WO2020168691A1 - 显示面板、其制备方法及显示装置 - Google Patents

显示面板、其制备方法及显示装置 Download PDF

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Publication number
WO2020168691A1
WO2020168691A1 PCT/CN2019/100538 CN2019100538W WO2020168691A1 WO 2020168691 A1 WO2020168691 A1 WO 2020168691A1 CN 2019100538 W CN2019100538 W CN 2019100538W WO 2020168691 A1 WO2020168691 A1 WO 2020168691A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
cover plate
sealant
display panel
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/100538
Other languages
English (en)
French (fr)
Inventor
徐童
刘瑞
李维国
王�琦
卢强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
Original Assignee
Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan New Flat Panel Display Technology Center Co Ltd, Kunshan Govisionox Optoelectronics Co Ltd filed Critical Kunshan New Flat Panel Display Technology Center Co Ltd
Priority to JP2021523598A priority Critical patent/JP7225390B2/ja
Priority to EP19916414.6A priority patent/EP3859720A4/en
Priority to KR1020217013314A priority patent/KR102529014B1/ko
Publication of WO2020168691A1 publication Critical patent/WO2020168691A1/zh
Priority to US17/211,006 priority patent/US11481052B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

Definitions

  • the present disclosure relates to the technical field of display devices, and in particular to a display panel and a display device.
  • the display panel includes a flexible circuit board, a cover plate, a polarizer, a touch layer and a display layer stacked in sequence; one end of the flexible circuit board is connected to the control device, and the other end of the flexible circuit board is connected to the touch layer to realize the touch of the display device control.
  • the display layer, touch layer and polarizer are first formed, and then the flexible circuit board is connected to the touch layer; in order to prevent the outside air from contacting the touch layer, solid sealant is often attached to the interface between the touch layer and the flexible circuit board ; Then attach the cover to the polarizer.
  • the volume of the solid sealant is relatively large. After the solid sealant is attached, the top surface of the solid sealant away from the touch layer is closer to the cover than the top surface of the polarizer away from the touch layer; when installing the cover, the solid sealant first It is in contact with the cover, and cracks are easily generated between the solid sealant and the touch layer after being stressed, resulting in the sealing failure of the touch layer.
  • the present disclosure provides a display panel and a display device to solve the problem that when the cover is installed, the solid sealant first contacts the cover, and cracks are easily generated between the solid sealant and the touch layer after being stressed, resulting in the touch layer The technical problem of seal failure.
  • the embodiment of the present disclosure provides a display panel, including: a flexible circuit board, a touch layer, a cover plate, and an auxiliary transparent layer disposed between the cover plate and the touch layer and close to the cover plate; the flexible The circuit board is connected to the touch layer, a first sealant is provided at the interface between the touch layer and the flexible circuit board, and the first sealant is located on the flexible circuit board and the touch layer facing the cover plate.
  • a display panel including: a flexible circuit board, a touch layer, a cover plate, and an auxiliary transparent layer disposed between the cover plate and the touch layer and close to the cover plate; the flexible The circuit board is connected to the touch layer, a first sealant is provided at the interface between the touch layer and the flexible circuit board, and the first sealant is located on the flexible circuit board and the touch layer facing the cover plate.
  • One side; the distance between the surface of the auxiliary transparent layer facing the cover plate and the cover plate is not greater than the distance between the surface of the first sealant facing the cover plate and the cover plate.
  • the boundary position includes a boundary line between the touch layer and the input end of the flexible circuit board, and a portion of the touch layer covered by the first sealant on the side of the boundary line close to the cover
  • the display panel further includes a second sealant, the second sealant is arranged on the side of the flexible circuit board away from the cover, and the second sealant is located between the touch layer and the cover.
  • the boundary position of the flexible circuit board closes the boundary line between the surface of the flexible circuit board facing away from the cover and the touch layer.
  • the first sealant and the second sealant are selected from any one or more of polyacrylate, epoxy acrylate, and linear unsaturated polyester.
  • the display panel further includes a polarizer, and the polarizer is disposed between the touch layer and the auxiliary transparent layer or a side of the touch layer facing away from the cover plate.
  • the auxiliary transparent layer includes an optical adhesive layer.
  • the elastic modulus of the first sealant and the second sealant is greater than the elastic modulus of the optical adhesive layer.
  • a mounting step is provided on the surface of the touch layer close to the input end of the flexible circuit board.
  • the cover plate includes a hard layer and an organic layer arranged in a stack, and the hard layer is arranged away from the touch layer.
  • the hard layer is an ultra-thin glass layer
  • the organic layer is a polyimide layer or a thermoplastic polyurethane elastomer layer.
  • the display panel further includes a sealing layer, a substrate and a display layer stacked in sequence along the light emitting direction; the sealing layer is located between the cover plate and the substrate, and is arranged around the outer edge of the display layer; Preferably, the sealing layer is formed on the substrate and extends upward from the substrate to contact the cover plate.
  • the sealing layer includes a plurality of sealing sublayers stacked along the light emitting direction, and adjacent sealing sublayers can slide relatively.
  • the edge of the auxiliary transparent layer extends toward the substrate to form a sealed side edge, and the sealed side edge wraps the film layer between the substrate and the auxiliary transparent layer.
  • the sealing layer there is a gap between the sealing layer and the auxiliary transparent layer, and the gap is filled with a flow blocking medium.
  • the display layer includes an array substrate formed on the substrate, a pixel defining layer formed on the array substrate, and is encapsulated by an encapsulation layer.
  • the encapsulation layer (for example, by connecting glue) and the touch Layer connection.
  • the flow blocking medium includes insulating oil
  • the sealing layer includes a closed-cell foam layer.
  • the embodiment of the present disclosure also provides a display device including the display panel as described above.
  • an auxiliary transparent layer is arranged between the touch layer and the cover plate, and the auxiliary transparent layer is arranged close to the cover plate, and the distance between the surface of the auxiliary transparent layer facing the cover plate and the cover plate is not greater than The distance between the surface of the first sealant facing the cover plate and the cover plate; when the cover plate is installed, the cover plate first contacts the auxiliary transparent layer, which can avoid the contact between the first sealant and the touch layer caused by the force of the first sealant Cracks occurred between the flexible circuit boards.
  • the embodiment of the present disclosure also provides a method for preparing a display panel, including:
  • the first sealant seals the boundary line between the touch layer and the flexible circuit board, and covers the touch layer at the boundary position, and the auxiliary transparent layer faces the surface of the cover plate and the The distance between the cover plates is not greater than the distance between the surface of the first sealant facing the cover plate and the cover plate.
  • it further includes disposing a polarizer on the touch layer or on the side of the touch layer away from the cover plate.
  • an auxiliary transparent layer is arranged between the touch layer and the cover plate, and the auxiliary transparent layer is arranged close to the cover plate, and the auxiliary transparent layer faces between the surface of the cover plate and the cover plate.
  • the distance is not greater than the distance between the surface of the first sealant facing the cover plate and the cover plate; when the cover plate is installed, the cover plate first contacts the auxiliary transparent layer, which can avoid the first sealant caused by the force of the first sealant Cracks are generated between the touch layer and the flexible circuit board.
  • FIG. 1 is a schematic diagram of the connection between a flexible circuit board and a touch layer in a display panel provided by an embodiment of the disclosure
  • FIG. 2 is a schematic diagram of the positions of the sealing layer and the flow blocking medium in the display panel provided by an embodiment of the disclosure.
  • FIG. 1 is a schematic diagram of the connection between a flexible circuit board and a touch layer in a display panel provided by an embodiment of the disclosure.
  • this embodiment provides a display panel, including: a flexible circuit board 10, a touch layer 30, a cover plate 20, and an auxiliary transparent layer 40 disposed close to the cover plate 20; the flexible circuit board 10 is connected to the touch layer 30, A first sealant 101 is provided at the interface between the touch layer 30 and the flexible circuit board 10.
  • the first sealant 101 is located on the side of the flexible circuit board 10 facing the cover 20; the auxiliary transparent layer 40 faces the surface of the cover 20 and the cover The distance between 20 is not greater than the distance between the surface of the first sealant 101 facing the cover 20 and the cover 20.
  • the touch layer 30 has a plurality of touch units, the circuits on the flexible circuit board 10 are electrically connected with the touch units, and the flexible circuit board 10 is connected with an external motherboard to realize touch control.
  • a mounting step is provided on the upper surface of the touch layer 30 near the right end, and the input end of the flexible circuit board 10 is attached to the mounting step.
  • the boundary position between the touch layer 30 and the flexible circuit board 10 is the boundary line between the touch layer 30 and the input terminal of the flexible circuit board, and the touch layer 30 covered by the first sealant 101 on the left side of the boundary line
  • the boundary position between the flexible circuit board 10 and the touch layer 30 also includes the boundary line between the lower surface of the flexible circuit board 10 and the right end of the touch layer 30 and the area near the boundary line; the first sealant 101 is provided on the flexible circuit The surface of the board 10 and the touch layer 30 facing the cover 20, that is, the first sealant 101 covers the boundary line between the top surface of the touch layer 30 and the top surface of the input terminal, and the part of the top surface of the touch layer 30 on the left side of the boundary line and the right side of the boundary line. A part of the top surface of the flexible circuit board 10 on the side is used to seal the boundary line between the flexible circuit board 10 and the touch layer 30.
  • the first sealant 101 also improves the connection force between the flexible circuit board 10 and the touch layer 30 to prevent the touch layer 30 from being separated from the flexible circuit board 10 when the display panel is bent.
  • the first sealant 101 also covers a part of the touch layer 30 outside the auxiliary transparent layer 40, which can prevent the outside air from contacting the touch layer 30.
  • the cover plate 20 is located at the outermost side of the display panel along the light emitting direction to protect each film layer; taking the orientation shown in FIG. 1 as an example, the cover plate 20 is located at the uppermost end of the display panel.
  • the cover plate 20 includes a hard layer and an organic layer arranged in a stack, and the hard layer is arranged away from the touch layer 30.
  • the composite cover plate composed of a hard layer and an organic layer improves the surface hardness and pencil hardness of the cover plate 20 while ensuring light transmittance.
  • the hard layer in this embodiment is an ultra-thin glass layer
  • the organic layer is a polyimide layer or a thermoplastic polyurethane elastomer layer.
  • Ultra-thin glass is a glass plate with a thickness of less than 0.1mm, which has good flexibility to avoid breaking when the display panel is bent.
  • the auxiliary transparent layer 40 is disposed between the cover plate 20 and the touch layer 30, and the auxiliary transparent layer 40 is disposed close to the cover plate 20; the distance between the surface of the auxiliary transparent layer 40 facing the cover plate 20 and the cover plate 20 It is not greater than the distance between the surface of the first sealant 101 facing the cover plate 20 and the cover plate 20.
  • the top surface of the first sealant 101 is flush with the top surface of the auxiliary transparent layer 40, or the top surface of the auxiliary transparent layer 40 is closer to the cover 20 than the top surface of the first sealant 101, so that It is avoided that when the cover 20 is installed, the first sealant 101 first contacts the cover 20, causing cracks between the first sealant 101 and the touch layer 30 or the flexible circuit board 10 after being stressed, thereby avoiding seal failure.
  • the auxiliary transparent layer 40 includes an optical glue layer.
  • the auxiliary transparent layer 40 made of optical glue can bond the cover 20 and the touch layer 30 together to improve the connection force between the cover 20 and the touch layer 30.
  • the optical adhesive layer may include adhesives such as organic silicone, polyurethane, or epoxy.
  • the manufacturing process of the display panel provided in this embodiment is: forming the touch layer 30, which has a mounting step, and then attaching the flexible circuit board 10 on the mounting step of the touch layer 30, between the touch layer 30 and the flexible circuit board 10
  • the first sealant 101 is formed at the junction position to close the boundary line between the touch layer 30 and the flexible circuit board 10, and at the same time, it can cover the touch layer 30 at the junction position to prevent the outside air from contacting the touch layer 30 at the junction position;
  • An auxiliary transparent layer 40 is formed on the touch layer 30, and the distance between the surface of the auxiliary transparent layer 40 facing the cover 20 and the cover 20 is not greater than the distance between the surface of the first sealant 101 facing the cover 20 and the cover 20; Then, the cover plate 20 is covered on the auxiliary transparent layer 40 to complete the manufacture of the display panel.
  • an auxiliary transparent layer 40 is provided between the touch layer 30 and the cover 20, and the auxiliary transparent layer 40 is disposed close to the cover 20, and the auxiliary transparent layer 40 faces the surface of the cover 20 and the cover 20.
  • the distance between the first sealant 101 is not greater than the distance between the surface of the first sealant 101 facing the cover 20 and the cover 20; when the cover 20 is installed, the cover 20 first contacts the auxiliary transparent layer 40, which can avoid the first sealant A crack occurs between the first sealant 101 and the touch layer 30 and the flexible circuit board 10 caused by the force.
  • the display panel provided in this embodiment further includes a second sealant 102.
  • the second sealant 102 is disposed on the side of the flexible circuit board 10 away from the cover 20, and the second sealant 102 is located on the touch layer 30 and the flexible circuit board 10.
  • the junction location The second sealant 102 can seal the boundary line between the surface of the flexible circuit board 10 facing away from the cover 20 and the touch layer 30, so as to further improve the sealing performance between the flexible circuit board 10 and the touch layer 30.
  • the second The sealant 102 can also partially cover the touch layer 30 to further prevent outside air from contacting the touch layer 30; in addition, the second sealant 102 can press against the flexible circuit board 10 to prevent the flexible circuit from bending the flexible circuit board 10.
  • the board 10 shakes, thereby avoiding cracks between the first sealant 101 and the touch layer 30 or the flexible circuit board 10 when the flexible circuit board 10 is bent.
  • the materials of the first sealant 101 and the second sealant 102 can be the same or different, as long as the first sealant 101 and the second sealant 102 have good water and oxygen resistance.
  • the elastic modulus of the first sealant 101 and the second sealant 102 is greater than that of the optical adhesive layer, so that when the flexible circuit board 10 is bent, the first sealant 101 and the second sealant 102 produce The deformation is small, and the shaking of the input end of the flexible circuit board 10 is reduced, so as to avoid cracks between the first sealant 101 and the touch layer 30 or the flexible circuit board 10.
  • the first sealant 101 and the second sealant 102 can be selected from any one or more of polyacrylate, epoxy acrylate, and linear unsaturated polyester.
  • the first sealant 101 and the second sealant 102 can be cured by heating or UV curing, so as to improve the first sealant 101 and the second sealant.
  • the elastic modulus of the sealant 102 is not limited to
  • the first sealant 101 and the second sealant 102 cured by UV curing need to meet the following conditions: the viscosity of the first sealant 101 is less than or equal to 2000cps, and the viscosity of the second sealant 102 is between 1000-6000cps
  • the curing wavelength is 365nm; the curing energy is less than or equal to 2000mj/cm 2 ; the curing depth is less than or equal to 1mm; the glue temperature is less than or equal to 50°C; the Shore hardness of the second sealant 102 is less than or equal to D50; the shrinkage rate is both Less than 2.5%.
  • the display panel provided by another embodiment further includes a polarizer 50, and the polarizer 50 is disposed between the touch layer 30 and the auxiliary transparent layer 40.
  • the polarizer 50 can process the light to improve the display effect of the display panel.
  • An optical glue is arranged between the polarizer 50 and the touch layer 30 to realize the connection between the polarizer 50 and the touch layer 30.
  • the manufacturing process of the display panel provided in this embodiment is: forming the touch layer 30, which has a mounting step, and then attaching the flexible circuit board 10 on the mounting step of the touch layer 30, between the touch layer 30 and the flexible circuit board 10
  • the first sealant 101 is formed at the junction position to close the boundary line between the touch layer 30 and the flexible circuit board 10.
  • the first sealant 101 can cover the touch layer 30 at the junction position to prevent the outside air from interfering with the junction position.
  • the touch layer 30 is in contact; then the polarizer 50 is covered on the touch layer 30, and the polarizer 50 can be connected to the touch layer 30 through optical glue; an auxiliary transparent layer 40 is formed on the surface of the polarizer 50 away from the touch layer 30, and the auxiliary transparent layer 40
  • the distance between the surface facing the cover plate 20 and the cover plate 20 is not greater than the distance between the surface of the first sealant 101 facing the cover plate 20 and the cover plate 20; then the cover plate 20 is covered on the auxiliary transparent layer 40 to Complete the production of the display panel.
  • the auxiliary transparent layer 40 can be attached to the surface of the polarizer 50 facing the cover 20 in advance to form a transparent component; after the first sealant 101 is formed, the transparent component is attached to the touch panel.
  • the cover plate 20 is then covered on the auxiliary transparent component; the production time of the display panel can be shortened and the processing can be facilitated.
  • the polarizer 50 can also be arranged on the side of the touch layer 30 away from the cover 20. At this time, the polarizer 50 and the touch layer 30 can also be connected by optical glue, and the touch layer 30 is connected through the auxiliary transparent layer 40. Connect with the cover 20.
  • FIG. 2 is a schematic diagram of the positions of the sealing layer and the flow blocking medium in the display panel provided by an embodiment of the disclosure.
  • the display panel provided by this embodiment further includes a sealing layer 601, a substrate 60 and a display layer 70 stacked in sequence along the light emitting direction; the sealing layer 601 is located between the cover 20 and the substrate 60, and the sealing layer 601 surrounds the outer edge of the display layer 70 Set up.
  • the sealing layer 601 is arranged around the outer edge of the display layer 70, which can prevent the outside air from contacting each film layer in the display layer 70, thereby improving the sealing performance of the display panel.
  • the sealing layer 601 is formed on the substrate 60 and extends upward from the substrate 60 to contact the cover plate 20. At this time, the sealing layer 601 surrounds all the film layers between the cover plate 20 and the substrate 60 to further improve the sealing performance of the display panel.
  • the gap there is a gap between the sealing layer 601 and the display layer 70, and the gap is filled with a flow blocking medium 602.
  • the flow blocking medium 602 can further prevent the outside air from contacting each film layer of the display layer 70, and further improve the sealing performance of the display panel.
  • the flow blocking medium 602 has a certain fluidity, and the flow blocking medium 602 can adjust the corresponding shape along with the movement and deformation of the substrate 60, the cover 20 and the display layer 70. Wherein, the gap surrounds the outside of the display layer 70.
  • the flow blocking medium 602 is in a deformable non-solid form such as fluid, semi-fluid, or gel, and has certain fluidity. Therefore, when the display panel is bent, it is filled between the sealing layer 601 and the display layer 70.
  • the flow blocking medium 602 will deform correspondingly with the bending of the substrate 60 and the cover plate 20, so as to always be consistent with the shape of the gap between the sealing layer and the display layer 70. In this way, the flow blocking medium 602 can always seal the area outside the edge of the display layer 70 to prevent the display layer 70 from contacting external air.
  • the flow blocking medium 602 includes insulating oil.
  • the insulating oil is not conductive, which can prevent the display layer 70 from leaking to the outside.
  • the flow blocking medium 602 in this embodiment may also include lubricating oil and the like.
  • the sealing layer 601 includes a closed-cell foam layer 6014.
  • the closed-cell foam used has a closed-cell ratio of 100%, and has good elasticity, and it is not easy to break after bending.
  • the closed-cell foam layer 6014 can prevent the flow blocking medium 602 from penetrating into the sealing layer 601, so as to prevent the flow blocking medium 602 in the gap from decreasing in volume;
  • outside air can also be prevented from entering the sealing layer 601.
  • the sealing layer 601 can also be made of silicone or TPU (Thermoplastic polyurethane) to improve the moisture resistance, water resistance, radiation resistance, and weathering resistance of the sealing layer 601, thereby improving the display The overall performance of the panel.
  • TPU thermoplastic polyurethane
  • the display layer 70 is used to display images.
  • the display layer 70 may include an array substrate formed on the substrate 60, a pixel defining layer formed on the array substrate, and encapsulated by an encapsulation layer, which is connected to the touch layer through a connecting glue.
  • the flow blocking medium 602 is in the gap between the auxiliary transparent layer 40 and the sealing layer.
  • a thin film transistor is provided in the array substrate, and the light emitting unit in the pixel defining layer can be controlled to emit light through the thin film transistor.
  • the substrate 60 is used to carry the array substrate, and the substrate 60 can be formed first, and then the array substrate, the pixel defining layer, the touch layer 30 and other film layers are sequentially formed on the substrate 60.
  • an encapsulation dam 701 is provided outside the display layer 70, and the encapsulation layer 80 extends to the outside of the display panel and covers the encapsulation dam to encapsulate the display layer 70.
  • the touch layer 30 is disposed on the side of the encapsulation layer 80 facing the cover plate 20, and the touch layer 30 is connected to the encapsulation layer 80 through, for example, a connecting glue 301, which may be an optical glue.
  • the polarizer 50 is disposed between the touch layer 30 and the cover 20, and the polarizer 50 may also be connected to the touch layer 30 through optical glue.
  • the auxiliary transparent layer 40 may be an optical adhesive layer, and the optical adhesive layer is disposed between the cover plate 20 and the polarizer 50 to realize the connection between the cover plate 20 and the polarizer 50.
  • the edge of the optical adhesive layer extends to the substrate 60 to form a sealed side.
  • the sealed side can wrap the film between the substrate 60 and the optical adhesive layer to further improve the sealing performance of the display panel.
  • the flow barrier medium 602 is filled on the sealed side And the gap between the sealing layer 601.
  • the sealing layer 601 includes a plurality of sealing sublayers stacked along the light emitting direction, for example, including three sealing sublayers 6011, 6012, and 6013.
  • the sealing layer 601 When the display panel is bent, relative sliding can occur between adjacent sealing sub-layers, so as to avoid stress concentration and damage to each film layer when the display panel is bent.
  • relative sliding can occur between adjacent sealing sublayers, which prevents the entire sealing layer 601 from sliding between the cover plate 20 and the substrate 60, and improves the stability of the sealing layer 601.
  • Both the sealing layer 601 and the cover 20 and the substrate 60 can be connected by an adhesive glue, and the adhesive glue may be an optical glue. Adjacent sealing sub-layers can be connected by pressing to ensure the tightness between adjacent sealing sub-layers.
  • the number of sealing sub-layers may be two, the sealing sub-layer close to the substrate 60 is provided in the same layer as the display layer 70, and the sealing sub-layer close to the cover plate 20 is provided in the same layer as the polarizer 50 and/or the touch layer 30 Therefore, when the display panel is bent, the sealing sublayer close to the substrate 60 moves synchronously with the display layer 70, and the sealing sublayer close to the cover plate 20 moves synchronously with its corresponding film layer.
  • the number of sealing sub-layers can also be three.
  • the sealing sub-layer close to the substrate 60 is provided in the same layer as the display layer 70, one of the other two sealing sub-layers is provided in the same layer as the touch layer 30, and the other It is arranged on the same layer as the polarizer 50.
  • the three sealing sub-layers move synchronously with their corresponding film layers.
  • the number of sealing sublayers may also be four, five, etc.
  • a display device including the display panel described above.
  • the display device may be a product or component with a display function such as a mobile phone, a tablet computer, a television, a display, an e-book, an e-paper, a smart watch, a notebook computer, a digital photo frame, or a navigator.
  • a display function such as a mobile phone, a tablet computer, a television, a display, an e-book, an e-paper, a smart watch, a notebook computer, a digital photo frame, or a navigator.
  • an auxiliary transparent layer 40 is provided between the touch layer 30 and the cover 20, and the auxiliary transparent layer 40 is arranged close to the cover 20, and the auxiliary transparent layer 40 faces the surface of the cover 20 and the cover 20.
  • the distance therebetween is not greater than the distance between the surface of the first sealant 101 facing the cover plate 20 and the cover plate 20.

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Abstract

一种显示面板、其制备方法及显示装置,显示面板包括:柔性电路板(10)、触摸层(30)、盖板(20)以及靠近盖板(20)设置的辅助透明层(40);柔性电路板(10)与触摸层(30)连接,触摸层(30)与柔性电路板(10)交界的位置设置有第一密封胶(101),第一密封胶(101)位于柔性电路板(10)朝向盖板(20)的一侧;辅助透明层(40)朝向盖板(20)的面与盖板(20)之间的距离不大于第一密封胶(101)朝向盖板(20)的面与盖板(20)之间的距离;在安装盖板(20)时,盖板(20)首先与辅助透明层(40)接触,可以避免第一密封胶(101)受力导致的第一密封胶(101)与触摸层(30)和柔性电路板(10)之间产生裂纹。

Description

显示面板、其制备方法及显示装置 技术领域
本公开涉及显示设备技术领域,尤其涉及一种显示面板及显示装置。
背景技术
随着显示设备技术的逐渐发展,柔性显示面板已经逐渐应用在可穿戴设备上,如:智能手表、腕部手机等。
显示面板包括柔性电路板、依次层叠设置的盖板、偏光片、触摸层以及显示层;柔性电路板的一端与控制设备连接,柔性电路板的另一端与触摸层连接,以实现显示装置的触摸控制。生产时,首先形成显示层、触摸层以及偏光片,之后将柔性电路板连接在触摸层上;为了避免外界空气与触摸层接触,常在触摸层与柔性电路板的交界位置贴附固体密封胶;之后再将盖板贴附在偏光片上。
然而,固体密封胶的体积较大,在贴附固体密封胶后,固体密封胶背离触摸层的顶面较偏光片背离触摸层的顶面更靠近盖板;安装盖板时,固体密封胶首先与盖板接触,且固体密封胶受力后与触摸层之间容易产生裂纹,导致触摸层的密封失效。
发明内容
有鉴于此,本公开提供一种显示面板及显示装置,以解决安装盖板时,固体密封胶首先与盖板接触,且固体密封胶受力后与触摸层之间容易产生裂纹,导致触摸层的密封失效的技术问题。
本公开实施例提供了一种显示面板,包括:柔性电路板、触摸层、盖板以及在所述盖板和所述触摸层之间且靠近所述盖板设置的辅助透明层;所述柔性电路板与所述触摸层连接,所述触摸层与所述柔性电路板的交界位置设置有第一密封胶,所述第一密封胶位于所述柔性电路板和触摸层朝向所述盖板的一侧;所述辅助透明层朝向所述盖板的面与所述盖板之间的距离不大于 所述第一密封胶朝向所述盖板的面与所述盖板之间的距离。
优选地,所述交界位置包括所述触摸层和所述柔性电路板的输入端的交界线、位于所述交界线一侧的被所述第一密封胶覆盖的所述触摸层的靠近所述盖板的面,和位于所述交界线另一侧的被第一密封胶覆盖的所述柔性电路板的靠近所述盖板的面。
优选地,所述显示面板还包括第二密封胶,所述第二密封胶设置在所述柔性电路板背离所述盖板的一侧,且所述第二密封胶位于所述触摸层与所述柔性电路板的交界位置,封闭所述柔性电路板背离所述盖板的面与所述触摸层之间的交界线。优选地,所述第一密封胶和所述第二密封胶选自聚丙烯酸酯、环氧丙烯酸酯、线型不饱和聚酯中的任一种或者多种。
优选地,所述显示面板还包括偏光片,所述偏光片设置在所述触摸层与所述辅助透明层之间或所述触摸层背离所述盖板的一侧。
优选地,所述辅助透明层包括光学胶层。
优选地,所述第一密封胶与所述第二密封胶的弹性模量大于所述光学胶层的弹性模量。
优选地,所述触摸层靠近所述柔性电路板输入端的表面上设置有安装台阶。
优选地,所述盖板包括层叠设置的硬质层和有机层,所述硬质层背远离所述触摸层设置。优选地,所述硬质层为超薄玻璃层,所述有机层为聚酰亚胺层或者热塑性聚氨酯弹性体层。
优选地,所述显示面板还包括密封层、沿出光方向依次层叠设置的基板和显示层;所述密封层位于所述盖板与所述基板之间,且环绕所述显示层外缘设置;优选地,所述密封层形成在所述基板上,并从所述基板向上延伸至与所述盖板接触。
优选地,所述密封层包括沿出光方向层叠设置的多个密封子层,相邻密封子层之间可相对滑动。
优选地,所述辅助透明层的边缘向所述基板延伸,形成密封侧边,所述密封侧边包裹所述基板与所述辅助透明层之间的膜层。
优选地,所述密封层与所述辅助透明层之间具有间隙,所述间隙内填充 有流动阻隔介质。
优选地,所述显示层包括形成在所述基板上的阵列基板,形成在所述阵列基板上的像素限定层,并且被封装层封装,所述封装层(例如通过连接胶)与所述触摸层连接。
优选地,所述流动阻隔介质包括绝缘油,所述密封层包括闭孔泡棉层。
本公开实施例还提供一种显示装置,包括如上所述的显示面板。
本公开提供的显示面板及显示装置,通过在触摸层和盖板之间设置辅助透明层,并且辅助透明层靠近盖板设置,辅助透明层朝向盖板的面与盖板之间的距离不大于第一密封胶朝向盖板的面与盖板之间的距离;在安装盖板时,盖板首先与辅助透明层接触,可以避免第一密封胶受力导致的第一密封胶与触摸层和柔性电路板之间产生裂纹。
本公开实施例还提供一种制备显示面板的方法,包括:
形成触摸层,
将柔性电路板贴附至所述触摸层,
在所述触摸层和所述柔性电路板之间的交界位置形成第一密封胶,
在所述触摸层上形成辅助透明层,
在所述辅助透明层上覆盖盖板。
其中,所述第一密封胶封闭所述触摸层与所述柔性电路板之间的交界线,并覆盖交界位置的所述触摸层,所述辅助透明层朝向所述盖板的面与所述盖板之间的距离不大于所述第一密封胶朝向所述盖板的面与所述盖板之间的距离。
优选地,还包括在所述触摸层上或在所述触摸层背离所述盖板的一侧设置偏光片。
根据上述方法制备的本公开的显示面板及显示装置,通过在触摸层和盖板之间设置辅助透明层,并且辅助透明层靠近盖板设置,辅助透明层朝向盖板的面与盖板之间的距离不大于第一密封胶朝向盖板的面与盖板之间的距离;在安装盖板时,盖板首先与辅助透明层接触,可以避免第一密封胶受力导致的第一密封胶与触摸层和柔性电路板之间产生裂纹。
附图说明
为了更清楚地说明本公开实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本公开实施例提供的显示面板中柔性电路板与触摸层之间的连接示意图;
图2为本公开实施例提供的显示面板中密封层与流动阻隔介质的位置示意图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例中的附图,对本公开实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本公开一部分实施例,而不是全部的实施例。基于本公开中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本公开保护的范围。
图1为本公开实施例提供的显示面板中柔性电路板与触摸层之间的连接示意图。
请参照图1,本实施例提供一种显示面板,包括:柔性电路板10、触摸层30、盖板20以及靠近盖板20设置的辅助透明层40;柔性电路板10与触摸层30连接,触摸层30与柔性电路板10交界的位置设置有第一密封胶101,第一密封胶101位于柔性电路板10朝向盖板20的一侧;辅助透明层40朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离。
本实施例中,触摸层30内具有多个触控单元,柔性电路板10上的电路与触控单元电连接,并且柔性电路板10与外界的主板连接,以实现触摸控制。参照图1所示方位,触摸层30靠近右端的上表面上设置有安装台阶,柔性电路板10的输入端贴附在安装台阶上。相应的,触摸层30与柔性电路板10的之间的交界位置为触摸层30与所述柔性电路板的输入端的交界线、交界线左 侧的被第一密封胶101覆盖的触摸层30的靠近盖板20的面以及交界线右侧的被第一密封胶101覆盖的柔性电路板10的靠近盖板20的面。除此之外,柔性电路板10与触摸层30之间的交界位置还包括柔性电路板10下表面与触摸层30右端的交界线以及交界线附近的区域;第一密封胶101设置在柔性电路板10和触摸层30朝向盖板20的面上,即第一密封胶101覆盖触摸层30顶面和输入端顶面的交界线以及交界线左侧的部分触摸层30顶面和交界线右侧的部分柔性电路板10顶面,以实现对柔性电路板10和触摸层30的交界线的密封。另外第一密封胶101还提高了柔性电路板10和触摸层30之间的连接力,以免在弯折显示面板时,触摸层30与柔性电路板10分离。
进一步地,第一密封胶101还覆盖位于辅助透明层40外部的部分触摸层30,可以避免外界的空气与触摸层30接触。
本实施例中,盖板20位于显示面板沿出光方向的最外侧,以实现对各膜层的保护;以图1所示方位为例,盖板20位于显示面板的最上端。
本实施例优选地,盖板20包括层叠设置的硬质层和有机层,硬质层背离触摸层30设置。由硬质层和有机层构成的复合盖板,在保证透光率的同时提高了盖板20的表面硬度和铅笔硬度。
具体地,本实施例中的硬质层为超薄玻璃层,有机层为聚酰亚胺层或者热塑性聚氨酯弹性体层。超薄玻璃为厚度小于0.1mm的玻璃板,具有较好的柔韧性,以免在弯折显示面板时发生断裂。
本实施例中,辅助透明层40设置在盖板20和触摸层30之间,且辅助透明层40靠近盖板20设置;辅助透明层40朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离。参照图1所示方位,第一密封胶101的顶面与辅助透明层40的顶面平齐,或者辅助透明层40的顶面较第一密封胶101的顶面更靠近盖板20,以避免在安装盖板20时,第一密封胶101首先与盖板20接触,导致第一密封胶101受力后与触摸层30或柔性电路板10之间产生裂纹,进而避免密封失效。
优选地,辅助透明层40包括光学胶层。由光学胶构成的辅助透明层40可以将盖板20和触摸层30粘结起来,以提高盖板20与触摸层30之间的连接力。其中,光学胶层可以包含有机硅胶、聚氨酯或环氧树脂等胶粘剂。
本实施例提供的显示面板的制作过程为:形成触摸层30,其具有一安装台阶,之后在触摸层30的安装台阶上贴附柔性电路板10,在触摸层30和柔性电路板10之间的交界位置形成第一密封胶101,以封闭触摸层30与柔性电路板10之间的交界线,同时可以覆盖交界位置的触摸层30,以免外界空气与交界位置的触摸层30接触;之后在触摸层30上形成辅助透明层40,辅助透明层40朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离;之后在辅助透明层40上覆盖盖板20,以完成显示面板的制作。
本实施例提供的显示面板,通过在触摸层30和盖板20之间设置辅助透明层40,并且辅助透明层40靠近盖板20设置,辅助透明层40朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离;在安装盖板20时,盖板20首先与辅助透明层40接触,可以避免第一密封胶101受力导致的第一密封胶101与触摸层30和柔性电路板10之间产生裂纹。
本实施例提供的显示面板,还包括第二密封胶102,第二密封胶102设置在柔性电路板10背离盖板20的一侧,且第二密封胶102位于触摸层30与柔性电路板10的交界位置。第二密封胶102可以封闭柔性电路板10背离盖板20的面与触摸层30之间的交界线,以进一步提高柔性电路板10与触摸层30之间的密封性,与此同时,第二密封胶102还可以部分地覆盖触摸层30,以进一步避免外界的空气与触摸层30接触;另外,第二密封胶102可以抵顶柔性电路板10,以免在弯折柔性电路板10时柔性电路板10晃动,进而避免在弯折柔性电路板10时第一密封胶101与触摸层30或柔性电路板10之间产生裂纹。
本实施例中,第一密封胶101与第二密封胶102的材质可以相同或不同,只要保证第一密封胶101与第二密封胶102具有较好的抗水氧性即可。优选地,第一密封胶101与第二密封胶102的弹性模量大于光学胶层的弹性模量,以在弯折柔性电路板10时,第一密封胶101与第二密封胶102产生的形变较小,减小柔性电路板10输入端的晃动,以免第一密封胶101与触摸层30或柔性电路板10之间产生裂纹。优选地,第一密封胶101和第二密封胶102可 以选自聚丙烯酸酯、环氧丙烯酸酯、线性不饱和聚酯的任一种或多种。优选地,形成第一密封胶101和第二密封胶102后可以通过加热固化或者UV固化等方式,使第一密封胶101和第二密封胶102固化,以提高第一密封胶101和第二密封胶102的弹性模量。
示例性地,以UV固化的方式固化的第一密封胶101和第二密封胶102需要满足以下条件:第一密封胶101的粘度小于等于2000cps,第二密封胶102的粘度在1000-6000cps之间;固化波长均为365nm;固化能量均小于等于2000mj/cm 2;固化深度均小于等于1mm;出胶温度均小于等于50℃;第二密封胶102的邵氏硬度小于等于D50;收缩率均小于2.5%。
另一实施例提供的显示面板,还包括偏光片50,偏光片50设置在触摸层30与辅助透明层40之间。偏光片50可以对光线进行处理,以提高显示面板的显示效果。
在偏光片50与触摸层30之间设置光学胶,以实现偏光片50与触摸层30之间的连接。
本实施例提供的显示面板的制作过程为:形成触摸层30,其具有一安装台阶,之后在触摸层30的安装台阶上贴附柔性电路板10,在触摸层30和柔性电路板10之间的交界位置形成第一密封胶101,以封闭触摸层30与柔性电路板10之间的交界线,与此同时第一密封胶101可以覆盖交界位置的触摸层30,以免外界空气与交界位置的触摸层30接触;之后在触摸层30上覆盖偏光片50,偏光片50可以通过光学胶与触摸层30连接;在偏光片50背离触摸层30的面上形成辅助透明层40,辅助透明层40的朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离;之后在辅助透明层40上覆盖盖板20,以完成显示面板的制作。
优选地,在上述制作过程中,可以预先将辅助透明层40贴附在偏光片50朝向盖板20的面上,形成透明组件;在形成第一密封胶101后,将透明组件贴附在触摸层30上,再将盖板20覆盖在辅助透明组件上;可以缩短显示面板的制作时间,便于加工。
在一个实施例中,偏光片50还可以设置在触摸层30背离盖板20的一侧,此时偏光片50与触摸层30之间也可以通过光学胶连接,触摸层30通过辅助 透明层40与盖板20连接。
图2为本公开实施例提供的显示面板中密封层与流动阻隔介质的位置示意图。
请参照图2。本实施例提供的显示面板还包括密封层601、沿出光方向依次层叠设置的基板60和显示层70;密封层601位于盖板20与基板60之间,且密封层601环绕显示层70外缘设置。密封层601环绕显示层70外缘设置,可以阻止外界空气与显示层70内的各膜层接触,进而提高显示面板的密封性。
优选地,密封层601形成在基板60上,并从基板60向上延伸至与盖板20接触。此时密封层601环绕盖板20和基板60之间的所有膜层,以进一步提高显示面板的密封性。
本实施例中,密封层601与显示层70之间具有间隙,间隙内填充有流动阻隔介质602。流动阻隔介质602可以进一步阻止外界的空气与显示层70的各膜层接触,进一步提高显示面板的密封性。另外,流动阻隔介质602具有一定的流动性,流动阻隔介质602能够随着基板60、盖板20以及显示层70的移动及形变进行相应形状的调整。其中,间隙环绕在显示层70的外侧。
流动阻隔介质602为可以为流态、半流态或者凝胶等可形变的非固态形式,具有一定的流动性,因而当弯折显示面板时,填充在密封层601和显示层70之间的流动阻隔介质602会随基板60及盖板20的弯曲而产生相应的形变,从而始终与密封层和显示层70之间的间隙形状保持一致。这样流动阻隔介质602可始终对显示层70边缘外侧的区域进行密封,避免显示层70接触到外部的空气。
优选地,流动阻隔介质602包括绝缘油。绝缘油不导电,可以避免显示层70向外漏电。本实施例中的流动阻隔介质602还可以包括润滑油等。
优选地,密封层601包括闭孔泡棉层6014。所用闭孔泡棉的闭孔率为100%,并且并具有较好的弹性,弯曲后不易发生断裂。密封层601与各膜层之间的间隙内填充有流动阻隔介质602时,闭孔泡棉层6014可以阻止流动阻隔介质602渗入密封层601内,以免间隙内的流动阻隔介质602体积减小;另外也可以阻止外界的空气进入到密封层601内。
本实施例中,密封层601还可由硅胶件或热塑性聚氨酯弹性体橡胶 (Thermoplastic polyurethane,TPU)件构成,以提高该密封层601的防潮、耐水、耐辐射及耐气候老化性能,进而提高该显示面板的整体性能。
本实施例中,显示层70用于显示图像。具体地,显示层70可以包括形成在基板60上的阵列基板,形成在阵列基板上的像素限定层,并且被封装层封装,封装层通过连接胶与触摸层连接。流动阻隔介质602处于辅助透明层40和密封层之间的间隙内。阵列基板内具有薄膜晶体管,通过薄膜晶体管可以控制像素限定层内的发光单元发光。基板60用于承载阵列基板,制作时可先形成基板60,之后在基板60上依次形成阵列基板、像素限定层、触摸层30等膜层。
继续参照图2,在显示层70外侧设置有封装堤坝701,封装层80向显示面板的外侧延伸,且覆盖在封装堤坝上,以对显示层70进行封装。触摸层30设置在封装层80朝向盖板20的一侧,并且触摸层30通过例如连接胶301与封装层80连接,连接胶301可以为光学胶。偏光片50设置在触摸层30与盖板20之间,偏光片50也可以通过光学胶与触摸层30连接。辅助透明层40可以为光学胶层,光学胶层设置在盖板20与偏光片50之间,以实现盖板20与偏光片50之间的连接。光学胶层的边缘向基板60延伸,形成密封侧边,密封侧边可以包裹基板60与光学胶层之间的膜层,以进一步提高显示面板的密封性,流动阻隔介质602填充在密封侧边与密封层601之间的间隙内。
本实施例中,密封层601包括沿出光方向层叠设置的多个密封子层,例如包括三个密封子层6011,6012,6013。在弯折显示面板时,相邻密封子层之间可以发生相对滑动,以免在弯折显示面板时,各膜层发生应力集中而损坏。另外,相邻密封子层之间可以发生相对滑动,避免了密封层601整体在盖板20和基板60之间滑动,提高了密封层601的稳固性。
密封层601与盖板20和基板60之间均可以通过粘结胶连接,粘结胶可以为光学胶。相邻密封子层之间可以通过压合的方式连接,以保证相邻密封子层之间的密封性。
示例性地,密封子层的数量可以为两个,靠近基板60的密封子层与显示层70同层设置,靠近盖板20的密封子层与偏光片50和/或触摸层30同层设置,以在弯折显示面板时,靠近基板60的密封子层与显示层70同步移动, 靠近盖板20的密封子层与其对应的膜层同步移动。当然,密封子层的数量还可以为三个,相应地,靠近基板60的密封子层与显示层70同层设置,另外两个密封子层中的一个与触摸层30同层设置,另一个与偏光片50同层设置,在弯折显示面板时,三个密封子层分别与其对应的膜层同步移动。本实施例中密封子层还可以为四个、五个等。
在其他实施例中,还提供一种显示装置,包括如上所述的显示面板。
其中显示装置可以为手机、平板电脑、电视机、显示器、电子书、电子纸、智能手表、笔记本电脑、数码相框或导航仪等具有显示功能的产品或部件。
本实施例提供的显示装置,通过在触摸层30和盖板20之间设置辅助透明层40,并且辅助透明层40靠近盖板20设置,辅助透明层40朝向盖板20的面与盖板20之间的距离不大于第一密封胶101朝向盖板20的面与盖板20之间的距离。在安装盖板20时,盖板20首先与辅助透明层40接触,可以避免第一密封胶101受力导致的第一密封胶101与触摸层30和柔性电路板10之间产生裂纹。
最后应说明的是:以上各实施例仅用以说明本公开的技术方案,而非对其限制;尽管参照前述各实施例对本公开进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。

Claims (20)

  1. 一种显示面板,包括:柔性电路板、触摸层、盖板以及在所述盖板和所述触摸层之间且靠近所述盖板设置的辅助透明层;所述柔性电路板与所述触摸层连接,所述触摸层与所述柔性电路板的交界位置设置有第一密封胶,所述第一密封胶位于所述柔性电路板和触摸层朝向所述盖板的一侧;所述辅助透明层朝向所述盖板的面与所述盖板之间的距离小于等于所述第一密封胶朝向所述盖板的面与所述盖板之间的距离。
  2. 根据权利要求1所述的显示面板,其中,所述交界位置包括所述触摸层和所述柔性电路板的输入端的交界线、位于所述交界线一侧的被所述第一密封胶覆盖的所述触摸层靠近所述盖板的面,和位于所述交界线另一侧的被第一密封胶覆盖的所述柔性电路板靠近所述盖板的面。
  3. 根据权利要求1所述的显示面板,还包括第二密封胶,所述第二密封胶设置在所述柔性电路板背离所述盖板的一侧,且所述第二密封胶位于所述触摸层与所述柔性电路板的交界位置,封闭所述柔性电路板背离所述盖板的面与所述触摸层之间的交界线。
  4. 根据权利要求1所述的显示面板,其中,所述第一密封胶和所述第二密封胶选自聚丙烯酸酯、环氧丙烯酸酯、线型不饱和聚酯中的任一种或者多种。
  5. 根据权利要求1所述的显示面板,其中,所述显示面板还包括偏光片,所述偏光片设置在所述触摸层与所述辅助透明层之间或所述触摸层背离所述盖板的一侧。
  6. 根据权利要求1所述的显示面板,其中,所述辅助透明层包括光学胶层。
  7. 根据权利要求6所述的显示面板,其中,所述第一密封胶与所述第二密封胶的弹性模量大于所述光学胶层的弹性模量。
  8. 根据权利要求1所述的显示面板,其中,所述触摸层靠近所述柔性电路板的所述输入端的表面上设置有安装台阶。
  9. 根据权利要求1-8任一项所述的显示面板,其中,所述盖板包括层叠设置的硬质层和有机层,所述硬质层远离所述触摸层设置。
  10. 根据权利要求9所述的显示面板,其中,所述硬质层为超薄玻璃层,所述有机层为聚酰亚胺层或者热塑性聚氨酯弹性体层。
  11. 根据权利要求1-8任一项所述的显示面板,其中,所述显示面板还包括密封层、沿出光方向依次层叠设置的基板和显示层;所述密封层位于所述盖板与所述基板之间,且环绕所述显示层外缘设置。
  12. 根据权利要求11所述的显示面板,其中,所述密封层形成在所述基板上,并从所述基板向上延伸至与所述盖板接触。
  13. 根据权利要求11所述的显示面板,其中,所述密封层包括沿出光方向层叠设置的多个密封子层,相邻所述密封子层之间可相对滑动。
  14. 根据权利要求11所述的显示面板,其中,所述辅助透明层的边缘向所述基板延伸,形成密封侧边,所述密封侧边包裹所述基板与所述辅助透明层之间的膜层。
  15. 根据权利要求14所述的显示面板,其中,所述密封层与所述辅助透明层之间具有间隙,所述间隙内填充有流动阻隔介质。
  16. 根据权利要求15所述的显示面板,其中,所述显示层包括形成在所述基板上的阵列基板,形成在所述阵列基板上的像素限定层,并且被封装层封装,所述封装层与所述触摸层连接。
  17. 根据权利要求16所述的显示面板,其中,所述流动阻隔介质包括绝缘油,所述密封层包括闭孔泡棉层。
  18. 一种显示装置,其中,包括权利要求1-17任一项所述的显示面板。
  19. 一种制备显示面板的方法,包括
    形成触摸层,
    将柔性电路板贴附至所述触摸层,
    在所述触摸层和所述柔性电路板之间的交界位置形成第一密封胶,
    在所述触摸层上形成辅助透明层,
    在所述辅助透明层上覆盖盖板。
    其中,所述第一密封胶封闭所述触摸层与所述柔性电路板之间的交界线,并覆盖交界位置的所述触摸层,所述辅助透明层朝向所述盖板的面与所述盖板之间的距离小于等于所述第一密封胶朝向所述盖板的面与所述盖板之间的距离。
  20. 根据权利要求19所述的方法,其中,还包括在所述触摸层上或在所述触摸层背离所述盖板的一侧设置偏光片。
PCT/CN2019/100538 2019-02-23 2019-08-14 显示面板、其制备方法及显示装置 Ceased WO2020168691A1 (zh)

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