WO2020156595A9 - Carte de circuit imprimé souple et procédé de fabrication, dispositif d'affichage, structure de carte de circuit imprimé et panneau d'affichage associé - Google Patents

Carte de circuit imprimé souple et procédé de fabrication, dispositif d'affichage, structure de carte de circuit imprimé et panneau d'affichage associé Download PDF

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Publication number
WO2020156595A9
WO2020156595A9 PCT/CN2020/082216 CN2020082216W WO2020156595A9 WO 2020156595 A9 WO2020156595 A9 WO 2020156595A9 CN 2020082216 W CN2020082216 W CN 2020082216W WO 2020156595 A9 WO2020156595 A9 WO 2020156595A9
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
wiring
bridge
sub
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/082216
Other languages
English (en)
Chinese (zh)
Other versions
WO2020156595A2 (fr
WO2020156595A3 (fr
Inventor
熊韧
汤强
宋慧强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201911136276.1A external-priority patent/CN110831328A/zh
Priority claimed from CN202010075431.XA external-priority patent/CN111511109B/zh
Application filed by BOE Technology Group Co Ltd, Chengdu BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to EP20748629.1A priority Critical patent/EP3920671B1/fr
Priority to US17/418,771 priority patent/US11500489B2/en
Publication of WO2020156595A2 publication Critical patent/WO2020156595A2/fr
Publication of WO2020156595A3 publication Critical patent/WO2020156595A3/fr
Publication of WO2020156595A9 publication Critical patent/WO2020156595A9/fr
Anticipated expiration legal-status Critical
Priority to US17/945,064 priority patent/US11934606B2/en
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the embodiments of the present disclosure relate to a flexible circuit board and a manufacturing method thereof, a display device, a circuit board structure and a display panel thereof.
  • Flexible Printed Circuit is a highly reliable and flexible printed circuit board made of flexible film as a substrate.
  • Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good flexibility, and are widely used in various electronic devices such as mobile phones, computers, and displays.
  • the FPC in the OLED display panel generally includes a display-related circuit and a touch-related circuit, and is limited to the volume of the display panel, and it is necessary to reduce the occupied space of the FPC as much as possible.
  • FPC generally adopts a six-layer software-hard combination design scheme.
  • the display-related circuits and the touch-related circuits can be respectively arranged in different laminated structures, thereby achieving the effect of reducing the occupied space of the FPC.
  • the six-layer FPC structure design is difficult, and the manufacturing process is complicated and the cost is high. There are few domestic manufacturers that can correspond to and their technical capabilities are not high. At this stage, the six-layer board supply channel is still dominated by foreign manufacturers, but the delivery time is long and it is not convenient for the flexible operation of the project.
  • the purpose of the present invention is to provide a flexible circuit board and a manufacturing method, a display device, a circuit board structure and a display panel thereof, which can solve the technical problems of high difficulty in the design of six-layer boards in related technologies, and complicated manufacturing process and high cost.
  • At least one embodiment of the present disclosure provides a flexible circuit board, including a main body sub-circuit board, including a first substrate, and a first bridge terminal, a second bridge terminal, a first wiring portion, and The second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal respectively;
  • the bridge sub-circuit board includes a first The second substrate and the third bridge end, the fourth bridge end and the third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the fourth bridge end are The third wiring portion is electrically connected, and the bridge sub-circuit board is configured to electrically connect the third bridge terminal and the fourth bridge terminal to the first bridge terminal and the second bridge terminal, respectively , And mounted on the main body sub-circuit board, so that the first wiring portion, the third wiring portion, and the second wiring portion are sequentially electrically connected to obtain a first functional wiring, the first substrate and the The outer contour shape of the second substrate is different.
  • the outer contour shape of the bridge sub-circuit board is a symmetrical structure.
  • the outer contour shape of the bridge sub-circuit board is an asymmetric structure.
  • the third bridge terminal and the fourth bridge terminal on the bridge sub-circuit board are symmetrically arranged on both sides of the bridge sub-circuit board.
  • the flexible circuit board provided by at least one embodiment of the present disclosure further includes a first control circuit coupling structure, the first control circuit coupling structure is disposed on the main body sub-circuit board, and is electrically connected to the first wiring portion , Or the first control circuit combination structure is arranged on the bridge sub-circuit board and is electrically connected to the third wiring part; the first control circuit combination structure is configured to provide the first functional wiring The first electrical signal or the first electrical signal is received from the first functional wiring.
  • the main body sub-circuit board further includes a second functional wiring, and the second functional wiring is connected to the second functional wiring provided on the main sub-circuit board.
  • a control circuit combined structure is electrically connected, and the first control circuit combined structure is further configured to provide a second electrical signal to the second functional wiring or receive a second electrical signal from the second functional wiring.
  • the first functional wiring obtained by sequentially electrically connecting the first wiring portion, the third wiring portion and the second wiring portion, so The first function wiring is used to transmit touch driving signals, and the second function wiring is used to transmit touch sensing signals.
  • the first functional wiring obtained by sequentially electrically connecting the first wiring portion, the third wiring portion and the second wiring portion, so The first functional wiring is used to transmit touch sensing signals, and the second functional wiring is used to transmit touch driving signals.
  • the main body sub-circuit board further includes a third functional wiring, and the third functional wiring is located between the first wiring part and the second wiring.
  • the bridge sub-circuit board is connected to the third functional wire, and the first wire portion and the second wire portion pass under the bridge sub-circuit board to be connected.
  • the main body sub-circuit board further includes a third functional wiring, and the third functional wiring is located between the first wiring part and the second wiring. Between the wire portions, and the orthographic projection of the third functional wiring on the first substrate and the orthographic projection of the bridge sub-circuit board on the first substrate at least partially overlap.
  • the third functional wiring is used to transmit signals different from the first functional wiring and the second functional wiring.
  • the third function wiring is used to provide signals for the display circuit.
  • the third function trace extends to one side of the main body sub-circuit board and is electrically connected to the terminal on one side of the main body sub-circuit board.
  • the first wiring portion, the second wiring portion, and the third functional wiring are routed in the same direction.
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer
  • the first main insulation layer on the side away from the first substrate, the first side is the side of the main sub-circuit board close to the bridge sub-circuit board
  • the main sub-circuit board further includes The second main body wiring layer on the second side of the first substrate and the second main body insulating layer laminated on the side of the second main body wiring layer away from the first substrate, the first wiring part One part is located on the first main wiring layer, and the other part of the first wiring part is located on the second main wiring layer; a part of the second wiring part is located on the first main wiring layer, and the second wiring The other part is located on the second main wiring layer.
  • a part of the second functional wiring is located on the first main body wiring layer, and another part of the second functional wiring is located on the second main body
  • the wiring layer, or the second functional wiring is all located on the first main wiring layer
  • a part of the third functional wiring is located on the first main wiring layer, and the third functional wiring
  • the other part is located on the second main body wiring layer, or all the third functional wires are located on the second main body wiring layer.
  • the second functional wiring is all located on the first main body wiring layer
  • the third functional wiring is all located on the second main wiring layer.
  • the first main insulating layer has a first via hole, and the first via hole exposes the first bridge end and the second bridge end.
  • the flexible circuit board provided by at least one embodiment of the present disclosure, at least part of the wiring of the first wiring portion of the second main wiring layer is electrically connected to the first main wiring layer through the second via hole for The first bridge terminal is electrically connected to the bridge sub-circuit board, and at least part of the wiring of the second wiring part of the second main wiring layer is electrically connected to the first main wiring layer through the second via hole for passing through the second wiring layer.
  • the bridge terminal is electrically connected to the bridge sub-circuit board.
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer The first main body insulating layer on the side away from the first substrate, the main body sub-circuit board further includes a second main body wiring layer located on a second side of the first substrate opposite to the first side, and A second main body insulating layer laminated on the side of the second main body wiring layer away from the first substrate, the first main body wiring layer including the first wiring portion and the second wiring Part and the first bridging end, the first bridging end is exposed by the first main body insulating layer; the second main body wiring layer includes the first wiring part, the second wiring part and The second bridge end, the second bridge end is exposed by the second main body insulating layer.
  • the bridge sub-circuit board includes a first bridge wiring layer on the first side of the second substrate and a layer stacked on the first bridge wiring.
  • the first bridge insulating layer on the side of the layer away from the second substrate, the first bridge wiring layer includes the third wiring portion.
  • the bridge sub-circuit board further includes a ground layer located on a second side of the second substrate opposite to the first side.
  • the second side is closer to the main body sub-circuit board relative to the first side.
  • the bridge sub-circuit board further includes a second bridge insulating layer laminated on a side of the ground layer away from the second substrate, and the second The bridge insulating layer has a plurality of openings that expose part of the ground layer, and the plurality of openings serve as the third bridge terminal and/or the fourth bridge terminal for bridging the sub-circuit board with the main sub-circuit board Electric connection.
  • the bridge daughter circuit board further includes a shielding layer on the second side of the second substrate, and the shielding laminated layer is on the ground layer. The side away from the second substrate.
  • the bridge sub-circuit board further includes a second bridge wiring layer located on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the second bridge wiring layer includes the third wiring portion, the third bridge end and The fourth bridge end, the third bridge end and the fourth bridge end are exposed by the second bridge insulating layer; in the case that the bridge sub-circuit board is mounted on the main sub-circuit board, The second side is closer to the main body sub-circuit board than the first side.
  • the bridge sub-circuit board further includes a second bridge wiring layer located on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the first bridge wiring layer further includes the third bridge end, the third bridge end is The first bridge insulating layer is exposed; the second bridge wiring layer includes the third wiring portion and the fourth bridge end, and the fourth bridge end is exposed by the second bridge insulating layer.
  • the bridge sub-circuit board further includes a bridge sub-circuit board on the second side of the second substrate and laminated on the second bridge insulating layer away from the first Two shielding layer on one side of the substrate.
  • the third bridge end and the fourth bridge end of the bridge sub-circuit board are connected to each other through anisotropic conductive glue, soldering material or a connector.
  • the first bridge end and the second bridge end of the main body sub-circuit board are connected to each other through anisotropic conductive glue, soldering material or a connector.
  • the surfaces of the first bridge end and the second bridge end include tin material, and the third bridge end of the bridge sub-circuit board is made by the tin material.
  • the fourth bridge terminal are respectively welded to the first bridge terminal and the second bridge terminal of the main body sub-circuit board, so that the bridge sub-circuit board is electrically connected to the main body sub-circuit board.
  • the main body sub-circuit board includes a plurality of the first bridge terminals and a plurality of the second bridge terminals; there are a plurality of the bridge sub-circuit boards, The plurality of bridge sub-circuit boards are respectively electrically connected to the plurality of first bridge terminals and the plurality of second bridge terminals through the plurality of third bridge terminals and the plurality of fourth bridge terminals, and Installed on the main body sub-circuit board.
  • the main body sub-circuit board further includes a terminal, the terminal has a plurality of first contact pads, and the second wiring part includes a plurality of wires One end of the terminal is electrically connected to a part of the first contact pad in the terminal, and one end of the multiple wiring included in the second functional wiring is electrically connected to the other part of the first contact pad in the terminal, and the third One end of the multiple wirings included in the functional wiring is electrically connected to another part of the first contact pads in the terminal, and is electrically connected to the second wiring part, the third functional wiring and the second functional wiring.
  • Part of the first contact pads are arranged at intervals between the terminals.
  • the terminal includes a structure located on the second main body wiring layer.
  • the terminal is disposed in the wiring area of the main body sub-circuit board, and the transparency of the wiring area is higher than the transparency of at least a part of the area outside the wiring area.
  • the wiring area only has a wiring layer and a part of an insulating layer.
  • the wiring area does not have a shielding layer.
  • the main body sub-circuit board further includes a terminal, the terminal has a plurality of first contact pads, and the second wiring part includes a plurality of wires One end of the terminal is electrically connected to a part of the first contact pad in the terminal, and one end of the multiple wiring included in the second functional wiring is electrically connected to the other part of the first contact pad in the terminal, and the third One end of the multiple wirings included in the functional wiring is electrically connected to another part of the first contact pads in the terminal, and is electrically connected to the second wiring part, the third functional wiring and the second functional wiring.
  • Part of the first contact pads are continuously arranged at the terminal.
  • the terminal includes a structure located on the second main body wiring layer.
  • the terminal is disposed in the wiring area of the main body sub-circuit board, and the transparency of the wiring area is higher than the transparency of at least a part of the area outside the wiring area.
  • the wiring area only has a wiring layer and a part of an insulating layer.
  • the wiring area does not have a shielding layer.
  • At least one embodiment of the present disclosure provides a flexible circuit board, including a main body sub-circuit board, including a first substrate, and a first bridge terminal, a second bridge terminal, a first wiring portion, and The second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal respectively;
  • the bridge sub-circuit board includes a first The second substrate and the third bridge end, the fourth bridge end and the third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the fourth bridge end are The third wiring portion is electrically connected, and the bridge sub-circuit board is configured to electrically connect the third bridge terminal and the fourth bridge terminal to the first bridge terminal and the second bridge terminal, respectively , And mounted on the main body sub-circuit board, so that the first wiring portion, the third wiring portion, and the second wiring portion are sequentially electrically connected to obtain a first functional wiring; the first substrate and the The outer contour shape of the second substrate is different, and the main body sub-circuit
  • At least one embodiment of the present disclosure provides a display device, including a display panel and a flexible circuit board, wherein the display panel has pixel units arranged in an array, touch drive wiring, and touch sensing wiring.
  • the panel further includes a second functional circuit structure, the second functional circuit structure is a display circuit structure, the second functional circuit structure is electrically connected to the pixel unit, and one side of the display panel is further provided with a circuit for connecting to the flexible circuit
  • the pad is electrically connected to the touch sensing trace, and a part of the second contact pad that is electrically connected to the second functional circuit structure is located in another part of the second contact pad that is electrically connected to the touch drive trace and is connected to the The touch-sensing trace is electrically connected between another part of the second contact pads.
  • the flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board, wherein the main body sub-circuit board includes a first substrate and is arranged on the first substrate.
  • the first bridge end, the second bridge end, the first wiring portion, and the second wiring portion on the substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are respectively connected to the first
  • the bridge terminal is electrically connected to the second bridge terminal;
  • the bridge sub-circuit board includes a second substrate, a third bridge terminal, a fourth bridge terminal and a third bridge for the first functional wiring.
  • the third bridge end and the fourth bridge end are electrically connected by the third wiring part, and the bridge sub-circuit board is configured to connect the third bridge end and the fourth bridge
  • the terminals are electrically connected to the first bridge terminal and the second bridge terminal, and are mounted on the main body sub-circuit board, so that the first wiring part, the third wiring part, and the second wiring part Electrical connections are made in sequence to obtain the first functional wiring, the outer contour shapes of the first substrate and the second substrate are different, and one side of the main body sub-circuit board also has a terminal for electrical connection with the display panel,
  • the terminal has a plurality of first contact pads
  • the main body sub-circuit board further includes a second function wiring and a third function wiring
  • the third function wiring is located between the first wiring part and the Between the second wiring portions, and the orthographic projection of the third functional wiring on the first substrate and the orthographic projection of the bridge sub-circuit board on the first substrate at least partially overlap, the main body sub-circuit
  • the first function trace of the board is electrically
  • Control sensing wiring or, the first function wiring of the main body sub-circuit board is electrically connected to the touch sensing wiring of the display panel, and the second function wiring of the main body sub-circuit board
  • the wire is electrically connected to the touch drive wire of the display panel
  • the third functional wire of the main body sub-circuit board is electrically connected to the second functional circuit structure of the display panel
  • the flexible circuit board further includes A first control circuit combined structure, the first control circuit combined structure is electrically connected to the first functional wiring
  • the first control circuit combination structure is also electrically connected to the second functional wiring
  • the touch drive wiring of the display panel is connected to the first functional wiring of the flexible circuit board through the first functional wiring.
  • a control circuit combining structure is electrically connected, and the touch sensing trace of the display panel is electrically connected to the first control circuit combining structure through the second functional trace of the flexible circuit board, or, the The touch sensing trace of the display panel is electrically connected to the first control circuit combination structure of the flexible circuit board through the first functional trace, and the touch driving trace of the display panel passes through all
  • the second functional trace of the flexible circuit board is electrically connected to the first control circuit combining structure, and the second contact pad of the display panel is electrically connected to the first contact pad of the flexible circuit board .
  • the first control circuit combined structure is configured to provide a first electrical signal to the first functional wiring or receive a first electrical signal from the first functional wiring.
  • the first control circuit combined structure is used to install a first control circuit, and the first control circuit is a touch drive IC chip.
  • the first control circuit combination structure is further configured to provide a second electrical signal to the second functional wiring or receive a second electrical signal from the second functional wiring. electric signal.
  • the touch sensing trace includes at least a portion located on the side of the display panel opposite to the second contact pad, and the touch driving trace It includes at least a part located on any side except the above two sides.
  • the first function trace electrically connected to the touch driving trace is bridged by a bridge sub-circuit board, and the touch driving trace is connected to the The distance between the first control circuit coupling structure is greater than the distance between the touch sensing trace and the first control circuit coupling structure, or the first functional trace electrically connected to the touch sensing trace is bridged
  • the sub-circuit board is bridged, and the distance between the touch sensing trace and the first control circuit combining structure is greater than the distance between the touch driving trace and the first control circuit combining structure.
  • the first control circuit combination structure is disposed on the main body sub-circuit board and is electrically connected to the first wiring part, or the first control circuit
  • the coupling structure is arranged on the bridge sub-circuit board and is electrically connected to the third wiring part; the first control circuit coupling structure is configured to provide a first electrical signal to the first functional wiring or from the The first function wiring receives the first electrical signal.
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer.
  • the first main body insulating layer on the side away from the first substrate, the first side being the side of the main body sub-circuit board close to the bridge sub-circuit board, the main body sub-circuit board further comprising The second main body wiring layer on the second side of the first substrate and the second main body insulating layer laminated on the side of the second main body wiring layer away from the first substrate, part of the first wiring part Located on the first main wiring layer, another part of the first wiring part is located on the second main wiring layer; part of the second wiring part is located on the first main wiring layer, the second wiring part The other part is located on the second main wiring layer.
  • a part of the second function wiring is located on the first main body wiring layer, and another part of the second function wiring is located on the second main body wiring layer.
  • Wire layer, or all the second functional wires are located on the first main body wire layer;
  • a part of the third functional wires are located on the first main body wire layer, and the third functional wires are other
  • a part is located on the second main body wiring layer, or all the third functional wires are located on the second main body wiring layer.
  • the second function wiring is all located on the first main body wiring layer
  • the third function wiring is all located on the second main body wiring layer
  • the first main insulating layer has a first via hole, and the first via hole exposes the first bridge terminal and the second bridge terminal.
  • the display device provided by at least one embodiment of the present disclosure, at least part of the wiring of the first wiring part of the second main wiring layer is electrically connected to the first main wiring layer through the second via hole for passing through
  • the first bridge terminal is electrically connected to the bridge sub-circuit board
  • at least part of the wiring of the second wiring part of the second main body wiring layer is electrically connected to the first main wiring layer through the second via hole for connecting through the second bridge
  • the terminal is electrically connected to the bridge sub-circuit board.
  • the bridge sub-circuit board includes a first bridge wiring layer on the first side of the second substrate and a layer stacked on the first bridge wiring layer.
  • the first bridge insulating layer on the side away from the second substrate, the first bridge wiring layer includes the third wiring portion.
  • the bridge sub-circuit board further includes a ground layer on the second side of the second substrate opposite to the first side, and the bridge sub-circuit When the board is mounted on the main body sub-circuit board, the second side is closer to the main body sub-circuit board relative to the first side.
  • the bridge sub-circuit board further includes a second bridge insulating layer laminated on the side of the ground layer away from the second substrate, and the second bridge
  • the insulating layer has a plurality of openings that expose part of the ground layer, and the plurality of openings serve as the third bridge end and/or the fourth bridge end for electrically connecting the sub-circuit board and the main sub-circuit board. connection.
  • the bridge sub-circuit board further includes a shielding layer on the second side of the second substrate, and the shielding layer is located far away from the ground layer.
  • the shielding layer is located far away from the ground layer.
  • the third bridge end and the fourth bridge end of the bridge sub-circuit board are respectively connected to the bridge through anisotropic conductive glue, soldering material, or a connector.
  • the first bridge end and the second bridge end of the main body sub-circuit board are respectively connected to the bridge through anisotropic conductive glue, soldering material, or a connector.
  • the surfaces of the first bridging end and the second bridging end include tin material, and the third bridging end of the bridge sub-circuit board is made to be connected to each other by the tin material.
  • the fourth bridge terminal is respectively welded to the first bridge terminal and the second bridge terminal of the main body sub-circuit board, so that the bridge sub-circuit board is electrically connected to the main body sub-circuit board.
  • the main body sub-circuit board includes a plurality of the first bridge terminals and a plurality of the second bridge terminals; the bridge sub-circuit board includes a plurality of Each of the bridge sub-circuit boards is electrically connected to a plurality of the first bridge terminals and a plurality of the second bridge terminals through a plurality of the third bridge terminals and a plurality of the fourth bridge terminals respectively, and is installed To the main body sub-circuit board.
  • the main body sub-circuit board further includes a terminal, the terminal has a plurality of first contact pads, and the second wiring part includes a plurality of wiring One end is electrically connected to a part of the first contact pad in the terminal, and one end of the multiple wiring included in the second function wiring is electrically connected to the other part of the first contact pad in the terminal.
  • the third function One end of the multiple wires included in the wire is electrically connected to another part of the first contact pads in the terminal, and is electrically connected to the second wire part, the third function wire and the second function wire part respectively.
  • the first contact pads are arranged at intervals between the terminals.
  • the terminal includes a structure located on the second main body wiring layer.
  • the terminal is disposed in the wiring area of the main body sub-circuit board, and the transparency of the wiring area is higher than the transparency of at least a part of the area outside the wiring area.
  • the wiring area only has a wiring layer and a part of an insulating layer.
  • the wiring area does not have a shielding layer.
  • the main body sub-circuit board further includes a terminal, the terminal has a plurality of first contact pads, and the second wiring part includes a plurality of wiring One end is electrically connected to a part of the first contact pad in the terminal, and one end of the multiple wiring included in the second function wiring is electrically connected to the other part of the first contact pad in the terminal.
  • the third function One end of the multiple wires included in the wire is electrically connected to another part of the first contact pads in the terminal, and is electrically connected to the second wire part, the third function wire and the second function wire part respectively.
  • the first contact pad is continuously arranged at the terminal.
  • the terminal includes a structure located on the second main body wiring layer.
  • the terminal is disposed in the wiring area of the main body sub-circuit board, and the transparency of the wiring area is higher than the transparency of at least a part of the area outside the wiring area.
  • the wiring area only has a wiring layer and a part of an insulating layer.
  • the wiring area does not have a shielding layer.
  • the display device further includes a second control circuit combination structure.
  • the second control circuit combined structure is configured to provide a third electrical signal to the third functional wiring or receive a third electrical signal from the third functional wiring.
  • the second control circuit combined structure is used for mounting a second control circuit, and the second control circuit is a driver IC chip.
  • the bridge sub-circuit board is connected to the third functional wiring, and the first wiring portion and the second wiring portion are separated from the bridge sub-circuit Pass under the board to connect.
  • At least one embodiment of the present disclosure provides a display device, including a display panel and a flexible circuit board, wherein the display panel has pixel units arranged in an array, touch drive wiring, and touch sensing wiring.
  • the panel further includes a second functional circuit structure, the second functional circuit structure is a display circuit structure, the second functional circuit structure is electrically connected to the pixel unit, and one side of the display panel is further provided with a circuit for connecting to the flexible circuit
  • the pad is electrically connected to the touch sensing trace, and a part of the second contact pad that is electrically connected to the second functional circuit structure is located in another part of the second contact pad that is electrically connected to the touch drive trace and is connected to the The touch-sensing trace is electrically connected between another part of the second contact pads.
  • the flexible circuit board includes a main body sub-circuit board and a bridge sub-circuit board, wherein the main body sub-circuit board includes a first substrate and is arranged on the first substrate.
  • the first bridge end, the second bridge end, the first wiring portion, and the second wiring portion on the substrate, the first wiring portion and the second wiring portion are spaced apart from each other and are respectively connected to the first
  • the bridge terminal is electrically connected to the second bridge terminal;
  • the bridge sub-circuit board includes a second substrate, a third bridge terminal, a fourth bridge terminal and a third bridge for the first functional wiring.
  • the third bridge end and the fourth bridge end are electrically connected by the third wiring part
  • the bridge sub-circuit board is configured to connect the third bridge end and the fourth bridge
  • the terminals are electrically connected to the first bridge terminal and the second bridge terminal, and are mounted on the main body sub-circuit board, so that the first wiring part, the third wiring part, and the second wiring part Electrical connections are made in sequence to obtain first functional traces, the outer contour shapes of the first substrate and the second substrate are different
  • the main body sub-circuit board includes a first main body trace on the first side of the first substrate Layer and the first main body insulating layer laminated on the side of the first main body wiring layer away from the first substrate, the first side being the main body sub-circuit board close to the bridge sub-circuit board
  • the main body sub-circuit board further includes a second main body wiring layer located on the second side of the first substrate, and a second main body wiring layer laminated on the side of the second main body wiring layer away from the first substrate.
  • At least part of the wiring of the first wiring part of the wiring layer is electrically connected to the first main wiring layer through the second via for passing through the A bridge terminal is electrically connected to the bridge sub-circuit board, and at least part of the wiring in the second wiring part of the second main body wiring layer is electrically connected to the first main wiring layer through the second via hole for passing through the second bridge terminal
  • the first main body wiring layer includes the first wiring portion, the second wiring portion, the first bridging end and the second bridging end, the first The bridge end and the second bridge end are exposed by the first main body insulating layer
  • the main body sub-circuit board also includes a second main body on a second side of the first substrate opposite to the first side.
  • the bridge sub-circuit board includes a first bridge wiring layer located on the first side of the second substrate and a stack on the side of the first bridge wiring layer away from the second substrate
  • the first bridge insulation layer, the first bridge wiring layer includes the third wiring portion
  • the bridge sub-circuit board further includes a second side located on the second substrate opposite to the first side
  • the bridge sub-circuit board is mounted on the main sub-circuit board, the second side is closer to the main sub-circuit board relative to the first side
  • the bridge sub-circuit The board further includes a second bridge insulating layer laminated on the side of the ground layer away from the second substrate, the second bridge insulating layer having a plurality of openings, and the plurality of openings expose part of the ground layer, The plurality of openings are used as the third bridge end and/or the fourth bridge end for electrically connecting the
  • the terminal has a plurality of first contact pads
  • the main body sub-circuit board further includes a second function wiring and a third function wiring
  • the third function wiring is located in the first Between the wiring portion and the second wiring portion, and the orthographic projection of the third functional wiring on the first substrate and the orthographic projection of the bridge sub-circuit board on the first substrate at least partially overlap
  • the first function trace of the main body sub-circuit board is electrically connected to the touch drive trace of the display panel
  • the second function trace of the main body sub-circuit board is electrically connected to the display
  • the touch sensing wiring of the panel, the third functional wiring of the main body sub-circuit board is electrically connected to the second functional circuit structure of the display panel
  • the flexible circuit board further includes a first control circuit combination structure
  • the first control circuit combining structure is electrically connected to the first functional wiring
  • the first control circuit combining structure is also electrically connected to the second functional wiring
  • the wire is electrically connected to the first control circuit combination structure
  • the bridge sub-circuit board is connected to the third functional wiring, and the first wiring portion and the second wiring portion are separated from the bridge sub-circuit Pass under the board to connect.
  • At least one embodiment of the present disclosure provides a method for manufacturing a flexible circuit board, including: providing a main body sub-circuit board, the main body sub-circuit board including a first substrate, and a first bridge terminal and a second substrate provided on the first substrate.
  • Two bridging ends, a first wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and respectively connected to the first bridging end and the second bridging end Electrical connection; providing a bridge sub-circuit board, the bridge sub-circuit board includes a second substrate and a third bridge end, a fourth bridge end and a third route for the first functional wiring provided on the second substrate The third bridge end and the fourth bridge end are electrically connected by the third wiring part to electrically connect the third bridge end and the fourth bridge end of the bridge sub-circuit board. Connected to the first bridge terminal and the second bridge terminal of the main body sub-circuit board so that the bridge sub-circuit board is mounted on the main body sub-circuit board, the first substrate and the second The two substrates are not in direct contact.
  • the third bridge end and the fourth bridge end of the bridge sub-circuit board are respectively connected by hot pressing, welding, or by a connector To the first bridge end and the second bridge end of the main body sub-circuit board.
  • the circuit board structure includes a main circuit board, an adapter circuit board, and a connector.
  • the main circuit board has a double circuit layer structure and carries the main board overlap terminal;
  • the transfer circuit board has a double circuit layer structure, which is stacked on the main circuit board and carries the first device overlap for the first device group.
  • the connector is arranged on the main circuit board and the adapter Between the circuit boards, it is used to connect the lap end of the main board and the lap end of the adapter board.
  • the circuit board structure further includes a shielding layer, and the shielding layer is stacked between the main circuit board and the transfer circuit board.
  • the main circuit board further carries a second lead set; the orthographic projection of the transfer circuit board on the main circuit board at least partially covers the second Lead group.
  • the main circuit board also carries a first external pin group; part of the first external pin group is connected to the lap end of the motherboard to connect part of the In the first lead group, part of the first external pin group is connected to the second lead group.
  • the main board lap end includes a plurality of sub main board lap ends
  • the adapter board lap end includes a plurality of sub board lap ends
  • the number of the sub-main board overlapping ends is two, and the two sub-main board overlapping ends are respectively disposed on opposite sides of the second lead group.
  • the main circuit board also carries a second external pin group; part of the second external pin group is connected to the second lead group, and some The second external pin group is connected to the lap end of the motherboard to connect part of the first lead group.
  • At least one of the main circuit board and the transfer circuit board is a flexible circuit board.
  • the main circuit board includes a first substrate and a circuit layer located on both sides or one side of the first substrate; the transition circuit board includes a second substrate And circuit layers located on both sides or one side of the second substrate.
  • At least one embodiment of the present disclosure provides a display panel including the above-mentioned circuit board structure.
  • the present disclosure provides a circuit board structure and a display panel thereof.
  • the circuit board structure includes a main circuit board, a switching circuit board, and a connector.
  • the main circuit board has a double circuit layer structure and carries the main board overlap terminal;
  • the transfer circuit board has a double circuit layer structure, which is stacked on the main circuit board and carries the first device overlap for the first device group.
  • the connector is arranged on the main circuit board and the adapter Between the circuit boards, it is used to connect the lap end of the main board and the lap end of the adapter board.
  • both the main circuit board and the switching circuit board can be provided with two circuit layers.
  • the circuit board structure provided by the present disclosure can reduce the space occupied by the circuit board structure by stacking the double circuit layer circuit board; on the other hand, the double circuit layer circuit board has a mature manufacturing process and simple structure design, which can reduce the circuit The design cost of the board.
  • FIG. 1A is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 1B is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 1C is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • 1D is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 2 is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 3 is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4B is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5B is a schematic plan view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • 6A is a schematic cross-sectional view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 6B is a schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7A is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7B is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 8A is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 8B is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8C is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8D is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 9A is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • 9B is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 10A is a schematic diagram of an electronic device module provided by at least one embodiment of the present disclosure.
  • 10B is a schematic diagram of another electronic device module provided by at least one embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of a display device provided by some embodiments of the disclosure.
  • FIG. 12 is a manufacturing flow chart of a flexible circuit board provided by some embodiments of the present disclosure.
  • FIG. 13 is a schematic structural diagram of a main circuit board in an exemplary embodiment of the circuit board structure of the disclosure.
  • FIG. 14 is a schematic structural diagram of a switching circuit board in an exemplary embodiment of the circuit board structure of the disclosure.
  • 15 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the present disclosure.
  • FIG. 16 is a schematic structural diagram of another exemplary embodiment of the circuit board structure of the present disclosure.
  • FIG. 17 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the present disclosure.
  • FIG. 18 is a schematic structural diagram of a main circuit board in an exemplary embodiment of the circuit board structure of the disclosure.
  • FIG. 19 is a schematic structural diagram of a switching circuit board in an exemplary embodiment of the circuit board structure of the disclosure.
  • 20 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the present disclosure.
  • Flexible circuit boards can usually integrate multiple signal traces to transmit different types of signals.
  • the wiring difficulty in the flexible circuit board will also increase. Big.
  • flexible circuit boards are often formed with multiple wiring layers, such as four or six wiring layers, etc., so as to facilitate the layout of multiple wirings, so that multiple wirings can be distributed on different layers , Thereby reducing the mutual interference between different types of wiring.
  • the flexible circuit board includes a first substrate, and a main body sub-circuit board and a bridge sub-circuit board disposed on the first substrate;
  • the main body sub-circuit board includes a first bridge end, a second Two bridge terminals, a first wiring part and a second wiring part, the first wiring part and the second wiring part are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal respectively;
  • the bridge sub-circuit board includes The second substrate and the third bridge end, the fourth bridge end, and the third wiring part provided on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring part, the first substrate and the second
  • the substrate is not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge terminal and the fourth bridge terminal to the first bridge terminal and the second bridge terminal, respectively.
  • An electronic device module provided by at least one embodiment of the present disclosure includes an electronic device substrate and the above-mentioned flexible circuit board; the electronic device substrate includes a first functional circuit structure, and the first functional wiring of the flexible circuit board is electrically connected to the first function Circuit configuration.
  • At least one embodiment of the present disclosure provides a display device including the above-mentioned electronic device module.
  • FIG. 1A is a schematic plan view of the flexible circuit board.
  • the flexible circuit board 10 includes a main body sub-circuit board 100 and a bridge sub-circuit board 200, and the bridge sub-circuit board 200 may be electrically connected to the main body sub-circuit board 100.
  • FIG. 2 is a schematic plan view of the main body sub-circuit board 100.
  • the main body sub-circuit board 100 includes a first substrate and a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, and a second wiring portion 104 disposed on the first substrate;
  • a wiring portion 103 and a second wiring portion 104 are separated by a predetermined space (distance) from each other, and are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the first bridge end 101 includes a plurality of first contact pads
  • the second bridge end 102 includes a plurality of second contact pads.
  • the first wiring portion 103 includes a plurality of wirings, and one end of the plurality of wirings is electrically connected to the plurality of first contact pads included in the first bridge terminal 101 in a one-to-one correspondence;
  • the second wiring portion 104 also includes multiple One wire, and one end of the wire is electrically connected to the plurality of second contact pads included in the first bridge terminal 102 in a one-to-one correspondence.
  • the figure only shows two wires included in the first wire portion 103 and two wires included in the second wire portion 104, the embodiment of the present disclosure is not limited thereto.
  • FIG. 3 is a schematic plan view of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 includes a second substrate, a third bridge end 201, a fourth bridge end 202, and a third wiring portion 203 disposed on the second substrate, the third bridge end 201 and the fourth
  • the bridge terminal 202 is electrically connected by the third wiring portion 203.
  • the third bridging end 201 includes a plurality of third contact pads
  • the fourth bridging end 202 includes a plurality of fourth contact pads
  • the third trace portion 203 includes a plurality of traces, and these traces are connected to the third bridging end at one end.
  • the plurality of third contact pads included in 201 are electrically connected in one-to-one correspondence, and the other end is electrically connected in one-to-one correspondence with the plurality of fourth contact pads included in the fourth bridge terminal 202. Although only two wires included in the third wire portion 203 are shown in the figure, the embodiment of the present disclosure is not limited thereto.
  • the bridge sub-circuit board 200 is configured to be able to mount the bridge sub-circuit board 200 to the main sub-circuit by electrically connecting the third bridge terminal 201 and the fourth bridge terminal 202 to the first bridge terminal 101 and the second bridge terminal 102, respectively On board 100.
  • the first wiring portion 103, the third wiring portion 203, and the second wiring portion 104 are sequentially electrically connected to obtain the first functional wiring, thereby
  • the signal can be transmitted from the first wiring section 103 to the second wiring section 104 through the third wiring section 203, or may be transmitted from the second wiring section 104 to the first wiring section through the third wiring section 203 103.
  • the outer contour shape of the bridge sub-circuit board 200 is a symmetrical structure.
  • FIG. 1A shows a situation where the bridge sub-circuit board 200 is mounted on the main sub-circuit board 100 through the third bridge end 201 and the fourth bridge end 202 respectively being joined to the first bridge end 101 and the second bridge end 102
  • the main body sub-circuit board 100 and the bridge sub-circuit board 200 may also be in a state to be connected, that is, the separate main body sub-circuit board 100 and the bridge sub-circuit board 200 are also within the protection scope of the present disclosure.
  • the flexible circuit board 10 may further include a first control circuit coupling structure 105, and the first control circuit coupling structure 105 is disposed on the main sub-circuit board 100.
  • the first control circuit combining structure 105 includes a plurality of contact pads for mounting the first control circuit, and a part of the plurality of contact pads is electrically connected to the other end of the plurality of wires included in the first wiring portion 103 one by one. connection.
  • the first control circuit combined structure 105 is configured to provide a first electrical signal to the first functional wiring or receive a first electrical signal from the first functional wiring.
  • the first control circuit may be a driver IC chip.
  • packaging methods such as tape carrier package (TCP), chip on film (COF) packaging, and so on.
  • TCP tape carrier package
  • COF chip on film
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are soldered to the multiple contact pads of the flexible circuit board in a one-to-one correspondence (such as eutectic soldering), or through anisotropic conductive glue ( ACF) one-to-one electrical connection, and at least the soldering part is protected by, for example, epoxy resin; in order to increase the bendability of the flexible circuit board in the TCP mode, a slit (Slit) can be formed in the package part.
  • TCP tape carrier package
  • COF chip on film packaging
  • ACF anisotropic conductive glue
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are directly crimped on the multiple contact pads of the flexible circuit board through ACF, so that the multiple pins of the driver IC chip and the flexible circuit
  • the multiple contact pads of the board are electrically connected in one-to-one correspondence.
  • the size and arrangement of the contact pads used to combine the driver IC chip on the flexible circuit board can be adjusted according to different types of packaging or the driver IC chip to be packaged.
  • the contact pads can be arranged long Bars or arranged in rectangles.
  • the embodiment of the present disclosure does not limit the packaging method of the driver IC chip.
  • the main body sub-circuit board 100 of the flexible circuit board 10 may further include a second functional wiring 106.
  • the second functional wiring 106 includes multiple wirings, and the first control circuit Another part of the contact pads in the bonding structure 105 are electrically connected to the multiple wirings included in the second functional wiring 106 in a one-to-one correspondence.
  • the first control circuit mounted on the first control circuit bonding structure 105 is also configured to provide The second functional wiring 106 provides a second electrical signal or receives a second electrical signal from the second functional wiring 106.
  • the main sub-circuit board 100 of the flexible circuit board 10 further includes a third functional wiring 107, and the third functional wiring 107 is located in the first wiring portion 103 and Between the second wiring portions 104, thereby passing through the predetermined space between the first wiring portion 103 and the second wiring portion 104, for example, the third functional wiring 107 is connected to the main body sub-circuit board 100
  • the bridge sub-circuit board 200 crosses in a direction perpendicular to the surface of the main body sub-circuit board 100.
  • the third portion of the wiring 203 on the bridge sub-circuit board 200 crosses the third functional wiring 107 to electrically connect the first portion 103 and the second portion of the wiring 104 on both sides of the main sub-circuit board 100,
  • this design can also simplify the wiring layout of the main body sub-circuit board 100, making the manufacturing process of the main sub-circuit board simple.
  • the first wiring portion 103, the second wiring portion 104, and the third functional wiring 107 are wired in the same direction, such as parallel wiring or substantially parallel wiring (as long as the wiring It does not need to cross), such as parallel wiring in the vertical direction as shown in the figure.
  • the above-mentioned multiple types of traces on the main body sub-circuit board 100 have no crossover parts, and the layout of the traces is simpler.
  • these traces may be arranged in the same trace layer, thereby reducing the number of trace layers and simplifying the layered structure of the flexible circuit board.
  • the flexible circuit board 10 may further include a second control circuit combining structure 108, and the second control circuit combining structure 108 is disposed on the main sub-circuit board 100.
  • the second control circuit combining structure 108 includes a plurality of contact pads for mounting the second control circuit, and at least a part of the plurality of contact pads is electrically connected to one end of the third functional wiring 107 in a one-to-one correspondence.
  • the second control circuit combined structure 108 is configured to provide a third electrical signal to the third functional wiring 107 or receive a third electrical signal from the third functional wiring 107.
  • the third functional wiring 107 is divided into two parts, the first part of the third functional wiring 107 is electrically connected to the first end (the lower end shown in the figure) of the second control circuit combining structure 108, and the third functional wiring The second part of 107 is electrically connected between the second end (shown as the upper end in the figure) of the second control circuit coupling structure 108 and a contact pad (described below) formed on one side edge of the main sub-circuit board 100.
  • the second control circuit may also be a driver IC chip.
  • the first control circuit and the second control circuit are respectively used to implement different driving functions.
  • the method of coupling the driver IC chip to the flexible circuit board is, for example, tape carrier package (TCP), chip on film (COF) package, and the like.
  • the second control circuit bonding structure 108 includes a plurality of contact pads for connecting with the driving IC chip.
  • the size, arrangement, etc. of the contact pads can be adjusted according to different types of packaging methods or drive IC chips to be packaged, which are not specifically limited in the embodiments of the present disclosure.
  • the first control circuit combination structure 105 may also be formed on the bridge sub-circuit board 200.
  • the first wiring The part 103 and the second wiring part 104 are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the third wiring part 203 is divided into two parts, and the third wiring part 203 The first part of is electrically connected between the first control circuit coupling structure 105 and the third bridge terminal 201, and the second part of the third wiring part 203 is electrically connected between the first control circuit coupling structure 105 and the fourth bridge terminal 202 .
  • the first wiring portion 103 and the second wiring portion 104 on the main sub-circuit board 100 are electrically connected to the first control circuit combination structure 105 on the bridge sub-circuit board 200, respectively.
  • the main body sub-circuit board 100 includes a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, and the plurality of bridge sub-circuit boards 200 respectively pass through a plurality of third bridge terminals 201 and a plurality of fourth bridge terminals thereon.
  • 202 is electrically connected to a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, respectively, so as to be mounted on the main body sub-circuit board 100.
  • bridge sub-circuit boards 200 there are two bridge sub-circuit boards 200, but the embodiment of the present disclosure is not limited to this, and the number of bridge sub-circuit boards 200 can be selected according to actual needs. In the embodiment of the present disclosure, the number of bridge sub-circuit boards 200 is not limited.
  • the embodiment of the present disclosure does not specifically limit the arrangement of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 is arranged horizontally, so that the left and right sides of the main sub-circuit board 100 are routed.
  • the wires located in the middle of the main body sub-circuit board 100 pass under the bridge sub-circuit board 200.
  • the arrangement direction of the bridge sub-circuit board 200 can also be bridged vertically, thereby bridging the traces located on the upper and lower sides of the main sub-circuit board 100, and are located on the main sub-circuit board 100.
  • the traces on the left and right sides pass under the bridge sub-circuit board 200.
  • FIG. 5A shows a schematic plan view of another main body sub-circuit board provided by an embodiment of the present disclosure.
  • the main body sub-circuit board adopts a different shape and circuit arrangement from the foregoing embodiment.
  • the main body sub-circuit board is elongated, and the main body sub-circuit board has a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, a second wiring portion 104, and Structures such as the second functional wiring 106 have a similar arrangement to that of the main body sub-circuit board of the foregoing embodiment.
  • Structures such as the second functional wiring 106 have a similar arrangement to that of the main body sub-circuit board of the foregoing embodiment.
  • the third wiring part 107 extends from the middle part of the main body sub-circuit board and is on one side of the main body sub-circuit board ( The lower side shown in the figure) is turned to the left side of the main body sub-circuit board, and is electrically connected to the terminal 111 on the left side of the main body sub-circuit board.
  • the terminal 111 has a plurality of contact pads, and the plurality of wires in the third wiring portion 107 correspond to the plurality of contact pads on the terminal 111 and are electrically connected.
  • the terminal 111 may be used for electrical connection with other display devices or control chips, which are not limited in the embodiment of the present disclosure.
  • the main sub-circuit board may have a single-layer wiring structure or a multi-layer wiring structure (such as a double-layer wiring structure or a three-layer wiring structure, etc.), which is not done in the embodiments of the present disclosure. limited.
  • the outer contour shape of the bridge sub-circuit board 200 is an asymmetric structure.
  • the second bridge terminal 102 and the first wiring portion 103 as shown in FIG. 5A are asymmetrical.
  • FIG. 6A shows a schematic cross-sectional view of a main sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line A-A in FIG. 2.
  • the main sub-circuit board 100 has a single-layer wiring structure.
  • the main body sub-circuit board 100 includes a first substrate 1001 and a first main body wiring layer 1002 and a first main body insulating layer 1003 stacked on one side of the first substrate 1001.
  • the first main wiring layer 1002 includes a first wiring portion 103, a second wiring portion 104, a first bridge terminal 101, and a second bridge terminal 102.
  • the first bridge terminal 101 and the second bridge terminal 102 are separated by the first The body insulating layer 1003 is exposed.
  • the first main body insulating layer 1003 serves as a protective layer to provide structural and electrical protection to the first main body wiring layer 1002.
  • the first main body insulating layer 1003 may be bonded to the first main body through an adhesive layer (not shown in the figure).
  • an opening 1013 is formed in the first main insulating layer 1003, and in the opening 1013, for example, the exposed portion of the first wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 can be surface treated (for example, The solder layer is plated), thereby forming a plurality of patterned contact pads, correspondingly forming the first bridge terminal 101 or the second bridge terminal 102.
  • the main body sub-circuit board further includes the second function wiring 106 and the third function wiring 107
  • the second function wiring 106 and the third function wiring 107 are also arranged in the first wiring layer 1002.
  • the main body sub-circuit board has a single-layer wiring structure with a single-layer wiring layer.
  • FIG. 6B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line A-A in FIG. 2, for example.
  • the main sub-circuit board 100 has a multi-layer wiring structure.
  • the main sub-circuit board 100 has a double-layer wiring structure as an example for description with reference to FIG. 6B, but the embodiment of the present disclosure does not limit this.
  • the main body sub-circuit board 100 includes a first substrate 1001, a first main body wiring layer 1002 and a first main wiring layer 1002 and a first substrate 1001 that are located on the first side of the first substrate 1001 (shown as the upper side in the figure).
  • a main insulation layer 1003 further includes a second main wiring layer 1004 and a second main insulation layer 1005 which are located on the second side of the first substrate 1001 (shown as the lower side in the figure) and stacked.
  • the first main body insulating layer 1003 serves as a protective layer to provide structural and electrical protection to the first main body wiring layer 1002.
  • the first main body insulating layer 1003 can be bonded to the first main body wiring through an adhesive layer (not shown in the figure) Layer 1002 and the first substrate 1001; the second insulating layer 1005 is used as a protective layer to provide structure and electrical protection for the second main body wiring layer 1004, for example, the second main body insulating layer 1005 may pass through an adhesive layer (not shown in the figure) Bonded to the second main wiring layer 1004 and the first substrate 1001.
  • the first main wiring layer 1002 includes a first wiring portion 103 and a second wiring portion 104.
  • the first wiring portion 103 and the second wiring portion 104 can be routed on the first main body.
  • the wiring layer 1002 and the second main wiring layer 1004 are arranged crosswise.
  • the two wirings of the first wiring portion 103 adjacent to each other on the board surface of the main body sub-circuit board 100 can be respectively located on the first main wiring layer 1002 and the second main wiring layer 1004, thereby facilitating wiring layout.
  • the second wiring part 104 can also be similarly arranged.
  • the second functional wiring 106 and the third functional wiring 107 can also be on the first main wiring layer 1002 and the second functional wiring layer 1002.
  • the main wiring layer 1004 is arranged crosswise.
  • the first main wiring layer 1002 may include a first wiring portion 103 and a second wiring portion 104
  • the second main wiring layer 1004 may include a second functional wiring 106 and a third functional wiring 107, that is, different
  • the wiring layer can be arranged with different functional wiring.
  • the embodiment of the present disclosure does not specifically limit the wiring layout on the main body sub-circuit board 100.
  • the wiring in the second main wiring layer 1004 has a similar arrangement to the wiring in the first main wiring layer 1002, and each wiring in the second main wiring layer 1004 can pass through Vias (such as the black dots shown in FIG. 5B) are electrically connected to the first body wiring layer 1002 and are exposed by the corresponding insulating layer to form a bridge terminal.
  • the first bridge terminal 101 and the second bridge terminal 102 may be exposed by the first body insulating layer 1003.
  • an opening 1013 is formed in the first body insulating layer 1003, and in the opening 1013, for example, a portion of the exposed first body wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 can be processed.
  • a plurality of patterned contact pads are formed, corresponding to the first bridging terminal 101 or the second bridging terminal 102; similarly, for the wiring located in the second main wiring layer 1004, it can be passed through
  • the via hole 1011 in the first substrate 1001, the first main body wiring layer 1002 and the opening 1013 of the first main body insulating layer 1003 form a bridge end.
  • the via hole 1011 in the first substrate 1001 and the opening 1013 of the first main insulating layer 1003 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1013 is relatively flat, which facilitates the formation of contact pads.
  • the first bridge terminal 101 and the second bridge terminal 102 may be exposed on different sides of the main body sub-circuit board, respectively, so that the first bridge terminal 101 and the second bridge terminal 102 are arranged on the main body sub-circuit board. Different sides.
  • FIG. 7A shows a schematic cross-sectional view of a main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line C-C in FIG. 2.
  • the main body sub-circuit board has a single-layer wiring structure.
  • the first bridge terminal 101 of the main body sub-circuit board is exposed by the first main insulating layer 1003, as shown in FIG. 6A; the second bridge terminal 102 is exposed by the first substrate 1001, thereby connecting the first bridge terminal 101 and the second bridge terminal 102 Set on different sides of the main body sub-circuit board.
  • FIG. 7B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line C-C in FIG. 2.
  • the main body sub-circuit board has a double-layer wiring structure.
  • the first bridge terminal 101 of the main body sub-circuit board is exposed by the first main insulating layer 1003, as shown in FIG. 6B; the second bridge terminal 102 is exposed by the second main insulating layer 1005, thereby connecting the first bridge terminal 101 and the second bridge
  • the terminals 102 are arranged on different sides of the main body sub-circuit board.
  • the main body sub-circuit board may also have a multilayer wiring structure such as a three-layer wiring structure, a four-layer wiring structure, and the like.
  • various parts of the wiring on the main sub-circuit board such as the first wiring part, the second wiring part, the second function wiring, and the third function wiring, may be arranged in a multilayer wiring layer.
  • the first wiring part, the second wiring part, the second functional wiring, and the third functional wiring are alternately arranged in multiple wiring layers, or arranged in different wiring layers.
  • the embodiment of the present disclosure does not specifically limit the number of wiring layers and the wiring arrangement of the main body sub-circuit board.
  • the bridge sub-circuit board can also have a single-layer wiring structure or a multi-layer wiring structure.
  • FIG. 8A shows a schematic cross-sectional view of a bridge sub-circuit board provided by some embodiments of the present disclosure. The cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge daughter circuit board 200 has a single-layer wiring structure.
  • the bridge sub-circuit board 200 includes a second substrate 2001, a first bridge wiring layer 2002 and a first bridge insulation layer on the first side (the upper side shown in the figure) of the second substrate 2001.
  • Layer 2003, the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridging insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridging wiring layer 2002.
  • the first bridging insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge insulation layer on the first side (the upper side shown in the figure) of the second substrate 2001.
  • the second substrate 2001 has an opening 2011, and in the opening 2011, for example, a portion of the exposed first bridge wiring layer 2002 corresponding to the third bridge end 201 or the fourth bridge end 202 may be subjected to surface treatment to form The patterned multiple contact pads form the third bridge end 201 or the fourth bridge end 202 correspondingly.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006, and the shielding layer 2006 is disposed on the side of the second substrate 2001 away from the first bridge wiring layer 2002.
  • the shielding layer 2006 may be grounded, so as to achieve an electromagnetic shielding effect and prevent signal crosstalk from the wiring in the main sub-circuit board and the bridge sub-circuit board.
  • the shielding layer 2006 has a hollow structure 2016 that corresponds to the opening 2011 in the second substrate 2001 to expose the third bridge end 201 or the fourth bridge end 202.
  • FIG. 8C shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge sub-circuit board 200 has a multi-layer structure. The following describes with reference to FIG. 8C taking the bridge sub-circuit board 200 having a double-layer structure as an example, but the embodiment of the present disclosure does not limit this.
  • the bridge sub-circuit board 200 includes a second substrate 2001, and a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side (the upper side shown in the figure) of the second substrate 2001.
  • the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridging insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridging wiring layer 2002.
  • the first bridging insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge wiring layer 2002 and the second substrate 2001.
  • the bridge sub-circuit board 200 may further include a second bridge wiring layer 2004 on a second side (shown as the lower side in the figure) opposite to the first side of the second substrate 2001 and The second bridge insulating layer 2005 is laminated on the second bridge wiring layer 2004.
  • the second bridging wiring layer 2004 may also include a third wiring portion 203.
  • the third wiring portions 203 may be alternately arranged in the first bridging wiring layer 2002 and the second bridging wiring layer 2004.
  • two traces of the third trace portion 203 adjacent to each other on the board surface of the bridge sub-circuit board 200 may be located in the first bridging trace layer 2002 and the second bridging trace layer 2004 respectively, thereby facilitating Wiring arrangement.
  • the dotted line in FIG. 8D indicates that the wiring portions located on both sides of the second bridge wiring layer 2004 are not electrically connected.
  • the third wiring portion 203 located on the first side of the bridge sub-circuit board 200 is exposed and led out through the vias 2011 in the second substrate 2001 and the openings 2015 in the second bridge insulating layer 2005, such as patterning by surface treatment A plurality of contact pads formed to form the third bridge end 201 or the fourth bridge end 202.
  • the opening 2015 in the second bridge insulating layer 2005 is formed at the position indicated by the dashed frame shown in FIG. 8C or at other suitable positions, which is not limited in the embodiment of the present disclosure.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 is, for example, provided on the second bridging insulating layer 2005. The side away from the second substrate 2001.
  • the shielding layer 2006 is grounded to achieve an electromagnetic shielding effect.
  • the shielding layer 2006 has a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby forming the exposed third bridging end 201 or the fourth bridging end 202.
  • the shielding layer 2006 is located between the wiring layer in the main sub-circuit board 100 and the wiring layer bridging the sub-circuit board 200, and the shielding layer 2006 can prevent the wiring layer in the main sub-circuit board 100 from bridging the sub-circuit Signal crosstalk occurs between the wiring layers of the board 200.
  • the second bridge wiring layer 2004 may be a ground layer including multiple ground wirings.
  • the third wiring portion 203 may be all disposed in the first bridging wiring layer 2002.
  • the third wiring portion 203 may be partially disposed in the first bridging wiring layer 2002, and another part is disposed in the second bridging wiring layer 2004.
  • the second bridging wiring layer The ground traces in the layer 2004 and some traces of the third trace portion 203 may be arranged alternately. Therefore, the second bridge wiring layer 2004 can also play a role in preventing signal crosstalk.
  • the grounding layer 2004 and the shielding layer 2006 can achieve a double shielding effect, preventing the wires on the main sub-circuit board 100 from bridging the wires on the sub-circuit board 200 Signal crosstalk occurs.
  • the bridge sub-circuit board 200 may further include an insulating layer (not shown in the figure) outside the shielding layer 2006 (that is, the side away from the second substrate 2001) to protect the shielding layer 2006.
  • the insulating layer may be bonded to the shielding layer 2006 through an adhesive layer.
  • the insulating layer may further include an opening corresponding to the opening 2015 and the hollow structure 2016 to expose the bridging end.
  • the via hole 2011 in the second substrate 2001 and the opening 2015 of the second bridging insulating layer 2005 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1015 is relatively flat, which facilitates the formation of contact pads.
  • the third bridge terminal 201 or the fourth bridge terminal 202 of the bridge sub-circuit board 200 may be exposed on different sides of the bridge sub-circuit board 200, so that the third bridge terminal 201 and the fourth bridge terminal are exposed.
  • 202 is arranged on different sides of the bridge sub-circuit board 200.
  • FIG. 9A shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line D-D in FIG. 3A.
  • the bridge daughter circuit board has a single-layer wiring structure.
  • the third bridge end 201 of the bridge sub-circuit board is exposed by the second substrate 2001, as shown in FIG. 8A; the fourth bridge end 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9A,
  • the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • FIG. 9B shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line D-D in FIG. 3A, for example.
  • the bridge sub-circuit board has a double-layer wiring structure.
  • the third bridge terminal 201 of the bridge sub-circuit board is exposed by the second bridge insulating layer 2005, as shown in FIG. 8C; the fourth bridge terminal 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9B Therefore, the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • the bridge sub-circuit board may also have a three-layer wiring structure, a four-layer wiring structure and other multilayer wiring structures.
  • the third part of the wiring on the bridge sub-circuit board can be arranged in a multilayer wiring layer.
  • the third part of the wiring can be alternately arranged in multiple wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the bridge sub-circuit board.
  • the third bridge terminal 201 and the fourth bridge terminal 202 of the bridge sub-circuit board may be electrically connected to the first bridge terminal 101 and the first bridge terminal 101 on different sides of the main sub-circuit board.
  • the second bridge terminal 102 or when the first bridge terminal 101 and the second bridge terminal 102 of the main body sub-circuit board are arranged on different sides of the main body sub-circuit board, and bridge the third bridge terminal 201 and the fourth bridge terminal of the sub-circuit board
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board can be electrically connected to the first bridge end 101 and the first bridge end 101 on different sides of the main sub-circuit board by bending.
  • the second bridge terminal 102 so that the bridge sub-circuit board can be bridged on the main sub-circuit board in a form similar to a "issue card".
  • the first substrate 1001 and the second substrate 2001 can be made of flexible materials such as polyimide or polyester, each wiring layer can be made of copper, silver, aluminum and other metal materials or alloy materials, and each insulating layer can be made of polyimide. Insulating materials such as amine or polyester.
  • the grounding layer 2004 is made of metal materials (such as copper layer or copper foil).
  • the shielding layer 2006 includes an insulating base and a conductive material filled in the insulating base.
  • the insulating base is made of epoxy resin and filled with conductive material.
  • the material is copper powder, graphite powder, etc.; or, in some embodiments, the shielding layer 2006 may also be a metal material.
  • the present disclosure does not specifically limit the material of each functional layer; the bonding layer is epoxy resin or polyethylene.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are respectively connected to the first bridge end 101 and the second bridge end of the main sub-circuit board 100 through anisotropic conductive glue, soldering material or a connector. 102.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, so as to be connected by a male
  • the mating of the connector and the female connector connects the bridge daughter circuit board 200 and the main body daughter circuit board 100.
  • the flexible circuit board provided by the embodiment of the present disclosure has a main body sub-circuit board and a bridge sub-circuit board, and the wiring on both sides of the main sub-circuit board is bridged by the bridge sub-circuit board, which can prevent the wiring from crossing on the main sub-circuit board. Therefore, it is possible to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure.
  • the main sub-circuit board and the bridge sub-circuit board have a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of manufacturing the main sub-circuit board and the bridge sub-circuit board.
  • FIG. 10A shows a schematic diagram of the electronic device module.
  • the electronic device module 1 includes an electronic device substrate 11 and any of the above-mentioned flexible circuit boards 10, and the electronic device substrate 11 includes a first functional circuit structure 20.
  • the first functional wiring (including the first wiring portion 103, the second wiring portion 104 and the third wiring portion 203) of the flexible circuit board 10 is electrically connected to the first functional circuit structure 20.
  • the flexible circuit board 10 further includes a second functional wiring 106
  • the first functional circuit structure 20 includes a first signal transmission portion 21 and a second signal transmission portion 22, and the first functional wiring is electrically connected to the second signal transmission portion.
  • a signal transmission part 21, and the second function wiring 106 is electrically connected to the second signal transmission part 22.
  • the electronic device substrate 11 further includes a second functional circuit structure 23, and the flexible circuit board further includes a third functional wiring 107, and the third functional wiring 107 is electrically connected to the second functional circuit structure 23.
  • the electronic device substrate 11 is a substrate with a display function and a touch function.
  • the first functional circuit structure 20 is a touch circuit structure
  • the second functional circuit structure 23 is a display circuit structure.
  • the electronic device substrate 11 is a substrate with a display function and a fingerprint recognition function.
  • the first functional circuit structure 20 is a fingerprint recognition circuit structure.
  • the fingerprint recognition circuit structure is a capacitive fingerprint recognition circuit.
  • the second functional circuit structure 23 is a display circuit structure including the detection driving electrodes and the detection sensing electrodes that are arranged crosswise.
  • the first functional circuit structure 20 is a touch circuit structure as an example for description.
  • the arrangement of the touch circuit structure on the electronic device substrate 11 may be a built-in type or an externally mounted type.
  • the form of the touch circuit structure may be capacitive, for example, a mutual capacitive touch circuit structure.
  • the mutual-capacitive touch circuit structure includes a plurality of first electrodes extending in a first direction and a plurality of second electrodes extending in a second direction (intersecting the first direction).
  • a detection capacitance will be formed, that is, the two sets of electrodes respectively constitute the two poles of the capacitance.
  • the capacitance change data of the touch circuit structure and the coordinates of each capacitance the coordinates of each touch point can be obtained.
  • the horizontal electrode is used as a touch drive circuit to send out excitation signals in turn
  • the vertical electrode is used as a touch sensing circuit to receive signals simultaneously or sequentially, so that the capacitance value of the intersection of all horizontal and vertical electrodes can be obtained, that is, the entire touch
  • the capacitance of the two-dimensional plane of the structure Therefore, even if there are multiple touch points on the touch structure, the true coordinates of each touch point can be determined.
  • the first signal transmission part 21 may include touch driving traces electrically connected to a touch drive (Tx) circuit of the touch circuit
  • the second signal transmission part 22 may include touch driving traces electrically connected to the touch circuit.
  • the first control circuit 1051 is a touch drive IC, which can provide an excitation signal to the touch drive circuit through the touch drive trace, and can receive the sensing signal of the touch sensing circuit through the touch sensing trace, and can be based on the above The signal determines the touch position and responds.
  • the touch driving circuit is bridged, and the touch sensing circuit is directly electrically connected to the first control circuit combining structure 105.
  • the distance between the touch sensing circuit and the first control circuit combining structure 105 is closer.
  • the first control circuit 1051 installed on the touch control circuit 1051 is closer to the touch driver IC, so the sensing signal received by the touch sensing circuit is transmitted to the touch driver IC in a shorter path, so the sensing signal may be interfered by the signal Smaller, which can make the touch operation more accurate.
  • the touch driving wiring and the touch sensing wiring extend to the same side of the electronic device substrate 11 (the lower side in the figure), and are connected to the contact pad 211 and the contact pad 221 formed on the side. Electrically connect separately.
  • the first signal transmission part 21 may also include touch sensing traces electrically connected to the touch sensing (Rx) circuit of the touch circuit, and the second signal transmission part 22 may include electrical connections.
  • the touch sensing circuit is bridged, and the touch drive circuit is directly electrically connected to the first control circuit combination structure 105, so the touch drive circuit and The first control circuit combination structure 105 is closer, that is, it is closer to the first control circuit 1051, that is, the touch drive IC mounted on it. Therefore, in this embodiment, the touch control circuit in the touch drive circuit The driving signal is less likely to be interfered by the signal.
  • the flexible circuit board 10 has a terminal 110 on one side (for example, the upper side in the figure), a plurality of contact pads are provided on the terminal 110, and the other end of the plurality of wires included in the second wiring portion 104 is connected to the wiring.
  • Part of the contact pads in the terminal 110 are electrically connected in a one-to-one correspondence
  • the other ends of the multiple wires included in the second functional wiring 106 are electrically connected in a one-to-one correspondence with another part of the contact pads in the terminal 110
  • the third functional wiring The other ends of the multiple traces included in 107 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence.
  • part of the contact pads respectively electrically connected to the second wiring portion 104, the third functional wiring 107, and the second functional wiring 106 are arranged at intervals or continuously at the terminal 110, which is not specifically described in the embodiment of the present disclosure. limited.
  • the contact pads connected to them can be arranged continuously on the terminal 110; when the second wiring portion 104.
  • the contact pads connected to them can be arranged at intervals on the terminal 110.
  • the spaced arrangement shown in FIG. 10A can be formed Multiple sets of contact pads.
  • the terminal 110 is arranged in the wiring area 110A of the main sub-circuit board (that is, the oblique area below the terminal 110 in the figure).
  • the wiring area 110A only has a wiring layer and a part of an insulating layer, but does not have a shielding layer. Therefore, the wiring area 110A has high transparency.
  • a clear alignment can be achieved to facilitate accurate electrical connection between the flexible circuit board 10 and the electronic device substrate 11.
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 can be directly crimped together, for example, in
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 are electrically connected to each other through, for example, ACF, thereby connecting the first functional wiring on the flexible circuit board 10 to
  • the touch driving trace connected to the first signal transmission part 21 is electrically connected through the contact pad 211
  • the touch sensing trace connecting the second function trace on the flexible circuit board and the second signal transmission part 22 is electrically connected through the contact pad 221. Connection, thereby electrically connecting the first functional wiring and the second functional wiring of the flexible circuit board 10 with the touch circuit structure of the electronic device substrate 11.
  • the second functional circuit structure 23, that is, the display circuit structure, includes multiple data lines (and also gate lines, etc.), the multiple data lines are respectively electrically connected to the pixel units, and the multiple data lines extend to the electronic device substrate 11 On one side (the lower side in the figure), and is electrically connected to the contact pad 231 formed on the side.
  • the pixel unit includes a display driving circuit, for example, the display driving circuit includes a plurality of transistors, capacitors, and light emitting devices, for example, formed in various forms such as 2T1C, 3T1C, or 7T1C.
  • the multiple contact pads on the terminals 110 of the flexible circuit board 10 also combine the third functional wiring on the flexible circuit board with the second functional circuit structure
  • the data lines in 23 are electrically connected through the contact pads 231, thereby electrically connecting the third function traces of the flexible circuit board 10 and the display circuit structure of the electronic device substrate 11.
  • the main sub-circuit board 100 may also have a second control circuit combination structure 108 and a second control circuit 1081 provided on the second control circuit combination structure 108.
  • the second control circuit 1081 is a display driver IC, which can provide data signals for the display driver circuit, so that the light-emitting state of the light-emitting device can be controlled by the data line number provided by the display driver IC to achieve different display effects.
  • the pixel unit includes a switching element and a first electrode (pixel electrode) and a second electrode (common electrode) for controlling the deflection of liquid crystal, and the switching element is electrically connected to the first electrode.
  • the second functional circuit structure 23 that is, the display circuit structure, includes multiple data lines respectively connected to the pixel unit.
  • the second control circuit is a display driver IC, which can provide different data voltage signals to the pixel unit through the data lines. So as to control the twisting state of the liquid crystal to achieve different display effects.
  • the flexible circuit board is bonded to the electronic device substrate 11 by binding.
  • the flexible circuit board can be bent to the back of the electronic device substrate 11 and fixed after being bound to the electronic device substrate 11 , Which is installed on the non-display side of the electronic device substrate 11 to facilitate the large-screen design of the display screen.
  • the wiring parts on the main body sub-circuit board that are respectively electrically connected to the touch drive circuit are bridged by the bridge sub-circuit board, so that the main body sub-circuit The on-board touch drive circuit and the display drive circuit do not intersect, and they are also shielded from each other at the intersection of the main sub-circuit board and the bridge sub-circuit board, so the signal routing in the main sub-circuit board and the bridge sub-circuit board can be avoided.
  • the main sub-circuit board and the bridge sub-circuit board have a simple structure and simple wiring layout, which is beneficial to simplify the manufacturing process.
  • FIG. 11 shows a schematic diagram of the display device.
  • the display device 2 includes any of the above electronic device modules, and the electronic device module includes an electronic device substrate 11 and a flexible circuit board 10.
  • the upper side of the electronic device substrate 11 shown in FIG. 11 is the display side, and the lower side is the non-display side; at this time, the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound.
  • the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound.
  • the display device 2 may be, for example, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the embodiment of the present disclosure does not specifically limit this.
  • Some embodiments of the present disclosure provide a manufacturing method of a flexible circuit board. As shown in FIG. 12, the manufacturing method includes steps S101-S103.
  • Step S101 Provide the main body sub-circuit board.
  • the main body sub-circuit board 100 includes a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103 and a second wiring portion 104, the first wiring portion 103 and the second wiring portion 104 are mutually Spaced apart and electrically connected to the first bridge terminal 101 and the second bridge terminal 102 respectively.
  • the main body sub-circuit board 100 is formed by sequentially forming a first wiring layer 1002 and a first insulating layer 1003 on the first substrate 1001.
  • the first substrate 1001 is made of polyimide or polyester
  • the first wiring layer 1002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first insulating layer 1003 is also made of polyimide or polyester.
  • other materials for example, firstly, a copper metal layer is formed on the first substrate 1001 by sputtering, and then the copper metal layer is patterned to form the first wiring layer 1002, and then the first wiring layer 1002 is formed by coating or the like.
  • a first insulating layer 1003 is formed thereon, and openings are formed in the first insulating layer 1003 to form structures such as bridge ends.
  • Step S102 Provide a bridge sub-circuit board.
  • the bridge sub-circuit board 200 includes a third bridge end 201, a fourth bridge end 202 and a third wiring portion 203, and the third bridge end 201 and the fourth bridge end 202 are electrically connected by the third wiring portion 203.
  • the bridge sub-circuit board 200 is formed by sequentially forming a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side of the second substrate 2001.
  • the first substrate 2001 is made of polyimide or polyester
  • the first bridge wiring layer 2002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first bridge insulating layer 2003 is also made of polyimide or Materials such as polyester.
  • a first bridging insulating layer 2003 is formed on the layer 2002.
  • forming the bridge sub-circuit board 200 further includes sequentially forming a second bridge wiring layer 2004 and a second bridge insulating layer on the second side of the second substrate 2001 opposite to the first side. 2005.
  • the second bridging wiring layer 2004 may be a grounding layer, using materials such as copper, and the second bridging insulating layer 2005 using materials such as polyimide or polyester.
  • openings are formed in the second substrate 2001 and the second bridge insulating layer 2005 by patterning, etc., and the third wiring portion 203 formed on the first side of the bridge sub-circuit board 200 passes through the second substrate 2001
  • the vias 2011 in the second bridge insulating layer 2005 and the opening 2015 in the second bridge insulating layer 2005 are exposed and lead out.
  • a plurality of contact pads are formed by surface treatment to form bridge ends.
  • forming the bridge sub-circuit board 200 further includes forming a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 may be suspended or configured to be electrically connected to the ground wire.
  • the second bridge wiring layer 2004 when the second bridge wiring layer 2004 is a ground layer, an opening 2025 is also formed in the second bridge insulating layer 2005, and the shielding layer 2006 is connected to the second bridge through the opening 2025.
  • the ground traces in the trace layer 2004 are electrically connected.
  • the shape of the via hole 1011 and the opening 2011, for example, the cross-sectional view is an inverted H shape, from the perspective of the top view, and the first main wiring layer 1002 and the first bridge wiring layer 2002
  • the outer diameter of the contact surface is larger than the outer diameter of the first substrate 1001 and the outer diameter of the second substrate 2001, and the outer diameter of the contact surface of the second main wiring layer 1004 and the second bridge wiring layer 2004 is larger than that of the first substrate 1001 and the outer diameter of the second substrate 2001 in one layer.
  • the via hole 1011 and the opening 2011 make the upper and lower layers (the first body wiring layer 1002 and the second body wiring layer 1004, the first bridge wiring layer 2002 and the second bridge wiring layer 2004) conductive.
  • the ground layer 2004 and the shielding layer 2006 can play a double shielding role, preventing the wires on the main body sub-circuit board 100 from each other on the bridge sub-circuit board 200.
  • Signal crosstalk occurs on the line.
  • the shielding layer 2006 is formed with a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby exposing the bridging end.
  • the shielding layer 2006 includes an insulating substrate and a conductive material filled in the insulating substrate.
  • the insulating substrate is made of epoxy resin, and the filled conductive material is copper powder, graphite powder, etc.; or in some embodiments, the shielding layer 2006 may also It is a metal material, which is not specifically limited in the embodiments of the present disclosure.
  • the shielding layer may be directly attached to the second side of the bridge sub-circuit board 200 after being formed.
  • Step S103 Mount the bridge sub-circuit board on the main sub-circuit board.
  • the third bridge terminal 201 and the fourth bridge terminal 202 of the bridge sub-circuit board 200 are respectively electrically connected to the first bridge terminal 101 and the second bridge terminal 102 of the main body sub-circuit board 100 to bridge the sub-circuit board
  • the 200 is mounted on the main body sub-circuit board 100, and the first wiring portion 103, the third wiring portion 203, and the second wiring portion 104 are sequentially electrically connected to obtain the first functional wiring.
  • the second side of the bridge sub-circuit board 200 is closer to the main sub-circuit board 100 than the first side, so that the wires on the main sub-circuit board 100 and the wires on the bridge sub-circuit board 200 can pass through the ground layer 2004 and the shielding layer 2006 are shielded to prevent signal crosstalk.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 can be connected to the first bridge end 101 and the second bridge end 101 and the second bridge end of the main body sub-circuit board 100, respectively, by hot pressing, soldering, or by connectors.
  • Two bridging end 102 For example, in the hot pressing method, an anisotropic conductive adhesive is formed between two bridge terminals, and then the bridge terminals are subjected to a hot pressing operation to connect the two bridge terminals together with the anisotropic conductive adhesive.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, so that the The mating of the connector and the female connector connects the bridge daughter circuit board 200 to the main body daughter circuit board 100.
  • the manufacturing method of the flexible circuit board of the embodiment of the present disclosure provides a main body sub-circuit board and a bridge sub-circuit board, and bridges the traces located on both sides of the main sub-circuit board through the bridging sub-circuit board.
  • the sub-circuit boards are crossed to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure; in addition, the main sub-circuit board and the bridge sub-circuit board provided by the manufacturing method It has a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of manufacturing the main sub-circuit board and the bridge sub-circuit board.
  • FIG. 13 is a schematic diagram of the main circuit board in an exemplary embodiment of the circuit board structure of the disclosure
  • FIG. 14 is a schematic diagram of the main circuit board in an exemplary embodiment of the circuit board structure of the disclosure.
  • FIG. 15 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the disclosure. As shown in FIGS. 13, 14 and 15, the circuit board structure includes a main circuit board 1111, a transfer circuit board 222, and a connector 3.
  • the main circuit board has a double circuit layer structure and carries the main board overlap terminal 4; the transfer circuit board 222 has a double circuit layer structure, is stacked on the main circuit board 1111, and carries the first device group for overlapping the first device group.
  • both the main circuit board and the switching circuit board can be provided with a circuit layer, and the circuit layer can include circuit leads and device overlap ends.
  • the circuit board structure provided by the present disclosure can realize the stacking of circuit layers by stacking the main circuit board layer and the switching circuit board, thereby reducing the space occupied by the circuit board structure; on the other hand, the double circuit layer circuit board The production process is mature and the structure design is simple, which can reduce the design cost of the circuit board.
  • switching circuit board there is one switching circuit board. It should be understood that in other exemplary embodiments, there may be multiple switching circuit boards.
  • the jumper board lap terminal 7 and the main board lap terminal 4 may be pin groups respectively.
  • the main board lap end 4 can be set on the side of the main circuit board facing the transfer circuit board; the transfer board lap end 7 can be set on the transfer circuit board away from the main circuit board.
  • One side of the circuit board can also be arranged on the side of the transfer circuit board facing the main circuit board.
  • the connector may be a plug-in connector, a snap-on connector, a welding connector, and the like.
  • the connector may be a snap-on connector, and the lap end 7 of the adapter board may be arranged on the side of the adapter circuit board facing the main circuit board.
  • the snap-on connector may include a first connecting portion and a second connecting portion.
  • the first connecting portion may be fixed to the side of the adapter circuit board facing the main circuit board to connect to the lap end 7 of the adapter board, and the second connecting portion may be fixed On the main circuit board to connect the motherboard lap terminal 4.
  • the connector may be a welded connector, and the lap end 7 of the adapter board may be arranged on the side of the adapter circuit board away from the main circuit board. In this connection method, the corresponding pins in the lap terminal 7 of the adapter board and the lap terminal 4 of the main board can be welded by solder paste.
  • FIG. 16 is a schematic structural diagram of another exemplary embodiment of the circuit board structure of the present disclosure.
  • a second lead set 62 may be provided on the main circuit board, and the orthographic projection of the transfer circuit board 222 on the main circuit board 1111 covers at least a part of the second lead set 62.
  • the first lead group 61 and the second lead group 62 are stacked to reduce the space occupied by the circuit board structure.
  • the main circuit board may also carry a second device lap terminal 52 for bonding the second device group, and the second device lap terminal 52 may be connected to the second lead group. 62.
  • the overlapping end 52 of the second device may be located at a position of the transfer circuit board outside the orthographic projection of the main circuit board.
  • the connector can be a ZIF connector or a BTB connector.
  • the ZIF connector and the BTB connector have low impedance and stable performance, the overlap resistance can be less than 10 ⁇ , and the impedance of each overlap channel Good consistency.
  • the circuit board structure provided by the exemplary embodiment of this embodiment has almost no difference in power consumption test data.
  • the main circuit board also carries a first external pin group 91; part of the first external pin group 91 is connected to the motherboard lap 4 to connect part In the first lead group 61, part of the first external pin group 91 is connected to the second lead group 62.
  • the main circuit board also carries a second external pin group 92; part of the second external pin group 92 is connected to the second lead group 62, and some The second external pin group 92 is connected to the lap terminal 4 of the motherboard to connect part of the first lead group.
  • the first external pin group 91 and the second external pin group 92 may be externally connected to signal terminals.
  • the circuit board structure can be applied to a display panel
  • the first external pin group 91 can be connected to the signal terminal of the display panel
  • the second external pin group 92 can be connected to an external chip.
  • the first lead group 61 can be used to transmit touch-related signals
  • the second lead group 62 can be used to transmit display-related signals
  • the first device lap terminal 51 can be used to lap contact control related chips
  • the second device lap terminal 52 Can be used to lap display related chips.
  • the display panel outputs touch-related signals.
  • the touch-related signals pass through part of the first external pin group 91, the motherboard lap terminal, the connector, the adapter board lap terminal, and part of the first lead group. 61 is transmitted to the lap terminal 51 of the first device.
  • the touch-related chip connected to the lap terminal 51 of the first device receives the touch-related signal and outputs another touch-related signal.
  • the other touch-related signal passes through part of the first device.
  • the lead group 61, the lap end of the adapter board, the connector, and the lap end of the main board are output to the second external pin group 92.
  • the display-related signals are transmitted to the second device lap terminal 52 through part of the first external pin group 91 and the second lead group 62, and the display-related chip connected to the second device lap terminal 52 receives the Display related signals and output another display related signal, and output another display related signal to the second external pin group 92.
  • the first lead group 61 can also be used to transmit other related signals, for example, fingerprint unlocking related signals, brightness sensing related signals, and the like.
  • the circuit board structure can also be applied to other technical fields other than the display panel, which all fall within the protection scope of the present disclosure.
  • FIG. 17 is a schematic structural diagram of an exemplary embodiment of the circuit board structure of the disclosure.
  • the circuit board structure may further include a shielding layer 8, and the shielding layer 8 may be stacked between the main circuit board 1111 and the switching circuit board 222.
  • the orthographic projection of the switching circuit board 222 may be located on the shielding layer 8, and the shielding layer may be used to shield the signals of the main circuit board and the circuits on the switching circuit board.
  • the shielding layer may be an EMI shielding layer.
  • the main board lap end includes a plurality of sub main board lap ends
  • the adapter board lap end includes a plurality of sub adapter board lap ends, and there are multiple connectors
  • the lap end of the main board and the lap end of the sub-lap board are connected in one-to-one correspondence through the plurality of connectors.
  • the number of overlapping terminals of the sub-main board can be set according to actual conditions.
  • FIG. 18 is a schematic structural diagram of a main circuit board in an exemplary embodiment of the circuit board structure of the present disclosure
  • FIG. 19 is a schematic structural diagram of a transfer circuit board in an exemplary embodiment of the circuit board structure of the disclosure
  • the main board lap end 4 may include two sub-main board lap ends 41, 42, and the two sub-main board lap ends 41, 42 may be respectively disposed on the second lead set 62.
  • the adapter board overlap end 7 may include two sub adapter board overlap ends 71 and 72.
  • the sub-main board lap end 41 is connected to the sub-adapter board lap end 71 through the connector 31, and the sub-master board lap end 42 is connected to the sub-adapter board overlap end 72 through the connector 32.
  • At least one of the main circuit board and the switching circuit board may be a flexible circuit board. It should be understood that, in other exemplary embodiments, the main circuit board or the switching circuit board The circuit board may also be a non-flexible circuit board, which all fall within the protection scope of the present disclosure.
  • the main circuit board may include a first substrate and circuit layers located on both sides or one side of the first substrate, wherein the circuit layers located on both sides of the first substrate may pass through the substrate Holes are electrically connected;
  • the transfer circuit board may include a second substrate and circuit layers located on either side or one side of the second substrate, wherein the circuit layers located on both sides of the second substrate can be electrically connected through vias on the substrate connection.
  • the exemplary embodiment also provides a display panel including the above-mentioned circuit board structure.
  • the display panel can be applied to display devices such as TVs, mobile phones, and tablet computers.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé souple et son procédé de fabrication, et un dispositif d'affichage. La carte de circuit imprimé souple comprend une carte de sous-circuit de corps principal et une carte de sous-circuit en pont; la carte de sous-circuit de corps principal comprend un premier substrat, ainsi qu'une première extrémité de pont, une deuxième extrémité de pont, une première partie câblée et une deuxième partie câblée disposée sur le premier substrat, la première partie câblée et la deuxième partie câblée étant mutuellement séparées et étant respectivement reliées électriquement à la première extrémité de pont et à la deuxième extrémité de pont; la carte de sous-circuit en pont comprend un second substrat, ainsi qu'une troisième extrémité de pont, une quatrième extrémité de pont et une troisième partie câblée utilisée pour un premier câblage fonctionnel, toutes disposées sur le second substrat, la troisième extrémité de pont et la quatrième extrémité de pont étant électriquement reliées au moyen de la troisième partie câblée; le premier substrat et le second substrat ne sont pas en contact direct, et la carte de sous-circuit en pont est conçue pour être reliée séparément et électriquement à la première extrémité de pont et à la seconde extrémité de pont au moyen de la troisième extrémité de pont et de la quatrième extrémité de pont, et est ainsi installée sur la carte de sous-circuit de corps principal. Le motif de câblage de la carte de circuit imprimé souple est simple et facile à fabriquer.
PCT/CN2020/082216 2019-01-30 2020-03-30 Carte de circuit imprimé souple et procédé de fabrication, dispositif d'affichage, structure de carte de circuit imprimé et panneau d'affichage associé Ceased WO2020156595A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP20748629.1A EP3920671B1 (fr) 2019-01-30 2020-03-30 Carte de circuit imprimé souple et procédé de fabrication, dispositif d'affichage, structure de carte de circuit imprimé et panneau d'affichage associé
US17/418,771 US11500489B2 (en) 2019-01-30 2020-03-30 Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
US17/945,064 US11934606B2 (en) 2019-01-30 2022-09-14 Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN201910093341 2019-01-30
CN201910093341.0 2019-01-30
CN201911136276.1 2019-11-19
CN201911136276.1A CN110831328A (zh) 2019-11-19 2019-11-19 电路板结构、显示面板
CN202010075431.X 2020-01-22
CN202010075431.XA CN111511109B (zh) 2019-01-30 2020-01-22 柔性电路板及制作方法、电子装置模组及电子装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US17/418,771 A-371-Of-International US11500489B2 (en) 2019-01-30 2020-03-30 Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof
US17/945,064 Continuation US11934606B2 (en) 2019-01-30 2022-09-14 Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof

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CN114982386B (zh) * 2020-12-25 2025-03-28 京东方科技集团股份有限公司 柔性电路板及显示装置
US11765830B2 (en) * 2020-12-25 2023-09-19 Chengdu Boe Optoelectronics Technology Co., Ltd. Flexible printed circuit and display device
US11803265B2 (en) * 2021-01-04 2023-10-31 Chengdu Boe Optoelectronics Technology Co., Ltd. Touch display device
CN113031699B (zh) * 2021-03-15 2024-11-08 维沃移动通信有限公司 终端的屏幕组件和终端设备
CN113281859B (zh) * 2021-05-18 2022-11-11 青岛海信宽带多媒体技术有限公司 一种光模块
CN114020166B (zh) * 2021-10-27 2023-07-14 云谷（固安）科技有限公司 一种触控显示装置
US12563674B1 (en) * 2022-06-02 2026-02-24 Beijing Boe Display Technology Co., Ltd. Display device and electronic apparatus
CN116133234A (zh) * 2023-02-07 2023-05-16 京东方科技集团股份有限公司 电路板、显示面板、显示装置和制作方法

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CN107393422B (zh) * 2017-09-04 2019-09-27 武汉华星光电半导体显示技术有限公司 显示面板及显示设备
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CN115052421B (zh) * 2019-11-19 2024-09-10 京东方科技集团股份有限公司 显示面板、显示装置

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