WO2020155820A1 - Module de caméra, dispositif électronique et dispositif de véhicule - Google Patents

Module de caméra, dispositif électronique et dispositif de véhicule Download PDF

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Publication number
WO2020155820A1
WO2020155820A1 PCT/CN2019/121252 CN2019121252W WO2020155820A1 WO 2020155820 A1 WO2020155820 A1 WO 2020155820A1 CN 2019121252 W CN2019121252 W CN 2019121252W WO 2020155820 A1 WO2020155820 A1 WO 2020155820A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
camera module
circuit board
heat conducting
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/121252
Other languages
English (en)
Chinese (zh)
Inventor
陈定元
陈文彬
苏周斌
陈磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Horizon Robotics Technology Research and Development Co Ltd
Original Assignee
Beijing Horizon Robotics Technology Research and Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Horizon Robotics Technology Research and Development Co Ltd filed Critical Beijing Horizon Robotics Technology Research and Development Co Ltd
Publication of WO2020155820A1 publication Critical patent/WO2020155820A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R11/04—Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils

Definitions

  • This application relates to the field of camera technology, in particular to a camera module, electronic equipment and vehicle equipment having the same.
  • the power of the corresponding image sensor is increasing; and the overall size of the camera module is becoming smaller and smaller This is very unfavorable to the overall heat dissipation of the camera module.
  • the high-power image sensor's own temperature will rise quickly, even exceeding the normal operating temperature of the image sensor, resulting in failure of the image sensor or severely reduced life span; higher image sensor temperature will cause the camera
  • the temperature of the air inside the module increases, making the electronic components in the camera module work at a higher temperature, resulting in a reduction in the life of the electronic components, which is not conducive to the quality of the camera.
  • the focal length of the camera module is assembled at room temperature, the focal length of the lens and the image sensor will have a certain linear expansion due to the increase in the temperature of the material, resulting in unexpected changes in the focal length, affecting imaging The clarity.
  • the heat dissipation effect of the camera in the prior art is not satisfactory, especially for a camera with a high-power image sensor.
  • the embodiment of the present application provides a camera module, including: a first housing and a second housing, which are located at two ends of the camera module and accommodate components of the camera module; and the third housing is located in the first housing. Between the housing and the second housing and fixedly connected to the first housing and the second housing; the first circuit board is located between the first housing and the third housing; the first heat conducting member A first side of the first heat conducting member is in contact with the first circuit board, and a second side of the first heat conducting member opposite to the first side is in contact with the third housing.
  • an electronic device including the above-mentioned camera module.
  • a vehicle device including the above-mentioned electronic device.
  • the housing of the camera module is divided into three parts, and the heat generated by the electronic components is quickly transferred to the intermediate housing through the heat conducting member, and then the intermediate housing with high thermal conductivity is used to dissipate to the surrounding air ,
  • the temperature inside the camera is significantly reduced, and the heat dissipation effect of the camera during use is improved.
  • the structure of the camera module is simple, which will not affect its assembly efficiency.
  • Fig. 1 is an exploded schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • Fig. 2 is an exploded schematic diagram of a camera module according to another exemplary embodiment of the present application.
  • Fig. 3 is an exploded schematic diagram of a part of the camera module including a third housing according to an exemplary embodiment of the present application.
  • Fig. 4 is a partial cross-sectional view of a third housing according to another exemplary embodiment of the present application.
  • Fig. 5 is a schematic diagram of a second housing according to an exemplary embodiment of the present application.
  • Fig. 6 is an exploded schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • Fig. 7 is an exploded schematic diagram of a camera module according to another exemplary embodiment of the present application.
  • Fig. 8 is a schematic diagram of an assembled camera module according to an exemplary embodiment of the present application.
  • the housing of the camera module is generally composed of two parts, namely, composed of two metal housings.
  • the heat dissipation of the camera module also uses these two metal housings to dissipate heat to the surrounding air.
  • the power of the image sensor is also increasing.
  • the temperature inside the camera module will rise quickly, even exceeding the normal operating temperature of the image sensor, which seriously affects the camera module.
  • the work of the internal electronic components, especially the work of the image sensor further reduces the quality of the camera module and affects the definition of imaging.
  • the current heat dissipation method of vehicle-mounted camera generally uses a two-part metal shell to dissipate heat.
  • part of the heat is conducted to the front shell through the mounting post of the PCB (printed circuit board) that contacts the shell.
  • Part of the heat is conducted through the air to the front shell and the rear shell, and finally the two shells radiate the heat to the surrounding air.
  • the extremely low thermal conductivity of air there is an extremely thin air layer on the contact surface between the PCB and the housing mounting column, which has a large thermal resistance, and the heat conducted to the housing through the PCB is extremely limited; similarly, the remaining heat is conducted through the air
  • the speed and heat of the enclosure are also extremely limited. Therefore, the heat dissipation effect of the vehicle-mounted camera is poor.
  • the housing of the camera module in this application is different from a two-part housing.
  • the housing of the camera module in this application includes at least three parts.
  • the heat generated by the electronic components is quickly transferred to the housing located in the middle through the thermally conductive member.
  • the use of the middle shell with high thermal conductivity to emit to the surrounding air significantly reduces the temperature inside the camera module and improves the heat dissipation effect of the camera during use.
  • the structure of the camera module is simple and does not affect its assembly efficiency.
  • Fig. 1 is an exploded schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • the camera module 1 includes: a first housing 10 and a second housing 20, which are located at both ends of the camera module 1 and accommodate various components of the camera module 1; a third housing 30, Located between the first housing 10 and the second housing 20 and fixedly connected to the first housing 10 and the second housing 20; the first circuit board 40 is located between the first housing 10 and the third housing 30
  • the first heat conducting member 60, the first side of the first heat conducting member 60 is in contact with the first circuit board 40, and the second side of the first heat conducting member 60 opposite to the first side is in contact with the third housing 30 .
  • the housing of the camera module includes at least a first housing 10 on one side, a third housing 30 in the middle, and a second housing 20 on the other side, which are used to hold the camera module 1
  • the various electronic component containers are in the housing.
  • the materials of the first housing 10, the second housing 20, and the third housing 30 may be the same, or may be different from each other, or different from each other.
  • the first housing 10, the second housing 20, and the third housing 30 may be made of materials with high thermal conductivity.
  • a fixed connection is adopted between the first housing 10 and the third housing 30.
  • the first housing 10 and the third housing 30 can be connected by screwing, pin connection, key connection, or welding or bonding. .
  • connection between the second housing 20 and the third housing 30 can also be threaded connection, pin connection, key connection, or welding or bonding.
  • the electronic components 41 of the camera module 1 are mounted on the first circuit board 40.
  • the position of the first circuit board 40 can be located between the first housing 10 and the third housing 30, or can be half-enclosed by the first housing 10, and the other side is sealed by the third housing 30, or the first circuit board 40 may be half-enclosed by the third housing 30 and sealed by the first housing 10 on the other side.
  • one side of the first circuit board 40 directly faces or indirectly faces the first housing 10, and the other side directly faces or indirectly faces the third housing 30.
  • the first thermally conductive member 60 may be a material with high thermal conductivity, such as thermally conductive silicone grease, thermally conductive silicone sheet, and the like.
  • the shape of the first heat conducting member 60 may be a sheet, a strip, a block, etc., and may be a square, a rectangle, a polygon, or the like.
  • the first heat conductive member 60 may be located between the first circuit board 40 and the third housing 30, or the first heat conductive member 60 may be half-enclosed by the third housing 30 together with the first circuit board 40, and the other side is surrounded by the third housing 30.
  • a housing 10 is sealed. In other words, one side of the first heat conducting member 60 is in direct or indirect contact with the first circuit board 40, and the other side opposite to the one side is in direct or indirect contact with the third housing 30.
  • the heat generated by the electronic components on the first circuit board 40 is quickly transferred to the third housing 30 through the first heat-conducting member 60, and then the third housing 30 with high thermal conductivity is used to radiate to the surrounding air ,
  • the temperature inside the camera is significantly reduced, and the heat dissipation effect of the camera during use is improved.
  • the structure of the camera module is simple, which will not affect its assembly efficiency.
  • the image sensor of the camera module 1 is provided on the first circuit board 40.
  • the image sensor is an important component of the camera, which affects the clarity of the image and also determines the quality of the camera module. This application does not limit the image sensor used.
  • the focal length of the lens 11 of the camera module and the image sensor will be affected by the linear expansion of the material due to the increase in temperature, resulting in unexpected changes in the focal length and affecting the definition of imaging. Therefore, ensuring a constant temperature around the image sensor is very important for the camera module.
  • Fig. 2 is an exploded schematic diagram of a camera module according to another exemplary embodiment of the present application.
  • the camera module in FIG. 2 is similar to the camera module shown in FIG. 1, the difference is that the camera module further includes a second circuit board 50 and a second heat conducting member 70, as shown in FIG. 2.
  • the second circuit board 50 is provided with some electronic components of the camera module, and the second circuit board 50 is located between the second housing 20 and the third housing 30.
  • the second circuit board 50 may be surrounded by the second housing 20 and sealed by the third housing 30 on one side, or may be surrounded by the third housing 30 and sealed by the second housing 20 on one side.
  • one side of the second circuit board 50 directly or indirectly faces the second housing 20, and the other side directly or indirectly faces the third housing 30.
  • the second thermal conductive member 70 may be a material with high thermal conductivity, such as thermal conductive silicone grease, thermal conductive silicone, and the like.
  • the second heat-conducting member 70 is located between the second circuit board 50 and the third housing 30, or the second heat-conducting member 70 may be surrounded by the third housing 30 together with the second circuit board 50, with one side of the second housing 20 sealed. In other words, one side of the second heat conducting member 70 is in contact with the second circuit board 50, and the other side opposite to the above-mentioned one side is in contact with the third housing 30.
  • the third housing 30 By providing the third housing 30, even if the camera module 1 is provided with two circuit boards, heat can be quickly transferred to the outside through the third housing 30 located in the middle, without affecting the temperature inside the camera module.
  • Fig. 3 is an exploded schematic diagram of a part of the camera module including a third housing according to an exemplary embodiment of the present application.
  • Fig. 4 is a partial cross-sectional view of a third housing according to another exemplary embodiment of the present application.
  • Fig. 5 is a schematic diagram of a third housing after assembly according to an exemplary embodiment of the present application.
  • the third housing 30 in the camera module 1 includes an outer wall 31 and a heat conducting plate 32.
  • the heat conducting plate 32 is connected to the outer wall 31, and the outer wall 31 is connected to the first housing 10 and the second housing. Between 20, the first heat conducting member 60 is in contact with the heat conducting plate 32.
  • the outer wall 31 of the third housing 30 is substantially closed in a ring shape. One end of the outer wall 31 is connected to the end of the first housing 10, and the other end is connected to the end of the second housing 20. In other words, the outer wall 31 connects the first housing 10 and the second housing 20 together.
  • the outer wall 31 may also have any shape matching the first housing 10 and the second housing 20, so that the camera module has a different appearance.
  • the heat-conducting plate 32 is located inside the third housing 30 and may be in the shape of a flat plate.
  • the heat-conducting plate 32 is arranged to have a larger area as much as possible to facilitate the improvement of the heat dissipation effect.
  • the outer wall 31 and the heat conducting plate 32 may be integrally formed, or the outer wall 31 and the heat conducting plate 32 are manufactured as two different components, and the heat conducting plate 32 is fixedly connected to the outer wall 31, for example, the heat conducting plate 32 is screwed, welded or adhered to the outer wall 31, to combine with the outer wall 31.
  • the material of the heat conducting plate 32 can be the same as or different from the material of the outer wall 31.
  • the outer wall 31 and the heat conducting plate 32 can be made of metal materials, or the outer wall 31 can be made of metal materials, and the heat conducting plate 32 can be made of non-metal with high thermal conductivity. material.
  • the heat conducting plate 32 directly contacts the first heat conducting member 60, or may indirectly contact the first heat conducting member 60 through another member.
  • a plurality of fins are provided on the outer side of the outer wall 31 of the third housing 30 to help heat dissipation.
  • a transverse plate (not shown) is provided inside the outer wall 31 of the third housing 30, and a heat conductive plate 32 is provided on the transverse plate.
  • the transverse plate connects the heat conductive plate 32 and the outer wall 31 together.
  • the heat conducting plate 32 may be in a columnar shape, protruding from the outer wall 31 toward the inside of the third housing 30 by a certain length, so as to contact the electronic components.
  • the heat-conducting plate 32 may be located inside the outer wall 31, and its shape roughly corresponds to the shape of the outer wall 31, and is connected to the outer wall 31 by a heat-conducting material to conduct heat from the heat-conducting plate 32 to the outer wall 31.
  • the housings at both ends of the camera module 1 are effectively connected, and the camera module 1 can also exhibit various shapes; through the heat conducting plate 32 in the third housing 30 Therefore, the heat inside the camera module 1 can be conducted to the third housing 30 more efficiently, and then transferred to the outside of the camera module 1.
  • the heat conducting plate 32 can not only accelerate the heat transfer inside the camera module 1, but also can increase the strength of the third housing 30, thereby improving the stability of the camera module 1.
  • a first protrusion 33 is provided on the heat-conducting plate 32, and the first heat-conducting member 60 is in contact with the first protrusion 33, or the first heat-conducting member 60 may be connected to the first protrusion 33 through another member.
  • a protrusion 33 is in indirect contact.
  • the shape of the first protrusion 33 may be rectangular, circular, polygonal, or the like.
  • the first protrusion 33 may be integrally formed with the heat-conducting plate 32 and slightly higher than other parts of the heat-conducting plate 32, or the first protrusion 33 may be provided on the heat-conducting plate 32, for example, bonded to the heat-conducting plate 32.
  • the material of the first protrusion 33 may be the same as or different from the heat conducting plate 32.
  • the arrangement of the first protrusion 33 can increase the thermal conductivity material, thereby improving the heat conduction efficiency inside the camera module.
  • a second protrusion (not shown) may be provided on the side of the heat conducting plate 32 opposite to the first protrusion 33.
  • the second protrusion may have the same shape and material as the first protrusion 33, and the only difference is that the position of the second protrusion corresponds to the electronic components on the second circuit board 50.
  • the first protrusion 33 corresponds to the area where the electronic component 41 on the first circuit board 40 is located, so that the heat generated by the electronic component 41 can be directly conducted to the third housing
  • the body 30 is further transferred to the outside of the camera module 1.
  • the position of the first protrusion 33 may correspond to the position of the first heat conducting member 60, so that even if the position of the electronic component 41 does not correspond to the position of the first protrusion 33, the heat generated by the electronic component 41 can be passed through the first heat conducting member. 60 is transferred to the heat conducting plate 32 and then to the third housing 30.
  • the arrangement of the first protrusion 33 can also visually mark the position of the heat conducting plate 32 or the main position of heat conduction, which facilitates the assembly of the camera module 1.
  • the material of the third housing 30 may be metal or non-metal with good thermal conductivity, such as aluminum, copper, silver, or graphite.
  • the camera module 1 further includes a sealing member 80, the sealing member 80 may be located in the third housing 30 and/or the first housing 10, and the number may be one or more , Arranged on the outer periphery of the first circuit board 40 and/or the second circuit board 50 to seal the circuit board, and when the circuit board is positioned in the first housing 10 and/or the third housing 30, the circuit board Play a shock absorption effect.
  • the sealing member 80 may include a sealing ring 81 and protrusions 82.
  • the number of protrusions 82 is one or more. When there are multiple protrusions 82, the protrusions 82 may be arranged symmetrically with respect to each other, or asymmetrical with respect to each other.
  • the protrusion 82 can be integrally formed with the sealing ring 81, or can be manufactured separately from the sealing ring 81, and then fixed to the sealing ring 81.
  • the protrusion 82 can further dampen the circuit board, and can also clamp the circuit board.
  • the outer circumference of the sealing ring 81 matches with the first housing 10 or the third housing 30 to better fix the circuit board.
  • the sealing member 80 may also include only the sealing ring 81. As shown in FIGS. 6 and 7, the sealing member 80 located between the first housing 10 and the third housing only includes the sealing ring 81.
  • the protrusion 82 is provided on the inner peripheral surface 83 of the sealing member 80 to directly clamp and fix the circuit board.
  • the protrusion 82 is provided on the inner circumference of the sealing ring 81 ⁇ 83.
  • the protrusion 82 may be formed in a strip shape and provided on the inner peripheral surface 83 of the sealing member 80.
  • the protrusions 82 may be formed on the four corners of the sealing member 80, or the protrusions 82 may be formed on the inner peripheral surface of the sealing member 80 at a position convenient for clamping the circuit board, thereby forming a more stable clamping of the circuit board. .
  • a fixing post 21 corresponding to the protrusion 82 is provided on the second housing 20.
  • the number of the fixing posts 21 corresponds to the number of the protrusions 82, or the number of the fixing posts 21 is less than the number of the protrusions 82, as long as the sealing member 80 can be immobilized with respect to the third housing 30.
  • the shape of the fixing column 21 may be a column shape, a strip shape or a cone shape.
  • the material of the fixing post 21 may be the same as the material of the second housing 20 or different from the material of the second housing 20.
  • the fixing post 21 may be integrally formed with the second housing 20, or may be manufactured separately from the second housing 20, and then fixed to the second housing 20 by, for example, welding or bonding.
  • the circuit board clamped by the sealing member 80 can be fixed to the third housing 30, thereby simplifying the fixing of the circuit board and making the assembly of the camera module more convenient .
  • the present application also provides an electronic device that includes the aforementioned camera module 1, and the electronic device can be used for vehicle equipment.
  • vehicle equipment can include a mini-vehicle, a small vehicle, a medium-sized vehicle, or a large-sized vehicle, and can be applied to Passenger vehicles or passenger cars can also be applied to manual vehicles, automatic vehicles or self-driving vehicles.
  • Fig. 6 is an exploded schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • Fig. 7 is an exploded schematic diagram of a camera module according to another exemplary embodiment of the present application.
  • the front housing 12 and the dustproof pad 13 are not shown in FIG. 7.
  • the difference between FIG. 6 and FIG. 7 is mainly in the position where the first heat conducting member 60 is placed. As shown in FIG. 6, the first heat conducting member 60 is placed in the first Between the circuit board 40 and the third housing 30, as shown in FIG. 7, the first heat conducting member 60 is placed between the second circuit board 50 and the third housing 30.
  • the camera module 1 may further include a front housing 12 to house the lens 11, and the first circuit board 40 faces the first housing.
  • a dustproof pad 13 can also be provided on one side of the body 10.
  • the first housing 10 and the second housing 20 are generally box-shaped with one side open.
  • One side of the first housing 10 has a columnar portion, in other words, on the side opposite to the open side, a columnar portion extends from the side housing to accommodate the fixed lens 11.
  • the side of the second housing 20 opposite to the open side is provided with a groove or a columnar portion (see FIG. 7) for signal lines for outputting image signals.
  • the thickness of the four corners of the first housing 10 and the second housing 20 may be greater than the thickness of the four sides, so as to facilitate the opening of threaded holes.
  • the first circuit board 40 and the second circuit board 50 may be provided with threaded holes at positions close to the four corners to facilitate assembly.
  • the first heat conducting member 60 may be located on the other side of the first circuit board 40 opposite to the side where the electronic components are provided, and corresponding to the position of the electronic components. In other words, the electronic components are located on the first circuit board 40. On one side, the first heat conducting member 60 is located on the second side of the first circuit board 40 that is exactly opposite to the electronic component.
  • the second heat conducting member 70 (not shown in FIGS. 6 and 7) may be located on the second circuit board 50, as shown in FIG. 2, that is, located between the heat conducting board 32 and the second circuit board 50 to connect the second
  • the heat generated by the circuit board 50 is also transferred to the heat conducting plate 32 and then transferred to the third housing 30.
  • the first heat-conducting member 60 and the second heat-conducting member 70 respectively contact the two side surfaces of the heat-conducting plate 32 of the third housing 30, thereby transferring the heat of the first circuit board 40 and the second circuit board 50 to the heat-conducting plate 32, and then It is transmitted to the third housing 30 and then to the external environment.
  • the first circuit board 40 may also be in contact with the first housing 10, so as not only to dissipate heat through the third housing 30, but also through the first housing 10, that is, the first The casing 10 can not only fix the first circuit board 40, but also dissipate heat.
  • the lens 11 when assembling the camera module, first, the lens 11 can be bonded or assembled to the first housing 10, and the sealing member 80 can be fitted on the outer periphery of the first circuit board 40;
  • the first circuit board 40 is aligned with the first housing 10, and the first circuit board 40 is fixed to the first housing 10 with screws; then, the first heat conducting member 60 is placed on the heat conducting plate 32 of the third housing 30 Next, align the third housing 30 with the first housing 10, and then use screws to fasten the third housing 30 to the assembled first housing 10; then, the sealing member 80 is sleeved in the first housing 10
  • the second heat conducting member 70 On the outer periphery of the second circuit board 50, the second heat conducting member 70 is then placed on the second circuit board 50 covered with the sealing member 80, and then the second heat conducting member 70 is clamped into the second housing 20; finally, screws are used
  • the second housing 20 is assembled to the third housing 30.
  • each component or each step can be decomposed and/or recombined.
  • decompositions and/or recombinations shall be regarded as equivalent solutions of this application.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Studio Devices (AREA)

Abstract

La présente invention concerne un module de caméra, un dispositif électronique et un dispositif de véhicule, le module de caméra comprenant : une première coque et une seconde coque, qui sont situées aux deux extrémités du module de caméra et contiennent à l'intérieur les composants du module de caméra ; une troisième coque, qui est située entre la première coque et la seconde coque et qui est reliée de manière fixe à la première coque et à la seconde coque ; une première carte de circuit imprimé, qui est située entre la première coque et la troisième coque ; et un premier élément thermoconducteur, un premier côté du premier élément thermoconducteur étant en contact avec la première carte de circuit imprimé, et un second côté du premier élément thermoconducteur opposé au premier côté étant en contact avec la troisième coque. Dans la présente invention, la chaleur générée par les composants électroniques est rapidement transmise à une coque intermédiaire au moyen d'un élément thermoconducteur, et ensuite la coque intermédiaire présentant une conductivité thermique élevée est utilisée pour distribuer la chaleur à l'air environnant, ce qui réduit significativement la température à l'intérieur de la caméra et améliore l'effet de dissipation de chaleur de la caméra dans le processus d'utilisation. En même temps, la structure du module de caméra est simple et n'affecte pas son efficacité d'assemblage.
PCT/CN2019/121252 2019-02-02 2019-11-27 Module de caméra, dispositif électronique et dispositif de véhicule Ceased WO2020155820A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910107767.7A CN111526265A (zh) 2019-02-02 2019-02-02 摄像头模组及车辆设备
CN201910107767.7 2019-02-02

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WO2020155820A1 true WO2020155820A1 (fr) 2020-08-06

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114615363A (zh) * 2022-02-23 2022-06-10 昆山丘钛微电子科技股份有限公司 一种摄像头模组及电子设备
CN114640730A (zh) * 2020-12-16 2022-06-17 宁波舜宇光电信息有限公司 摄像模组及电子设备
CN117915174A (zh) * 2024-01-17 2024-04-19 广汽本田汽车有限公司 一种车载摄像头组件及其控制方法和汽车
US12401870B2 (en) 2022-08-11 2025-08-26 Willand (Beijing) Technology Co., Ltd. Image acquisition apparatus and self-moving device

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