WO2021036859A1 - 一种磁感应料位计 - Google Patents

一种磁感应料位计 Download PDF

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Publication number
WO2021036859A1
WO2021036859A1 PCT/CN2020/109715 CN2020109715W WO2021036859A1 WO 2021036859 A1 WO2021036859 A1 WO 2021036859A1 CN 2020109715 W CN2020109715 W CN 2020109715W WO 2021036859 A1 WO2021036859 A1 WO 2021036859A1
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WO
WIPO (PCT)
Prior art keywords
magnetic
reed
level gauge
chip
magnetoresistive chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/109715
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English (en)
French (fr)
Inventor
祁彬
薛松生
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MultiDimension Technology Co Ltd
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MultiDimension Technology Co Ltd
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Publication date
Application filed by MultiDimension Technology Co Ltd filed Critical MultiDimension Technology Co Ltd
Priority to JP2022512289A priority Critical patent/JP2022545492A/ja
Priority to US17/753,201 priority patent/US12018973B2/en
Priority to EP20856630.7A priority patent/EP4019913B1/en
Publication of WO2021036859A1 publication Critical patent/WO2021036859A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/14—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measurement of pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G01F23/64—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements
    • G01F23/72—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats of the free float type without mechanical transmission elements using magnetically actuated indicating means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/091—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/30—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by floats
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/096—Magnetoresistive devices anisotropic magnetoresistance sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors

Definitions

  • the embodiment of the present invention relates to storage detection technology, in particular to a magnetic induction level gauge for detecting the height of materials in a material warehouse.
  • the material level gauge is used to detect the material level.
  • Existing level gauges include resistance-rotation type, diaphragm type, tuning fork type, vibrating rod type and radio frequency admittance type.
  • the anti-rotation level gauge uses a motor to drive the blade.
  • the motor stops rotating and outputs a signal;
  • the diaphragm type level gauge transmits its own deformation signal to the micro switch through a lever mechanism to trigger the action;
  • the tuning fork type level gauge Based on the change in the vibration frequency when the tuning fork is immersed, the signal is output;
  • the vibrating rod level gauge uses material coverage to increase the vibration damping and triggers the signal;
  • the radio frequency admittance level gauge measures the admittance value under the change of the material level by radio waves Change, thereby triggering the output signal.
  • the resistance-rotation type level gauge is low in cost
  • the diaphragm type level gauge has low sensitivity
  • the tuning fork type level gauge has high power consumption
  • the vibrating rod type level gauge has high power consumption, low sensitivity and high cost
  • the radio frequency admittance type material The position meter has high power consumption.
  • the embodiment of the present invention provides a magnetic induction level gauge, which reduces the power consumption of the existing level gauge and improves its sensitivity.
  • An embodiment of the present invention provides a magnetic induction level gauge, which is installed on the side wall of a material warehouse, and the magnetic induction level gauge includes:
  • a magnetic displacement component which is used to generate mechanical displacement to the side wall of the material bin according to the height of the material in the material bin;
  • the magnetic sensing component includes a protective casing, a magnetoresistive chip and a processing module located inside the protective casing, the protective casing is fixed on the side wall of the material bin, and the magnetic The resistance chip is located on the side of the processing module facing the magnetic displacement component, and the magnetic sensing component is used to sense the magnetic field signal of the magnetic displacement component and determine the material in the material warehouse according to the magnetic field signal the height of.
  • the magnetic displacement component includes a reed and a body of permanent magnet material
  • the permanent magnet material body is a piece of permanent magnet material and is fixed on the side surface of the reed facing the magnetic sensing component; or,
  • the permanent magnetic material body is a layer of permanent magnetic material and is attached to the side surface of the reed facing the magnetic sensing component; or,
  • the permanent magnetic material body is a permanent magnetic material powder and is evenly distributed in the reed;
  • the magnetizing direction of the permanent magnet material body is perpendicular or parallel to the plane where the reed is located, and the magnetoresistive chip is located on the maximum displacement path of the permanent magnet material body.
  • the permanent magnetic material body adopts a hard magnetic material or a multilayer thin film composite unit composed of a plurality of hard magnetic materials; or, the permanent magnetic material body adopts a multiple of [soft magnetic material/hard magnetic material]n.
  • Layer film composite material where n is a natural number.
  • the magnetic displacement assembly further includes a protective coating that wraps the reed and the permanent magnetic material body.
  • the material bin includes a bottom surface
  • the reed includes a first end close to the bottom surface of the material bin and a second end far away from the bottom surface of the material bin;
  • the first end of the reed is fixed on a first fixing point by a first support, and the first support is a rigid support or an elastic support; or, the first end of the reed is fixed on the On the first fixed point; wherein, the first fixed point is located on the protective shell or on the side wall of the material bin.
  • the second end of the reed is fixed to a second fixed point by a second support
  • the second support is a rigid support or an elastic support
  • the second fixed point is located on the protective shell On the body or on the side wall of the material bin.
  • the processing module includes a signal processing unit and a circuit board, the circuit board is fixed in the protective housing, and the magnetoresistive chip is arranged on a surface of the circuit board facing the magnetic displacement component ,
  • the signal processing unit is arranged on one side surface of the circuit board;
  • the magnetoresistive chip is used to sense the magnetic field signal of the magnetic displacement component
  • the signal processing unit is used to obtain the magnetic field signal, determine the height of the material in the material bin according to the magnetic field signal, and then output the material height signal.
  • the plane where the magnetoresistance chip is located is perpendicular to the tangent plane at the highest point of the top surface of the protective housing, the sensitive direction of the magnetoresistance chip is located on the plane where the magnetoresistance chip is located, and the The sensitive direction is parallel or perpendicular to the tangent plane at the highest point of the top surface of the protective shell; or,
  • the plane where the magneto-resistance chip is located is parallel to the tangent plane at the highest point of the top surface of the protective housing, the sensitive direction of the magneto-resistance chip is located in the plane where the magneto-resistance chip is located, and the sensitive direction of the magneto-resistance chip is parallel.
  • the tangent plane at the highest point of the top surface of the protective shell is parallel to the tangent plane at the highest point of the top surface of the protective shell.
  • the magnetoresistive chip is any one of an anisotropic magnetoresistive chip, a giant magnetoresistive chip, and a tunnel junction magnetoresistive chip.
  • the magnetic displacement component generates mechanical displacement according to the height of the material, which causes the magnetic field between it and the magnetic sensing component to change, and the magnetic sensing component changes according to the magnetic field between the magnetic displacement component and the magnetic displacement component. Determine the height of the material.
  • the magnetoresistive chip has the characteristics of high sensitivity and low power consumption, which is beneficial to the high-precision detection of the storage material level.
  • the protective casing isolates the magnetoresistive chip and the material, and does not cause electrical conduction between the material and the magnetoresistive chip.
  • the protective casing also makes the magnetic sensing component highly resistant to abrasion.
  • the magnetic displacement component is in direct contact with the material, it will change according to the mechanical position of the material, but it will not be affected by the dielectric constant of the material; in addition, the magnetoresistive chip in the magnetic sensing component has low power consumption and high sensitivity, which makes the overall
  • the magnetic induction level gauge has a simple structure and low cost. It is suitable for the detection of solid and liquid materials such as blocks, particles, and liquids. It has good material adaptability, simple installation, high reliability, and it is not easy to jam materials.
  • Figure 1 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 2 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 3 is a schematic diagram of a magnetic displacement component in a level gauge provided by an embodiment of the present invention.
  • Figure 4 is a schematic diagram of a magnetic displacement component in a level gauge provided by an embodiment of the present invention.
  • Figure 5 is a schematic diagram of a magnetic displacement component in a level gauge provided by an embodiment of the present invention.
  • Figure 6 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 7 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 8 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 9 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 10 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 11 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 12 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 13 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • FIG. 14 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • FIG. 15 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Figure 16 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • Fig. 17 is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • FIG. 1 and FIG. 2 it is a schematic diagram of a magnetic induction level gauge provided by an embodiment of the present invention.
  • the magnetic induction level gauge provided by the embodiment of the present invention is installed on the side wall of the material bin, and can be used to measure the material level storage height and the liquid interface position of the material bin such as particles, powder, slurry, liquid, etc.
  • the magnetic induction level gauge includes: a magnetic displacement component 1, which is used to generate mechanical displacement to the side wall 1a of the material warehouse according to the height of the material in the material warehouse; the magnetic sensing component 2, the magnetic sensing component 2 includes a protective housing 108, a magnetoresistive chip 103 and a processing module 2a located inside the protective housing 108, the protective housing 108 is fixed on the side wall 1a of the material bin, and the magnetoresistive chip 103 is located on the magnetic displacement component facing the processing module 2a On one side of 1, the magnetic sensing component 2 is used to sense the magnetic field signal of the magnetic displacement component 1 and determine the height of the material in the material bin according to the magnetic field signal.
  • the magnetic displacement component 1 can be directly fixed on the side wall 1a of the material bin.
  • the magnetic displacement component 1 can also be fixed on the side wall 1a of the material bin through a support.
  • the magnetic sensing component 2 is directly fixed on the side wall 1a of the material bin.
  • the working principle of the magnetic induction level gauge is that the magnetic displacement component 1 produces corresponding mechanical displacement changes according to the height of the material, and the displacement of the magnetic displacement component 1 causes the relative distance between the magnetic displacement component 1 and the magnetoresistive chip 103 to change; the magnetoresistive chip 103 senses According to the magnetic field signal between it and the magnetic displacement component 1, the processing module 2a determines the material height of the material bin according to the magnetic field information.
  • the signal conversion process of the magnetic induction level gauge is that the magnetic displacement component 1 converts the material height information into mechanical displacement information, the magnetoresistive chip 103 converts the mechanical displacement information into magnetic field information, and the processing module 2a then converts the magnetic field information into Material height information.
  • the magnetic induction level gauge is composed of a magnetic displacement assembly 1 and a magnetic induction sensing assembly 2, so the installation position of the two components must be able to realize the detection function of the magnetic induction level gauge, which is not specifically limited here.
  • the magnetic displacement component 1 can produce mechanical displacement to the side wall 1a according to the height of the material in the material silo. Specifically, the material in the material silo will generate pressure on the magnetic displacement component 1 so that the magnetic displacement component 1 is displaced in the direction of the magnetic sensing component 2 , Where, when the height of the material in the material bin is different, the pressure generated on the magnetic displacement assembly 1 is also different, and the displacement of the corresponding magnetic displacement assembly 1 is also different. Therefore, the magnetic displacement component 1 generates a corresponding displacement according to the height of the material, so that the relative distance between the magnetic displacement component 1 and the magnetic sensing component 2 changes accordingly.
  • the magnetic sensing component 2 includes a protective casing 108, a magnetoresistive chip 103 and a processing module 2a located inside the protective casing 108, the protective casing 108 is fixed on the side wall 1a of the material bin, and the magnetoresistive chip 103 Located on the side of the processing module 2a facing the magnetic displacement assembly 1.
  • the protective shell 108 can isolate the magnetoresistive chip 103 and materials inside it, so as to prevent the magnetoresistive chip 103 and the processing module 2a from being damaged.
  • the magnetic displacement component 1 and the magnetic sensing component 2 are both arranged on the side wall 1a of the material bin.
  • the magnetoresistive chip 103 is located on the maximum displacement path of the magnetic displacement component 1, and the displacement of the magnetic displacement component 1 causes it to interact with the magnetoresistive The magnetic field between the chips 103 changes.
  • the magnetoresistive chip 103 located on the maximum displacement path of the magnetic displacement component 1 can sense the magnetic field signal with the magnetic displacement component 1, and the magnetoresistive chip 103 will sense the magnetic field signal Converted to the change of the magnetic resistance value, the processing module 2a determines the height of the material in the material warehouse according to the magnetic resistance value signal.
  • the structure of the magnetic displacement assembly 1 can be any structure that has both magnetic and elastic functions, such as a magnetic spring sheet.
  • the magnetoresistive chip 103 in the magnetoresistive sensing component 2 can be any magnetoresistive sensor that can detect a magnetic field signal, which is not specifically limited in the present invention.
  • the protective shell 108 may be made of a non-magnetic material, specifically metal, ceramic, glass, quartz or composite material, so as to prevent the protective shell 108 from affecting the mechanical displacement of the magnetic displacement component 1.
  • the magnetic displacement component generates mechanical displacement according to the height of the material, which causes the magnetic field between it and the magnetic sensing component to change, and the magnetic sensing component is determined according to the change in the magnetic field between the magnetic displacement component and the magnetic displacement component.
  • Material height, among them, the magnetoresistive chip of the magnetic sensing component has the characteristics of high sensitivity and low power consumption, which is conducive to the high-precision detection of the storage material level.
  • the protective casing isolates the magnetoresistive chip and the material, so that no conduction occurs between the material and the magnetoresistive chip, and the protective casing also makes the magnetic sensing component highly resistant to abrasion; If the magnetic displacement component is in direct contact with the material, it will change its mechanical position according to the material, but it will not be affected by the dielectric constant of the material.
  • the magnetoresistive chip in the magnetic sensing component has low power consumption and high sensitivity, which makes the overall magnetic induction
  • the level gauge has a simple structure and low cost. It is suitable for the detection of solid and liquid materials such as blocks, particles, and liquids. It has good material adaptability, simple installation, high reliability, and it is not easy to jam materials.
  • the magnetic displacement assembly 1 shown in FIGS. 1 to 5 may include a reed 101 and a permanent magnet material body 102; as shown in FIG. 3, the permanent magnet material body 102 is a permanent magnet.
  • the material block is fixed on the side surface of the reed 101 facing the magnetic sensing component 2; or, as shown in FIG. 4, the permanent magnetic material body 102 is a layer of permanent magnetic material and attached to the reed 101 facing the magnetic sensing component.
  • the permanent magnet material body 102 is a permanent magnet material powder and is evenly distributed in the reed 101; wherein, the magnetizing direction of the permanent magnet material body 102 is perpendicular or parallel to The plane where the reed 101 is located, and the magnetoresistive chip 103 is located on the maximum displacement path of the permanent magnetic material body 102.
  • the reed 101 is a sheet-shaped elastic body.
  • the material of the reed 101 may be metal, ceramic, silicon or silicon compound, rubber or synthetic polymer. It can be understood that the sheet-shaped elastic body is all The protection scope of the present invention is not limited to this.
  • the reed 101 of the magnetic induction level gauge will produce a corresponding mechanical position change under the pressure of the material height in the material bin, that is, displacement. It can be understood that the mechanical position change of the reed 101 is different when the material height is different. Among them, the reed 101 The direction of displacement under the action of the material is the direction in which the reed 101 points to the magnetic sensing component 2.
  • a permanent magnetic material body 102 is provided on the reed 101.
  • the permanent magnetic material body 102 may be attached to the surface of the reed 101 in a layered manner, or the material powder may be uniformly distributed inside the reed 101. It can also be attached to the reed 101 in a block shape.
  • the reed 101 generates a mechanical position change and drives the permanent magnet material body 102 thereon to generate a mechanical position change, and the magnetic field between the permanent magnet material body 102 and the magnetoresistive chip 103 changes.
  • the permanent magnetic material body 102 can be formed on the reed 101 by bonding, welding, electroplating, sputtering growth, vapor deposition, spin coating, etc. to form a magnetic displacement.
  • Component 1
  • the magnetoresistive chip 103 is located on the maximum displacement path of the permanent magnetic material body 102, so the magnetoresistance chip 103 can sense the magnetic field between the magnetoresistance chip 103 and the permanent magnetic material body 102.
  • the magnetic field signal follows the magnetoresistance chip 103 and the permanent magnetic material body 102. The relative distance between 102 changes.
  • the optional permanent magnetic material body 102 adopts a hard magnetic material or a multilayer thin film composite unit of multiple hard magnetic materials.
  • Optional hard magnetic materials for making permanent magnetic material body 102 include but not limited to ferrite, AlNiCo, rare earth permanent magnets, and soft magnetic materials for making permanent magnetic material body 102 include but not limited to FeCo, NiFe, silicon steel sheet, industrial pure iron . It can be understood that the hard magnetic material and/or soft magnetic material constituting the permanent magnetic material body 102 include but are not limited to the above examples.
  • the magnetic displacement assembly 1 includes a reed 101 and a permanent magnet material body 102.
  • the combination of the reed 101 and the permanent magnet material body 102 converts the material height signal into a mechanical position change to facilitate subsequent material height detection.
  • the reed 101 is combined with the permanent magnetic material body 102, and the high-sensitivity magnetoresistive chip 103 is combined.
  • the magnetic field near the magnetoresistive chip 103 changes, which causes the magnetoresistive resistance value of the magnetoresistive chip 103 to change.
  • Module 2a converts the mechanical movement into electrical signals, so as to accurately obtain the material level signal in the material bin.
  • the advantage of the magnetic displacement component 1 composed of the reed 101 and the permanent magnet material body 102 is that it is not sensitive to the conductivity of the material and is not affected by the dielectric constant of the material. It is suitable for the detection of solid materials such as blocks and particles. For liquid material detection, the material adaptability is good. At the same time, the reed 101 has high sensitivity, strong versatility, no material jamming, no power consumption and wear resistance, and the overall structure is simple and low in cost.
  • the magnetic displacement assembly 1 further includes a protective coating 301 covering the reed 101 and the permanent magnetic material body 102.
  • the protective coating 301 can isolate the magnetic displacement component 1 from the material, avoid direct contact between the magnetic displacement component 1 and the material, prolong the service life of the magnetic displacement component 1, reduce the wear of the material to the magnetic displacement component 1, and improve the resistance of the magnetic displacement component 1 Abrasion.
  • the optional protective coating 301 is a wear-resistant or corrosion-resistant polymer material, such as a metal or ceramic material. In other embodiments, it also includes, but is not limited to, polytetrafluoroethylene, titanium, titanium alloy, tungsten alloy, chromium, and aluminum oxide. , It can avoid the consumption of the material to the reed and the permanent magnet material body.
  • the material bin includes a bottom surface (not shown), as shown in FIGS. 7 to 10, the reed 101 includes a first end close to the bottom surface of the material bin and a second end away from the bottom surface of the material bin; The first end is fixed to a first fixing point (not shown) by a first support 109, which is a rigid support or an elastic support; or, the first end of the reed 101 is fixed to the first fixing Point; Among them, the first fixed point is located on the protective shell 108 or located on the side wall 1a of the material bin.
  • the magnetic induction level gauge is installed on the side wall of the material bin.
  • the reed 101 is a sheet-shaped elastic body, and the sheet-shaped elastic body includes two ends.
  • the end of the sheet-shaped elastic body close to the bottom surface is defined as the first end of the reed 101, and the end of the sheet-shaped elastic body away from the bottom surface is defined as the first end of the reed 101.
  • the second end of the reed 101 defined as the second end of the reed 101.
  • the magnetic induction level gauge is installed on the side wall 1 a of the material bin, the first end of the reed 101 is essentially the lower end of the reed 101, and the second end of the reed 101 is essentially the upper end of the reed 101.
  • One or both ends of the reed 101 are fixed by a rigid connection or an elastic connection, and the fixing point can be on the surface of the protective housing 108 or on the surface of the side wall 1a of the material bin.
  • the first end of the reed 101 is directly fixed on the side wall 1a of the material bin.
  • the first end of the reed 101 is fixed on the surface of the protective housing 108 through a first support 109, and the first support 109 may be a rigid support.
  • the first end of the reed 101 is directly fixed on the surface of the protective housing 108.
  • the first end of the reed 101 is fixed on the side wall 1a of the material bin through a first support 109, and the first support 109 may be a rigid support.
  • the first support can also be an elastic support.
  • the second end of the optional reed 101 is fixed on a second fixing point through a second support 110, which is a rigid support or an elastic support, and the second fixing point is located on the protective housing 108 or On the side wall 1a of the material bin.
  • Optional reed 101 is fixed at both ends.
  • the first end of the reed 101 is fixed on the surface of the protective housing 108 through a first support 109.
  • the first support 109 may be a rigid support; the second end of the reed 101 is passed through a second
  • the support 110 is fixed on the surface of the protective housing 108, and the second support 110 may be a rigid support.
  • the permanent magnet material body 102 is located in the middle of the reed 101.
  • the lower end of the reed 101 can be defined as the first end
  • the upper end of the reed 101 can be defined as the second end.
  • the first end of the reed 101 is fixed on the surface of the protective housing 108 through a first support 109.
  • the first support 109 may be a rigid support; the second end of the reed 101 is passed through a second
  • the support 110 is fixed on the surface of the protective housing 108, and the second support 110 may be an elastic support.
  • the side surface of the protective shell 108 facing away from the magnetic displacement assembly 1 is attached and fixed to the side wall 1a of the material bin, and the side surface of the protective shell 108 facing the magnetic displacement assembly 1 is flat or curved.
  • the side wall 1a of the optional material bin is flat, the side surface of the protective shell 108 facing the magnetic displacement assembly 1 is flat, and the side surface of the protective shell 108 facing away from the magnetic displacement assembly 1 and the material
  • the side wall 1a of the bin is attached and fixed.
  • the side wall 1a of the optional material bin is curved, the surface of the protective shell 108 facing the magnetic displacement assembly 1 is flat, and the surface of the protective shell 108 facing away from the magnetic displacement assembly 1 is adapted to It is fixed to the side wall 1a of the material bin.
  • the side wall 1a of the optional material bin is flat, the side surface of the protective shell 108 facing the reed 101 is curved, and the magnetic displacement component 1 is fixedly connected to the curved protective shell 108.
  • top arc surface of the protective shell 108 is beneficial to reduce the mechanical impact and wear of the detection material on the protective shell 108.
  • the bottom arc and bottom plane of the protective shell 108 are selected to be consistent with the installation position arc to achieve protection. The maximum fit of the shell 108 and the installation position reduces stress and improves stability.
  • the processing module 2a shown in FIG. 2 and FIG. 14 may optionally include a signal processing unit 104 and a circuit board 105, the circuit board 105 is fixed in the protective housing 108, and the magnetoresistive chip 103 It is arranged on the side surface of the circuit board 105 facing the magnetic displacement component 1, and the signal processing unit 104 is arranged on one side surface of the circuit board 105; the magnetoresistive chip 103 is used to sense the magnetic field signal of the magnetic displacement component 1; The unit 104 is used to obtain the magnetic field signal and determine the height of the material in the material bin according to the magnetic field signal, and then output the material height signal.
  • the structure of the processing module 2a in FIGS. 1 to 13 is the same as that in FIGS. 2 and 14, and will not be described and labeled in detail here.
  • the top surface of the protective housing 108 specifically refers to a side surface of the protective housing 108 facing away from the side wall 1a.
  • the plane where the magnetoresistive chip 1 is located is parallel to the tangent plane at the highest point of the top surface of the protective housing 108
  • the sensitive direction of the magnetoresistive chip 103 is located on the plane where the magnetoresistive chip 103 is located, and the magnetoresistive chip 103
  • the sensitive direction of is parallel to the tangent plane at the highest point of the top surface of the protective shell 108. As shown in FIG.
  • the plane where the magnetoresistive chip 1 is located is perpendicular to the tangent plane at the highest point of the top surface of the protective housing 108
  • the sensitive direction of the magnetoresistive chip 103 is located on the plane where the magnetoresistive chip 103 is located
  • the sensitive direction of the magnetoresistive chip 103 is parallel Or perpendicular to the tangent plane at the highest point of the top surface of the protective shell 108.
  • the optional circuit board 105 is a PCB circuit board, and the circuit board 105 is fixed in the protective casing 108 through a supporting column, or, in other embodiments, the PCB circuit board may be directly fixed on the inner wall of the protective casing.
  • the magnetoresistive chip 103 and the signal processing unit 104 are integrated on the PCB circuit board, and the magnetoresistive chip 103 is also located in the vertical projection of the permanent magnetic material body 102 on its maximum displacement path.
  • the optional magnetoresistive chip 103 is any one of an anisotropic magnetoresistive chip, a giant magnetoresistive chip, and a tunnel junction magnetoresistive chip.
  • the magnetoresistance chip 103 can sense the magnetic field signal of the permanent magnetic material body 102 and convert the magnetic field signal into a magnetoresistance signal and transmit it to the signal processing unit 104.
  • the signal processing unit 104 analyzes and processes the magnetoresistance signal and outputs it.
  • the optional signal processing unit 104 is one or more of integrated circuit chips such as CPU, MCU, DSP, ASIC, amplifier, filter, comparator, etc., or the signal processing unit 104 is a PCB circuit board composed of discrete devices and The above components have circuits with the same function.
  • the signal processing unit 104 has one or more of the following functions. It receives the magnetoresistance signal generated by the magnetoresistive chip 103 through the circuit board 105 and performs modulation, filtering, amplification, analog-to-digital conversion, isolation, noise reduction, level conversion, and output form Conversion to transmit the processed signal to the data transmission unit 111. It can be understood that the signal processing unit 104 and the magnetoresistive chip 103 may be located in the same package or packaged separately.
  • the circuit board 105 is further provided with a power supply unit 112 and a data transmission unit 111.
  • the data transmission unit 111 transmits at least one of the signal generated by the magnetoresistive chip 103 and the signal generated by the signal processing unit 104 to an external terminal.
  • the data transmission unit 111 uses wireless transmission or wired transmission for transmission. If the data transmission unit 111 adopts a wireless transmission mode for transmission, a wireless transmission unit is also integrated on the circuit board 105, and the wireless transmission unit transmits the data of the data transmission unit 111 to an external interrupter in a wireless transmission mode. It can be understood that the data transmission unit 111 and the signal processing unit 104 may be located in the same package or packaged separately.
  • the power supply unit 112 supplies power to the power-consuming components in the level gauge, such as the magnetoresistive chip 103, the signal processing unit 104, the circuit board 105, and the data transmission unit 111.
  • the power supply unit 112 is powered by an internal battery and/or an external lead.
  • the internal battery is arranged inside the protective casing 108, and the external lead is connected to the PCB circuit board through a surface sealing interface of the protective casing 108.
  • the data transmission unit and the power supply unit may also be fixed on the inner wall of the protective housing.
  • the magnetic sensing component 2 further includes a transmission wire 113.
  • the transmission wire 113 is electrically connected to an external terminal.
  • the protective shell 108 is also provided with a sealed interface 106 at the position where the transmission wire 113 is connected.
  • the transmission wire 113 is electrically connected to the PCB circuit board through the sealed interface 106 on the surface of the protective shell 108.
  • the sealing interface 106 can achieve sealing and waterproof functions, so that solid and liquid materials can be prevented from entering the protective casing 108 through the connection between the protective casing 108 and the transmission wire 113 and damaging the magnetic sensing assembly 2.
  • the transmission wire 106 also extends to the PCB circuit board and transmits power supply signals and other signals for various devices.
  • the circuit principle of the level gauge based on the magnetic induction function is as follows: the power supply unit supplies power to the power-consuming devices; the magnetoresistive chip converts the magnetic field change caused by the displacement of the permanent magnetic material on the reed into an electrical signal and passes the PCB circuit The board outputs to the signal processing unit, where the output signal of the magnetoresistive chip is output in a single-ended output or a differential output mode; the signal processing unit adjusts the signal and outputs a current or voltage signal according to demand, or outputs an analog or digital signal according to demand, And output to the external terminal through the data transmission unit to determine the material height of the material warehouse.
  • the magnetoresistive chip 103, the signal processing unit 104, and the circuit board 105 as shown in FIG. 16 and FIG. 17 may be selected to form the magnetic induction measurement basic unit 401 of the magnetic induction component, and the protective housing
  • a number of magnetic induction measurement basic units 401 can be set in 108, which are arranged in a linear manner. With the linear reed and permanent magnet material body, they can be used to accurately measure different material levels.
  • a plurality of magnetic induction measurement basic units 401 can share a reed, and the extension direction of the reed is parallel to the direction of the bottom surface of the material silo pointing to the top surface of the material silo, and the multiple magnetic induction measurement basic units 401 are in the extension direction of the reeds. Arranged on top.
  • the multiple magnetic induction measurement basic units 401 are connected through the PCB circuit board 105 or the transmission wire 106, and the multiple magnetic induction measurement basic units 401 transmit signals to the outside of the protective housing 108 through the transmission wire 106.
  • each magnetic induction measurement basic unit 401 It contains single or multiple data transmission units and transmits signals to the outside of the protective housing 108.
  • the multiple magnetic induction measurement basic units 401 are also powered by the transmission wire 106, or the magnetic induction measurement unit 401 further includes a single or multiple power supply units to realize self-powering.

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  • General Physics & Mathematics (AREA)
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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
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Abstract

一种磁感应料位计，安装在物料仓的侧壁上，磁感应料位计包括：磁性位移组件（101），磁性位移组件（101）用于根据物料仓内物料的高度向物料仓的侧壁产生机械位移；磁性感测组件（2），磁性感测组件（2）包括保护壳体（108）以及位于保护壳体（108）内部的磁阻芯片（103）和处理模块（2a），保护壳体（108）固定在物料仓的侧壁上，磁阻芯片（103）位于处理模块（2a）的面向磁性位移组件（101）的一侧上，磁性感测组件（2）用于感测磁性位移组件（101）的磁场信号并根据磁场信号确定物料仓内物料的高度。磁性位移组件（101）根据物料高度产生机械位移，磁阻结构感测磁性位移组件（101）的磁场变化以此确定物料高度。该磁感应料位计具有功耗低、灵敏度高、结构简单成本低的优势，适于固液体物料检测。

Description

一种磁感应料位计 技术领域
本发明实施例涉及仓储检测技术，尤其涉及一种检测物料仓物料高度的磁感应料位计。
背景技术
料位计用于检测物料料位。现有料位计包括阻旋式，膜片式，音叉式，振棒式以及射频导纳式。阻旋式料位计利用马达驱动叶片，当叶片接触物料时，马达停止转动输出信号；膜片式料位计通过杠杆机构将自身形变信号传递至微动开关，触发动作；音叉式料位计基于音叉被浸没时振动频率发生变化，进而输出信号；振棒式料位计利用物料覆盖造成振动阻尼增强而触发信号；射频导纳式料位计通过无线电波测量料位变化下的导纳值变化，从而触发输出信号。
然而，阻旋式料位计成本低，膜片式料位计灵敏度低，音叉式料位计功耗高，振棒式料位计功耗高、灵敏度低且成本高，射频导纳式料位计功耗高。
发明内容
本发明实施例提供一种磁感应料位计，降低现有料位计功耗并提高其灵敏度。
本发明实施例提供的一种磁感应料位计，安装在物料仓的侧壁上，所述磁感应料位计包括：
磁性位移组件，所述磁性位移组件用于根据所述物料仓内物料的高度向所述物料仓的侧壁产生机械位移；
磁性感测组件，所述磁性感测组件包括保护壳体以及位于所述保护壳体内部的磁阻芯片和处理模块，所述保护壳体固定在所述物料仓的侧壁上，所述磁阻芯片位于所述处理模块的面向所述磁性位移组件的一侧上，所述磁性 感测组件用于感测所述磁性位移组件的磁场信号并根据所述磁场信号确定所述物料仓内物料的高度。
进一步地，所述磁性位移组件包括簧片和永磁材料体；
所述永磁材料体为永磁材料块并固定在所述簧片的面向所述磁性感测组件的一侧表面上；或者，
所述永磁材料体为永磁材料层并贴附在所述簧片的面向所述磁性感测组件的一侧表面上；或者，
所述永磁材料体为永磁材料粉体并均匀分布在所述簧片内；
其中，所述永磁材料体的充磁方向垂直或平行于所述簧片所在平面，所述磁阻芯片位于所述永磁材料体的最大位移路径上。
进一步地，所述永磁材料体采用一种硬磁材料或多种硬磁材料构成的多层薄膜复合单元；或者，所述永磁材料体采用[软磁材料/硬磁材料]n的多层薄膜复合材料，其中n为自然数。
进一步地，所述磁性位移组件还包括包裹所述簧片和所述永磁材料体的保护涂层。
进一步地，所述物料仓包括底面，所述簧片包括靠近所述物料仓的底面的第一端和远离所述物料仓的底面的第二端；
所述簧片的第一端通过第一支撑件固定在第一固定点上，所述第一支撑件为刚性支撑件或弹性支撑件；或者，所述簧片的第一端固定在所述第一固定点上；其中，所述第一固定点位于所述保护壳体上或者位于所述物料仓的侧壁上。
进一步地，所述簧片的第二端通过第二支撑件固定在第二固定点上，所述第二支撑件为刚性支撑件或弹性支撑件，所述第二固定点位于所述保护壳体上或者位于所述物料仓的侧壁上。
进一步地，所述处理模块包括信号处理单元和电路板，所述电路板固定在所述保护壳体内，所述磁阻芯片设置在所述电路板的面向所述磁性位移组件的一侧表面上，所述信号处理单元设置在所述电路板的一侧表面上；
所述磁阻芯片用于感测所述磁性位移组件的磁场信号；
所述信号处理单元用于获取所述磁场信号并根据所述磁场信号确定所述物料仓内物料的高度，再输出该物料高度信号。
进一步地，所述磁阻芯片所在平面与所述保护壳体的顶面最高处的切平面垂直，所述磁阻芯片的敏感方向位于所述磁阻芯片所在平面，且所述磁阻芯片的敏感方向平行或垂直于所述保护壳体的顶面最高处的切平面；或者，
所述磁阻芯片所在平面与所述保护壳体的顶面最高处的切平面平行，所述磁阻芯片的敏感方向位于所述磁阻芯片所在平面，且所述磁阻芯片的敏感方向平行于所述保护壳体的顶面最高处的切平面。
进一步地，所述磁阻芯片为各向异性磁阻芯片、巨磁阻芯片和隧道结磁阻芯片中的任意一种。
本发明实施例提供的磁感应料位计，磁性位移组件根据物料高度产生机械位移进而导致其与磁性感测组件之间的磁场发生变化，磁性感测组件根据其与磁性位移组件之间的磁场变化确定物料高度，其中，磁阻芯片具有高灵敏度以及低功耗的特性，有利于仓储料位的高精确度检测。与现有技术相比，本发明实施例中，保护壳体隔离磁阻芯片和物料，不会使物料和磁阻芯片之间产生导电，保护壳体还使得磁性感测组件的抗磨损性高；磁性位移组件与物料直接接触，其会根据物料发生机械位置变化，但自身不会受物料介电常数的影响；此外，磁性感测组件中磁阻芯片的功耗低且灵敏度高，使得整体磁感应料位计的结构简单成本低，适于块体、颗粒、液体等固液体物料检测，物料适配性好，安装简便，可靠性高，不容易挂料卡料。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图做一简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明实施例提供的一种磁感应料位计的示意图；
图2是本发明实施例提供的一种磁感应料位计的示意图；
图3是本发明实施例提供的料位计中磁性位移组件的示意图；
图4是本发明实施例提供的料位计中磁性位移组件的示意图；
图5是本发明实施例提供的料位计中磁性位移组件的示意图；
图6是本发明实施例提供的一种磁感应料位计的示意图；
图7是本发明实施例提供的一种磁感应料位计的示意图；
图8是本发明实施例提供的一种磁感应料位计的示意图；
图9是本发明实施例提供的一种磁感应料位计的示意图；
图10是本发明实施例提供的一种磁感应料位计的示意图；
图11是本发明实施例提供的一种磁感应料位计的示意图；
图12是本发明实施例提供的一种磁感应料位计的示意图；
图13是本发明实施例提供的一种磁感应料位计的示意图；
图14是本发明实施例提供的一种磁感应料位计的示意图；
图15是本发明实施例提供的一种磁感应料位计的示意图；
图16是本发明实施例提供的一种磁感应料位计的示意图；
图17是本发明实施例提供的一种磁感应料位计的示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，以下将参照本发明实施例中的附图，通过实施方式清楚、完整地描述本发明的技术方案，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参考图1和图2所示，为本发明实施例提供的一种磁感应料位计的示意图。本发明实施例提供的磁感应料位计安装在物料仓的侧壁上，可用于测量颗粒物、粉末、浆体、液体等物料仓的料位仓储高度以及液体界面位置。
本实施例提供的磁感应料位计包括：磁性位移组件1，磁性位移组件1用于根据物料仓内物料的高度向物料仓的侧壁1a产生机械位移；磁性感测组 件2，磁性感测组件2包括保护壳体108以及位于保护壳体108内部的磁阻芯片103和处理模块2a，保护壳体108固定在物料仓的侧壁1a上，磁阻芯片103位于处理模块2a的面向磁性位移组件1的一侧上，磁性感测组件2用于感测磁性位移组件1的磁场信号并根据磁场信号确定物料仓内物料的高度。
本实施例中，磁性位移组件1可以直接固定在物料仓的侧壁1a上，在其他实施例中如图2所示磁性位移组件1也可以通过支撑件固定在物料仓的侧壁1a上，其中，磁性感测组件2直接固定在物料仓的侧壁1a上。可以理解，磁感应料位计的工作原理是，磁性位移组件1根据物料高度产生相应机械位移变化，磁性位移组件1位移使其与磁阻芯片103的相对距离发生变化；磁阻芯片103感测到其与磁性位移组件1之间的磁场信号，处理模块2a根据该磁场信息确定物料仓的物料高度。由此可知，磁感应料位计的信号转换过程为，磁性位移组件1将物料高度信息转换为机械位移信息，磁阻芯片103将机械位移信息转换为磁场信息，处理模块2a再将磁场信息转换为物料高度信息。
可以理解，磁感应料位计由磁性位移组件1和磁性感测组件2构成，那么该两个组件的安装位置需能够实现磁感应料位计的检测功能，在此不进行具体限定。
磁性位移组件1能够根据物料仓内物料的高度向侧壁1a产生机械位移，具体的，物料仓内的物料会对磁性位移组件1产生压力使得磁性位移组件1向磁性感测组件2的方向位移，其中，物料仓内物料高度不同时，对磁性位移组件1产生的压力大小也不同，相应的磁性位移组件1的位移大小也不同。因此，磁性位移组件1根据物料高度产生相应位移使得其与磁性感测组件2的相对距离发生相应变化。
本实施例中，磁性感测组件2包括保护壳体108以及位于保护壳体108内部的磁阻芯片103和处理模块2a，保护壳体108固定在物料仓的侧壁1a上，磁阻芯片103位于处理模块2a的面向磁性位移组件1的一侧上。保护壳体108可以隔离其内部的磁阻芯片103和物料，避免磁阻芯片103和处理模块2a受损。磁性位移组件1和磁性感测组件2均设置在物料仓的侧壁1a上， 具体的，磁阻芯片103位于磁性位移组件1的最大位移路径上，则磁性位移组件1位移造成其与磁阻芯片103之间的磁场发生变化，位于磁性位移组件1的最大位移路径上的磁阻芯片103能够感测到与磁性位移组件1之间的磁场信号，磁阻芯片103将感测到的磁场信号转换为磁电阻值变化，处理模块2a根据磁电阻值信号确定物料仓内物料的高度。
可以理解，磁性位移组件1的结构可选为任意一种兼具磁性和弹性功能的结构，例如具有磁性的弹片。磁性感测组件2中的磁阻芯片103可选为任意一种可检测到磁场信号的磁阻传感器，在本发明中不进行具体限定。可选保护壳体108为无磁性材料，具体为金属、陶瓷、玻璃、石英或复合材料，避免保护壳体108影响磁性位移组件1的机械位移。
本实施例提供的磁感应料位计，磁性位移组件根据物料高度产生机械位移进而导致其与磁性感测组件之间的磁场发生变化，磁性感测组件根据其与磁性位移组件之间的磁场变化确定物料高度，其中，磁性感测组件的磁阻芯片具有高灵敏度以及低功耗的特性，有利于仓储料位的高精确度检测。与现有技术相比，本实施例中，保护壳体隔离磁阻芯片和物料，不会使物料和磁阻芯片之间产生导电，保护壳体还使得磁性感测组件的抗磨损性高；磁性位移组件与物料直接接触，其会根据物料发生机械位置变化，但自身不会受物料介电常数的影响；此外，磁性感测组件中磁阻芯片的功耗低且灵敏度高，使得整体磁感应料位计的结构简单成本低，适于块体、颗粒、液体等固液体物料检测，物料适配性好，安装简便，可靠性高，不容易挂料卡料。
示例性的，在上述技术方案的基础上，可选如图1～图5所示磁性位移组件1包括簧片101和永磁材料体102；如图3所示永磁材料体102为永磁材料块并固定在簧片101的面向磁性感测组件2的一侧表面上；或者，如图4所示永磁材料体102为永磁材料层并贴附在簧片101的面向磁性感测组件2的一侧表面上；或者，如图5所示永磁材料体102为永磁材料粉体并均匀分布在簧片101内；其中，永磁材料体102的充磁方向垂直或平行于簧片101所在平面，磁阻芯片103位于永磁材料体102的最大位移路径上。
本实施例中，簧片101为片状弹性体，可选簧片101的组成材料为金属、陶瓷、硅或硅的化合物、橡胶或合成高分子聚合物，可以理解，片状弹性体均落入本发明的保护范围，不限于此。磁感应料位计的簧片101会在物料仓内物料高度的压力下产生相应的机械位置变化即产生位移，可以理解，物料高度不同，簧片101产生的机械位置变化不同，其中，簧片101在物料作用下产生位移的方向为簧片101指向磁性感测组件2的方向。
本实施例中，簧片101上设置有永磁材料体102，永磁材料体102可以为层状贴附在簧片101的表面，也可以是材料粉体均匀分布在簧片101的内部，还可以为块状贴附在簧片101上。簧片101产生机械位置变化进而带动其上的永磁材料体102产生机械位置变化，则永磁材料体102与磁阻芯片103之间的磁场发生变化。根据永磁材料体102与簧片101的相对位置关系，永磁材料体102可通过粘接、焊接、电镀、溅射生长、气相沉积、旋涂等方式形成在簧片101上以构成磁性位移组件1。
磁阻芯片103位于永磁材料体102的最大位移路径上，则磁阻芯片103能够感测到与永磁材料体102之间的磁场，该磁场信号随着磁阻芯片103与永磁材料体102之间的相对距离变化而变化。
本实施例中，可选永磁材料体102采用一种硬磁材料或多种硬磁材料的多层薄膜复合单元。在其他实施例中还可选永磁材料体是采用[软磁材料/硬磁材料]n的多层薄膜复合单元，即软磁材料层和硬磁材料层层叠设置，其中n为自然数，如n＝2，则永磁材料体可选为第一层和第三侧为软磁材料层且第二层和第四层为硬磁材料层。可选制作永磁材料体102的硬磁材料包括但不限于铁氧体、AlNiCo、稀土永磁体，制作永磁材料体102的软磁材料包括但不限于FeCo、NiFe、硅钢片、工业纯铁。可以理解，构成永磁材料体102的硬磁材料和/或软磁材料包括但不限于以上示例。
本实施例中，磁性位移组件1包括簧片101和永磁材料体102，簧片101和永磁材料体102的组合将物料高度信号转换为机械位置变化以便于后续进行物料高度检测。具体的，簧片101与永磁材料体102复合，配合高灵敏度磁阻芯片103，基于簧片101位移引起磁阻芯片103附近的磁场变化，造成 磁阻芯片103的磁阻阻值变化，处理模块2a将机械运动转化为电信号，从而精确获得物料仓内料位信号。其中，簧片101和永磁材料体102组成的磁性位移组件1的优势是，对物料导电性不敏感，也不受物料介电常数影响，适于块体、颗粒等固体物料检测，还适用于液体物料检测，物料适配性好，同时簧片101的灵敏度高，通用性强，不挂料卡料，没有功耗且抗磨损，整体结构简单成本低。
可选的如图6所示磁性位移组件1还包括包裹簧片101和永磁材料体102的保护涂层301。保护涂层301可隔离磁性位移组件1与物料，避免磁性位移组件1与物料直接接触，延长了磁性位移组件1的使用寿命，降低物料对磁性位移组件1的磨损，提高磁性位移组件1的抗磨损性。可选保护涂层301为耐磨或耐腐蚀高分子材料，例如金属或陶瓷材料，在其他实施例中还包括但不限于聚四氟乙烯、钛、钛合金、钨合金、铬和氧化铝材料，可以避免物料对簧片及永磁材料体的消耗。
可选的，物料仓包括底面(未示出)，如图7～图10所示簧片101包括靠近物料仓的底面的第一端和远离物料仓的底面的第二端；簧片101的第一端通过第一支撑件109固定在第一固定点(未示出)上，第一支撑件109为刚性支撑件或弹性支撑件；或者，簧片101的第一端固定在第一固定点上；其中，第一固定点位于保护壳体108上或者位于物料仓的侧壁1a上。
本实施例中，磁感应料位计安装在物料仓的侧壁。其中，簧片101为片状弹性体，片状弹性体包括两端，其中将片状弹性体的靠近底面的一端定义为簧片101的第一端，将片状弹性体的远离底面的一端定义为簧片101的第二端。可以理解，磁感应料位计安装在物料仓的侧壁1a，簧片101的第一端实质是指簧片101的下端，簧片101的第二端实质为簧片101的上端。簧片101的一端或者两端以刚性连接或者弹性连接方式固定，固定点可以在保护壳体108的表面，也可以在物料仓的侧壁1a的表面上。
可选簧片101单端固定。
如图1所示，簧片101的第一端直接固定在物料仓的侧壁1a上。
如图2所示，簧片101的第一端通过第一支撑件109固定在保护壳体108 的表面，可选第一支撑件109为刚性支撑件。
如图7所示，簧片101的第一端直接固定在保护壳体108的表面。
如图8所示，簧片101的第一端通过第一支撑件109固定在物料仓的侧壁1a上，可选第一支撑件109为刚性支撑件。
在其他实施例中，还可选第一支撑件为弹性支撑件。
可选的簧片101的第二端通过第二支撑件110固定在第二固定点上，第二支撑件110为刚性支撑件或弹性支撑件，第二固定点位于保护壳体108上或者位于物料仓的侧壁1a上。
可选簧片101双端固定。
如图9所示，簧片101的第一端通过第一支撑件109固定在保护壳体108的表面，可选第一支撑件109为刚性支撑件；簧片101的第二端通过第二支撑件110固定在保护壳体108的表面，可选第二支撑件110为刚性支撑件。可以理解，永磁材料体102位于簧片101的中间，此时簧片101的下端可定义为第一端，簧片101的上端可定义为第二端。
如图10所示，簧片101的第一端通过第一支撑件109固定在保护壳体108的表面，可选第一支撑件109为刚性支撑件；簧片101的第二端通过第二支撑件110固定在保护壳体108的表面，可选第二支撑件110为弹性支撑件。
可选的，保护壳体108的背离磁性位移组件1的一侧表面与物料仓的侧壁1a贴合固定，保护壳体108的面向磁性位移组件1的一侧表面为平面或弧面。
如图11所示，可选物料仓的侧壁1a为平面，保护壳体108的面向磁性位移组件1的一侧表面为平面，保护壳体108的背离磁性位移组件1的一侧表面与物料仓的侧壁1a贴合固定。
如图12所示，可选物料仓的侧壁1a为弧面，保护壳体108的面向磁性位移组件1的一侧表面为平面，保护壳体108的背离磁性位移组件1的一侧表面适应性的与物料仓的侧壁1a贴合固定。
如图13所示，可选物料仓的侧壁1a为平面，保护壳体108的面向簧片 101的一侧表面为弧面，磁性位移组件1与弧面状保护壳体108固定连接。
需要说明的是，保护壳体108的顶弧面设计有利于降低检测物料对保护壳体108的力学冲击及磨损，保护壳体108的底弧面和底平面选择与安装位置弧度一致，实现保护壳体108与安装位置的最大化贴合，降低应力同时提高稳定性。
示例性的，在上述技术方案的基础上，可选如图2和图14所示处理模块2a包括信号处理单元104和电路板105，电路板105固定在保护壳体108内，磁阻芯片103设置在电路板105的面向磁性位移组件1的一侧表面上，信号处理单元104设置在电路板105的一侧表面上；磁阻芯片103用于感测磁性位移组件1的磁场信号；信号处理单元104用于获取磁场信号并根据磁场信号确定物料仓内物料的高度，再输出该物料高度信号。图1～图13中处理模块2a与图2和图14结构相同，在此不再具体赘述和标记。
保护壳体108的顶面具体是指保护壳体108的背离侧壁1a的一侧表面。如图1-图13所示，磁阻芯片1所在平面与保护壳体108的顶面最高处的切平面平行，磁阻芯片103的敏感方向位于磁阻芯片103所在平面，且磁阻芯片103的敏感方向平行于保护壳体108的顶面最高处的切平面。如图14所示磁阻芯片1所在平面与保护壳体108的顶面最高处的切平面垂直，磁阻芯片103的敏感方向位于磁阻芯片103所在平面，且磁阻芯片103的敏感方向平行或垂直于保护壳体108的顶面最高处的切平面。
本实施例中，可选电路板105为PCB电路板，电路板105通过支撑柱固定在保护壳体108内，或者，在其他实施例中PCB电路板可直接固定于保护壳体的内壁上。磁阻芯片103和信号处理单元104集成在PCB电路板上，磁阻芯片103还位于永磁材料体102在其最大位移路径上的垂直投影内。
可选磁阻芯片103为各向异性磁阻芯片、巨磁阻芯片和隧道结磁阻芯片中的任意一种。磁阻芯片103可感测到永磁材料体102的磁场信号并将该磁场信号转换为磁电阻信号并传输给信号处理单元104，信号处理单元104对磁电阻信号进行分析处理并输出。
可选信号处理单元104为CPU、MCU、DSP、ASIC、放大器、滤波器、比较器等集成电路芯片的一种或多种，或者，信号处理单元104为PCB电路板上由分立器件构成的与上述元件具有相同功能的电路。信号处理单元104具有一种或多种以下功能，通过电路板105接收磁阻芯片103生成的磁电阻信号并进行调制、滤波、放大、模数转换、隔离、降噪、电平转换和输出形式转换，以将处理后的信号传输至数据传输单元111。可以理解，信号处理单元104可与磁阻芯片103位于同一封装体内或独立封装。
可选的，如图15所示电路板105上还设置有供电单元112和数据传输单元111。
数据传输单元111将磁阻芯片103生成的信号和信号处理单元104生成的信号中的至少一种传输至外部终端。其中，数据传输单元111采用无线传输或者有线传输方式进行传输。若数据传输单元111采用无线传输方式进行传输，则电路板105上还集成有无线传输单元，无线传输单元将数据传输单元111的数据采用无线传输的方式传输给外部中断。可以理解，数据传输单元111可与信号处理单元104位于同一封装体内或独立封装。
供电单元112对料位计中的各耗电元件进行供电，如给磁阻芯片103、信号处理单元104、电路板105和数据传输单元111进行供电。供电单元112为内部电池供电和/或外部引线供电方式，其中内部电池设置于保护壳体108内部，外部引线通过保护壳体108表面密封接口与PCB电路板连接。
在其他实施例中，还可选数据传输单元和供电单元还可固定于保护壳体内壁上。
如图14所示，若数据传输单元(未示出，集成在电路板105中)采用有线传输方式进行传输，则磁性感测组件2还包括传输导线113。传输导线113与外部终端电连接，保护壳体108上在连接传输导线113的位置还设置有密封接口106，传输导线113通过保护壳体108表面的密封接口106与PCB电路板电连接。其中密封接口106可以实现密封和防水功能，如此可避免固液体物料通过保护壳体108和传输导线113的连接处进入保护壳体108内而损坏磁性感测组件2。需要说明的是，传输导线106还延伸至PCB电路板上并 为各个器件传输供电信号和其他信号。
基于上述示例，该基于磁感应功能的料位计的电路原理如下：供电单元对各耗电器件进行供电；磁阻芯片将簧片上永磁材料体位移引起的磁场变化转变为电信号并通过PCB电路板输出至信号处理单元，其中磁阻芯片的输出信号采用单端输出或者差分输出的方式输出；信号处理单元将信号调理后根据需求输出电流或电压信号，或者根据需求输出为模拟或数字信号，并通过数据传输单元输出至外部终端，以此确定物料仓的物料高度。
示例性的，在上述技术方案的基础上，可选如图16和图17所示磁阻芯片103、信号处理单元104和电路板105构成了磁性感应组件的磁感应测量基本单元401，保护壳体108内可设置多个磁感应测量基本单元401，呈线性排列，配合线性簧片及永磁材料体，可用于对不同料位进行精确测量。
本实施例中，多个磁感应测量基本单元401可共用一个簧片，该簧片的延伸方向平行于物料仓底面指向物料仓顶面的方向，多个磁感应测量基本单元401在簧片的延伸方向上依次排列。多个磁感应测量基本单元401之间通过PCB电路板105或者传输导线106连接，多个磁感应测量基本单元401通过传输导线106向保护壳体108外传输信号，具体的，每个磁感应测量基本单元401包含单个或多个数据传输单元并向保护壳体108外传输信号。多个磁感应测量基本单元401还通过传输导线106供电，或者磁感应测量单元401内还包含单个或多个供电单元以实现自供电。
注意，上述仅为本发明的较佳实施例及所运用技术原理。本领域技术人员会理解，本发明不限于这里所述的特定实施例，对本领域技术人员来说能够进行各种明显的变化、重新调整、相互结合和替代而不会脱离本发明的保护范围。因此，虽然通过以上实施例对本发明进行了较为详细的说明，但是本发明不仅仅限于以上实施例，在不脱离本发明构思的情况下，还可以包括更多其他等效实施例，而本发明的范围由所附的权利要求范围决定。

Claims (9)

  1. 一种磁感应料位计，其特征在于，安装在物料仓的侧壁上，所述磁感应料位计包括：
    磁性位移组件，所述磁性位移组件用于根据所述物料仓内物料的高度向所述物料仓的侧壁产生机械位移；
    磁性感测组件，所述磁性感测组件包括保护壳体以及位于所述保护壳体内部的磁阻芯片和处理模块，所述保护壳体固定在所述物料仓的侧壁上，所述磁阻芯片位于所述处理模块的面向所述磁性位移组件的一侧上，所述磁性感测组件用于感测所述磁性位移组件的磁场信号并根据所述磁场信号确定所述物料仓内物料的高度。
  2. 根据权利要求1所述的磁感应料位计，其特征在于，所述磁性位移组件包括簧片和永磁材料体；
    所述永磁材料体为永磁材料块并固定在所述簧片的面向所述磁性感测组件的一侧表面上；或者，
    所述永磁材料体为永磁材料层并贴附在所述簧片的面向所述磁性感测组件的一侧表面上；或者，
    所述永磁材料体为永磁材料粉体并均匀分布在所述簧片内；
    其中，所述永磁材料体的充磁方向垂直或平行于所述簧片所在平面，所述磁阻芯片位于所述永磁材料体的最大位移路径上。
  3. 根据权利要求2所述的磁感应料位计，其特征在于，所述永磁材料体采用一种硬磁材料或多种硬磁材料构成的多层薄膜复合单元；或者，
    所述永磁材料体采用[软磁材料/硬磁材料]n的多层薄膜复合材料，其中n为自然数。
  4. 根据权利要求2所述的磁感应料位计，其特征在于，所述磁性位移组件还包括包裹所述簧片和所述永磁材料体的保护涂层。
  5. 根据权利要求2所述的磁感应料位计，其特征在于，所述物料仓包括 底面，所述簧片包括靠近所述物料仓的底面的第一端和远离所述物料仓的底面的第二端；
    所述簧片的第一端通过第一支撑件固定在第一固定点上，所述第一支撑件为刚性支撑件或弹性支撑件；或者，所述簧片的第一端固定在所述第一固定点上；其中，所述第一固定点位于所述保护壳体上或者位于所述物料仓的侧壁上。
  6. 根据权利要求5所述的磁感应料位计，其特征在于，所述簧片的第二端通过第二支撑件固定在第二固定点上，所述第二支撑件为刚性支撑件或弹性支撑件，所述第二固定点位于所述保护壳体上或者位于所述物料仓的侧壁上。
  7. 根据权利要求1所述的磁感应料位计，其特征在于，所述处理模块包括信号处理单元和电路板，所述电路板固定在所述保护壳体内，所述磁阻芯片设置在所述电路板的面向所述磁性位移组件的一侧表面上，所述信号处理单元设置在所述电路板的一侧表面上；
    所述磁阻芯片用于感测所述磁性位移组件的磁场信号；
    所述信号处理单元用于获取所述磁场信号并根据所述磁场信号确定所述物料仓内物料的高度，再输出该物料高度信号。
  8. 根据权利要求1所述的磁感应料位计，其特征在于，所述磁阻芯片所在平面与所述保护壳体的顶面最高处的切平面垂直，所述磁阻芯片的敏感方向位于所述磁阻芯片所在平面，且所述磁阻芯片的敏感方向平行或垂直于所述保护壳体的顶面最高处的切平面；或者，
    所述磁阻芯片所在平面与所述保护壳体的顶面最高处的切平面平行，所述磁阻芯片的敏感方向位于所述磁阻芯片所在平面，且所述磁阻芯片的敏感方向平行于所述保护壳体的顶面最高处的切平面。
  9. 根据权利要求1所述的磁感应料位计，其特征在于，所述磁阻芯片为各向异性磁阻芯片、巨磁阻芯片和隧道结磁阻芯片中的任意一种。
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