WO2020260480A1 - Procédé d'étalonnage/de vérification de débitmètres/contrôleurs de débit massique d'un système de mélange de gaz et arrangement pour mettre en œuvre le procédé - Google Patents
Procédé d'étalonnage/de vérification de débitmètres/contrôleurs de débit massique d'un système de mélange de gaz et arrangement pour mettre en œuvre le procédé Download PDFInfo
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- WO2020260480A1 WO2020260480A1 PCT/EP2020/067876 EP2020067876W WO2020260480A1 WO 2020260480 A1 WO2020260480 A1 WO 2020260480A1 EP 2020067876 W EP2020067876 W EP 2020067876W WO 2020260480 A1 WO2020260480 A1 WO 2020260480A1
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- Prior art keywords
- mass flow
- calibration
- gas
- measuring
- calibrated
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
- G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
Definitions
- the invention relates to a method for calibrating in a gas mixing system of a substrate treatment device permanently arranged th mass flow measurement / control devices in which a calibration device formed as a gas flow meter is brought into a gas flow connection to the mass flow measurement / control device to be calibrated that the gas flow flowing through the mass flow measuring / control device to be calibrated flows through the calibration device.
- the invention also relates to a device for performing the method.
- the device for carrying out the method is in particular a gas mixing system of a substrate treatment device, it being possible for the substrate treatment device to have a CVD reactor and in particular an MOCVD reactor.
- the invention also relates to a plurality of derarüger before directions of a manufacturing facility.
- a device for treating substrates has a reactor, in particular a CVD reactor or an MOCVD reactor, in which a substrate is thermally treated, in particular in such a way that a Layer is deposited.
- a gas mixing system provides reaküve for this purpose Gases that are fed into a process chamber of the reactor together with a carrier gas. The gas flows are measured or controlled with mass flow measuring devices or mass flow control devices. Such mass flow measuring / control devices have to be calibrated or verified or at least checked at time intervals. For this purpose, methods are known from the prior art, in particular US Pat. No. 9,169,975 B2, US Pat. No.
- 9,644,796 B2 and US 2006/0283390 A1 in which a gas flow is passed through a mass flow measuring / control device to be calibrated and this gas flow is controlled by a Gas flow meter trained calibration device is measured.
- the mass flow measuring / control device to be calibrated is set in such a way that the value that the mass flow measuring / control device sends to control electronics corresponds to the value that the calibration device measures.
- the invention is based on the object of further developing the generic method and the generic device in an advantageous manner. Provision is made in particular to take measures with which a fully automatic calibration of several and in particular all mass flow measuring / control devices of a gas mixing system is possible.
- the invention proposes that the calibration device be arranged upstream of the mass flow measuring / control device to be calibrated or checked. At least one mass flow measuring / control device of a gas mixing system can be calibrated with the calibration device, whereby calibration is understood to mean not only correcting the setting, but also simply checking or verifying the setting of the mass flow measuring / control device.
- the calibration device is a gas mass flow measuring device permanently arranged in the gas mixing system.
- the calibration device be arranged between a feed line of a calibration gas, which can be an inert gas, and the mass flow measuring / control devices to be calibrated.
- the calibration device is permanently arranged in the piping of a gas mixing system. It is screwed or otherwise flanged to a supply line that is fed by a calibration gas source, for example an inert gas source. It is screwed or flanged to a gas distribution line that guides the calibration gas to other mass flow measuring / control devices.
- each can Inert gas supply line have at least one calibration device, so that the mass flow measuring / control devices arranged in the following can optionally be calibrated with one of the several inert gases.
- a calibration device for example a source for nitrogen or hydrogen.
- several calibration devices with different value ranges are arranged in parallel or in series with one another in the gas supply line.
- Each of the calibration devices can be connected to the calibration gas source (inert gas source).
- a valve can be assigned to the flow line with which the calibration device can be connected to the calibration gas source, which valve can optionally be opened or closed in order to direct the calibration gas flow through the calibration device.
- a bypass can be provided which can be closed with a valve in order to divert the calibration gas flow (inert gas flow) around the at least one calibration device.
- Calibration devices with different measuring ranges can also be connected in series, each of the calibration devices being bypassed. However, the mass flow can also flow simultaneously through the bypass and the calibration device.
- the one or more calibration devices form a calibration device arrangement.
- An electronic pressure regulator can also be part of the calibration device arrangement.
- the electronic pressure regulator is a precision pressure regulator with which the pressure within the pipe system of the gas mixing system can be kept at a constant value during calibration.
- the precision pressure regulator can be arranged upstream of a calibration device. In the case of several calibration devices, it is preferably arranged upstream of a calibration device with a small measuring range. Since the calibration devices are a permanent part of the gas mixing system, the mass flow measuring / control devices of the gas mixing system can be operated at regular intervals without the risk of contamination, especially in idle phases when no sub- strat treatment steps are carried out, calibrate. This is done preferably controlled by a control device. Since several calibration devices with different measuring ranges can optionally be switched to the inert gas flow, a large range of values can be recorded.
- the calibration gas flow provided by the calibration device arrangement is passed into a common gas supply line.
- Several gas lines can branch off from this gas feed line, each leading to a mass flow measuring / control device to be calibrated. It is not necessary for mass flow measuring / control devices arranged parallel to one another to be separated from one another during the calibration, for example in that the gas flow is passed through a circuit of appropriate valves through only one mass flow measuring / control device to be calibrated.
- one variant of the invention provides that the calibration gas flow provided by the calibration device arrangement is divided between several mass flow measurement / control devices connected in parallel.
- the mass flow measuring / control devices are preferably mass flow controllers that have a control loop that regulates a mass flow according to a predetermined setpoint.
- the actual value of the mass flow regulated by the mass flow controller can be determined and compared with the setpoint value.
- the multiple mass flow measurement / control devices can preferably have at least similar measurement ranges. However, it is also provided that the mass flow measurement / control devices connected in parallel have measurement ranges that are different from one another, for example 2 slm, 5 slm, 10 slm, 20 slm, 50 slm or 100 slm.
- all other mass flow measuring / control devices are operated with a minimum target value of a mass flow, for example 2% of the maximum flow. During the calibration, these values are not changed, but kept constant.
- the mass flow measuring / control device to be calibrated is loaded with various setpoints drove. For example, the setpoint can be changed gradually. It can be increased gradually starting from a minimum setpoint.
- the respective increase in the mass flow that can be attributed to the increase in the setpoint value can then be read on the calibration device.
- the slope of a calibration function of the mass flow measuring / control device to be calibrated can be recorded.
- the zero value of the calibration function can take place by switching off the calibration gas flow and / or by evacuating the gas mixing system.
- the precision pressure regulator By means of the precision pressure regulator, the total pressure within the gas mixing system downstream of the pressure regulator is kept constant during the calibration phase. This means that no blind flows are formed within the pipe system during calibration that could influence the measurement.
- a second of these mass flow measuring / control devices can be calibrated in the same way by gradually changing the setpoint value of the mass flow measuring / control device to be calibrated and the setpoints of the other mass flow measuring / control devices are kept constant.
- all mass flow measuring / control devices can thus be automatically calibrated at regular intervals by a control device of the device.
- the gas flow which can optionally be passed through a calibration device, is routed into a common gas feed line from which several gas lines branch off, each leading to a mass flow measuring / control device to be calibrated.
- Each of these supply lines can be closed with a valve, so that optionally only one mass flow measuring / control device can be connected to the calibration or inert gas source from a large number of mass flow measuring / control devices.
- a valve arrangement it can be ensured that the gas flow flowing through the mass flow measuring / control device to be calibrated is the same as that flowing through the calibration device.
- several mass flow measuring / control devices can each of the mass flow measurement / control devices to be calibrated can be brought into a flow connection individually with one of the multiple calibration devices in particular, in which the same mass flow flows through both devices.
- the calibration can also be carried out fully automatically here, in that a control system compares the mass flows of the calibration or inert gas measured by the mass flow measuring / control devices with the mass flow measured by the calibration device at time intervals. If several calibration devices with different value ranges are provided, then mass flow measuring / control devices can be calibrated which have different value ranges. For calibration, the mass flow measuring / control device to be calibrated can be brought into a 1: 1 flow connection with the calibration device which belongs to the same or a similar value range. However, the above-mentioned variant is preferred, in which during calibration the gas flow flowing through the calibration device is divided into several partial flows which flow through mass flow measuring / control devices arranged parallel to one another.
- the method also calibrates those mass flow measuring / control devices through which a reactive gas, for example arsine, ammonia or phosphine, flows during the substrate treatment process.
- a reactive gas for example arsine, ammonia or phosphine
- the mass flow measuring / control device to be calibrated is arranged upstream of a bubbier in which there is a liquid or solid starting material, for example an organometallic compound that is converted into a vapor by the application of temperature, which is transported into a reactor with a carrier gas, which can be the calibration gas (inert gas).
- the mass flow measuring / control device is connected downstream with a bypass line.
- the device can have a flange or another port to which an external reference system can be connected.
- the reference system has a reference measuring device with which the calibration device is over-calibrated at time intervals.
- the calibrating device which is preferably a mass flow measuring device, measures the total mass flow of a carrier gas fed into the gas mixing system.
- This mass flow is, however, divided into at least two mass flow measuring / control devices downstream of the calibration device, these being preferably formed by mass flow controllers.
- mass flow controllers are to a certain extent connected in parallel so that the total of the mass flow of the carrier gas flowing through the mass flow controller is measured by the calibration device.
- mass flow controllers that flow through in parallel with the carrier gas, only the flow value of one mass flow controller is changed.
- the invention thus relates to a method for testing a mass flow measuring / control device with regard to an error, the mass flow measuring / control device to be tested being connected in parallel to further mass flow measuring / control devices and the sum of the connected in parallel Mass flow control devices flowing through mass flow is measured by the calibration device. It is particularly provided that of the mass flow measuring / control devices connected in parallel, the setpoint value of only one mass flow measuring / control device is changed and the setpoints of the remaining mass flow measuring / control device is kept constant.
- Fig. 1 is a circuit diagram of a first embodiment of a gas
- Fig. 3 shows a section of a gas mixing system of a third Auspar approximately example
- Fig. 4 is a circuit diagram of a second embodiment of a gas mixing system
- 5 schematically shows the course of the measured values Q versus time when the gas mass flow is increased step by step.
- Figures 1 and 4 each show schematically a gas mixing system for
- the process chamber, not shown in detail, of the reactor 1 has a susceptor for receiving at least one substrate which is to be coated with a layer.
- a gas inlet element is also provided in order to introduce the inert gas and the reactive gases into the process chamber.
- gas feed lines 24, 34, 44, 54, 64 open into the reactor 1.
- the reactor 1 has a gas outlet 16 with which the gas emerging from the reactor 1 can be brought to a gas aftertreatment device.
- the gas aftertreatment device can have a decomposition device with which the reactive gases are decomposed.
- mass flow controllers and mass flow measuring devices are mentioned, which are referred to in the disclosure of the invention with the superordinate term mass flow measuring / control devices.
- each of the gas supply lines 24, 34, 44, 54, 64 at least one mass flow controller 21, 31, 41, 51, 61 is arranged with which the mass flows through the supply lines 24, 34, 44, 54, 64 can be set in the reactor 1.
- the mass flow controllers 21, 31 are used to supply hydrogen or nitrogen.
- the mass flow controllers 41, 51 can optionally be connected to an inert gas source 20, 30 or sources 40, 50 for reactive gases.
- the respective connecting lines of the mass flow controllers 21, 31, 41, 51, 61 can be closed by means of valves 22, 32, 42, 43, 52, 53, 62 in the exemplary embodiment shown in FIG. In the exemplary embodiment shown in FIG. 1, the mass flow controllers 21, 31, and 61 are directly connected to a gas supply line 10.
- the mass flow controllers 41, 51 can be connected to the gas supply line 10 by opening valves 42, 52.
- a mass flow controller 61 with a supply line that can be closed with a valve 62, as are the other mass flow controllers 21, 31, 41, 51 with the common supply line 10 connected, can be fed into the hydrogen or nitrogen.
- the mass flow controller 61 is directly connected to the common supply line 10 connected. Downstream of the mass flow controller 61 is a bubbier 65 in which there is an organometallic compound.
- the supply line to the Bubbier 65 can be closed with a valve 66.
- the mass flow controller 61 can be brought into a flow connection with a bypass line 68 which opens into the gas outlet 16 for calibration.
- FIG. 1 shows an inert gas source 20, which can be an N2 or H2 source.
- the inert gas is fed into the common feed line 10 via a valve arrangement 19a, 19b, 19c or via a calibration device arrangement 2a, 2b, 2c.
- FIG. 1 shows only one calibration device arrangement. However, it is also possible for a plurality of calibration device arrangements to be arranged in parallel next to one another, each calibration device arrangement being fed by a different inert gas.
- the calibration device arrangement has several mass flow measuring / control devices 2a, 2a, 2c connected in series, with a mass flow measuring / control device 2a with a measuring range of 100 slm initially being provided downstream of the inert gas source 20.
- a second mass flow measuring / control device 2b Downstream of this first mass flow measuring / control device 2a is a second mass flow measuring / control device 2b, which has a smaller measuring range, namely 10 slm.
- a third mass flow measuring / control device 2c can have a measuring range of 2 slm.
- a high-precision pressure regulator 69 Upstream of the mass flow measuring / control device 2b there is a high-precision pressure regulator 69 with which the total pressure within the gas mixing system is kept constant. It is provided that the mass flow measuring devices (2a), 2b, 2c are connected in series in the flow direction in such a way that their measuring ranges decrease in the flow direction.
- the mass flow measuring / control devices 21, 31, 41, 51, 61 are preferably mass flow controllers which supply an actual value of a mass flow of a
- each Inertgasquel le 20, 30 is connected to the gas mixing system via an inert gas feed line.
- the two inert gases can optionally be used as calibration gases.
- the mass flow measuring / control devices 21, 31, 41, 51, 61 can be both mass flow measuring devices and mass flow controllers. However, they are preferably designed as mass flow controllers.
- valves 19a, 19b, 19c are open so that the inert gas stream coming from a hydrogen source 20 or a nitrogen source 30 can optionally flow into the common feed line 10.
- the inert gas flows directly into the mass flow controllers 21, 61.
- the mass flow controllers 41, 51 can be brought into the inert gas flow by opening the valves 42, 52.
- the mass flow of the Inert gas can be set via the mass flow controller 21, 31, 41, 51, 61.
- AsFh can flow from the source 40 via the supply line 45 into the process chamber of the reactor 1 instead of the inert gas.
- NH3 can alternatively or cumulatively flow from the source 50 via the feed line 55 into the process chamber of the reactor 1.
- At least one of the valves 19a, 19b, 19c is closed, so that the inert gas flow from the inert gas source 20 by at least one of the mass flow measuring / control devices 2a,
- the entire gas flow supplied by only one of the inert gas sources 20, 30 flows through the mass flow measuring / control device 21, 31, 41, 51, 61, whose associated valve is open.
- the bypass 3, 3 ' is closed by closing the valve 4, 4'. Only one of the valves 5, 5 'is open, so that a mass flow flows into the feed line 10 through only one of the calibration devices 2, 2', 2a, 2b, 2c.
- the mass flow flowing through the calibration device 2a, 2b, 2c is generally not identical to the mass flow flowing through the mass flow measuring / control device to be calibrated.
- the mass flow flowing through the calibration device 2 or ⁇ is identical to that which flows through the mass flow measuring / control device to be calibrated.
- valve 66 When calibrating the mass flow measuring / control device 61, the valve 66 is closed. The inert gas flow is passed through the opened valve 67 into the bypass line 68.
- the calibration can be carried out either with hydrogen or with nitrogen.
- the associated valves 5, 5 ' are optionally opened or closed.
- the calibration of the mass flow controllers 21, 31, 41, 51, 61 can be carried out at regular time intervals, for example in idle phases.
- the calibration can also be carried out in non-productive operating states, for example when the device is being prepared to carry out a coating process.
- the reference number 8 denotes a flange 8 which is connected via a closable valve 7 with a gas line 11 to the gas outlet of the calibration devices 2, 2 ', 2a, 2b, 2c.
- a flange 9 of a reference system 12, which has a reference measuring device 6, can be connected to this flange 8.
- a flange 14 arranged downstream of the reference measuring device 6 can be connected to a gas discharge line which opens into the gas outlet 16 and which can be closed with a valve 15.
- the calibration devices 2, 2 ', 2a, 2b, 2c can be over-calibrated. For this purpose, all of the mass flow controllers 21, 31, 41, 51, 61 are operated with a minimum setpoint value.
- the reference measuring device 6 functions as a mass flow controller.
- the setpoint value of this mass flow controller 6 is changed step by step, so that the gradient of a calibration function for the mass flow measuring / control devices 2a, 2b, 2c can be determined in a manner analogous to the procedure described above.
- a leak test device can be connected to flange 14 '.
- the calibration gases flowing through the reference measuring device are conducted past the reactor 1, so that contamination of the reactor with O2, H2O or the like is minimized.
- the gas mixing system can also be evacuated via a leak test port.
- FIG. 2 shows a second exemplary embodiment in which a plurality of calibration devices 2 are arranged parallel to one another and can each be connected to an inert gas source 20 by opening a valve 19.
- a bypass 3 is also provided here, which is closed for calibrating the mass flow measuring / control devices arranged downstream of the calibration devices 2 and which is open during production operation, in which production operation the valves 19 are closed.
- the mass flow measuring / control devices arranged in parallel next to each other work in different value ranges. They have different measuring ranges, for example a maximum of 2 slm,
- FIG. 3 shows an arrangement similar to FIG. 2.
- only one of the two inert gas sources 20, 30 has a calibration arrangement consisting of at least one calibration device 2.
- FIG. 5 shows schematically the time course of the measured values Q versus time when a gas mass flow is gradually increased by the mass flow controller 21, while the gas mass flows are kept constant by the other mass flow controllers 31, 41, 51, 61.
- the sum of these gas mass flows flows through one of the calibration devices 2.
- the step height of the measurement curve of the calibration device 2 corresponds to the step height of the setpoint curve of the mass flow controller 21.
- a method which is characterized in that the plurality of mass flow measurement / control devices 21, 31, 41, 51, 61 are connected in parallel and / or have measurement / control areas that are different from one another.
- a method which is characterized in that by a step-by-step change in the setpoint value of the mass flow measuring / control device 21, 31, 41, 51, 61 to be calibrated / checked and simultaneously determining the actual value of the the mass flow measuring / control device 21, 31, 41, 51, 61 towards the gas flow flowing through, a gradient of a calibration function is determined and / or the zero point of the calibration function is determined by evacuating the gas mixing system or blocking the calibration gas.
- a device which is characterized in that the calibration device 2, 2 ', 2a, 2b, 2c is arranged upstream of the mass flow measuring / control device 21, 31, 41, 51, 61 with respect to the calibration gas flow .
- a device which is characterized by an electronic pressure regulator 26 which is arranged in the flow direction immediately before or after the at least one calibration device 2, 2 ', 2a, 2b, 2c and which can be controlled by the control device 25 in such a way that the pressure is constant in the pipelines of the gas mixing system during calibration / checking and / or that the electronic pressure regulator 26 is arranged upstream at least one of one or more calibration devices 2, 2 ', 2a, 2b, 2c.
- a device which is characterized in that at least two calibration devices 2, 2 ', 2a, 2b, 2c are provided, the at least two calibration devices 2, 2', 2a, 2b, 2c parallel to one another and / or parallel are connected in series to form a bypass and / or in series and / or have mutually different measurement control areas.
- a device which is characterized by a reactor for the thermal treatment of a substrate.
- a device which is characterized by a mobile reference measuring device 6 which can be connected to a flange 8 of the gas mixing system in this way or which can be exchanged for a mass flow measuring / control device 21, 31, 41, 51, 61 that the calibration gas flow flowing through the calibration device 2, 2 ', 2a, 2b, 2c at least partially flows through the reference measuring device 6, the mass flow of the mass flow flowing through the reference measuring device 6 in particular step by step can be changed in that the reference measuring device 6 is a mass flow controller in which the mass flow flowing through the reference measuring device 6 can be predetermined by a setpoint value.
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Abstract
L'invention concerne un procédé d'étalonnage/de vérification de débitmètres/contrôleurs de débit massique (21, 31, 41, 51, 61) disposés de manière permanente dans un système de mélange de gaz d'un dispositif de traitement de substrat, avec lequel un appareil d'étalonnage (2, 2', 2a, 2b, 2c) réalisé sous la forme d'un débitmètre de gaz est mis en liaison d'écoulement de gaz avec le débitmètre/contrôleur de débit massique (21, 31, 41, 51, 61) à étalonner/vérifier de telle sorte qu'au moins un débit partiel du flux de gaz qui s'écoule à travers l'appareil d'étalonnage (2, 2', 2a, 2b, 2c) s'écoule à travers le débitmètre/contrôleur de débit massique (21, 31, 41, 51, 61) à étalonner/vérifier. En vue d'un perfectionnement avantageux en termes d'utilisation, notamment en vue de permettre un étalonnage/une vérification entièrement automatique de plusieurs et en particulier de tous les débitmètres/contrôleurs de débit massique d'un système de mélange de gaz, l'invention est caractérisée en ce que l'appareil d'étalonnage (2, 2', 2a, 2b, 2c) est disposé en permanence en amont du débitmètre/contrôleur de débit massique (21, 31, 41, 51, 61) à étalonner, en référence au flux de gaz. L'invention concerne en outre un arrangement pour la mise en œuvre du procédé ainsi qu'un arrangement pour le traitement thermique d'un substrat avec un système de mélange de gaz.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102019117543.7A DE102019117543A1 (de) | 2019-06-28 | 2019-06-28 | Verfahren zum Kalibrieren/Verifizieren von Massenfluss-Mess/Steuer-Geräten eines Gasmischsystems und Vorrichtung zur Durchführung des Verfahrens |
| DE102019117543.7 | 2019-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2020260480A1 true WO2020260480A1 (fr) | 2020-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2020/067876 Ceased WO2020260480A1 (fr) | 2019-06-28 | 2020-06-25 | Procédé d'étalonnage/de vérification de débitmètres/contrôleurs de débit massique d'un système de mélange de gaz et arrangement pour mettre en œuvre le procédé |
Country Status (3)
| Country | Link |
|---|---|
| DE (1) | DE102019117543A1 (fr) |
| TW (1) | TWI869417B (fr) |
| WO (1) | WO2020260480A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758544A (zh) * | 2021-09-07 | 2021-12-07 | 广州燃气用具检测服务有限公司 | 一种钟罩式气体流量检定装置及方法 |
| WO2024148961A1 (fr) * | 2023-01-10 | 2024-07-18 | 江苏微导纳米科技股份有限公司 | Appareil et procédé d'étalonnage d'écoulement de gaz |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023117058A1 (de) | 2023-06-28 | 2025-01-02 | Aixtron Se | Prozessgaszuleitungssystem für eine Verdampfungseinrichtung eines CVD-Reaktorsystems |
| DE102024119587A1 (de) * | 2024-07-10 | 2026-01-15 | Westnetz Gmbh | Erweiterung Hochdruckprüfstand auf H2-Readiness |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000153A1 (fr) | 1984-06-15 | 1986-01-03 | Oy Nokia Ab | Systeme d'etalonnage pour etalonner des controleurs de debit-masse |
| EP0623381A1 (fr) * | 1993-05-07 | 1994-11-09 | Teisan Kabushiki Kaisha | Système d'alimentation de gas mélangés |
| US6332348B1 (en) * | 2000-01-05 | 2001-12-25 | Advanced Micro Devices, Inc. | Gas flow calibration of mass flow controllers |
| DE69428485T2 (de) | 1993-07-20 | 2002-06-20 | Raytheon Co., Lexington | Gas-Zuführungssystem zur Bildung von Ablagerungen ausgehend von flüssigen Ausgangsprodukten |
| US20060283390A1 (en) | 2002-11-15 | 2006-12-21 | Renesas Technology Corporation | Semiconductor manufacturing apparatus enabling inspection of mass flow controller maintaining connection thereto |
| US20110265895A1 (en) * | 2010-04-30 | 2011-11-03 | Tokyo Electron Limited | Gas supply apparatus for semiconductor manufacturing apparatus |
| US20130092269A1 (en) | 2011-10-12 | 2013-04-18 | Ckd Corporation | Gas flow monitoring system |
| US9169975B2 (en) | 2012-08-28 | 2015-10-27 | Asm Ip Holding B.V. | Systems and methods for mass flow controller verification |
| US9644796B2 (en) | 2011-09-29 | 2017-05-09 | Applied Materials, Inc. | Methods for in-situ calibration of a flow controller |
| DE102015120090A1 (de) | 2015-11-19 | 2017-05-24 | Endress + Hauser Flowtec Ag | Verfahren zur Überprüfung einer Messstelle, an welcher ein Durchfluss eines Fluids ermittelt wird |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6193679B2 (ja) * | 2013-08-30 | 2017-09-06 | 株式会社フジキン | ガス分流供給装置及びガス分流供給方法 |
-
2019
- 2019-06-28 DE DE102019117543.7A patent/DE102019117543A1/de active Pending
-
2020
- 2020-06-24 TW TW109121485A patent/TWI869417B/zh active
- 2020-06-25 WO PCT/EP2020/067876 patent/WO2020260480A1/fr not_active Ceased
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1986000153A1 (fr) | 1984-06-15 | 1986-01-03 | Oy Nokia Ab | Systeme d'etalonnage pour etalonner des controleurs de debit-masse |
| EP0623381A1 (fr) * | 1993-05-07 | 1994-11-09 | Teisan Kabushiki Kaisha | Système d'alimentation de gas mélangés |
| DE69428485T2 (de) | 1993-07-20 | 2002-06-20 | Raytheon Co., Lexington | Gas-Zuführungssystem zur Bildung von Ablagerungen ausgehend von flüssigen Ausgangsprodukten |
| US6332348B1 (en) * | 2000-01-05 | 2001-12-25 | Advanced Micro Devices, Inc. | Gas flow calibration of mass flow controllers |
| US20060283390A1 (en) | 2002-11-15 | 2006-12-21 | Renesas Technology Corporation | Semiconductor manufacturing apparatus enabling inspection of mass flow controller maintaining connection thereto |
| US20110265895A1 (en) * | 2010-04-30 | 2011-11-03 | Tokyo Electron Limited | Gas supply apparatus for semiconductor manufacturing apparatus |
| US9644796B2 (en) | 2011-09-29 | 2017-05-09 | Applied Materials, Inc. | Methods for in-situ calibration of a flow controller |
| US20130092269A1 (en) | 2011-10-12 | 2013-04-18 | Ckd Corporation | Gas flow monitoring system |
| US9169975B2 (en) | 2012-08-28 | 2015-10-27 | Asm Ip Holding B.V. | Systems and methods for mass flow controller verification |
| DE102015120090A1 (de) | 2015-11-19 | 2017-05-24 | Endress + Hauser Flowtec Ag | Verfahren zur Überprüfung einer Messstelle, an welcher ein Durchfluss eines Fluids ermittelt wird |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758544A (zh) * | 2021-09-07 | 2021-12-07 | 广州燃气用具检测服务有限公司 | 一种钟罩式气体流量检定装置及方法 |
| WO2024148961A1 (fr) * | 2023-01-10 | 2024-07-18 | 江苏微导纳米科技股份有限公司 | Appareil et procédé d'étalonnage d'écoulement de gaz |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI869417B (zh) | 2025-01-11 |
| TW202111290A (zh) | 2021-03-16 |
| DE102019117543A1 (de) | 2020-12-31 |
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