、電子機器用銅合金塑性加工材及び電子機器用部品

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JP2011219843A (ja) * 2010-04-14 2011-11-04 Jx Nippon Mining & Metals Corp 電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP2012207264A (ja) * 2011-03-29 2012-10-25 Jx Nippon Mining & Metals Corp 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP2015203141A (ja) * 2014-04-15 2015-11-16 三菱電機株式会社 Ｃｕ−Ｃｏ−Ｓｉ合金及びその製造方法
JP2016060957A (ja) * 2014-09-19 2016-04-25 Ｊｘ金属株式会社 電子部品用チタン銅及びその製造方法
WO2018198995A1 (fr) * 2017-04-26 2018-11-01 古河電気工業株式会社 Feuille d'alliage de cuivre et son procédé de fabrication

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