WO2020171498A1 - Ensemble de module de caméra et dispositif électronique le comprenant - Google Patents

Ensemble de module de caméra et dispositif électronique le comprenant Download PDF

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Publication number
WO2020171498A1
WO2020171498A1 PCT/KR2020/002208 KR2020002208W WO2020171498A1 WO 2020171498 A1 WO2020171498 A1 WO 2020171498A1 KR 2020002208 W KR2020002208 W KR 2020002208W WO 2020171498 A1 WO2020171498 A1 WO 2020171498A1
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WO
WIPO (PCT)
Prior art keywords
camera
opening
electronic device
camera module
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2020/002208
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English (en)
Korean (ko)
Inventor
이성영
정원준
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2020171498A1 publication Critical patent/WO2020171498A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the embodiments disclosed in this document relate to a camera module assembly structure and an electronic device including the same.
  • a mobile electronic device may include a plurality of camera modules.
  • specifications of some camera modules may vary according to the model of the electronic device.
  • a high-end model may include three camera modules (triple camera), and a low-end model may include two camera modules (dual camera).
  • some camera modules may be commonly included in high-end models and low-end models.
  • An embodiment disclosed in this document is to provide an assembly structure for camera module that can be commonly applied to various models of electronic devices and an electronic device including the same.
  • an embodiment disclosed in this document is to provide a camera module assembly structure capable of efficiently utilizing a mounting space as the number of camera modules increases, and an electronic device including the same.
  • An electronic device includes: a housing in which a camera area is formed on one surface; A bracket disposed below the camera area and including a first surface facing the camera area, a second surface facing the first surface, and an opening passing through the first surface and the second surface; And a camera housing including a first surface facing the camera area, a second surface facing the first surface, and a side surface surrounding a space between the first surface and the second surface, and at least one lens.
  • a camera module including; Including, wherein the camera module may be disposed in the opening such that the optical axis of the lens passes through the camera area, and the side surface of the camera housing contacts the inner wall of the opening. .
  • An electronic device includes: a housing; A bracket disposed inside the housing and having an opening; A plurality of camera modules each including one or more lenses and coupled to the bracket; And a guide structure for guiding the camera module to the opening, wherein the plurality of camera modules include a first camera module movably coupled to the opening of the bracket in a direction of an optical axis of the lens, ,
  • the first camera module includes a base on which an image sensor is disposed, a camera housing formed on the base to cover the image sensor, and a lens extending from the inside of the camera housing to the outside and having the one or more lenses disposed therein
  • a barrel is included
  • the guide structure includes a guide rail formed on either an inner wall of the opening or a side surface of the camera housing, and a guide member formed on the other and protruding to be inserted into the guide rail, , Each of the guide rail and the guide member may extend in the optical axis direction of the lens.
  • the assembly process can be simplified through one assembly structure.
  • a plurality of cameras may be mounted on an electronic device through a single bracket. Accordingly, it is possible to optimize the mounting space inside the housing.
  • a general-purpose camera commonly applied to several models and a dedicated camera applied differently according to models may be mounted on an electronic device through a single bracket. Accordingly, since various models of electronic devices may include a modularized common bracket, and there is no need to design a dedicated bracket for each model of the electronic device, this may be advantageous in terms of a delivery deadline and a manufacturing cost.
  • the camera assembly structure according to the embodiments disclosed in this document may include a guide block corresponding to the shape of the guide rail of the bracket, and may provide compatibility for mounting other cameras only by replacing the guide block.
  • the guide structure included in the bracket as an elastic body, compatibility for mounting various types of cameras without changing the design of the entire bracket may be provided.
  • FIG. 1 is a front perspective view of an electronic device according to an exemplary embodiment.
  • FIG. 2 is a rear perspective view of the electronic device illustrated in FIG. 1.
  • FIG. 3 is an exploded perspective view of the electronic device illustrated in FIG. 1.
  • FIG. 4 is an exploded perspective view of an electronic device according to an exemplary embodiment.
  • FIG. 5 is a perspective view of a camera module assembly structure of an electronic device according to an exemplary embodiment.
  • FIG. 6 is an exploded perspective view of a camera module assembly structure of an electronic device according to an exemplary embodiment.
  • FIG. 7 is a cross-sectional view of a camera module assembly structure of an electronic device according to an exemplary embodiment.
  • FIG. 8 is a diagram illustrating a guide structure of a camera module assembly structure according to various embodiments of the present disclosure.
  • FIG. 9 is a diagram illustrating a guide block and a guide structure of a camera module assembly structure according to various embodiments of the present disclosure.
  • FIG. 10 is a diagram illustrating a guide structure of a camera module assembly structure according to various embodiments of the present disclosure.
  • FIG. 11 is a diagram illustrating a guide structure of a camera module assembly structure according to various embodiments.
  • FIG. 1 is a front perspective view of an electronic device according to an exemplary embodiment.
  • 2 is a rear perspective view of the electronic device illustrated in FIG. 1.
  • 3 is an exploded perspective view of the electronic device illustrated in FIG. 1.
  • the electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A, and A housing 110 including a side surface 110C surrounding the space between the second surfaces 110B may be included.
  • the housing may refer to a structure forming some of the first surface 110A, the second surface 110B, and the side surface 110C of FIG. 1.
  • at least a portion of the first surface 110A may be formed by a substantially transparent front plate 102 (eg, a glass plate including various coating layers or a polymer plate).
  • the second surface 110B may be formed by a substantially opaque rear plate 111.
  • the back plate 111 is formed by, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Can be.
  • the side surface 110C is coupled to the front plate 102 and the rear plate 111 and may be formed by a side bezel structure (or “side member”) 118 including metal and/or polymer.
  • the rear plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 102 includes two first regions 110D that are curved toward the rear plate 111 from the first surface 110A and extend seamlessly, the front plate It may be included at both ends of the long edge (102).
  • the rear plate 111 is curved toward the front plate 102 from the second surface 110B to seamlessly extend two second regions 110E with a long edge. Can be included at both ends.
  • the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, some of the first regions 110D or the second regions 110E may not be included.
  • the side bezel structure 118 when viewed from the side of the electronic device 100, is a side surface that does not include the first regions 110D or the second regions 110E. It may have one thickness (or width), and may have a second thickness that is thinner than the first thickness on a side surface including the first regions 110D or the second regions 110E.
  • the electronic device 100 includes a display 101, an audio module 103, 107, 114, a sensor module 104, 116, 119, a camera module 105, 112, 113, and a key input. It may include at least one or more of the device 117, the light emitting element 106, and the connector holes 108, 109. In some embodiments, the electronic device 100 may omit at least one of the components (for example, the key input device 117 or the light emitting device 106) or additionally include other components.
  • Display 101 may be exposed through a substantial portion of front plate 102, for example.
  • at least a part of the display 101 may be exposed through the first surface 110A and the front plate 102 forming the first regions 110D of the side surface 110C.
  • the edge of the display 101 may be formed to have substantially the same shape as an adjacent outer shape of the front plate 102.
  • the distance between the outer periphery of the display 101 and the outer periphery of the front plate 102 may be formed substantially the same.
  • a recess or opening is formed in a part of the screen display area of the display 101, and the audio module 114 and the sensor are aligned with the recess or the opening. It may include at least one or more of the module 104, the camera module 105, and the light emitting device 106. In another embodiment (not shown), on the rear surface of the screen display area of the display 101, the audio module 114, the sensor module 104, the camera module 105, the fingerprint sensor 116, and the light emitting element 106 ) May include at least one or more of.
  • the display 101 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and/or a digitizer that detects a magnetic field type stylus pen. Can be placed.
  • a touch sensing circuit capable of measuring the intensity (pressure) of the touch
  • a digitizer that detects a magnetic field type stylus pen.
  • at least a part of the sensor modules 104 and 119, and/or at least a part of the key input device 117 may include the first regions 110D and/or the second regions 110E. Can be placed in the field.
  • the audio modules 103, 107, and 114 may include microphone holes 103 and speaker holes 107 and 114.
  • a microphone for acquiring external sound may be disposed inside, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound.
  • the speaker holes 107 and 114 may include an external speaker hole 107 and a call receiver hole 114.
  • the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker may be included without the speaker holes 107 and 114 (eg, piezo speakers).
  • the sensor modules 104, 116, and 119 may generate electrical signals or data values corresponding to an internal operating state of the electronic device 100 or an external environmental state.
  • the sensor modules 104, 116, 119 are, for example, a first sensor module 104 (eg, a proximity sensor) and/or a second sensor module disposed on the first surface 110A of the housing 110 ( Not shown) (for example, a fingerprint sensor), and/or a third sensor module 119 (for example, an HRM sensor) and/or a fourth sensor module 116 disposed on the second surface 110B of the housing 110 ) (E.g. fingerprint sensor).
  • the fingerprint sensor may be disposed on the first surface 110A of the housing 110 (eg, not only the display 101 but also the second surface 110B.
  • the electronic device 100 is a sensor module, not shown, for example, for example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included.
  • a gesture sensor e.g., a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor 104 is further included.
  • IR infrared
  • the camera modules 105, 112, and 113 include a first camera device 105 disposed on the first surface 110A of the electronic device 100, and a second camera device 112 disposed on the second surface 110B. ), and/or a flash 113.
  • the camera devices 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device 100.
  • the key input device 117 may be disposed on the side surface 110C of the housing 110.
  • the electronic device 100 may not include some or all of the aforementioned key input devices 117, and the key input device 117 that is not included is a soft key or the like on the display 101. It can be implemented in a form.
  • the key input device may include a sensor module 116 disposed on the second surface 110B of the housing 110.
  • the light emitting element 106 may be disposed on the first surface 110A of the housing 110, for example.
  • the light-emitting element 106 may provide state information of the electronic device 100 in the form of light, for example.
  • the light emitting device 106 may provide a light source that is interlocked with the operation of the camera module 105, for example.
  • the light-emitting element 106 may include, for example, an LED, an IR LED, and a xenon lamp.
  • the connector holes 108 and 109 are a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or an external electronic device. And a second connector hole (eg, an earphone jack) 109 capable of accommodating a connector for transmitting and receiving an audio signal.
  • a connector eg, a USB connector
  • a second connector hole eg, an earphone jack
  • the electronic device 100 includes a side member 140, a first support member 142 (eg, a bracket), a front plate 120, a display 130, a printed circuit board 150, and A battery 152, a rear case 160, an antenna 170, and a rear plate 180 may be included.
  • the electronic device 100 may omit at least one of the components (for example, the first support member 142 or the rear case 160), or may additionally include other components.
  • At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2, and redundant descriptions will be omitted below.
  • the first support member 142 may be disposed inside the electronic device 100 and connected to the side member 140, or may be integrally formed with the side member 140.
  • the first support member 142 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the display 130 may be coupled to one surface and the printed circuit board 150 may be coupled to the other surface.
  • a processor, memory, and/or interface may be mounted on the printed circuit board 150.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or nonvolatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 100 to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery 152 is a device for supplying power to at least one component of the electronic device 100 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 152 may be disposed substantially on the same plane as the printed circuit board 150, for example. The battery 152 may be integrally disposed within the electronic device 100 or may be disposed detachably from the electronic device 100.
  • the antenna 170 may be disposed between the rear plate 180 and the battery 152.
  • the antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 170 may perform short-range communication with an external device, for example, or wirelessly transmit and receive power required for charging.
  • an antenna structure may be formed by a part of the side member 140 and/or the first support member 142 or a combination thereof.
  • FIG. 4 is an exploded perspective view of an electronic device 100 according to an exemplary embodiment.
  • the electronic device 100 includes a second plate 180 forming a surface of the electronic device 100, a side member 140 connected to the second plate 180, and a printed circuit board 150. ), a mid plate 160 disposed between the printed circuit board 150 and the second plate 180 (for example, the rear case 160 in FIG. 3), and a camera module assembly structure coupled to the mid plate 160 It may include (200).
  • the second plate 180 may include a camera area 181 in which 120 parts of the camera module 210 are visible to the outside.
  • the camera region 181 may be formed to be substantially transparent so that external light is incident on the camera lens.
  • the second plate 180 may include a planar portion 1801 formed substantially in a plane and a curved portion 1802 formed at an edge of the planar portion 1801.
  • the camera region 181 may be formed on the planar portion 1801.
  • the planar portion 1801 may face substantially the same direction as the optical axis of the lens of the camera module 210.
  • the curved portion 1802 may be connected to the frame structure 1402 of the side member 140 to form a space therein.
  • the second plate 180 may form a surface (eg, a rear surface) of the electronic device 100. In some embodiments, the second plate 180 may form a part of the housing of the electronic device 100.
  • the side member 140 may include a plate structure 1401 on which the printed circuit board 150 is disposed, and a frame structure 1402 surrounding the plate structure 1401.
  • the plate structure 1401 may face substantially the same direction as the planar portion 1801 of the second plate 180.
  • a space in which the printed circuit board 150 is disposed may be formed between the plate structure 1401 and the second plate 180.
  • the frame structure 1402 may be connected to the curved portion 1802 of the second plate 180 to form the space.
  • the frame structure 1402 may form a surface (eg, a side surface) of the electronic device 100.
  • the mid plate 160 (for example, the rear case 160 of FIG. 3) and the printed circuit board 150 Can be placed between the plate structure 1401 of the side member 140 and the second plate 180.
  • the printed circuit board 150 may be disposed on the plate structure 1401.
  • the mid plate 160 may be disposed between the printed circuit board 150 and the second plate 180.
  • the mid plate 160 may include an opening 161 into which the camera module assembly structure 200 may be inserted. In this case, the opening may be substantially formed in a region corresponding to the camera region 181 of the second plate 180.
  • the camera module assembly structure 200 may include a bracket 220 and a camera module 210 coupled to the bracket 220.
  • the camera module 210 may be formed in plural.
  • the bracket 220 may be formed to surround at least a portion of the camera module 210.
  • the bracket 220 may be disposed on the printed circuit board 150 so that at least a portion of the bracket 220 is inserted into the opening 161 formed in the mid plate 160.
  • the camera module 210 may be electrically connected to an electric device (eg, a processor) mounted on the printed circuit board 150.
  • FIG 5 is a perspective view of a camera module assembly structure 200 of the electronic device 100 according to an exemplary embodiment.
  • the camera module assembly structure 200 may include a plurality of camera modules 210a, 210b, and 210c and a bracket 220 on which the plurality of camera modules 210a, 210b, and 210c are installed. .
  • the plurality of camera modules 210a, 210b, 210c is a first camera module 210a slidingly coupled to the first structure 2201 of the bracket 220, and a second structure of the bracket 220 A second camera module 210b and a third camera module 210c fixedly installed on the 2202 may be included.
  • the bracket 220 is formed in the plate structure 2203 facing the second plate 180, the plate structure 2203, and the first structure 2201 to which the first camera module 210a is coupled. ), and a second structure 2202 formed on the plate structure 2203 and in which the second camera module 210b and the third camera module 210c are coupled.
  • the first structure 2201 has a cover surface 221 facing the same direction as the plate structure 2203, and a side surface 228 formed between the cover surface 221 and the plate structure 2203 It may include.
  • the cover surface 221 may be formed substantially in a direction toward the second plate 180.
  • the side surface 228 may be formed in a substantially vertical direction from the cover surface 221 to the plate structure 2203.
  • the plate structure 2203 may be steppedly connected to the cover surface 221 of the first structure 2201.
  • a flange region 223 may be formed at the periphery of the first structure 2201.
  • the first structure 2201 is disposed inside the opening of the mid plate (eg, the mid plate 160 in FIG. 4) (eg, the opening 161 in FIG. 4 ), and the plate structure 2203
  • the flange region 223 may be supported on the periphery of the opening (eg, the opening 161 of FIG. 4 ).
  • the second structure 2202 of the bracket 220 may include a second camera module 210b and a sidewall 224 surrounding the third camera module 210c.
  • FIG. 6 is an exploded perspective view of the camera module assembly structure 200 of the electronic device 100 according to an exemplary embodiment.
  • the first camera module 210a may be slidably coupled to the first structure 2201 of the bracket 220.
  • the first structure 2201 of the bracket 220 may include a cover surface 221 and an opening 225 penetrating through the plate structure 2203.
  • the first camera module 210a includes a base 211, a camera housing 212 formed on the base 211, and a lens barrel 213 in which one or more lenses 214 are disposed ( Example: lens barrel), and a connection member 219 may be included.
  • the base 211 may be formed substantially in a direction toward the plate structure 2203.
  • a substrate (not shown) including an image sensor (not shown), for example, may be disposed on the base 211.
  • the connection member 219 may extend from the substrate to the printed circuit board 150 to electrically connect the image sensor and the processor.
  • the connection member 219 may include an FPCB.
  • the camera housing 212 may include a first surface 2121 facing the base 211 and a side surface 2122 extending from the first surface 2121 to the base 211.
  • the lens barrel 213 may extend from the inside of the camera housing 212 to the outside of the camera housing 212. In this case, the lens barrel 213 may be inserted into the opening 225 of the first structure 2201 of the bracket 220.
  • the first structure 2201 of the bracket 220 may include an opening 225 passing through the cover surface 221 from the plate structure 2203.
  • the camera housing 212 and the lens barrel 213 may be inserted into the opening 225.
  • one or more guide structures 231a for guiding the first camera module 210a may be formed on the inner wall 222 of the opening 225.
  • the guide structure 231a protrudes from the inner wall 222 toward the center of the opening 225, and the protruding surface may be formed in a substantially planar shape. In this case, it may be formed to face the side surface 2122 of the first camera module 210a.
  • the first camera module 210a may be mounted in the opening 225 formed in the first structure 2201 of the bracket 220.
  • the side surface 2122 of the camera housing 212 is in contact with the first guide structure 231a formed in the inner wall 222 of the opening 225, and the camera housing ( The first surface 2121 of 212) may be mounted in the opening 225 so as to face the cover surface 221 of the first structure 2201.
  • the first camera module 210a may be mounted in the opening 225 while the first surface 2121 of the camera housing 212 moves in a direction toward the cover surface 221.
  • FIG. 7 is a cross-sectional view of a first structure 2201 of the camera module assembly structure 200 of the electronic device 100 according to an exemplary embodiment.
  • the opening 225 includes a first part 2251 in which the lens barrel 213 is disposed, a second part 2252 in which the camera housing 212 is disposed, and a substrate ( It may include a third portion 2253 on which the 2111 is disposed.
  • the first portion 2251 may be formed smaller than the second portion 2252, and the second portion 2252 may be formed smaller than the third portion 2253.
  • a first stepped surface 226 may be formed between the first portion 2251 and the second portion 2252 of the opening 225.
  • a second stepped surface 227 may be formed between the second portion 2252 and the third portion 2253 of the opening.
  • first stepped surface 226 and the second stepped surface 227 may be formed to face the optical axis direction of the lens. In various embodiments, the first stepped surface 226 and the second stepped surface 227 may be formed to face the rear surface of the electronic device 100 (eg, a direction toward the camera area 181 of the rear plate). .
  • the inner wall 222 may face the side surface 2122 of the camera housing 212.
  • the inner wall 222 may be formed to surround at least a portion of the camera housing 212.
  • a guide structure 231a may be formed on the inner wall 222 of the opening 225.
  • the guide structure 231a may contact the side surface 2122 of the camera housing 210a.
  • a region of the inner wall 222 of the opening 225 in which the guide structure 231a is not formed may be spaced apart from the side surface 2122 of the camera housing 212 at a predetermined interval.
  • the first stepped surface 226 may face the first surface 2121 of the camera housing 212.
  • the first stepped surface 226 may be spaced apart from the first peripheral region 216 of the first surface 2121 of the camera housing 212 by a predetermined distance.
  • the first peripheral region 216 may include a peripheral portion of a region of the first surface 2121 on which the lens barrel 213 is formed.
  • the second stepped surface 227 may support a part of the substrate 2111.
  • the second stepped surface 227 may face the second peripheral region 217.
  • An adhesive member 229 may be formed between the second stepped surface 227 and the second peripheral region 217.
  • the lens barrel 213 is disposed in the first portion 2251 of the opening 225, and at least a portion of the camera housing 212 is the first portion of the opening 225. It is disposed in the second portion 2252 and may be slidably coupled to the opening 225 so that at least a portion of the substrate 2111 is disposed in the third portion 2253 of the opening 225.
  • FIG. 8 is a diagram illustrating a guide structure of the camera module assembly structure 200 according to various embodiments.
  • the inner wall 222 of the opening 225 may include a first guide member 232 extending in the optical axis direction of the lens.
  • the first guide member 232 may be formed to protrude from the second inner wall 2222 of the opening 225 in the direction of the center of the opening 225.
  • the first guide member 232 may extend from the second stepped surface 227 in the optical axis direction of the lens.
  • the first guide member 232 may extend in a direction from the second stepped surface 227 toward the first stepped surface 226.
  • the camera module 210 may include a first guide rail 233 formed on the side surface 2122 of the camera housing 212.
  • the first guide rail 233 may be formed in a direction from the first peripheral region 216 of the camera housing 212 toward the second peripheral region 217.
  • the camera module 210 includes the first guide member 232 inserted into the first guide rail 233 formed on the side surface 2122 of the camera housing 212 and sliding in the optical axis direction of the lens, It may be detached from the bracket 220.
  • the coupling direction of the camera module 210 and the bracket 220 may be a direction from the second stepped surface 227 of the opening 225 toward the first stepped surface 226 of the opening 225.
  • a direction in which the camera module 210 and the bracket 220 are disengaged may be a direction from the first stepped surface 226 of the opening 225 toward the second stepped surface 227 of the opening 225.
  • the camera module 210 is coupled to the bracket 220 by sliding into the opening 225 in a direction toward the camera area (eg, the camera area 181 of FIG. 4) of the electronic device 100, and By sliding in the opposite direction, it can be removed from the bracket 220.
  • the camera area eg, the camera area 181 of FIG. 4
  • the guide structure of the camera module assembly structure 100 includes a second guide rail 235 formed on an inner wall of the opening 225 and a guide block 250 coupled to the second guide rail 235. ) May be further included.
  • the second guide rail 235 may be formed on the inner wall of the opening 225.
  • the inner wall of the opening 225 may be a surface facing or in contact with a side (eg, side 2122 of FIG. 8) of the camera housing (eg, the camera housing 212 of FIG. 8 ).
  • the second guide rail 235 shown in the drawing may be formed on the second inner wall 2222 formed between the first stepped surface 226 and the second stepped surface 227.
  • the second guide rail 235 may be formed in a shape whose width decreases toward the center of the opening 225.
  • the guide block 250 when the guide block 250 is inserted into the second guide rail 235 in the optical axis direction of the lens, the guide block 250 can be prevented from being deviated in the center direction of the opening 225. . That is, the second guide rail 235 may constrain the guide block 250 in a direction other than the insertion direction and the insertion release direction.
  • the guide block 250 may include an insertion portion 250a formed to be inserted into the second guide rail 235 and an extension portion 250b extending in the direction of the center of the opening 225 from the insertion portion 250a.
  • the extension part 250b is a first guide rail (eg, the side surface 2122 of FIG. 8) formed on the side surface of the camera housing (eg, the camera housing 212 of FIG. 8) shown in FIG. It may be formed in a shape corresponding to the first guide rail 233 of FIG. 8.
  • the insertion portion 250a may be formed in a shape substantially corresponding to the second guide rail 235.
  • the extension part 250b may be formed in a shape corresponding to the first guide rail (eg, the first guide rail 233 of FIG. 8) of the camera housing.
  • the guide block 250 may include an insertion portion 250a having the same shape and an extension portion 250b extending from the insertion portion 250a to different lengths.
  • the extension length of the extension part 250b may correspond to the depth of the guide rail (eg, the first guide rail 233 of FIG. 8) included in the camera housing.
  • a camera module when a camera module includes a guide rail formed with a first depth d1, the first guide block shown in FIG. 9(b) on the second guide rail 235 of the bracket 220 ( The insertion portion 250a of the 251 may be inserted.
  • the extension portion 250b of the first guide block 251 may extend by a first length d1 in the center direction of the opening 225.
  • the camera module may be mounted on the bracket 220 by inserting the extended portion 250b of the first guide block 251 into a guide rail having a first depth d1.
  • a camera module when a camera module includes a guide rail formed with a second depth d2, the second guide block shown in FIG. 9(b) is attached to the second guide rail 235 of the bracket 220. Insertion portion 250a of 252 may be inserted. In this case, the extension portion 250b of the second guide block 252 may extend by a second length d2 in the center direction of the opening 225. Accordingly, the camera module may be mounted on the bracket 220 by inserting the extended portion 250b of the second guide block 252 into a guide rail having a second depth d1.
  • the third guide block shown in FIG. 9(b) is attached to the second guide rail 235 of the bracket 220.
  • the insertion portion 250a of the 253 may be inserted.
  • the extension portion 250b of the third guide block 253 may extend by a third length d3 in the center direction of the opening 225. Accordingly, the camera module may be mounted on the bracket 220 by inserting the extended portion 250b of the third guide block 253 into the guide rail having a third depth d3.
  • FIG. 10 is a diagram illustrating a guide structure of the camera module assembly structure 200 according to various embodiments.
  • a protruding second guide member 234 is formed on the side surface 2122 of the camera housing 212, and the second opening 225 facing the side surface 2122 of the camera housing 212
  • a second guide rail 235 formed so that the second guide member 234 is inserted may be formed on the inner wall 2222.
  • the second guide member 234 extends in a direction from the first peripheral region 216 toward the second peripheral region 217 and is formed on the second inner wall 2222 of the opening 225
  • the second guide rail 235 to be formed may extend in a direction from the second stepped surface 227 toward the first stepped surface 226.
  • the camera module 210 includes a second guide member 234 formed on the side surface 2122 of the camera housing 212 and a second guide rail formed on the second inner wall 2222 of the opening 225. By sliding on 235 in the optical axis direction of the lens, it may be detached from the bracket 220.
  • the coupling direction of the camera module 210 and the bracket 220 may be a direction from the second stepped surface 227 of the opening 225 toward the first stepped surface 226 of the opening 225.
  • FIG. 11 is a diagram illustrating a guide structure of a camera module assembly structure 200 according to various embodiments.
  • the bracket 220 may further include an elastic member 236 disposed on the inner wall of the opening 225.
  • the elastic member 236 may be disposed on the second inner wall 2222 facing the side of the camera housing (eg, the camera housing 212 of FIG. 10 ).
  • a recess 237 in which a part of the elastic member 236 is seated may be formed in the inner wall 2222 of the opening 225.
  • the elastic member 236 may be formed to provide an elastic force in a direction from the second inner wall 2222 of the opening 225 toward the camera housing (eg, the camera housing 212 of FIG. 10 ).
  • the elastic member 236 is compressed when the camera module (eg, the camera module 210 of FIG. 10) is inserted into the opening 225, and the camera module (eg, the camera module 210 of FIG. 10) is compressed. )) After the insertion into the opening 225 is completed, an elastic force for pressing the camera housing (eg, the camera housing 212 of FIG. 10) may be provided.
  • the elastic member 236 may include a curved portion 2361 contacting the camera housing (eg, the camera housing 212 of FIG. 10 ).
  • the camera module e.g., the camera module 210 of FIG. 10
  • the curved portion 2361 is formed by the side of the camera housing (e.g. Move in the outer direction of the opening 225 (eg, a direction toward the inner wall 222 of the opening 225 in FIG. 10), and a camera module (eg, the camera module 210 of FIG. 10)
  • the camera housing eg, the camera housing 212 of FIG. 10.
  • some of the plurality of camera modules may be slidably assembled, so the assembly process is performed. There is an advantageous effect that can be simplified.
  • certain electronic devices include a common camera module (eg, the first camera module 210a) applied regardless of the model of the electronic device, and a dedicated camera module (eg, a first camera module) that is applied differently according to the model of the electronic device. It may include a 2 camera module (210b) and a third camera module (210c)).
  • a common camera module eg, the first camera module 210a
  • a dedicated camera module eg, a first camera module
  • It may include a 2 camera module (210b) and a third camera module (210c)).
  • the dedicated camera module (eg, 210b, 210c) is attached to the bracket (eg, the second structure 2202 of the bracket 220 of FIG. 5) by the camera module assembly structure 200 disclosed in this document. Can be installed.
  • the common camera module 210a may be fixedly installed on a bracket (eg, the first structure 2201 of the bracket 220 of FIG. 5 ).
  • a low-end electronic device may include a first dedicated camera module
  • a high-end electronic device may include a second dedicated camera module
  • each of the low-end electronic device and the high-end electronic device may include the same common camera module.
  • the camera module assembly process may include a common assembly process of fixing the common camera module to the bracket.
  • the assembly process of assembling the first dedicated camera module to the bracket is performed in the popular model, and the assembly process of assembling the second dedicated camera module to the bracket (for example, the first structure 2201 in FIG. 5) in the high-end model. This can be done.
  • the camera module assembly structure according to an embodiment disclosed in the present document has an advantageous effect of simplifying the assembly process by integrating a part of the camera assembly process that was different for each model of the electronic device.
  • the electronic device 100 includes a housing 110 in which a camera area 181 is formed on one surface (eg, a rear surface); A first surface (eg, cover surface 221) disposed under the camera area 181 and facing the camera area 181, and a first surface (eg, cover surface 221) facing the camera area 181 A bracket 220 including two surfaces and an opening 225 penetrating through the first surface (eg, the cover surface 221) and the second surface (eg, the plate structure 2203); And a first surface 2121 facing the camera area 181, a second surface facing the first surface (eg, base 211), and between the first surface 2121 and the second surface.
  • a camera area 181 is formed on one surface (eg, a rear surface);
  • a first surface eg, cover surface 221) disposed under the camera area 181 and facing the camera area 181, and a first surface (eg, cover surface 221) facing the camera area 181
  • a bracket 220 including two surfaces and an opening 225 penetrating through the first surface (eg
  • Camera housing 212 including a side surface 2122 surrounding the space of the camera, and a camera module 210 including one or more lenses 214; Including, the camera module 210, the light of the lens
  • An axis may be disposed in the opening 225 so that the axis passes through the camera area 181 and the side surface 2122 of the camera housing 212 contacts the inner wall 222 of the opening 225.
  • a guide structure for coupling the bracket 220 and the camera module 210 is further included, and the guide structure includes the side surface 2122 and the opening 225 of the camera housing 212. ), the other one of the guide rails 233 and 235 formed on any one of the inner walls 222 of the camera housing 212 and the inner wall 222 of the opening 225 and the side surface 2122 of the camera housing 212
  • the guide members 232 and 234 are formed in and have a shape corresponding to the guide rails 233 and 235.
  • a guide structure for coupling the bracket 220 and the camera module 210 is further included, and the guide structure includes a first structure formed on the side surface 2122 of the camera housing 212.
  • the second guide rail 235 may be formed to have a smaller width (eg, W in FIG. 9) toward the center of the opening 225.
  • the guide rails 233 and 235 may extend in a direction from the second surface of the bracket 220 toward the first surface.
  • the guide members 232 and 234 are protruded from the side surface 2122 of the camera housing 212, and the camera module 210 includes the guide members 232 and 234 By being inserted into (233, 235) and sliding, it may be coupled to the bracket (220).
  • a guide structure for coupling the bracket 220 and the camera module 210 is further included, and the guide structure is formed on the inner wall 222 of the opening 225, and the camera housing It may include an elastic member 236 that provides an elastic force in the direction of pressing the side surface 2122 of (212).
  • a recess in which the elastic member 236 is disposed may be formed in the inner wall 222 of the opening 225.
  • the camera module 210 includes a lens barrel 213 formed on the first surface of the camera housing 212, and the camera module 210 includes at least the lens barrel 213. It may be coupled to the bracket 220 so that a part is disposed inside the opening 225.
  • the camera module 210 may be coupled to the bracket 220 so that the lens barrel 213 protrudes above the first surface (eg, the cover surface 221) of the bracket 220. have.
  • the opening 225 has a first portion 2251 having a shape substantially corresponding to the camera housing 212 and a shape substantially corresponding to the lens barrel 213, and A second portion 2252 formed smaller than the first portion 2251 and a stepped surface formed between the first portion 2251 and the second portion 2252 (for example, a first stepped surface 226) Including, the stepped surface (eg, the first stepped surface 226) may support a peripheral region (eg, the first peripheral region 216) of the lens barrel 213.
  • the housing 110 includes a first plate 120, a second plate 180 on which the camera region 181 is formed, and the first plate 120 and the second plate 180
  • the electronic device 100 includes a side member 140 surrounding a space therebetween, and the electronic device 100 includes a mid plate 160 disposed between the first plate 120 and the second plate 180, and the mid Further comprising a printed circuit board 150 disposed on the plate 160, the mid plate 160 includes a recess (for example, an opening 161) formed in a region corresponding to the camera region 181
  • the bracket 220 may be disposed in the recess (eg, the opening 161).
  • connection member 219 extending from the second surface (eg, the base 211) to the printed circuit board 150 may be further included.
  • connection member 219 may include an FPCB.
  • the electronic device 100 includes a housing 110; A bracket 220 disposed inside the housing 110 and having an opening 225 formed therein; A plurality of camera modules 210 each including one or more lenses 214 and coupled to the bracket 220; And a guide structure for guiding the camera module 210 to the opening 225, wherein the plurality of camera modules 210 include light of the lens in the opening 225 of the bracket 220.
  • a first camera module (210a) coupled to be movable in the axial direction, the first camera module (210a), a base 211 on which an image sensor is disposed, the base 211 to cover the image sensor
  • the guide structure includes the opening 225 )
  • Guide members 232 and 234 may be included, and the guide rails 233 and 235 and the guide members 232 and 234 may extend in the optical axis direction of the lens, respectively.
  • the opening 225 includes a first portion 2251 where the lens barrel 213 is disposed, a second portion 2252 where the camera housing 212 is disposed, and the base 211 A third portion 2253, a first stepped surface 226 formed between the first portion 2251 and the second portion 2252, and the second portion 2252 and the third portion 2253 ) And a second stepped surface 227 formed therebetween, and the first stepped surface 226 includes a peripheral portion of an outer surface of the camera housing 212 in which the lens barrel 213 is formed.
  • the peripheral region 216 is supported, and the second stepped surface 227 may support a second peripheral region 217 including a peripheral portion of a region in which the camera housing 212 is formed among the surfaces of the base 211. I can.
  • the first portion 2251 may be formed smaller than that of the second portion 2252, and the second portion 2252 may be formed smaller than the third portion 2253.
  • the guide rails 233 and 235 extend from the second stepped surface 227 in a first direction parallel to the optical axis direction of the lens, and the guide members 232 and 234 1 It may extend in a second direction parallel to the optical axis direction of the lens from the peripheral area and opposite to the first direction.
  • a printed circuit board 150 disposed inside the housing 110 and on which the bracket 220 is disposed, and a processor mounted on the printed circuit board 150 are further included, and the first 1
  • the camera module 210a may further include a connection member 219 extending from the base 211 to the printed circuit board 150 to electrically connect the processor from the image sensor.
  • the plurality of camera modules 210 may include a second camera module 210b, and the second camera module 210b may be fixed to the bracket 220.
  • a device configured to may mean that the device “can” along with other devices or parts.
  • a processor configured (or configured) to perform A, B, and C means a dedicated processor (eg, an embedded processor) for performing the corresponding operations, or by executing one or more programs stored in a memory device, It may refer to a general-purpose processor (eg, CPU or AP) capable of performing corresponding operations.
  • module used in this document includes a unit composed of hardware, software, or firmware, and is used interchangeably with terms such as logic, logic blocks, parts, or circuits. I can.
  • the “module” may be an integrally configured component or a minimum unit that performs one or more functions, or a part thereof.
  • Modules can be implemented mechanically or electronically, for example, known or future development, application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), or It may include a programmable logic device.
  • ASIC application-specific integrated circuit
  • FPGAs field-programmable gate arrays
  • At least a part of an apparatus (eg, modules or functions thereof) or a method (eg, operations) according to various embodiments may be implemented as instructions stored in a computer-readable storage medium in the form of a program module.
  • the processor may perform a function corresponding to the instruction.
  • Computer-readable recording media include hard disks, floppy disks, magnetic media (eg, magnetic tape), optical recording media (eg, CD-ROM, DVD, magnetic-optical media (eg, floppy disks)), internal memory, etc.
  • the instruction may include code generated by a compiler or code that can be executed by an interpreter.
  • Each of the constituent elements may be composed of a singular or a plurality of entities, and some of the aforementioned sub-elements may be omitted, or other sub-elements may be omitted. It may contain more. Alternatively or additionally, some constituent elements (eg, a module or a program module) may be integrated into a single entity to perform the same or similar functions performed by each corresponding constituent element before the consolidation. Operations performed by modules, program modules, or other components according to various embodiments may be sequentially, parallel, repetitively or heuristically executed, or at least some operations may be executed in a different order, omitted, or other operations. Can be added.

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Abstract

La présente invention concerne un dispositif électronique. Le dispositif électronique comprend : un boîtier dans lequel une zone de caméra est formée sur une surface de celui-ci; un support disposé au-dessous de la zone de caméra et comprenant une première surface faisant face à la zone de caméra, une seconde surface opposée à la première surface, et une ouverture pénétrant dans la première surface et la seconde surface; un module de caméra comprenant un boîtier de caméra et une ou plusieurs lentilles, le boîtier de caméra comprenant une première surface faisant face à la zone de caméra, une seconde surface opposée à la première surface, et des surfaces latérales entourant un espace entre la première surface et la seconde surface; et une structure de guidage comprenant un élément de guidage faisant saillie à partir d'une paroi interne de l'ouverture, le module de caméra pouvant être disposé dans l'ouverture de telle sorte que les axes optiques des lentilles passent à travers la zone de caméra et les surfaces latérales du boîtier de caméra sont en contact avec l'élément de guidage. Divers autres modes de réalisation qui découlent de la présente invention sont également possibles.
PCT/KR2020/002208 2019-02-19 2020-02-17 Ensemble de module de caméra et dispositif électronique le comprenant Ceased WO2020171498A1 (fr)

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KR1020190019575A KR20200101240A (ko) 2019-02-19 2019-02-19 카메라 모듈 조립 구조 및 이를 포함하는 전자 장치
KR10-2019-0019575 2019-02-19

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WO2022092754A1 (fr) * 2020-10-26 2022-05-05 삼성전자 주식회사 Dispositif électronique comprenant une pluralité de caméras
KR102840632B1 (ko) * 2020-12-02 2025-08-01 삼성전자주식회사 에어 벤트를 포함하는 전자 장치
KR20220079220A (ko) * 2020-12-04 2022-06-13 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치
KR102805426B1 (ko) * 2020-12-21 2025-05-12 삼성전자주식회사 전자 장치에 있어서 카메라 커버를 이용한 슬롯 안테나가 구현된 장치
EP4362486B1 (fr) 2021-08-18 2026-03-11 Samsung Electronics Co., Ltd. Support de caméra et dispositif électronique le comprenant
KR20230026744A (ko) * 2021-08-18 2023-02-27 삼성전자주식회사 카메라 브라켓 및 이를 포함하는 전자 장치
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