WO2020177051A1 - Structure de module et dispositif électronique - Google Patents

Structure de module et dispositif électronique Download PDF

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Publication number
WO2020177051A1
WO2020177051A1 PCT/CN2019/076854 CN2019076854W WO2020177051A1 WO 2020177051 A1 WO2020177051 A1 WO 2020177051A1 CN 2019076854 W CN2019076854 W CN 2019076854W WO 2020177051 A1 WO2020177051 A1 WO 2020177051A1
Authority
WO
WIPO (PCT)
Prior art keywords
module structure
light
circuit board
reflecting
reflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/076854
Other languages
English (en)
Chinese (zh)
Inventor
王文轩
沈健
青小刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Priority to PCT/CN2019/076854 priority Critical patent/WO2020177051A1/fr
Priority to CN201980000385.2A priority patent/CN110062902A/zh
Publication of WO2020177051A1 publication Critical patent/WO2020177051A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring

Definitions

  • the embodiments of the present application relate to integrated module technology, and in particular to a module structure and electronic equipment.
  • the module structure due to the consideration of the propagation path of the optical path and the introduction of devices, the module structure is thicker, and this makes the module structure less integrated, thereby affecting the integration of electronic equipment.
  • the embodiments of the present application provide a module structure and an electronic device, so as to reduce the thickness of the module structure, improve the integration degree of the module structure, and thereby improve the integration degree of the electronic device.
  • an embodiment of the present application provides a module structure, including: a circuit board and an optical receiver;
  • the circuit board is provided with an opening on the side facing the light receiver, a reflection unit is provided in the opening, and the reflection surface of the reflection unit faces the light receiver for reflecting incident light to the light receiver.
  • Optical receiver Optical receiver.
  • an embodiment of the present application also provides a module structure, including: a reinforcement board, a circuit board, and an optical receiver;
  • the reinforcing plate is located on the side away from the circuit board, and the side of the reinforcing plate facing the circuit board is provided with a reflective layer; the projection area of the reflective layer on the circuit board has an opening; The reflective layer faces the light receiver and is used for reflecting the light incident through the opening to the light receiver.
  • an embodiment of the present application also provides an electronic device, including: the module structure of the first aspect described above.
  • an embodiment of the present application also provides an electronic device, including: the module structure of the second aspect described above.
  • the embodiments of the present application provide a module structure and electronic equipment.
  • the module structure may include a circuit board and an optical receiver.
  • the circuit board is provided with an opening on the side facing the light receiver, and a reflection unit is arranged in the opening, and the reflection surface of the reflection unit faces the light receiver for reflecting incident light to the light receiver.
  • the incident light can be reflected to the light receiver through the reflecting unit provided in the opening of the circuit board, which realizes the folding of the optical path, reduces the thickness of the module structure or keeps the thickness of the module structure unchanged.
  • the optical path is increased, the integration of the module structure is improved, and the integration of the electronic equipment is improved.
  • FIG. 1 is a first schematic diagram of a module structure provided by an embodiment of the application
  • 2A is a schematic diagram of a reflection unit in a module structure provided by an embodiment of the application as an internal reflection structure;
  • FIG. 2B is a schematic diagram of a reflection unit in a module structure provided by an embodiment of the application as an external reflection structure;
  • FIG. 3 is a second schematic diagram of a module structure provided by an embodiment of the application.
  • FIG. 4 is a third schematic diagram of a module structure provided by an embodiment of the application.
  • FIG. 5 is a schematic diagram 1 of another module structure provided by an embodiment of the application.
  • FIG. 6 is a second schematic diagram of another module structure provided by an embodiment of the application.
  • FIG. 7 is a third schematic diagram of another module structure provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of a stack of a fingerprint identification device for a liquid crystal display screen provided by an embodiment of the application.
  • FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • the module structure and electronic equipment provided by the following embodiments of the present application can be applied to any electronic equipment with optical propagation such as smart phones, notebook computers, wearable devices, and household appliances.
  • the module structure can be any module with light path propagation, such as a display module, a fingerprint recognition module, or a structured light module.
  • the structured light module can also be called a three-dimensional (3D) structured light module or a laser module.
  • a reflective structure can be provided in the module structure through two implementations, and the optical path is increased through the reflective structure, and the thickness of the module structure is reduced.
  • an opening may be provided on the circuit board, and an external reflection unit may be introduced into the opening.
  • the surface of the reinforcing plate provided on the back of the circuit board can be processed to provide a reflective layer, and an opening is provided in the projection area of the reflective layer on the circuit board so that light can penetrate The circuit board is incident on the reflective layer.
  • FIG. 1 is a first schematic diagram of a module structure provided by an embodiment of the application.
  • the module structure may include: a circuit board 12 and an optical receiver 13.
  • the side of the circuit board 12 facing the light receiver 13 is provided with an opening, and a reflection unit 14 is provided in the opening.
  • the reflecting surface of the reflecting unit 14 faces the light receiver 11 for reflecting incident light to the light receiver 13.
  • the circuit board 12 may be a flexible printed circuit board (Flexible Printed Circuit Board, referred to as FPCB), or a rigid circuit board, also referred to as a printed circuit board (Printed Circuit Board, referred to as PCB).
  • FPCB Flexible Printed Circuit Board
  • PCB printed circuit Board
  • the module structure may further include a reinforcing board 11.
  • the reinforcing plate 11 can be located on the back of the circuit board 12.
  • the reinforcing plate 11 is used as a strength enhancer and can be used to provide support for the circuit board 12 to reinforce the strength of the circuit board 12. It can be a steel plate or other devices that can have rigid support characteristics.
  • a reinforcing plate 11 is provided on the back of the circuit board 12 to provide support for the circuit board 12 to avoid strength loss caused by the opening of the circuit board 12 and to ensure the strength of the circuit board 12.
  • the reinforcing plate 11 is located on the back of the circuit board 12, which means that the base structure of the circuit board 12 is arranged on the reinforcing plate 11, and the base structure of the circuit board 12 is also provided with circuits.
  • the other areas on the circuit board 12 other than the circuit can also be provided with integrated circuit chips, discrete devices, optical components, or electrical components through binding, gluing, etc., which will not be repeated here.
  • the module structure may not include a reinforcement board.
  • FIG. 1 is only a module structure with a reinforcement board.
  • the structural view is similar to that of FIG. 1. The only difference is that the reinforcing plate 11 is not included, and the opening types on the circuit board 12 can be different. The similarities are not repeated here.
  • the thickness of the module structure can be reduced and the cost can be saved.
  • An opening is provided in a predetermined area on the base structure of the circuit board 12, and the opening can be any similar hole such as a through hole, a blind hole or a groove.
  • the hole can be obtained by performing hole processing on the base structure of the circuit board 12 through any process such as etching, laser cutting, mechanical cutting and the like.
  • the opening can be a through hole; if the circuit board 12 is a rigid circuit board, also called a PCB, the opening on the circuit board 12 can be a blind hole or a groove.
  • the reflecting unit 14 can be arranged in the opening.
  • the thickness of the reflection unit 14 in the depth direction of the opening can be greater than or equal to the depth of the opening, and of course can also be less than the depth of the opening, as long as the reflection unit 14 can reflect light to the light receiver 13.
  • the reflecting unit 14 may be an independent structure or a separate structure. If the reflection unit 14 is an independent structure, the reflection unit 14 can be a metal or non-metal material with a reflective layer; if the reflection unit 14 is a discrete structure, the reflection unit 14 can be an internal reflection structure or an external reflection structure.
  • FIG. 2A is a schematic diagram of a reflection unit in a module structure provided by an embodiment of the application as an internal reflection structure. As shown in FIG. 2A, if the reflection unit 14 has an internal reflection structure, the reflection unit 14 may include: a base layer 141 and a reflection layer 142 disposed on the back of the base layer 141. The reflection surface of the reflection unit 14 is the reflection layer 142; 141 is located on the side close to the light receiver 13, and the reflective layer 142 is located on the side far away from the light receiver 142.
  • the base layer 141 of the reflection unit 14 may be a transparent material, such as glass, plastic, PolyEthylene Terephthalate (PET), or organic glass.
  • the base layer 141 of the reflective unit 14 may also be a base material that passes through a predetermined specific wavelength and absorbs other wavelengths, such as ARTON film and metal materials such as germanium.
  • the reflective layer 142 may be a film material with high reflection, such as aluminum (Al), silver (Ag), aluminum oxide (Al 2 O 3 ), silicon dioxide (SiO 2 ), titanium dioxide (TiO 2 ), gold ( Single-layer or multilayer structure of materials such as Au) or copper (Cu).
  • light can penetrate the base layer 141 and be reflected at the reflective layer 142 located at the bottom of the base layer 141, which can further increase the optical path.
  • FIG. 2B is a schematic diagram of a reflection unit in a module structure provided by an embodiment of the application as an external reflection structure.
  • the reflective unit 14 may include: a base layer 141 and a reflective layer 142 disposed on the back of the base layer 141, the reflective surface of the reflective unit 14 is the reflective layer 142; 141 is located on the side far away from the light receiver 13, and the reflective layer 142 is located on the side close to the light receiver 142.
  • the material of the base layer 141 of the reflection unit 14 of the external reflection structure may be the same as the material of the base layer 141 of the reflection unit 14 of the internal reflection structure in FIG. 2A.
  • the reflection unit of the external reflection structure The material of the reflective layer 141 of 14 may be the same as the material of the reflective layer 141 of the reflective unit 14 of the internal reflection structure in FIG. 2A.
  • the reflection unit 14 of the external reflection structure shown in FIG. 2B is different from the reflection unit 14 of the internal reflection structure shown in FIG. 2A in that the positions of the base layer 141 and the reflection layer 142 are different, which makes light incident and emission different .
  • the light does not need to penetrate the base layer 141 and can be directly reflected on the reflection layer 142.
  • the structure of the reflection unit 14 may not be limited to the structure shown in FIG. 2A and FIG. 2B, and may also be other structural forms. There is no restriction on this.
  • the light receiver 13 can be arranged on the circuit board 12, or in the upper area of the circuit board 12 in the module structure, that is, the area on the side away from the reinforcing plate, or it can be arranged in any position in the module structure.
  • the specific position of the optical receiver 13 in the module structure can be determined according to the optical path requirements of the module structure.
  • the light receiver 13 may be a light sensor chip, which may also be called a light sensor, or a light sensor, which may be an integrated circuit sensor.
  • the module structure can be applied to any field of consumer electronic devices. Taking fingerprint recognition as an example, in the field of fingerprint recognition, the optical receiver may be, for example, a fingerprint sensor.
  • the optical receiver 13 may also be an optical path modulation device, which may be a secondary optical path modulation modulation device, such as an optical path modulation device integrating a lens and/or an optical filter device.
  • the light receiver 13 can also be an optical path modulation device, such as a lens.
  • the light reflected by the reflective surface of the reflection unit 14 enters the optical path modulation device, and the optical path modulation device will The light is modulated into the fingerprint sensor, or, after the light is modulated by the optical path modulation device, it is incident to other optical path modulation devices, and the other optical path modulation device modulates the light into the fingerprint sensor.
  • the module structure may be an integrated packaging structure, and the middle part of the module structure, that is, the part outside the devices included in the module structure, may be filled with a transparent material to protect the devices.
  • the components included in the module structure may be, for example, the aforementioned reinforcing plate 11, the circuit board 12, the light receiver 13, and the reflecting unit 14 provided in the opening of the circuit board 12, etc.
  • the transparent material may be epoxy resin or the like, for example.
  • the filling may not be performed, that is, the parts other than the devices included in the module structure are air medium. Since different media have different requirements for the optical path, the characteristics of the filled transparent material can be configured according to the optical path requirements of the module structure.
  • the module structure shown in FIG. 1 may or may not include internal light sources. If it includes an internal light source, the incident light received by the reflecting surface of the reflecting unit 14 may be the light incident from the internal light source, or may be the light emitted by the internal light source, and the light reflected by the external device of the module structure; It does not include an internal light source, and the incident light received by the reflecting surface of the above-mentioned reflecting unit 14 may be light incident from an external light source.
  • the incident light received by the reflecting surface of the above-mentioned reflecting unit 14 may be light incident from an external light source.
  • FIG. 3 is a second schematic diagram of a module structure provided by an embodiment of the application.
  • FIG. 3 shows a possible implementation of the module structure including the internal light source, that is, the first light source 15.
  • the above-mentioned module structure may further include: a first light source 15.
  • the incident light received by the reflecting surface of the reflecting unit 14 may be the light incident from the first light source 15.
  • the first light source 15 is the internal light source of the module structure.
  • the first light source 15 can be arranged on the circuit board 12 or on the circuit board 12. In the module structure, the area above the circuit board 12 is far away from the compensation.
  • One side area of the strong plate (the structure for fixing the first light source 15 in the upper area is not shown in the drawings); the first light source 15 can also be arranged at any position in the module structure.
  • the specific position of the optical receiver 13 in the module structure can be determined according to the optical path requirements of the module structure.
  • the first light source 15 and the light receiver 13 may be respectively located in two different directions of the reflection surface of the reflection unit 14, that is, directions on both sides of the normal line of the reflection surface of the reflection unit 14.
  • the first light source 15 may be a backlight source, and the backlight source may be a white light emitting diode (Light Emitting Diode, LED for short).
  • the backlight source may be a white light emitting diode (Light Emitting Diode, LED for short).
  • the first light source 15 may be a structured light source, and the structured light source may be, for example, a laser light source.
  • the incident light received by the reflecting surface of the reflecting unit 14 is the internal light source, that is, the light source emitted by the first light source 15 passes through other light sources than the module structure.
  • the light reflected by the device that is to say, the difference between this other implementation manner and the implementation manner shown in FIG. 3 is that the light path between the reflection unit 14 and the first light source 15 is slightly different, and the rest is similar.
  • FIG. 4 is a third schematic diagram of a module structure provided by an embodiment of the application.
  • the incident light received by the reflecting surface of the reflecting unit 14 may be incident light from the second light source 2 outside the module structure.
  • the second light source 2 is an external light source of the module structure.
  • the second light source 2 can be any type of light source such as white light LED, laser light source, infrared light source, etc.
  • the module structure provided by the embodiment of the present application may include a circuit board and an optical receiver.
  • the circuit board is provided with an opening on the side facing the light receiver, and a reflection unit is arranged in the opening, and the reflection surface of the reflection unit faces the light receiver for reflecting incident light to the light receiver.
  • the incident light can be reflected to the light receiver through the reflecting unit provided in the opening of the circuit board, which realizes the folding of the optical path, reduces the thickness of the module structure or keeps the thickness of the module structure unchanged.
  • the optical path is increased, the integration of the module structure is improved, and the integration of the electronic equipment is improved.
  • a reinforcing plate is provided on the back of the circuit board, it can provide strength support for the circuit board, avoiding insufficient strength of the circuit board due to openings.
  • the reflecting unit is arranged on the reinforcing plate in the opening to strengthen The board also provides strength support for the reflection unit, increasing the strength and reliability of the reflection unit.
  • FIG. 5 is a first schematic diagram of another module structure provided by an embodiment of the application.
  • the module structure may include: a reinforcement board 51, a circuit board 52 and an optical receiver 53.
  • the reinforcing plate 51 is located on the side away from the circuit board 52, and the side of the reinforcing plate 51 facing the circuit board 52 is provided with a reflective layer 54; the reflective layer 54 on the circuit board 52 has an opening in the projection area; the reflective layer 54 faces the light receiving
  • the device 53 is used to reflect the light incident through the opening to the light receiver 53.
  • the reinforcing plate 51 is used as a strength enhancer and can be used to provide support for the circuit board 52 to reinforce the strength of the circuit board 52, and it can be a steel plate or other devices with rigid support characteristics.
  • the circuit board 52 may be a flexible circuit board, also called FPCB, or a rigid circuit board, also called PCB.
  • a reinforcing plate 51 is provided on the back of the circuit board 52 to provide support for the circuit board 52 to avoid the strength caused by openings in the circuit board 52. Loss to ensure the strength of the circuit board 52.
  • the side of the reinforcing plate 51 facing the circuit board 52 is provided with a reflective layer 54, that is, the reflecting layer is located on the surface of the reinforcing plate 51 facing the circuit board 52. Therefore, in the case where the reinforcing plate 51 is provided, the surface of the reinforcing plate 51 may be subjected to reflection treatment to obtain the reflective layer 54 on the surface of the reinforcing plate 51.
  • the reflection treatment may be, for example, a high-reverse coating treatment.
  • the high-reverse coating material required for the high-reverse coating treatment may include aluminum (Al), silver (Ag), aluminum oxide (Al 2 O 3 ), and dioxide Single-layer or multi-layer structure of materials such as silicon (SiO 2 ), titanium dioxide (TiO 2 ), gold (Au) or copper (Cu), wherein the thickness and content of each layer of material can be reflected according to the required reflection of the module structure The wavelength range is determined and will not be repeated here.
  • the reflection treatment may also be a physical or chemical treatment, so that the surface of the reinforcing plate 51 has reflection characteristics, which meets the preset reflection requirements, thereby obtaining high reflection requirements.
  • the surface of the reinforcing plate 51 can be ground and polished and a protective layer is formed by mechanical polishing or mechanical polishing combined with electrochemical polishing, anodizing processes, etc., so that the reinforcing plate 51
  • the surface can meet the requirements of high reflection without introducing additional film materials.
  • the base material of the reinforcing plate 51 can also be aluminum alloy, gold, silver, polymer materials, etc.
  • the surface coating film structure changes little, and the surface treatment grinding and polishing process can be used. According to the surface properties of the base material, it is within the scope of the embodiments of the present application as long as the requirement of high reflection is met.
  • the reflective layer 54 may be disposed on a predetermined partial area on the surface of the reinforcing plate 51 or may be disposed on the entire surface area of the reinforcing plate 51.
  • the sub-height range of the reflective layer 54 on the surface of the reinforcing plate 51 can be determined according to the light reflection requirements in practical applications.
  • the circuit board 52 can be provided on the surface of the reflective layer 54 so that the reflective layer 54 is provided on the side of the reinforcing plate 51 facing the circuit board 52.
  • the reflective layer 54 on the circuit board 52 has openings in the projection area, which means that part or all of the reflective layer 54 on the circuit board 52 has openings in the projection area. If the reflective layer 54 is located in a predetermined partial area on the reinforcing plate 51, the opening can be located in the projection area of the reflective layer on the circuit board 52, and the projection area completely covers the area of the opening.
  • the area of the opening may be exactly the same as the projection area or smaller than the projection area, as long as the area of the opening is guaranteed to be within the coverage of the projection area.
  • the example of opening the circuit board 52 in this embodiment may be the same or similar to the example of opening the circuit board 12 in the module structure shown in FIG. 1. For details, refer to the above, and will not be repeated here.
  • the position of the optical receiver 53 in the module structure and the specific form of the optical receiver 53 can be similar to the optical receiver 13 of the module structure in FIG. Repeat.
  • the module structure may be an integrated packaging structure, and the middle part of the module structure, that is, the part outside the devices included in the module structure, may be filled with a transparent material to protect the devices.
  • the components included in the module structure may be, for example, the aforementioned reinforcing plate 51, circuit board 52, optical receiver 53, and other components.
  • the transparent material may be epoxy resin or the like, for example.
  • the filling may not be performed, that is, the parts other than the devices included in the module structure are air medium. Since different media have different requirements for the optical path, the characteristics of the filled transparent material can be configured according to the optical path requirements of the module structure.
  • the module structure shown in FIG. 5 may or may not include internal light sources. If it includes an internal light source, the incident light received by the reflective layer 54 may be the light incident from the internal light source, or the light emitted by the internal light source, and the light reflected by the external components of the module structure; if it does not include Internal light source, the incident light received by the reflective layer 54 may be light incident from an external light source.
  • internal light source the incident light received by the reflective layer 54 may be the light incident from an external light source.
  • FIG. 6 is a second schematic diagram of another module structure provided by an embodiment of the application.
  • FIG. 6 shows a possible implementation of the module structure including the internal light source, that is, the first light source 55.
  • the above-mentioned module structure may further include: a first light source 55.
  • the incident light received by the reflective layer 54 may be the light incident from the first light source 55.
  • the position of the first light source 55 in the module structure and the possible forms of the first light source 55 may be similar to the first light source 15 in FIG. 3 described above. For details, refer to the above, and will not be repeated here.
  • the incident light received by the reflective layer 54 is its internal light source, that is, the light source emitted by the first light source 55 is reflected by other devices outside the module structure Light. That is to say, this other implementation is different from the implementation shown in FIG. 6 in that the light path between the reflective layer and the first light source 55 is slightly different, and the rest is similar.
  • FIG. 7 is a third schematic diagram of another module structure provided by an embodiment of the application.
  • the incident light received by the reflective layer 54 may be the light incident from the second light source 6 outside the module structure.
  • the second light source 6 is an external light source of the module structure.
  • the second light source 6 can be any type of light source such as white light LED, laser light source, infrared light source, etc.
  • the module structure provided by the embodiment of the present application may include a reinforcement board, a circuit board and an optical receiver.
  • the reinforcing plate is located on the side away from the circuit board, and the side of the reinforcing plate facing the circuit board is provided with a reflective layer; the projection area of the reflective layer on the circuit board has an opening; the reflective layer faces the light receiver to pass through the opening The incident light is reflected to the light receiver.
  • the reflective layer can be provided on one side of the circuit board through the reinforcing plate, and an opening is provided in the projection area of the reflective layer on the circuit board, so that the reflective layer can reflect the incident light to the light receiver.
  • the folding of the optical path reduces the thickness of the module structure or increases the optical path under the condition that the thickness of the module structure remains unchanged, and improves the integration degree of the module structure, thereby improving the integration degree of electronic equipment.
  • only the surface of the reinforcing plate needs to be processed to have a reflective layer, without adding additional reflective parts, and the optical path can be further increased or the thickness of the module structure can be reduced.
  • the module structure provided in this application can be any module with optical path propagation, such as a display module, a fingerprint recognition module, or a structured light module.
  • a display module such as a liquid crystal display, and the liquid crystal display to which the module structure is applied can be a liquid crystal display fingerprint recognition device.
  • FIG. 8 is a schematic diagram of a stack of a fingerprint identification device for a liquid crystal display screen provided by an embodiment of the application.
  • the liquid crystal display fingerprint identification device may include: a display module 81 and a fingerprint module 82.
  • the display module 81 includes a liquid crystal panel 811 and a backlight module 812 arranged on the back of the liquid crystal panel 811.
  • the fingerprint module 82 is based on the module structure shown in FIG. 1 or FIG. 5, and may include a fingerprint light source 821, a first reflecting unit 822, a second reflecting unit 823 and a fingerprint sensor 824.
  • the liquid crystal panel 811 can be located above the backlight module 812.
  • the display module 81 may further include a cover plate 813, and the liquid crystal panel 811 can be located between the cover plate 813 and the backlight module 812.
  • the first reflecting unit 822, the second reflecting unit 823 and the fingerprint sensor 824 are used to be arranged between the liquid crystal panel 811 and the backlight module 812.
  • the fingerprint module 82 may further include a transmission unit 825.
  • the transmissive unit 825 can be located between the first reflective unit 822 and the second reflective unit 823, that is, one side of the transmissive unit 825 can be set toward the reflective surface of the first reflective unit 822 to receive the light reflected by the first reflective unit 822 and transmit
  • the other surface of the unit 825 may be disposed toward the reflection surface of the second reflection unit 823 to transmit the light reflected by the first reflection unit 822 to the reflection surface of the second reflection unit 823.
  • the light emitted by the fingerprint light source 821 after being reflected by the finger, is incident on the reflecting surface of the first reflecting unit 822 through the cover 813 and the liquid crystal panel 812 in sequence.
  • the reflecting surface of the first reflecting unit 822 reflects the received light to the first reflecting unit 822.
  • the reflecting surface of the second reflecting unit 823 receives light from the reflecting surface of the second reflecting unit 823 and reflects it to the photosensitive surface of the fingerprint sensor 824, so that the fingerprint sensor 824 generates a fingerprint image according to the received light, and then performs fingerprint detection .
  • the first reflection unit 822 may be the reflection unit 14 in FIG. 1 or the reflection layer 54 in FIG. 5.
  • the specific description of the first reflecting unit 822 can refer to the description of the reflecting unit 14 in FIG. 1 or the reflecting layer 54 in FIG. 5, which will not be repeated here.
  • the fingerprint light source 821 shown in FIG. 8 may be an internal light source of the module structure shown in FIG. 1 or 5 described above.
  • the FPCB 826 carrying the fingerprint light source 821 and the fingerprint sensor 824 in FIG. 8 may be the circuit board 12 in FIG. 1 or the circuit board 52 in FIG. 5 described above.
  • the back of the FPCB 826 shown in FIG. 8 may also be provided with a reinforcing plate (not shown in FIG. 8).
  • the FPCB 826 may be provided with an opening (not shown), and the first reflection unit 822 may be provided in the opening on the FPCB 826, or the reflective layer provided on the side of the reinforcing plate facing the FPCB 826 receives the incident through the opening Light.
  • the device that receives the reflection optics of the first reflection unit 822 in FIG. 8, that is, the lens unit 825 may be a specific example of the light receiver 13 in FIG. 1 or the light receiver 53 in FIG. 5.
  • the liquid crystal display fingerprint identification device may include a fingerprint module of the above-mentioned module structure shown in FIG. 1 or FIG. 5, which is achieved by arranging a reflective unit in the opening of the FPCB or on the back of the FPCB
  • the surface of the reinforcing plate is provided with a reflective layer as the first reflective unit to reflect light, realize the folding of the light path, reduce the thickness of the fingerprint module, and thereby reduce the thickness of the fingerprint identification device of the liquid crystal display screen.
  • the reinforcing plate provided on the back of the FPCB provides strength support for the FPCB and the devices carried on the FPCB, such as fingerprint light sources, fingerprint sensors, etc., which improves the strength and reliability of the internal components of the fingerprint module, and improves the fingerprint recognition of the LCD screen. The service life of the device.
  • the embodiment of the present application provides an under-screen fingerprint identification system.
  • the fingerprint recognition system under the screen can be achieved by arranging a reflective unit in the opening of the FPCB or setting a reflective layer on the surface of the reinforcing plate on the back of the FPCB, as the first reflective unit for light reflection, realizing the folding of the optical path and reducing The module thickness of the fingerprint recognition system under the screen.
  • the reinforcing plate on the back of the FPCB provides strength support for the FPCB and the devices carried on the FPCB, such as fingerprint light sources, fingerprint sensors, etc., which improves the strength and reliability of the internal components of the fingerprint identification system under the screen, and improves the fingerprints under the screen. Identify the service life of the system.
  • FIG. 9 is a schematic structural diagram of an electronic device provided by an embodiment of the application.
  • the electronic device 90 may include: a module structure 91.
  • the module structure 91 may be the module structure shown in FIG. 1 or FIG. 5.
  • FIG. 9 please refer to the above, and will not be repeated here.
  • the reflective unit can be provided in the opening of the circuit board in the module structure or the reinforcement on the back of the circuit board
  • the surface of the board is provided with a reflective layer to realize the folding of the light path, reduce the thickness of the module structure, thereby reduce the thickness of the electronic device, and improve the integration of the electronic device.
  • the reinforcing plate provided on the back of the circuit board in the module structure provides strength support for the circuit board and the devices carried on the circuit board, such as internal light sources or light receivers, and also improves the strength support for the reflecting unit. The strength and reliability of the components inside the module structure are improved, and the service life of electronic equipment is improved.
  • a person of ordinary skill in the art can understand that all or part of the steps in the above method embodiments can be implemented by a program instructing relevant hardware.
  • the foregoing program can be stored in a computer readable storage medium. When the program is executed, it is executed. Including the steps of the foregoing method embodiment; and the foregoing storage medium includes: ROM, RAM, magnetic disk, or optical disk and other media that can store program codes.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

L'invention concerne une structure de module et un dispositif électronique. La structure de module comprend une carte de renforcement, une carte de circuit imprimé et un récepteur de lumière. La carte de renforcement est située sur une face arrière de la carte de circuit imprimé ; une face, faisant face au récepteur de lumière, de la carte de circuit imprimé est pourvue d'une ouverture ; une face, faisant face à la carte de circuit imprimé, de la carte de renforcement dans l'ouverture est pourvue d'une unité de réflexion ; et une face de réflexion de l'unité de réflexion fait face au récepteur de lumière de façon à réfléchir la lumière incidente vers le récepteur de lumière. Au moyen de la présente application, l'épaisseur d'une structure de module peut être réduite.
PCT/CN2019/076854 2019-03-04 2019-03-04 Structure de module et dispositif électronique Ceased WO2020177051A1 (fr)

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PCT/CN2019/076854 WO2020177051A1 (fr) 2019-03-04 2019-03-04 Structure de module et dispositif électronique
CN201980000385.2A CN110062902A (zh) 2019-03-04 2019-03-04 模组结构及电子设备

Applications Claiming Priority (1)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106446752A (zh) * 2015-08-04 2017-02-22 上海箩箕技术有限公司 电子产品
CN108932460A (zh) * 2017-05-26 2018-12-04 上海箩箕技术有限公司 指纹成像模组和电子设备
US10209442B2 (en) * 2017-05-17 2019-02-19 Commisariat A L'energie Atomique Et Aux Energies Alternatives Photonic chip with reflecting structure for folded optical path

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203117502U (zh) * 2013-03-05 2013-08-07 南昌欧菲光电技术有限公司 镜头模组
US10157305B2 (en) * 2015-10-19 2018-12-18 Qualcomm Incorporated Cover-glass optical isolation for optical touch and fingerprint sensing
CN107251046B (zh) * 2015-10-23 2021-02-12 深圳市汇顶科技股份有限公司 光学指纹传感器及封装
CN106886767B (zh) * 2017-02-23 2019-07-05 京东方科技集团股份有限公司 一种光学指纹识别装置和显示面板
CN208298205U (zh) * 2018-06-14 2018-12-28 南昌欧菲生物识别技术有限公司 封装模组及电子装置
WO2020006706A1 (fr) * 2018-07-04 2020-01-09 深圳市汇顶科技股份有限公司 Module d'empreinte digitale et dispositif électronique
WO2020029021A1 (fr) * 2018-08-06 2020-02-13 深圳市汇顶科技股份有限公司 Dispositif d'identification d'empreintes digitales optique sous écran et dispositif électronique
CN108769495A (zh) * 2018-08-07 2018-11-06 宁波舜宇光电信息有限公司 一种摄像模组及组装方法和电子设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106446752A (zh) * 2015-08-04 2017-02-22 上海箩箕技术有限公司 电子产品
US10209442B2 (en) * 2017-05-17 2019-02-19 Commisariat A L'energie Atomique Et Aux Energies Alternatives Photonic chip with reflecting structure for folded optical path
CN108932460A (zh) * 2017-05-26 2018-12-04 上海箩箕技术有限公司 指纹成像模组和电子设备

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