WO2021130874A1 - 電気めっき装置及びめっき物の製造方法 - Google Patents
電気めっき装置及びめっき物の製造方法 Download PDFInfo
- Publication number
- WO2021130874A1 WO2021130874A1 PCT/JP2019/050716 JP2019050716W WO2021130874A1 WO 2021130874 A1 WO2021130874 A1 WO 2021130874A1 JP 2019050716 W JP2019050716 W JP 2019050716W WO 2021130874 A1 WO2021130874 A1 WO 2021130874A1
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- Prior art keywords
- space
- rotating body
- magnetic
- plating tank
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/007—Electroplating using magnetic fields, e.g. magnets
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
- B24B31/112—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using magnetically consolidated grinding powder, moved relatively to the workpiece under the influence of pressure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/18—Apparatus for electrolytic coating of small objects in bulk having closed containers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
- C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
Definitions
- Patent Document 1 discloses that the stirring step is performed at the same time as the electroplating step to enhance the adhesion of the plating layer to the base material.
- Patent Document 2 discloses a magnetic polishing method and apparatus, and particularly discloses that a plurality of magnet disks are provided when polishing a large work (see paragraphs 0001, 0003, 0030, etc.). It is also disclosed that the magnetic disc is moved to reduce the dead zone of the alternating magnetic field (see paragraphs 0032, 0035, and 0036, etc.).
- Patent Document 3 relates to polishing a large material to be polished (see FIG. 4) by instructing a magnet disk and a rotary motor on a base and swinging the base to cause a magnet disk. Discloses that the dead zone of the alternating magnetic field around the rotation axis of the above is eliminated (see paragraphs 0006, 0035, and 0036, etc.).
- the magnetic rotating body is moved along the lateral direction until the outer peripheral portion of the magnetic rotating body reaches a position where it protrudes from the plating tank in the lateral direction.
- the plating tank has a first bottom surface region corresponding to the first space and a second bottom surface region corresponding to the second space, and the area of the second bottom surface region is the first bottom surface region. Is larger than the area of.
- the plating tank is long shaped to have first and second ends, and the magnetic rotating body is located directly below the first end and directly below the second end. It is moved to reciprocate between the second terminal positions of.
- An insoluble anode can also be used as the anode.
- the plating tank 10 and the metal block 23 (anode) are connected to the DC power supply E1, and the object to be plated 1 (cathode) electrically connected to the plating tank 10 is electroplated.
- the electrical connection of the object to be plated 1 to the plating tank 10 is not limited to the state in which the object to be plated 1 is in direct contact with the plating tank 10, and the object to be plated 1 is connected to the plating tank 10 via another object to be plated 1. Includes the state of being electrically connected to 10.
- the first space SP1 depends on the shape of the space inside the plating tank 10, the shape of the magnetic rotating body 6, and the relative arrangement relationship between the space inside the tank 10 of the plating tank 10 and the magnetic rotating body 6, and is illustrated. It is not limited to the one.
- the moving mechanism M1 is configured to move the rotational force supply unit 65 (and the magnetic rotating body 6 via the rotational force supply unit 65) in the lateral direction.
- the moving mechanism M1 includes an electric motor 61 and a crank mechanism for converting the rotational force generated by the electric motor 61 into lateral movement of the rotational force supply unit 65.
- the crank mechanism includes first and second links 62, 63 that are pivotally connected to each other.
- the first link 62 has a first end portion that is non-rotatably attached to the rotating shaft 61a of the electric motor 61, and a second end portion that is rotatably attached to the second link 63.
- the second link 63 has a first end portion rotatably attached to the first link 62 and a second end portion rotatably attached to the rotational force supply unit 65.
- the first link 62 rotates clockwise or counterclockwise according to the rotation of the rotating shaft 61a of the electric motor 61.
- the posture of the second link 63 changes according to the rotation of the first link 62, and the position of the rotational force supply unit 65 along the guide rail G1 changes.
- the magnetic rotating body 6 moves laterally together with the rotational force supply unit 65.
- the rotational force supply portion 65 is moved from the first terminal position directly below the first end portion 16 of the plating tank 10 to the second end portion 17 by the rotation of the rotating shaft 61a of the electric motor 61 by 180 °. Move to the second terminal position just below.
- the growth of the plating layer is excessively inhibited by excessive polishing.
- electroplating of a larger number of objects 1 to be plated is also promoted.
- the second space SP2 between the second region V2 of the virtual surface and the curved wall 12d It is narrowed down. Further, in the process of moving the magnetic rotating body 6, the first region V1 of the virtual surface intersects the curved wall 12c or the lateral walls 12a and 12b, and a new second space SP2 is formed between the first region V1 and the curved wall 12c. Will be generated.
- the decrease of the second space SP2 between the second region V2 and the curved wall 12d according to the movement of the magnetic rotating body 6 is the second between the first region V1 and the curved wall 12c according to the movement of the magnetic rotating body 6. Compensated by the increase in space SP2.
- the second space SP2 between the second region V2 and the curved wall 12d disappears.
- the peripheral walls 12 of the first and second end portions 16 and 17 of the plating tank 10 it is preferable to bend the peripheral walls 12 of the first and second end portions 16 and 17 of the plating tank 10 (for example, in an arc shape such as curved walls 12c and 12d). It is avoided or suppressed that the object to be plated 1 stays at the end portion in the longitudinal direction of the plating tank 10 and the electroplating and polishing become insufficient.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
少なくとも被めっき物と磁性メディアが沈降した電解液を貯留するめっき槽において被めっき物を電気めっきする工程と、
磁気的吸引力及び磁気的反発力に応じて電解液中の磁性メディアが運動するようにめっき槽の下方で磁性回転体を回転する工程にして、めっき槽の槽内空間が、磁性回転体の上方の空間を占める第1空間と第1空間以外の空間を占める第2空間に区分される、工程と、
磁性回転体の回転軸に交差する横方向に磁性回転体を動かす工程にして、被めっき物が、第1空間において電解液中にある状態と第2空間において電解液中にある状態の間で切り替えられる工程を含む。
2 磁性メディア
6 磁性回転体
10 めっき槽
100 電気めっき装置
SP1 第1空間
SP2 第2空間
Claims (6)
- 少なくとも被めっき物(1)と磁性メディア(2)が沈降する電解液を貯留するめっき槽(10)と、
交番磁界を生成するべく前記めっき槽(10)の下方に回転可能に設けられた少なくとも一つの磁性回転体(6)を備える電気めっき装置(100)であって、
前記少なくとも一つの磁性回転体(6)は、前記磁性回転体(6)の上方の空間を占める第1空間(SP1)と前記第1空間(SP1)以外の空間を占める第2空間(SP2)に前記めっき槽(10)の槽内空間を区分するように設けられ、
前記少なくとも一つの磁性回転体(6)は、前記磁性回転体(6)の回転軸(AX66)に交差する横方向に移動可能に設けられ、これによって、前記被めっき物(1)が、前記第1空間(SP1)において前記電解液中にある状態と前記第2空間(SP2)において前記電解液中にある状態の間で切り替えられる、電気めっき装置。 - 前記磁性回転体(6)は、当該磁性回転体(6)の外周部が前記横方向において前記めっき槽(10)から突出する位置に到達するまで前記横方向沿いに動かされることを特徴とする請求項1に記載の電気めっき装置。
- 前記めっき槽(10)は、前記第1空間(SP1)に対応する第1底面領域(111)と、前記第2空間(SP2)に対応する第2底面領域(112)を有し、前記第2底面領域(112)の面積は、前記第1底面領域(111)の面積よりも大きいことを特徴とする請求項1又は2に記載の電気めっき装置。
- 前記めっき槽(10)が第1及び第2端部(16,17)を有するべく長尺に形状付けられ、前記磁性回転体(6)は前記第1端部(16)の直下の第1末端位置と前記第2端部(17)の直下の第2末端位置の間を往復するように動かされることを特徴とする請求項1乃至3のいずれか一項に記載の電気めっき装置。
- 前記磁性回転体(6)に回転力を供給する回転力供給部(65)と、
前記回転力供給部(65)を前記横方向に移動するべく構成された移動機構(M1)を更に備えることを特徴とする請求項1乃至4のいずれか一項に記載の電気めっき装置。 - 少なくとも被めっき物(1)と磁性メディア(2)が沈降した電解液を貯留するめっき槽(10)において前記被めっき物(1)を電気めっきする工程と、
磁気的吸引力及び磁気的反発力に応じて前記電解液中の磁性メディア(2)が運動するように前記めっき槽(10)の下方で磁性回転体(6)を回転する工程にして、前記めっき槽(10)の槽内空間が、前記磁性回転体(6)の上方の空間を占める第1空間(SP1)と前記第1空間(SP1)以外の空間を占める第2空間(SP2)に区分される、工程と、
前記磁性回転体(6)の回転軸(AX66)に交差する横方向に前記磁性回転体(6)を動かす工程にして、前記被めっき物(1)が、前記第1空間(SP1)において前記電解液中にある状態と前記第2空間(SP2)において前記電解液中にある状態の間で切り替えられる工程を含むめっき物の製造方法。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/780,006 US12351930B2 (en) | 2019-12-24 | 2019-12-24 | Electroplating device and method for manufacturing plated product |
| EP19957227.2A EP4083273A4 (en) | 2019-12-24 | 2019-12-24 | ELECTROPLATING DEVICE AND METHOD FOR MAKING PLATED PRODUCT |
| CN201980102324.7A CN114761624B (zh) | 2019-12-24 | 2019-12-24 | 电镀装置和镀覆物的制造方法 |
| JP2021566617A JP7196338B2 (ja) | 2019-12-24 | 2019-12-24 | 電気めっき装置及びめっき物の製造方法 |
| PCT/JP2019/050716 WO2021130874A1 (ja) | 2019-12-24 | 2019-12-24 | 電気めっき装置及びめっき物の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/050716 WO2021130874A1 (ja) | 2019-12-24 | 2019-12-24 | 電気めっき装置及びめっき物の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021130874A1 true WO2021130874A1 (ja) | 2021-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2019/050716 Ceased WO2021130874A1 (ja) | 2019-12-24 | 2019-12-24 | 電気めっき装置及びめっき物の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12351930B2 (ja) |
| EP (1) | EP4083273A4 (ja) |
| JP (1) | JP7196338B2 (ja) |
| CN (1) | CN114761624B (ja) |
| WO (1) | WO2021130874A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI787066B (zh) * | 2021-08-06 | 2022-12-11 | 日商Ykk股份有限公司 | 拉鏈牙鏈帶、拉鏈鏈條及拉鏈的製造方法、以及電鍍裝置 |
| WO2025057345A1 (ja) * | 2023-09-13 | 2025-03-20 | Ykk株式会社 | 電気めっき装置及びその方法、めっき物の製造方法、並びにめっき槽 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114746585B (zh) * | 2019-12-24 | 2024-06-25 | Ykk株式会社 | 电镀系统 |
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| JP2001138208A (ja) | 1999-11-15 | 2001-05-22 | Priority Co | 円盤揺動型磁気研磨機 |
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| WO2018189916A1 (ja) | 2017-04-14 | 2018-10-18 | Ykk株式会社 | 電気めっき方法及び装置 |
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2019
- 2019-12-24 EP EP19957227.2A patent/EP4083273A4/en active Pending
- 2019-12-24 US US17/780,006 patent/US12351930B2/en active Active
- 2019-12-24 WO PCT/JP2019/050716 patent/WO2021130874A1/ja not_active Ceased
- 2019-12-24 CN CN201980102324.7A patent/CN114761624B/zh active Active
- 2019-12-24 JP JP2021566617A patent/JP7196338B2/ja active Active
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| JPH0246710A (ja) * | 1988-08-08 | 1990-02-16 | Fukuda Shigeo | 希土類磁石材の表面処理方法 |
| JPH10180611A (ja) | 1996-12-24 | 1998-07-07 | Takahiro Imahashi | 複数の交番磁界生成による磁気研摩方法及び装置 |
| JP2001138208A (ja) | 1999-11-15 | 2001-05-22 | Priority Co | 円盤揺動型磁気研磨機 |
| WO2016075828A1 (ja) * | 2014-11-14 | 2016-05-19 | 合同会社ナポレ企画 | 服飾付属部品の表面電解処理方法、服飾付属品及びその製造方法 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI787066B (zh) * | 2021-08-06 | 2022-12-11 | 日商Ykk股份有限公司 | 拉鏈牙鏈帶、拉鏈鏈條及拉鏈的製造方法、以及電鍍裝置 |
| WO2025057345A1 (ja) * | 2023-09-13 | 2025-03-20 | Ykk株式会社 | 電気めっき装置及びその方法、めっき物の製造方法、並びにめっき槽 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114761624B (zh) | 2024-07-19 |
| CN114761624A (zh) | 2022-07-15 |
| JPWO2021130874A1 (ja) | 2021-07-01 |
| US12351930B2 (en) | 2025-07-08 |
| US20220411951A1 (en) | 2022-12-29 |
| EP4083273A4 (en) | 2022-11-30 |
| JP7196338B2 (ja) | 2022-12-26 |
| EP4083273A1 (en) | 2022-11-02 |
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