WO2021074460A1 - Módulo de conexión láser - Google Patents
Módulo de conexión láser Download PDFInfo
- Publication number
- WO2021074460A1 WO2021074460A1 PCT/ES2019/070707 ES2019070707W WO2021074460A1 WO 2021074460 A1 WO2021074460 A1 WO 2021074460A1 ES 2019070707 W ES2019070707 W ES 2019070707W WO 2021074460 A1 WO2021074460 A1 WO 2021074460A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrodes
- laser
- laser diodes
- module
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B2/00—Friction-grip releasable fastenings
- F16B2/02—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening
- F16B2/06—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action
- F16B2/065—Clamps, i.e. with gripping action effected by positive means other than the inherent resistance to deformation of the material of the fastening external, i.e. with contracting action using screw-thread elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4018—Lasers electrically in series
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4043—Edge-emitting structures with vertically stacked active layers
- H01S5/405—Two-dimensional arrays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
Definitions
- the invention refers to a laser connection module, which provides structural and constitutive characteristics, which will be described in detail later, which represent a remarkable improvement for the current state of the technique within its field of application.
- the object of the invention focuses on a module of the type whose purpose is to serve as a support for the electrical connection and thermal contact between laser diodes and electrodes successively stacked between corresponding spacers, being able to have internal conduits for the circulation of a cooling fluid, with the advantage of presenting an improved structural configuration that allows, on the one hand, to fix all its components and keep them together, and on the other, to apply the clamping force, to guarantee that said electrical connection is safe, in a controlled manner directly on the laser diodes and at the point where they meet to ensure electrical and thermal contact between electrodes and diodes.
- the field of application of the present invention is framed within the sector of the industry dedicated to the manufacture of devices and components for laser technology equipment.
- the laser diodes also called chip or bar
- the laser diodes were mounted on at least one of the electrodes by welding, which raises various problems.
- the main problem is that the laser chip must be positioned with very high precision, so that its end protrudes between eight and ten microns from the end of the electrode so that the welded connection that will join it to said electrode, does not reach the epitaxy, since if it does the laser module will be defective.
- soldered connection of the laser chip does not allow a subsequent adjustment of its position, nor can it be replaced in case of failure.
- patent document US5978396 describes a semiconductor laser source including a stack of semiconductor laser diodes, each one having at least one active region.
- the active region includes a series of semiconductor layers located between an ohmic contact layer and a substrate, which also takes on the function of an ohmic contact layer.
- the pressure causes the diodes to maintain contact with each other through their ohmic contact layers.
- Each diode has dimensions, especially in its thickness, which allows the transient heating of each diode to be as low as possible and in such a way that the average heating of the stackable diodes does not exceed a predetermined value.
- a stackable integrated diode packaging in which a stack of laser elements is proposed, configured to absorb the heat given off by said laser elements, for their repair and / or replacement, and their testing.
- the assembly comprises cells, which have a cavity for the passage of a coolant in order to cool the laser elements.
- Cells can be individually built for individual testing and then stacked together and removably secured for easy replacement.
- the cell cavities form a substantially contiguous cavity through which the refrigerant enters and exits the entire assembly.
- Cell cavities include regions and surfaces that enhance coolant flow to regions substantially adjacent to the laser elements for cooling.
- Patent document US6245589 describes the manufacture of a device for cooling a planar light source, which includes a device for cooling a series of laser diodes using a stack of a plurality of metal plate elements, formed with a slot pattern with arms or openings, which act as a cooling water circulation path for said laser diodes.
- patent document ES2191559B1 whose owner is the applicant for the present invention, proposes a laser connection module, comprising: - electrodes mutually facing and connected in alternate order with opposite poles; insulating spacers arranged between the facing surfaces of the electrodes to prevent direct contact of the electrodes and their short circuit; laser chips mounted between the facing surfaces of said electrodes, making contact with the electrodes; - and tightening means in charge of establishing the approach of the mutually facing electrodes to ensure their contact with the laser chips positioned between them, ensuring the electrical supply to the mentioned laser chips and the dissipation of the heat generated.
- the aforementioned tightening means are composed of screws that are mounted on through holes that affect the electrodes and insulating spacers, and by the corresponding nuts that screw on said screws, the heads of the screws acting and the nuts directly on the outer surface of the two electrodes that occupy the extreme positions on the laser module.
- this laser module although it effectively solves the aforementioned problem of guaranteeing a safe connection between the diodes and the electrodes, allowing easy adjustment and / or replacement of the same, has certain problematic aspects that can be improved.
- one of the drawbacks is the risk of deterioration of the end electrodes, due to the direct action on them of the heads of the screws and of the respective nuts in the tightening areas, taking into account: on the one hand, that said electrodes are made of a relatively soft, electrically conductive material such as copper and, on the other hand, that the section of the electrodes is reduced in said clamping areas by the holes made for mounting the screws.
- the objective of the present invention is, therefore, to provide an improved laser module that performs a correct clamping between all the stacked components of the module, a protection for the extreme electrodes, so that they are not exposed to accidental impacts and that the screws and nuts of the clamping elements do not act directly on said end electrodes, preventing them from being damaged.
- the laser connection module of the invention is of the type used for the electrical connection between laser diodes and electrodes stacked alternately, and can have internal conduits for the circulation of a cooling fluid.
- This laser connection module has technical characteristics that allow all its components to be fixed and kept together, and simultaneously provide protection to the extreme electrodes preventing them from being damaged due to an impact. accidental, or by the direct action on them of the tightening bolts and nuts; and without said tightening screws passing through the electrical supply electrodes of the laser diodes.
- this laser connection module is of the type described in the preamble of claim 1 and comprising: several superimposed electrodes, connected in alternating order with opposite poles of electrical supply; at least one laser diode mounted between the facing surfaces of consecutive electrodes, making contact with said electrodes; and means for tightening the set of electrodes and laser diodes together.
- this laser connection module comprises:
- - clamping means mounted on a first end of the structure, and which press the set of electrodes and laser diodes against a second opposite end of said structure, establishing their fixation and mutual contact of the laser diodes with the consecutive electrodes and,
- Said external structure comprises: an upper part that forms the first end of the structure; a lower part forming the second end of the structure and means for fixing said upper and lower parts in a parallel position and vertically spaced at a suitable distance for the loose housing of the set of electrodes and laser diodes between said upper and lower parts; so that the tightening means are responsible for pressing the set of electrodes and laser diodes against the lower part of the structure
- the external structure provides adequate protection to the electrode assembly and laser diodes, while serving as a support for the clamping means in charge of pressing the set of laser electrodes and diodes against the lower part or second end of the structure, without said clamping means traversing, or weakening, any of the elements of the aforementioned set.
- the tightening means comprise tightening studs mounted in threaded holes defined for this purpose in the upper part or first end of the structure.
- the intermediate plate arranged between the clamping studs and the upper electrode, closer to them, is made of a resistant material and of greater hardness than the electrodes, its function being to prevent the clamping studs from damaging the electrode. during the tightening of said studs.
- the fixing means of the upper and lower parts of the structure can have different configurations, being constituted by fixing screws; or by tubular spacers arranged between the upper and lower parts and mounted on the fixing screws; or by guide columns arranged between the upper and lower parts and fixed at their ends to said upper and lower parts.
- said fixing means guarantee an adequate separation between the upper and lower parts of the structure, for the loose housing of the set of electrodes and laser diodes.
- the laser connection module comprises means for aligning the successive electrodes in a vertical direction which, depending on the means for fixing the structure, can be made up of pins housed in vertical holes, and made for this purpose in successive electrodes, or by the guide columns themselves; in the second case, the electrodes present in their contour recesses with a configuration complementary to a portion of the section of the guide columns and suitable for mounting the electrodes, in the manner of a slide, between said guide columns; said guide columns forming simultaneously means for separating the upper and lower parts of the structure and means for vertical alignment of the electrodes.
- the laser diodes are arranged between front ends of the electrodes, the module comprising electrically insulating spacers located between rear ends of said consecutive electrodes and of a thickness similar to laser diodes, said spacers preventing the consecutive electrodes from contacting each other causing a short circuit.
- the tightening means comprises front studs that establish the tightening of the front end of the electrodes against the laser chips and rear studs that establish the tightening of the rear end of the electrodes against the electrically insulating spacers, compensating said front and rear studs tighten on the respective ends of the electrodes.
- FIG. 1 shows an exploded perspective view of an embodiment of the laser connection module object of the invention, provided with a single laser diode.
- FIG. 2 shows a perspective view of the laser connection module, of figure 1 once assembled.
- FIG. 6 shows an exploded perspective view of a first variant embodiment of the laser connection module, according to the invention, which in this case comprises multiple alternating laser diodes with respective electrodes.
- - Figure 7 shows a perspective view of the laser connection module of figure 6, once assembled.
- FIG. 8 shows an exploded perspective view of a variant embodiment of the laser connection module, in which the structure comprises guide columns that are part of the fixing means of the upper and lower parts and means for the vertical alignment of the electrodes.
- FIG. 9 shows a perspective view of the laser connection module of Figure 8, in the assembled position.
- the laser connection module (1) comprises: electrodes (2) connected in alternate order to opposite poles of electrical supply; a separator (3) arranged between the facing surfaces of the consecutive electrodes (2), to prevent their direct contact and their short-circuit, a laser diode (4) mounted between the facing surfaces of consecutive electrodes (2), making contact with them in the area that leaves the corresponding separator (3) free; and tightening means (6) of the set of electrodes (2) and laser diodes (4) to each other.
- the separator (3) has a smaller surface than the facing surfaces of the electrodes (2).
- the module (1) comprises an external structure (5) that delimits an open space by a zone of light emission of the laser diode (4) and suitable for housing the set of electrodes (2) and laser diodes ( 4);
- the clamping means (6) are mounted on a first end of the structure (5) and press the set of electrodes (2) and laser diodes (4) against a second opposite end of said structure, establishing its fixation and the mutual contact of the laser diodes (4) with the consecutive electrodes (2).
- the module (1) comprises, between the clamping means (6) and the end electrode (2), closest to said clamping means (6), an intermediate plate (50) for protecting said end electrode (2).
- the external structure (5) comprises: - an upper part (a) conforming to the first end of the structure (5) and provided with threaded holes (55) in which studs (60) are mounted that form part of the tightening means (6), - a lower part (b) forming the second end of the structure (5), and - fixing means of said upper (a) and lower (b) parts in parallel position and vertically spaced apart. a suitable distance for the loose housing of the set of electrodes and laser diodes between said upper and lower parts.
- the fixing means of the upper (a) and lower (b) parts of the external structure (5) comprise fixing screws (51) mounted, with interposition of washers (54), in holes through (52) defined in the upper part (a) and inserted into threaded holes (53) of the lower part (b), allowing an adjustment of the gap between the upper (a) and lower (b) parts of the the external structure (5).
- the module (1) has connectors (7) for a wiring (not shown) for the electrical supply of the electrodes (2), and internal conduits (10) for the circulation of a cooling product.
- the module (1) comprises means for aligning the successive electrodes (2) in the vertical direction, made up of pins (8) housed in vertical holes, made for this purpose in the successive electrodes (2) and in the upper (a) and lower (b) parts of the external structure (5); interposing between said elements some sealing gaskets (9) to prevent leaks.
- the laser diodes (4) are arranged between some front ends of the electrodes (2), and the spacers (3), electrically insulating and of a thickness similar to the laser diodes (4), between some rear ends of sayings consecutive electrodes (2).
- the tightening means comprise: front studs (60) that establish the tightening of the front end of the electrodes (2) against the laser diodes (4) and some rear studs (61) that establish the tightening of the rear end of the the electrodes (2) against the electrically insulating spacers (3).
- the laser connection module has a configuration similar to that described above, incorporating in this case a greater number of electrodes (2) and laser diodes (4) stacked in alternate order.
- the fixing means of the upper (a) and lower (b) parts of the structure (5) comprise tubular spacers (56), arranged between said upper (a) and lower (b) parts and mounted on the fixing screws (51), said tubular spacers (56) being precisely those that determine the separation between the upper (a) and lower (b) pieces.
- the fixing means of the upper (a) and lower (b) parts of the structure (5) comprise guide columns (57) arranged between the upper (a) and lower (b) parts. , and fixed at their ends by means of screws (58) to said upper and lower parts.
- the electrodes (2) present in their contour some recesses (21) of a complementary configuration to a portion of the section of the guide columns (57) and suitable for mounting the electrodes (2), by way of slider, between said guide columns; said guide columns (57) simultaneously forming means for separating the upper (a) and lower (b) parts of the structure and means for vertical alignment of the electrodes (2).
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims
Priority Applications (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19949162.2A EP4047759B1 (en) | 2019-10-17 | 2019-10-17 | Laser connection module |
| JP2022513577A JP7499846B2 (ja) | 2019-10-17 | 2019-10-17 | レーザ接続モジュール |
| PCT/ES2019/070707 WO2021074460A1 (es) | 2019-10-17 | 2019-10-17 | Módulo de conexión láser |
| IL292139A IL292139B2 (en) | 2019-10-17 | 2019-10-17 | Laser connection module |
| CA3154833A CA3154833A1 (en) | 2019-10-17 | 2019-10-17 | Laser connection module |
| MX2022004405A MX2022004405A (es) | 2019-10-17 | 2019-10-17 | Modulo de conexion laser. |
| RS20240747A RS65792B1 (sr) | 2019-10-17 | 2019-10-17 | Modul za povezivanje lasera |
| KR1020227014205A KR102681970B1 (ko) | 2019-10-17 | 2019-10-17 | 레이저 연결 모듈 |
| CN201980101181.8A CN114586249B (zh) | 2019-10-17 | 2019-10-17 | 激光连接模块 |
| ES19949162T ES2983723T3 (es) | 2019-10-17 | 2019-10-17 | Módulo de conexión láser |
| HUE19949162A HUE067486T2 (hu) | 2019-10-17 | 2019-10-17 | Lézercsatlakozó modul |
| US17/768,163 US12316070B2 (en) | 2019-10-17 | 2019-10-17 | Laser connection module |
| HRP20240911TT HRP20240911T1 (hr) | 2019-10-17 | 2019-10-17 | Modul za povezivanje lasera |
| AU2019470058A AU2019470058A1 (en) | 2019-10-17 | 2019-10-17 | Laser connection module |
| PL19949162.2T PL4047759T3 (pl) | 2019-10-17 | 2019-10-17 | Moduł łączący lasera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/ES2019/070707 WO2021074460A1 (es) | 2019-10-17 | 2019-10-17 | Módulo de conexión láser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021074460A1 true WO2021074460A1 (es) | 2021-04-22 |
Family
ID=75537736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/ES2019/070707 Ceased WO2021074460A1 (es) | 2019-10-17 | 2019-10-17 | Módulo de conexión láser |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US12316070B2 (es) |
| EP (1) | EP4047759B1 (es) |
| JP (1) | JP7499846B2 (es) |
| KR (1) | KR102681970B1 (es) |
| CN (1) | CN114586249B (es) |
| AU (1) | AU2019470058A1 (es) |
| CA (1) | CA3154833A1 (es) |
| ES (1) | ES2983723T3 (es) |
| HR (1) | HRP20240911T1 (es) |
| HU (1) | HUE067486T2 (es) |
| IL (1) | IL292139B2 (es) |
| MX (1) | MX2022004405A (es) |
| PL (1) | PL4047759T3 (es) |
| RS (1) | RS65792B1 (es) |
| WO (1) | WO2021074460A1 (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115693388A (zh) * | 2022-11-29 | 2023-02-03 | 无锡亮源激光技术有限公司 | 一种基于同结构单环半导体激光器及装配方法 |
| RU227597U1 (ru) * | 2024-05-29 | 2024-07-25 | Общество С Ограниченной Ответственностью "Научно-Производственное Предприятие "Инжект" | Лазерный излучатель |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4315225A (en) * | 1979-08-24 | 1982-02-09 | Mcdonnell Douglas Corporation | Heat sink laser diode array |
| US4716568A (en) * | 1985-05-07 | 1987-12-29 | Spectra Diode Laboratories, Inc. | Stacked diode laser array assembly |
| US5978396A (en) | 1995-07-13 | 1999-11-02 | Thomson-Csf | Semiconductor laser source |
| US6151341A (en) | 1997-05-30 | 2000-11-21 | Excel/Quantronix, Inc. | Stackable integrated diode packaging |
| US6245589B1 (en) | 1996-11-22 | 2001-06-12 | Fujitsu Limited | Fabrication of cooling device of a planar light source |
| EP1113543A1 (en) * | 1998-09-24 | 2001-07-04 | Branson Ultrasonics Corporation | Laser diode array |
| ES2191559B1 (es) | 2002-02-18 | 2005-02-01 | Monocrom, S.L. | Modulo laser. |
| CN104577707A (zh) * | 2014-12-31 | 2015-04-29 | 西安炬光科技有限公司 | 一种叠层阵列液体制冷型高功率半导体激光器 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4454602A (en) * | 1982-03-26 | 1984-06-12 | Mcdonnell Douglas Corporation | Conductively cooled laser diode array |
| JPH03268382A (ja) * | 1990-03-16 | 1991-11-29 | Mitsubishi Electric Corp | 半導体レーザ装置の製造方法 |
| US8737441B2 (en) * | 2009-08-31 | 2014-05-27 | Xi'an Focuslight Technologies Co., Ltd. | Cooling module for laser, fabricating method thereof, and semiconductor laser fabricated from the module |
| CN102087135B (zh) * | 2009-12-08 | 2014-10-08 | 鸿富锦精密工业(深圳)有限公司 | 称重装置 |
| US8681829B2 (en) * | 2011-08-29 | 2014-03-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| US10243321B2 (en) * | 2013-01-15 | 2019-03-26 | Channel Investments, Llc | Laser diode package |
| CN204613019U (zh) * | 2015-05-06 | 2015-09-02 | 中国地质大学(武汉) | 一种多层陶土板饱和支架 |
| CN106785921A (zh) * | 2016-12-29 | 2017-05-31 | 西安炬光科技股份有限公司 | 一种机械安装的半导体激光器叠阵 |
| CN106737991B (zh) * | 2017-01-23 | 2018-08-07 | 泉州泉港润美环保科技有限公司 | 一种提高切割效率的切纸管机 |
| US10170893B1 (en) * | 2017-08-09 | 2019-01-01 | Waymo Llc | Vacuum fixture |
| CN208093686U (zh) * | 2018-03-09 | 2018-11-13 | 合肥国轩高科动力能源有限公司 | 一种方形动力锂离子电池的束缚化成装置 |
| CN108584210B (zh) * | 2018-05-10 | 2020-03-24 | 刘大可 | 一种自动分类的空间集约式垃圾箱 |
-
2019
- 2019-10-17 KR KR1020227014205A patent/KR102681970B1/ko active Active
- 2019-10-17 HR HRP20240911TT patent/HRP20240911T1/hr unknown
- 2019-10-17 MX MX2022004405A patent/MX2022004405A/es unknown
- 2019-10-17 EP EP19949162.2A patent/EP4047759B1/en active Active
- 2019-10-17 CN CN201980101181.8A patent/CN114586249B/zh active Active
- 2019-10-17 CA CA3154833A patent/CA3154833A1/en active Pending
- 2019-10-17 WO PCT/ES2019/070707 patent/WO2021074460A1/es not_active Ceased
- 2019-10-17 ES ES19949162T patent/ES2983723T3/es active Active
- 2019-10-17 JP JP2022513577A patent/JP7499846B2/ja active Active
- 2019-10-17 PL PL19949162.2T patent/PL4047759T3/pl unknown
- 2019-10-17 AU AU2019470058A patent/AU2019470058A1/en active Pending
- 2019-10-17 IL IL292139A patent/IL292139B2/en unknown
- 2019-10-17 RS RS20240747A patent/RS65792B1/sr unknown
- 2019-10-17 US US17/768,163 patent/US12316070B2/en active Active
- 2019-10-17 HU HUE19949162A patent/HUE067486T2/hu unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4315225A (en) * | 1979-08-24 | 1982-02-09 | Mcdonnell Douglas Corporation | Heat sink laser diode array |
| US4716568A (en) * | 1985-05-07 | 1987-12-29 | Spectra Diode Laboratories, Inc. | Stacked diode laser array assembly |
| US5978396A (en) | 1995-07-13 | 1999-11-02 | Thomson-Csf | Semiconductor laser source |
| US6245589B1 (en) | 1996-11-22 | 2001-06-12 | Fujitsu Limited | Fabrication of cooling device of a planar light source |
| US6151341A (en) | 1997-05-30 | 2000-11-21 | Excel/Quantronix, Inc. | Stackable integrated diode packaging |
| EP1113543A1 (en) * | 1998-09-24 | 2001-07-04 | Branson Ultrasonics Corporation | Laser diode array |
| ES2191559B1 (es) | 2002-02-18 | 2005-02-01 | Monocrom, S.L. | Modulo laser. |
| CN104577707A (zh) * | 2014-12-31 | 2015-04-29 | 西安炬光科技有限公司 | 一种叠层阵列液体制冷型高功率半导体激光器 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP4047759A4 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115693388A (zh) * | 2022-11-29 | 2023-02-03 | 无锡亮源激光技术有限公司 | 一种基于同结构单环半导体激光器及装配方法 |
| RU227597U1 (ru) * | 2024-05-29 | 2024-07-25 | Общество С Ограниченной Ответственностью "Научно-Производственное Предприятие "Инжект" | Лазерный излучатель |
| RU238422U1 (ru) * | 2024-11-22 | 2025-10-29 | Общество С Ограниченной Ответственностью "Научно-Производственное Предприятие "Инжект" | Одиночный лазерный излучатель высокой мощности |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230138461A1 (en) | 2023-05-04 |
| IL292139B1 (en) | 2025-07-01 |
| ES2983723T3 (es) | 2024-10-24 |
| EP4047759A4 (en) | 2023-08-16 |
| AU2019470058A1 (en) | 2022-04-14 |
| EP4047759C0 (en) | 2024-04-24 |
| US12316070B2 (en) | 2025-05-27 |
| CA3154833A1 (en) | 2021-04-22 |
| CN114586249A (zh) | 2022-06-03 |
| JP2023510068A (ja) | 2023-03-13 |
| KR20220078630A (ko) | 2022-06-10 |
| EP4047759B1 (en) | 2024-04-24 |
| KR102681970B1 (ko) | 2024-07-04 |
| EP4047759A1 (en) | 2022-08-24 |
| PL4047759T3 (pl) | 2024-09-16 |
| HRP20240911T1 (hr) | 2024-10-11 |
| HUE067486T2 (hu) | 2024-10-28 |
| IL292139B2 (en) | 2025-11-01 |
| MX2022004405A (es) | 2022-09-27 |
| RS65792B1 (sr) | 2024-08-30 |
| JP7499846B2 (ja) | 2024-06-14 |
| IL292139A (en) | 2022-07-01 |
| CN114586249B (zh) | 2026-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2451115T3 (es) | Estructura de célula solar con diodo de derivación discreto integrado | |
| ES2348945T3 (es) | Diodo de derivacion para celulas fotovoltaicas. | |
| US7859103B2 (en) | Semiconductor module and inverter device | |
| US7760503B2 (en) | Semiconductor module and inverter device | |
| US20230066938A1 (en) | Battery connection module and battery pack | |
| JP6593143B2 (ja) | 車両用電池冷却装置 | |
| ES2993939T3 (en) | Low-pressure chip packaging type junction box and processing method thereof for solar power generation assembly | |
| US9117688B2 (en) | Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device | |
| US11469160B2 (en) | Power module with active elements and intermediate electrode that connects conductors | |
| ES3064576T3 (en) | Battery system and assembly method of assembling the battery system | |
| US6151341A (en) | Stackable integrated diode packaging | |
| CN114498284A (zh) | 一种半导体激光器阵列封装组件和半导体激光器 | |
| US20230217580A1 (en) | Power module and heat sink system | |
| ES2983723T3 (es) | Módulo de conexión láser | |
| ES2332997T3 (es) | Modulo laser. | |
| ES3057635T3 (en) | Energy storage device and vehicle | |
| ES2807475T3 (es) | Módulo condensador de potencia con disposición de refrigeración | |
| US20170084515A1 (en) | Power-Module Device and Power Conversion Device | |
| ES2658229T3 (es) | Disposición de derivación en un laminado de módulo solar vidrio-vidrio con células solares | |
| RU2796525C1 (ru) | Модуль подключения лазера | |
| US12183517B2 (en) | Power electronic assembly with a housing and with a capacitor device arranged therein | |
| JP6868322B2 (ja) | 電力変換装置 | |
| US20230170583A1 (en) | Battery module having a laminated busbar assembly | |
| JP7576002B2 (ja) | 半導体素子の積層構造体 | |
| CN116520139A (zh) | 芯片测试夹具 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 19949162 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2022513577 Country of ref document: JP Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: 3154833 Country of ref document: CA |
|
| ENP | Entry into the national phase |
Ref document number: 2019470058 Country of ref document: AU Date of ref document: 20191017 Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 20227014205 Country of ref document: KR Kind code of ref document: A |
|
| ENP | Entry into the national phase |
Ref document number: 2019949162 Country of ref document: EP Effective date: 20220517 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: P-2024/0747 Country of ref document: RS |
|
| WWG | Wipo information: grant in national office |
Ref document number: MX/A/2022/004405 Country of ref document: MX |
|
| WWG | Wipo information: grant in national office |
Ref document number: 17768163 Country of ref document: US |