WO2020186597A1 - Procédé d'encapsulation de cadre de panneau d'affichage et panneau d'affichage - Google Patents

Procédé d'encapsulation de cadre de panneau d'affichage et panneau d'affichage Download PDF

Info

Publication number
WO2020186597A1
WO2020186597A1 PCT/CN2019/084184 CN2019084184W WO2020186597A1 WO 2020186597 A1 WO2020186597 A1 WO 2020186597A1 CN 2019084184 W CN2019084184 W CN 2019084184W WO 2020186597 A1 WO2020186597 A1 WO 2020186597A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
display panel
layer
water blocking
siox
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2019/084184
Other languages
English (en)
Chinese (zh)
Inventor
杨中国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Publication of WO2020186597A1 publication Critical patent/WO2020186597A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Definitions

  • the present disclosure relates to the field of display technology, in particular to a display panel frame packaging method and a display panel.
  • OLED display panel packaging methods mainly include surface bonding packaging and frame glue, moisture absorption and filling glue packaging.
  • surface bonding packaging and frame glue there is a distance of 3-4mm from the edge of the surface bonding packaging glue to the light-emitting area.
  • the frame glue and moisture absorption The agent has a width of about 2mm, so it is difficult to form a narrow frame package of less than 2mm whether it is a surface mount package or a frame glue, moisture absorbent, and glue filling package.
  • glass glue encapsulation is usually used for packaging, but because large-sized display panels have higher requirements for life, there will be some pores and cracks after laser sintering, thereby providing water vapor intrusion channels , Make the packaging effect worse. Therefore, the glass glue package cannot fully meet the packaging requirements of large-size display panels.
  • the existing display panels have the problems of easy intrusion of water vapor, poor packaging effect, and insufficient packaging life. Therefore, it is necessary to provide a display panel frame packaging method and a display panel to improve this defect.
  • glass glue encapsulation is usually used for packaging, but because large-sized display panels have higher requirements for life, there will be some pores and cracks after laser sintering, thereby providing water vapor intrusion channels , Make the packaging effect worse. Therefore, the glass glue package cannot fully meet the packaging requirements of large-size display panels.
  • the present disclosure provides a display panel frame packaging method and a display panel, which are used to solve the problems that the existing display panel is easy to penetrate water vapor, the packaging effect is not good, and the packaging life is insufficient.
  • the present disclosure provides a method for packaging a display panel frame, including:
  • Step S10 providing a first substrate, and forming a plurality of barrier walls arranged at intervals on the first substrate;
  • Step S20 forming a display device layer on the first substrate, and the retaining wall is located on both sides of the display device layer;
  • Step S30 forming a water blocking layer on the display device layer and the retaining wall;
  • Step S40 providing a second substrate, forming an encapsulation part on the two ends of the second substrate close to the first substrate, coating the encapsulation part with glass glue and removing organic matter in the glass glue;
  • Step S50 coating filler in the interval area of the encapsulation part
  • Step S60 bonding the first substrate and the second substrate, curing the filler to form a filler layer, and sintering the glass glue;
  • Step S70 cutting the first substrate and the second substrate, coating a sealant on the edge connection part of the first substrate and the second substrate, and curing the sealant.
  • the method for forming the water blocking layer is to form the water blocking layer by low temperature plasma enhanced chemical vapor deposition on the display device layer and the retaining wall.
  • the method of curing the filler is ultraviolet curing or heating the filler.
  • the material of the water blocking layer is SiNx, SiON or SiOx.
  • the water blocking layer is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx.
  • the present disclosure provides a display panel, including:
  • a first substrate, a display device layer is provided on the first substrate, and a plurality of retaining walls are provided at intervals on both sides of the display device layer;
  • a second substrate, the second substrate is arranged on the first substrate, a glue filling layer is provided on one side of the second substrate close to the first substrate, and glass glue is arranged on both sides of the glue filling layer.
  • the first substrate further includes a water blocking layer, and the water blocking layer is disposed on the display device layer.
  • the edge connection portion of the first substrate and the second substrate is coated with a sealant to prevent water vapor from invading the display panel.
  • the material of the water blocking layer is SiNx, SiON or SiOx.
  • the water blocking layer is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx.
  • the present disclosure provides a display panel, including:
  • a first substrate, a display device layer is provided on the first substrate, and a plurality of retaining walls are provided at intervals on both sides of the display device layer;
  • a second substrate is disposed on the first substrate, the second substrate is provided with a filler layer on a side close to the first substrate, and glass glue is provided on both sides of the filler layer;
  • a water blocking layer is further provided on the side of the first substrate close to the second substrate, and the water blocking layer covers the display device layer and the plurality of retaining walls.
  • the edge connection portion of the first substrate and the second substrate is coated with a sealant to prevent water vapor from invading the display panel.
  • the material of the water blocking layer is SiNx, SiON or SiOx.
  • the water blocking layer is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx.
  • a plurality of retaining walls are arranged at intervals on both sides of the display device layer, and a water blocking layer is provided on the display device layer.
  • the water blocking layer can prevent the display device layer from being invaded by water vapor.
  • the second substrate is provided with a glue filling layer on one side close to the first substrate, and glass glue is arranged on both sides of the glue filling layer.
  • the retaining wall can prevent the glue filling layer from overflowing to the glass glue, thereby preventing the glue filling layer from being damaged by high temperature.
  • the denser glass glue can reduce the frame width of the display panel.
  • the edge connection part of the first substrate and the second substrate is coated with sealant. The sealant penetrates into the pores and cracks formed after the sintering of the glass glue, effectively preventing the intrusion of water vapor and improving the display
  • the packaging effect of the panel meets the packaging life requirements of the display panel.
  • FIG. 1 is a schematic flowchart of a method for packaging a display panel frame provided by an embodiment of the disclosure
  • FIG. 2 is a schematic structural diagram of a first substrate provided by an embodiment of the disclosure.
  • FIG. 3 is a schematic structural diagram of a first substrate provided by an embodiment of the disclosure.
  • FIG. 4 is a schematic diagram of the structure of a first substrate provided by an embodiment of the disclosure.
  • FIG. 5 is a schematic structural diagram of a second substrate provided by an embodiment of the disclosure.
  • FIG. 6 is a schematic structural diagram of a second substrate provided by an embodiment of the disclosure.
  • FIG. 7 is a schematic structural diagram of a display panel provided by an embodiment of the disclosure.
  • FIG. 8 is a schematic structural diagram of a display panel provided by an embodiment of the disclosure.
  • the present disclosure provides a method for packaging a display panel frame, which will be described in detail below with reference to FIGS. 1 to 8.
  • FIG. 1 is a schematic flowchart of a method for packaging a display panel frame provided by an embodiment of the disclosure, and the method includes:
  • Step S10 As shown in FIG. 2, a first substrate 201 is provided, and a plurality of barrier walls 202 arranged at intervals are formed on the first substrate;
  • Step S20 As shown in FIG. 3, a display device layer 301 is formed on the first substrate 201, and the retaining wall 202 is located on both sides of the display device layer 301;
  • Step S30 As shown in FIG. 4, a water blocking layer 401 is formed on the display device layer 301 and the retaining wall 202;
  • Step S40 As shown in FIG. 5, a second substrate 501 is provided, and encapsulation parts are formed at both ends of the second substrate 501 on the side close to the first substrate 201, and spaced areas are left between the encapsulation parts at both ends.
  • the encapsulation part is coated with glass glue 502 and the organic matter in the glass glue 502 is removed;
  • Step S50 as shown in FIG. 6, a filler 601 is coated in the interval area of the encapsulation part;
  • Step S60 As shown in FIG. 7, bonding the first substrate 201 and the second substrate 501, curing the filler 601 to form a filler layer 701, and sintering the glass glue 502;
  • Step S70 As shown in FIG. 8, the first substrate 201 and the second substrate 501 are cut, a sealant 801 is applied to the edge connection part of the first substrate 201 and the second substrate 501, and the Mentioned sealant 801.
  • the method for forming the water blocking layer 401 is to form the water blocking layer 401 by low-temperature plasma enhanced chemical vapor deposition on the display device layer 301 and the retaining wall 202, and the water blocking layer 401 covers On the display device layer 301, it is used to prevent water vapor from invading the display device layer 301, ensuring the packaging effect of the display panel and improving the packaging life of the display panel.
  • the method of curing the filler 601 is ultraviolet curing or heating the filler 601.
  • the material of the water blocking layer 401 is SiNx, SiON or SiOx. Further, the material of the water blocking layer may also be a mixture of two or more of SiNx, SiON and SiOx.
  • the water blocking layer 401 is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx, which effectively improves the ability of the water blocking layer 401 to block water and oxygen intrusion.
  • the present disclosure provides a display panel, which will be described in detail below with reference to FIG. 8.
  • FIG. 8 is a schematic structural diagram of a display panel provided by an embodiment of the disclosure, and the display panel includes:
  • a first substrate 201, a display device layer 301 is provided on the first substrate 201, and a plurality of retaining walls 202 are provided at intervals on both sides of the display device layer 301;
  • the second substrate 501, the second substrate 501 is disposed on the first substrate 201, the second substrate 501 is provided with a filling layer 701 on the side close to the first substrate 201, and the filling layer 701 is two Glass glue 502 is provided on the side.
  • the glass glue 502 is used for packaging between the first substrate 201 and the second substrate, which can effectively reduce the width of the display panel frame.
  • the first substrate 201 further includes a water blocking layer 401, the water blocking layer 401 is disposed on the display device layer 301, and the water blocking layer 401 is used to cover the display device layer 301, which can block water and oxygen. Invade the display device layer 301, and increase the package life of the display panel.
  • the edge connecting portion of the first substrate 201 and the second substrate 501 is coated with a sealant 801.
  • the glass glue 502 will produce pores and cracks after laser sintering, and the sealant 801 can penetrate into These pores and cracks can effectively prevent water vapor from entering the display panel.
  • the material of the water blocking layer 401 is SiNx, SiON or SiOx. Further, the material of the water blocking layer may also be a mixture of two or more of SiNx, SiON and SiOx.
  • the water blocking layer 401 is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx, which effectively improves the ability of the water blocking layer 401 to block water and oxygen intrusion.
  • the present disclosure provides a display panel, which will be described in detail below with reference to FIG. 8.
  • FIG. 8 is a schematic structural diagram of a display panel provided by an embodiment of the disclosure, and the display panel includes:
  • a first substrate 201, a display device layer 301 is provided on the first substrate 201, and a plurality of retaining walls 202 are provided at intervals on both sides of the display device layer 301;
  • the second substrate 501, the second substrate 501 is disposed on the first substrate 201, the second substrate 501 is provided with a filling layer 701 on the side close to the first substrate 201, and the filling layer 701 is two Glass glue 502 is provided on the side.
  • the first substrate 201 is further provided with a water blocking layer 401 on the side close to the second substrate 501, and the water blocking layer 401 covers the display device layer 301 and the plurality of retaining walls 202.
  • the layer 401 covers the display device layer 301, can prevent water and oxygen from invading the display device layer 301, and improve the packaging life of the display panel.
  • the glass glue 502 is used for packaging between the first substrate 201 and the second substrate, which can effectively reduce the width of the display panel frame.
  • the edge connecting portion of the first substrate 201 and the second substrate 501 is coated with a sealant 801.
  • the glass glue 502 will produce pores and cracks after laser sintering, and the sealant 801 can penetrate into These pores and cracks can effectively prevent water vapor from entering the display panel.
  • the material of the water blocking layer 401 is SiNx, SiON or SiOx. Further, the material of the water blocking layer may also be a mixture of two or more of SiNx, SiON and SiOx.
  • the water blocking layer 401 is a stacked structure of SiOx and SiON or a stacked structure of SiOx, SiON, and SiOx, which effectively improves the ability of the water blocking layer 401 to block water and oxygen intrusion.
  • a plurality of retaining walls 202 are arranged on both sides of the display device layer 301, and a water blocking layer 401 is provided on the display device layer 301.
  • the water blocking layer 401 can prevent the display device layer 301 from being invaded by water vapor.
  • the second substrate 501 is provided with a filler layer 701 on one side close to the first substrate 201, and glass glue 502 is provided on both sides of the filler layer 701.
  • the retaining wall 202 can prevent the filler in the filler layer 701 from overflowing to the glass.
  • Adhesive 502 prevents the filling layer 701 from being damaged by high temperature.
  • the denser glass adhesive 502 can reduce the frame width of the display panel.
  • the edge connection part of the first substrate 201 and the second substrate 501 is coated with sealant 801, and the sealant 801 penetrates into the glass.
  • the pores and cracks formed after the sintering of the glue 502 effectively prevent water vapor from entering the inside of the display panel, improve the packaging effect of the display panel, and meet the packaging life requirements of the display panel.

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un panneau d'affichage et un procédé d'encapsulation de cadre de panneau d'affichage. Le panneau d'affichage comprend un premier substrat (201) et un second substrat (501). Le second substrat (501) est disposé sur le premier substrat (201) ; une couche adhésive de remplissage (701) est disposée sur un côté du second substrat (501) près du premier substrat (201) ; un adhésif de verre (502) est disposé sur deux côtés de la couche adhésive de remplissage (701) ; et un adhésif d'étanchéité (801) est étalé sur une partie de connexion de bords du premier substrat (201) et du second substrat (501).
PCT/CN2019/084184 2019-03-19 2019-04-25 Procédé d'encapsulation de cadre de panneau d'affichage et panneau d'affichage Ceased WO2020186597A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910208386.8A CN109841756B (zh) 2019-03-19 2019-03-19 显示面板边框封装方法及显示面板
CN201910208386.8 2019-03-19

Publications (1)

Publication Number Publication Date
WO2020186597A1 true WO2020186597A1 (fr) 2020-09-24

Family

ID=66885916

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/084184 Ceased WO2020186597A1 (fr) 2019-03-19 2019-04-25 Procédé d'encapsulation de cadre de panneau d'affichage et panneau d'affichage

Country Status (2)

Country Link
CN (1) CN109841756B (fr)
WO (1) WO2020186597A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111653213A (zh) * 2020-06-10 2020-09-11 武汉华星光电半导体显示技术有限公司 显示模组及其制作方法
CN114171551B (zh) 2020-09-10 2025-06-10 京东方科技集团股份有限公司 显示基板及显示装置
CN112635527B (zh) * 2020-12-18 2025-04-08 上海和辉光电股份有限公司 有机发光显示面板及其制造方法和有机发光显示装置
US12274147B2 (en) 2020-12-18 2025-04-08 Everdisplay Optronics (Shanghai) Co., Ltd Organic light emitting display panel, method for manufacturing the same and organic light emitting display apparatus
CN116113262A (zh) * 2023-02-14 2023-05-12 昆山国显光电有限公司 显示屏及其封装方法、显示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100670367B1 (ko) * 2005-12-07 2007-01-16 삼성에스디아이 주식회사 유기 발광 디스플레이 장치
CN104576707A (zh) * 2015-01-28 2015-04-29 京东方科技集团股份有限公司 Oled面板及其制备方法和显示装置
CN105810710A (zh) * 2014-12-31 2016-07-27 昆山国显光电有限公司 一种oled器件及其制备方法
CN107123744A (zh) * 2017-04-27 2017-09-01 京东方科技集团股份有限公司 一种封装结构、显示装置及照明装置
CN108598277A (zh) * 2018-04-20 2018-09-28 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101056260B1 (ko) * 2008-10-29 2011-08-11 삼성모바일디스플레이주식회사 발광 표시 장치 및 그의 제조 방법
CN104617234A (zh) * 2015-02-13 2015-05-13 京东方科技集团股份有限公司 隔垫物、有机电致发光显示面板、制作方法及显示装置
CN106548987A (zh) * 2016-12-29 2017-03-29 长春海谱润斯科技有限公司 显示面板及显示面板封装胶涂布方法
JP2018113104A (ja) * 2017-01-06 2018-07-19 株式会社ジャパンディスプレイ 表示装置及び表示装置の製造方法
CN108461653A (zh) * 2018-04-04 2018-08-28 武汉华星光电半导体显示技术有限公司 柔性oled屏幕、柔性面板薄膜封装结构和封装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100670367B1 (ko) * 2005-12-07 2007-01-16 삼성에스디아이 주식회사 유기 발광 디스플레이 장치
CN105810710A (zh) * 2014-12-31 2016-07-27 昆山国显光电有限公司 一种oled器件及其制备方法
CN104576707A (zh) * 2015-01-28 2015-04-29 京东方科技集团股份有限公司 Oled面板及其制备方法和显示装置
CN107123744A (zh) * 2017-04-27 2017-09-01 京东方科技集团股份有限公司 一种封装结构、显示装置及照明装置
CN108598277A (zh) * 2018-04-20 2018-09-28 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置

Also Published As

Publication number Publication date
CN109841756A (zh) 2019-06-04
CN109841756B (zh) 2020-09-01

Similar Documents

Publication Publication Date Title
CN109841756B (zh) 显示面板边框封装方法及显示面板
CN103474561B (zh) 一种oled器件的封装结构
CN101083277B (zh) 显示装置及其制造方法
WO2016086538A1 (fr) Structure d'encapsulation oled et procédé d'encapsulation oled
CN109004104A (zh) 一种oled显示面板及其制备方法
CN105226079B (zh) 一种显示装置
CN103996696A (zh) 一种oled显示面板及其制备方法、显示装置
CN109560112B (zh) 显示面板、显示装置及显示面板制备方法
WO2020211288A1 (fr) Panneau d'affichage et dispositif d'affichage
US10613402B2 (en) Display panel with array substrate having thickness varying in packaging area, method of manufacturing display panel and display device
CN104538566A (zh) Oled的封装方法及oled封装结构
US20210343976A1 (en) Display device and package method thereof
CN108520884B (zh) 阵列基板及其制备方法、显示装置
WO2020029390A1 (fr) Panneau d'affichage et son procédé de fabrication
CN203826395U (zh) 一种oled显示面板及显示装置
CN105206620B (zh) 一种薄膜封装结构及其制备方法、显示装置
CN108538862A (zh) 显示母板、显示屏及显示终端
KR102066079B1 (ko) 유기 발광 다이오드 표시 장치 및 이의 제조 방법
WO2017161628A1 (fr) Procédé de mise sous boîtier pour substrat oled et structure de mise sous boîtier oled
US20150171150A1 (en) Manufacturing method of organic light emitting diode display device
CN203481275U (zh) 一种oled器件的封装结构
US20190140215A1 (en) Oled thin film packaging structure and method
CN208093561U (zh) 一种oled面板
WO2016029547A1 (fr) Dispositif électroluminescent organique et son procédé de fabrication, et appareil d'affichage
WO2019024591A1 (fr) Plaque d'impression d'écran, procédé d'encapsulation, panneau d'affichage et dispositif d'affichage

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19919859

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19919859

Country of ref document: EP

Kind code of ref document: A1